WO2014059974A3 - Multifunction microelectronic component and method for producing such component - Google Patents

Multifunction microelectronic component and method for producing such component Download PDF

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Publication number
WO2014059974A3
WO2014059974A3 PCT/DE2013/100355 DE2013100355W WO2014059974A3 WO 2014059974 A3 WO2014059974 A3 WO 2014059974A3 DE 2013100355 W DE2013100355 W DE 2013100355W WO 2014059974 A3 WO2014059974 A3 WO 2014059974A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
multifunction
producing
microelectronic component
microelectronic
Prior art date
Application number
PCT/DE2013/100355
Other languages
German (de)
French (fr)
Other versions
WO2014059974A2 (en
WO2014059974A4 (en
Inventor
Wolfgang Hornig
Original Assignee
Bpe E. K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bpe E. K. filed Critical Bpe E. K.
Priority to RU2015118444A priority Critical patent/RU2015118444A/en
Priority to EP13802226.4A priority patent/EP2909859A2/en
Publication of WO2014059974A2 publication Critical patent/WO2014059974A2/en
Publication of WO2014059974A3 publication Critical patent/WO2014059974A3/en
Publication of WO2014059974A4 publication Critical patent/WO2014059974A4/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Element Separation (AREA)

Abstract

The invention relates to a multifunction microelectronic component and to method for producing such a multifunction microelectronic component, wherein the method comprises the following steps: provision of a substrate having a front face and a rear face, forming one or more elements of a multifunction microelectronic component on the front face of the substrate and forming one or more elements of a Peltier element on the rear face of the substrate.
PCT/DE2013/100355 2012-10-19 2013-10-16 Multifunction microelectronic component and method for producing such component WO2014059974A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
RU2015118444A RU2015118444A (en) 2012-10-19 2013-10-16 MULTIFUNCTIONAL MICROELECTRONIC ELEMENT AND METHOD FOR ITS MANUFACTURE
EP13802226.4A EP2909859A2 (en) 2012-10-19 2013-10-16 Multifunction microelectronic component and method for producing such component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012110021.7 2012-10-19
DE102012110021.7A DE102012110021A1 (en) 2012-10-19 2012-10-19 Multifunction microelectronic device and manufacturing method therefor

Publications (3)

Publication Number Publication Date
WO2014059974A2 WO2014059974A2 (en) 2014-04-24
WO2014059974A3 true WO2014059974A3 (en) 2014-06-12
WO2014059974A4 WO2014059974A4 (en) 2014-07-31

Family

ID=49726408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2013/100355 WO2014059974A2 (en) 2012-10-19 2013-10-16 Multifunction microelectronic component and method for producing such component

Country Status (4)

Country Link
EP (1) EP2909859A2 (en)
DE (1) DE102012110021A1 (en)
RU (1) RU2015118444A (en)
WO (1) WO2014059974A2 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222113B1 (en) * 1999-12-09 2001-04-24 International Business Machines Corporation Electrically-isolated ultra-thin substrates for thermoelectric coolers
JP2002208741A (en) * 2001-01-11 2002-07-26 Nok Corp Thermoelectric semiconductor device, cooler-heater using thermoelectric semiconductor device and manufacturing method therefor
US20050178423A1 (en) * 2004-02-12 2005-08-18 Shriram Ramanathan Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
DE102007051312A1 (en) * 2006-12-29 2008-07-03 Dongbu Hitek Co., Ltd. Device, particularly complimentary metal oxide semiconductor unit, comprises cooling element that is formed on lower substrate and image sensor is formed on cooling element
US20110006388A1 (en) * 2008-03-26 2011-01-13 Masafumi Kawanaka Semiconductor device
US20120139076A1 (en) * 2010-12-06 2012-06-07 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device
US20120139075A1 (en) * 2010-12-06 2012-06-07 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222113B1 (en) * 1999-12-09 2001-04-24 International Business Machines Corporation Electrically-isolated ultra-thin substrates for thermoelectric coolers
JP2002208741A (en) * 2001-01-11 2002-07-26 Nok Corp Thermoelectric semiconductor device, cooler-heater using thermoelectric semiconductor device and manufacturing method therefor
US20050178423A1 (en) * 2004-02-12 2005-08-18 Shriram Ramanathan Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
DE102007051312A1 (en) * 2006-12-29 2008-07-03 Dongbu Hitek Co., Ltd. Device, particularly complimentary metal oxide semiconductor unit, comprises cooling element that is formed on lower substrate and image sensor is formed on cooling element
US20110006388A1 (en) * 2008-03-26 2011-01-13 Masafumi Kawanaka Semiconductor device
US20120139076A1 (en) * 2010-12-06 2012-06-07 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device
US20120139075A1 (en) * 2010-12-06 2012-06-07 Stmicroelectronics Pte. Ltd. Thermoelectric cooler system, method and device

Also Published As

Publication number Publication date
RU2015118444A (en) 2016-12-10
DE102012110021A1 (en) 2014-04-24
WO2014059974A2 (en) 2014-04-24
WO2014059974A4 (en) 2014-07-31
EP2909859A2 (en) 2015-08-26

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