WO2014026978A1 - Lighting module and method for the production of such a lighting module - Google Patents

Lighting module and method for the production of such a lighting module Download PDF

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Publication number
WO2014026978A1
WO2014026978A1 PCT/EP2013/066895 EP2013066895W WO2014026978A1 WO 2014026978 A1 WO2014026978 A1 WO 2014026978A1 EP 2013066895 W EP2013066895 W EP 2013066895W WO 2014026978 A1 WO2014026978 A1 WO 2014026978A1
Authority
WO
WIPO (PCT)
Prior art keywords
precursor molecules
potting compound
light
module according
circuit board
Prior art date
Application number
PCT/EP2013/066895
Other languages
German (de)
French (fr)
Inventor
Martin Reiss
Davide Grosso
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2014026978A1 publication Critical patent/WO2014026978A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the invention relates to a light module, insbesonde re a flexible light strip, according to the preamble of patent claim 1 and a method for producing egg nes such light module.
  • Leuchtmo ⁇ module such as a Leuchtmo ⁇ module is disclosed.
  • This has a printed circuit board on which electronic components, such as transistors, resistors, etc., and a plurality of light-emitting diodes, in particular LEDs, are arranged.
  • electronic components such as transistors, resistors, etc.
  • a plurality of light-emitting diodes in particular LEDs
  • this is completely potted with a silicone potting compound.
  • Surfaces of the circuit board and the electronic components are then covered with Vergussmas ⁇ se.
  • At least in the region of a beam path ei ⁇ ner radiation emitted by a respective light emitting diode here is a transparent potting verwen ⁇ det.
  • the potting compound of silicone for example, UV-cured or thermally cured. It has been found that in the case of UV curing of the potting compound, it has only a comparatively low adhesion or adhesion to the different surfaces of the luminescent module.
  • the potting compound then dissolves in the use of the Leuchtmo ⁇ duls from at least in sections, as may contamination conditions, such as dust or moisture, between ⁇ penetrate the potting compound and the electronic components. If the impurities thereby reach the beam path of the light-emitting diodes, this leads to an extremely disadvantageous impairment of the luminous quality of the light-emitting module.
  • UV curing takes place in a comparatively short time, that no thermal curing ovens are necessary (curing ovens are usually very long, for example. 100m, very expensive and have a high energy consumption), that no different expansions due to different coefficients of expansion of the components of the luminous band occur and that a rapid extrusion extrusion is possible.
  • thermal curing of the casting compound Ver ⁇ silicone in comparison to the UV-curing in the manufacture is extremely expensive and can lead to mechanical stresses between the components of the light bands.
  • the object of the present invention is to provide a low-cost and high-life and / or high-quality lighting module.
  • a white ⁇ tere object of the present invention is to provide a procedural for producing such a light module to create.
  • a lighting module is provided insbeson ⁇ particular a flexible light-emitting module or a flexible light ⁇ band, the one, in particular flexible, printed circuit board has up.
  • This is equipped with a plurality of semiconductor diodes, in particular light-emitting diodes, in particular LEDs, and / or electrical components.
  • the lighting module is at least partially shed with a potting compound on the surface.
  • vorgese ⁇ hen between this and at least surface portions of a molded surface of the light emitting module precursor molecules.
  • precursor molecules are in this context in particular bifunctional molecules, preferably organic Mo ⁇ leküle to view, through their configuration, a good adhesion both to the surface of the lighting module, in particular ⁇ sondere the circuit board, solder resist and LED Surface, as well as to achieve the potting compound.
  • a functional group of the precursor reacts with the surface of the lighting module, in particular the printed ⁇ te, solder resist and LED surface, the remaining functional group can then dock the potting compound.
  • This solution has the advantage that the precursor molecules or the precoating molecules serve as connection points for the potting compound for firm connection to the surfaces to be potted.
  • the luminous module according to the invention with the precursor molecules makes it completely sufficient for the potting compound to be UV-cured as a result of the resulting high adhesion of the potting compound. A cost- effective thermal curing to increase the adhesion is not necessary.
  • the precursor molecules thus lead to a UV-cured potting compound, such as silicone, usually no longer - as in the prior art - can replace.
  • a color temperature of the individual light-emitting diodes thus remains substantially the same over the life of the light-emitting module, which leads to a homogeneous appearance of the light-emitting module. Risks such as delamination, corrosion or mechanical damage in the event of temperature fluctuations, in particular during production, are avoided or at least significantly reduced by the luminous module according to the invention.
  • the precursor molecules are applied to the surface to be cast by surface coating, in particular by plasma coating known from the prior art. brought.
  • Plasma coating is an extremely fast process, which essentially has little effect on a production time of the lighting module.
  • a surface treatment or a plasma treatment takes place after the surface coating or plasma coating as aftertreatment.
  • the precursor molecules are plasma-activated after the plasma coating and in particular also after the plasma treatment and in particular before the casting. It has been found that, as a result, adhesion of the potting compound, in particular of silicone, is extremely high.
  • the precursor molecules are preferably bifunctional substances. This means in particular that on the one hand a good adhesion to the surface of the light module, in particular the circuit board, and on the other ⁇ a good connection with the potting compound is achieved.
  • silane-based molecules in particular hexadimethylsilane and / or tetraethoxysilane, are used as precursor molecules.
  • the semiconductor diode can be integrally ⁇ arranged in a semiconductor body, which consists, for example, PPA (polyphthalamide), whose surface is at least partially encapsulated in the potting compound.
