WO2014071721A1 - 滤波器、接收器、发送器和收发器 - Google Patents

滤波器、接收器、发送器和收发器 Download PDF

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Publication number
WO2014071721A1
WO2014071721A1 PCT/CN2013/074250 CN2013074250W WO2014071721A1 WO 2014071721 A1 WO2014071721 A1 WO 2014071721A1 CN 2013074250 W CN2013074250 W CN 2013074250W WO 2014071721 A1 WO2014071721 A1 WO 2014071721A1
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WO
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Prior art keywords
filter
microstrip
resonator
signal
assembly
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PCT/CN2013/074250
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English (en)
French (fr)
Inventor
周彦昭
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华为技术有限公司
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP13742143.4A priority Critical patent/EP2744037A1/en
Priority to US14/035,344 priority patent/US9042847B2/en
Publication of WO2014071721A1 publication Critical patent/WO2014071721A1/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/205Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/207Hollow waveguide filters
    • H01P1/208Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2084Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/203Strip line filters
    • H01P1/20309Strip line filters with dielectric resonator

Definitions

  • the present invention relates to the field of communications and, more particularly, to a filter, receiver, transmitter and transceiver. Background technique
  • the duplexer of the base transceiver station module is composed of a radio frequency ("RF") cavity filter, which is generally located on the back structural member of the transceiver board, and is used for single-channel high-power signal transmission. Includes transmit channel filter and receive channel filter.
  • RF radio frequency
  • metal cavity filters for metal cavity filters, metal cavities have better high-power characteristics and insertion loss, but they are huge in size and pose great challenges to the competitiveness of next-generation products.
  • non-metal cavity filters although they are smaller in size, but the power is lower.
  • the integrated dielectric filter has a power of only 10 ⁇ 50W, and the sound meter filter is below 1W.
  • the suspended microstrip filter has appeared. Since the power capacity of the microstrip filter is limited by the temperature resistance of the sheet, the width and thickness of the copper sheet, etc., it can only reach about 80W at present, and it is difficult to reach the average power of the cavity. Above 100W requirements.
  • Embodiments of the present invention provide a filter, a receiver, a transmitter, and a transceiver that are not only small in size but also capable of high power transmission.
  • a filter comprising a resonator assembly 100, a microstrip filter assembly 200, and connectors 401, 402, wherein the resonator assembly 100 includes at least two resonant cavities 101 connected in parallel, each A resonator 102 and a tuning screw 103 are disposed on a resonant cavity 101.
  • the microstrip filter assembly 200 includes a dielectric substrate 202 and a microstrip line 201 on the dielectric substrate 202.
  • the connector 401 connects the microstrip line 201.
  • One end of the microstrip line 201 is mated with the resonator 102 on the other resonant cavity 102, and the connector 402 is mated with the resonator 102 on the other resonant cavity.
  • the impedance is less than the microstrip filter assembly 200 Impedance.
  • the connector in conjunction with the first aspect, in a first possible implementation of the first aspect, the connector
  • 401 and 402 are connectors having a step impedance conversion structure.
  • the cavity assembly includes two resonant cavities 101, and the microstrip line 201 included in the microstrip filter assembly is a 7th order microstrip line.
  • the input end of the filter The 301 and the output end 302 are respectively connected to both ends of the microstrip filter 201.
  • the resonator 101 is a metal resonator and/or a dielectric resonator.
  • the microstrip filter component In a fifth possible implementation manner of the first aspect, the microstrip filter component
  • the 200 also includes a shield cover on the microstrip line 201.
  • the microstrip line 201 comprises a microstrip interdigital filtering circuit and/or a microstrip parallel coupling line Filter circuit.
  • the microstrip line 201 includes a suspension At least one of a microstrip line, an inverted microstrip, and a coplanar waveguide microstrip line.
  • a receiver comprising a signal receiving device 510 for receiving a signal, and a filter 520 for processing the signal receiving device 510 to receive signal of.
  • a transmitter including a signal transmitting device 610 and as in the first aspect and
  • the filter 620 is described in various implementations in the first aspect, the filter 620 is for processing signals, and the signal transmitting device 610 is configured to transmit signals that have been processed by the filter 620.
  • a transceiver comprising a signal receiving device 710, a filter 720 and a signal transmitting device 730 as described in the first aspect and various implementations of the first aspect, the signal receiving device 710
  • the filter 720 is configured to process a signal received by the signal receiving device 710
  • the signal transmitting device 730 is configured to process a signal processed by the filter 720.
  • the filter may include a resonator assembly 100, a microstrip filter assembly 200, and connectors 401, 402, wherein the resonator assembly 100 includes at least two resonant cavities 101 connected in parallel, Each resonator 101 is provided with a resonator 102 and a tuning screw 103.
  • the microstrip filter assembly 200 includes a dielectric substrate 202 and a microstrip line 201 on the dielectric substrate 202.
  • the connector 401 connects the microstrip line.
