WO2014121300A3 - Ensemble de transfert de données photoniques - Google Patents

Ensemble de transfert de données photoniques Download PDF

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Publication number
WO2014121300A3
WO2014121300A3 PCT/US2014/014740 US2014014740W WO2014121300A3 WO 2014121300 A3 WO2014121300 A3 WO 2014121300A3 US 2014014740 W US2014014740 W US 2014014740W WO 2014121300 A3 WO2014121300 A3 WO 2014121300A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible
data transfer
transfer assembly
photonic
photonic data
Prior art date
Application number
PCT/US2014/014740
Other languages
English (en)
Other versions
WO2014121300A2 (fr
Inventor
Douglas R. Hackler, Sr.
Dale G. Wilson
Original Assignee
American Semiconductor, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Semiconductor, Inc. filed Critical American Semiconductor, Inc.
Priority to US14/181,539 priority Critical patent/US20140224882A1/en
Publication of WO2014121300A2 publication Critical patent/WO2014121300A2/fr
Publication of WO2014121300A3 publication Critical patent/WO2014121300A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Communication System (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention concerne un ensemble de transfert de données photoniques (100) comprenant un dispositif souple permettant de recevoir, de traiter et de transmettre des signaux photoniques qui peuvent être activés, désactivés, syntonisés et commandés par un ensemble de circuits électroniques inclus qui peuvent être commandés sans fil par communication radiofréquence (RF). Des guides d'onde photoniques souples et des circuits électroniques souples sont intégrés à des interconnexions souples dans un format de carte intelligente de seulement 0,25 mm d'épaisseur. Les guides d'onde (130) fabriqués sous forme de tranche semi-conductrice et transformés en polymère sur semi-conducteur (SOP) assurent l'acheminement d'une lumière tridimensionnelle. Des caractéristiques de la taille du sous-micron (10) offrent une souplesse pour un montage conforme et maintiennent la performance pendant des déformations dynamiques. Les transpondeurs SOP souples (160) intégrés à des antennes imprimées (180) utilisent des signaux RF pour transmettre des données sans fil depuis le circuit électronique-photonique souple. Des interconnections (190) utilisent un matériau mince souple, tel qu'un polymère, qui supporte les lignes imprimées qui connectent des pastilles et peut contenir des trous d'interconnexion. Des fixations utilisent des résines époxydes conductrices et non conductrices pour rester souples tout en se conformant à une topographie sous-jacente.
PCT/US2014/014740 2013-02-04 2014-02-04 Ensemble de transfert de données photoniques WO2014121300A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/181,539 US20140224882A1 (en) 2013-02-14 2014-02-14 Flexible Smart Card Transponder

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201361760350P 2013-02-04 2013-02-04
US61/760,350 2013-02-04
US201361764810P 2013-02-14 2013-02-14
US61/764,810 2013-02-14
US201361785501P 2013-03-14 2013-03-14
US61/785,501 2013-03-14

Publications (2)

Publication Number Publication Date
WO2014121300A2 WO2014121300A2 (fr) 2014-08-07
WO2014121300A3 true WO2014121300A3 (fr) 2014-10-30

Family

ID=51263137

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/014740 WO2014121300A2 (fr) 2013-02-04 2014-02-04 Ensemble de transfert de données photoniques

Country Status (1)

Country Link
WO (1) WO2014121300A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CL2013001789A1 (es) * 2013-06-19 2013-10-25 Vidaurre Heiremans Victor Sistema recuperador reciclador de neblina acida generada en celdas electrolíticas de electroobtencion o electrorefinacion de metales no ferrosos, comprende un aparejo extractor de neblina acida, un primer dispositivo individual, un manifold colector comun y un sistema colector de condensados de los primeros dispositivos y de un segundo dispositivo multicamara; y procedimiento asociado.
EP3674759A1 (fr) * 2018-12-31 2020-07-01 Indigo Diabetes N.V. Intégration d'un composant actif sur une plateforme photonique

