WO2014009042A1 - Support for a movable element and lithography apparatus - Google Patents
Support for a movable element and lithography apparatus Download PDFInfo
- Publication number
- WO2014009042A1 WO2014009042A1 PCT/EP2013/059999 EP2013059999W WO2014009042A1 WO 2014009042 A1 WO2014009042 A1 WO 2014009042A1 EP 2013059999 W EP2013059999 W EP 2013059999W WO 2014009042 A1 WO2014009042 A1 WO 2014009042A1
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- WO
- WIPO (PCT)
- Prior art keywords
- field inducing
- movable element
- torque
- support
- stator
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/044—Active magnetic bearings
- F16C32/0459—Details of the magnetic circuit
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70816—Bearings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Definitions
- the present invention relates to a support for a movable element, a support system comprising a movable element and a support for the movable element, a lithographic or exposure apparatus comprising a projection system having a movable element and a support for the movable element, a method of supporting a movable element, and a device manufacturing method.
- a lithographic or exposure apparatus is a machine that applies a desired pattern onto a substrate or part of a substrate.
- a lithographic or exposure apparatus may be used, for example, in the manufacture of integrated circuits (ICs), flat panel displays and other devices or structures having fine features.
- a patterning device which may be referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of the IC, flat panel display, or other device). This pattern may transferred on (part of) the substrate (e.g. silicon wafer or a glass plate), e.g. via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate.
- the substrate e.g. silicon wafer or a glass plate
- the patterning device may be used to generate other patterns, for example a color filter pattern, or a matrix of dots.
- the patterning device may comprise a patterning array that comprises an array of individually controllable elements that generate the circuit or other applicable pattern.
- a maskless system includes a programmable patterning device (e.g., a spatial light modulator, a contrast device, etc.).
- a programmable patterning device e.g., a spatial light modulator, a contrast device, etc.
- programmable patterning device is programmed (e.g., electronically or optically) to form the desired patterned beam using the array of individually controllable elements.
- Types of programmable patterning devices include micro-mirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, arrays of self-emissive contrast devices, a shutter element/matrix and the like.
- a programmable patterning device could also be formed from an electro-optical deflector, configured for example to move spots of radiation projected onto the substrate or to intermittently direct a radiation beam away from the substrate, for example to a radiation beam absorber. In either such arrangement, the radiation beam may be continuous.
- a lithographic or exposure apparatus may contain one or more movable elements.
- the movable element may be configured to rotate and/or undergo translational movement.
- a gravity compensator may be provided to compensate all or a portion of the weight of the movable element.
- the movable element may be suspended in a contactless manner below the gravity compensator.
- the movable element may be levitated above the gravity compensator.
- An approach to implementing a gravity compensator uses a permanent magnet (to compensate the constant force due to gravity) in combination with a Lorentz actuator (to compensate "AC" or varying forces).
- a permanent magnet to compensate the constant force due to gravity
- a Lorentz actuator to compensate "AC" or varying forces.
- an error in the magnetization of the permanent magnet may tend to cause an unwanted (parasitic) force.
- the parasitic force may have a component perpendicular to the direction of gravity for example.
- the parasitic force may cause a positioning error of the movable element and/or require a complex corrective measure to be employed.
- such an arrangement may generally cause a significant stray field, which may disrupt one or more other elements of the apparatus.
- a reluctance actuator tends to have a lower parasitic force.
- the relationship between the gravity-opposing force and the current applied to the reluctance actuator is non-linear (for example, proportional to the square of the applied current) and it may be difficult to control a torque about one or more axes perpendicular to the gravity-opposing force applied by the actuator.
- a reluctance actuator is prone to high negative stiffness (indicating that the gravity opposing force for a given applied field will tend to decrease relatively quickly with increasing gap size). The stiffness behaves in the manner of an additional coupling and can mediate a resonance and/or disturbance force.
- a support for a movable element comprising: a stator element; a gravity compensator field inducing element mounted on the stator element, the gravity compensator field inducing element configured to apply a translational force to the movable element by controlling a magnetic field in a gap between the stator element and the movable element; and a plurality of torque compensator field inducing elements mounted on the stator element, the torque compensator field inducing elements configured to apply a torque to the movable element by controlling a magnetic field in the gap between the stator element and the movable element, the torque being about a first axis substantially
- an exposure apparatus comprising: a projection system for projecting each of a plurality of radiation beams onto a target, the projection system comprising a stationary element and a movable element; a stator element; a gravity compensator field inducing element mounted on the stator element, the gravity compensator field inducing element configured to apply a translational force to the movable element by controlling a magnetic field in a gap between the stator element and the movable element; and a plurality of torque compensator field inducing elements mounted on the stator element, the torque compensator field inducing elements configured to apply a torque to the movable element by controlling a magnetic field in the gap between the stator element and the movable element, the torque being about a first axis perpendicular to the direction of the translational force applied by the gravity compensator field inducing element.
- a method of supporting a movable element comprising: driving a gravity compensator field inducing element mounted on a stator element to apply a translational force to the movable element by controlling a magnetic field in a gap between the stator element and the movable element; and driving a plurality of torque compensator field inducing elements mounted on the stator element to apply a torque to the movable element by controlling a magnetic field in the gap between the stator element and the movable element, the torque being about a first axis substantially perpendicular to the direction of the translational force applied by the gravity compensator field inducing element.