  • One end of 201 is mated with a resonator 102 on a resonant cavity 101, and the connector 402 mates the other end of the microstrip line 201 with a resonator 102 on another resonant cavity 101, the resonant cavity assembly
  • the impedance of 100 is less than the impedance 200 of the microstrip filter assembly. Due to the impedance d of the cavity assembly 100, the impedance of the filter assembly 200, the power capacity of the resonator is high, and the high-power electromagnetic wave preferentially selects the low-resistance cavity.
  • the power signal is combined by the resonant cavity and the microstrip line to ensure that the high-power signal does not break down, and at the same time, the RF insertion loss and suppression degree of the filter are taken into consideration.
  • the miniaturization of the total volume is achieved, and the power capacity of the filter is guaranteed.
  • FIG. 1 is a schematic structural diagram of a filter according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a filter according to another embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a connection matching structure of a resonant cavity assembly and a microstrip filter assembly of a filter in accordance with an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a microstrip filter assembly in accordance with an embodiment of the present invention.
  • FIG. 5 is a diagram of a suspension microstrip filter assembly and an inverted microstrip filter assembly in accordance with an embodiment of the present invention. Magnetic field model diagram.
  • FIG. 6 is a schematic structural diagram of a receiver according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a transmitter according to an embodiment of the invention.
  • FIG. 8 is a schematic structural diagram of a transceiver according to an embodiment of the present invention. detailed description
  • the filter may include: a resonator assembly 100, a microstrip filter assembly 200, and connectors 401, 402, wherein the resonator assembly 100 includes at least two resonant cavities 101 connected in parallel, each The resonator 101 is provided with a resonator 102 and a tuning screw 103.
  • the microstrip filter assembly 200 includes a dielectric substrate 202 and a microstrip line 201 on the dielectric substrate 202.
  • the connector 401 connects the microstrip line 201.
  • One end is mated with a resonator 102 on a resonant cavity 101, and the connector 402 mates the other end of the microstrip line 201 with a resonator 102 on another resonant cavity 101.
  • the resonant cavity assembly 100 The impedance is less than the impedance 200 of the microstrip filter assembly.
  • the number of resonant cavities included in the resonant cavity assembly 100 illustrated in FIG. 1 and the microstrip filtering assembly 200 includes the order of the microstrip lines, which is merely illustrative and should not be construed as limiting the invention.
  • the channel with low impedance is generally selected. Like the water flow, the forward resistance in which direction is small, and the water flow is easier to flow. Therefore, since the impedance of the resonator assembly 100 is smaller than the impedance of the microstrip filter assembly 200, the resonance The power capacity of the cavity is high, and the high-power electromagnetic wave preferentially selects the low-resistance cavity.
  • the power signal is combined by the resonant cavity and the microstrip line to ensure that the high-power signal does not break down, and at the same time, the filter is considered. Indicators such as RF insertion loss and suppression achieve miniaturization of the total volume and ensure the power capacity of the filter.
  • the impedance values and impedance differences for the cavity assembly 100 and the filter assembly 200 can be flexibly designed according to specific product requirements.
  • the impedance of the cavity assembly 100 can be designed to be 33-77 ohms.
  • the impedance of the cavity assembly 100 can be designed according to 33 ohms.
  • the filter RF index requires low insertion loss
  • the cavity assembly 100 can be designed with an impedance of 77 ohms of the cavity assembly; when the insertion loss and power specifications for the filter are compromised
  • the design of the cavity assembly 100 can be performed with an impedance of about 50 ohms.
  • the impedance of the microstrip filter assembly 200 can also be flexibly designed according to the product, as long as the impedance of the cavity assembly 100 is greater than the impedance of the microstrip filter assembly 200, that is, the shunt of the power signal can be realized, for example, the filter assembly 200 is
  • the impedance is designed to be 1.5 to 2 times the resonant cavity assembly 100.
  • the input end 301 and the output end 302 of the filter are respectively connected to two ends of the microstrip line.
  • the input end 301 and the output end 302 of the filter of the embodiment of the present invention may also be respectively connected to the resonator 102 at both ends of the resonant cavity assembly 100; or the input end 301 is connected to the resonator 102 at one end of the resonant cavity assembly 100, and the output is output.
  • the end 302 is connected to an end of the microstrip line 201 opposite to the input end 301; or the input end 301 is connected to one end of the microstrip line 201, and the output end 302 is opposite to the end of the resonant cavity assembly 100 opposite the input end 301.
  • the resonator 102 is connected.
  • the impedance of the component refers to the branch node composite impedance of the component.
  • the impedance of the cavity assembly 100 is the composite impedance of the cavity assembly 100, the connector 401, and the connector 402.
  • the impedance of the microstrip filter assembly 100 is the microstrip filter assembly 100, the connector 401, and the connector 402.
  • the impedance of the cavity assembly 100 It refers to the composite impedance of the cavity assembly 100 and the connector 402.
  • the impedance of the microstrip filter component refers to the composite impedance of the microstrip assembly 200 and the connector 401; if the input end 301 of the filter is connected to one end of the microstrip line 201, the output end 302 is coupled to the resonator 102 of the resonant cavity assembly 100 opposite the input end 301.
  • the impedance of the resonant cavity assembly 100 refers to the composite impedance of the resonant cavity assembly 100 and the connector 401.