  • a semiconductor body which consists, for example, PPA (polyphthalamide), whose surface is at least partially encapsulated in the potting compound.
  • the semiconductor housing has a recess which is provided with a potting compound, in particular made of silicone. at least partially filled. Be inserted between the ⁇ ser potting compound of the semiconductor package and the casting mass for the surface ⁇ Precur- sor molecules of the invention, then this is done an ex- tremely high holding force between the potting compounds. A replacement of the outer potting compound, as in the prior art, which leads to a change in the color temperature due to additionally occurring interfaces, is avoided.
  • the semiconductor diode and the printed circuit board and electronic components on the circuit board can be angeord ⁇ net whose surfaces are cast at least in sections with the potting compound. It is also conceivable to completely shed the complete light module with a potting compound.
  • FIG. 1 a schematic side view of a light strip according to an embodiment
  • Fig. 2 shows an enlarged section of the luminous band
  • FIG. 1 A first figure.
  • FIG. 1 a lighting module in the form of a flexible lighting strip 1 is shown greatly simplified.
  • a derarti ⁇ ges luminous band 1 is sold by the company. Osram GmbH under the name "Linear Flex Series.”
  • the light strip 1 has a band-shaped flexible conductor ⁇ plate 2. This is equipped with a variety of, in particular arranged in series, LEDs 4, of which for the sake of clarity, only one is shown in the figure 1.
  • electronic components 6 are provided on the circuit board, de ⁇ nen also only one is shown.
  • the light-emitting diode 4 has an example of PPA (polyphthalamide) exist ⁇ of the semiconductor housing 8 with a light exit portion 10, can escape via the radiation emitted by the light emitting diode 4.
  • the light exit section 10 is potted with a transparent potting compound, which consists for example of silicone or silicone with phosphorus.
  • one or more may be provided within the semiconductor body 8 or outside in the Figure 1 is not Darge ⁇ placed optical elements.
  • this is potted with a potting compound 12 made of silicone.
  • the potting compound consists for example of epoxy.
  • the printed circuit board 2, the semiconductor housing 8 with the potted light exit section 10 and the electronic compo ⁇ le 6 each have surfaces 14, 16 and 18, wherein in the figure 1 for better depictibility half only one surface of said elements with a Reference is provided. On the surfaces 14 to 18, the potting compound 12 adheres.
  • precursor molecules are provided, with which the potting compound 12 is additionally anchored to the surfaces 14 to 18. This will be explained in more detail with reference to the following Figure 2.
  • the precursor molecules are, for example, hexadimethylsilane or tetraethoxysilane.
  • the precursor molecules 20 are connected to the surface 14 to 18 and each have a junction 22 to which a silicone chain 24 the group consisting of silicone potting ⁇ mass 12 is connected.
  • the surfaces 14 to 18 are here before the casting of the light strip 1 with the potting compound 12 via a plasma coating with the Precursor molecules 20 coated. After the application of the precursor molecules 20, a plasma treatment is carried out in order to fix the precursor molecules 20 with a high adhesion to the surfaces 14 to 18.
  • the precursor molecules 20 are plasma-activated, whereby the silicone chains 24 adhere to the precursor molecules 20 with a high degree of adhesion.
  • the light module 1 is shed on Liehe usual way with the potting compound 12 and in the end it UV cured in arrival in the shortest time. Despite the lack of thermal curing of the potting compound 12, this has an extremely high adhesion to the surfaces 14 to 18 of the luminescent band 1 due to the precursor molecules 20.
  • inventive precursor molecules 20 in particular, the detachment of the sealing compound in the region of the shed light exit portion 10 of the semiconducting ⁇ tergepatuses avoided 8, whereby here occur in contrast to the prior art, no changes in the color temperature.
  • a flexib ⁇ les light strip with a flexible printed circuit board which is equipped with a plurality of light-emitting diodes.
  • On the circuit board in addition to other electronic components ⁇ can be arranged.
  • the lighting module is in this case potted with a potting compound that it is protected against external environmental influences.
  • the casting compound is additionally supported by ⁇ precursor molecules on one, several or all surfaces of the cast components.

Abstract

Disclosed is, especially according to the invention, a flexible lighting strip comprising a flexible printed circuit board (2) that is fitted with a plurality of light emitting diodes (4). Additional electronic components (6) can also be arranged on the printed circuit board. The lighting module is encapsulated with a potting compound (12) in such a way that the lighting module is protected from external environmental influences. The potting compound is additionally secured on one, several, or all surfaces of the encapsulated components by precursor molecules (20).

Description

Beschreibung  description
Leuchtmodul und Verfahren zur Herstellung eines derarti¬ gen Leuchtmoduls Light module and method for producing a derarti ¬ gene light module
Technisches Gebiet Technical area
Die Erfindung geht aus von einem Leuchtmodul, insbesonde re einem flexiblen Leuchtband, gemäß dem Oberbegriff de Patentanspruchs 1 und einem Verfahren zur Herstellung ei nes derartigen Leuchtmoduls. The invention relates to a light module, insbesonde re a flexible light strip, according to the preamble of patent claim 1 and a method for producing egg nes such light module.