- a device manufacturing method comprising: projecting each of a plurality of radiation beams onto a target, the projection system comprising a stationary element and a movable element; driving a gravity compensator field inducing element mounted on a stator element to apply a translational force to the movable element by controlling a magnetic field in a gap between the stator element and the movable element; and driving a plurality of torque compensator field inducing elements mounted on the stator element to apply a torque to the movable element by controlling a magnetic field in the gap between the stator element and the movable element, the torque being about a first axis substantially perpendicular to the direction of the translational force applied by the gravity compensator field inducing element.
- Figure 1 depicts a part of a lithographic or exposure apparatus according to an embodiment of the invention
- Figure 2 depicts a top view of a part of the apparatus of Figure 1 according to an embodiment of the invention
- Figure 3 depicts a highly schematic, perspective view of a part of a lithographic or exposure apparatus according to an embodiment of the invention
- Figure 4 depicts a schematic top view of projections by the apparatus according to Figure 3 onto a substrate according to an embodiment of the invention
- Figure 5 depicts in cross-section, a part of an embodiment of the invention
- Figure 6 depicts an example movable element suspended below a support
- Figure 7 is a schematic bottom view of a stator element for a support
- Figure 8 is a schematic top view of the stator element of Figure 7;
- Figure 9 is a schematic side sectional view of the stator element shown in Figure 7;
- Figure 10 is a schematic top view of a plurality of torque
- Figure 1 1 is a schematic top view of a field inducing element of a gravity compensator suitable for engagement with the stator element depicted in Figures 7 to 9;
- Figure 12 is a schematic bottom view of a support comprising a stator element of the type shown in Figures 7 to 9 with field inducing elements of the type shown in Figures 10 and 1 1 mounted thereon;
- Figure 13 is a schematic side sectional view of the support shown in Figure 12;
- Figure 14 is a schematic side sectional view of a stator element comprising a permanent magnet.
- An embodiment of the present invention relates to an apparatus that may include a programmable patterning device that may, for example, be comprised of an array or arrays of self-emissive contrast devices. Further information regarding such an apparatus may be found in PCT patent application publication no. WO 2010/032224 A2, U.S. patent application publication no. US 201 1 -0188016, U.S. patent application no. US 61 /473636 and U.S. patent application no. 61/524190 which are hereby incorporated by reference in their entireties. An embodiment of the present invention, however, may be used with any form of programmable patterning device including, for example, those discussed above.
- Figure 1 schematically depicts a schematic cross-sectional side view of a part of a lithographic or exposure apparatus.
- the apparatus has individually controllable elements substantially stationary in the X-Y plane as discussed further below although it need not be the case.
- the apparatus 1 comprises a substrate table 2 to hold a substrate, and a positioning device 3 to move the substrate table 2 in up to 6 degrees of freedom.
- the substrate may be a resist-coated substrate.
- the substrate is a wafer.
- the substrate is a polygonal (e.g. rectangular) substrate.
- the substrate is a glass plate.
- the substrate is a plastic substrate.
- the substrate is a foil.
- the apparatus is suitable for roll-to-roll manufacturing.
- the apparatus 1 further comprises a plurality of individually controllable self-emissive contrast devices 4 configured to emit a plurality of beams.
- the self-emissive contrast device 4 is a radiation emitting diode, such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode (e.g., a solid state laser diode).
- each of the individually controllable elements 4 is a blue-violet laser diode (e.g., Sanyo model no. DL-3146-151 ).
- the diode may be supplied by companies such as Sanyo, Nichia, Osram, and Nitride.
- the diode emits UV radiation, e.g., having a wavelength of about 365 nm or about 405 nm.
- the diode can provide an output power selected from the range of 0.5 - 200 mW.
- the size of laser diode (naked die) is selected from the range of 100 - 800 micrometers.
- the laser diode has an emission area selected from the range of 0.5 - 5 micrometers 2 .
- the laser diode has a divergence angle selected from the range of 5 - 44 degrees.
- the diodes have a configuration (e.g., emission area, divergence angle, output power, etc.) to provide a total brightness more than or equal to about 6.4 x 1 0 8 W/(m 2 .sr).
- a configuration e.g., emission area, divergence angle, output power, etc.
- the self-emissive contrast devices 4 are arranged on a frame 5 and may extend along the Y-direction and/or the X direction. While one frame 5 is shown, the apparatus may have a plurality of frames 5 as shown in Figure 2.
- Frame 5 and thus self-emissive contrast device 4 and lens 12 are substantially stationary in the X-Y plane.
- self-emissive contrast device 4 and lens 12 may be moved in the Z- direction by actuator 7.
- lens 12 may be moved in the Z-direction by an actuator related to this particular lens.
- each lens 12 may be provided with an actuator.
- the self-emissive contrast device 4 may be configured to emit a beam and the projection system 12, 14 and 1 8 may be configured to project the beam onto a target portion of the substrate.
- the self-emissive contrast device 4 and the projection system form an optical column.
- the apparatus 1 may comprise an actuator (e.g. motor 1 1 ) to move the optical column or a part thereof with respect to the substrate.
- Frame 8 with arranged thereon field lens 14 and imaging lens 1 8 may be rotatable with the actuator.
- a combination of field lens 14 and imaging lens 18 forms movable optics 9.
- the frame 8 rotates about its own axis 10, for example, in the directions shown by the arrows in FIG. 2.
- the frame 8 is rotated about the axis 10 using an actuator e.g. motor 1 1 .
- the frame 8 may be moved in a Z direction by motor 7 so that the movable optics 9 may be displaced relative to the substrate table 2.
- An aperture structure 13 having an aperture therein may be located above lens 12 between the lens 12 and the self-emissive contrast device 4.