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5659153A (en) * 1995-03-03 1997-08-19 International Business Machines Corporation Thermoformed three dimensional wiring module
US6288443B1 (en) * 1996-12-11 2001-09-11 David Finn Chip module and manufacture of same
US6343744B1 (en) * 1999-02-19 2002-02-05 Nippon Telegraph And Telephone Corporation Noncontact type IC card and system therefor
US20020106165A1 (en) * 2000-12-13 2002-08-08 Barry Arsenault Optical waveguide assembly for interfacing a two-dimensional optoelectronic array to fiber bundles
US20030031446A1 (en) * 2001-08-08 2003-02-13 Photon-X, Inc. Freestanding athermal polymer optical waveguide
US20030057525A1 (en) * 2001-05-08 2003-03-27 Johann-Heinrich Fock Flexible integrated monolithic circuit
US20030133682A1 (en) * 2002-01-14 2003-07-17 Henryk Temkin Optical waveguide structures and methods of fabrication
US20040178484A1 (en) * 2003-03-14 2004-09-16 General Electric Company Interposer, interposer package and device assembly employing the same
US20050024290A1 (en) * 2001-02-15 2005-02-03 Integral Technologies, Inc. Low cost RFID antenna manufactured from conductive loaded resin-based materials
US20060072297A1 (en) * 2004-10-01 2006-04-06 Staktek Group L.P. Circuit Module Access System and Method
US20060079127A1 (en) * 2004-10-01 2006-04-13 Socketstrate, Inc. Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
US20060237838A1 (en) * 2003-02-19 2006-10-26 Mark Fery Thermal interconnect systems methods of production and uses thereof
US20070231953A1 (en) * 2006-03-31 2007-10-04 Yoshihiro Tomita Flexible interconnect pattern on semiconductor package
US20090129786A1 (en) * 2007-11-02 2009-05-21 National Semiconductor Corporation Coupling of optical interconnect with electrical device
US20090152100A1 (en) * 2007-12-14 2009-06-18 Ami Semiconductor, Inc. Thick metal interconnect with metal pad caps at selective sites and process for making the same
US20100328028A1 (en) * 2003-07-04 2010-12-30 Koninklijke Philips Electronics N.V. Flexible semiconductor device and identification label
WO2012145605A1 (fr) * 2011-04-22 2012-10-26 The Regents Of The University Of California Modulateur optique à base de graphène
US20130028147A1 (en) * 2011-07-26 2013-01-31 Motorola Mobility, Inc. Front end employing pin diode switch with high linearity and low loss for simultaneous transmission

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5659153A (en) * 1995-03-03 1997-08-19 International Business Machines Corporation Thermoformed three dimensional wiring module
US6288443B1 (en) * 1996-12-11 2001-09-11 David Finn Chip module and manufacture of same
US6343744B1 (en) * 1999-02-19 2002-02-05 Nippon Telegraph And Telephone Corporation Noncontact type IC card and system therefor
US20020106165A1 (en) * 2000-12-13 2002-08-08 Barry Arsenault Optical waveguide assembly for interfacing a two-dimensional optoelectronic array to fiber bundles
US20050024290A1 (en) * 2001-02-15 2005-02-03 Integral Technologies, Inc. Low cost RFID antenna manufactured from conductive loaded resin-based materials
US20030057525A1 (en) * 2001-05-08 2003-03-27 Johann-Heinrich Fock Flexible integrated monolithic circuit
US20030031446A1 (en) * 2001-08-08 2003-02-13 Photon-X, Inc. Freestanding athermal polymer optical waveguide
US20030133682A1 (en) * 2002-01-14 2003-07-17 Henryk Temkin Optical waveguide structures and methods of fabrication
US20060237838A1 (en) * 2003-02-19 2006-10-26 Mark Fery Thermal interconnect systems methods of production and uses thereof
US20040178484A1 (en) * 2003-03-14 2004-09-16 General Electric Company Interposer, interposer package and device assembly employing the same
US20100328028A1 (en) * 2003-07-04 2010-12-30 Koninklijke Philips Electronics N.V. Flexible semiconductor device and identification label
US20060072297A1 (en) * 2004-10-01 2006-04-06 Staktek Group L.P. Circuit Module Access System and Method
US20060079127A1 (en) * 2004-10-01 2006-04-13 Socketstrate, Inc. Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
US20070231953A1 (en) * 2006-03-31 2007-10-04 Yoshihiro Tomita Flexible interconnect pattern on semiconductor package
US20090129786A1 (en) * 2007-11-02 2009-05-21 National Semiconductor Corporation Coupling of optical interconnect with electrical device
US20090152100A1 (en) * 2007-12-14 2009-06-18 Ami Semiconductor, Inc. Thick metal interconnect with metal pad caps at selective sites and process for making the same
WO2012145605A1 (fr) * 2011-04-22 2012-10-26 The Regents Of The University Of California Modulateur optique à base de graphène
US20130028147A1 (en) * 2011-07-26 2013-01-31 Motorola Mobility, Inc. Front end employing pin diode switch with high linearity and low loss for simultaneous transmission

Also Published As

Publication number Publication date
WO2014121300A2 (fr) 2014-08-07

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