Stand der Technik State of the art
In der DE 10 2009 008 845 AI ist ein derartiges Leuchtmo¬ dul offenbart. Dieses weist eine Leiterplatte auf, auf der elektronische Bauteile, wie Transistoren, Widerstände usw., und eine Mehrzahl von Leuchtdioden, insbesondere LEDs, angeordnet sind. Zum Schutz des Leuchtmoduls vor äußeren Einflüssen, wie beispielsweise Staub oder Feuchtigkeit, wird dieses mit einer Vergussmasse aus Silikon vollständig vergossen. Oberflächen der Leiterplatte und der elektronischen Bauteile sind dann mit der Vergussmas¬ se bedeckt. Zumindest im Bereich eines Strahlengangs ei¬ ner von einer jeweiligen Leuchtdiode emittierten Strahlung wird hierbei eine transparente Vergussmasse verwen¬ det . In DE 10 2009 008 845 AI, such a Leuchtmo ¬ module is disclosed. This has a printed circuit board on which electronic components, such as transistors, resistors, etc., and a plurality of light-emitting diodes, in particular LEDs, are arranged. To protect the light module against external influences, such as dust or moisture, this is completely potted with a silicone potting compound. Surfaces of the circuit board and the electronic components are then covered with Vergussmas ¬ se. At least in the region of a beam path ei ¬ ner radiation emitted by a respective light emitting diode here is a transparent potting verwen ¬ det.
Die Vergussmasse aus Silikon wird beispielsweise UV- gehärtet oder thermisch gehärtet. Es hat sich gezeigt, dass bei einer UV-Härtung der Vergussmasse diese nur eine vergleichsweise geringe Adhäsion bzw. Anhaftung auf den unterschiedlichen Oberflächen des Leuchtmoduls aufweist. Löst sich die Vergussmasse dann im Einsatz des Leuchtmo¬ duls zumindest abschnittsweise ab, so können Verunreini- gungen, wie beispielsweise Staub oder Feuchtigkeit, zwi¬ schen die Vergussmasse und die elektronischen Bauteile eindringen. Gelangen die Verunreinigungen dabei in den Strahlengang der Leuchtdioden, so führt dies zu einer äu- ßerst nachteiligen Beeinträchtigung der Leuchtqualität des Leuchtmoduls. Ablösungen der Vergussmasse im Bereich eines Strahlengangs einer Leuchtdiode führen des Weiteren häufig zur Veränderungen der Farbtemperatur dieser Leuchtdiode, da durch die Ablösung der Vergussmasse neue Grenzflächen geschaffen werden, an denen sich die von der Leuchtdiode emittierte Strahlung bricht. Ein Leuchtband mit unterschiedliche Farbtemperaturen aufweisenden Leuchtdioden vermittelt im Einsatz eine äußerst negative Anmutung . Beim thermischen Aushärten der Vergussmasse aus Silikon weist diese eine höhere Adhäsion im Vergleich zum UV- Aushärten auf. Allerdings gehen bei diesem Verfahren die Vorteile der UV-Aushärtung verloren. Die Vorteile der UV- Aushärtung sind beispielsweise, dass die Aushärtung in einer vergleichsweise kurzen Zeit erfolgt, dass keine thermischen Aushärteöfen notwendig sind (Aushärteöfen sind üblicherweise sehr lang, bspw. 100m, sehr kostenintensiv und weisen einen hohen Energieverbrauch auf) , dass keine unterschiedliche Ausdehnungen aufgrund unterschied- licher Ausdehnungskoeffizienten der Bauteile des Leuchtbands auftreten und dass eine schnelle Strangextrusion möglich ist. Somit ist das thermische Aushärten der Ver¬ gussmasse aus Silikon im Vergleich zum UV-Aushärten in der Herstellung äußerst kostenintensiv und kann zu mecha- nischen Spannungen zwischen den Bauteilen des Leuchtbands führen . Darstellung der Erfindung The potting compound of silicone, for example, UV-cured or thermally cured. It has been found that in the case of UV curing of the potting compound, it has only a comparatively low adhesion or adhesion to the different surfaces of the luminescent module. The potting compound then dissolves in the use of the Leuchtmo ¬ duls from at least in sections, as may contamination conditions, such as dust or moisture, between ¬ penetrate the potting compound and the electronic components. If the impurities thereby reach the beam path of the light-emitting diodes, this leads to an extremely disadvantageous impairment of the luminous quality of the light-emitting module. Detachments of the potting compound in the region of a beam path of a light-emitting diode furthermore frequently lead to changes in the color temperature of this light-emitting diode, since new patches are created by the detachment of the potting compound, at which the radiation emitted by the light-emitting diode breaks. A light strip with light-emitting diodes having different color temperatures gives a very negative impression in use. During thermal curing of the potting compound of silicone, this has a higher adhesion compared to UV curing. However, this process loses the benefits of UV curing. The advantages of UV curing are, for example, that the curing takes place in a comparatively short time, that no thermal curing ovens are necessary (curing ovens are usually very long, for example. 100m, very expensive and have a high energy consumption), that no different expansions due to different coefficients of expansion of the components of the luminous band occur and that a rapid extrusion extrusion is possible. Thus, the thermal curing of the casting compound Ver ¬ silicone in comparison to the UV-curing in the manufacture is extremely expensive and can lead to mechanical stresses between the components of the light bands. Presentation of the invention
Die Aufgabe der vorliegenden Erfindung ist es, ein kostengünstiges und eine hohe Lebensdauer und/oder eine hohe Qualität aufweisendes Leuchtmodul zu schaffen. Eine wei¬ tere Aufgabe der vorliegenden Erfindung ist es, ein Ver- fahren zur Herstellung eines derartigen Leuchtmoduls zu schaffen . The object of the present invention is to provide a low-cost and high-life and / or high-quality lighting module. A white ¬ tere object of the present invention is to provide a procedural for producing such a light module to create.