- the aperture structure 13 can limit diffraction effects of the lens 12, the associated self-emissive contrast device 4, and/or of an adjacent lens 12 / self-emissive contrast device 4.
- the depicted apparatus may be used by rotating the frame 8 and simultaneously moving the substrate on the substrate table 2 underneath the optical column.
- the self-emissive contrast device 4 can emit a beam through the lenses 12, 14, and 18 when the lenses are substantially aligned with each other. By moving the lenses 14 and 1 8, the image of the beam on the substrate is scanned over a portion of the substrate. By simultaneously moving the substrate on the substrate table 2 underneath the optical column, the portion of the substrate which is subjected to an image of the self- emissive contrast device 4 is also moving.
- a desired pattern can be imaged in the resist layer on the substrate.
- FIG. 2 depicts a schematic top view of the apparatus of Figure 1 having self-emissive contrast devices 4.
- the apparatus 1 comprises a substrate table 2 to hold a substrate 17, a positioning device 3 to move the substrate table 2 in up to 6 degrees of freedom, an alignment/level sensor 1 9 to determine alignment between the self-emissive contrast device 4 and the substrate 17, and to determine whether the substrate 17 is at level with respect to the projection of the self- emissive contrast device 4.
- the substrate 17 has a rectangular shape, however also or alternatively round substrates may be processed.
- the self-emissive contrast device 4 is arranged on a frame 15.
- the self-emissive contrast device 4 may be a radiation emitting diode, e.g., a laser diode, for instance a blue-violet laser diode.
- the self- emissive contrast devices 4 may be arranged into an array 21 extending in the X-Y plane.
- the array 21 may be an elongate line. In an embodiment, the array 21 may be a single dimensional array of self-emissive contrast devices 4. In an embodiment, the array 21 may be a two dimensional array of self-emissive contrast device 4.
- a rotating frame 8 may be provided which may be rotating in a direction depicted by the arrow.
- the rotating frame may be provided with lenses 14, 18 (show in Figure 1 ) to provide an image of each of the self- emissive contrast devices 4.
- the apparatus may be provided with an actuator to rotate the optical column comprising the frame 8 and the lenses 14, 18 with respect to the substrate.
- Figure 3 depicts a highly schematic, perspective view of the rotating frame 8 provided with lenses 14, 18 at its perimeter.
- a plurality of beams in this example 10 beams, are incident onto one of the lenses and projected onto a target portion of the substrate 17 held by the substrate table 2.
- the plurality of beams are arranged in a straight line.
- the rotatable frame is rotatable about axis 10 by means of an actuator (not shown).
- the beams will be incident on successive lenses 14, 18 (field lens 14 and imaging lens 18) and will, incident on each successive lens, be deflected thereby so as to travel along a part of the surface of the substrate 17, as will be explained in more detail with reference to Fig. 4.
- each beam is generated by a respective source, i.e. a self-emissive contrast device, e.g. a laser diode (not shown in Figure 3).
- a self-emissive contrast device e.g. a laser diode (not shown in Figure 3).
- the beams are deflected and brought together by a segmented mirror 30 in order to reduce a distance between the beams, to thereby enable a larger number of beams to be projected through the same lens and to achieve resolution requirements to be discussed below.
- FIG. 4 depicts a highly schematic top view of a part of the rotatable frame 8.
- a first set of beams is denoted by B1
- a second set of beams is denoted by B2
- a third set of beams is denoted by B3.
- Each set of beams is projected through a respective lens set 14, 1 8 of the rotatable frame 8. As the rotatable frame 8 rotates, the beams B1 are projected onto the substrate 17 in a scanning movement, thereby scanning area A14.
- beams B2 scan area A24 and beams B3 scan area A34.
- the substrate 17 and substrate table are moved in the direction D, which may be along the X axis as depicted in Figure 2), thereby being substantially perpendicular to the scanning direction of the beams in the area's A14, A24, A34.
- a second actuator e.g.
- successive scans of the beams when being projected by successive lenses of the rotatable frame 8 are projected so as to substantially abut each other, resulting in substantially abutting areas A1 1 , A12, A13, A14 (areas A1 1 , A12, A13 being previously scanned and A14 being currently scanned as shown in Figure 4) for each successive scan of beams B1 , areas A21 , A22, A23 and A24 (areas A21 , A22, A23 being previously scanned and A24 being currently scanned as shown in Figure 4) for beams B2 and areas A31 , A32, A33 and A34 (areas A31 , A32, A33 being previously scanned and A34 being currently scanned as shown in Figure 4) for beams B3.
- the areas A1 , A2 and A3 of the substrate surface may be covered with a movement of the substrate in the direction D while rotating the rotatable frame 8.
- the projecting of multiple beams through a same lens allows processing of a whole substrate in a shorter timeframe (at a same rotating speed of the rotatable frame 8), since for each passing of a lens, a plurality of beams scan the substrate with each lens, thereby allowing increased displacement in the direction D for successive scans.
- the rotating speed of the rotatable frame may be reduced when multiple beams are projected onto the substrate via a same lens, thereby possibly reducing effects such as deformation of the rotatable frame, wear, vibrations, turbulence, etc.
- the plurality of beams are arranged at an angle to the tangent of the rotation of the lenses 14, 18 as shown in Figure 4. In an embodiment, the plurality of beams are arranged such that each beam overlaps or abuts a scanning path of an adjacent beam.