  • the impedance of the microstrip filter assembly 200 is Refers to the composite impedance of the microstrip filter assembly 200 and the connector 402.
  • the input end 301 and the output end 302 can also be connected to the middle of the connecting member 401 and the connecting member 402. For example, as shown in FIG. 2, the input end 301 is connected with the middle point b of the connecting member 401, and the output end 302 is connected.
  • the intermediate point e of the member 402 is connected, and the impedance of the cavity assembly 100 refers to the composite impedance of the cavity assembly 100, the ab segment of the connector 401, and the ed segment of the connector 402.
  • the impedance of the microstrip filter assembly 200 refers to micro The composite impedance of the filter assembly 200, the be segment of the connector 401, and the ef segment of the connector 402. It should be understood that in the embodiment described above, the ⁇ input 301 is adjacent to the connector 401 and the output 302 is adjacent to the connector 402.
  • the connector 401 may have a step impedance transformation.
  • the connector 401 can be used to match the tap line 104 of the cavity assembly 100 with the microstrip filter assembly 200.
  • the connector 402 can also be used for cleaning purposes, not shown.
  • resonator 102 may be a metal resonator and/or a dielectric resonator.
  • the metal resonator is a so-called coaxial resonator, and its Q value is general.
  • the Q value of the dielectric resonator is high, but the cost is high. Therefore, a dielectric resonator can be used for a scene with high filter insertion loss.
  • a metal resonator can be used.
  • the metal resonator can be used in combination with a dielectric resonator.
  • a resonator assembly including three resonators one metal resonator and two dielectric resonators can be used, or two metal resonators can be used. And a dielectric resonator.
  • the microstrip filter component 200 can adopt a microstrip interdigital filter circuit, or a microstrip parallel coupled line filter circuit, or a microstrip interdigital filter circuit and a microstrip parallel coupled line filter.
  • the circuit for example, the microstrip filter assembly 200 shown in FIG. 4 simultaneously employs a microstrip interdigital filter circuit and a microstrip parallel coupled line filter circuit.
  • the microstrip interdigital filtering circuit is used, or the microstrip parallel coupling line filtering circuit is used, or both of them are used at the same time, and can be designed according to product requirements, which is not limited by the embodiment of the present invention.
  • the microstrip line 201 of the microstrip filter assembly 200 may include at least one of a suspended microstrip line, an inverted microstrip line, and a coplanar waveguide strip line.
  • the suspended microstrip line and the inverted microstrip line have a high Q value (500 ⁇ 1500), and the two transmission media can achieve a wide range of impedance values.
  • a and b are electromagnetic field model diagrams of the inverted microstrip filter circuit and the suspended microstrip filter circuit, respectively.
  • the resonator assembly 100 when the filter total insertion loss requirement is 1.20 db and the out-of-band rejection is 90 db or more, the resonator assembly 100 includes two resonators, and the microstrip filter assembly 200 includes a 7-order microstrip line. .
  • the radio frequency index and the insertion loss index are superior.
  • the number of the cavity of the resonant cavity 101 included in the required resonant cavity component 100 may be simulated according to the type of the signal to be transmitted (eg, power, etc.), the RF index of the filter, and the insertion loss index requirement.
  • the microstrip filter assembly 200 includes the order of the microstrip line 201, the impedance of the two, and the like.
  • the number of cavities of the resonant cavity 101 included in the cavity assembly 100 is obtained by simulation, and the microstrip line included in the microstrip filter assembly 200 After the parameters of 201, the impedance of the two, etc., the filter can be specifically processed, and the cavity 101 included in the cavity assembly 100 can be machined and turned.
  • the microstrip line 201 included in the microstrip filter assembly 200 can be processed by using a low-loss PCB board, and the processed microstrip filter assembly 200 and the metal cavity are soldered through the tapped wire, and the shield is mounted over the microstrip line.
  • the board, after the screw and the connector are installed, constitutes the filter of the embodiment of the invention, wherein the addition of the shielding cover plate above the microstrip line 201 can stop the electromagnetic leakage and cause the noise floor of the filter to be improved and the suppression index to decrease. problem.
  • the filter may include a resonator assembly 100, a microstrip filter assembly 200, and connectors 401, 402, wherein the resonator assembly 100 includes at least two resonant cavities 101 connected in parallel. Each resonator 101 is provided with a resonator 102 and a tuning screw 103.
  • the microstrip filter assembly 200 includes a dielectric substrate 202 and a microstrip line 201 on the dielectric substrate 202.
  • the connector 401 connects the microstrip One end of the line 201 is mated with the resonator 102 on a resonant cavity 101, and the connecting member 402 mates the other end of the microstrip line 201 with the resonator 102 on the other resonant cavity 101, the resonant cavity
  • the impedance of the component 100 is less than the impedance 200 of the filter assembly. Since the impedance of the cavity assembly 100 is less than the impedance of the filter assembly 200, the power capacity of the resonator is high, and the high-power electromagnetic wave preferentially selects a low-resistance cavity, the power signal.
  • the high-power signal is not broken down, and the RF insertion loss and suppression degree of the filter are taken into consideration.
