WO2014101614A1 - 一种温度可控半导体制冷装置 - Google Patents

一种温度可控半导体制冷装置 Download PDF

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Publication number
WO2014101614A1
WO2014101614A1 PCT/CN2013/087959 CN2013087959W WO2014101614A1 WO 2014101614 A1 WO2014101614 A1 WO 2014101614A1 CN 2013087959 W CN2013087959 W CN 2013087959W WO 2014101614 A1 WO2014101614 A1 WO 2014101614A1
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temperature
circuit board
control circuit
semiconductor refrigeration
controller
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PCT/CN2013/087959
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English (en)
French (fr)
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陈建波
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宁波婷微电子科技有限公司
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Publication of WO2014101614A1 publication Critical patent/WO2014101614A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage

Definitions

  • the utility model relates to the technical field of refrigeration equipment, and in particular to a temperature controllable semiconductor refrigeration device.
  • the temperature balance is achieved by using the cooling capacity of the semiconductor chip itself.
  • the disadvantage is that the temperature cannot be adjusted and the equilibrium temperature inside the box changes with the environmental temperature, and the product consumes a large amount of energy; the other is to set the temperature of the shutdown and the temperature to automatically open. Stop, the shortcoming is that the balance temperature in the tank has fluctuations during the start and stop process, and the relative energy consumption is still relatively large. In summary, how to reduce the high energy consumption of semiconductor refrigerators has become an urgent problem to be solved by those skilled in the art.
  • the present invention provides a temperature controllable semiconductor refrigeration device, including a semiconductor refrigeration chip, further comprising: a power control circuit board, the power control circuit board is a multi-speed power control circuit board, the power supply a control circuit board electrically connected to the semiconductor refrigeration chip; a controller, the controller includes a comparison component and a control component capable of controlling gear bit selection of the power control circuit board, wherein the comparison component stores contrast temperature data,
  • the power control circuit board is electrically connected to the semiconductor cooling chip through the controller; a temperature sensing component, the temperature sensing component is configured to detect an ambient temperature and generate a temperature signal, and the temperature sensing component and the controller signal connection.
  • the temperature sensing component is an electronic thermometer.
  • the temperature controllable semiconductor refrigeration device provided by the utility model comprises a
  • the utility model comprises: a power control circuit board, the power control circuit board is a multi-level power control circuit board, the power control circuit board is electrically connected with the semiconductor refrigeration chip; the controller and the controller comprise a comparison component and a control capable of controlling the gear position selection of the power control circuit board
  • the component, the comparison component stores the contrast temperature data
  • the power control circuit board is electrically connected to the semiconductor refrigeration chip through the controller
  • the temperature sensing component the temperature sensing component is used for detecting the ambient temperature and generating a temperature signal
  • the temperature sensing component is connected with the controller signal .
  • the controller has logic capability to compare the ambient temperature data of the temperature sensing component with the comparison data stored in the comparison component, and select a predetermined gear to control the power control circuit board voltage output through the control component.
  • the temperature sensing component is used to detect the ambient temperature and provide a basis for control of the controller.
  • the power control circuit board is electrically connected to the semiconductor refrigeration chip. As the output voltage of the power control circuit board is reduced, the semiconductor refrigeration effect is lowered, thereby achieving temperature control.
  • FIG. 1 is a structural block diagram of a temperature controllable semiconductor refrigeration device according to an embodiment of the present invention; the corresponding relationship between component names and reference numerals in FIG. 1 is:
  • Semiconductor refrigeration chip 1 controller 2; power control circuit board 3; temperature sensing component 4.
  • the core of the utility model provides a temperature controllable semiconductor book cooling device, and the temperature controllable semiconductor refrigeration device can realize real-time temperature control through its structural design, thereby achieving the purpose of reducing energy consumption, so that the person skilled in the art can make the person skilled in the art