Die Aufgabe hinsichtlich des Leuchtmoduls wird gelöst durch die Merkmale des Patentanspruchs 1 und hinsichtlich des Verfahrens durch die Merkmale des Patentanspruchs 9. Besonders vorteilhafte Ausgestaltungen finden sich in den abhängigen Ansprüchen. The object with regard to the light module is achieved by the features of patent claim 1 and with regard to the method by the features of claim 9. Particularly advantageous embodiments can be found in the dependent claims.
Erfindungsgemäß ist ein Leuchtmodul vorgesehen, insbeson¬ dere ein flexibles Leuchtmodul oder ein flexibles Leucht¬ band, das eine, insbesondere flexible, Leiterplatte auf- weist. Diese ist mit einer Vielzahl von Halbleiterdioden, insbesondere Leuchtdioden, insbesondere LEDs, und/oder elektrischen Bauteilen bestückt. Zum Schutz und/oder zum Versiegeln wird das Leuchtmodul zumindest abschnittsweise mit einer Vergussmasse oberflächlich vergossen. Um die Adhäsion der Vergussmasse zu erhöhen, sind zwischen dieser und zumindest Flächenabschnitten einer vergossenen Oberfläche des Leuchtmoduls Precursor-Moleküle vorgese¬ hen . According to the invention, a lighting module is provided insbeson ¬ particular a flexible light-emitting module or a flexible light ¬ band, the one, in particular flexible, printed circuit board has up. This is equipped with a plurality of semiconductor diodes, in particular light-emitting diodes, in particular LEDs, and / or electrical components. For protection and / or sealing, the lighting module is at least partially shed with a potting compound on the surface. In order to increase the adhesion of the casting compound are vorgese ¬ hen between this and at least surface portions of a molded surface of the light emitting module precursor molecules.
Als Precursor-Moleküle sind in diesem Zusammenhang insbe- sondere bifunktionale Moleküle, bevorzugt organische Mo¬ leküle, anzusehen, die durch ihre Ausgestaltung eine gute Haftung sowohl an der Oberfläche des Leuchtmoduls, insbe¬ sondere der Leiterplatte, Lötstopplack und LED- Oberfläche, als auch zu der Vergussmasse erzielen. Dabei reagiert eine funktionelle Gruppe des Precursors mit der Oberfläche des Leuchtmoduls, insbesondere der Leiterplat¬ te, Lötstopplack und LED-Oberfläche, an die verbleibende funktionelle Gruppe kann dann die Vergussmasse andocken. As precursor molecules are in this context in particular bifunctional molecules, preferably organic Mo ¬ leküle to view, through their configuration, a good adhesion both to the surface of the lighting module, in particular ¬ sondere the circuit board, solder resist and LED Surface, as well as to achieve the potting compound. In this case, a functional group of the precursor reacts with the surface of the lighting module, in particular the printed ¬ te, solder resist and LED surface, the remaining functional group can then dock the potting compound.
Diese Lösung hat den Vorteil, dass die Precursor-Moleküle bzw. die Vorbeschichtungsmoleküle als Anschlussstellen für die Vergussmasse zum festen Anschließen an die zu vergießenden Oberflächen dienen. Wird als Vergussmasse beispielsweise Silikon eingesetzt, so können die Precur¬ sor-Moleküle als Anschlussstellen für Silikonketten vorgesehen sein. Durch das erfindungsgemäße Leuchtmodul mit den Precursor-Molekülen ist es durch die daraus sich ergebende hohe Adhäsion der Vergussmasse völlig ausrei- chend, die Vergussmasse UV-auszuhärten . Eine kostenauf¬ wendige thermische Aushärtung zur Erhöhung der Adhäsion ist nicht notwendig. Die Precursor-Moleküle führen somit dazu, dass eine UV-gehärtete Vergussmasse, beispielsweise aus Silikon, sich in der Regel nicht mehr - wie im Stand der Technik - ablösen kann. Eine Farbtemperatur der einzelnen Leuchtdioden bleibt damit über die Lebensdauer des Leuchtmoduls im Wesentlichen gleich, was zu einem homogenen Erscheinen des Leuchtmoduls führt. Risiken wie Dela- mination, Korrosion oder mechanische Beschädigungen bei Temperaturschwankungen, insbesondere bei der Herstellung, werden durch das erfindungsgemäße Leuchtmodul vermieden oder zumindest signifikant reduziert. This solution has the advantage that the precursor molecules or the precoating molecules serve as connection points for the potting compound for firm connection to the surfaces to be potted. Is used as a potting compound such as silicone, so the precur sor ¬ molecules can be provided as connection points for the silicone chains. The luminous module according to the invention with the precursor molecules makes it completely sufficient for the potting compound to be UV-cured as a result of the resulting high adhesion of the potting compound. A cost- effective thermal curing to increase the adhesion is not necessary. The precursor molecules thus lead to a UV-cured potting compound, such as silicone, usually no longer - as in the prior art - can replace. A color temperature of the individual light-emitting diodes thus remains substantially the same over the life of the light-emitting module, which leads to a homogeneous appearance of the light-emitting module. Risks such as delamination, corrosion or mechanical damage in the event of temperature fluctuations, in particular during production, are avoided or at least significantly reduced by the luminous module according to the invention.