- a further effect of the aspect that multiple beams are projected at a time by the same lens may be found in relaxation of tolerances. Due to tolerances of the lenses (positioning, optical projection, etc), positions of successive areas A1 1 , A12, A13, A14 (and/or of areas A21 , A22, A23 and A24 and/or of areas A31 , A32, A33 and A34) may show some degree of positioning inaccuracy in respect of each other. Therefore, some degree of overlap between successive areas A1 1 , A1 2, A13, A14 may be required. In case of for example 1 0% of one beam as overlap, a processing speed would thereby be reduced by a same factor of 10% in case of a single beam at a time through a same lens.
- the apparatus may be arranged to operate the second actuator so as to move the substrate with respect to the optical column to have a following projection of the beam to be projected in the spacing.
- the beams may be arranged diagonally in respect of each other, in respect of the direction D.
- the spacing may be further reduced by providing a segmented mirror 30 in the optical path, each segment to reflect a respective one of the beams, the segments being arranged so as to reduce a spacing between the beams as reflected by the mirrors in respect of a spacing between the beams as incident on the mirrors.
- Such effect may also be achieved by a plurality of optical fibers, each of the beams being incident on a respective one of the fibers, the fibers being arranged so as to reduce along an optical path a spacing between the beams downstream of the optical fibers in respect of a spacing between the beams upstream of the optical fibers.
- an integrated optical waveguide circuit having a plurality of inputs, each for receiving a respective one of the beams.
- the integrated optical waveguide circuit is arranged so as to reduce along an optical path a spacing between the beams downstream of the integrated optical waveguide circuit in respect of a spacing between the beams upstream of the integrated optical waveguide circuit.
- a system may be provided for controlling the focus of an image projected onto a substrate.
- the arrangement may be provided to adjust the focus of the image projected by part or all of an optical column in an arrangement as discussed above.
- the projection system projects the at least one radiation beam onto a substrate formed from a layer of material above the substrate 17 on which a device is to be formed so as to cause local deposition of droplets of the material (e.g. metal) by a laser induced material transfer.
- a material e.g. metal
- a radiation beam 200 is focused through a substantially transparent material 202 (e.g., glass) at an intensity below the plasma breakdown of the material 202.
- a substantially transparent material 202 e.g., glass
- Surface heat absorption occurs on a substrate formed from a donor material layer 204 (e.g., a metal film) overlying the material 202.
- the heat absorption causes melting of the donor material 204.
- the heating causes an induced pressure gradient in a forward direction leading to forward acceleration of a donor material droplet 206 from the donor material layer 204 and thus from the donor structure (e.g., plate) 208.
- the donor material droplet 206 is released from the donor material layer 204 and is moved (with or without the aid of gravity) toward and onto the substrate 1 7 on which a device is to be formed.
- a donor material pattern can be deposited on the substrate 17.
- the beam is focused on the donor material layer 204.
- one or more short pulses are used to cause the transfer of the donor material.
- the pulses may be a few picoseconds or femto-seconds long to obtain quasi one dimensional forward heat and mass transfer of molten material.
- Such short pulses facilitate little to no lateral heat flow in the material layer 204 and thus little or no thermal load on the donor structure 208.
- the short pulses enable rapid melting and forward acceleration of the material (e.g., vaporized material, such as metal, would lose its forward directionality leading to a splattering deposition).
- the short pulses enable heating of the material to just above the heating temperature but below the vaporization temperature. For example, for aluminum, a temperature of about 900 to 1000 degrees Celsius is desirable.
- an amount of material is transferred from the donor structure 208 to the substrate 17 in the form of 100-1 000 nm droplets.
- the donor material comprises or consists essentially of a metal.
- the metal is aluminum.
- the material layer 204 is in the form a film.
- the film is attached to another body or layer. As discussed above, the body or layer may be a glass.
- Figure 6 depicts an example arrangement in which a support 40 is configured to apply a force 46 to a movable element 8 in order to suspend the movable element 8 beneath the support 40 in a contactless manner.
- the force 46 thus "compensates" for the force of gravity on the movable element.
- the movable element 8 is configured to rotate about axis 44 substantially parallel to the direction of gravity.
- the movable element 8 is configured to rotate about one or more other axes and/or to undergo translational movement.
- the movable element 8 may correspond, for example, to the frame 8 holding the field lenses 14 and the imaging lenses 18. Movement of the movable element 8 is driven by motor 1 1 (which may be referred to as a movable element driver).
- the support 40 comprises a stator element and field inducing elements mounted on the stator element (described in detail below).
- the field inducing elements control a magnetic field in a gap 42 between the stator element of the support 40 and the movable element 8.
- the field inducing elements may comprise coils or other elements to support an electrical current.
- the coils or other elements may be mounted on the stator element by a winding process.
- a support driver 95 is provided to drive the field inducing elements (e.g. to drive an electrical current through the field inducing elements).
- the field inducing elements induce a magnetic field in the stator element and in the gap 42 adjacent to the stator element.
- the gap is arranged to have a thickness in the range of 0.1 -10 mm, optionally 1 -5 mm, optionally about 3 mm.
- the field inducing elements comprise a gravity compensator field inducing element and a plurality of torque compensator field inducing elements (which may or may not be separate from each other).
- the gravity compensator field inducing element is configured to apply a translational force to the movable element 8 (e.g. in a direction opposed to gravity) by controlling a magnetic field in the gap 42.
- the torque compensator field inducing elements are configured to apply a torque to the movable element by controlling the magnetic field in the gap 42.
- the gravity compensator field inducing element can be driven independently of the torque compensator field inducing elements (e.g.
- a current can be driven through the field inducing element while no current or a different current is driven through each of the torque compensator field inducing elements).
