WO2014102642A1 - Ensemble d'éclairage - Google Patents

Ensemble d'éclairage Download PDF

Info

Publication number
WO2014102642A1
WO2014102642A1 PCT/IB2013/060836 IB2013060836W WO2014102642A1 WO 2014102642 A1 WO2014102642 A1 WO 2014102642A1 IB 2013060836 W IB2013060836 W IB 2013060836W WO 2014102642 A1 WO2014102642 A1 WO 2014102642A1
Authority
WO
WIPO (PCT)
Prior art keywords
lighting assembly
light source
lighting
heat dissipating
dissipating element
Prior art date
Application number
PCT/IB2013/060836
Other languages
English (en)
Inventor
Jianhong CHEN
Original Assignee
Koninklijke Philips N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V. filed Critical Koninklijke Philips N.V.
Publication of WO2014102642A1 publication Critical patent/WO2014102642A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting assembly.
  • the invention relates to a cooling arrangement for a lighting assembly.
  • LEDs Light Emitting Diodes
  • a LED lamp can save energy compared to traditional lighting, which will make LEDs widely used in the future. LEDs also have a much longer lifetime which may decrease environmental impact from production of lamps. However, in an ordinary LED lamp 75% ⁇ 85% of the energy provided will be converted to heat. Consequently, there is a need to use high power LEDs to produce enough lighting for most ordinary indoor applications as efficient as possible. However, these high power LEDs also produce heat. High demands are therefore put both on the LEDs but also on their driver circuits to deliver high lumen output at a high temperature.
  • the driver circuits are often provided integrated in the lamp, these driver circuits convert an AC voltage into a DC voltage which is then used by the LEDs. These driver circuits will also produce heat when converting the voltage, and the driver components for a driver circuit able to provide more power must also be able to withstand higher temperatures. If the heat is not managed in a LED lamp, the light output and lifetime will be reduced.
  • the aforementioned issues relating to thermal management are addressed through an LED lamp having a thermally conductive body.
  • the thermally conductive body also has cavities and openings for allowing air to flow through the body to cool the entire LED lamp.
  • a lighting assembly comprising a lighting unit which comprises a light source thermally coupled to a first heat dissipating element and a driver unit which comprises light source driver electronics thermally coupled to a second heat dissipating element wherein both of the light source and the driver electronics are arranged intersecting with a same plane perpendicular to an optical axis of the lighting assembly.
  • lighting assembly it should be understood that the purpose of the device is to provide lighting, and that the lighting unit with a light source is the main component providing this function.
  • An optical axis is defined as an axis around which there is rotational symmetry of the light output from an optical system.
  • the central axis of a lighting assembly is typically aligned with the optical axis of the lighting assembly.
  • the assembly is essentially divided into two parts, a lighting unit and a driver unit, where the driver unit comprises the driver electronics capable of driving the light source.
  • the driver unit comprises the driver electronics capable of driving the light source.
  • This divide makes it possible to provide each unit with a separate heat dissipating element, which may in turn enable a reduced thermal coupling between the two units.
  • the present invention is based on the realization that by thermally separating the light source and light source driver electronics from each other a lower temperature can be achieved, during use, in the entire assembly.
  • components of the driver electronics circuitry such as electrolytic elements in the form of capacitors, may be more sensitive to high
  • a light source such as an LED may operate at 125°C while conventional components for driver electronics may fail at temperatures around 80°C. Accordingly, it is desirable to arrange the thermally sensitive driver components in a cooler area where they are better protected from high temperatures. Additionally, even though suitable high-temperature components may be available, they are in general much more expensive than conventional components.
  • the light source and driver electronics are arranged intersecting with a plane perpendicular to the optical axis of the lighting assembly.
  • the light source and the driver electronics are arranged laterally with respect to the optical axis. This arrangement may, when the lighting assembly is arranged with its optical axis in an essentially vertical plane, provide a lower heat conduction between the light source and light source driver electronics than the prior art. Although there may be some displacement between the light source and driver electronics along the direction of the optical axis, they are at the substantial same level.
  • the light source and the driver electronics are arranged in essentially a vertically stacked manner, which allows heat to be conducted vertically between the light source and light source driver electronics.
  • a lighting assembly according to the present invention may provide lower heat conduction between the light source and light source driver electronics, which may lower the overall temperature of both the light source and light source driver electronics. The present invention may thus allow the light source driver electronics to provide a higher effect than before at the same temperature due to improved cooling, or provide lower energy consumption due to higher efficiency of the light source driver electronics at lower temperatures.
  • the lower temperature may allow other materials to be used in manufacturing the lighting assembly, which may be cheaper and/or enable a simpler manufacture of the components.
  • Lower heat conduction may thus be achieved since air in the proximity of either the light source or the light source driver electronics which is heated will rise, but heated air does not pass the other component since they are arranged essentially in the same horizontal plane.
  • the present invention enables a design where energy may be saved due to a higher efficiency of the light source driver electronics, or a higher lumen output may be achieved from the lighting assembly without inferring additional thermal protection, fabrication costs may also be lowered through use of different materials.
  • the lighting assembly may further comprise a connecting portion in a connecting end of the lighting assembly for connecting the lighting assembly to a socket, and a light output end opposite of the connecting end of the lighting assembly, wherein the lighting unit and the driver unit are arranged in the light output end.
