WO2014079081A1 - 热沉及用该热沉的背光模组 - Google Patents

热沉及用该热沉的背光模组 Download PDF

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Publication number
WO2014079081A1
WO2014079081A1 PCT/CN2012/085383 CN2012085383W WO2014079081A1 WO 2014079081 A1 WO2014079081 A1 WO 2014079081A1 CN 2012085383 W CN2012085383 W CN 2012085383W WO 2014079081 A1 WO2014079081 A1 WO 2014079081A1
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WIPO (PCT)
Prior art keywords
bottom plate
heat sink
plate
heat
side plate
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Ceased
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PCT/CN2012/085383
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English (en)
French (fr)
Inventor
萧宇均
黄冲
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/806,806 priority Critical patent/US9208705B2/en
Publication of WO2014079081A1 publication Critical patent/WO2014079081A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a heat sink and a backlight module using the heat sink. Background technique
  • Liquid crystal display has many advantages such as thin body, power saving, and no radiation, and has been widely used.
  • Most of the liquid crystal display devices on the market are backlight type liquid crystal displays, which include a liquid crystal panel and a backlight module.
  • the working principle of the liquid crystal panel is to place liquid crystal molecules in two parallel glass substrates, control the liquid crystal molecules to change direction by energizing the circuit of the glass substrate, and refract the light of the backlight module to produce a picture. Since the liquid crystal panel itself does not emit light, the light source provided by the backlight module is required to normally display the image. Therefore, the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight module is divided into a side-lit backlight module and a direct-lit backlight module according to the incident position of the light source.
  • a light source such as a CCFL (Cold Cathode Fluorescent Lamp) or an LED (Light Emitting Diode) is disposed behind the liquid crystal panel, and a surface light source is directly formed and supplied to the liquid crystal panel.
  • the side-lit backlight module has an illumination light source such as an LED light bar disposed on the edge of the back panel behind the liquid crystal panel, and the light emitted by the light source enters the optical film group from the light incident surface on the optical film group side. After being reflected and diffused, the light exits from the optical film set to form a surface light source for the liquid crystal panel.
  • the LED light bar is generally mounted on the heat sink by means of a screw lock or a thermal adhesive tape, and the heat sink is then mounted on the back plate, and the heat is replaced by a light bar. Conducted to the heat sink for heat dissipation.
  • FIG. 1 which is a structural diagram of a heat sink of an existing LED light bar
  • the heat sink 100 includes a bottom plate 102 and a side plate 104 , and the bottom plate 102 and the side plate 104 are integrally formed by an aluminum extruded material, and the LED lamp is formed.
  • the strip 300 is mounted on the side plate 104, and the heat radiated by the LED strip 300 is conducted from the side plate 104 to the bottom plate 102, and then a large area is dissipated on the bottom plate 102.
  • a large surface area is usually designed. 102.
  • the surface area of the bottom plate 102 is generally increased by increasing the width a of the bottom plate 102.
  • the thickness of the aluminum extrusion profile is not so good, and when the width a is increased, the thickness design of the bottom plate 102 needs to be correspondingly increased, otherwise the process cannot extrude the profile with better flatness.
  • the object of the present invention is to provide a heat sink which is formed by splicing, has a good heat dissipation effect, and is advantageous for cost control.
  • Another object of the present invention is to provide a backlight module which has good heat dissipation effect and high backlight quality.
  • the present invention provides a heat sink, comprising: a first bottom plate, a first side plate disposed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, the first bottom plate and the first bottom plate One side plate is integrally formed, and the second bottom plate is mounted on one end of the first bottom plate away from the first side plate by screwing, the first bottom plate is made of aluminum extruded material, and the second bottom plate is Made of aluminum sheet metal.
  • the aluminum extrusion material used in the first bottom plate is A16063, and the aluminum base material used in the second bottom plate is A15052.
  • the outer surface of the first bottom plate is coated with a radiation heat dissipating material, and the radiation heat dissipating material is a heat dissipating paint.
  • a heat conductive layer disposed between the first bottom plate and the second bottom plate is further included.
  • the heat conductive layer is made of a thermal conductive paste material or a thermal conductive paste.