In weiterer Ausgestaltung der Erfindung werden die Precursor-Moleküle durch ein Oberflächenbeschichten, insbe- sondere durch ein aus dem Stand der Technik bekanntes Plasmabeschichten, auf die zu vergießende Oberfläche auf- gebracht. Beim Plasmabeschichten handelt es sich um ein äußerst schnelles Verfahren, wodurch eine Produktionszeit des Leuchtmoduls im Wesentlichen kaum beeinflusst wird. In a further embodiment of the invention, the precursor molecules are applied to the surface to be cast by surface coating, in particular by plasma coating known from the prior art. brought. Plasma coating is an extremely fast process, which essentially has little effect on a production time of the lighting module.
Damit die Precursor-Moleküle fest auf der zu vergießenden Oberfläche bzw. auf den zu vergießenden Oberflächen gehaltert sind, erfolgt nach dem Oberflächenbeschichten bzw. Plasmabeschichten eine Oberflächenbehandlung bzw. eine Plasmabehandlung als Nachbehandlung. So that the precursor molecules are firmly held on the surface to be cast or on the surfaces to be cast, a surface treatment or a plasma treatment takes place after the surface coating or plasma coating as aftertreatment.
In weiterer Ausgestaltung der Erfindung sind die Precur- sor-Moleküle nach dem Plasmabeschichten und insbesondere auch nach der Plasmabehandlung und insbesondere vor dem Vergießen plasma-aktiviert . Es hat sich gezeigt, dass hierdurch eine Adhäsion der Vergussmasse, insbesondere aus Silikon, äußerst hoch ist. In a further embodiment of the invention, the precursor molecules are plasma-activated after the plasma coating and in particular also after the plasma treatment and in particular before the casting. It has been found that, as a result, adhesion of the potting compound, in particular of silicone, is extremely high.
Bei den Precursor-Molekülen handelt es sich vorzugsweise um bifunktionale Stoffe. Dies bedeutet insbesondere, dass einerseits eine gute Haftung an der Oberfläche des Leuchtmoduls, insbesondere der Leiterplatte, und anderer¬ seits eine gute Verbindung mit der Vergussmasse erzielt wird. Beispielsweise werden als Precursor-Moleküle auf Silanen basierende Moleküle, insbesondere Hexadimethayl- silan und/oder Tetraethoxysilan eingesetzt. The precursor molecules are preferably bifunctional substances. This means in particular that on the one hand a good adhesion to the surface of the light module, in particular the circuit board, and on the other ¬ a good connection with the potting compound is achieved. For example, silane-based molecules, in particular hexadimethylsilane and / or tetraethoxysilane, are used as precursor molecules.
Die Halbleiterdiode kann in einem Halbleitergehäuse ange¬ ordnet sein, das beispielsweise aus PPA ( Polyphthalamid) besteht, dessen Oberfläche zumindest abschnittsweise mit der Vergussmasse vergossen ist. The semiconductor diode can be integrally ¬ arranged in a semiconductor body, which consists, for example, PPA (polyphthalamide), whose surface is at least partially encapsulated in the potting compound.
Das Halbleitergehäuse hat im Bereich des Strahlengangs der darin angeordneten Halbleiterdiode eine Aussparung, die mit einer Vergussmasse, insbesondere aus Silikon zu- mindest abschnittsweise befüllt ist. Werden zwischen die¬ ser Vergussmasse des Halbleitergehäuse und der Verguss¬ masse für dessen Oberfläche die erfindungsgemäßen Precur- sor-Moleküle eingesetzt, so erfolgt hierdurch eine äu- ßerst hohe Haltekraft zwischen den Vergussmassen. Eine Ablösung der äußeren Vergussmasse, wie im Stand der Technik, die zu einer Veränderung der Farbtemperatur aufgrund von zusätzlich auftretenden Grenzflächen führt, wird vermieden . Neben der Halbleiterdiode und der Leiterplatte können auch elektronische Bauteile auf der Leiterplatte angeord¬ net sein, deren Oberflächen zumindest abschnittsweise mit der Vergussmasse vergossen sind. Denkbar ist auch, das komplette Leuchtmodul mit einer Vergussmasse vollständig zu vergießen. In the region of the beam path of the semiconductor diode arranged therein, the semiconductor housing has a recess which is provided with a potting compound, in particular made of silicone. at least partially filled. Be inserted between the ¬ ser potting compound of the semiconductor package and the casting mass for the surface ¬ Precur- sor molecules of the invention, then this is done an ex- tremely high holding force between the potting compounds. A replacement of the outer potting compound, as in the prior art, which leads to a change in the color temperature due to additionally occurring interfaces, is avoided. In addition to the semiconductor diode and the printed circuit board and electronic components on the circuit board can be angeord ¬ net whose surfaces are cast at least in sections with the potting compound. It is also conceivable to completely shed the complete light module with a potting compound.
Bei einem erfindungsgemäßen Verfahren zur Herstellung des Leuchtmoduls werden folgende Schritte ausgeführt: In a method according to the invention for producing the luminous module, the following steps are carried out:
- Aufbringen der Precursor-Moleküle zumindest auf ei¬ ner, auf mehreren oder auf allen zu vergießenden Oberflächen des Leuchtmoduls, beispielsweise durch- Applying the precursor molecules at least on ei ¬ ner, on several or on all to be cast surfaces of the lighting module, for example by
Plasmabeschichten, Plasma coating,
- Vergießen zumindest einer oder mehrerer Oberflächen des Leuchtmoduls mit einer Vergussmasse. - Pouring at least one or more surfaces of the light module with a potting compound.