  • a lower heat coupling may be ensured as heated air from either unit does not affect the other.
  • the light output end is in the opposite end of the lighting assembly with respect to the connecting end along the optical axis.
  • lighting assemblies are directed downwards to provide an aesthetically pleasing lighting indoors. This will, in use, place the light output end with the lighting unit and driver unit, which in use produces heat, at a lower part of the lighting assembly.
  • An adequate separation in distance between a connecting socket and the heat producing components of the lighting assembly may then be allowed due to the arrangement of the driver unit and lighting unit at the light output end. This separation in distance may enable air circulation around the heat dissipating elements.
  • the second heat dissipating element may surround a portion of the first heat dissipating element.
  • the driver unit may surround the lighting unit instead of being placed adjacent laterally, which may enable a lighting assembly having a shape similar to conventional incandescent bulbs.
  • the second heat dissipating element may surround a portion of the first heat dissipating element at the light output end. As the surrounding portion is in direct contact with the ambient air, cooling of the surrounding portion may be more efficient. Accordingly, it may be advantageous to arrange the second heat dissipating element of the more thermally sensitive driver electronics adjacent to the surrounding air.
  • the driver unit may surround a portion of the lighting unit comprising said light source.
  • thermal separation may be enabled between the light source and the light source driver electronics.
  • the lighting assembly is arranged in an essentially vertical plane, air which may be heated indirectly or directly by the light source or the light source driver electronics will rise, but not impinge upon and heat the other component since it is ensured that the light source and light source driver electronics are both in a plane perpendicular to the essentially vertical plane.
  • the light source and the light source driver electronics may be arranged adjacent to each other. This allows a compact size of the lighting assembly.
  • the lighting assembly may also further comprise a thermally insulating material arranged between the lighting unit and the driver unit. It may be the case that further thermal separation is desired between the driver unit and the lighting unit, for instance where a high lumen output is desired which requires high power. It may therefore be advantageous to arrange a thermally insulating material in between the driver unit and the lighting unit for further thermal separation.
  • the insulating material could also be an absence of material where a spacing in itself provides thermal insulation i.e. the material in question would then be air, vacuum or another gaseous compound with low thermal conductivity.
  • the first heat dissipating element may further comprise; a plurality of cooling fins and at least one cavity having a first opening at the light output end of the lighting unit and a second opening adjacent to the plurality of cooling fins, such that when the lighting unit is arranged with its optical axis in an essentially vertical plane, ambient air is allowed to enter the first opening, pass through the cavity and exit the cavity through the second opening, wherein the cooling fins are arranged such that air pass the cooling fins when leaving the at least one cavity.
  • the cooling fins will increase the area able to dissipate heat to the surrounding air through convection, and to even further dissipate heat through radiation.
  • each of the plurality of cooling fins may be extending radially from the optical axis of the lighting unit. This embodiment may advantageously even further increase the available surface area for dissipating heat to the surrounding environment.
  • the at least one cavity may be aligned with the optical axis of the lighting assembly.
  • the cavity will advantageously as mentioned above be placed in an essentially vertical plane as the present lighting assembly is preferably oriented vertically to enable the advantageous cooling features. This will as mentioned enable the cavity together with the cooling fins to create a "chimney" effect and pull ambient air through the cavity. An essentially vertical orientation of the lighting assembly and chimney may thus create the most efficient cooling conditions.
  • the lighting assembly may further comprise potting material encasing the light source driver electronics to conduct heat from the light source driver electronics to the second heat dissipating element which encases the potting material.
  • potting material By further encasing the light source driver electronics in potting material the light source driver electronics will be able to conduct heat more efficiently to the second heat dissipating element, whereby the light source driver electronics may produce more power, or they may be manufactured by other less costly materials, materials having a smaller environmental impact or materials producing more heat at the same power.
  • the potting material may advantageously be made from at least one from a group of silicon oil, micro silica powder and asphalt, or a mixture thereof, which are materials with a thermal conductivity which is advantageous for use as potting material.
  • the first heat dissipating element further comprises a coating for increasing thermal radiation from the first heat dissipating element.
  • a coating for increasing thermal radiation from the first heat dissipating element By increasing the thermal radiation even further, even more heat dissipation to the surrounding is enabled, which will as discussed above enable a higher lumen output from the assembly and/or a different choice of materials used in the lighting assembly.
  • the first heat dissipating element may further comprise a coating for increasing thermal radiation from the first heat dissipating element, where the coating is black and/or white paint.
  • Black and/or white paint may advantageously be used as coating to improve the emissivity of the surface, which may in turn increase the heat radiation and thus the heat dissipated to the surrounding.
  • the lighting assembly may further comprise an optical element arranged in front of the light source, where the optical element may further comprise an opening aligned with the first opening of the first heat dissipating element for allowing air to enter the cavity.
