WO2013137403A1

WO2013137403A1 - Organic led element, light-transmitting substrate, and manufacturing method for light-transmitting substrate

Info

Publication number: WO2013137403A1
Application number: PCT/JP2013/057250
Authority: WO
Inventors: 奈央石橋; 渋谷　幸一
Original assignee: 旭硝子株式会社
Priority date: 2012-03-14
Filing date: 2013-03-14
Publication date: 2013-09-19
Also published as: JP2015109136A

Abstract

Provided is an organic LED element having the following: a light-transmitting substrate; a scattering layer formed on the light-transmitting substrate; a first electrode formed on the scattering layer; an organic light-emitting layer formed on the first electrode; and a second electrode formed on the organic light-emitting layer. The organic LED element is characterized in that a repair material is disposed at a portion where the first electrode and the organic light-emitting layer do not come into contact with each other.

Description

Organic LED element, translucent substrate, and manufacturing method of translucent substrate

The present invention relates to an organic LED element, a translucent substrate, and a method for producing the translucent substrate.

Organic LED (Light Emitting Diode) elements are widely used for displays, backlights, lighting applications, and the like.

A general organic LED element has a first electrode (anode) placed on a transparent substrate, a second electrode (cathode), and an organic light emitting layer placed between these electrodes. When a voltage is applied between the electrodes, holes and electrons are injected from each electrode into the organic light emitting layer. When the holes and electrons are recombined in the organic light emitting layer, binding energy is generated, and the organic light emitting material in the organic light emitting layer is excited by this binding energy. Since light is emitted when the excited light emitting material returns to the ground state, a light emitting (LED) element can be obtained by utilizing this.

Usually, a transparent thin film such as ITO (Indium Tin Oxide) is used for the first electrode, that is, the anode, and a metal thin film such as aluminum and silver is used for the second electrode, that is, the cathode.

Recently, it has been proposed to install a scattering layer having a scattering material between the ITO electrode and the transparent substrate (for example, Patent Document 1). In such a configuration, since a part of the light emission generated in the organic layer is scattered by the scattering material in the scattering layer, the amount of light confined in the ITO electrode or the transparent substrate (total reflection light amount) is reduced. It is disclosed that the light extraction efficiency of the organic LED element can be increased.

International Publication No. 2009/060916

As described above, Patent Document 1 discloses an organic LED element in which a scattering layer is installed between an ITO electrode and a transparent substrate.

However, generally, there may be a defect such as a foreign substance or a recess on the surface of the scattering layer after installation. The foreign material may reach a size of about 500 μm, for example. Similarly, the diameter and depth of the recess may each reach about 50 μm.

When such a defect exists, there is a possibility that the surroundings of each layer may be deteriorated in a film forming process of each layer such as an electrode and an organic light emitting layer constituting the organic LED element. In particular, depending on the shape of the existing defect, the film-forming substance is prevented from reaching the surface of the scattering layer in the subsequent film-forming process. In this case, there may be a problem that the two electrodes to be separated from each other through the light emitting layer are short-circuited to each other. In such a case, there is a possibility that desired characteristics may not be obtained or light emission may not be obtained in the finally obtained organic LED element.

In addition, in some organic LED elements, the thing of the structure which has a protective layer further exists on the upper part of a scattering layer, but the same problem may arise also in this structure. That is, if there is a defect such as a foreign substance or a recess on the surface of the protective layer after installation, there is a risk that the contact of each layer will worsen in the subsequent film forming process and the two electrodes will short-circuit each other. is there.

The present invention has been made in view of such problems, and in the present invention, even if a defect exists on the surface of the scattering layer or the protective layer, the film is formed on the scattering layer or the protective layer thereafter. It aims at providing the organic LED element which can suppress the short circuit between both electrodes made. Moreover, it aims at providing the method of manufacturing the translucent board | substrate which can be used for such an organic LED element, and such a translucent board | substrate.

In the present invention,
A transparent substrate, a scattering layer formed on the transparent substrate, a first electrode formed on the scattering layer, an organic light emitting layer formed on the first electrode, and the organic light emitting layer An organic LED element having a second electrode formed on
An organic LED element is provided in which a repair material is disposed in a portion where the first electrode and the organic light emitting layer are not in contact with each other.

In the present invention,
A transparent substrate, a scattering layer formed on the transparent substrate, a first electrode formed on the scattering layer, an organic light emitting layer formed on the first electrode, and the organic light emitting layer An organic LED element having a second electrode formed on
There are defects on the surface of the scattering layer,
A repair material is present in the portion of the defect, and the repair material is disposed so as to cover the defect in a state of being in contact with a portion shadowed by the defect of the scattering layer,
The first electrode is formed of a continuous layer covering the repair material, and an organic LED element is provided.

Here, the organic LED element according to the present invention may include a protective layer on the scattering layer.

Moreover, in the organic LED element according to the present invention, the repair material is disposed in a defective portion on the surface of the scattering layer or the protective layer,
The defect may be a foreign matter and / or a recess.

In the organic LED element according to the present invention, the repair material may include a resin, glass, ceramic, and / or metal.

In the organic LED element according to the present invention, the first electrode may have a two-layer structure of an electrode layer and an additional conductive layer.

Moreover, in the organic LED element according to the present invention, the scattering layer may include a base material made of glass and a plurality of scattering materials dispersed in the base material.

Furthermore, in the present invention,
A translucent substrate having a transparent substrate, a scattering layer formed on the transparent substrate, and a first electrode formed on the scattering layer,
A translucent substrate comprising a repair material formed on the first electrode so as not to expose the scattering layer is provided.

Furthermore, in the present invention,
A translucent substrate having a transparent substrate, a scattering layer formed on the transparent substrate, a protective layer formed on the scattering layer, and a first electrode formed on the protective layer. ,
A translucent substrate comprising a repair material formed on the first electrode so as not to expose the protective layer is provided.

Here, in the translucent substrate according to the present invention, the first electrode may be formed of a continuous layer covering the repair material.

Furthermore, in the present invention,
A method of manufacturing a translucent substrate having a transparent substrate, a scattering layer, and a first electrode,
(1a) forming the scattering layer on the transparent substrate;
(1b) forming the first electrode on the scattering layer;
(1c) forming a repair material on the first electrode so that the scattering layer is not exposed;
Is provided.

Furthermore, in the present invention,
A method for producing a translucent substrate having a transparent substrate, a scattering layer, a protective layer, and a first electrode,
(2a) forming the scattering layer on the transparent substrate;
(2b) forming the protective layer on the scattering layer;
(2c) forming the first electrode on the protective layer;
(2d) forming a repair material on the first electrode so that the protective layer is not exposed;
Is provided.

Here, in the method according to the invention,
The repair material is disposed on a defective portion of the surface of the scattering layer or the protective layer,
The defect may be a foreign matter and / or a recess.

In the method according to the present invention, the repair material may include a resin, glass, ceramic, and / or metal.

In the method according to the present invention, the first electrode may have a two-layer structure of an electrode layer and an additional conductive layer.

In the present invention, even when there is a defect on the surface of the scattering layer or the protective layer, an organic material that can suppress a short circuit between the two electrodes formed on the scattering layer or the protective layer is then obtained. An LED element can be provided. Moreover, in this invention, the translucent board | substrate which can be used for such an organic LED element, and the method of manufacturing such a translucent board | substrate can be provided.

It is a schematic sectional drawing of the conventional organic LED element. It is a schematic diagram for demonstrating the problem at the time of comprising the conventional organic LED element. It is a schematic diagram for demonstrating the problem at the time of comprising the conventional organic LED element. 1 is a schematic cross-sectional view of an organic LED element according to a first embodiment of the present invention. It is the figure which showed typically an example of the form of repair material when the defect like a foreign material exists in the surface of a scattering layer. It is the figure which showed typically an example of the form of repair material when a defect like a recessed part exists in the surface of a scattering layer. FIG. 5 is a schematic cross-sectional view of an organic LED device according to a second embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of an organic LED element according to a third embodiment of the present invention. It is a typical expanded sectional view of the vicinity of repair material when the defect like a foreign material exists in the surface of a scattering layer. It is a typical expanded sectional view of the vicinity of repair material in case a defect like a recessed part exists in the surface of a scattering layer. FIG. 6 is a schematic cross-sectional view of an organic LED element according to a fourth embodiment of the present invention. It is a typical expanded sectional view of the vicinity of repair material when the defect like a foreign material exists in the surface of a protective layer. It is a typical expanded sectional view of the vicinity of repair material in case a defect like a recessed part exists in the surface of a protective layer. FIG. 6 is a schematic cross-sectional view of an organic LED element according to a fifth embodiment of the present invention. It is a typical expanded sectional view of the vicinity of repair material when the defect like a foreign material exists in the surface of a scattering layer. It is a typical expanded sectional view of the vicinity of repair material in case a defect like a recessed part exists in the surface of a scattering layer. FIG. 6 is a schematic cross-sectional view of an organic LED element according to a sixth embodiment of the present invention. It is a typical expanded sectional view of the vicinity of repair material when the defect like a foreign material exists in the surface of a protective layer. It is a typical expanded sectional view of the vicinity of repair material in case a defect like a recessed part exists in the surface of a protective layer. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 1st Example. It is the figure which showed typically the mode at the time of installing repair material in the defect part of the surface of a scattering layer by the apply | coating needle method. It is the figure which showed typically the mode at the time of installing repair material in the defect part of the surface of a scattering layer by the ejection method. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 2nd Example. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 3rd Example. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 4th Example. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 5th Example. It is the figure which showed schematically an example of the flow at the time of manufacturing the organic LED element by 6th Example. It is the figure which showed the typical top view of the 1st glass substrate after forming an ITO layer. It is the figure which showed the upper side figure of the organic LED element sample roughly. It is the figure which showed the reflected image (before voltage application) at the time of observing the light emission area | region of an organic LED element sample from the 1st glass substrate side. It is the figure which showed the state of the reflected image (during voltage application) at the time of observing the light emission area | region of an organic LED element sample from the 1st glass substrate side. In Example 2, it is the figure which showed typically the optical microscope image of the organic EL element sample in a light emission state. It is the figure which showed typically the form of the defect selected in Example 3. FIG. It is the figure which showed the measurement result of the uneven | corrugated shape of a cross section of the area | region of the defect shown in FIG. 33 obtained by the confocal microscope. It is the figure which showed the measurement result of the cross-sectional uneven | corrugated shape of the defect part after apply | coating a repair material obtained with the confocal microscope.

Hereinafter, the present invention will be described in detail with reference to the drawings.

(Conventional organic LED element)
First, in order to better understand the characteristics of the present invention, the configuration of a conventional organic LED element described in Patent Document 1 will be briefly described with reference to FIG. FIG. 1 shows a simplified cross-sectional view of a conventional organic LED element.

As shown in FIG. 1, a conventional organic LED element 1 includes a glass substrate 10, a scattering layer 20, a transparent electrode (anode) 40, an organic light emitting layer 50, and a second electrode (cathode) 60. It is configured by stacking in order. In the example of FIG. 1, the lower surface of the organic LED element 1 (that is, the exposed surface of the glass substrate 10) is the light extraction surface.

In such an organic LED element 1, light emitted from the organic light emitting layer 50 is effectively scattered by the scattering layer 20. For this reason, in the structure of such an organic LED element 1, compared with the structure which does not have the scattering layer 20, the extraction efficiency of the light from the light extraction surface of the organic LED element 1 can be improved.

Here, the scattering layer 20 is formed, for example, by baking a paste containing a glass powder having a high refractive index.

However, generally, the surface of the scattering layer 20 after film formation may have defects (one or two or more) such as foreign matters and recesses due to film forming raw materials and / or manufacturing processes. The foreign material may reach a size of about 500 μm, for example. Similarly, the diameter and depth of the recess may each reach about 50 μm.

When such a defect is present on the surface of the scattering layer 20, there is a possibility that the surroundings of each layer may be deteriorated in the film forming process of the transparent electrode 40, the organic light emitting layer 50, and the second electrode 60. In particular, depending on the shape of the existing defect, the film-forming substance is prevented from reaching the surface of the scattering layer 20 in the subsequent film-forming process. In this case, the problem that the two electrodes 40 and 60 which should be spaced apart via the organic light emitting layer 50 will mutually short-circuit may arise. Moreover, in such a case, there is a possibility that desired characteristics may not be obtained or light emission may not be obtained in the finally obtained organic LED element 1.

FIG. 2 schematically shows changes in the layer structure when the transparent electrode 40, the organic light emitting layer 50, and the second electrode 60 are sequentially formed in a state where defects such as foreign matters exist on the surface of the scattering layer 20. It is the figure shown in.

As shown in FIG. 2A, the foreign material 21 exists on the surface 29 of the scattering layer 20. The foreign material 21 has a first side surface 25 and a second side surface 26. The first side surface 25 is formed so that the particle size of the foreign material 21 decreases from the upper side to the lower side. Similarly, the second side surface 26 is formed so that the particle size of the foreign material 21 decreases from the upper side to the lower side.

In this state, when the film forming material is deposited on the scattering layer by sputtering or vapor deposition in order to form the transparent electrode 40, the film forming material is formed of the foreign material 21 as shown in FIG. It is deposited on the upper portion to form the layer portion 41a, and is deposited on the upper portion of the surface 29 of the scattering layer 20 where the foreign material 21 is not present, thereby forming the

layer portions

41b and 41c.