  • the present invention also provides a heat sink, comprising: a first bottom plate, a first side plate disposed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, wherein the first bottom plate is integrated with the first side plate Formed, the second bottom plate is mounted on one end of the first bottom plate away from the first side plate by screwing, the first bottom plate is made of aluminum extruded material, and the second bottom plate is made of aluminum sheet metal.
  • a heat sink comprising: a first bottom plate, a first side plate disposed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, wherein the first bottom plate is integrated with the first side plate Formed, the second bottom plate is mounted on one end of the first bottom plate away from the first side plate by screwing, the first bottom plate is made of aluminum extruded material, and the second bottom plate is made of aluminum sheet metal.
  • a heat sink comprising: a first bottom plate, a first side plate disposed on the first bottom plate, and a second bottom plate mounted on
  • the aluminum extrusion material used in the first bottom plate is A16063, and the aluminum base material used in the second bottom plate is A15052;
  • the outer surface of the first bottom plate is coated with a radiation heat dissipating material, and the radiation heat dissipating material is a heat dissipating paint;
  • the method further includes a heat conducting layer disposed between the first bottom plate and the second bottom plate;
  • the heat conducting layer is made of a thermal conductive paste material or a thermal conductive adhesive.
  • the present invention also provides a backlight module, comprising: a back plate, a heat sink disposed in the back plate, a light guide plate disposed in the back plate, and an LED light bar mounted on the heat sink, the heat sink comprising: a first bottom plate, a first side plate disposed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, wherein the first bottom plate is integrally formed with the first side plate, and the second bottom plate is screwed
  • the locking method is mounted on an end of the first bottom plate away from the first side plate, the first bottom plate is made of an aluminum extruded material, and the second bottom plate is made of an aluminum sheet metal material.
  • the aluminum extrusion material used in the first bottom plate is A16063, and the aluminum base material used in the second bottom plate is A15052.
  • the outer surface of the first bottom plate is coated with a radiation heat dissipation material, and the radiation heat dissipation material is a heat dissipation paint.
  • the LED light bar is fixedly mounted on the first side plate of the heat sink by screwing or thermally conductive adhesive.
  • the backboard includes a third bottom plate and a second side plate vertically connected to the third bottom plate, the first and second bottom plates are mounted on the third bottom plate, and the first side plate is mounted on the second bottom plate Side panel.
  • the heat sink further includes a heat conductive layer disposed between the first bottom plate and the second bottom plate, the heat conductive layer being made of a thermal conductive paste material or a thermal conductive adhesive.
  • the heat sink of the present invention and the backlight module using the heat sink is formed by splicing, and some of the bottom plates are made of a thin aluminum alum metal material, which uses less Aluminum material is good for cost control, and the backlight module has good heat dissipation effect, which ensures the quality of the backlight.
  • FIG. 1 is a schematic structural view of a conventional heat sink connecting LED strips
  • FIG. 2 is a schematic structural view of an embodiment of a heat sink of the present invention.
  • Figure 3 is a schematic perspective view of the structure of Figure 2;
  • FIG. 4 is a schematic structural view of another embodiment of a heat sink according to the present invention.
  • FIG. 5 is a schematic structural view of an embodiment of a backlight module of the present invention.
  • FIG. 6 is a schematic structural view of another embodiment of a backlight module of the present invention. detailed description
  • the present invention provides a heat sink 2 including: a first bottom plate 22, a first side plate 24 disposed on the first bottom plate 22, and a second bottom plate 26 mounted on the first bottom plate 22 .
  • the first bottom plate 22 is integrally formed with the first side plate 24, and the second bottom plate 26 is attached to one end of the first bottom plate 22 away from the first side plate 24 by means of a screw 202.
  • the first bottom plate 22 is made of an aluminum extruded material
  • the second bottom plate 26 is made of an aluminum sheet metal material.
  • the aluminum extrusion material used in the first bottom plate 22 is A16063
  • the aluminum base material used in the second bottom plate 26 is A15052.
  • the outer surface of the first bottom plate 22 is coated with a radiation heat dissipating material.
  • the radiation heat dissipating material is a heat dissipating paint to obtain a better heat dissipating effect.
  • the second bottom plate 26 has a small thickness, which saves material compared with the integrally formed bottom plate in the prior art, thereby saving cost, especially when the high power demand is used, the cost advantage is more obvious.