  • Introducing an optical element in front of the light source may protect the light source from contact with the outside environment and protect the light source from e.g., dust.
  • the optical element may be a lens.
  • a lens will advantageously enable many effects such as focusing or dispersing the light from the light source depending on what type of lens is chosen.
  • Fig. 1 schematically illustrates an exploded view of the lighting assembly according to an embodiment of the invention
  • Fig. 2 is a schematic representation of the lighting assembly
  • Fig. 3 is a cross-section view of the lighting assembly illustrated in Fig.
  • a lighting assembly according to the present invention is mainly discussed with reference to a lighting assembly comprising an LED light source. It should be noted that this by no means limit the scope of the invention, which is also applicable in other circumstances, for example for use with other types of light sources.
  • the lighting assembly 120 is represented through an exploded view drawing, where the first heat dissipating element 100 and a printed circuit board (PCB) 102 comprising a light source (not shown), arranged towards the light output end 1 10 is shown.
  • the first heat dissipating element 100 further comprises cooling fins 130 for improving the heat dissipation.
  • the first heat dissipating element 100 and the PCB 102 comprising the light source 102 together form the lighting unit 1 16.
  • the connecting end 1 12 with a connecting portion 122 of the lighting assembly 120 is shown.
  • Light source driver electronics 104 are mounted on a printed circuit board 105, to be arranged within a second heat dissipating element 106. Together, the PCB 105 comprising the light source driver electronics 104 and the second heat dissipating element 106 form the driver unit 1 18.
  • the driver unit 1 18 further comprises potting material 108, which is to be placed in the second heat dissipating element 106 enclosing the driver electronics 104 in order to provide a thermal coupling between the driver electronics 104 and the second heat dissipating element 106.
  • An optical element 109 in the form of a lens is also shown arranged between the light source 102 and the light output end 1 10 of the lighting assembly 120.
  • the lighting assembly 120 has a shape as shown in Fig. 1 , where the lighting assembly 120 is essentially rotationally symmetric around an optical axis 1 14.
  • FIG. 2 a schematic representation where the lighting assembly 120 of Fig. 1 is assembled, is shown.
  • the light source 102 is surrounded towards the light output end by the driver unit 1 18 comprising the driver electronics 104, and the light source 102 and the driver electronics 104 are thereby arranged adjacent to each other in a plane perpendicular to the optical axis 1 14 of the lighting assembly 120.
  • Fig. 3 is a cross-section view of the assembled lighting assembly illustrated in Fig. 2.
  • the air flow entering the lighting assembly 120 and the air flow exiting the lighting assembly 120 is illustrated by arrow 124.
  • the ambient air passes the cooling fins 130, the cooling fins 130 and ambient air exchange heat.
  • the heated air will rise and more ambient air will be pulled into and through the cavity 126 defining a chimney along the path of the airflow 124.
  • the lighting assembly 120 is advantageously mounted with the optical axis 1 14 in an essentially vertical orientation, where the connecting portion 122 is the highest point of the lighting assembly 120.
  • the lighting unit 1 16 comprising the first heat dissipating element 100 and the light source 102
  • the driver unit 1 18 comprising the second heat dissipating element 106 and the light source driver electronics 104 are arranged adjacent to each other in a plane perpendicular to the optical axis 1 14 of the lighting assembly 120, where the driver unit 1 18 surrounds a portion of the lighting unit 1 16 comprising the light source 102. If the lighting assembly 120 is mounted with the optical axis 1 14 in an essentially vertical plane this arrangement may further reduce the thermal coupling between the driver unit 1 18 and the lighting unit 1 16 since heated air rising from the lighting unit 1 16 will not impinge upon the driver unit 1 18.
  • the driver unit 1 18 further comprises potting material 108 which is comprised of silicon oil and micro silica powder which conducts heat more efficient to the second heat dissipating element 106, from the light source driver electronics 104.
  • potting material 108 may be asphalt or a mixture of similar materials.
  • the physical contact area 128 between the driver unit 1 18 and the lighting unit 1 16 illustrated in Fig. 3 may further comprise a thermally insulating material inserted to further reduce the thermal connection between the driver unit 1 16 and the lighting unit 1 18.
  • the thermally insulating material would increase the spacing between the driver unit 1 18 and the lighting unit 1 16, but would not essentially otherwise change any structural details of the lighting assembly 120.
  • the lighting assembly 120 further comprises an optical element 109 in the form of a lens.
  • This optical element 109 will protect the light source 102 from the outside environment and may also in the form of a lens produce features such as but not limited to focusing the light emitted from the light source or dispersing it.
  • the light source could be a laser, OLED, or another material or device producing light.
  • the connecting end may be shaped in another way or angled or slightly angled for fitting into a non-standard socket.
  • the optical element might be colored or produced from a luminescent material which converts the light into another wavelength or wavelength spectra.
  • the cooling fins may extend all the way to the opening at the light output end, or they may be arranged in another configuration.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention se rapporte à un ensemble d'éclairage (120) comprenant une unité d'éclairage (116) qui comprend une source de lumière (102) thermocouplée à un premier élément de dissipation de chaleur (100), et une unité de commande (118) qui comprend de l'électronique de commande (104) de source de lumière thermocouplée à un second élément de dissipation de chaleur (106), la source de lumière (102) et l'électrique de commande (104) étant toutes les deux agencées de manière à couper un même plan perpendiculaire à un axe optique (114) de l'ensemble d'éclairage (120).
PCT/IB2013/060836 2012-12-24 2013-12-12 Ensemble d'éclairage WO2014102642A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNPCT/CN2012/087325 2012-12-24
CN2012087325 2012-12-24