Here, the film-forming substance is hardly deposited on the region S1 of the surface 29 of the scattering layer 20 due to the presence of the first side surface 25 of the foreign material 21. For this reason, the layer portion 41b is formed in a form that does not completely cover the region S1 of the surface 29 of the scattering layer 20, as shown in FIG. Similarly, the film-forming substance is less likely to be deposited in the region S <b> 2 of the surface 29 of the scattering layer 20 due to the presence of the second side surface 26 of the foreign material 21. Therefore, the layer portion 41c is formed in a form that does not completely cover the region S2 of the surface 29 of the scattering layer 20, as shown in FIG.

Next, when the film-forming substance is deposited on the transparent electrode 40 in order to form the organic light emitting layer 50, the film-forming substance is applied to the layer portion 41a of the transparent electrode 40 as shown in FIG. , 41b, and 41c. As a result, the

layer portions

51a, 51b, and 51c of the organic light emitting layer 50 are formed.

In this case as well, because of the foreign matter 21, the

layer portions

51b and 51c are hardly formed above the regions S1 and S2 on the surface 29 of the scattering layer 20. In particular, the layer portion 51a of the organic light emitting layer 50 tends to be formed in a form that completely covers the layer portion 41a of the transparent electrode 40 and extends to the side portion of the layer portion 41a. Since the layer portion 51a is shaded when depositing the film forming material of the organic light emitting layer 50, the formation region of the

layer portions

51b and 51c is narrower than the

layer portions

41b and 41c of the transparent electrode 40. It becomes.

Next, when a film forming material is deposited on the organic light emitting layer 50 in order to form the second electrode 60, the film forming material is formed on the organic light emitting layer 50 as shown in FIG. Deposited on top of each of the

layer portions

51a, 51b, and 51c. As a result, the

layer portions

61a, 61b, and 61c of the second electrode 60 are formed.

Also in this case, because of the foreign matter 21, the

layer portions

61b and 61c are difficult to be formed above the regions S1 and S2 on the surface 29 of the scattering layer 20. In particular, the layer portion 61a of the second electrode 60 tends to be formed in a form that completely covers the layer portion 51a of the organic light emitting layer 50 and extends to the side of the layer portion 51a. And since this layer part 61a becomes a shadow when depositing the film-forming substance of the second electrode 60, the formation area of the

layer parts

61b and 61c is compared with the

layer parts

51b and 51c of the organic light emitting layer 50. Narrower.

In the case of a layer structure obtained through such a film forming process, the layer portion 41b of the transparent electrode 40 and the layer portion 61b of the second electrode 60 are in contact with each other at the position indicated by a circle A in FIG. The relationship between the layer portion 41c of the transparent electrode 40 and the layer portion 61c of the second electrode 60 is the same, and the layer portion 41a of the transparent electrode 40 and the layer of the second electrode 60 The same applies to the relationship with the portion 61a).

Thus, the presence of the foreign matter 21 on the scattering layer 20 may worsen the surroundings of each layer in the subsequent film formation process of the transparent electrode 40, the organic light emitting layer 50, and the second electrode 60. Moreover, when this influence becomes remarkable, the problem that two electrodes 40 and 60 will short-circuit may arise. Furthermore, when such a short circuit occurs, desired characteristics cannot be obtained in the finally obtained organic LED element 1.

In the above description, as an example of the defect, the assumed problem has been described assuming the foreign material 21 having the first side surface 25 and the second side surface 26 as shown in FIG. However, it will be apparent to those skilled in the art that similar problems can occur when foreign particles of other shapes are present on the surface 29 of the scattering layer 20.

For example, when only one side surface (for example, the side surface 25) of the two

side surfaces

25 and 26 of the foreign material has a shape that becomes a shadow when depositing a subsequent film-forming material (for example, the foreign material has parallel four sides) It will be clear that a similar problem can occur in the vicinity of the region S1 of the scattering layer 20 just below the side surface 25 of the foreign object, such as when having a cross section of shape.

Also, when a defect present on the surface of the scattering layer 20 has a shape such as a recess, the same problem can occur as shown in FIG.

FIG. 3 schematically shows a change in the layer structure when the transparent electrode 40, the organic light emitting layer 50, and the second electrode 60 are sequentially formed in a state where a defect such as a recess exists on the surface of the scattering layer 20. It is the figure shown in.

In this example, as shown in FIG. 3A, a recess 31 is present on the surface 29 of the scattering layer 20. The recess 31 has a side portion 35 and a bottom portion 36 such that the angles θ and φ (see FIG. 3A) formed by the surface 29 of the scattering layer 20 and the tangent line of the opening of the recess 31 are acute angles.

When the transparent electrode 40 is formed in a state where the scattering layer 20 has such a recess 31 on the surface 29, the film-forming substance is deposited on the bottom 36 of the recess 31 as shown in FIG. It is deposited to form the layer portion 42a, and is deposited on the portion of the surface 29 of the scattering layer 20 where the concave portion 31 is not present to form the

layer portions

42b and 42c.

Here, due to the influence of the shape of the side portion 35 of the concave portion 31, the film-forming substance is less likely to be deposited in the regions S3 and S4 that are behind the surface 29 of the scattering layer 20 when the concave portion 31 is viewed from above. Therefore, as shown in FIG. 3B, the layer portions 42a to 42c are formed in a form that does not completely cover the regions S3 and S4 of the recess 31. That is, the transparent electrode 40 is formed as a discontinuous layer.

Next, when a film forming material is deposited on the transparent electrode 40 in order to form the organic light emitting layer 50, the film forming material is applied to the layer portion 42a of the transparent electrode 40 as shown in FIG. , 42b, and 42c. As a result, the

layer portions

52a, 52b, and 52c of the organic light emitting layer 50 are formed.

In this case as well, the

layer portions

52a, 52b, and 52c are less likely to be formed in the regions S3 and S4 of the recess 31 that are shaded by the surface 29 of the scattering layer 20. Therefore, the organic light emitting layer 50 is formed as a discontinuous layer.

layer portions

52a, 52b, and 52c. As a result, the

layer portions

62a, 62b, and 62c of the second electrode 60 are formed.

Also in this case, the

layer portions

62a, 62b and 62c are hardly formed in the regions S3 and S4 of the concave portion 31 which are shaded by the surface 29 of the scattering layer 20. Therefore, the second electrode 60 is formed as a discontinuous layer.

Also in the case of such a layer configuration, for example, the layer portion 42b (or 42c) of the transparent electrode 40 and the layer portion 62a of the second electrode 60 are in contact with each other at a position indicated by a circle C in FIG. It will be clear that the risk of doing so increases.

In the example of FIG. 3, the recess 31 has a side portion 35 in which the angles θ and φ formed by the surface 29 of the scattering layer 20 and the tangent line of the opening of the recess 31 are both acute angles. However, this is only an example, and it will be apparent that the same problem can occur on the side having the angle θ, for example, when only the angle θ is an acute angle.

Although not shown in FIG. 1, some organic LED elements have a configuration in which a protective layer is further provided between the scattering layer 20 and the transparent electrode 40.

In the case of such an organic LED element, the same problem may occur. That is, if there is a defect such as a foreign substance or a recess on the surface of the protective layer after installation, there is a risk that the contact of each layer will worsen in the subsequent film forming process and the two electrodes will short-circuit each other. is there.

As described above, in the conventional organic LED element, there is a problem that two electrodes formed thereafter are short-circuited to each other due to defects existing on the surface of the scattering layer or the protective layer.

(Organic LED device according to the first embodiment of the present invention)
Next, an example of the configuration of the organic LED element according to the first embodiment of the present invention will be described with reference to FIG. FIG. 4 shows a schematic cross-sectional view of an example of the organic LED element according to the first embodiment of the present invention.

As shown in FIG. 4, the organic LED element 100 according to the first embodiment includes a transparent substrate 110, a scattering layer 120, a first electrode (anode) 140, an organic light emitting layer 150, a second electrode ( Cathode) 160 is laminated in this order.

Although not shown in the drawing, an additional conductive layer may be further disposed on the first electrode 140.
Further, a functional sputtered film may be further disposed immediately below the first electrode 140. As the functional sputtered film, for example, a high refractive index film (with a wavelength of 430 nm to 650 nm and a refractive index of 2.2 or more) is preferable because it has a function as an auxiliary layer for improving light extraction efficiency. Moreover, even if it is a film | membrane of other refractive indexes, since it has a function as a layer which protects a scattering layer etc. from a process which is easy to receive damage, such as ITO etching, it is preferable.

The transparent substrate 110 has a role of supporting each layer constituting the organic LED element.

The scattering layer 120 includes a glass base material 121 having a first refractive index, and a plurality of scattering materials 124 having a second refractive index different from the base material 121 and dispersed in the base material 121. Consists of. The thickness of the scattering layer 220 is, for example, in the range of 5 μm to 50 μm.

The first electrode 140 is made of a transparent metal oxide thin film such as ITO (Indium Tin Oxide), and has a thickness of about 50 nm to 1.0 μm. On the other hand, the second electrode 160 is made of a metal such as aluminum or silver.

The organic light emitting layer 150 is usually composed of a plurality of layers such as an electron transport layer, an electron injection layer, a hole transport layer, and a hole injection layer in addition to the light emitting layer.

In the example of FIG. 4, the lower surface of the organic LED element 100 (that is, the exposed surface of the transparent substrate 110) is the light extraction surface 190.

The scattering layer 120 has a role of effectively scattering the light generated from the organic light emitting layer 150 and reducing the amount of light totally reflected in the organic LED element 100. Therefore, in the organic LED element 100 having the configuration of FIG. 4, the amount of light emitted from the light extraction surface 190 can be improved.

Here, in the organic LED element 100 according to the first embodiment of the present invention, the repair material 170 is installed between the scattering layer 120 and the first electrode 140.

The repair material 170 has a first electrode 140 to a second electrode 160 that are subsequently formed on the scattering layer 120 even when a defect such as a foreign substance and / or a recess exists on the scattering layer 120. It functions as a member that suppresses deterioration of the attached state of each layer.

The role of the repair material 170 will be described in more detail with reference to FIG.

FIG. 5 schematically shows an example of the form of the repair material 170 when a defect such as a foreign substance exists on the surface of the scattering layer 120.

As shown in FIG. 5, the foreign material 21 having the form shown in FIG. 2 is present on the surface 129 of the scattering layer 120. For this reason, regions S1 and S2 that are shaded by the first and second side surfaces 25 and 26 of the foreign material 21 exist on the surface 129 of the scattering layer 120.

However, in FIG. 5, the repair material 170 is disposed on the surface 129 of the scattering layer 120 so as to cover the foreign material 21 and to be in contact with the regions S1 and S2 of the surface 129 of the scattering layer 120.

Such a repair material 170 can mitigate the influence due to the presence of the foreign material 21.
That is, when the first electrode 140 is formed after the repair material 170 is installed, the first electrode 140 is not an intermittent configuration having the three layer portions 41a to 41c as shown in FIG. It can be formed as a continuous layer as shown in FIG. Accordingly, the organic light emitting layer 150 to the second electrode 160 formed thereafter are also formed in a continuous form on the first electrode 140.

For this reason, in the organic LED element 100 according to the first embodiment, the problem of the contact between the respective layers, particularly the short circuit between the first and

second electrodes

140 and 160, which may occur due to the presence of the foreign matter 21 as described above, is prevented. It becomes possible to suppress significantly.

On the other hand, FIG. 6 schematically shows an example of the form of the repair material 170 when a defect such as a recess exists on the surface of the scattering layer 120.

As shown in FIG. 6, the surface 129 of the scattering layer 120 has the concave portion 31 having the form shown in FIG. 3 described above. In the recess 31, there are regions S 3 and S 4 which are shaded by the surface 129 of the scattering layer 120.

However, in the example of FIG. 6, the repair material 170 is disposed so as to cover the recess 31.

Such a repair material 170 can mitigate the influence of the presence of the recess 31. That is, when the first electrode 140 is formed after the repair material 170 is installed, the first electrode 140 is not an intermittent configuration having the three layer portions 42a to 42c as shown in FIG. It can be formed as a continuous layer as shown in FIG. Accordingly, the organic light emitting layer 150 to the second electrode 160 formed thereafter are also formed in a continuous form on the first electrode 140.

Therefore, also in this case, it is possible to significantly suppress the problem of the contact between the layers, particularly the risk of short circuit between the first and

second electrodes

140 and 160, which may occur due to the presence of the recess 31 as described above. Become.

(Organic LED device according to the second embodiment of the present invention)
Next, with reference to FIG. 7, the structure of the organic LED element by 2nd Example of this invention is demonstrated. FIG. 7 is a schematic cross-sectional view of an organic LED element according to the second embodiment of the present invention.

As shown in FIG. 7, the organic LED element 200 according to the second embodiment basically has the same configuration as the organic LED element 100 according to the first embodiment described above. Therefore, in FIG. 7, the same reference numerals as those in FIG.

However, unlike the organic LED element 100 according to the first embodiment, the organic LED element 200 according to the second embodiment includes a protective layer 230 between the scattering layer 220 and the first electrode 240. Therefore, the repair material 270 is disposed so as to be in contact with the protective layer 230 instead of the scattering layer 220.

Generally, the protective layer 230 is installed as a barrier layer of the scattering layer 220. The protective layer 230 has a role of suppressing the scattering layer from being damaged, deteriorated, or removed, for example, in a process such as an etching process of the first electrode 240.

The material of the protective layer 230 is not particularly limited, but the surface of the protective layer 230 may have defects similar to the defects present on the surface of the scattering layer. Therefore, also in this case, the presence of defects may cause the problem of the contact between the layers as described above, particularly the problem of the short circuit between the first and

second electrodes

240 and 260.