- the process of supporting the weight of the movable element 8 can thus be performed separately to the process of correcting for torque applied to the movable element 8.
- the torque compensator field inducing elements are configured to apply a torque about a first axis 48 substantially
- the applied torque may compensate for a torque applied to the movable element 8 from a source, for example, other than the torque compensator field inducing elements.
- the torque compensator field inducing elements are configured to apply a torque about a second axis 50 (into the page in the orientation of Figure 6) substantially perpendicular to the first axis 48 and to the direction of the translational force applied by the gravity compensator field inducing element (upwards in the orientation of Figure 6).
- the torque applied about the first axis 48 can be controlled independently of the torque applied about the second axis 50.
- the field inducing elements of the support 40 apply a force and/or torque to the movable element 8 by varying the size (strength) of the magnetic field in the gap 42.
- the process may be considered as based on the reluctance principle.
- the force and/or torque acts so as to reduce the field energy associated with a magnetic circuit defined by the stator element and the gap 42.
- the movable element 8 comprises a material having high relative permeability, for example substantially greater than the magnetic permeability of air or vacuum.
- the relative permeability may be greater than 10 at room temperature and for fields less than 0.002 T for example.
- the material may be a magnetically soft material for example.
- the magnetic field energy associated with the field is lower when the field traverses a material with high permeability than when the field traverses air or vacuum.
- a force is thereby applied to the movable element 8. The force is directed into the gap 42 (trying to reduce the size of the gap and thereby the field energy associated with the magnetic circuit).
- a gravity compensator using a permanent magnet in combination with a Lorentz actuator may be prone to a parasitic force due to an error in the magnetization of the permanent magnet.
- a permanent magnet on the movable element 8 may introduce an AC parasitic force (acting for example between the movable element 8 and a stationary part of the support) at a frequency corresponding to the rotational frequency or higher.
- a permanent magnet on the stationary part of the support may introduce a DC parasitic force. This problem is avoided or mitigated by using the above-described reluctance mechanism to provide at least part of the gravity opposing force.
- the accuracy of the support is improved by providing the integral torque compensation for axes perpendicular to the direction of gravity.
- a stray field is reduced.
- a stray field can disrupt a nearby element of the apparatus, for example by inducing an eddy current and/or resistive heating and/or by introducing a parasitic force.
- a single stator element engages both with the gravity compensator field inducing element and with the torque compensator field inducing elements.
- the stator element comprises one or more parts that engage predominantly with the gravity compensation field inducing element (e.g. pass through one or more loops defined by the gravity compensation field inducing element) and one or more other parts that engage predominantly with the torque compensator field inducing elements (e.g. pass through loops defined by the torque
- compensator stator parts may be integral with one or more of the torque compensator stator parts.
- a plurality of separate stator elements is provided (e.g. stator elements that are not-integral with each other and/or are spaced apart from each other).
- one or more of the gravity compensator stator elements are separate from one or more of the torque compensator stator elements.
- Figures 7 to 9 illustrate an example of a stator element 52 that is configured to engage both with the gravity compensator field inducing element and with the torque compensator field inducing elements.
- Figure 7 is a schematic bottom view of the stator element 52.
- Figure 8 is a schematic top view of the stator element 52 (with hidden interfaces shown by broken lines).
- Figure 9 is a schematic side sectional view along line AA of Figure 7.
- the depicted stator element 52 comprises a first part 54 configured to act predominantly as a stator for a gravity compensator field inducing element.
- the first part 54 has a hollow cylindrical form.
- the first part 54 takes another form.
- the stator element 52 shown also comprises four further parts 56A, 56B, 56C and 56D.
- the further parts 56A-D act predominantly as stator elements for the torque compensator field inducing elements.
- each of the further parts comprises a quarter of a hollow cylinder (formed for example by dividing the cylinder by two perpendicular planes having a line of intersection along the axis of the cylinder).
- the first part 54 and the further parts 56A-D are connected together by the base 58 of the stator element 52.
- the base 58 provides a flat surface.
- the region below the base 58 and between the first part 54 and further parts 56A-D of the stator element 52 defines a trough within which gravity compensator and/or torque compensator field inducing elements can be located (as shown in Figures 12 and 13 for example).
- a cylindrical hole 60 traverses the stator element 52 in the longitudinal direction.
- the first part 54 of the stator element 52 is integrally connected to the further parts 56A-D via the base 58. This approach facilitates manufacture because only a single element needs to be formed. In other embodiments, the first part 54 is separated from one or more of the further parts 56A-D.
- one or more of the cylindrical elements referred to above is/are axially aligned substantially parallel to the smallest dimension of the gap 42 and/or substantially parallel to the direction of the translational force applied by the gravity compensator field inducing element.
- the gap is bounded by a planar surface of the stator element 52 on one side and by a planar surface of the movable element 8 on the other side.
- the gap 42 takes the form of a flat, hollow cylinder (with the central missing portion corresponding to the cylindrical hole 60).
- the plurality of torque compensator field inducing elements are configured to control a spatial variation in the size of the magnetic field in the gap 42 between the stator element 52 and the movable element 8.
- Making the size of the magnetic field non-uniform for example makes it possible to apply a torque to the movable element 8 (or compensate a torque applied by another element) about one or more axes substantially perpendicular to the direction of gravity.
- driving a current through a field inducing element e.g. coil
- a field inducing element e.g. coil
- a current may be driven through another field inducing element in such a way as to increase the field in a second region of the gap 42 by a corresponding amount.