  • the standard achieves a miniaturization of the total volume and guarantees the power capacity of the filter.
  • an embodiment of the present invention further provides a receiver, including a signal receiving device 510 and a filter 520 according to an embodiment of the present invention, where the signal receiving device is configured to receive a signal.
  • the filter 520 is configured to process signals received by the signal receiving device 510.
  • the filter according to the embodiment of the present invention can ensure that the high-power signal does not break down, and at the same time, the RF insertion loss and the suppression degree of the filter are taken into consideration, the total volume is miniaturized, and the guarantee is ensured.
  • the power capacity of the filter is such that the total volume of the receiver including the filter can be miniaturized at the same time, and the power capacity of the receiver can be guaranteed.
  • an embodiment of the present invention further provides a transmitter, including a signal sending device 610 and a filter 620 according to an embodiment of the present invention, where the filter 620 is configured to process a signal.
  • the signal transmitting device 610 is configured to transmit a signal that has been processed by the filter 620.
  • an embodiment of the present invention further provides a transceiver, including a signal receiving device 710, a filter 720 and a signal transmitting device 730 according to an embodiment of the present invention, as described above, the signal receiving device 710.
  • the filter 720 is for processing signals received by the signal receiving device 710
  • the signal transmitting device 730 is for processing signals processed by the filter 720.
  • the filter according to the embodiment of the present invention can ensure that the high-power signal does not break down, and at the same time, the RF insertion loss and the suppression degree of the filter are taken into consideration, the total volume is miniaturized, and the guarantee is ensured.
  • the power capacity of the filter is such that the total volume of the transceiver including the filter can be miniaturized at the same time, and the power capacity of the transceiver can be guaranteed.