Publications (1)

Publication Number Publication Date
WO2014102642A1 true WO2014102642A1 (fr) 2014-07-03

Family

ID=50033603

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2013/060836 WO2014102642A1 (fr) 2012-12-24 2013-12-12 Ensemble d'éclairage

Country Status (1)

Country Link
WO (1) WO2014102642A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2849473Y (zh) * 2004-10-01 2006-12-20 沈锦祥 一种发光二极管射灯
US20080123341A1 (en) * 2006-11-28 2008-05-29 Primo Lite Co., Ltd Led lamp structure
JP2010015798A (ja) * 2008-07-03 2010-01-21 Panasonic Corp ランプ
WO2011089103A1 (fr) * 2010-01-20 2011-07-28 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage
US20120080699A1 (en) * 2010-09-30 2012-04-05 GE Lighting Solutions, LLC Lightweight heat sinks and led lamps employing same
EP2461094A2 (fr) * 2010-12-03 2012-06-06 Samsung LED Co., Ltd. Source lumineuse pour appareil d'éclairage et son procédé de fabrication
US20120147600A1 (en) 2008-09-08 2012-06-14 Intematix Corporation Light emitting diode (led) lamps
WO2012114225A2 (fr) * 2011-02-24 2012-08-30 Koninklijke Philips Electronics N.V. Ensemble lampe
DE102011004746A1 (de) * 2011-02-25 2012-08-30 Osram Ag Halbleiter-Leuchtmodul und Fahrzeugleuchte

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2849473Y (zh) * 2004-10-01 2006-12-20 沈锦祥 一种发光二极管射灯
US20080123341A1 (en) * 2006-11-28 2008-05-29 Primo Lite Co., Ltd Led lamp structure
JP2010015798A (ja) * 2008-07-03 2010-01-21 Panasonic Corp ランプ
US20120147600A1 (en) 2008-09-08 2012-06-14 Intematix Corporation Light emitting diode (led) lamps
WO2011089103A1 (fr) * 2010-01-20 2011-07-28 Osram Gesellschaft mit beschränkter Haftung Dispositif d'éclairage
US20120080699A1 (en) * 2010-09-30 2012-04-05 GE Lighting Solutions, LLC Lightweight heat sinks and led lamps employing same
EP2461094A2 (fr) * 2010-12-03 2012-06-06 Samsung LED Co., Ltd. Source lumineuse pour appareil d'éclairage et son procédé de fabrication
WO2012114225A2 (fr) * 2011-02-24 2012-08-30 Koninklijke Philips Electronics N.V. Ensemble lampe
DE102011004746A1 (de) * 2011-02-25 2012-08-30 Osram Ag Halbleiter-Leuchtmodul und Fahrzeugleuchte

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