However, in the organic LED element 200 according to the second embodiment of the present invention, the repair material 270 is disposed on the defective portion of the protective layer 230. The repair material 270 is formed in a form similar to the form shown in FIGS. 5 and 6 described above.

Therefore, also in the organic LED element 200, the repair material 270 significantly suppresses the risk of short-circuiting of the first and

second electrodes

240 and 260 that may occur due to the presence of defects (foreign matter 21 and / or recess 31). It becomes possible.
Although not shown in FIG. 7, a functional sputtered film may be further disposed immediately below the first electrode 240. As the functional sputtered film, for example, a high refractive index film (with a wavelength of 430 nm to 650 nm and a refractive index of 2.2 or more) is preferable because it has a function as an auxiliary layer for improving light extraction efficiency. Moreover, even if it is a film | membrane of other refractive indexes, since it has a function as a layer which protects a scattering layer etc. from a process which is easy to receive damage, such as ITO etching, it is preferable.

In addition, when obtaining the configuration of the

organic LED elements

100 and 200 according to the first and second embodiments, the film formation process of the

first electrodes

140 and 240 is performed after the

repair materials

170 and 270 are installed. Further, when the

first electrodes

140 and 240 are formed, the

transparent substrates

110 and 210 may be exposed to a high temperature environment (for example, up to 300 ° C.). For this reason, the material of the

repair materials

170 and 270 is limited to a material that does not deteriorate due to the film formation process of the

first electrodes

140 and 240. However, in the configuration of the

organic LED elements

100 and 200, unlike the other configurations described below, when the

repair material

170 or 270 is formed of a transparent material, light is emitted from the entire surface including the

repair material

170 or 270 portion. There is an advantage that it can be obtained.

(Organic LED device according to the third embodiment of the present invention)
Next, with reference to FIG. 8, the structure of the organic LED element by 3rd Example of this invention is demonstrated. FIG. 8 is a schematic cross-sectional view of an organic LED device according to a third embodiment of the present invention.

As shown in FIG. 8, the organic LED element 300 according to the third embodiment basically has the same configuration as the organic LED element 100 according to the first embodiment. Therefore, in FIG. 8, the same reference numerals as those in FIG. 4 are given the reference numerals obtained by adding 200 to the reference numerals in FIG.

However, the organic LED element 300 according to the third embodiment is different in the installation position of the repair material 370 from the organic LED element 100 according to the first embodiment. That is, the repair material 370 is disposed so as to cover a part of the first electrode 340 in addition to the scattering layer 320.

Note that such a configuration can be easily obtained by performing the installation process of the repair material 370 after the film formation process of the first electrode 340.

Although not shown in FIG. 8, an additional conductive layer may be disposed immediately below the organic light emitting layer 350, that is, immediately above the repair material 370 and the first electrode 340.

9 and 10 schematically show enlarged sectional views of the vicinity of the repair material 370 in the case where the defect is the foreign material 21 and the concave portion 31, respectively. Note that the second electrode 360 is not shown in these drawings for the sake of clarity.

In the example shown in FIG. 9, the foreign material 21 is present on the surface of the scattering layer 320. Therefore, when the first electrode 340 is formed after the formation of the scattering layer 320 and before the repair material 370 is installed, the first electrode 340 includes the layer portions 341a to 341c as described above. Formed as a thick layer.

Thereafter, as shown in FIG. 9, the repair material 370 is installed so as to cover the foreign material 21. More precisely, the repair material 370 is in contact with the exposed surface (regions S1, S2) of the scattering layer 320, on the top and sides of the layer portion 341a of the first electrode, and on the foreign matter 21 side of the layer portions 341b and 341c. It is installed so as to cover the end.

In this case, the organic light emitting layer 350 is continuously formed on the first electrode 340 and the repair material 370 due to the presence of the repair material 370. Therefore, the risk that the second electrode 360 installed thereafter is short-circuited with the first electrode 340 is significantly avoided.

On the other hand, in the example shown in FIG. 10, the concave portion 31 exists on the surface of the scattering layer 320. Therefore, when the first electrode 340 is formed after the formation of the scattering layer 320 and before the repair material 370 is installed, the first electrode 340 includes the layer portions 342a to 342c as described above. Formed as a layer.

Thereafter, as shown in FIG. 10, the repair material 370 is installed so as to cover the recess 31. More precisely, the repair material 370 is in contact with the exposed surface (regions S3, S4) of the scattering layer 320, on the upper and side portions of the layer portion 342a of the first electrode, and on the concave portion 31 side of the

layer portions

342b and 342c. It is installed so as to cover the end.

Also in this case, the organic light emitting layer 350 is continuously formed on the first electrode 340 and the repair material 370 due to the presence of the repair material 370. Therefore, the risk that the second electrode 360 installed thereafter is short-circuited with the first electrode 340 is significantly avoided.

Thus, even in the structure of the organic LED element 300 according to the third embodiment as shown in FIG. 8, the effect of the present invention can be obtained that suppresses a short circuit between the

electrodes

340 and 360.

(Organic LED device according to the fourth embodiment of the present invention)
Next, with reference to FIG. 11, the structure of the organic LED element by 4th Example of this invention is demonstrated. FIG. 11 is a schematic cross-sectional view of an organic LED element according to a fourth embodiment of the present invention.

As shown in FIG. 11, the organic LED element 400 according to the fourth embodiment basically has the same configuration as the organic LED element 200 according to the second embodiment described above. Therefore, in FIG. 11, members similar to those in FIG. 7 are given reference numerals obtained by adding 200 to the reference numerals in FIG. 7.

However, the organic LED element 400 according to the fourth embodiment is different in the installation position of the repair material 470 from the organic LED element 200 according to the second embodiment. That is, the repair material 470 is disposed so as to cover the exposed portion of the protective layer 430 and a part of the first electrode 440 instead of the scattering layer 420.

Note that such a configuration can be easily obtained by performing the installation process of the repair material 470 after the film formation process of the first electrode 440.

12 and 13 schematically show enlarged sectional views of the vicinity of the repair material 470 in the case where the defect is the foreign material 21 and the concave portion 31, respectively. Note that the second electrode 460 is not shown in these drawings for the sake of clarity.

In the example shown in FIG. 12, the foreign material 21 exists on the surface of the protective layer 430. Therefore, when the first electrode 440 is formed after the protective layer 430 is formed and before the repair material 470 is installed, the first electrode 440 includes the layer portions 441a to 441c as described above. Formed as a thick layer.

Then, as shown in FIG. 12, the repair material 470 is installed so as to cover the foreign material 21. More precisely, the repair material 470 is in contact with the exposed surface (regions S5, S6) of the protective layer 430, on the top and sides of the layer portion 441a of the first electrode, and on the foreign substance 21 side of the layer portions 441b and 441c. It is installed so as to cover the end.

In this case, the organic light emitting layer 450 is continuously formed on the first electrode 440 (and the repair material 470) due to the presence of the repair material 470. Therefore, the risk that the second electrode 460 installed thereafter is short-circuited with the first electrode 440 is significantly avoided.

On the other hand, in the example shown in FIG. 13, the recess 31 is present on the surface of the protective layer 430. Therefore, when the first electrode 440 is formed after the protective layer 430 is formed and before the repair material 470 is installed, the first electrode 440 includes the layer portions 442a to 442c as described above. Formed as a layer.

Thereafter, as shown in FIG. 13, the repair material 470 is installed so as to cover the recess 31. More precisely, the repair material 470 is in contact with the exposed surface (regions S7, S8) of the protective layer 430, on the upper and side portions of the layer portion 442a of the first electrode, and on the concave portion 31 side of the

layer portions

442b and 442c. It is installed so as to cover the end.

Also in this case, the organic light emitting layer 450 is continuously formed on the first electrode 440 (and the repair material 470) due to the presence of the repair material 470. Therefore, the risk that the second electrode 460 installed thereafter is short-circuited with the first electrode 440 is significantly avoided.

Thus, even in the structure of the organic LED element 400 according to the fourth embodiment as shown in FIG. 11, the effect of the present invention that suppresses a short circuit between the

electrodes

440 and 460 can be obtained.

(Organic LED device according to the fifth embodiment of the present invention)
Next, with reference to FIG. 14, the structure of the organic LED element by 5th Example of this invention is demonstrated. FIG. 14 is a schematic cross-sectional view of an organic LED element according to a fifth embodiment of the present invention.

As shown in FIG. 14, the organic LED element 500 according to the fifth embodiment basically has the same configuration as the organic LED element 300 according to the third embodiment described above. Accordingly, in FIG. 14, members similar to those in FIG. 8 are given reference numerals obtained by adding 200 to the reference numerals in FIG. 8.

However, in the organic LED element 500 according to the fifth embodiment, unlike the configuration of the organic LED element 300 according to the third embodiment, an additional conductive layer 580 is further provided on the first electrode 540. The additional conductive layer 580 is provided in contact with the first electrode 540 at the position where the first electrode 540 is present. As a result, the repair material 570 is disposed so as to cover a part of the additional conductive layer 580 in addition to the scattering layer 520 and a part of the first electrode 540.

The additional conductive layer 580 has a role of reducing the resistance of the first electrode 540.

Note that the configuration shown in FIG. 14 can be easily obtained by performing the installation process of the repair material 570 after the film formation process of the first electrode 540 and the additional conductive layer 580.

15 and 16 schematically show enlarged sectional views of the vicinity of the repair material 570 when the defect is the foreign material 21 and the concave portion 31, respectively. Note that the second electrode 560 is not shown in these drawings for the sake of clarity.

In the example shown in FIG. 15, the foreign matter 21 exists on the surface of the scattering layer 520. Therefore, when the first electrode 540 and the additional conductive layer 580 are formed after the scattering layer 520 is formed and before the repair material 570 is installed, as shown in FIG. 15, the first electrode 540 has a layer portion 541a. Formed as an intermittent layer with ˜541c. Similarly, the additional conductive layer 580 is formed as an intermittent layer having layer portions 581a-581c.

Thereafter, as shown in FIG. 15, the repair material 570 is installed so as to cover the foreign material 21. More precisely, the repair material 570 is in contact with the exposed surface (regions S1, S2) of the scattering layer 520, on the top and sides of the layer portion 581a of the additional conductive layer 580, and on the foreign material 21 side of the

layer portions

581b and 581c. It is installed so as to cover the end and the end on the foreign substance 21 side of the

layer portions

541b and 541c of the first electrode 540.

In this case, the organic light emitting layer 550 is continuously formed on the additional conductive layer 580 and the repair material 570 due to the presence of the repair material 570. Therefore, the risk that the second electrode 560 to be installed thereafter is short-circuited with the additional conductive layer 580 and the first electrode 540 is significantly avoided.

On the other hand, in the example shown in FIG. 16, the concave portion 31 exists on the surface of the scattering layer 520. Therefore, when the first electrode 540 and the additional conductive layer 580 are formed after the scattering layer 520 is formed and before the repair material 570 is installed, the first electrode 540 includes the layer portions 542a to 542c as described above. Having an intermittent layer. Similarly, additional conductive layer 580 is formed as an intermittent layer having layer portions 582a-582c.

Thereafter, as shown in FIG. 16, the repair material 570 is installed so as to cover the recess 31. More precisely, the repair material 570 is in contact with the exposed surface (regions S3, S4) of the scattering layer 520, on the top and sides of the layer portion 582a of the additional conductive layer 580, and on the recess 31 side of the

layer portions

582b and 582c. It is installed so as to cover the end portion and the end portion on the concave portion 31 side of the

layer portions

542b and 542c of the first electrode 540.

Also in this case, the organic light emitting layer 550 is continuously formed on the additional conductive layer 580 and the repair material 570 due to the presence of the repair material 570. Therefore, the risk that the second electrode 360 to be subsequently installed is short-circuited with the additional conductive layer 580 and the first electrode 540 is significantly avoided.

Therefore, also in the organic LED element 500 according to the fifth embodiment, it is possible to obtain an effect that the risk that the second electrode 560 is short-circuited with the additional conductive layer 580 and the first electrode 540 is significantly avoided.

(Organic LED device according to the sixth embodiment of the present invention)
Next, with reference to FIG. 17, the structure of the organic LED element by 6th Example of this invention is demonstrated. FIG. 17 is a schematic cross-sectional view of an organic LED element according to a sixth embodiment of the present invention.

As shown in FIG. 17, the organic LED element 600 according to the sixth embodiment basically has the same configuration as the organic LED element 500 according to the fifth embodiment. Therefore, in FIG. 17, the same reference numerals as those in FIG.

However, unlike the organic LED element 500 according to the fifth embodiment, the organic LED element 600 according to the sixth embodiment includes a protective layer 630 between the scattering layer 620 and the first electrode 640. Therefore, the repair material 670 is disposed so as to be in contact with the exposed portion of the protective layer 630 instead of the scattering layer 620. More precisely, the repair material 670 is disposed so as to cover the exposed portion of the protective layer 630 and a part of the first electrode 640 and a part of the additional conductive layer 680.

18 and 19 schematically show enlarged cross-sectional views of the vicinity of the repair material 670 when the defect is the foreign material 21 and the concave portion 31, respectively. Note that the second electrode 660 is not shown in these drawings for the sake of clarity.

In the example shown in FIG. 18, the foreign material 21 is present on the surface of the protective layer 630. Accordingly, when the first electrode 640 and the additional conductive layer 680 are formed after the formation of the protective layer 630 and before the repair material 670 is installed, as shown in FIG. 18, the first electrode 640 has a layer portion 641a. Formed as an intermittent layer having ˜641c. Similarly, the additional conductive layer 680 is formed as an intermittent layer having layer portions 681a to 681c.