  • the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
  • FIG. 1 is a structural block diagram of a temperature controllable semiconductor refrigeration device according to an embodiment of the present invention.
  • the utility model provides a temperature controllable semiconductor refrigeration device, which comprises a semiconductor refrigeration chip 1.
  • the semiconductor refrigeration chip 1 has the characteristics that the cooling power changes synchronously with the magnitude of the voltage and current loaded thereon, and the basis of this feature
  • the utility model proposes the following technical solution for realizing temperature control of the refrigeration device.
  • the temperature controllable semiconductor refrigeration device comprises a semiconductor refrigeration chip 1 for loading voltage and current to the semiconductor device, and further comprising: a power control circuit board 3, and the power control circuit board 3 is a multi-speed power supply control circuit a board, the power control circuit board 3 is electrically connected to the semiconductor refrigeration chip 1;
  • the controller 2 includes a comparison component and a control component capable of controlling the gear position selection of the power control circuit board 3.
  • the comparison component stores the contrast temperature data, and the power control circuit board 3 is electrically connected to the semiconductor refrigeration chip 1 through the controller 2.
  • the temperature sensing component 4 is configured to detect an ambient temperature and generate a temperature signal, and the temperature sensing component 4 is coupled to the controller 2.
  • the function of the power control circuit board 2 is to output multiple voltages and currents. It should be noted that at least one of the gears is a rated power output gear, that is, the voltage and current output by the gear are the semiconductor refrigeration chip 1. Rated use voltage and current. For other gear positions, the output is gradually reduced. For example: The output rated voltage is DC12V. After the power supply control board 3 senses the ring temperature through the controller 2, the output voltage is reduced to the DC6V voltage output. The output of the power control book board 3 is electrically connected to the semiconductor cooling chip 1. As the output voltage of the power control circuit board 2 is reduced, the semiconductor cooling effect is lowered to achieve temperature control.
  • the controller 2 has a logic capability to compare the ambient temperature data of the temperature sensing component 4 with the comparison data stored in the comparison component, and select a predetermined gear position control power supply control circuit board 3 voltage output through the control component.
  • the temperature sensing component 4 is used for detecting the ambient temperature and providing a control basis for the controller 3.
  • the temperature sensing component 4 is an electronic thermometer, and the electronic thermometer not only has high sensitivity, but also enables seamless detection of temperature detection (temperature data obtained by an electronic thermometer is a continuous variable).
  • the temperature controllable semiconductor refrigeration device provided by the utility model fully utilizes the characteristics that the cooling power of the semiconductor refrigeration chip changes synchronously with the magnitude of the voltage and current loaded thereon, firstly, the temperature sensing head sensing environment on the control system Temperature, adjust the voltage and current changes on the cooling chip according to different sensing temperatures to adjust the cooling capacity of the product, synchronously with the voltage and electricity on the semiconductor chip The flow is reduced, and the output power of the switching power supply is simultaneously reduced, thereby achieving the purpose of energy saving and power saving in different environments.
  • a specific application of the utility model is as follows:
  • Two comparators in the switching power supply external transition board compare the temperature sensing temperature of the temperature sensor to the set temperature. There is a toggle switch on the board. When the switch is in the first gear, the temperature sensor is short-circuited, so that 358 outputs a low level to IC 494 in the power board, so that DC forces the full power. When the switch is in the second gear, the temperature sensor operates according to the ring temperature. When the ambient temperature is at the required value A (required value A depends on different products), the voltage at pin 3 of 358 is higher than the pin 2 of the book, and a set of comparators works.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种温度可控半导体制冷装置，包括半导体制冷芯片（1）、电源控制电路板（3）、控制器（2）和感温组件（4）。电源控制电路板（3）为多档电源控制电路板，电源控制电路板（3）与半导体制冷芯片（1）电气连接，随着电源控制电路板（3）输出电压的减小，半导体制冷效果降低；控制器（2）包括比较组件和能够控制电源控制电路板（3）档位选择的控制组件，比较组件中存储有对比温度数据，控制器（2）与电源控制电路板（3）电气连接；感温组件（4）用于检测环境温度并生成温度信号，感温组件（4）与控制器（2）信号连接。该半导体制冷装置的制冷温度可控，从而达到了降低能耗的效果。