  • Figures 6, 7, and 8 show only some of the components of the receiver, transmitter, and transceiver, respectively, but the receiver, transmitter, and transceiver may also include other components, for example, for the transceiver. It may also include an amplifier, a buffer, etc., and may be specifically referred to the prior art. For the sake of cleaning, the details are not described herein, but the present invention is not limited thereto. Various equivalent modifications and alterations to the embodiments of the present invention can be made by those skilled in the art without departing from the spirit and scope of the invention.

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Abstract

本发明实施例提供了一种滤波器、接收器、发送器和收发器。该滤波器包括谐振腔组件、微带滤波组件和两个连接件,其中,所述谐振腔组件包括并联在一起的至少二个谐振腔,每一谐振腔上设置有谐振器和调谐螺钉,所述微带滤波组件包括介质基板和位于介质基板上面的微带线,其中一个连接件将所述微带线的一端和一谐振腔上的谐振器匹配连接,其中另一连接件将所述微带线的另一端与另一谐振腔上的谐振器匹配连接,所述谐振腔组件的阻抗小于所述微带滤波组件的阻抗。本发明实施例的滤波器、接收器、发送器和收发器不仅能实现总体积小型化,还能保证功率容量指标。

Description

滤波器、 接收器、 发送器和收发器 技术领域
本发明涉及通信领域, 并且更具体地, 涉及一种滤波器、 接收器、 发送 器和收发器。 背景技术
基站收发信机模块的双工器由射频( Radio Frequency , 筒称 "RF" )腔 体滤波器构成, 一般位于收发信机单板的背面结构件上, 用于单路大功率的 信号传输, 包括发射通道滤波器和接收通道滤波器。
随着移动通信多载波和多制式的发展, 射频模块小型化的需求趋于强 烈, 现有金属腔滤波器(通常所说的同轴腔滤波器)和非金属腔滤波器。 对 于金属腔滤波器而言, 金属腔体具有较好的大功率特性和插损, 但是体积巨 大, 对下一代产品的竟争力带来巨大挑战。 而非金属腔滤波器种类多, 虽然 体积较小,但是功率则较低,例如,一体化介质滤波器,其功率只有 10~50W, 声表滤波器则在 1W以下。 近年来出现了悬置微带滤波器, 由于微带滤波器 的功率容量受制于板材耐温, 铜皮的宽度和厚度等因素制约, 目前也仅能达 到 80W左右, 难以达到腔体的平均功率 100W以上的要求。
因此, 现在急需一种滤波器, 要求其不仅实现总体积小型化, 还要保证 滤波器的功率容量指标。 发明内容
本发明实施例提供了一种滤波器、 接收器、 发送器和收发器, 不仅体积 较小, 而且可以实现大功率传输。
第一方面,提供了一种滤波器, 包括谐振腔组件 100、微带滤波组件 200 和连接件 401、 402, 其中, 所述谐振腔组件 100包括并联在一起的至少两个 谐振腔 101 , 每一谐振腔 101上设置有谐振器 102和调谐螺釘 103, 所述微 带滤波组件 200包括介质基板 202和位于介质基板 202上面的微带线 201 , 所述连接件 401将所述微带线 201的一端和一谐振腔 101上的谐振器 102匹 配连接,所述连接件 402将所述微带线 201的另一端与另一谐振腔上的谐振 器 102匹配连接, 所述谐振腔组件 100的阻抗小于所述微带滤波组件 200的 阻抗。
结合第一方面, 在第一方面的第一种可能的实现方式中, 所述连接件
401、 402是具有阶梯阻抗变换结构的连接件。
结合第一方面或第一方面的第一种可能的实现方式,在第一方面的第二 种可能的实现方式中, 在滤波器总插损要求为 1.20db, 带外抑制 90db以上 时, 所述谐振腔组件包括两个谐振腔 101 , 所述微带滤波组件包括的微带线 201为 7阶微带线。
结合第一方面, 第一方面的第一种可能的实现方式或第一方面的第二种 可能的实现方式, 在第一方面的第三种可能的实现方式中, 所述滤波器的输 入端 301和输出端 302分别连接所述微带滤线 201的两端。
结合第一方面, 第一方面的第一种可能的实现方式, 第一方面的第二种 可能的实现方式或第一方面的第三种可能的实现方式,在第一方面的第四种 可能的实现方式中, 所述谐振器 101为金属谐振器和 /或介质谐振器。
结合第一方面, 第一方面的第一种可能的实现方式, 第一方面的第二种 可能的实现方式, 第一方面的第三种可能的实现方式或第一方面的第四种可 能的实现方式, 在第一方面的第五种可能的实现方式中, 所述微带滤波组件
200还包括位于所述微带线 201上的屏蔽盖板。
结合第一方面, 第一方面的第一种可能的实现方式, 第一方面的第二种 可能的实现方式, 第一方面的第三种可能的实现方式, 第一方面的第四种可 能的实现方式或第一方面的第五种可能的实现方式,在第一方面的第六种可 能的实现方式中,所述微带线 201组成微带交指滤波电路和 /或微带平行耦合 线滤波电路。
结合第一方面, 第一方面的第一种可能的实现方式, 第一方面的第二种 可能的实现方式, 第一方面的第三种可能的实现方式, 第一方面的第四种可 能的实现方式, 第一方面的第五种可能的实现方式或第一方面的第六种可能 的实现方式, 在第一方面的第七种可能的实现方式中, 所述微带线 201包括 悬置式微带线、 倒置式微带和共面波导微带线中的至少一种。