Thereafter, as shown in FIG. 18, the repair material 670 is installed so as to cover the foreign material 21. More precisely, the repair material 670 is in contact with the exposed surface (regions S5, S6) of the protective layer 630, on the top and sides of the layer portion 681a of the additional conductive layer 680, and on the foreign matter 21 side of the

layer portions

681b and 681c. It is installed so as to cover the end portion and the end portion on the foreign matter 21 side of the

layer portions

641b and 641c of the first electrode 640.

In this case, the organic light emitting layer 650 is continuously formed on the additional conductive layer 680 and the repair material 670 due to the presence of the repair material 670. Therefore, the risk that the second electrode 660 installed thereafter is short-circuited with the additional conductive layer 680 and the first electrode 640 is significantly avoided.

On the other hand, in the example shown in FIG. 19, the recess 31 is present on the surface of the protective layer 630. Therefore, when the first electrode 640 and the additional conductive layer 680 are formed after the protective layer 630 is formed and before the repair material 670 is installed, the first electrode 640 includes the layer portions 642a to 642c as described above. Having an intermittent layer. Similarly, additional conductive layer 680 is formed as an intermittent layer having layer portions 682a-682c.

Thereafter, as shown in FIG. 19, the repair material 670 is installed so as to cover the recess 31. More precisely, the repair material 670 is in contact with the exposed surface (regions S7, S8) of the scattering layer 620, on the top and sides of the layer portion 682a of the additional conductive layer 680, and on the recess 31 side of the

layer portions

682b and 682c. It is installed so as to cover the end portion and the end portion on the concave portion 31 side of the

layer portions

642b and 642c of the first electrode 640.

Also in this case, the organic light emitting layer 650 is continuously formed on the additional conductive layer 680 and the repair material 670 due to the presence of the repair material 670. Therefore, the risk that the second electrode 660 installed thereafter is short-circuited with the additional conductive layer 680 and the first electrode 640 is significantly avoided.

Therefore, also in the organic LED element 600 according to the sixth embodiment, it is possible to obtain an effect that the risk that the second electrode 660 is short-circuited with the additional conductive layer 680 and the first electrode 640 is significantly avoided.

In the configuration of the

organic LED elements

500 and 600 according to the fifth and sixth examples, the resistance of the

first electrodes

540 and 640 is reduced due to the presence of the additional

conductive layers

580 and 680.

In the configuration of the

organic LED elements

500 and 600 according to the fifth and sixth embodiments, the

first electrodes

540 and 640 and the additional

conductive layers

580 and 680 can be continuously formed. The efficiency of the film forming process is improved.

In the configuration of the organic LED elements 300 to 600 according to the third to sixth embodiments, the first electrodes 340 to 640 are formed before the repair materials 370 to 670 are installed. Therefore, in the organic LED elements 300 to 600, unlike the

organic LED elements

100 and 200 according to the first embodiment and the second embodiment, the material of the repair material 370 to 670 is not particularly limited and is relatively heat resistant. Even if it is a material inferior in property, there exists an advantage that it can be used. However, in the organic LED elements 300 to 600, since the first electrodes 340 to 640 and the organic light emitting layers 350 to 650 are not in direct contact with each other in the repair material 370 to 670, the repair material 370 to 670 is turned on. It ’s difficult.

(Specifications of each member)
Next, details of each member constituting the organic LED element 600 according to the sixth embodiment of the present invention will be described. It should be apparent to those skilled in the art that the following description can be applied to each member constituting the organic LED elements 100 to 500 according to the first to fifth embodiments of the present invention. .

(Repair material 670)
As long as the repair material 670 covers defects on the surface of the scattering layer or the protective layer, and the layer formed after the repair material 670 can be formed into a continuous form, the mode is not limited. Therefore, any material such as an organic material, an inorganic material, and a metal material may be used for the repair material 670. As the repair material 670, any one of a conductive material / insulating material and a transparent material / opaque material can be used. In the case of the

organic LED elements

100 and 200 according to the first embodiment and the second embodiment, the repair material 670 does not deteriorate even when exposed to plasma or high temperature when the first electrode 140 is formed. It needs to be a material.

Moreover, the installation method of the repair material 670 is not particularly limited. The repair material 670 may be installed by, for example, an “application needle method” or an “ejecting method” as described in detail below.

(Transparent substrate 610)
The transparent substrate 610 is made of a material having high visible light transmittance. The transparent substrate 610 may be a glass substrate or a plastic substrate, for example.

The material of the glass substrate includes inorganic glass such as alkali glass, non-alkali glass or quartz glass. Examples of the plastic substrate material include polyester, polycarbonate, polyether, polysulfone, polyethersulfone, polyvinyl alcohol, and fluorine-containing polymers such as polyvinylidene fluoride and polyvinyl fluoride.

The thickness of the transparent substrate 610 is not particularly limited, but may be in the range of 0.1 mm to 2.0 mm, for example. Considering strength and weight, the thickness of the transparent substrate 610 is preferably 0.5 mm to 1.4 mm.

(Scattering layer 620)
The scattering layer 620 includes a base material 621 and a plurality of scattering materials 624 dispersed in the base material 621. The base material 621 has a first refractive index, and the scattering material 624 has a second refractive index different from that of the base material.

It is preferable that the abundance of the scattering material 624 in the scattering layer 620 decreases from the inside of the scattering layer 620 toward the outside.

The base material 621 is made of glass, and an inorganic glass such as soda lime glass, borosilicate glass, alkali-free glass, and quartz glass is used as the glass material.

The scattering material 624 includes, for example, bubbles, precipitated crystals, material particles different from the base material, phase separation glass, and the like. A phase-separated glass refers to a glass composed of two or more types of glass phases.

The refractive index of the base material 621 is preferably close to that of the organic layer or ITO in order to realize high-efficiency light extraction, and the difference in refractive index from the scattering material 624 is preferably large. For this purpose, it is preferable to use a high refractive index glass as the base material 621 and use bubbles as the scattering material 624.

Because of the high refractive index glass for the base material 621, one or more components of P ₂ O ₅ , SiO ₂ , B ₂ O ₃ , GeO ₂ , and TeO ₂ are selected as the network former. As high refractive index components, TiO ₂ , Nb ₂ O ₅ , WO ₃ , Bi ₂ O ₃ , La ₂ O ₃ , Gd ₂ O ₃ , Y ₂ O ₃ , ZrO ₂ , ZnO, BaO, PbO, and Sb ₂ One or more components of O ₃ may be selected. Furthermore, in order to adjust the characteristics of the glass, alkali oxides, alkaline earth oxides, fluorides, and the like may be added within a range that does not affect the refractive index.

Accordingly, examples of the glass system constituting the base material 621 include B ₂ O ₃ —ZnO—La ₂ O ₃ system, P ₂ O ₅ —B ₂ O ₃ —R ′ ₂ O—R ″ O—TiO ₂ —. Nb ₂ O ₅ —WO ₃ —Bi ₂ O ₃ system, TeO ₂ —ZnO system, B ₂ O ₃ —Bi ₂ O ₃ system, SiO ₂ —Bi ₂ O ₃ system, SiO ₂ —ZnO system, B ₂ O ₃ -ZnO-based, P ₂ O ₅ -ZnO-based, etc. Here, R ′ represents an alkali metal element, and R ″ represents an alkaline-earth metal element. In addition, the above material system is only an example, and if it is the structure which satisfy | fills the said conditions, the material to be used will not be restricted especially.

The color of light emission can be changed by adding a colorant to the base material 621. As the colorant, transition metal oxides, rare earth metal oxides, metal colloids, and the like can be used alone or in combination.

The scattering layer 620 may be a single layer or a plurality of layers.

(Protective layer 630)
The material of the protective layer 630 is not particularly limited. However, the protective layer 630 is selected from a material that is resistant to chemicals used when etching the first electrode 640 (and the additional conductive layer 680 if necessary). The protective layer 630 may be made of ceramics such as titanium oxide, niobium oxide, zirconium oxide, and tantalum oxide.

When the transparent substrate 610 side is the light extraction surface 690, the protective layer 630 is made of a transparent material.

The film thickness of the protective layer 630 is not particularly limited. The film thickness of the protective layer 630 may be, for example, in the range of 100 nm to 500 μm.

The method for forming the protective layer 630 is not particularly limited. The protective layer 630 may be formed by, for example, a dry process such as a sputtering method or a wet coating method using, for example, a sol-gel solution. In particular, when the protective layer 630 is formed by a wet coating method, a relatively thick film can be formed relatively easily by repeating the treatment.

(First electrode 640)
The first electrode 640 is required to have a translucency of 80% or more in order to extract light generated in the organic light emitting layer 650 to the outside. Also, a high work function is required to inject many holes.

The first electrode 640 includes, for example, ITO, SnO ₂ , ZnO, IZO (Indium Zinc Oxide), AZO (ZnO—Al ₂ O ₃ : zinc oxide doped with aluminum), GZO (ZnO—Ga ₂ O). ₃ : zinc oxide doped with gallium), Nb-doped TiO ₂ , and Ta-doped TiO ₂ .

Furthermore, the first electrode 640 may be a stacked film in which a base layer is added to the above-described material. Examples of the base material include SiO ₂ , ZrO ₂ , TiO ₂ , TiZrO ₂ , and Ta ₂ O. A material such as ₅ is used.

The thickness of the first electrode 640 is preferably 100 nm or more.

The refractive index of the first electrode 640 is in the range of 1.9 to 2.2. For example, when ITO is used for the first electrode 640, the refractive index of the first electrode 640 can be decreased by increasing the carrier concentration. Commercially available ITO contains 10 wt% SnO ₂ as standard, but the refractive index of ITO can be lowered by further increasing the Sn concentration. However, as the Sn concentration increases, the carrier concentration increases, but the mobility and transmittance decrease. Therefore, it is necessary to determine the Sn amount in consideration of the overall balance.

Further, the refractive index of the first electrode 640 is preferably determined in consideration of the refractive index of the base material 621 constituting the scattering layer 620 and the refractive index of the second electrode 660. In consideration of waveguide calculation, the reflectance of the second electrode 660, and the like, the difference in refractive index between the first electrode 640 and the base material 621 is preferably 0.2 or less.

(Additional conductive layer 680)
The additional conductive layer 680 serves as an auxiliary conductor that reduces the resistance of the first electrode 640. However, the additional conductive layer 680 is not an essential member, and is installed as necessary. In general, a multilayer film made of Cr, a MoNb alloy, Al, or the like is used.

Note that the additional conductive layer 680 is often disposed at the same position or part of the first electrode 640 so as to be in contact with the first electrode 640. However, the additional conductive layer may be arranged at a location different from the first electrode. For example, in the third embodiment and the fourth embodiment described above, when the additional conductive layer is formed after the

repair materials

370 and 470 are installed, the additional conductive layer is different from the

first electrodes

340 and 440 and is continuous. It becomes composition.

(Organic light emitting layer 650)
The organic light emitting layer 650 is a layer having a light emitting function, and is generally composed of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. However, it is obvious to those skilled in the art that the organic light emitting layer 650 does not necessarily have all of the other layers as long as it has a light emitting layer. In general, the refractive index of the organic light emitting layer 650 is in the range of 1.7 to 1.8.

The hole injection layer preferably has a small difference in ionization potential in order to lower the hole injection barrier from the first electrode 640. When the charge injection efficiency from the electrode to the hole injection layer is increased, the drive voltage of the organic LED element 600 is decreased, and the charge injection efficiency is increased.

As the material of the hole injection layer, a high molecular material or a low molecular material is used. Among polymer materials, polyethylene dioxythiophene (PEDOT: PSS) doped with polystyrene sulfonic acid (PSS) is often used, and among low molecular materials, phthalocyanine-based copper phthalocyanine (CuPc) is widely used. .
The hole transport layer serves to transport holes injected from the hole injection layer to the light emitting layer. Examples of the hole transport layer include triphenylamine derivatives, N, N′-bis (1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine (NPD), N , N′-Diphenyl-N, N′-bis [N-phenyl-N- (2-naphthyl) -4′-aminobiphenyl-4-yl] -1,1′-biphenyl-4,4′-diamine ( NPTE), 1,1′-bis [(di-4-tolylamino) phenyl] cyclohexane (HTM2), and N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1,1′- Diphenyl-4,4′-diamine (TPD) or the like is used.

The thickness of the hole transport layer is, for example, in the range of 10 nm to 150 nm. The thinner the hole transport layer is, the lower the voltage of the organic LED element is. However, due to the problem of short circuit between electrodes, it is usually in the range of 10 nm to 150 nm.
The light emitting layer has a role of providing a field where the injected electrons and holes are recombined. As the organic light emitting material, a low molecular weight or high molecular weight material is used.

Examples of the light emitting layer include tris (8-quinolinolato) aluminum complex (Alq3), bis (8-hydroxy) quinaldine aluminum phenoxide (Alq′2OPh), bis (8-hydroxy) quinaldine aluminum-2,5- Dimethylphenoxide (BAlq), mono (2,2,6,6-tetramethyl-3,5-heptanedionate) lithium complex (Liq), mono (8-quinolinolato) sodium complex (Naq), mono (2, 2,6,6-tetramethyl-3,5-heptanedionate) lithium complex, mono (2,2,6,6-tetramethyl-3,5-heptanedionate) sodium complex and bis (8-quinolinolate) Metal complexes of quinoline derivatives such as calcium complexes (Caq2), tetraphenylbutadiene, pheny Quinacridone (QD), anthracene, perylene, as well as fluorescent substance such as coronene.

