WO2014005351A1 - 一种背光模组及led的封装结构 - Google Patents

一种背光模组及led的封装结构 Download PDF

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Publication number
WO2014005351A1
WO2014005351A1 PCT/CN2012/078647 CN2012078647W WO2014005351A1 WO 2014005351 A1 WO2014005351 A1 WO 2014005351A1 CN 2012078647 W CN2012078647 W CN 2012078647W WO 2014005351 A1 WO2014005351 A1 WO 2014005351A1
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WO
WIPO (PCT)
Prior art keywords
led
pcb
backlight module
fixed
backplane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/078647
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English (en)
French (fr)
Inventor
李全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
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Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/636,697 priority Critical patent/US9134477B2/en
Publication of WO2014005351A1 publication Critical patent/WO2014005351A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Definitions

  • the present invention relates to the field of liquid crystal display, and more particularly to a backlight module and an LED package structure.
  • the backlight module is one of the key components of the liquid crystal display panel.
  • the function is to supply sufficient brightness and a well-distributed light source to display images properly.
  • the backlight module usually uses an LED as a light source, and other sources such as a cold cathode tube are used as a light source.
  • LEDs are widely used in existing liquid crystal displays because of their low energy consumption and long life.
  • the LED component as the light-emitting unit is generally soldered on a circuit board (PCB) by SMT (Electronic Circuit Surface Mount Technology) to form a lightbar (light bar), if one of the LEDs is broken or the chromaticity NG (not good, not good), the entire lightbar needs to be returned to the PCB factory for rework or scrap, and the broken LED can not be replaced in time to affect the efficiency.
  • PCB circuit board
  • SMT Electrical Circuit Surface Mount Technology
  • the technical problem to be solved by the present invention is to provide a backlight module and an LED package structure which are low in cost and convenient in maintenance.
  • a backlight module comprising: a backplane, a PCB disposed on the backplane, and an LED disposed on the PCB;
  • the backplane includes: a sidewall a bottom plate;
  • the PCB is tiled on the bottom plate, the LED is erected at an edge of the PCB and a back surface thereof is closely adjacent to a sidewall of the back plate;
  • the PCB is provided with a fixing bracket, Forming a "" Cao on the fixing bracket, a fixing portion is disposed on both sides of the light emitting surface of the LED, and a fixing portion is disposed on the inner wall of the card slot; the back and bottom surfaces of the LED are provided with heat sink.
  • a backlight module includes a PCB and an LED disposed on the PCB, and the PCB is provided with a fixing structure for fixing the LED, and the LED is disposed on the LED
  • a docking structure for interfacing with the fixed structure is provided; the LED is mechanically fixed to the fixed structure on the PCB by a docking structure thereon.
  • the LED is erected on the PCB.
  • the LED is placed upright on the PCB, and the light emitting surface of the LED is perpendicular to the surface of the PCB.
  • the PCB may not be disposed on the sidewall of the backplane but is laid on the bottom panel of the backplane, so that the backplane is not required.
  • a hole for fixing the PCB is disposed on the side wall to improve the strength of the back plate.
  • the backlight module includes a backboard
  • the backboard includes: a sidewall and a bottom plate;
  • the PCB is tiled on the bottom plate, and the LED is erected at an edge of the PCB and The back side is in close contact with the side wall of the back panel.
  • the PCB is laid on the bottom plate of the back plate and the LED is closely attached to the side wall of the back plate.
  • the thickness of one PCB can be increased to improve the optical taste of the backlight module; in addition, such an arrangement makes the LED directly contact with the sidewall of the back panel, which is more conducive to heat dissipation.
  • the fixing structure is a fixing bracket disposed on the PCB, and the fixing bracket forms a fixing portion, wherein the docking structure is a fixing portion disposed on two opposite sides of the LED, and the fixing portion passes
  • the docking structure is a fixing portion disposed on two opposite sides of the LED, and the fixing portion passes
  • the card slot comprises: two oppositely disposed upright frames, and a connecting portion connecting the bottom ends of the two upright frames, the card slots being fixed to the PCB by the connecting portion.