- substantially equal and opposite forces are applied at the first and second regions, resulting in a torque about an axis lying in between the two regions that does not affect the gravity compensation.
- the forces applied by the torque compensator field inducing elements are deliberately controlled so as to provide a net force in the direction of gravity.
- the torque compensator field inducing elements can be configured to provide control of the force substantially parallel to gravity that is independent of the force applied by the gravity compensator field inducing element.
- the current applied to the gravity compensator field inducing element is kept substantially constant (e.g. at a level equal or approximately equal to the nominal weight of the movable element 8), while a dynamic variation in the force applied to the movable element substantially parallel to gravity is corrected using the torque compensator field inducing elements.
- Figure 10 depicts an example plurality of torque compensator field inducing elements (e.g. coils).
- four field inducing elements 66A-D are provided.
- the four field inducing elements 66A-D are configured so that they can be mounted on a stator element 52 having the geometry shown in Figures 7 to 9.
- the field inducing element 66A is configured so that it can be mounted (e.g. wound) onto the further part 56A of the stator element 52
- field inducing element 66B is configured to be mounted on the further part 56B
- field inducing element 66C is configured to be mounted on the further part 56C
- field inducing element 66D is configured to be mounted on the further part 56D.
- openings 68A-D are provided in the stator element 52 to allow the field inducing element 56A-D to be mounted (e.g. wound) around the stator parts 56A-B.
- the field inducing element 66A will pass through openings 68A and 68B
- field inducing element 66B will pass through openings 68B and 68C
- field inducing element 66C will pass through openings 68C and 68D
- field inducing element 66D will pass through openings 68D and 68A.
- slots 70 are provided that extend from the opening 68A-D to the leading edge of the stator parts 56A-D (i.e. upwards in the orientation shown in Figure 9).
- the slots 70 thus help ensure that the openings are not surrounded by a closed loop of material.
- the slots may reduce an eddy current and/or facilitate a process of mounting (e.g.
- a torque about the first axis 48 can be applied by arranging for the current 72 in the field inducing element 66A to circulate in the opposite sense to the current 72 in the field inducing element 66C.
- the magnetic field 79 generated by the current 72 in the field inducing element 66A will be opposite in direction (out of the page in the example shown) to the magnetic field 77 generated by the current 72 in the field inducing element 66C (into the page in the example shown).
- the magnetic field in the region of the gap 42 directly below the field inducing element 66A will thus be changed in an opposite sense to the magnetic field in the region of the gap 42 directly below the field inducing element 66C.
- a torque can be applied about the second axis 50 by arranging for the current 72 in the field inducing element 66B to circulate in an opposite sense to the current 72 in the field inducing element 66D (see magnetic field contributions 79 and 77 respectively for the field inducing elements 66B and 66D).
- the torque compensator field inducing elements comprises only three field inducing elements rather than, for example, four.
- the three field inducing elements are arranged in the same way as in Figure 10 except that the cylinder is divided into three parts rather than four parts (each therefore extending through 1 20° rather than through 90 °).
- the torque compensator field inducing elements comprises more than four field inducing elements.
- one or more gravity compensator field inducing elements are provided that are separate from the torque compensator field inducing elements.
- the gravity compensator field inducing element is drivable separately from the torque compensator field inducing elements.
- Figure 1 1 is a schematic top view of an example gravity
- FIG. 80 shows an example direction of current circulating in the field inducing element 80.
- the resulting field 81 would be directed into the page and would be distributed predominantly in the portion of the stator element 54 radially inside of the element 80 (shown for reference by broken line 54).
- the field inducing element 80 is cylindrical in the example shown and dimensioned so as to be mountable within the trough below the base 58 of stator element 52 of the type shown in Figures 7 to 9. The axis of the cylindrical field inducing element 80 when mounted thus coincides with the axis of the cylindrical part 54 of the stator element 52.
- Increasing the size of current 82 increases the size of the magnetic field in the gap 42 and increases the size of the attractive force (i.e. the reluctance-based force opposing gravity) between the stator element 52 and the movable element 8. Decreasing the size of the current 82 decreases the size of the attractive force.
- Figure 12 is a schematic bottom view of the stator element shown in Figures 7 to 9 with the field inducing elements shown in Figures 10 and 1 1 mounted thereon.
- Figure 13 is a schematic side sectional view along broken line A-A of the assembly of Figure 12.
- two cylindrical field inducing element 80 are provided.
- the two cylindrical field inducing elements 80 are axially aligned.
- the two cylindrical field inducing elements sandwich radially inner portions of the torque compensator field inducing elements 66A-D.
- a single field inducing element 80 is provided or more than two field inducing elements 80 are provided. In an embodiment, more than one layer of the torque compensator field inducing element 66A-D are provided, for example sandwiching one or more gravity compensator field inducing elements.
- FIG 14 illustrates an embodiment in which a permanent magnet 96 is incorporated into a stator element 92.
- a support using such a stator element 92 may be referred to as a hybrid reluctance actuator.
- the geometry and dimensions of the stator element 92 are the same as the geometry and dimensions of the stator element 52 depicted in Figures 7 to 9, 12 and 1 3.
- a difference is that part of the material forming the stator element 92 comprises permanent magnet material, whereas in the stator element 52 all of the stator element is formed from soft magnetic material.
- the stator element 92 is thus suitable for receiving gravity and torque compensator field inducing elements having the geometry depicted in Figures 10 and 1 1 .
- the stator element with a permanent magnet may have a different geometry from the stator element 52 depicted in Figures 7 to 9, 12 and 1 3.