In einem weiteren Verfahrensschritt werden nach dem Auf- bringen bzw. nach dem Plasmabeschichten und vor dem Vergießen die Precursor-Moleküle plasmabehandelt und plas¬ maaktiviert. Ein derartiges Verfahren kann beispielsweise einfach und kostengünstig durch drei in Fertigungsrich- tung gesehen hintereinander angeordnete Plasmadüsen erfolgen . In a further method step, after the bringing up or after the plasma coating, and plasma-treated prior to casting the precursor molecules and plas ¬ maaktiviert. Such a method can be achieved, for example, simply and cost-effectively by means of three production lines. tion seen successively arranged plasma nozzles.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Im Folgenden soll die Erfindung anhand eines Ausführungs¬ beispiels näher erläutert werden. Die Figuren zeigen: Fig. 1 in einer schematischen Seitenansicht ein Leuchtband gemäß einem Ausführungsbeispiel In the following, the invention will be explained in more detail with reference to an embodiment ¬ example. The figures show: FIG. 1 a schematic side view of a light strip according to an embodiment
Fig. 2 einen vergrößerten Ausschnitt des Leuchtbands aus Fig. 2 shows an enlarged section of the luminous band
Figur 1  FIG. 1
Bevorzugte Ausführung der Erfindung Preferred embodiment of the invention
Gemäß Figur 1 ist ein Leuchtmodul in Form eines flexiblen Leuchtbands 1 stark vereinfacht dargestellt. Ein derarti¬ ges Leuchtband 1 wird von der Fa. Osram GmbH unter der Bezeichnung „LINEARLight Flex-Serie" vertrieben. According to FIG. 1, a lighting module in the form of a flexible lighting strip 1 is shown greatly simplified. A derarti ¬ ges luminous band 1 is sold by the company. Osram GmbH under the name "Linear Flex Series."
Das Leuchtband 1 hat eine bandförmige flexible Leiter¬ platte 2. Diese ist mit einer Vielzahl von, insbesondere in Reihe angeordneter, Leuchtdioden 4 bestückt, von denen der Übersichtlichkeit halber nur eine in der Figur 1 dargestellt ist. Neben den Leuchtdioden 4 sind auf der Leiterplatte 2 elektronische Bauteile 6 vorgesehen, von de¬ nen ebenfalls nur eines gezeigt ist. Die Leuchtdiode 4 hat ein beispielsweise aus PPA ( Polyphthalamid) bestehen¬ des Halbleitergehäuse 8 mit einem Lichtaustrittsabschnitt 10, über den von der Leuchtdiode 4 emittierte Strahlung austreten kann. Der Lichtaustrittsabschnitt 10 ist mit einer transparenten Vergussmasse, die beispielsweise aus Silikon oder aus Silikon mit Phosphor besteht, vergossen. Im Strahlengang der von der Leuchtdiode 4 emittierten Strahlung können innerhalb des Halbleitergehäuses 8 oder außerhalb ein oder mehrere in der Figur 1 nicht darge¬ stellte optische Elemente vorgesehen sein. Um das Leuchtband 1 zusammen mit seinen Bauteilen vor äußeren Einflüssen, wie beispielsweise Staub oder Feuchtig¬ keit, zu schützen, wird dieses mit einer Vergussmasse 12 aus Silikon vergossen. Denkbar wäre auch, dass die Vergussmasse beispielsweise aus Epoxid besteht. Die Leiter- platte 2, das Halbleitergehäuse 8 mit dem vergossenen Lichtaustrittsabschnitt 10 und die elektronischen Bautei¬ le 6 weisen jeweils Oberflächen 14, 16 bzw. 18 auf, wobei in der Figur 1 der besseren Darstellbarkeit halber nur jeweils eine Oberfläche der genannten Elemente mit einem Bezugszeigen versehen ist. An den Oberflächen 14 bis 18 haftet die Vergussmasse 12 an. Erfindungsgemäß sind Pre- cursor-Moleküle vorgesehen, mit denen die Vergussmasse 12 zusätzlich an den Oberflächen 14 bis 18 verankert ist. Dies wird anhand der folgenden Figur 2 näher erläutert. The light strip 1 has a band-shaped flexible conductor ¬ plate 2. This is equipped with a variety of, in particular arranged in series, LEDs 4, of which for the sake of clarity, only one is shown in the figure 1. In addition to the light-emitting diodes 4 2 electronic components 6 are provided on the circuit board, de ¬ nen also only one is shown. The light-emitting diode 4 has an example of PPA (polyphthalamide) exist ¬ of the semiconductor housing 8 with a light exit portion 10, can escape via the radiation emitted by the light emitting diode 4. The light exit section 10 is potted with a transparent potting compound, which consists for example of silicone or silicone with phosphorus. In the beam path of the light emitted from the light emitting diode 4 radiation, one or more may be provided within the semiconductor body 8 or outside in the Figure 1 is not Darge ¬ placed optical elements. In order to protect the light strip 1 together with its components against external influences, such as dust or moisture ¬ speed, this is potted with a potting compound 12 made of silicone. It would also be conceivable that the potting compound consists for example of epoxy. The printed circuit board 2, the semiconductor housing 8 with the potted light exit section 10 and the electronic compo ¬ le 6 each have surfaces 14, 16 and 18, wherein in the figure 1 for better depictibility half only one surface of said elements with a Reference is provided. On the surfaces 14 to 18, the potting compound 12 adheres. According to the invention precursor molecules are provided, with which the potting compound 12 is additionally anchored to the surfaces 14 to 18. This will be explained in more detail with reference to the following Figure 2.