  • the structure of the card slot is simple and easy to manufacture.
  • the inner wall of the card slot is provided with a convex portion.
  • the convex portion By setting the convex portion on the inner wall, the clamping force of the card slot on the card strip on the LED is improved, thereby ensuring the reliability of mounting the LED.
  • the fixing structure is a card strip disposed on the PCB
  • the docking structure is a card slot disposed on the LED that cooperates with the card strip.
  • the card slot can also be set on the LED, corresponding to the card strip It can also be set on the PCB.
  • the back side of the LED is provided with a heat sink.
  • the LED can be directly radiated through the heat sink without passing through the PCB, and the light bar is improved, compared with the existing heat sink disposed on the back side of the light bar (ie, the back side of the PCB). Cooling efficiency.
  • the bottom of the LED in contact with the PCB is also provided with a heat sink. Further improve the heat dissipation efficiency of the LED.
  • An LED package structure comprising: a fixed structure disposed on a PCB, and a docking structure disposed on the LED; the LED is mechanically fixed to the fixed structure on the PCB by a mating structure thereon.
  • the invention has a fixed structure and a docking structure respectively disposed on the PCB and the LED, so that the LED can be directly mounted on the PCB without SMT soldering.
  • the LED packaging only the LED is mechanically fixed to the PCB;
  • the fixed structure and the docking structure are extremely fixed LEDs are detachable connections, which is convenient for replacing the LEDs.
  • LED damage or chromaticity deviation only need to remove the damaged LED and replace it with a good LED. There is no need to return the entire light bar to the factory for repair, and there is no need to dispose of the entire light bar.
  • FIG. 1 is a view showing a package structure of an LED in the first embodiment of the present invention
  • FIG. 2 is a structural view of a structure of an LED in the first embodiment of the present invention
  • FIG. 3 is a structural view of a fixing bracket on a PCB in the first embodiment of the present invention
  • FIG. 5 is a structural diagram of the LED of the second embodiment of the present invention.
  • FIG. 6 is a view showing a package structure of an LED in a second embodiment of the present invention.
  • FIG. 7 is a structural view of a backlight module according to Embodiment 1 of the present invention.
  • the package structure of the LED according to the present invention includes: a fixed structure disposed on the PCB 200 and a docking structure disposed on the LED 100.
  • the LED 100 is mechanically fixed to the fixed structure of the PCB 200 through the docking structure, and the mounting method is single, replacing the original SMT soldering and packaging method.
  • a package structure of the upper LED 100 of the light bar includes: a fixing bracket 210 disposed on the PCB 200, and a fixing portion 110 disposed on the LED 100; the LED 100 has a block structure. It is placed upright on the PCB 200. As shown in FIG. 2, a protruding strip 111 is formed on the opposite side of the fixing portion 110 of the LED 100. As shown in FIG. 3, the fixing bracket 210 includes two oppositely disposed upright frames 211 and the two standing frames 211. A connecting portion 213 is formed, and a card slot 217 for engaging the card strip 111 is formed between the two upright frames 211.
  • the upright frame 211 of the fixing bracket 210 is provided with a convex portion 212.
  • the convex portion 212 forms an inner convex structure on the inner wall of the card slot 217.
  • the pressing of the convex portion 212 on the upright frame 211 can improve the clamping force of the card slot 217 on the clip 111 on the LED 100, thereby ensuring the mounting reliability of the LED 100.
  • the fixing bracket 210 has a certain elasticity to ensure that the card strip 111 can be inserted into the card slot 217 and the two upright frames 211 can clamp the card strip 111.
  • all the LEDs 100 on the light bar are fixed to the fixing brackets on the PCB 200 through the fixing portions disposed on both sides thereof, so that when any of the LEDs 100 of the light bar is damaged or the chromaticity NG, LED100 with damage or chroma NG can be removed directly, no need to return the strip Factory repair or scrap.