- the permanent magnet 96 has a hollow cylindrical form. Portion 96' represents the part of the magnet 96 that is curving (concave) into the plane of the page. Relative to the stator element 52 depicted in Figures 7 to 9, 12 and 13, the permanent magnet 96 may be considered as notionally replacing a portion of the stator element part 54.
- the permanent magnet 96 is configured to provide at least a portion of the force 98 that opposes the force of gravity on the movable element 8 by contributing to the field in the gap 42 between the stator element 52 and the movable element 8.
- the portion of the force provided by the permanent magnet represents the majority of the force required (e.g.
- the gravity compensator field inducing element 80 is required only to fine tune the force to support the movable element 8 and/or to correct for dynamic variation in the force applied to the movable element 8 and/or in the position of the movable element 8 substantially parallel to the direction of gravity. In an embodiment, no separate gravity compensator field inducing element is provided. In an example of such an embodiment, fine tuning (or correction of dynamic variation in force or position) of the gravity compensation is performed by other means.
- fine tuning (or correction of dynamic variation in force or position) of the gravity compensation is performed by field inducing elements that operate both as torque compensator field inducing elements and as gravity compensator field inducing elements.
- field inducing elements of the type shown in Figure 1 0 could be used to fine tune the gravity compensation and could therefore be considered as both gravity compensator field inducing elements and torque compensator field inducing elements.
- the presence of the permanent magnet 96 may reduce the size of the current driven through a field inducing element to provide the gravity opposing force. Electrical loss and/or heat load associated with the current is therefore reduced. Additionally, the negative stiffness associated with the reluctance mechanism is lower in comparison to a support having a stator element with no permanent magnet. This is because with a permanent magnet in the magnetic circuit instead of soft magnetic material, the magnetic field variation (force variation) as a function of gap size is much smaller due to the fact that the permanent magnet material will have a relative permeability (typically in the region of 1 .05, similar to air) that is much lower than the relative permeability of a soft magnetic material. A variation in the size of the gap thus results in relatively less variation in magnetic resistance in the system than would be the case in an embodiment based on a stator element formed purely from soft magnetic material (with no permanent magnet).
- a stator element comprising a permanent magnet removes (or reduces the predominance of) the non-linear relationship between the size of a force generated by driving a current through a field inducing element mounted on the stator element (e.g. a field inducing element configured purely to apply a translational force, such as a gravity compensator field inducing element, or a field inducing element configured selectively to apply either or both of a translation force or a torque), thus facilitating for example the control of dynamic forces acting on the movable element.
- a field inducing element mounted on the stator element
- a field inducing element configured purely to apply a translational force, such as a gravity compensator field inducing element, or a field inducing element configured selectively to apply either or both of a translation force or a torque
- the predominantly linear relationship between current and corrective force can also apply where a permanent magnet is not used but where a main field inducing element is used to compensate all or a majority of the gravity force and an additional field inducing element (e.g. one or more of the torque compensator field inducing elements), or an additional current superimposed on the current through the main field inducing element, is used to provide the corrective force, as long as the corrective force/torque is not too high (e.g. the corrective force is at least 80% smaller than the force used to compensate gravity).
- an additional field inducing element e.g. one or more of the torque compensator field inducing elements
- a field homogenizing element 94 is provided between the permanent magnet 96 and the gap 42 between the stator element and the movable element 8.
- the field homogenizing element 94 has a hollow cylindrical form corresponding to the hollow cylindrical form of the permanent magnet 96 (having the substantially same size and/or geometry when viewed along the cylinder axis).
- the field homogenizing element 94 comprises a material of high relative permeability, e.g. a magnetically soft material.
- the field homogenizing element 94 comprises a plate of magnetically soft material.
- a magnetically soft material is easily magnetized but does not retain its magnetization.
- magnetically soft materials include ferromagnetic material, for example based on an iron and nickel alloy, or ferrimagnetic material, for example based on a ceramic oxide (above the Curie temperature).
- the field homogenizing element 94 comprises a plate of magnetically soft material.
- a magnetically soft material is easily magnetized but does not retain its magnetization.
- magnetically soft materials include ferromagnetic material, for example based on an iron and nickel alloy, or ferrimagnetic material, for example based on a ceramic oxide (above the Curie temperature).
- the field homogenizing element 94 comprises a plate of magnetically soft material.
- a magnetically soft material is easily magnetized but does not retain its magnetization.
- magnetically soft materials include ferromagnetic material, for example based on an iron and nickel alloy, or ferrimagnetic material, for example based on a ceramic oxide
- homogenizing element has a relative permeability of 10 or greater (at room temperature and for applied fields of less than 0.002T).
- the field homogenizing element 94 reduces the effect of an error, for example an alignment error, in the magnetization of the permanent magnet 96.
- an error for example an alignment error
- homogenizing element 94 is such as to redirect magnetic field lines leaving the permanent magnet so that they become more evenly spaced and/or more perpendicular to the gap 42 between the stator element and the movable element 8.
- a material with high magnetic permeability facilitates this functionality because field lines will tend to leave such a material
- a device such as a display, integrated circuit or any other item may be manufactured from the substrate on which the pattern has been projected.
- lithographic or exposure apparatus in the manufacture of ICs
- the lithographic or exposure apparatus described herein may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc.
- LCDs liquid-crystal displays
- any use of the terms “wafer” or “die” herein may be considered as synonymous with the more general terms “substrate” or “target portion”, respectively.
- the substrate referred to herein may be processed, before or after exposure, in for example a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist), a metrology tool and/or an inspection tool. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already contains multiple processed layers.
