WO2014072834A3 - Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample - Google Patents

Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample Download PDF

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Publication number
WO2014072834A3
WO2014072834A3 PCT/IB2013/003107 IB2013003107W WO2014072834A3 WO 2014072834 A3 WO2014072834 A3 WO 2014072834A3 IB 2013003107 W IB2013003107 W IB 2013003107W WO 2014072834 A3 WO2014072834 A3 WO 2014072834A3
Authority
WO
WIPO (PCT)
Prior art keywords
cross
section
sample
integrated circuit
polishing
Prior art date
Application number
PCT/IB2013/003107
Other languages
French (fr)
Other versions
WO2014072834A2 (en
Inventor
Qing Zhang
Xiaoming Wu
Original Assignee
Funai Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Funai Electric Co., Ltd. filed Critical Funai Electric Co., Ltd.
Publication of WO2014072834A2 publication Critical patent/WO2014072834A2/en
Publication of WO2014072834A3 publication Critical patent/WO2014072834A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/36—Embedding or analogous mounting of samples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H01J2237/31745—Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers

Abstract

A method for preparing an integrated circuit or iincro-electo-mechanical system chip sample for ion cross-section polishing is provided. The method includes preparing a polymer coating formulation. The polymer coating formulation includes a novolac epoxy resin, a bisphenol-A/epichlorhydrin epoxy resin, a photoacid generator, an adhesion promoter, and a mixture of acetophenone, cyclohexanone and butyrolactone organic solvents. The integrated circuit or micro-electro -mechanical system chip sample is encapsulated by the polymer coating formulation, wherein the chip sample is then ready for ion beam cross-section polishing. A cross-section sample of integrated circuit or micro-electro-mechanicai system chip is prepared by polishing the obtained polymer encapsulated integrated circuit or micro-electro-mechanical system chip with ion beam cross-section polisher. The disclosed method allows the cross-section sample to be obtained at a reduced polishing time. Moreover, a good quality and larger cross-sectional area of the sample is obtained, thus allowing for accurate inspection or analysis of the integrated circuit or micro-electro-mechanical system chip.
PCT/IB2013/003107 2012-11-01 2013-11-01 Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample WO2014072834A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/666,062 2012-11-01
US13/666,062 US8678555B1 (en) 2012-11-01 2012-11-01 Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample

Publications (2)

Publication Number Publication Date
WO2014072834A2 WO2014072834A2 (en) 2014-05-15
WO2014072834A3 true WO2014072834A3 (en) 2014-07-24

Family

ID=50280433

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2013/003107 WO2014072834A2 (en) 2012-11-01 2013-11-01 Encapsulation of inkjet heater chip for ion beam cross-section polishing and method of preparing chip cross-section sample

Country Status (2)

Country Link
US (1) US8678555B1 (en)
WO (1) WO2014072834A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111474200B (en) * 2020-04-16 2023-09-26 宸鸿科技(厦门)有限公司 Method for preparing microstructure sample of electronic element
CN113607511B (en) * 2021-06-23 2023-12-08 北京芯可鉴科技有限公司 Method for preparing power chip sample to be analyzed and power chip sample to be analyzed

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207615A (en) * 1962-04-19 1965-09-21 Pure Oil Co Process for preparing specimens for microphotographic examination
US4204181A (en) * 1976-04-27 1980-05-20 Westinghouse Electric Corp. Electrical coil, insulated by cured resinous insulation
US4296018A (en) * 1979-05-17 1981-10-20 Westinghouse Electric Corp. Catechol or pyrogallol containing flexible insulating tape having low gel time
US6723650B1 (en) * 2003-04-03 2004-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. TEM sample preparation using transparent defect protective coating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1461387B1 (en) 2001-12-05 2012-02-08 Isola Laminate Systems, Corp. Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
US6890062B2 (en) * 2002-05-14 2005-05-10 Lexmark International, Inc. Heater chip configuration for an inkjet printhead and printer
US6834937B2 (en) 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
US7571979B2 (en) 2005-09-30 2009-08-11 Lexmark International, Inc. Thick film layers and methods relating thereto
US20070236542A1 (en) 2006-03-29 2007-10-11 Graham David C Adhesive Compositions, Micro-Fluid Ejection Devices, and Methods for Attaching Micro-Fluid Ejection Heads
US7766455B2 (en) 2006-03-29 2010-08-03 Lexmark International, Inc. Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3207615A (en) * 1962-04-19 1965-09-21 Pure Oil Co Process for preparing specimens for microphotographic examination
US4204181A (en) * 1976-04-27 1980-05-20 Westinghouse Electric Corp. Electrical coil, insulated by cured resinous insulation
US4296018A (en) * 1979-05-17 1981-10-20 Westinghouse Electric Corp. Catechol or pyrogallol containing flexible insulating tape having low gel time
US6723650B1 (en) * 2003-04-03 2004-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. TEM sample preparation using transparent defect protective coating

Also Published As

Publication number Publication date
US8678555B1 (en) 2014-03-25
WO2014072834A2 (en) 2014-05-15

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