  • the components of the LED 100 and the PCB 200 are connected, so that the electrical connection between the LED 100 and the PCB 200 can be realized by the contact of the fixing bracket 210 with the card strip 111.
  • the package structure of the LED 100 As shown in FIG. 7 , in the backlight module of the liquid crystal display device, the package structure of the LED 100 according to the first embodiment is used.
  • the backlight module includes: a back plate 1 disposed on the bottom plate 11 of the back plate 1 a reflective sheet 2, a light guide plate 3 disposed on the reflective sheet 2, and a diffusing plate 4 disposed on the light guide plate 3; a PCB 200 on the light strip is laid flat on the bottom plate 11 of the back plate 1, and the LED 100 is erected on the PCB 200 The back side of the edge abuts against the side wall 12 of the backing plate 1.
  • the distance of one PCB thickness can be increased, thereby improving the optical taste of the backlight module; in addition, such setting allows the LED 100 to directly face the side wall of the back panel 1. 12 contacts, which is more conducive to heat dissipation.
  • a heat sink 101 is further disposed on the back surface of the LED 100, and a heat sink 102 is also disposed at the bottom of the LED 100 in contact with the PCB 200 to further improve the heat dissipation efficiency of the light bar.
  • the fixing portion 120 provided on the LED 100 is formed with a card slot 127
  • the PCB 200 is formed with a card strip 221.
  • the first embodiment provides the card strip 111 on the LED 100 to improve the strength of the docking structure, and the strength of the card strip 221 (shown in FIG. 6) is set on the PCB 200. There is no high in the first embodiment.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Description

一种背光模组及 LED的封装结构
【技术领域】
本发明涉及液晶显示领域， 更具体的说， 涉及一种背光模组及 LED的封装 结构。
【背景技术】