  • the heat sink 2 further includes a heat conductive layer 28 disposed between the first bottom plate 22 and the second bottom plate 26.
  • the heat conducting layer 28 is made of a thermal conductive paste material or a thermal conductive adhesive.
  • the heat conducting layer 28 can effectively reduce the thermal resistance of the contact between the first bottom plate 22 and the second bottom plate 26, thereby improving heat transfer efficiency, and the heat sink 2 has Better heat dissipation.
  • the present invention further provides a backlight module, including: a back plate 4 , a heat sink 2 disposed in the back plate 4 , and a light guide plate 6 disposed in the back plate 4 . And an LED strip 8 mounted on the heat sink 2.
  • the heat sink 2 includes: a first bottom plate 22, a first side plate 24 disposed on the first bottom plate 22, and a second bottom plate 26 mounted on the first bottom plate 22.
  • the first bottom plate 22 is integrally formed with the first side plate 24, and the second bottom plate 26 is attached to one end of the first bottom plate 22 away from the first side plate 24 by means of a screw 202.
  • the first bottom plate 22 is made of an aluminum extruded material
  • the second bottom plate 26 is made of an aluminum sheet metal material.
  • the first bottom plate 22 adopts an aluminum extruded material of A16063
  • the second bottom plate 26 adopts an aluminum sheet metal material of A15052.
  • the outer surface of the first bottom plate 22 is coated with a radiation heat dissipating material.
  • the radiation heat dissipating material is a heat dissipating paint to obtain a better heat dissipating effect.
  • the LED light bar 8 is fixedly mounted on the first side plate 24 of the heat sink 2 by screwing or thermally conductive adhesive.
  • the heat radiated by the LED strip 8 is transmitted to the first bottom plate 22 via the first side plate 24, and then transmitted to the second bottom plate 26, and the heat is radiated from the heat sink 2 to the outside, which has a good heat dissipation effect.
  • the second bottom plate 26 is made of a thin aluminum alum metal material, the material is small, and the material cost is effectively reduced.
  • the backboard 4 includes a third bottom plate 42 and a second side plate vertically connected to the third bottom plate 42.