Description

一种温度可控半导体制冷装置 技术领域
说
本实用新型涉及制冷设备技术领域， 更具体地说， 特别涉及一种温度可控 半导体制冷装置。
背景技术 目前巿场上的半导体冰箱的控制方式大致有两种， 一类为不加温度控制的， 书
利用半导体芯片自身的产冷量来达到温度平衡， 其缺点为温度无法调节且箱内 平衡温度随环境温度变化而变化， 产品能耗大； 另一类为设定开停机温度， 达 到温度自动开停， 其缺点为开停过程中箱内平衡温度有起伏， 相对能耗还是较 大。 综上所述， 如何降低半导体冰箱能耗较高的问题， 成为了本领域技术人员 亟待解决的问题。
实用新型内容 本实用新型要解决的技术问题为提供一种温度可控半导体制冷装置， 该温 度可控半导体制冷装置通过其结构设计， 能够进行实时温度控制， 从而达到降 低能耗的目的。 为解决上述技术问题， 本实用新型提供了一种温度可控半导体制冷装置， 包括半导体制冷芯片， 还包括： 电源控制电路板， 所述电源控制电路板为多档电源控制电路板， 所述电源 控制电路板与所述半导体制冷芯片电气连接； 控制器， 所述控制器包括比较组件和能够控制所述电源控制电路板档位选 择的控制组件， 所述比较组件中存储有对比温度数据， 所述电源控制电路板通 过所述控制器与所述半导体说制冷芯片电气连接； 感温组件， 所述感温组件用于检测环境温度并生成温度信号， 所述感温组 件与所述控制器信号连接。 优选地， 所述感温组件为电子温度计。 本实用新型提供的温度可控半导体制冷装置， 包括有半导体制冷芯片， 还 书
包括： 电源控制电路板， 电源控制电路板为多档电源控制电路板， 电源控制电 路板与半导体制冷芯片电气连接； 控制器， 控制器包括比较组件和能够控制电 源控制电路板档位选择的控制组件， 比较组件中存储有对比温度数据， 电源控 制电路板通过控制器与半导体制冷芯片电气连接； 感温组件， 感温组件用于检 测环境温度并生成温度信号， 感温组件与控制器信号连接。 控制器具有逻辑能 力， 其根据感温组件的环境温度数据与比较组件中存储的对比数据进行比较， 通过控制组件选择既定的档位控制电源控制电路板电压输出。 感温组件则用于 进行环境温度的检测， 为控制器提供控制依据。 电源控制电路板与半导体制冷 芯片电气连接， 随着电源控制电路板输出电压的减小， 半导体制冷效果降低， 从而达到温度控制。 通过上述结构设计， 由于温度可控半导体制冷装置制冷温 度可控， 从而达到了降低能耗的目的。
附图说明 为了更清楚地说明本实用新型实施例或现有技术中的技术方案， 下面将对 实施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本实用新型的实施例， 对于本领域普通技术人员来讲， 在 不付出创造性劳动的前提下， 还可以根据提供的附图获得其他的附图。
图 1为本实用新型一种说实施例中温度可控半导体制冷装置的结构框图； 图 1中部件名称与附图标记的对应关系为：
半导体制冷芯片 1 ; 控制器 2; 电源控制电路板 3; 感温组件 4。 具体实施方式
本实用新型的核心为提供一种温度可控半导体制书冷装置， 该温度可控半导 体制冷装置通过其结构设计， 能够进行实时温度控制， 从而达到降低能耗的目 为了使本领域的技术人员更好地理解本实用新型的技术方案， 下面结合附 图和具体实施例对本实用新型作进一步的详细说明。
请参考图 1 ,图 1为本实用新型一种实施例中温度可控半导体制冷装置的结 构框图。
本实用新型提供了一种温度可控半导体制冷装置， 包括半导体制冷芯片 1 , 半导体制冷芯片 1 具有制冷功率随加载在其上面的电压和电流的大小变化而同 步变化的特点， 在此特点的基础上， 本实用新型提出了如下技术方案， 用于实 现对制冷装置的温度控制。