第二方面, 提供了一种接收器, 包括信号接收装置 510和所述的滤波器 520, 所述信号接收装置 510用于接收信号, 所述滤波器 520用于处理所述 信号接收装置 510接收的信号。
第三方面, 提供了一种发送器, 包括信号发送装置 610和如第一方面和 第一方面中各种实现方式中所述的滤波器 620, 所述滤波器 620用于处理信 号, 所述信号发射装置 610用于发送已经所述滤波器 620处理过的信号。
第四方面, 提供了一种收发器, 包括信号接收装置 710、 如第一方面和 第一方面中各种实现方式中所述的滤波器 720和信号发射装置 730, 所述信 号接收装置 710用于接收信号, 所述滤波器 720用于处理所述信号接收装置 710接收的信号, 所述信号发射装置 730用于处理经所述滤波器 720处理过 的信号。
因此, 在本发明实施例中, 滤波器可以包括谐振腔组件 100、 微带滤波 组件 200和连接件 401、 402, 其中, 所述谐振腔组件 100包括并联在一起的 至少二个谐振腔 101 ,每一谐振腔 101上设置有谐振器 102和调谐螺釘 103, 所述微带滤波组件 200包括介质基板 202和位于介质基板 202上面的微带线 201 , 所述连接件 401将所述微带线 201的一端和一谐振腔 101上的谐振器 102匹配连接,所述连接件 402将所述微带线 201的另一端与另一谐振腔 101 上的谐振器 102匹配连接, 所述谐振腔组件 100的阻抗小于所述微带滤波组 件的阻抗 200 , 由于谐振腔组件 100的阻抗 d、于 ί带滤波组件 200的阻抗, 谐振腔的功率容量较高, 大功率电磁波优先选择低阻的谐振腔, 功率信号经 谐振腔和微带线分路后合路, 保证了大功率信号不会击穿, 同时又兼顾了滤 波器的射频插损和抑制度等指标, 实现了总体积小型化, 保证了滤波器的功 率容量指标。 附图说明
为了更清楚地说明本发明实施例的技术方案, 下面将对本发明实施例中 所需要使用的附图作筒单地介绍, 显而易见地, 下面所描述的附图仅仅是本 发明的一些实施例, 对于本领域普通技术人员来讲, 在不付出创造性劳动的 前提下, 还可以根据这些附图获得其他的附图。
图 1是根据本发明实施例的滤波器的示意性结构图。
图 2是根据本发明另一实施例的滤波器的示意性结构图。
图 3是根据本发明实施例的滤波器的谐振腔组件和微带滤波组件的连接 匹配结构示意性图。
图 4是根据本发明实施例的微带滤波组件的示意图。
图 5是根据本发明实施例的悬置微带滤波组件和倒置微带滤波组件的电 磁场模型图。
图 6是根据本发明实施例的接收器的示意性结构图。
图 7是根据发明实施例的发送器的示意性结构图。
图 8是根据本发明实施例的收发器的示意性结构图。 具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行 清楚、 完整地描述, 显然, 所描述的实施例是本发明的一部分实施例, 而不 是全部实施例。 基于本发明中的实施例, 本领域普通技术人员在没有做出创 造性劳动的前提下所获得的所有其他实施例, 都应属于本发明保护的范围。
图 1是根据本发明实施例的滤波器的示意性结构图。 如图 1所示, 该滤 波器可以包括: 谐振腔组件 100、 微带滤波组件 200和连接件 401、 402, 其 中, 所述谐振腔组件 100包括并联在一起的至少二个谐振腔 101 , 每一谐振 腔 101上设置有谐振器 102和调谐螺釘 103 , 所述微带滤波组件 200包括介 质基板 202和位于介质基板 202上面的微带线 201 , 所述连接件 401将所述 微带线 201的一端和一谐振腔 101上的谐振器 102匹配连接,所述连接件 402 将所述微带线 201的另一端与另一谐振腔 101上的谐振器 102匹配连接, 所 述谐振腔组件 100的阻抗小于所述微带滤波组件的阻抗 200。
应理解, 图 1所示的谐振腔组件 100包括的谐振腔的个数, 微带滤波组 件 200包括微带线的阶数,只是示例性的说明,不应对本发明构成任何限定。
对于射频信号来说, 一般选择走低阻抗的通道, 类似于水流一样, 哪个 方向的前进阻力小, 水流越容易流下去, 所以, 由于谐振腔组件 100的阻抗 小于微带滤波组件 200的阻抗, 谐振腔的功率容量较高, 大功率电磁波优先 选择低阻的谐振腔, 功率信号经谐振腔和微带线分路后合路, 保证了大功率 信号不会击穿, 同时又兼顾了滤波器的射频插损和抑制度等指标, 实现了总 体积小型化, 保证了滤波器的功率容量指标。
对于谐振腔组件 100和 带滤波组件 200的阻抗值以及阻抗差值可以根 据具体产品要求进行灵活设计。 例如, 谐振腔组件 100 的阻抗可以设计为 33-77欧姆, 当对滤波器要求较高的功率时, 谐振腔组件 100的阻抗可按照 33欧姆设计, 当滤波器射频指标要求低插损时, 可按谐振腔组件的阻抗 77 欧姆来设计该谐振腔组件 100; 当对于滤波器的插损和功率指标要求均折中 时, 可按照 50欧姆左右的阻抗进行谐振腔组件 100的设计。 微带滤波组件 200的阻抗也可以根据产品灵活设计, 只要满足谐振腔组件 100的阻抗大于 微带滤波组件 200的阻抗即可, 即可以实现大小功率信号的分流, 例如, 将 带滤波组件 200的阻抗设计为谐振腔组件 100的 1.5至 2倍。
在本发明实施例中, 如图 1所示, 该滤波器的输入端 301和输出端 302 分别连接微带线的两端。 当然, 本发明实施例的滤波器的输入端 301和输出 端 302也可以分别与谐振腔组件 100两端的谐振器 102连接;或者输入端 301 与谐振腔组件 100的一端的谐振器 102连接,输出端 302与微带线 201的与 所述输入端 301相对的一端连接;或者输入端 301与微带线 201的一端连接, 输出端 302与谐振腔组件 100的与所述输入端 301相对的一端的谐振器 102 连接。