  • the first and second bottom plates 22 and 26 are mounted on the third bottom plate 42, and the first side plate 24 is mounted on the second side plate 44.
  • FIG. 6 is a schematic structural view of another embodiment of a backlight module according to the present invention.
  • the heat sink 2 further includes a first bottom plate 22 and a second bottom plate.
  • the heat conducting layer 28 is made of a thermal conductive paste material or a thermal conductive adhesive.
  • the heat conductive layer 28 can effectively reduce the thermal resistance of the contact between the first bottom plate 22 and the second bottom plate 26, thereby improving heat transfer efficiency, and the heat sink 2 has Better heat dissipation, thus ensuring backlight quality.
  • the bottom plate of the heat sink is formed by splicing, and some of the bottom plates are made of a thin thickness of aluminum sheet metal material, and less used.
  • Aluminum material is good for cost control, and the backlight module has good heat dissipation effect, which ensures the quality of the backlight.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种热沉（2）及用该热沉（2）的背光模组。该热沉（2）包括:第一底板（22）、设于第一底板（22）上的第一侧板（24）、及安装于第一底板（22）上的第二底板（26）。第一底板（22）与第一侧板（24）—体成型制成。第二底板（26）通过螺丝锁附的方式安装于第一底板（22）上远离第一侧板（24）的一端。第一底板（22）由铝挤材料制成，第二底板（26）由铝钣金材料制成。由于热沉（2）的底板（22，26）采用拼接的方式制成，部分底板（26）采用较薄厚度的铝钣金材料制成，使用了较少的铝材，因此利于成本控制；此外，使用该热沉（2）的背光模组的散热效果好。

Description

热沉及用该热沉的背光模组 技术领域
本发明涉及液晶显示领域， 尤其涉及一种热沉及用该热沉的背光模 组。 背景技术
液晶显示装置 （LCD, Liquid Crystal Display )具有机身薄、 省电、 无 辐射等众多优点， 得到了广泛的应用。 现有市场上的液晶显示装置大部分 为背光型液晶显示器， 其包括液晶面板及背光模组（backlight module ) 。 液晶面板的工作原理是在两片平行的玻璃基板中放置液晶分子， 通过给玻 璃基板的电路通电来控制液晶分子改变方向， 将背光模组的光线折射出来 产生画面。 由于液晶面板本身不发光， 需要借由背光模组提供的光源来正 常显示影像， 因此， 背光模组成为液晶显示装置的关键组件之一。 背光模 组依照光源入射位置的不同分成侧入式背光模组与直下式背光模组两种。 直下式背光模组是将发光光源例如 CCFL(Cold Cathode Fluorescent Lamp, 阴极萤光灯管)或 LED(Light Emitting Diode发光二极管)设置在液晶面板后 方， 直接形成面光源提供给液晶面板。 而侧入式背光模组是将发光光源例 如 LED 灯条（lightbar )设于液晶面板侧后方的背板边缘， 发光光源发出 的光线从光学膜片组一侧的入光面进入光学膜片组， 经反射和扩散后从光 学膜片组出光面出射， 以形成面光源提供给液晶面板。