本实用新型提供的温度可控半导体制冷装置， 包括有半导体制冷芯片 1 , 用 于对半导体装置加载电压、 电流， 其还包括： 电源控制电路板 3 , 电源控制电路 板 3为多档电源控制电路板， 电源控制电路板 3与半导体制冷芯片 1电气连接； 控制器 2,控制器 2包括比较组件和能够控制电源控制电路板 3档位选择的控制 组件， 比较组件中存储有对比温度数据， 电源控制电路板 3通过控制器 2与半 导体制冷芯片 1电气连接； 感温组件 4 , 感温组件 4用于检测环境温度并生成温 度信号， 感温组件 4与控制说器 2信号连接。
电源控制电路板 2 的作用为输出多档不同电压与电流， 需要说明的是， 其 中至少包括一档为额定功率输出档位， 即釆用该档位输出的电压、 电流为半导 体制冷芯片 1 的额定使用电压、 电流。 其他档位， 则釆用输出量逐级减小的设 置， 例如： 输出额定电压为 DC12V, 电源控制电路板 3通过控制器 2感应环温 后， 将输出电压下降至 DC6V电压输出。 电源控制书电路板 3输出端与半导体制 冷芯片 1 电气连接， 随着电源控制电路板 2输出电压的减小， 半导体制冷效果 降低， 从而达到温度控制。
控制器 2具有逻辑能力， 其根据感温组件 4的环境温度数据与比较组件中 存储的对比数据进行比较，通过控制组件选择既定的档位控制电源控制电路板 3 电压输出。
感温组件 4则用于进行环境温度的检测， 为控制器 3提供控制依据。
具体地， 在本实用新型中， 感温组件 4 为电子温度计， 电子温度计不仅具 有较高的灵敏度， 同时还能够实现温度检测的无缝检测 （通过电子温度计得到 的温度数据为连续变量）。
本实用新型提供的温度可控半导体制冷装置， 充分利用半导体制冷芯片的 制冷功率随加载在它上面的电压和电流的大小变化而同步变化的特点， 首先通 过该控制系统上的感温头感应环境温度， 按照不同的感应温度而调整制冷芯片 上的电压和电流的变化来调整产品的制冷量， 同步随着半导体芯片上电压和电 流的减小， 开关电源的输出功率同步缩小， 从而达到在不同的环境下都可实现 节能省电的目的。 本实用新型的一种具体应用如下：
说
开关电源外接过渡板 （LM358 ) 中的两个比较器， 将温度传感器的感应温 度与设定温度进行比较。 在板上的有一拨动开关， 开关位于一档时， 将温度传 感器短路， 使得 358输出低电平给电源板中的 IC 494, 使直流强制输出全功率。 当开关位于二档时， 温度传感器根据环温工作， 当环境温度在要求值 A (要求 值 A视不同产品而定） 时， 358的 3脚电压高于其书 2脚， 一组比较器工作， 输 出一个稳定电压 a (电压 A视不同产品而定）；当温度在要求值 B (要求值 B视 不同产品而定）， 358的 3脚高于 2脚， 同时， 5脚高于 6脚， 两组比较器同时 工作， 输出一个稳定电压 b (电压 B视不同产品而定）， 当温度在要求值 C (要 求值 C视不同产品而定）， 358的 3脚高于 2脚， 同时， 5脚高于 6脚， 两组比 较器同时工作， 输出一个稳定电压 c (电压 c视不同产品而定）

Claims

权 利 要 求 书
1、 一种温度可控半导体制冷装置， 包括半导体制冷芯片 （1 ), 其特征在于， 还 包括：
电源控制电路板（3), 所述电源控制电路板（3) 为多档电源控制电路板， 所述电源控制电路板（3) 与所述半导体制冷芯片 （1 ) 电气连接；
控制器（2), 所述控制器（2)包括比较组件和能够控制所述电源控制电路 板（3)档位选择的控制组件， 所述比较组件中存储有对比温度数据， 所述电源 控制电路板（3) 通过所述控制器（2) 与所述半导体制冷芯片 （1 ) 电气连接； 感温组件（4), 所述感温组件（4)用于检测环境温度并生成温度信号， 所 述感温组件（4) 与所述控制器 （2)信号连接。
2、 根据权利要求 1所述的温度可控半导体制冷装置， 其特征在于， 所述感温组 件（4)为电子温度计。
PCT/CN2013/087959 2012-12-26 2013-11-27 一种温度可控半导体制冷装置 WO2014101614A1 (zh)

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