As the host material, a quinolinolate complex may be used, and in particular, an aluminum complex having 8-quinolinol and a derivative thereof as a ligand may be used.
The electron transport layer serves to transport electrons injected from the electrode. Examples of the electron transport layer include quinolinol aluminum complex (Alq3), oxadiazole derivatives (for example, 2,5-bis (1-naphthyl) -1,3,4-oxadiazole (END), and 2- ( 4-t-butylphenyl) -5- (4-biphenyl))-1,3,4-oxadiazole (PBD) etc.), triazole derivatives, bathophenanthroline derivatives, silole derivatives and the like.
The electron injection layer is configured, for example, by providing a layer doped with an alkali metal such as lithium (Li) or cesium (Cs) at the interface with the second electrode 660.

(Second electrode 660)
For the second electrode 660, a metal having a small work function or an alloy thereof is used. The second electrode 660 may be, for example, an alkali metal, an alkaline earth metal, a metal belonging to Group 3 of the periodic table, or the like. For the second electrode 660, for example, aluminum (Al), magnesium (Mg), silver (Ag), or an alloy thereof is used.

Also, a laminated electrode in which aluminum (Al) is deposited on a thin film of aluminum (Al), magnesium silver (MgAg), lithium fluoride (LiF), or lithium oxide (Li ₂ O) may be used. good. Furthermore, a laminated film of calcium (Ca) or barium (Ba) and aluminum (Al) may be used.

(Method for producing organic LED element according to the present invention)
Next, an example of a method for manufacturing an organic LED element having the configuration as shown in FIGS. 4, 7, 8, 11, 14, and 17 will be described.

(Manufacturing method of organic LED element by 1st Example)
First, an example of a method for manufacturing the organic LED element 100 according to the first embodiment shown in FIG. 4 (hereinafter referred to as “first manufacturing method”) will be described with reference to FIG.

FIG. 20 shows an example of a schematic flow diagram when manufacturing the organic LED element 100 according to the first embodiment.

As shown in FIG. 20, the first manufacturing method is:
(1a) forming a scattering layer on the transparent substrate, the scattering layer having a defect on a surface (step S110);
(1b) A step of installing a repair material on a defect portion on the surface of the scattering layer, wherein the repair material covers the defect in a state where it is in contact with a portion shadowed by the defect of the scattering layer. Arranged in step (step S120),
(1c) A step of installing a first electrode on the scattering layer and the repair material, wherein the first electrode is formed of a continuous layer covering the repair material (step S130). )When,
(1d) installing an organic light emitting layer on the first electrode (step S140);
(1e) installing a second electrode on the organic light emitting layer (step S150);
Have

Here, the expression “the part of the scattering layer that is shaded by the defect” means that when no repair material is installed, the film-forming substance adheres when the first electrode is formed due to the presence of the defect. It should be noted that this means the part of the scattering layer that is not formed and where the first electrode is not formed.

For example, when the defect has the form of the foreign substance 21 as shown in FIG. 5 and the first electrode is formed vertically downward from above the scattering layer 120, “the shadow is hidden by the defect of the scattering layer. The “parts” correspond to the regions S1 and S2 on the surface of the scattering layer 120 as shown in FIG. Further, for example, when the defect has the form of the concave portion 31 as shown in FIG. 6 and the first electrode is formed in the vertical direction downward from the upper side of the scattering layer 120, “the above-mentioned of the scattering layer” The “parts shaded by the defects” correspond to the regions S3 and S4 on the side surface (also the side portion 35 of the recess 31) of the scattering layer 120 as shown in FIG.

Hereinafter, each step will be described in detail.

(Step S110)
First, a transparent substrate is prepared. As described above, a glass substrate or a plastic substrate is usually used as the transparent substrate.

Next, a scattering layer in which scattering substances are dispersed in a glass base material is formed on the transparent substrate. The method for forming the scattering layer is not particularly limited, but here, a method for forming the scattering layer by the “frit paste method” will be particularly described. However, it will be apparent to those skilled in the art that the scattering layer may be formed by other methods.

In the frit paste method, a paste containing a glass material called a frit paste is prepared (preparation process), this frit paste is applied to the surface of the substrate to be installed, patterned (pattern formation process), and the frit paste is then baked. This is a method of forming a desired glass film on the surface of the substrate to be installed by performing (firing process). Hereinafter, each process will be briefly described.

(Preparation process)
First, a frit paste containing glass powder, resin, solvent and the like is prepared.

The glass powder is composed of a material that finally forms the base material of the scattering layer. The composition of the glass powder is not particularly limited as long as the desired scattering characteristics can be obtained and it can be frit pasted and fired. The composition of the glass powder is, for example, 20-30 mol% of P ₂ O ₅ , 3-14 mol% of B ₂ O ₃ , 10-20 mol% of Bi ₂ O ₃ , 3-15 mol% of TiO ₂ , Nb ₂ O ₅ 10 to 20 mol%, WO ₃ to 5 to 15 mol%, the total amount of Li ₂ O, Na ₂ O and K ₂ O is 10 to 20 mol%, and the total amount of the above components is 90 mol% or more. May be. The particle size of the glass powder is, for example, in the range of 1 μm to 100 μm.

In addition, in order to control the scattering property of the finally obtained scattering layer, a predetermined amount of filler may be added to the glass powder. As the filler, for example, particles such as zircon, silica, or alumina are used, and the particle size is usually in the range of 0.1 μm to 20 μm.

Examples of the resin include ethyl cellulose, nitrocellulose, acrylic resin, vinyl acetate, butyral resin, melamine resin, alkyd resin, and rosin resin. In addition, when a butyral resin, a melamine resin, an alkyd resin, and a rosin resin are added, the strength of the frit paste coating film is improved.

The solvent has a role of dissolving the resin and adjusting the viscosity. Examples of the solvent include ether solvents (butyl carbitol (BC), butyl carbitol acetate (BCA), dipropylene glycol butyl ether, tripropylene glycol butyl ether, butyl cellosolve), alcohol solvents (α-terpineol, pine oil) Ester solvents (2,2,4-trimethyl-1,3-pentanediol monoisobutyrate), phthalic acid ester solvents (DBP (dibutyl phthalate), DMP (dimethyl phthalate), DOP (dioctyl phthalate)) is there. Mainly used are α-terpineol and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate). DBP (dibutyl phthalate), DMP (dimethyl phthalate), and DOP (dioctyl phthalate) also function as a plasticizer.

In addition, a surfactant may be added to the frit paste to adjust the viscosity and promote frit dispersion. Moreover, you may use a silane coupling agent for surface modification.

Next, these raw materials are mixed to prepare a frit paste in which glass raw materials are uniformly dispersed.

(Pattern formation process)
Next, the frit paste prepared by the above-described method is applied on a transparent substrate and patterned. The application method and the patterning method are not particularly limited. For example, a frit paste may be pattern-printed on a transparent substrate using a screen printer. Alternatively, a doctor blade printing method or a die coat printing method may be used.

After that, the frit paste film is dried.

(Baking process)
Next, the frit paste film is baked. Usually, firing is performed in two steps. In the first step, the resin in the frit paste film is decomposed and disappeared, and in the second step, the glass powder is softened and sintered.

The first step is performed by maintaining the frit paste film in a temperature range of 200 ° C. to 400 ° C. in an air atmosphere. However, the processing temperature varies depending on the resin material contained in the frit paste. For example, when the resin is ethyl cellulose, the treatment temperature may be about 350 ° C. to 400 ° C., and when the resin is nitrocellulose, the treatment temperature may be about 200 ° C. to 300 ° C. The processing time is usually about 30 minutes to 1 hour.

The second step is performed by maintaining the frit paste film in the temperature range of the softening temperature ± 30 ° C. of the contained glass powder in an air atmosphere. The processing temperature is, for example, in the range of 450 ° C. to 600 ° C. Further, the processing time is not particularly limited, but is, for example, 30 minutes to 1 hour.

After the second step, the glass powder is softened and sintered to form a base material for the scattering layer. Further, the scattering material uniformly dispersed in the base material can be obtained by the scattering material encapsulated in the frit paste film, for example, due to the bubbles present therein.

Thereafter, by cooling the transparent substrate, a transparent substrate having a scattering layer on the surface is formed.

The thickness of the finally obtained scattering layer may be in the range of 5 μm to 50 μm.

(Step S120)
Next, a repair material is placed at a required position on the surface of the scattering layer obtained in the above process, that is, at a defective portion. The defect position on the surface of the scattering layer can be easily grasped by using a conventional general defect inspection method.

設置 The repair material installation method is not particularly limited. The repair material is present on the surface of the scattering layer by, for example, a method using an application needle (hereinafter referred to as “application needle method”) or a method using an ejection nozzle (hereinafter referred to as “jet method”). It may be installed in a defective part.

Hereinafter, each method will be described with reference to the drawings.

(Applying needle method)
FIG. 21 schematically shows a state in which a repair material is placed on a defective portion existing on the surface of the scattering layer by a coating needle method.

In the case of this method, the application needle 910 is first prepared. As shown in FIG. 21A, the application needle 910 has a main body 911, a tapered portion 912, and a tip 913. The diameter of the tip 913 is not particularly limited, but is, for example, in the range of 30 μm to 100 μm.

Such an application needle 910 is used, for example, when repairing a defect in a color filter of a liquid crystal display element.

Next, a container 920 containing a liquid 916 containing a repair material is prepared. The liquid 916 may be a paste.

Next, as shown in FIG. 21 (b), the application needle 910 is immersed in the liquid 916.

Thereafter, when the application needle 910 is pulled up from the container 920, the liquid 923 adheres at least over the tapered portion 912 to the tip 913 of the application needle 910, as shown in FIG.

Next, as shown in FIG. 21 (d), the tip 913 of the application needle 910 is brought into contact with a defective portion (not shown) of the surface 129 of the scattering layer 120. Thereafter, when the application needle 910 is lifted from the surface 129 of the scattering layer 120, as shown in FIG. 21 (e), the liquid 923 attached to the application needle 910 moves to a defective portion of the scattering layer 120, and the portion A raw material liquid 925 of a repair material is disposed in

Thereafter, the raw material liquid 925 is dried and further heated, whereby the raw material liquid 925 is fired. The temperature of the baking treatment varies depending on the material contained in the raw material liquid 925, but is about 100 ° C. to 600 ° C., for example.

In a normal case, the firing process of the raw material liquid 925 may be performed by placing the entire transparent substrate in a high temperature furnace. Furthermore, only the portion of the raw material liquid 925 may be locally heated using an infrared heating device, a laser, or the like.

By such a process, the repair material can be installed on the defect portion existing on the surface of the scattering layer.

The principle of such a coating needle method is used for, for example, a liquid crystal TFT / color filter correction device (RAGNAS series) manufactured by Lasertec Corporation.

(Spout method)
Next, a method for installing a repair material on a defective portion existing on the surface of the scattering layer by the ejection method will be described. In the case of this method, a tube member 950 having a hollow structure is prepared.

As shown in FIG. 22A, the tube member 950 has a nozzle portion 952 at the tip. A center needle 954 is mounted inside the tube member 950 so as to be coaxial with the center axis C of the tube member 950. Further, the inside of the pipe member 950 is filled with a liquid 956 containing a repair material. The liquid 956 may be in a paste form, for example.

Next, as shown in FIG. 22 (b), the tube member 950 is disposed above a defect (not shown) on the surface 129 of the scattering layer 120.

In this state, when the center needle 954 is protruded from the nozzle portion 952 of the tube member 950, a droplet 957 of the liquid 956 is formed at the tip of the center needle 954 as the center needle 954 moves. Further, as shown in FIG. 22C, the droplet 957 is dropped on the defective portion of the surface 129 of the scattering layer 120 due to the momentum and its own weight when ejected from the nozzle portion 952. Thereby, the droplet 958 can be placed on the defective portion of the surface 129 of the scattering layer 120.

Thereafter, the repair material can be formed at the same position by drying and firing the droplet 958 in the same manner as the “coating needle method”.

It should be noted that the above repair material installation method is merely an example. That is, the repair material may be placed on a defect portion existing on the surface of the scattering layer by a contact method other than the “coating needle method” or a non-contact method other than the “spout method”.

(Step S130)
Next, a 1st electrode (anode) is installed on the scattering layer which has a repair material obtained at the said process.

The formation method of the first electrode is not particularly limited, and the first electrode may be formed by a film formation method such as a sputtering method, a vapor deposition method, and a vapor phase film formation method.

As described above, the material of the first electrode may be ITO or the like. Further, the thickness of the first electrode is not particularly limited, and the thickness of the first electrode may be, for example, in the range of 50 nm to 1.0 μm.

In the method of manufacturing the organic LED element according to the first embodiment, a repair material is installed in the defective portion of the scattering layer. For this reason, the first electrode is formed in a continuous form covering the scattering layer and the repair material.

As described above, an additional conductive layer may be provided on the first electrode before the subsequent step S140. Thereby, the resistance of the first electrode can be reduced.

(Step S140)
Next, an organic light emitting layer is installed so as to cover the first electrode. The installation method of the organic light emitting layer is not particularly limited, and for example, a vapor deposition method and / or a coating method may be used.

As described above, the first electrode is formed in a continuous form covering the scattering layer and the repair material. For this reason, the organic light emitting layer in contact with the first electrode is also formed in a continuous form.