现有的侧入式 LED 背光模组的散热设计中， LED 灯条一般通过螺钉 锁附或导热胶贴附等方式安装于热沉上， 该热沉再安装于背板上， 热量由 灯条传导至热沉进行散热。 如图 1 所示， 为现有的 LED灯条热沉的结构 示意图， 热沉 100包括底板 102及侧板 104, 该底板 102与侧板 104—般 由铝挤材料一体成型制成， LED灯条 300安装于侧板 104上， LED灯条 300散发的热量由侧板 104传导至底板 102, 再在底板 102上进行大面积 散热， 为达到较好的散热效果， 通常设计较大表面积的底板 102 , —般通 过增加底板 102的幅宽 a来增加底板 102的表面积。 但由于铝挤工艺的限 制， 厚度太薄将造成铝挤型材平整度不好， 当增加幅宽 a时， 底板 102的 厚度设计需要相应增加， 否则制程无法挤出平整度较好的型材。 但增加底 板 102的厚度则会使用较多的铝挤材料， 同时增加幅宽 a需要使用更大吨 位的铝挤挤型机台， 进而增加了成本， 尤其是在高功率灯条散热设计中， 成本的增加更加明显。 发明内容
本发明的目的在于提供一种热沉， 其采用拼接方式制成， 散热效果 好， 利于成本控制。
本发明的另一目的在于提供一种背光模组， 其散热效果好， 背光品质 高。
为实现上述目的， 本发明提供一种热沉， 包括： 第一底板、 设于第一 底板上的第一侧板、 及安装于第一底板上的第二底板， 所述第一底板与第 一侧板一体成型制成， 所述第二底板通过螺丝锁附的方式安装于第一底板 上远离第一侧板的一端， 所述第一底板由铝挤材料制成， 所述第二底板由 铝钣金材料制成。
所述第一底板采用的铝挤材料为 A16063 , 所述第二底板采用的铝钣金 材料为 A15052。 所述第一底板的外表面涂布辐射散热材料， 所述辐射散热 材料为散热漆。
还包括设于第一底板与第二底板之间的导热层。
所述导热层由导热膏材料或导热胶制成。
本发明还提供一种热沉， 包括： 第一底板、 设于第一底板上的第一侧 板、 及安装于第一底板上的第二底板， 所述第一底板与第一侧板一体成型 制成， 所述第二底板通过螺丝锁附的方式安装于第一底板上远离第一侧板 的一端， 所述第一底板由铝挤材料制成， 所述第二底板由铝钣金材料制 成；
其中， 所述第一底板采用的铝挤材料为 A16063 , 所述第二底板采用的 铝钣金材料为 A15052;
其中， 所述第一底板的外表面涂布辐射散热材料， 所述辐射散热材料 为散热漆；
还包括设于第一底板与第二底板之间的导热层；
其中， 所述导热层由导热膏材料或导热胶制成。
本发明还提供一种背光模组， 包括： 背板、 设于背板内的热沉、 设于 背板内的导光板、 及安装于热沉上的 LED 灯条， 所述热沉包括： 第一底 板、 设于第一底板上的第一侧板、 及安装于第一底板上的第二底板， 所述 第一底板与第一侧板一体成型制成， 所述第二底板通过螺丝锁附的方式安 装于第一底板上远离第一侧板的一端， 所述第一底板由铝挤材料制成， 所 述第二底板由铝钣金材料制成。 所述第一底板采用的铝挤材料为 A16063 , 所述第二底板采用的铝钣金 材料为 A15052, 所述第一底板的外表面涂布辐射散热材料， 所述辐射散热 材料为散热漆。
所述 LED 灯条通过螺丝锁附或导热胶粘附的方式固定安装于热沉的 第一侧板上。
所述背板包括第三底板及垂直连接于第三底板的第二侧板， 所述第 一、 第二底板安装于所述第三底板上， 所述第一侧板安装于所述第二侧板 上。
所述热沉还包括设于第一底板与第二底板之间的导热层， 该导热层由 导热膏材料或导热胶制成。
本发明的有益效果： 本发明热沉及用该热沉的背光模组， 热沉的底板 采用拼接的方式制成， 部分底板采用较薄厚度的铝钣金材料制成， 使用了 较少的铝材， 利于成本控制， 背光模组的散热效果好， 保证了背光的质 量。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为现有的连接 LED灯条的热沉的结构示意图；
图 2为本发明热沉的一实施例的结构示意图；
图 3为本图 2的立体结构示意图；
图 4为本发明热沉的另一实施例的结构示意图；
图 5为本发明背光模组一实施例的结构示意图；
图 6为本发明背光模组另一实施例的结构示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 2及 3 , 本发明提供一种热沉 2 , 包括： 第一底板 22、 设于 第一底板 22上的第一侧板 24、 及安装于第一底板 22上的第二底板 26。 所述第一底板 22与第一侧板 24 —体成型制成， 所述第二底板 26通过螺 丝 202锁附的方式安装于第一底板 22上远离第一侧板 24的一端。 所述第 一底板 22 由铝挤材料制成， 所述第二底板 26 由铝钣金材料制成。 优选 的， 所述第一底板 22采用的铝挤材料为 A16063 , 所述第二底板 26采用的 铝钣金材料为 A15052。 所述第一底板 22 的外表面涂布辐射散热材料， 在 本实施例中， 所述辐射散热材料为散热漆， 以获得较好的散热效果。 所述 第二底板 26 厚度较小， 与现有技术中一体成型的底板相比， 节省了材 料， 进而节省了成本， 尤其在高功率需求使用时， 成本优势更为明显。
请参阅图 4 , 为本发明热沉的另一实施例的结构示意图， 本实施例 中， 所述热沉 2，还包括设于第一底板 22与第二底板 26之间的导热层 28。 该导热层 28由导热膏材料或导热胶制成， 该导热层 28可有效的减小第一 底板 22与第二底板 26之间的接触热阻， 进而提高热传导效率， 使热沉 2， 具有更好的散热效果。
请参阅图 5 , 同时参阅图 2及图 3 , 本发明还提供一种背光模组， 包 括： 背板 4、 设于背板 4内的热沉 2、 设于背板 4内的导光板 6、 及安装于 热沉 2上的 LED灯条 8。