In der Figur 2 ist beispielhaft eine der Oberflächen 14 bis 18 dargestellt, auf der Precursor-Moleküle 20 vorge¬ sehen sind, von denen der Einfachheit halber nur zwei mit einem Bezugszeichen versehen sind. Bei den Precursor- Molekülen handelt es sich beispielsweise um Hexadi- methaylsilan oder Tetraethoxysilan . Die Precursor- Moleküle 20 sind mit der Oberfläche 14 bis 18 verbunden und weisen jeweils eine Verbindungsstelle 22 auf, an die eine Silikonkette 24 der aus Silikon bestehenden Verguss¬ masse 12 angeschlossen ist. Die Oberflächen 14 bis 18 werden hierbei vor dem Vergießen des Leuchtbands 1 mit der Vergussmasse 12 über ein Plasmabeschichten mit den Precursor-Molekülen 20 beschichtet. Nach dem Aufbringen der Precursor-Moleküle 20 erfolgt eine Plasmabehandlung, um die Precursor-Moleküle 20 mit einer hohen Adhäsion auf den Oberflächen 14 bis 18 zu fixieren. Anschließend wer- den die Precursor-Moleküle 20 plasmaaktiviert, wodurch die Silikonketten 24 mit einer hohen Adhäsion an den Precursor-Molekülen 20 anhaften. Nach dem Anbringen, Fixieren und Aktivieren der Precursor-Moleküle 20, was in kür¬ zester Zeit erfolgen kann, wird das Leuchtmodul 1 auf üb- liehe Weise mit der Vergussmasse 12 vergossen und im An- schluss daran in kürzester Zeit UV-gehärtet. Trotz der fehlenden thermischen Aushärtung der Vergussmasse 12 weist diese durch die Precursor-Moleküle 20 eine äußerst hohe Adhäsion an den Oberflächen 14 bis 18 des Leucht- bands 1 auf. In the figure 2 is shown one of the surfaces 14 to 18 by way of example, on the precursor molecules are pre see ¬ 20, only two of which for simplicity are provided with a reference numeral. The precursor molecules are, for example, hexadimethylsilane or tetraethoxysilane. The precursor molecules 20 are connected to the surface 14 to 18 and each have a junction 22 to which a silicone chain 24 the group consisting of silicone potting ¬ mass 12 is connected. The surfaces 14 to 18 are here before the casting of the light strip 1 with the potting compound 12 via a plasma coating with the Precursor molecules 20 coated. After the application of the precursor molecules 20, a plasma treatment is carried out in order to fix the precursor molecules 20 with a high adhesion to the surfaces 14 to 18. Subsequently, the precursor molecules 20 are plasma-activated, whereby the silicone chains 24 adhere to the precursor molecules 20 with a high degree of adhesion. After the attachment, fixation and activation of the precursor molecules 20, which can be done in kür ¬ possible time, the light module 1 is shed on Liehe usual way with the potting compound 12 and in the end it UV cured in arrival in the shortest time. Despite the lack of thermal curing of the potting compound 12, this has an extremely high adhesion to the surfaces 14 to 18 of the luminescent band 1 due to the precursor molecules 20.
Durch die erfindungsgemäße Precursor-Moleküle 20 wird insbesondere eine Ablösung der Vergussmasse im Bereich des vergossenen Lichtaustrittsabschnitts 10 des Halblei¬ tergehäuses 8 vermieden, wodurch hier, im Unterschied zum Stand der Technik, keine Änderungen in der Farbtemperatur auftreten . The inventive precursor molecules 20 in particular, the detachment of the sealing compound in the region of the shed light exit portion 10 of the semiconducting ¬ tergehäuses avoided 8, whereby here occur in contrast to the prior art, no changes in the color temperature.
Offenbart ist, insbesondere erfindungsgemäß, ein flexib¬ les Leuchtband mit einer flexiblen Leiterplatte, die mit einer Mehrzahl von Leuchtdioden bestückt ist. Auf der Leiterplatte können zusätzlich weitere elektronische Bau¬ teile angeordnet sein. Das Leuchtmodul ist hierbei derart mit einer Vergussmasse vergossen, dass es gegen äußere Umwelteinflüsse geschützt ist. Die Vergussmasse ist zu¬ sätzlich durch Precursor-Moleküle auf einer, mehrerer oder aller Oberflächen der vergossenen Bauteile gehaltert . Bezugs zeichenliste Disclosed is, in particular according to the invention, a flexib ¬ les light strip with a flexible printed circuit board, which is equipped with a plurality of light-emitting diodes. On the circuit board in addition to other electronic components ¬ can be arranged. The lighting module is in this case potted with a potting compound that it is protected against external environmental influences. The casting compound is additionally supported by ¬ precursor molecules on one, several or all surfaces of the cast components. Reference sign list
1 Leuchtband  1 illuminated strip
2 Leiterplatte  2 circuit board
4 Leuchtdiode 4 LED
6 elektronisches Bauteil 6 electronic component
8 Halbleitergehäuse 8 semiconductor package
10 Lichtaustrittsabschnitt 10 light exit section
12 Vergussmasse 12 potting compound
14 Oberfläche 14 surface
16 Oberfläche  16 surface
18 Oberfläche  18 surface
20 Precursor-Molekül 20 precursor molecule
22 Verbindungsstelle 22 connection point
24 Silikonkette 24 silicone chain

Claims

Ansprüche claims
Leuchtmodul mit einer mit zumindest einer Halbleiter¬ diode (4) und/oder zumindest einem elektronischen Bauteil (6) bestückten Leiterplatte (2), wobei eine Oberfläche (16) der zumindest eine Halbleiterdiode (4) und/oder eine Oberfläche (14) der Leiterplatte (2) und/oder eine Oberfläche (18) des zumindest einen elektronisches Bauteils (6) zumindest abschnittsweise mit einer Vergussmasse (12) vergossen sind, dadurch gekennzeichnet, dass Precursor-Moleküle (20) zumin¬ dest abschnittsweise zwischen der Vergussmasse (12) und der vergossenen Oberfläche (14, 16, 18) zum Be¬ festigen der Vergussmasse (12) an der Oberfläche (14, 16, 18) vorgesehen sind. A light emitting module equipped with an with at least one semiconductor ¬ diode (4) and / or at least one electronic component (6) printed circuit board (2), wherein a surface (16) of the at least one semiconductor diode (4) and / or a surface (14) of the printed circuit board (2) and / or a surface (18) of the at least one electronic component (6) at least in sections with a sealing compound (12) are cast, characterized in that the precursor molecules (20) at ¬ least in sections (between the potting compound 12 ) and the potted surface (14, 16, 18) for Be ¬ consolidate the potting compound (12) on the surface (14, 16, 18) are provided.