(Step S150)
Next, a second electrode is placed on the organic light emitting layer. The method for installing the second electrode is not particularly limited, and for example, a vapor deposition method, a sputtering method, a vapor deposition method, or the like may be used.

Through the above steps, the organic LED element 100 as shown in FIG. 4 is manufactured.

Here, as described above, the first electrode and the organic light emitting layer are formed in a continuous form. For this reason, in the step of forming the second electrode, the first electrode is not exposed in the installation region of the second electrode. As a result, the risk that the second electrode installed in step S150 is short-circuited with the first electrode is significantly suppressed.

(Manufacturing method of organic LED element by 2nd Example)
Next, an example of a method for manufacturing the organic LED element 200 according to the second embodiment shown in FIG. 7 (hereinafter referred to as “second manufacturing method”) will be described with reference to FIG.

FIG. 23 shows an example of a schematic flow chart when manufacturing the organic LED element 200 according to the second embodiment.

As shown in FIG. 23, the second manufacturing method is
(2a) forming a scattering layer on the transparent substrate (step S210);
(2b) forming a protective layer on the scattering layer, the protective layer having a defect on the surface (step S220);
(2c) A step of installing a repair material on a defect portion on the surface of the protective layer, the repair material covering the defect in a state in which the repair material is in contact with a portion shadowed by the defect of the protective layer. (Step S230) arranged in
(2d) A step of installing a first electrode on the protective layer and the repair material, wherein the first electrode is formed of a continuous layer covering the repair material (Step S240). )When,
(2e) installing an organic light emitting layer on the first electrode (step S250);
(2f) installing a second electrode on the organic light emitting layer (step S260);
Have

Here, the expression “part of the protective layer that is shaded by the defect” means that when no repair material is installed, the film-forming substance adheres when the first electrode is formed due to the presence of the defect. It should be noted that this means the part of the protective layer where the first electrode is not formed.

For example, when the defect has the form of the foreign substance 21 as shown in FIG. 12 and the first electrode is formed vertically downward from the upper side of the protective layer 430, “the above-described defect of the protective layer causes shadows. The “parts” correspond to the regions S5 and S6 on the surface of the protective layer 430 as shown in FIG. Further, for example, when the defect has a form of the concave portion 31 as shown in FIG. 13 and the first electrode is formed vertically downward from the upper side of the protective layer 430, “the above-mentioned of the protective layer” The “parts shaded by the defects” correspond to the regions S7 and S8 on the side surface (also the side part 35 of the recess 31) of the protective layer 430 as shown in FIG.

Of the above steps, steps other than step S220 in (2b) and step S230 in (2c) are the same as the corresponding steps described in the first manufacturing method. Therefore, only step S220 and step S230 will be described here.

(Step S220)
In the second manufacturing method, a protective layer is provided on the scattering layer.

The method for forming the protective layer is not particularly limited.

The protective layer can be formed relatively easily, for example, by wet-coating the protective layer material on the surface of the scattering layer and then immobilizing it as a film. For example, the protective layer may be formed by applying a sol-gel solution containing a raw material to be the protective layer to the surface of the scattering layer, and then drying and heat-treating it.

Alternatively, the protective layer may be formed by a dry process such as sputtering.

The protective layer is selected from materials that are resistant to chemical substances used when the first electrode is etched.

(Step S230)
Next, a repair material is placed at a required position on the surface of the protective layer obtained in the above process, that is, at a defect existing position.

As the method for installing the repair material, for example, the coating needle method or the ejection method described in the first manufacturing method described above may be used.

Thereafter, the first electrode is placed on top of the protective layer and the repair material by step S240 similar to step S130 of the first manufacturing method. If necessary, an additional conductive layer is further formed.

Thereafter, the organic LED element 200 according to the second embodiment is manufactured through steps S250 to S260.

(Manufacturing method of organic LED element by 3rd Example)
Next, an example of a method for manufacturing the organic LED element 300 according to the third embodiment shown in FIG. 8 (hereinafter referred to as “third manufacturing method”) will be described with reference to FIG.

FIG. 24 shows an example of a schematic flow chart when manufacturing the organic LED element 300 according to the third embodiment.

As shown in FIG. 24, the third manufacturing method is
(3a) a step of forming a scattering layer on the transparent substrate, the scattering layer having a defect on the surface (step S310);
(3b) installing a first electrode on the scattering layer,
The first electrode is cut at the position of the defect and is composed of at least two layers including a first layer portion and a second layer portion;
The first layer portion is disposed at the position of the defect, and the second layer portion is disposed at a position different from the defect (step S320);
(3c) installing a repair material on a defect portion on the surface of the scattering layer,
The repair material is arranged so as to cover the defect in a state in contact with a portion shadowed by the defect of the scattering layer,
The repair material covers the first layer portion of the first electrode and the end of the second layer portion on the side close to the defect (step S330);
(3d) installing an organic light emitting layer on top of the first electrode and repair material (step S340);
(3e) installing a second electrode on the organic light emitting layer (step S350);
Have

Of the above steps, step S310 of (3a) and step S350 of (3e) are the same as the corresponding steps described in the first manufacturing method. Therefore, only the steps other than these will be described here.

(Step S320)
In the third manufacturing method, after the scattering layer 320 is formed, the first electrode 340 is installed before the repair material 370 is installed.

By this step, the first electrode 340 is formed discontinuously on the surface of the scattering layer 320 having defects, for example, in the manner shown in FIG. 9 or FIG.

(Step S330)
Next, a repair material 370 is installed on the defective portion of the scattering layer 320.

Here, when the foreign material 21 is present on the surface of the scattering layer 320, the repair material 370 is in contact with the regions S1 and S2 of the scattering layer 320 as shown in FIG. 9, and furthermore, the layer portion 341a of the first electrode 340. Are formed so as to cover the ends of the layer portions 341b and 341c of the first electrode 340 on the foreign substance 21 side.

Similarly, when the concave portion 31 is present on the surface of the scattering layer 320, the repair material 370 is in contact with the regions S3 and S4 of the scattering layer 320 as shown in FIG. 10, and further, the layer portion 342a of the first electrode 340. Is formed so as to cover the end portions of the

layer portions

342b and 342c of the first electrode 340 on the concave portion 31 side.

It should be noted that the repair material 370 having such an aspect can be formed relatively easily by, for example, the above-described coating needle method or jetting method.

If necessary, an additional conductive layer may be installed after the repair material 370 is installed and before step S340.

(Step S340)
Next, the organic light emitting layer 350 is disposed on the first electrode 340 and the repair material 370.

The organic light emitting layer 350 is continuously formed on the first electrode 340 and the repair material 370 so as to cover the first electrode 340 due to the presence of the repair material 370. Therefore, the risk that the second electrode 360 installed thereafter is short-circuited with the first electrode 340 is significantly avoided.

(Manufacturing method of organic LED element by 4th Example)
Next, an example of a method for manufacturing the organic LED element 400 according to the fourth embodiment shown in FIG. 11 (hereinafter referred to as “fourth manufacturing method”) will be described with reference to FIG.

FIG. 25 shows an example of a schematic flow chart when manufacturing the organic LED element 400 according to the fourth embodiment.

As shown in FIG. 25, the fourth manufacturing method is
(4a) forming a scattering layer on the transparent substrate (step S410);
(4b) installing a protective layer on the scattering layer, the protective layer having a defect on the surface (step S420);
(4c) installing a first electrode on the protective layer,
The first electrode is cut at the position of the defect and is composed of at least two layers including a first layer portion and a second layer portion;
The first layer portion is disposed at the position of the defect, and the second layer portion is disposed at a position different from the defect (step S430);
(4d) installing a repair material on a defective portion of the surface of the protective layer,
The repair material is arranged so as to cover the defect in a state where it is in contact with a portion shadowed by the defect of the protective layer,
The repair material covers the first layer portion of the first electrode and the end of the second layer portion close to the defect (step S440);
(4e) installing an organic light emitting layer on top of the first electrode and the repair material (step S450);
(4f) installing a second electrode on the organic light emitting layer (step S460);
Have

Here, among the above steps, step S410 in (4a), step S420 in (4b), and step S460 in (4f) are the same as the corresponding steps described in the second manufacturing method. Accordingly, only steps S430 to S450 will be described here.

(Step S430)
In the fourth manufacturing method, after the protective layer 430 is formed, the first electrode 440 is installed before the repair material 470 is installed.

By this step, the first electrode 440 is discontinuously formed on the surface of the protective layer 430 having defects, for example, in the manner shown in FIG. 12 or FIG.

(Step S440)
Next, the repair material 470 is installed on the defective portion of the protective layer 430.

Here, when the foreign material 21 is present on the surface of the protective layer 430, the repair material 470 is in contact with the regions S5 and S6 of the protective layer 430 and further, the layer portion 441a of the first electrode 440 as shown in FIG. Are formed so as to cover the ends of the layer portions 441b and 441c of the first electrode 440 on the foreign substance 21 side.

Similarly, when the recess 31 is present on the surface of the protective layer 430, the repair material 470 is in contact with the regions S7 and S8 of the protective layer 430 and further, the layer portion 442a of the first electrode 440 as shown in FIG. Are formed so as to cover the end portions of the

layer portions

442b and 442c of the first electrode 440 on the concave portion 31 side.

In addition, the repair material 470 of such an aspect can be formed comparatively easily by the above-mentioned coating needle method or the ejection method, for example.

If necessary, an additional conductive layer may be installed after the repair material 470 is installed and before step S450.

(Step S450)
Next, an organic light emitting layer 450 is disposed on the first electrode 440 and the repair material 470.

The organic light emitting layer 450 is continuously formed on the first electrode 440 and the repair material 470 so as to cover the first electrode 440 due to the presence of the repair material 470. Therefore, the risk that the second electrode 460 installed thereafter is short-circuited with the first electrode 440 is significantly avoided.

(Manufacturing method of organic LED element by 5th Example)
Next, an example of a method for manufacturing the organic LED element 500 according to the fifth embodiment shown in FIG. 14 (hereinafter referred to as “fifth manufacturing method”) will be described with reference to FIG.

FIG. 26 shows an example of a schematic flow diagram when manufacturing the organic LED element 500 according to the fifth embodiment.

As shown in FIG. 26, the fifth manufacturing method is
(5a) forming a scattering layer on the transparent substrate, the scattering layer having a defect on a surface (step S510);
(5b) installing the first electrode on the scattering layer,
The first electrode is cut at the position of the defect and is composed of at least two layers including a first layer portion and a second layer portion;
The first layer portion is disposed at the position of the defect, and the second layer portion is disposed at a position different from the defect (step S520);
(5c) installing an additional conductive layer on the first electrode,
The additional conductive layer is composed of at least two layers including a third layer portion and a fourth layer portion, which are cut at the position of the defect,
The third layer portion is disposed on the first layer portion of the first electrode, and the fourth layer portion is disposed on the second layer portion of the first electrode. Step S530),
(5d) installing a repair material on a defect portion on the surface of the scattering layer,
The repair material is arranged so as to cover the defect in a state in contact with a portion shadowed by the defect of the scattering layer,
The repair material includes the third layer portion of the additional conductive layer, the end of the fourth layer portion of the additional conductive layer on the side close to the defect, and the second layer of the first electrode. Covering the end of the part close to the defect (step S540);
(5e) installing an organic light emitting layer on top of the additional conductive layer and repair material (step S550);
(5f) installing a second electrode on the organic light emitting layer (step S560);
Have

Here, among the above steps, step S510 of (5a), step S520 of (5b), and step S560 of (5f) are the same as the corresponding steps described in the third manufacturing method described above. Therefore, only the steps other than these will be described here.

(Step S530)
In the fifth manufacturing method, after forming the first electrode 540 and before installing the repair material 570, an additional conductive layer 580 is further installed.

By this step, the structure of the defect portion of the scattering layer 520 becomes a form as shown in FIG. 15 or FIG.

That is, when the defect is the foreign material 21, the first electrode 540 is formed in a discontinuous form having the layer portions 541a to 541c on the surface of the scattering layer 520. The additional conductive layer 580 is formed in a discontinuous form having layer portions 581a to 581c on the surface of the first electrode 540.

Similarly, when the defect is the recess 31, the first electrode 540 is formed in a discontinuous form having layer portions 542 a to 542 c on the surface of the scattering layer 520. The additional conductive layer 580 is formed in a discontinuous form having layer portions 582a to 582c on the surface of the first electrode 540.

(Step S540)
Next, the repair material 570 is installed on the defective portion of the scattering layer 520.

Here, when the foreign material 21 exists on the surface of the scattering layer 520, the repair material 570 is in contact with the regions S1 and S2 of the scattering layer 520 and the

layer portions

541b and 541c of the first electrode 540 as shown in FIG. Is formed so as to cover the end of the additional conductive layer 580 and the upper and side portions of the layer portion 581a of the additional conductive layer 580, and to cover the end of the additional conductive layer 580 on the foreign matter 21 side of the

layer portions

581b and 581c. The

Similarly, when the recess 31 is present on the surface of the scattering layer 520, the repair material 570 is in contact with the regions S3 and S4 of the scattering layer 520 and the

layer portions

542b and 542c of the first electrode 540 as shown in FIG. Is formed so as to cover the end portion of the additional conductive layer 580, the upper portion and the side portion of the layer portion 582a of the additional conductive layer 580, and the end portions of the

layer portions

582b and 582c of the additional conductive layer 580 on the concave portion 31 side. The

In addition, the repair material 570 of such an aspect can be formed comparatively easily by the above-mentioned application needle method or the ejection method, for example.