所述热沉 2包括： 第一底板 22、 设于第一底板 22上的第一侧板 24、 及安装于第一底板 22上的第二底板 26。 所述第一底板 22与第一侧板 24 一体成型制成， 所述第二底板 26通过螺丝 202锁附的方式安装于第一底 板 22上远离第一侧板 24的一端。 所述第一底板 22 由铝挤材料制成， 所 述第二底板 26由铝钣金材料制成。 优选的， 所述第一底板 22采用的铝挤 材料为 A16063 , 所述第二底板 26采用的铝钣金材料为 A15052。 所述第一 底板 22 的外表面涂布辐射散热材料， 在本实施例中， 所述辐射散热材料 为散热漆， 以获得较好的散热效果。
所述 LED灯条 8通过螺丝锁附或导热胶粘附的方式固定安装于热沉 2 的第一侧板 24上。 所述 LED灯条 8散发的热量经第一侧板 24传至第一 底板 22, 再传至第二底板 26, 热量由热沉 2 向外部散发， 具有较好的散 热效果。 此外， 由于采用厚度较薄的铝钣金材料制作第二底板 26 , 用材 少， 有效的降低了材料成本。
所述背板 4 包括第三底板 42及垂直连接于第三底板 42 的第二侧板
44, 所述第一、 第二底板 22、 26安装于所述第三底板 42上， 所述第一侧 板 24安装于所述第二侧板 44上。
请参阅图 6, 为本发明背光模组的另一实施例的结构示意图， 同时参 阅图 4, 在本实施例中， 所述热沉 2，还包括设于第一底板 22 与第二底板 26之间的导热层 28。 该导热层 28由导热膏材料或导热胶制成， 该导热层 28可有效的减小第一底板 22与第二底板 26之间的接触热阻， 进而提高热 传导效率， 使热沉 2，具有更好的散热效果， 进而保证背光质量。
综上所述， 本发明热沉及用该热沉的背光模组， 热沉的底板采用拼接 的方式制成， 部分底板釆用较薄厚度的铝钣金材料制成， 使用了较少的铝 材， 利于成本控制， 背光模组的散热效果好， 保证了背光的质量。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种热沉， 包括： 第一底板、 设于第一底板上的第一侧板、 及安 装于第一底板上的第二底板， 所述第一底板与第一侧板一体成型制成， 所 述第二底板通过螺丝锁附的方式安装于第一底板上远离第一侧板的一端， 所述第一底板由铝挤材料制成， 所述第二底板由铝钣金材料制成。
2、 如权利要求 1 所述的热沉， 其中， 所述第一底板采用的铝挤材料 为 A16063 , 所述第二底板采用的铝钣金材料为 A15052。
3、 如权利要求 1 所述的热沉， 其中， 所述第一底板的外表面涂布辐 射散热材料， 所述辐射散热材料为散热漆。
4、 如权利要求 1 所述的热沉， 还包括设于第一底板与第二底板之间 的导热层。
5、 如权利要求 4 所述的热沉， 其中， 所述导热层由导热膏材料或导 热胶制成。
6、 一种热沉， 包括： 第一底板、 设于第一底板上的第一侧板、 及安 装于第一底板上的第二底板， 所述第一底板与第一侧板一体成型制成， 所 述第二底板通过螺丝锁附的方式安装于第一底板上远离第一侧板的一端， 所述第一底板由铝挤材料制成， 所述第二底板由铝钣金材料制成；
其中， 所述第一底板采用的铝挤材料为 A16063 , 所述第二底板采用的 铝钣金材料为 A15052;
其中， 所述第一底板的外表面涂布辐射散热材料， 所述辐射散热材料 为散热漆；
还包括设于第一底板与第二底板之间的导热层；
其中， 所述导热层由导热膏材料或导热胶制成。
7、 一种背光模组， 包括： 背板、 设于背板内的热沉、 设于背板内的 导光板、 及安装于热沉上的 LED 灯条， 所述热沉包括： 第一底板、 设于 第一底板上的第一侧板、 及安装于第一底板上的第二底板， 所述第一底板 与第一侧板一体成型制成， 所述第二底板通过螺丝锁附的方式安装于第一 底板上远离第一侧板的一端， 所述第一底板由铝挤材料制成， 所述第二底 板由铝钣金材料制成。
8、 如权利要求 7 所述的背光模组， 其中， 所述第一底板采用的铝挤 材料为 A16063 , 所述第二底板采用的铝钣金材料为 A15052 , 所述第一底 板的外表面涂布辐射散热材料， 所述辐射散热材料为散热漆。
9、 如权利要求 7所述的背光模组， 其中， 所述 LED灯条通过螺丝锁 附或导热胶粘附的方式固定安装于热沉的第一侧板上。
10、 如权利要求 7所述的背光模组， 其中， 所述背板包括第三底板及 垂直连接于第三底板的第二侧板， 所述第一、 第二底板安装于所述第三底 板上， 所述第一侧板安装于所述第二侧板上。
11、 如权利要求 7 所述的背光模组， 其中， 所述热沉还包括设于第一 底板与第二底板之间的导热层， 该导热层由导热膏材料或导热胶制成。
PCT/CN2012/085383 2012-11-21 2012-11-28 热沉及用该热沉的背光模组 Ceased WO2014079081A1 (zh)

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CN102661550A (zh) * 2012-05-09 2012-09-12 深圳市华星光电技术有限公司 背光模组

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