背光模组为液晶显示器面板的关键零组件之一。 功能在于供应充足的亮度 与分布均匀的光源， 使其能正常显示影像。 背光模组通常使用 LED作为发光 源， 也有使用冷阴极管等其它作为发光源的， 但是由于 LED具有耗能低， 寿命 长等因素因而被广泛用于现有的液晶显示器中。
在 LED背光模组中，作为发光单元的 LED元件一般是通过 SMT (电子电 路表面封装技术）焊接在电路板 ( PCB )上构成一条 lightbar (灯条 ), 如果其中 一个 LED坏掉或者色度 NG ( not good, 不好）， 则整条 lightbar需要回 PCB工 厂返工或者报废， 且坏掉的 LED不能及时更换影响效率， 灯条的返工或报废以 及组装直接影响到了液晶显示器的制造成本。
【发明内容】
本发明所要解决的技术问题是提供一种成本低、 维修方便的背光模组及 LED的封装结构。
本发明的目的是通过以下技术方案来实现的： 一种背光模组， 包括： 背板、 设置在背板上的 PCB以及设置在所述 PCB上的 LED; 所述背板包括： 侧壁以 及底板； 所述 PCB平铺设置在所述底板上， 所述 LED直立设置在所述 PCB的 边缘处且其背面紧贴所述背板的侧壁； 所述 PCB上设置有固定支架， 所述固定 支架上形成一"" 曹， 所述 LED的出光面的两侧面上设置有固定部， 所述固定部 所述卡槽的内壁上设置有凸部； 所述 LED的背面及底面设置有热沉。 本发明的目的还可以通过以下技术方案来实现： 一种背光模组， 包括 PCB 以及设置在所述 PCB上的 LED, 所述 PCB上设置用于固定所述 LED的固定结 构，所述 LED上设置有用于与所述固定结构对接的对接结构；所述 LED通过其 上的对接结构机械固定到所述 PCB上的固定结构。
优选的， 所述 LED直立设在所述 PCB上。 将 LED直立设置在 PCB上， 则 LED的发光面与 PCB表面垂直， 则 PCB可以不需要设置在背板的侧壁上而是 平铺设置在背板的底板上， 从而不需要在背板的侧壁上设置固定 PCB的孔， 提 高背板的强度。
优选的， 所述背光模组包括有背板， 所述背板包括： 侧壁以及底板； 所述 PCB平铺设置在所述底板上， 所述 LED直立设置在所述 PCB的边缘处且其背 面并紧贴所述背板的侧壁。将 PCB平铺设置在背板的底板上并使得 LED紧贴背 板的侧壁， 对于液晶显示模组的 A值（LED的出光面到液晶显示模组的有效显 示区边缘的距离）来说， 可以增大一个 PCB的厚度， 提高背光模组的光学品味； 另外， 这样的设置使得 LED直接与背板的侧壁接触， 更利于散热。
优选的， 所述固定结构为设置在所述 PCB上的固定支架， 所述固定支架上 形成一^" 曹， 所述对接结构为设置在 LED两相对侧面上的固定部， 所述固定部 通过卡槽与卡条的配合， 可直接将 LED机械固定到 PCB上， 不需要辅助工具， 方便快捷。
优选的， 所述卡槽包括： 两相对设置的直立架， 以及连接所述两条直立架 底端的连接部，所述卡槽通过所述连接部固定到所述 PCB上。卡槽的结构筒单， 制作方便。
优选的， 所述卡槽的内壁上设置有凸部。 通过设置在内壁上的凸部， 提高 卡槽对 LED上的卡条的卡紧力， 进而保证 LED的安装可靠性。
优选的， 所述固定结构为设置在所述 PCB上的卡条， 所述对接结构为与所 述卡条配合的设置在 LED上的卡槽。 卡槽也可以设置在 LED上， 对应的， 卡条 也可以设置在 PCB上。
优选的， LED的背面设置有热沉。 通过在 LED的背面直接设置热沉， 相对 于现有将热沉设置在灯条背面（即 PCB背面）来说， LED可以直接通过热沉散 热而不需要经过 PCB传导， 进而提高了灯条的散热效率。
优选的，所述 LED与所述 PCB接触的底部也设置有热沉。进一步提高 LED 的散热效率。
一种 LED的封装结构， 包括： 设置在 PCB上的固定结构、 以及设置在所 述 LED上的对接结构； 所述 LED通过其上的对接结构机械固定到所述 PCB上 的固定结构。
本发明由于在 PCB及 LED上分别设置固定结构以及对接结构， 使得 LED 可以直接安装到 PCB上， 不需要 SMT焊接， 在 LED封装时， 只需要将 LED机 械固定到 PCB上即可； 同时，通过固定结构及对接结构进行极小固定的 LED是 可拆卸的连接， 这样方便于对 LED进行更换， 在 LED损坏或色度偏差时， 只需 要取下损坏的 LED并换上良好的 LED即可，不需要将整个灯条返厂维修，也不 需要对整个灯条进行报废处理。
