WO2014009453A1 - Dispositif d'adaptation d'impedance - Google Patents
Dispositif d'adaptation d'impedance Download PDFInfo
- Publication number
- WO2014009453A1 WO2014009453A1 PCT/EP2013/064654 EP2013064654W WO2014009453A1 WO 2014009453 A1 WO2014009453 A1 WO 2014009453A1 EP 2013064654 W EP2013064654 W EP 2013064654W WO 2014009453 A1 WO2014009453 A1 WO 2014009453A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit
- spring
- conductive
- line
- ground plane
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
Definitions
- the invention relates to an electronic impedance matching device.
- the field of the invention is the microwave domain including in particular that of photoconductive systems.
- the adaptation systems known to date are fixed and not optimizable. Their performances depend on the type of line chosen, the quality of soldering and the properties of the useful components (photoconductors, property of the substrate of the line and materials ). In versions using metal housings, the shielding function is provided but does not optimize performance in terms of impedance matching.
- the invention aims to optimize the performance of an impedance matching device comprising for example a microstrip circuit surrounded by a metal casing.
- This circuit can be loaded by a photoconductor which we want to recover the electrical response.
- the object of the invention is to provide a robust device whose performance in terms of impedance matching is optimized in a relatively wide frequency band (greater than GHz).
- the invention meets requirements strict: the transmitted signals must not be damaged in the useful band.
- the invention relates to an impedance matching device comprising a circuit composed of a plane substrate on which at least one conductive line and a ground plane are arranged, characterized in that this ground plane is positioned directly on a wall. internal conductor housing and in that this device comprises at least one conductive spring, having at least one variable characteristic, arranged on the line side and applying a mechanical stress on the circuit with a set screw to compress the plane mass against said inner wall.
- the circuit may be a microstrip line or a slotline. It may include coplanar lines ("planar waveguides”) or strip lines ("striplines").
- the springs may be arranged symmetrically with respect to the conductive lines.
- each spring has at least one variable characteristic, for example the number of turns exceeding a ground plane, the space between the turns, or the length of a central core.
- Each spring may have a spring size adjusting screw, or a central screw-shaped core whose tightening determines the length inside the spring.
- Figures 1A and 1B illustrate a microstrip line respectively in perspective and in cross section.
- FIG. 2 illustrates the device of the invention.
- FIG. 3 illustrates an exemplary embodiment of the device of the invention.
- FIG. 4 illustrates the frequency responses of the reflection coefficients (Sij) in the case where the circuit is not equipped with springs and in the case where it is equipped with springs as in the microstrip circuit of the invention.
- FIG. 5 shows curves illustrating the comparison of percussion responses between two operational circuits: an organized circuit according to the invention and a non-optimized circuit without springs.
- microstrip lines are an extension of the microwave technology to printed circuits. They have many advantages, including their small size, their lightness and ease of integration into a housing. In return, they can not transmit significant power and can only radiate locally.
- Microband lines are widely used in the manufacture of microwave circuits. In this type of line, as illustrated in FIGS. 1A and 1B, the electric field lines E and magnetic lines H are mainly concentrated in the dielectric of the substrate 12 between the metallized line 10 and the ground plane 11, although a weak portion is also found in the air above the substrate. Strictly speaking, the exact fields of a microstrip structure correspond to a TM-TE wave. In practice, the fields are quasi-TEM because the thickness of the dielectric is very small compared to the wavelength.
- TE represents an electric tranverse mode
- TM represents a magnetic tranverse mode
- TEM represents an electro-magnetic tranverse mode, which is characterized by transverse components only in x and y (the components E z and H z are zero. ).
- the circuit 20 is enclosed here, for example a line "adapted" microstrip 26 disposed on a substrate 27, in a conductive housing 21 provided with a cover 25.
- a line "adapted" microstrip 26 disposed on a substrate 27, in a conductive housing 21 provided with a cover 25.
- the reference 28 corresponds to an external power supply input (for example the polarization in the case of a photoconductor).
- the springs 22 have two essential roles in the device of the invention: they allow first of all to compress the ground plane 23 of the circuit 20 against the inner wall 24 of the conductive housing 21, then locally induce inductive coupling with the Thus, the inner radiation in the vicinity of the line is partly coupled with the conductive housing 21.
- the compression of the springs 22 makes it possible to slightly modify the impedance of the line and thus makes it possible to improve the adaptation of the circuit and so the transmission in the line.
- a vector network analyzer is used. The port of the analyzer is calibrated before connection to make a measurement of the S parameter in reflection. If one uses the port 3 of the analyzer, one speaks about the parameter S33.
- the adjustment consists in compressing the springs on the circuit by screws placed on the surface of the upper cover.
- 31 corresponds to an optical input
- 32 to the external power supply
- 33 to an electrical output (SMA or other) and measurement of the reflection coefficient.
- the optimization consists of reducing the S33 (in dB) in the frequency band defined by the device of the invention. Indeed, there is a relationship between the reflection coefficient (Sij) and the input impedance (Ze) seen by the network analyzer. The closer the circuit has an impedance close to the normalized impedance (50 ⁇ ), the lower the response reflected by the system.
- Curve I corresponds to the device of the invention, comprising a closed casing with springs, and curve II to a casing closed without springs. If a threshold of -10 dB is taken as a criterion, an increase (of approximately 15% in the illustrated example) in the frequency band in which the circuit is impedance is noted.