应理解, 在本发明实施例中, 组件的阻抗是指组件的分支节复合阻抗。 例如, 如图 1所示, 谐振腔组件 100的阻抗为谐振腔组件 100、 连接件 401 以及连接件 402的复合阻抗。 当然, 如果滤波器的输入端 301和输出端 302 分别与谐振腔组件 100两端的谐振器 102连接, 则微带滤波组件 100的阻抗 即为微带滤波组件 100、 连接件 401以及连接件 402的复合阻抗; 如果滤波 器的输入端 301与谐振腔组件 100的一端的谐振器 102连接,输出端 302与 微带线 201的与所述输入端 301相对的一端连接, 则谐振腔组件 100的阻抗 是指谐振腔组件 100和连接件 402复合阻抗,微带滤波组件阻抗是指微带组 件 200和连接件 401的复合阻抗; 如果滤波器的输入端 301与微带线 201的 一端连接,输出端 302与谐振腔组件 100的与所述输入端 301相对的一端的 谐振器 102连接,则谐振腔组件 100的阻抗是指谐振腔组件 100和连接件 401 复合阻抗,微带滤波组件 200的阻抗是指微带滤波组件 200和连接件 402的 复合阻抗。 当然, 输入端 301和输出端 302也可以连接于连接件 401和连接 件 402的中间处, 例如, 如图 2所示, 输入端 301与连接件 401的中间 b点 连接, 输出端 302与连接件 402的中间点 e点连接, 则谐振腔组件 100的阻 抗是指谐振腔组件 100、 连接件 401中 ab段和连接件 402中 ed段的复合阻 抗,微带滤波组件 200的阻抗是指微带滤波组件 200、连接件 401中 be段和 连接件 402中 ef段的复合阻抗。应理解, 上述所述的实施例中, 殳输入端 301靠近于连接件 401 , 输出端 302靠近于连接件 402。
在本发明实施例中, 如图 3所示, 连接件 401可以为具有阶梯阻抗变换 结构的连接件,连接件 401可以将谐振腔组件 100的抽头线 104和微带滤波 组件 200进行匹配连接, 当然, 连接件 402也可以是如此, 只是为了筒洁, 未在图中示出。
在本发明实施例中,谐振器 102可以为金属谐振器和 /或介质谐振器。金 属谐振器即为通常所说的同轴谐振器, 其 Q值一般, 介质谐振器的 Q值较 高,但成本较高, 因此,对于滤波器插损要求高的场景可以采用介质谐振器, 而对于滤波器插损要求不高的场景可以采用金属谐振器。 当然, 金属谐振器 可以和介质谐振器混合使用, 例如, 对于包括了三个谐振腔的谐振腔组件而 言, 可以采用一个金属谐振器和两个介质谐振器, 或者可以采用两个金属谐 振器和一个介质谐振器。
在本发明实施例中, 微带滤波组件 200可以采用微带交指滤波器电路, 也可以采用微带平行耦合线滤波电路,也可以同时采用微带交指滤波电路和 微带平行耦合线滤波电路, 例如, 如图 4所示的微带滤波组件 200同时采用 了微带交指滤波电路和微带平行耦合线滤波电路。具体采用微带交指滤波电 路, 还是采用微带平行耦合线滤波电路, 或者两者同时采用, 可以根据产品 需求进行设计, 本发明实施例并不对此作任何限定。
在本发明实施例中,所述微带滤波组件 200的微带线 201可以包括悬置 式微带线、 倒置式微带线和共面波导带线中的至少一种。 悬置式微带线和倒 置式微带线具有较高的 Q值( 500 ~ 1500 ) , 并且这两种传输媒介可以实现很 宽范围的阻抗值。 如图 5所示, a和 b分别为倒置式微带滤波电路和悬置式 微带滤波电路的电磁场模型图。
在本发明实施例中, 在滤波器总插损要求为 1.20db, 带外抑制 90db以 上时, 所述谐振腔组件 100包括两个谐振器, 所述微带滤波组件 200包括 7 阶微带线。 在本发明实施例中, 由于谐振腔组件的两端分别和微带滤波组件 的两端连接, 因此具有较优的射频指标和插损指标。
在本发明实施例中, 可以根据需要传输的信号类型 (例如, 功率等), 滤波器的射频指标和插损指标要求进行仿真求解出需要的谐振腔组件 100包 括的谐振腔 101的腔数, 微带滤波组件 200包括的微带线 201的阶数, 两者 的阻抗等参数, 在通过仿真得出谐振腔组件 100包括的谐振腔 101的腔数, 微带滤波组件 200包括的微带线 201的阶数, 两者的阻抗等参数之后, 可以 具体加工该滤波器,谐振腔组件 100包括的谐振腔 101可以采用机加工车削 而成, 微带滤波组件 200包括的微带线 201可以采用低损耗的 PCB板加工 而成, 将加工好的微带滤波组件 200和金属腔通过抽头金属线焊接, 在微带 线上方安装屏蔽板, 在安装了螺釘和连接器之后, 就构成了本发明实施例的 滤波器,其中微带线 201上方增加屏蔽盖板可以放止电磁泄漏造成滤波器的 底噪提升和抑制度指标下降的问题。
因此, 本发明实施例的滤波器, 滤波器可以包括谐振腔组件 100、 微带 滤波组件 200和连接件 401、 402, 其中, 所述谐振腔组件 100包括并联在一 起的至少二个谐振腔 101 , 每一谐振腔 101上设置有谐振器 102和调谐螺釘 103 , 所述微带滤波组件 200包括介质基板 202和位于介质基板 202上面的 微带线 201 , 所述连接件 401将所述微带线 201的一端和一谐振腔 101上的 谐振器 102匹配连接, 所述连接件 402将所述微带线 201的另一端与另一谐 振腔 101上的谐振器 102匹配连接,所述谐振腔组件 100的阻抗小于所述 带滤波组件的阻抗 200, 由于谐振腔组件 100的阻抗小于 带滤波组件 200 的阻抗, 谐振腔的功率容量较高, 大功率电磁波优先选择低阻的谐振腔, 功 率信号经谐振腔和微带线分路后合路, 保证了大功率信号不会击穿, 同时又 兼顾了滤波器的射频插损和抑制度等指标, 实现了总体积小型化, 保证了滤 波器的功率容量指标。