【附图说明】
图 1是本发明实施例一中 LED的封装结构的筒图，
图 2是本发明实施例一中 LED的结构筒图，
图 3是本发明实施例一中 PCB上的固定支架的结构筒图，
图 4是本发明实施例一中灯条的结构筒图，
图 5是本发明实施例二中 LED的结构筒图，
图 6是本发明实施例二中 LED的封装结构筒图，
图 7是本发明实施例一中背光模组的结构筒图。
其中： 1、 背板， 2、 反射片， 3、 导光板， 4、 扩散板， 11、 底板， 12、 侧 壁， 100、 LED, 101、 热沉， 102、 热沉， 110、 固定部， 111、 卡条， 127、 卡槽 (图 5及图 6 ), 200、 PCB, 210、 固定支架， 211、 直立架， 212、 凸部， 213、 连接部， 217卡槽（图 3 ), 221、 卡条（图 6 )。
【具体实施方式】
如图 1及图 6所示为本发明所述的 LED的封装结构，其包括：设置在 PCB200 上的固定结构以及设置在 LED100上的对接结构。 LED100通过对接结构机械固 定到所述 PCB200上的固定结构， 安装方式筒单， 取代了原有的 SMT焊接封装 方式。
下面结合附图和较佳的实施例对本发明作进一步说明。
实施例一
如图 1所示为本发明的优选实施例一， 灯条的上 LED100的封装结构包括： 设置在 PCB200上的固定支架 210,以及设置在 LED100上的固定部 110; LED 100 呈块状结构， 其直立设置在 PCB200上。 如图 2所示， LED100两相对侧面的固 定部 110上形成有一凸出的卡条 111 ,如图 3所示固定支架 210包括两条相对设 置的直立架 211以及将所述两条直立架 211连接的连接部 213 , 两条直立架 211 之间形成一用于卡合所述卡条 111的卡槽 217。 这样， 在需要将 LED100封装到 PCB200上时， 只需要将 LED100的两侧的卡条 111直接插入 PCB200上固定支 架 210, 安装过程比较筒单， 不需要复杂的焊接工艺。
如图 3所示， 固定支架 210上的直立架 211上设置有凸部 212, 凸部 212在 卡槽 217的内壁上形成了一个内凸的结构， 当卡条 111插入卡槽 217内时， 受 到直立架 211上凸部 212的挤压，可提高卡槽 217对 LED100上的卡条 111的卡 紧力， 进而保证 LED100的安装可靠性。 当然， 固定支架 210具有一定的弹性， 才能保证卡条 111能够插入卡槽 217内并且使得两条直立架 211能夹紧卡条 111。
如图 4所示， 灯条上的所有 LED100均是通过设置在其两侧上的固定部固 定到 PCB200上的固定支架上，这样，在灯条任何一个 LED100出现损坏或者色 度 NG时， 均可直接将出现损坏或者色度 NG的 LED100取下， 不需要将灯条返 厂维修或者报废。
另外， 对于固定支架 210以及卡条 111来说， 是连接 LED100以及 PCB200 的部件， 这样， LED100与 PCB200的电连接可以通过固定支架 210与卡条 111 的接触来实现。
如图 7 所示， 在液晶显示装置的背光模组中， 使用了本实施例一所述的 LED100的封装结构， 该背光模组包括： 背板 1、设置在背板 1的底板 11上的反 射片 2, 设置在反射片 2之上的导光板 3以及设置在导光板 3上的扩散板 4; 灯 条上的 PCB200平铺设置在背板 1的底板 11上， LED100直立设置在 PCB200 的边缘处其背面紧贴在背板 1的侧壁 12上。 这样， 对于液晶显示模组的 A值来 说， 可以增大其一个 PCB厚度的距离， 进而可提高背光模组的光学品味； 另夕卜， 这样的设置使得 LED100直接与背板 1的侧壁 12接触， 更利于散热。
为了提高 LED100的散热效率，在 LED100的背面还设置了热沉 101 ,并且， 在 LED100与 PCB200接触的底部也设置有热沉 102, 进一步提高灯条的散热效 率。
实施例二
如图 5及图 6所示， 与实施例一不同的是， 在 LED100上设置的固定部 120 上形成的是卡槽 127, 而在 PCB200上形成的是卡条 221。 相对于实施例 1来说 (如图 1所示；)， 实施例一在 LED100上设置卡条 111可以提高对接结构强度， 而在 PCB200上设置卡条 221 (如图 6所示） 的话其强度没有实施例一的高。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干筒单推演或替 换， 都应当视为属于本发明的保护范围。