- the device of the invention has the advantage of optimizing the adapted circuit and thus of improving the performance in terms of impedance matching in the frequency band of the system.
- Bandwidth depends mainly on intrinsic characteristics of the semiconductor and the quality of the connections.
- the use of the springs improves the impedance matching at the output of a photoconductor and makes it possible to focus this device. Indeed, the more the circuit is adapted, the greater the bandwidth and the better the transfer function of the circuit. This improvement results in a decrease in the back bounces and a good restitution of the fronts during transients.
- the device of the invention makes it possible to improve the performance of the circuits mounted in metal shells.
- the equidistributed contact between the ground plane of the circuit and the housing is a sine qua non condition to ensure good electrical performance (low reflection coefficient and therefore better impedance matching seen from the output connector).
- the fact of adding the conductive springs indeed compresses the circuit and thus allows a slight coupling between the field radiated by the line and the closed conductive housing.
- the invention contributes to modifying the transfer function of the planar circuit and thus makes it possible to reduce rebound phenomena during fast transients.
- the device of the invention can be used for a semiconductor-based device having the ability to detect radiation from the optical domain and transform it into an electrical signal (photodiode).
- this type of device is regularly used to characterize optical signals from measurement chains provided with optical fibers.
- the design of specific laser diagnostics requires the use of photodiodes whose performance is directly related to the selected components but also to the means set up to adapt the output of the product.
- the development and use of fiber devices may also employ such a photon-electron converting means in a more or less severe environment, subjected to electromagnetic disturbances in radiated mode.
- the device thus produced is industrializable and can be used in the field of telecommunications or research.
Landscapes
- Waveguides (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112013003497.2T DE112013003497T5 (de) | 2012-07-12 | 2013-07-11 | Impedanzanpassungsgerät |
US14/413,332 US9467114B2 (en) | 2012-07-12 | 2013-07-11 | Impedance-matching device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1256730 | 2012-07-12 | ||
FR1256730A FR2993412B1 (fr) | 2012-07-12 | 2012-07-12 | Dispositif d'adaptation d'impedance |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014009453A1 true WO2014009453A1 (fr) | 2014-01-16 |
Family
ID=47351795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/064654 WO2014009453A1 (fr) | 2012-07-12 | 2013-07-11 | Dispositif d'adaptation d'impedance |
Country Status (4)
Country | Link |
---|---|
US (1) | US9467114B2 (fr) |
DE (1) | DE112013003497T5 (fr) |
FR (1) | FR2993412B1 (fr) |
WO (1) | WO2014009453A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10693236B2 (en) | 2016-02-03 | 2020-06-23 | Waymo Llc | Iris matched PCB to waveguide transition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02243001A (ja) * | 1989-03-16 | 1990-09-27 | Fujitsu Ltd | Mmic調整補助装置およびそれを用いたmmicの調整方法 |
US6292073B1 (en) * | 1998-10-26 | 2001-09-18 | The United States Of America As Represented By The Secretary Of The Air Force | Solderless circuit interconnect having a spring contact passing through an aperture |
US20040051620A1 (en) * | 2002-09-12 | 2004-03-18 | Kung-Chao Tung | Externally adjustable impedance transformer |
US20080258848A1 (en) * | 2007-04-19 | 2008-10-23 | Raytheon Company | Spring loaded microwave interconnector |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3505619A (en) * | 1968-10-17 | 1970-04-07 | Westinghouse Electric Corp | Microwave stripline variable attenuator having compressible,lossy dielectric material |
DE19620932C1 (de) * | 1996-05-24 | 1997-08-21 | Bosch Gmbh Robert | Planarer Filter mit ferroelektrischen und/oder antiferroelektrischen Elementen |
KR101744979B1 (ko) * | 2010-11-25 | 2017-06-20 | 엘지이노텍 주식회사 | 멤스를 이용한 튜너 모듈 |
FR2979684B1 (fr) | 2011-09-07 | 2014-08-08 | Commissariat Energie Atomique | Dispositif de deplacement relatif de deux pieces sous pression differentielle |
-
2012
- 2012-07-12 FR FR1256730A patent/FR2993412B1/fr active Active
-
2013
- 2013-07-11 WO PCT/EP2013/064654 patent/WO2014009453A1/fr active Application Filing
- 2013-07-11 DE DE112013003497.2T patent/DE112013003497T5/de not_active Withdrawn
- 2013-07-11 US US14/413,332 patent/US9467114B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02243001A (ja) * | 1989-03-16 | 1990-09-27 | Fujitsu Ltd | Mmic調整補助装置およびそれを用いたmmicの調整方法 |
US6292073B1 (en) * | 1998-10-26 | 2001-09-18 | The United States Of America As Represented By The Secretary Of The Air Force | Solderless circuit interconnect having a spring contact passing through an aperture |
US20040051620A1 (en) * | 2002-09-12 | 2004-03-18 | Kung-Chao Tung | Externally adjustable impedance transformer |
US20080258848A1 (en) * | 2007-04-19 | 2008-10-23 | Raytheon Company | Spring loaded microwave interconnector |
Also Published As
Publication number | Publication date |
---|---|
DE112013003497T5 (de) | 2015-04-02 |
US20150155847A1 (en) | 2015-06-04 |
FR2993412A1 (fr) | 2014-01-17 |
FR2993412B1 (fr) | 2015-06-19 |
US9467114B2 (en) | 2016-10-11 |
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