如图 6所示,本发明实施例还提供了一种接收器,包括信号接收装置 510 和如上文所述的根据本发明实施例的滤波器 520, 所述信号接收装置用于接 收信号, 所述滤波器 520用于处理所述信号接收装置 510接收的信号。
如前文所述, 由于根据本发明实施例的滤波器能够保证了大功率信号不 会击穿, 同时又兼顾了滤波器的射频插损和抑制度等指标, 实现了总体积小 型化, 保证了滤波器的功率容量指标, 所以也能同时实现包含该滤波器的接 收器的总体积的小型化, 并能保证接收器的功率容量指标。
如图 7所示,本发明实施例还提供了一种发送器,包括信号发送装置 610 和如上文所述的根据本发明实施例的滤波器 620, 所述滤波器 620用于处理 信号, 所述信号发射装置 610用于发送已经所述滤波器 620处理过的信号。
如前文所述, 由于根据本发明实施例的滤波器能够保证了大功率信号不 会击穿, 同时又兼顾了滤波器的射频插损和抑制度等指标, 实现了总体积小 型化, 保证了滤波器的功率容量指标, 所以也能同时实现包含该滤波器的发 送器的总体积的小型化, 并能保证发送器的功率容量指标。 如图 8 所示, 本发明实施例还提供了一种收发器, 包括信号接收装置 710、如上文所述的根据本发明实施例的滤波器 720和信号发射装置 730,所 述信号接收装置 710用于接收信号,所述滤波器 720用于处理所述信号接收 装置 710接收的信号,所述信号发射装置 730用于处理经所述滤波器 720处 理过的信号。
如前文所述, 由于根据本发明实施例的滤波器能够保证了大功率信号不 会击穿, 同时又兼顾了滤波器的射频插损和抑制度等指标, 实现了总体积小 型化, 保证了滤波器的功率容量指标, 所以也能同时实现包含该滤波器的收 发器的总体积的小型化, 并能保证收发器的功率容量指标。
应理解, 图 6、 图 7和图 8分别只示出了接收器、 发送器和收发器的部 分部件, 但接收器、 发送器和收发器还可以包含其它部件, 例如, 对于收发 器而言,还可以包括放大器、緩沖器等, 具体可以参考现有技术, 为了筒洁, 在此不再赘述 但本发明并不限于此。 在不脱离本发明的精神和实质的前提下, 本领域普通 技术人员可以对本发明的实施例进行各种等效的修改或替换, 而这些修改或 替换都应在本发明的涵盖范围内。

Claims

权利要求
1. 一种滤波器, 其特征在于, 包括谐振腔组件 ( 100 )、 微带滤波组件 (200)和连接件(401、 402), 其中, 所述谐振腔组件(100) 包括并联在 一起的至少二个谐振腔( 101 ), 每一谐振腔( 101 )上设置有谐振器( 102) 和调谐螺釘 ( 103 ), 所述微带滤波组件( 200 ) 包括介质基板( 202 )和位于 介质基板( 202 )上面的微带线( 201 ),所述连接件 ( 401 )将所述微带线( 201 ) 的一端和一谐振腔( 101 )上的谐振器( 102) 匹配连接, 所述连接件(402) 将所述微带线 (201 ) 的另一端与另一谐振腔(101 )上的谐振器(102) 匹 配连接, 所述谐振腔组件(100)的阻抗小于所述微带滤波组件(200)的阻 抗。
2. 根据权利要求 1所述的滤波器,其特征在于,所述连接件(401、 402) 是具有阶梯阻抗变换结构的连接件。
3. 根据权利要求 1或 2所述的滤波器, 其特征在于, 在滤波器总插损 要求为 1.20db, 带外抑制 90db以上时, 所述微带线( 201 ) 为 7阶微带线。
4. 根据权利要求 1至 3中任一项所述的滤波器, 其特征在于, 所述滤 波器的输入端(301 )和输出端( 302)分别连接所述微带线(201)的两端。
5. 根据权利要求 1至 4中任一项所述滤波器, 其特征在于, 所述谐振 器(101) 为金属谐振器和 /或介质谐振器。
6. 根据权利要求 1至 5中任一项所述的滤波器, 其特征在于, 所述微 带滤波组件( 200 )还包括位于所述微带线 ( 201 )上的屏蔽盖板。
7. 根据权利要求 1至 6中任一项所述的滤波器, 其特征在于, 所述微 带线(201)组成微带交指滤波电路和 /或微带平行耦合线滤波电路。
8. 根据权利要求 1至 7中任一项所述的滤波器, 其特征在于, 所述微 带线 (201) 包括悬置式微带线、 倒置式微带和共面波导微带线中的至少一 种。
9. 一种接收器, 其特征在于, 包括信号接收装置(510)和如权利要求 1至 8中任一项所述的滤波器( 520 ), 所述信号接收装置( 510 )用于接收信 号, 所述滤波器(520)用于处理所述信号接收装置 (510)接收的信号。
10. 一种发送器, 其特征在于, 包括信号发送装置 ( 610 )和如权利要 求 1至 8中任一项所述的滤波器( 620 ), 所述滤波器( 620 )用于处理信号, 所述信号发射装置(610 )用于发送已经所述滤波器(620 )处理过的信 号。
11. 一种收发器, 其特征在于, 包括信号接收装置(710 )、 如权利要求 1至 8中任一项所述的滤波器( 720 )和信号发射装置( 730 ) , 所述信号接收 装置( 710 )用于接收信号, 所述滤波器( 720 )用于处理所述信号接收装置 ( 710 )接收的信号 ,所述信号发射装置( 730 )用于处理经所述滤波器( 720 ) 处理过的信号。
PCT/CN2013/074250 2012-11-08 2013-04-16 滤波器、接收器、发送器和收发器 WO2014071721A1 (zh)

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