Claims

权利要求
1、一种背光模组， 包括： 背板、设置在背板上的 PCB以及设置在所述 PCB 上的 LED; 所述背板包括： 侧壁以及底板； 所述 PCB平铺设置在所述底板上， 所述 LED直立设置在所述 PCB的边缘处且其背面紧贴所述背板的侧壁； 所述 PCB上设置有固定支架， 所述固定支架上形成一"" ^槽， 所述 LED的出光面的两 侧面上设置有固定部， 所述固定部上形成有一"" ^条， 所述 LED的两个侧面上的 卡条分别与所述卡槽配合机械固定； 所述卡槽的内壁上设置有凸部； 所述 LED 的背面及底面设置有热沉。
2、一种背光模组， 包括 PCB以及设置在所述 PCB上的 LED, 所述 PCB上 设置用于固定所述 LED的固定结构，所述 LED上设置有用于与所述固定结构对 接的对接结构；所述 LED通过其上的对接结构机械固定到所述 PCB上的固定结 构。
3、 如权利要求 2所述的一种背光模组， 其中， 所述 LED直立设置在所述 PCB上。
4、 如权利要求 3所述的一种背光模组， 其中， 所述背光模组包括有背板， 所述背板包括： 侧壁以及底板； 所述 PCB平铺设置在所述底板上， 所述 LED直 立设置在所述 PCB的边缘处且其背面并紧贴所述背板的侧壁。
5、 如权利要求 2所述的一种背光模组， 其中， 所述固定结构为设置在所述 PCB上的固定支架， 所述固定支架上形成一"" 曹， 所述对接结构为设置在 LED 的出光面的两侧面上的固定部， 所述固定部上形成有一"" ^条， 所述 LED的两个 侧面上的卡条分别与所述卡槽配合固定。
6、 如权利要求 5所述的一种背光模组， 其中， 所述卡槽包括： 两相对设置 的直立架， 以及连接所述两条直立架底端的连接部， 所述卡槽通过所述连接部 固定到所述 PCB上。
7、 如权利要求 6所述的一种背光模组， 其中， 所述卡槽的内壁上设置有凸 部。
8、 如权利要求 2所述的一种背光模组， 其中， 所述固定结构为设置在所述 PCB上的卡条， 所述对接结构为与所述卡条配合的设置在 LED上的卡槽。
9、 如权利要求 2所述的一种背光模组， 其中， 所述 LED的背面设置有热 沉。
10、 如权利要求 9所述的一种背光模组， 其中， 所述 LED的底部也设置有 热沉。
11、 一种 LED的封装结构， 包括： 设置在 PCB上的固定结构、 以及设置在 所述 LED上的对接结构； 所述 LED通过其上的对接结构机械固定到所述 PCB 上的固定结构。
12、如权利要求 11所述的一种封装结构， 其中， 所述 LED直立设置在所述 PCB上。
13、如权利要求 12所述的一种封装结构， 其中， 所述背光模组包括有背板， 所述背板包括： 侧壁以及底板； 所述 PCB平铺设置在所述底板上， 所述 LED直 立设置在所述 PCB的边缘处且其背面并紧贴所述背板的侧壁。
14、 如权利要求 11所述的一种封装结构， 其中， 所述固定结构为设置在所 述 PCB上的固定支架，所述固定支架上形成一"" 曹，所述对接结构为设置在 LED 的出光面的两侧面上的固定部， 所述固定部上形成有一"" ^条， 所述 LED的两个 侧面上的卡条分别与所述卡槽配合固定。
15、 如权利要求 14所述的一种封装结构， 其中， 所述卡槽包括： 两相对设 置的直立架， 以及连接所述两条直立架底端的连接部， 所述卡槽通过所述连接 部固定到所述 PCB上。
16、 如权利要求 15所述的一种封装结构， 其中， 所述卡槽的内壁上设置有 凸部。
17、 如权利要求 11所述的一种封装结构， 其中， 所述固定结构为设置在所 述 PCB上的卡条， 所述对接结构为与所述卡条配合的设置在 LED上的卡槽。
18、如权利要求 11所述的一种封装结构， 其中， 所述 LED的背面设置有热 沉。
19、 如权利要求 18所述的一种封装结构， 其中， 所述 LED的底部也设置 有热沉。
PCT/CN2012/078647 2012-07-02 2012-07-13 一种背光模组及led的封装结构 Ceased WO2014005351A1 (zh)

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