- lens may refer to any one of various types of optical components, including refractive, diffractive, reflective, magnetic, electromagnetic and electrostatic optical components or
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Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015520859A JP6025978B2 (en) | 2012-07-12 | 2013-05-15 | Support for movable element, exposure apparatus, and device manufacturing method |
| US14/413,667 US9535340B2 (en) | 2012-07-12 | 2013-05-15 | Support for a movable element and lithography apparatus |
| KR1020157002515A KR101688906B1 (en) | 2012-07-12 | 2013-05-15 | Support for a movable element, support system, lithography apparatus, method of supporting a movable element, and device manufacturing method |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261671000P | 2012-07-12 | 2012-07-12 | |
| US61/671,000 | 2012-07-12 |
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| WO2014009042A1 true WO2014009042A1 (en) | 2014-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2013/059999 Ceased WO2014009042A1 (en) | 2012-07-12 | 2013-05-15 | Support for a movable element and lithography apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9535340B2 (en) |
| JP (1) | JP6025978B2 (en) |
| KR (1) | KR101688906B1 (en) |
| NL (1) | NL2010804A (en) |
| WO (1) | WO2014009042A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI664503B (en) * | 2017-03-16 | 2019-07-01 | 荷蘭商Asml荷蘭公司 | Bearing device, magnetic gravity compensator, vibration isolation system, lithographic apparatus, method to control a gravity compensator having a negative stiffness, and spring |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997155B (en) * | 2017-05-24 | 2018-06-12 | 华中科技大学 | A kind of magnetcisuspension suspension gravity compensator of Low rigidity and micropositioner structure |
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| US20090009742A1 (en) * | 2007-05-11 | 2009-01-08 | Yoichi Arai | Optical element driving apparatus, barrel, exposure apparatus and device manufacturing method |
| WO2010032224A2 (en) | 2008-09-22 | 2010-03-25 | Asml Netherlands B.V. | Lithographic apparatus, programmable patterning device and lithographic method |
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| US6191513B1 (en) * | 1997-10-27 | 2001-02-20 | Mohawk Innovative Technology, Inc. | Stator-controlled magnetic bearing |
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| US7197828B2 (en) * | 2005-05-31 | 2007-04-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing FPD chuck Z position measurement |
| US20090134734A1 (en) | 2005-07-19 | 2009-05-28 | Denso Corporation | Ac motor and control unit thereof |
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| JP2010114212A (en) * | 2008-11-05 | 2010-05-20 | Nikon Corp | Optical element driving device, lens barrel, exposure device, and device manufacturing method |
| DE102009054549A1 (en) * | 2008-12-11 | 2010-06-17 | Carl Zeiss Smt Ag | Gravitation compensation for optical elements in projection exposure systems |
| NL2005240A (en) | 2009-09-22 | 2011-03-23 | Asml Netherlands Bv | Actuator, positioning system and lithographic apparatus. |
| US9081307B2 (en) | 2010-07-09 | 2015-07-14 | Asml Netherlands B.V. | Variable reluctance device, stage apparatus, lithographic apparatus and device manufacturing method |
| DE102011088735A1 (en) * | 2010-12-20 | 2012-06-21 | Carl Zeiss Smt Gmbh | Arrangement for mounting an optical element, in particular in an EUV projection exposure apparatus |
| JP5731063B2 (en) | 2011-04-08 | 2015-06-10 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus, programmable patterning device, and lithographic method |
| KR101616761B1 (en) | 2011-08-16 | 2016-04-29 | 에이에스엠엘 네델란즈 비.브이. | Lithographic apparatus, programmable patterning device and lithographic method |
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2013
- 2013-05-15 KR KR1020157002515A patent/KR101688906B1/en active Active
- 2013-05-15 JP JP2015520859A patent/JP6025978B2/en active Active
- 2013-05-15 NL NL2010804A patent/NL2010804A/en not_active Application Discontinuation
- 2013-05-15 US US14/413,667 patent/US9535340B2/en active Active
- 2013-05-15 WO PCT/EP2013/059999 patent/WO2014009042A1/en not_active Ceased
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| US5294854A (en) * | 1990-12-20 | 1994-03-15 | Massachusetts Institute Of Tech. | Bearing for use in high resolution precision control device |
| US20090009742A1 (en) * | 2007-05-11 | 2009-01-08 | Yoichi Arai | Optical element driving apparatus, barrel, exposure apparatus and device manufacturing method |
| WO2010032224A2 (en) | 2008-09-22 | 2010-03-25 | Asml Netherlands B.V. | Lithographic apparatus, programmable patterning device and lithographic method |
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| TWI664503B (en) * | 2017-03-16 | 2019-07-01 | 荷蘭商Asml荷蘭公司 | Bearing device, magnetic gravity compensator, vibration isolation system, lithographic apparatus, method to control a gravity compensator having a negative stiffness, and spring |
| US11029612B2 (en) | 2017-03-16 | 2021-06-08 | Asml Netherlands B.V. | Bearing device, magnetic gravity compensator, vibration isolation system, lithographic apparatus, and method to control a gravity compensator having a negative stiffness |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015523601A (en) | 2015-08-13 |
| KR101688906B1 (en) | 2016-12-22 |
| US9535340B2 (en) | 2017-01-03 |
| JP6025978B2 (en) | 2016-11-16 |
| KR20150036273A (en) | 2015-04-07 |
| US20150205210A1 (en) | 2015-07-23 |
| NL2010804A (en) | 2014-01-14 |
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