(Step S550)
Next, the organic light emitting layer 550 is disposed on the additional conductive layer 580 and the repair material 570.

The organic light emitting layer 550 is continuously formed on the additional conductive layer 580 and the repair material 570 so as to cover the additional conductive layer 580 due to the presence of the repair material 570. Therefore, the risk that the second electrode 560 to be installed thereafter is short-circuited with the additional conductive layer 580 and the first electrode 540 is significantly avoided.

(Manufacturing method of organic LED element by 6th Example)
Next, an example of a method for manufacturing the organic LED element 600 according to the sixth embodiment shown in FIG. 17 (hereinafter referred to as “sixth manufacturing method”) will be described with reference to FIG.

FIG. 27 shows an example of a schematic flow chart when manufacturing the organic LED element 600 according to the sixth embodiment.

As shown in FIG. 27, the sixth manufacturing method is
(6a) forming a scattering layer on the transparent substrate (step S610);
(6b) installing a protective layer on the scattering layer, the protective layer having a defect on the surface (step S620);
(6c) installing the first electrode on the protective layer,
The first electrode is cut at the position of the defect and is composed of at least two layers including a first layer portion and a second layer portion;
The first layer portion is disposed at the position of the defect, and the second layer portion is disposed at a position different from the defect (step S630);
(6d) installing an additional conductive layer on the first electrode,
The additional conductive layer is composed of at least two layers including a third layer portion and a fourth layer portion, which are cut at the position of the defect,
The third layer portion is disposed on the first layer portion of the first electrode, and the fourth layer portion is disposed on the second layer portion of the first electrode. Step S640),
(6e) installing a repair material on a defective portion of the surface of the protective layer,
The repair material is arranged so as to cover the defect in a state where it is in contact with a portion shadowed by the defect of the protective layer,
The repair material includes the third layer portion of the additional conductive layer, the end of the fourth layer portion of the additional conductive layer on the side close to the defect, and the second layer of the first electrode. Covering the end of the portion close to the defect (step S650);
(6f) installing an organic light emitting layer on top of the additional conductive layer and the repair material (step S660);
(6g) installing a second electrode on the organic light emitting layer (step S670);
Have

Here, among the above steps, step S610 in (6a), step S620 in (6b), step S630 in (6c), and step S670 in (6g) correspond to those described in the above-described fourth manufacturing method. It is the same as the step. Therefore, only the steps other than these will be described here.

(Step S640)
In the sixth manufacturing method, after forming the first electrode 640 and before installing the repair material 670, an additional conductive layer 680 is further installed.

By this step, the structure of the defective portion of the protective layer 630 becomes as shown in FIG. 18 or FIG.

That is, when the defect is the foreign material 21, the first electrode 640 is formed in a discontinuous form having the layer portions 641a to 641c on the surface of the protective layer 630. The additional conductive layer 680 is formed in a discontinuous form having layer portions 681a to 681c on the surface of the first electrode 640.

Similarly, when the defect is the recess 31, the first electrode 640 is formed in a discontinuous form having layer portions 642 a to 642 c on the surface of the protective layer 630. The additional conductive layer 680 is formed in a discontinuous form having layer portions 682a to 682c on the surface of the first electrode 640.

(Step S650)
Next, the repair material 670 is installed on the defective portion of the protective layer 630.

Here, when the foreign material 21 is present on the surface of the protective layer 630, the repair material 670 is in contact with the regions S5 and S6 of the protective layer 630 and the

layer portions

641b and 641c of the first electrode 640 as shown in FIG. Is formed so as to cover the end portion of the additional conductive layer 680 and the upper and side portions of the layer portion 681a of the additional conductive layer 680 and to cover the end portions of the

layer portions

681b and 681c of the additional conductive layer 680 on the foreign matter 21 side. The

Similarly, when the recess 31 is present on the surface of the protective layer 630, the repair material 670 is in contact with the regions S7 and S8 of the protective layer 630 and the

layer portions

642b and 642c of the first electrode 640 as shown in FIG. Is formed so as to cover the end portion of the additional conductive layer 680 and the upper and side portions of the layer portion 682a of the additional conductive layer 680 and cover the end portions of the

layer portions

682b and 682c of the additional conductive layer 680 on the concave portion 31 side. The

It should be noted that the repair material 670 having such an aspect can be formed relatively easily by, for example, the above-described coating needle method or jetting method.

(Step S660)
Next, the organic light emitting layer 650 is disposed on the additional conductive layer 680 and the repair material 670.

The organic light emitting layer 650 is continuously formed on the additional conductive layer 680 and the repair material 670 so as to cover the additional conductive layer 680 due to the presence of the repair material 670. Therefore, the risk that the second electrode 660 installed thereafter is short-circuited with the additional conductive layer 680 and the first electrode 640 is significantly avoided.

In the present application, the laminate before forming the organic light emitting layer and the second electrode, that is, the transparent substrate, the scattering layer, the protective layer (if necessary), the repair material, and the first electrode (and if necessary, The laminated body having the additional conductive layer is particularly referred to as a “translucent substrate”. The specifications of the organic light emitting layer, the second electrode, and the like vary depending on the application application of the finally obtained organic LED element. Therefore, it is necessary to keep in mind that this “translucent substrate” is usually distributed in the market as an intermediate product in this state, and the subsequent steps are often omitted. There is.

Next, examples of the present invention will be described.

(Example 1)
The organic LED element sample was produced with the following method, and the characteristic was evaluated. The organic LED element sample was configured as shown in FIG.

(Formation of scattering layer)
First, a glass substrate made of soda lime (hereinafter referred to as “first glass substrate”) was prepared as a transparent substrate, and a scattering layer was placed on one surface of the first glass substrate.

The scattering layer was formed by the following procedure.

First, glass raw material powder was prepared. Table 1 shows the composition of the raw material powder. Next, this raw material powder was melted at 1150 ° C. using an electric furnace and then roll-cast to obtain glass flakes.

The glass transition temperature and the thermal expansion coefficient of the glass flakes were measured by a thermal expansion method (temperature increase rate: 5 ° C./min) using a thermal analyzer (TD5000SA: manufactured by Bruker). As a result, the glass transition temperature of the glass flakes was 478 ° C., and the thermal expansion coefficient was 71 × 10 ⁻⁷ / ° C. (average value of 50 ° C. to 300 ° C.). Further, the refractive index nd of this glass flake at the d-line (587.56 nm) was measured using a refractometer (trade name: KRP-2, manufactured by Kalnew Optical Industry Co., Ltd.). As a result, the refractive index nd was 1.84.

Next, a glass paste was prepared by the following method, and a scattering layer was formed using the glass paste.

First, glass flakes were pulverized with a zirconia planetary mill for 2 hours and then sieved to collect powder having an average particle size d50 (particle size of 50% integrated value) of 1 μm to 3 μm.

Next, 72.4 g of the collected glass powder was kneaded with 27.6 g of an organic vehicle (about 10% by mass of ethyl cellulose dissolved in α-terpineol or the like) to prepare a glass paste (glass paste A). Further, 15 vol% of substantially spherical SiO ₂ particles having an average particle diameter of about 3 μm were added to the glass paste A to prepare another glass paste (glass paste B).

Next, glass paste B was printed on the first glass substrate using a screen printer. Glass paste B was printed in a substantially circular shape having a diameter of about 10 mm. This glass paste B was dried at 140 ° C. for 10 minutes to form a first layer. Next, the glass paste A was printed on the first layer formed on the first glass substrate. The glass paste A was substantially the same shape as the first layer, and was printed so that it was just laminated on top of the first layer. Then, it dried at 140 degreeC for 10 minute (s), and formed the 2nd layer.

Next, the temperature of the first glass substrate was raised to 450 ° C. in 45 minutes and held at 450 ° C. for 30 minutes, so that the organic vehicle resin contained in the first and second layers was decomposed and disappeared. Thereafter, the temperature was raised to 595 ° C. in 15 minutes and held at 595 ° C. for 40 minutes to soften the glass frit. Thereafter, the temperature was lowered to room temperature over 3 hours.

Thereby, a scattering layer having a two-layer structure was formed on the first glass substrate. The film thickness of the entire scattering layer was 35 μm.

(Formation of protective layer)
Next, a protective layer was formed on the scattering layer formed by the above-described method.

As a material for the protective layer, a sol-gel solution composed of tetra-n-butoxytitanium, 3- (glycidyloxy) propyltrimethoxysilane, trimethoxymethoxysilane, 1-butanol, toluene, and acetylacetone was used.

Using a spin coater, this sol-gel solution was coated on the entire surface of the first glass substrate on which the scattering layer was formed. Next, the glass substrate was kept at 120 ° C. for about 5 to 10 minutes and dried. Further, the protective layer was formed by maintaining at 475 ° C. for about 1 hour to evaporate, decompose, and / or burn off the solvent in the sol-gel layer and oxidize and bond the organometallic compound in the sol-gel layer.

(Formation of transparent electrode)
First, as a first electrode, an ITO layer was formed on the surface of the first glass substrate on which the scattering layer and the protective layer were formed by DC magnetron sputtering. The thickness of the ITO layer was 150 nm. When forming the ITO layer, a mask was used so that a desired pattern was obtained.

FIG. 28 shows a schematic top view of the first glass substrate after the ITO layer is formed.

As shown in FIG. 28, a circular scattering layer 1120 and a substantially “L” -shaped ITO layer 1140 are formed on the surface of the first glass substrate 1110. One end of the ITO layer 1140 is disposed at the central portion of the scattering layer 1120. Although not shown in FIG. 28 for clarification, a protective layer is actually provided on the entire surface of the first glass substrate 1100 so as to cover the scattering layer 1120.

(Installation of repair materials)
Next, the repair material was installed in the defective part of the ITO layer by the following method.

First, an optical microscope observation of the ITO layer surface was performed to detect a portion where the ITO was cut due to a defect present on the surface of the protective layer of the first glass substrate. As a result, on the surface of the ITO layer, a portion where the ITO layer is cut by a plurality of foreign matters protruding from the surface of the protective layer, and a portion where the ITO layer is cut by a plurality of recesses having openings on the surface of the protective layer Was detected. The detected defect portion was marked and the defect position was recorded.

The maximum width of the foreign material was, for example, 50 μm. Moreover, the diameter of the opening part of a recessed part was 10 micrometers, for example.

Next, a repair material was applied to the detected defect position by the above-described application needle method.

透明 Transparent polyimide silicone resin was used as the repair material. Moreover, the above-mentioned application needle method was used for application | coating of repair material. The repair material was applied so as to have a circular shape with a diameter of about 120 μm centered on the substantially central portion of the defect.

After the repair material was applied to the defective part, it was heated at 200 ° C. for 30 minutes using an oven to cure the repair material.

(Production of organic LED elements)
Next, the organic LED element was produced in the following procedures using the 1st glass substrate by which repair material was installed in the defective part.

First, the glass substrate was ultrasonically cleaned using pure water and IPA, and then the surface was cleaned by irradiating the first glass substrate with ultraviolet rays using an excimer UV generator.

Next, an organic light emitting layer and a second electrode were formed on the first glass substrate 1100 using a vacuum deposition apparatus.

First, an α-NPD (N, N′-diphenyl-N, N′-bis (l-naphthyl) -l, l′ biphenyl-4,4 ″ diamine) layer having a thickness of 100 nm is used as a hole transport layer. Further, an Alq3 (tris8-hydroxyquinoline aluminum) layer having a thickness of 60 nm was formed as a light-emitting layer (and an electron transport layer). The α-NPD layer and Alq3 layer were formed into a circular pattern having a diameter of 12 mm using a mask.

Next, a LiF layer having a thickness of 0.5 nm was formed as an electron injection layer. Further, an Al layer having a thickness of 80 nm was formed as the second electrode. The LiF layer and the Al layer were substantially “L” -shaped, and were formed so as to have a shape in which an additional region of 2 mm in length × 2 mm in width was installed at one end.

Thereby, an organic LED element sample was produced.

FIG. 29 schematically shows a top view of the produced organic LED element sample 1000. In FIG. 29, it should be noted that the protective layer is not shown for clarity.

As shown in FIG. 29, the Alq3 layer 1150 has a circular shape that is slightly larger than the previously formed scattering layer 1120, and is formed to cover the entire scattering layer 1120. Although not visible from FIG. 29, an α-NPD layer having the same shape as the Alq3 layer 1150 is provided immediately below the Alq3 layer 1150.

On the other hand, the Al layer 1160 is formed such that an additional region 1162 disposed at one end of the “L” shape is disposed at the center of the scattering layer 1120. Although not visible from FIG. 29, a LiF layer having the same shape as the Al layer 1160 is provided immediately below the Al layer 1160.

Such an organic LED element sample 1000, when viewed from above, near the center of the scattering layer 1120, the tip of the ITO layer 1140, the center of the α-NPD layer and the Alq3 layer 1150, and the LiF layer and the Al layer 1160. The additional region 1162 overlaps, and this portion functions as the light emitting region 1190 of the organic LED element sample 1000. Therefore, the dimension of the light emitting region 1190 is 2 mm long × 2 mm wide.

In this state, the organic LED element sample 1000 may be deteriorated. Therefore, the organic LED element sample 1000 was sealed with nitrogen by the following method.

First, a glass substrate (PD200: manufactured by Asahi Glass Co., Ltd.) (hereinafter referred to as “second glass substrate”) having a recess near the center was prepared. The concave portion was formed by sandblasting the central portion of the second glass substrate. The recess has a sufficiently large depth and width so that the second glass substrate does not come into contact with each element except for the first glass substrate 1110 of the organic LED element sample 1000.