Leuchtmodul nach Anspruch 1, wobei die Precursor- Moleküle (20) durch ein Plasmabeschichten auf die zu vergießende Oberfläche (14-18) aufgebracht sind. Luminous module according to claim 1, wherein the precursor molecules (20) are applied by a plasma coating on the surface to be cast (14-18).
Leuchtmodul nach Anspruch 2, wobei die Precursor- Moleküle (20) nach dem Aufbringen auf die zu vergie¬ ßende Oberfläche (14-18) durch eine Plasmabehandlung nachbehandelt sind. Luminous module according to claim 2, wherein the precursor molecules (20) after application to the vergie ¬ ßende surface (14-18) are treated by a plasma treatment.
4. Leuchtmodul nach Anspruch 2 oder 3, wobei die Precursor-Moleküle (20) nach dem Plasmabeschichten plasmaaktiviert sind. 4. Luminous module according to claim 2 or 3, wherein the precursor molecules (20) are plasma-activated after the plasma coating.
5. Leuchtmodul nach einem der vorhergehenden Ansprüche, wobei die Precursor-Moleküle Hexadimethaylsilan und/oder Tetraethoxysilan sind. 5. Luminous module according to one of the preceding claims, wherein the precursor molecules are hexadimethylsilane and / or tetraethoxysilane.
6. Leuchtmodul nach einem der vorhergehenden Ansprüche, wobei die Vergussmasse (12) im Wesentlichen aus Sili¬ kon besteht. 6. Light module according to one of the preceding claims, wherein the potting compound (12) consists essentially of Sili ¬ kon.
Leuchtmodul nach einem der vorhergehenden Ansprüche, wobei die zumindest eine Halbleiterdiode (4) in einem Halbleitergehäuse (8) angeordnet ist, dessen Oberflä¬ che (16) zumindest abschnittsweise mit der Verguss¬ masse (12) vergossen ist. Luminous module according to one of the preceding claims, wherein the at least one semiconductor diode (4) in a semiconductor housing (8) is arranged, the Oberflä ¬ che (16) at least partially sealed with the Verguss ¬ mass (12).
Leuchtmodul nach Anspruch 7, wobei das Halbleiterge häuse im Bereich des Strahlengangs der darin angeord neten Halbleiterdiode ausgespart und mit einer Ver gussmasse zumindest abschnittsweise befüllt ist. Luminous module according to claim 7, wherein the housing Halbleitge in the region of the beam path of the angeord Neten semiconductor diode recessed and is filled with a casting compound Ver at least in sections.
9. Leuchtmodul nach einem der vorhergehenden Ansprüche, wobei die Vergussmasse (12) UV-gehärtet ist. 10. Verfahren zur Herstellung eines Leuchtmoduls 1 nach einem oder mehrerer der vorhergehenden Ansprüche mit den Schritten: 9. Light module according to one of the preceding claims, wherein the potting compound (12) is UV-cured. 10. A method for producing a light module 1 according to one or more of the preceding claims with the steps:
Aufbringen der Precursor-Moleküle (20) zumindest auf eine oder mehrere zu vergießenden Oberflächen (14 - 18) des Leuchtmoduls (1), Applying the precursor molecules (20) to at least one or more surfaces (14-18) of the light module (1) to be cast,
- Vergießen zumindest einer oder mehrerer Oberflächen (14 - 18) des Leuchtmoduls (1) mit einer Vergussmas- se (12) . Verfahren nach Anspruch 10, wobei nach dem Aufbringen und vor dem Vergießen die Precursor-Moleküle (20) durch zumindest eine Plasmabehandlung behandelt werden . - Pouring at least one or more surfaces (14-18) of the lighting module (1) with a Vergussmas- se (12). The method of claim 10, wherein after the application and before the casting, the precursor molecules (20) are treated by at least one plasma treatment.
PCT/EP2013/066895 2012-08-14 2013-08-13 Lighting module and method for the production of such a lighting module WO2014026978A1 (en)

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