Next, a water catching material containing CaO was attached to the concave portion of the second glass substrate. Moreover, the photosensitive epoxy resin was apply | coated as a sealing material along the outer periphery of the recessed part of a 2nd glass substrate. In this state, the second glass substrate was placed on top of the organic LED element sample 1000 so that the recess faces each element of the organic LED element sample 1000, and a sealing process was performed.

During the sealing process, the photosensitive epoxy resin of the second glass substrate was irradiated with ultraviolet rays to cure the resin. Thereby, the organic LED element sample 1000 and the 2nd glass substrate were bonded together. In addition, the sealing process was implemented in the glove box made into nitrogen atmosphere. For this reason, each element of the organic LED element sample 1000 was nitrogen-sealed.

(Evaluation)
Next, the light emission test was implemented using the organic LED element sample 1000 sealed with nitrogen.

The light emission test was performed by applying a voltage of 6 V between both electrodes (that is, the ITO layer 1140 and the Al layer 1160) of the organic LED element sample 1000.

30 and 31 show reflection images when the light emitting region 1190 of the organic LED element sample 1000 is observed from the first glass substrate 1100 side using an optical microscope. FIG. 30 shows a state before voltage application, and FIG. 31 shows a state after voltage application.

30 and 31, two portions indicated by an arrow A correspond to a defective portion where a repair material is installed.

FIG. 31 shows that in the light emitting region 1190 of the produced organic LED element sample, appropriate light emission (green light emission) is obtained except for the place where the repair material is installed. In addition, although voltage was continuously applied to both electrodes of the organic LED element sample 1000 for 15 minutes, the light emission state was stable, and constant light emission was obtained during voltage application.

In general, when two electrodes are short-circuited in an organic LED element, immediately after voltage application, a local large current flows through the short-circuited portion, the brightness of the short-circuited portion increases, and immediately after that, the short-circuited portion becomes a dark spot. It becomes a non-lighting part called, and the size of the dark spot may expand over time. Moreover, when a short circuit part is large, an organic LED element may not light at all.

However, in this experiment, stable light emission was obtained with the organic LED element 1000 at least during the measurement period. Furthermore, when the current was measured while applying a voltage to the element, it was found that there was no difference in measured values between the organic LED element 1000 and an organic LED element that had no defects and was not repaired. If a short circuit occurs, the current value should be large. From these results, in the organic LED element sample 1000, it was confirmed that the short circuit between electrodes did not arise.

In addition, light emission does not occur in the portion where the repair material is installed in the light emitting region 1190. However, since the repair material has only a diameter of about 120 μm and light is scattered by the scattering layer 1120 in the light emitting region 1190, the non-light emitting portion due to the repair material is only several tens of centimeters away from the organic LED element sample 1000 Almost no longer recognized.

As described above, according to the method of the present invention, even when a defect exists on the surface of the scattering layer or the protective layer, a short circuit is unlikely to occur between the electrodes formed on the scattering layer or the protective layer. It was confirmed that an organic LED element can be produced.

(Example 2)
As described above, in the case of the configuration shown in FIGS. 4 and 7, when the organic EL element emits light, light can be obtained from the entire surface including the portion where the repair material is provided. For this reason, in the case of the structure shown in FIG. 4 and FIG. 7, it is thought that the advantage that a repair material becomes difficult to visually recognize is acquired.

In order to confirm this, an organic EL element was prepared according to the following procedure, and the appearance of the light emitting state was observed.

First, a glass substrate having a scattering layer and a protective layer formed thereon was prepared in the same manner as in Example 1 described above.

Next, a repair material was installed on the protective layer. As an installation method of the repair material, an application needle method as shown in FIG. 21 was adopted.

As the repair material, polyimide varnish (C-5420: manufactured by Mitsubishi Gas Chemical) was used. The repair material was applied in a substantially circular shape with a diameter of 110 μm and a film thickness of 1.2 μm.

In Example 2, since the purpose is to confirm the visibility of light emission in the portion where the repair material is installed, the repair material is not necessarily applied to the defective portion.

Since polyimide material has relatively good heat resistance, it has a feature that deterioration is small even when an ITO layer is formed under high temperature conditions. In addition, since the polyimide material has a low coefficient of thermal expansion and is close to ITO, there is little risk of occurrence of defects such as stress-induced cracks after the formation of the ITO layer. Therefore, the polyimide material is suitable as a repair material.

After applying the repair material, the entire glass substrate was heated at 140 ° C. for about 10 minutes using an oven to cure the repair material.

Next, an ITO layer was formed on the protective layer so as to cover the portion where the repair material was disposed. Furthermore, an organic light emitting layer and a second electrode were formed on the ITO layer. Thereafter, nitrogen sealing was performed to complete an organic EL element sample. These processing methods and conditions such as the mask shape are the same as those in the first embodiment.

A voltage of about 5 V was applied between both electrodes of the obtained organic EL element sample, and the light emission state was observed.

FIG. 32 schematically shows an observation result (illustration of an optical microscope image) of an organic EL element sample in a light emitting state. In the figure, the location indicated by the arrow corresponds to the area where the repair material is installed. In addition, this figure is an observation result at the time of focusing on the surface on the opposite side to the surface which formed each layer of the glass substrate in the organic EL element sample.

From this figure, it can be seen that the entire field of view has uniform brightness, and it is difficult to visually recognize the part where the repair material is installed.

In addition, in the organic EL element sample, when the same observation was performed focusing on the light emitting surface of the organic light emitting layer, the region where the repair material was installed was slightly darker than the peripheral part, but good light emission was achieved. It was confirmed that

Thus, in the case of the configuration as shown in FIGS. 4 and 7, it was confirmed that when the organic EL element was caused to emit light, light was obtained from the entire surface, and the repair material was difficult to visually recognize.

(Example 3)
Next, the following evaluation was performed in order to confirm that a continuous film can be formed on top of the protective layer (and the repair material) by disposing a repair material on the defects present on the surface of the protective layer.

First, a glass substrate having a scattering layer and a protective layer formed thereon was prepared by the same method as in Example 1 described above.

Next, the location where the defect exists on the surface of the protective layer was searched by microscopic observation, and the location of the found defect was grasped. In this evaluation, among these, the defect which consists of a foreign material with a major axis of about 50 micrometers was selected as shown in FIG.

A three-dimensional image of this defect was obtained using a confocal microscope. Moreover, the uneven | corrugated shape of the cross section of the area | region shown with the dotted line in FIG.

The measurement results are shown in FIG.

From this result, it can be seen that the foreign matter itself has a sharp uneven shape, and the periphery of the foreign matter is a dent. When an organic EL element is formed by depositing each layer on this defect, it is considered that there is a high possibility that the coverage of the film is lowered and the first electrode and the second electrode are short-circuited.

Next, a repair material was installed on this defect by a coating needle method as shown in FIG. A polyimide varnish (C-5420: manufactured by Mitsubishi Gas Chemical) was used as a repair material. The repair material was applied in a substantially circular shape having a diameter of 102 μm and a film thickness of 1.6 μm.

FIG. 35 shows the measurement results of the cross-sectional irregularities in the defective portion after the repair material is applied. From FIG. 35, it can be seen that a smooth state is obtained on the surface of the protective layer by covering the defect with the repair material.

It is clear that short-circuiting between the first electrode (ITO layer) and the second electrode is significantly suppressed when each layer below the ITO layer is formed on such a smooth protective layer. I will.

The present invention can be applied to an organic LED element used for a light emitting device or the like.

This application claims priority based on Japanese Patent Application No. 2012-057961 filed on March 14, 2012, the entire contents of which are incorporated herein by reference.

DESCRIPTION OF SYMBOLS 1 Conventional organic LED element 10 Glass substrate 20 Scattering layer 21 Foreign material 25 1st side surface 26 2nd side surface 29 Surface of scattering layer 31 Recessed part 35 Side part 36 Bottom part 40 Transparent electrode (anode)
41a to 41c Layer portion 42a to 42c Layer portion 50 Organic light emitting layer 51a to 51c Layer portion 52a to 52c Layer portion 60 Second electrode (cathode)
61a to 61c Layer portion 62a to 62c Layer portion 100 Organic LED device according to first embodiment 110 Transparent substrate 120 Scattering layer 121 Base material 124 Scattering substance 129 Surface of scattering layer 140 First electrode (anode)
150 Organic light emitting layer 160 Second electrode (cathode)
170 Repair Material 190 Light Extraction Surface 200 Organic LED Element According to Second Example 210 Transparent Substrate 220 Scattering Layer 221 Base Material 224 Scattering Material 230 Protective Layer 240 First Electrode 250 Organic Light-Emitting Layer 260 Second Electrode 270 Repair Material 290 Light Extraction surface 300 Organic LED element according to third embodiment 310 Transparent substrate 320 Scattering layer 321 Base material 324 Scattering substance 340 First electrode 341a to 341c Layer portion 342a to 342c Layer portion 350 Organic light emitting layer 360 Second electrode 370 Repair material 390 Light extraction surface 400 Organic LED element according to fourth embodiment 410 Transparent substrate 420 Scattering layer 421 Base material 424 Scattering substance 430 Protective layer 440 First electrode 441a to 441c Layer portion 442a to 442c Layer portion Minute 450 Organic light emitting layer 460 Second electrode 470 Repair material 490 Light extraction surface 500 Organic LED element according to the fifth example 510 Transparent substrate 520 Scattering layer 521 Base material 524 Scattering substance 540 First electrode 541a to 541c Layer portion 542a to 542c layer portion 550 organic light emitting layer 560 second electrode 570 repair material 580 additional conductive layer 581a to 581c layer portion 582a to 582c layer portion 590 light extraction surface 600 organic LED element 610 transparent substrate 620 scattering layer 621 base according to the sixth embodiment Material 624 Scattering substance 630 Protective layer 640 First electrode 641a to 641c Layer portion 642a to 642c Layer portion 650 Organic light emitting layer 660 Second electrode 670 Repair material 680 Additional conductive layer 681a to 681c Layer portion 682a to 682c Layer portion 690 Light extraction surface 910 Application needle 911 Main body 912 Tapered portion 913 Tip 916, 923 Liquid 920 Container 925 Raw material liquid 950 Tube member 952 Nozzle portion 954 Central needle 956 Liquid 957, 958 Droplet 1000 Organic LED element sample 1 First glass substrate 1120 Scattering layer 1140 ITO layer 1150 Organic light emitting layer 1160 Al layer 1162 Additional region 1190 Light emitting part

Claims

A transparent substrate, a scattering layer formed on the transparent substrate, a first electrode formed on the scattering layer, an organic light emitting layer formed on the first electrode, and the organic light emitting layer An organic LED element having a second electrode formed on
An organic LED element, wherein a repair material is disposed in a portion where the first electrode and the organic light emitting layer are not in contact with each other.
A transparent substrate, a scattering layer formed on the transparent substrate, a first electrode formed on the scattering layer, an organic light emitting layer formed on the first electrode, and the organic light emitting layer An organic LED element having a second electrode formed on
There are defects on the surface of the scattering layer,
A repair material is present in the portion of the defect, and the repair material is disposed so as to cover the defect in a state of being in contact with a portion shadowed by the defect of the scattering layer,
The organic LED element, wherein the first electrode is formed of a continuous layer covering the repair material.
3. The organic LED element according to claim 1, further comprising a protective layer on the scattering layer.
The repair material is disposed on a defective portion of the surface of the scattering layer or the protective layer,
The organic LED element according to any one of claims 1 to 3, wherein the defect is a foreign matter and / or a concave portion.
The organic LED element according to any one of claims 1 to 4, wherein the repair material includes resin, glass, ceramic, and / or metal.
The organic LED element according to any one of claims 1 to 5, wherein the first electrode has a two-layer structure of an electrode layer and an additional conductive layer.
The organic LED element according to any one of claims 1 to 6, wherein the scattering layer includes a base material made of glass and a plurality of scattering materials dispersed in the base material.
A translucent substrate having a transparent substrate, a scattering layer formed on the transparent substrate, and a first electrode formed on the scattering layer,
A translucent substrate comprising a repair material formed on the first electrode so that the scattering layer is not exposed.
A translucent substrate having a transparent substrate, a scattering layer formed on the transparent substrate, a protective layer formed on the scattering layer, and a first electrode formed on the protective layer. ,
A translucent substrate comprising a repair material formed on the first electrode so that the protective layer is not exposed.
The translucent substrate according to claim 8 or 9, wherein the first electrode is formed of a continuous layer covering the repair material.
A method of manufacturing a translucent substrate having a transparent substrate, a scattering layer, and a first electrode,
(1a) forming the scattering layer on the transparent substrate;
(1b) forming the first electrode on the scattering layer;
(1c) forming a repair material on the first electrode so that the scattering layer is not exposed;
Having a method.
A method for producing a translucent substrate having a transparent substrate, a scattering layer, a protective layer, and a first electrode,
(2a) forming the scattering layer on the transparent substrate;
(2b) forming the protective layer on the scattering layer;
(2c) forming the first electrode on the protective layer;
(2d) forming a repair material on the first electrode so that the protective layer is not exposed;
Having a method.
The repair material is disposed on a defective portion of the surface of the scattering layer or the protective layer,
The method according to claim 11, wherein the defect is a foreign object and / or a recess.
14. The method according to claim 11, wherein the repair material includes resin, glass, ceramic, and / or metal.
The method according to claim 11, wherein the first electrode has a two-layer structure of an electrode layer and an additional conductive layer.