WO2013133652A1 - Plaque de connexion combinée à une fpcb pour haut-parleur à panneau plat - Google Patents

Plaque de connexion combinée à une fpcb pour haut-parleur à panneau plat Download PDF

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Publication number
WO2013133652A1
WO2013133652A1 PCT/KR2013/001872 KR2013001872W WO2013133652A1 WO 2013133652 A1 WO2013133652 A1 WO 2013133652A1 KR 2013001872 W KR2013001872 W KR 2013001872W WO 2013133652 A1 WO2013133652 A1 WO 2013133652A1
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WO
WIPO (PCT)
Prior art keywords
plate
voice coil
lead
pair
printed
Prior art date
Application number
PCT/KR2013/001872
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English (en)
Korean (ko)
Inventor
김동만
Original Assignee
주식회사 엑셀웨이
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Application filed by 주식회사 엑셀웨이 filed Critical 주식회사 엑셀웨이
Publication of WO2013133652A1 publication Critical patent/WO2013133652A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details

Definitions

  • the present invention relates to a flat speaker, and more particularly, to an FPCB integrated lead plate for a flat speaker manufactured in the form of a flexible printed circuit board (FPCB) for electrical connection with a voice film.
  • FPCB flexible printed circuit board
  • the speaker includes a voice coil and a diaphragm interposed between the magnets, and generates sound by vibrating the diaphragm by the movement of the voice coil.
  • magnets are arranged at regular intervals on both sides of the flat voice coil and its sides to generate organic electromotive force according to Flaming's left-hand law and Lorentz's principle, forming a frequency according to voice, and the frequency vibrates the diaphragm Is reproduced.
  • the voice coil is spirally wound or printed in an elliptical shape on one side or both sides of a plate-shaped coil base to form a voice coil plate.
  • the vibration plate is attached to the upper end of the voice coil plate in the longitudinal direction, and the vibration plate vibrates according to the movement of the voice coil plate to generate sound.
  • Conventional flat speakers are electrically connected to each other by soldering lead wires between both terminals (+ and ⁇ terminals) of the voice film and external input / output terminals in order to apply power to the voice film.
  • the soldering work by the lead wire has a problem of difficulty in soldering work due to the fluidity of the lead wire, a high defect rate of the soldering part of the lead wire, and the increase of the airborne time due to the soldering work, which leads to a problem of low productivity.
  • An object of the present invention for solving the above-described problems is to improve the productivity, to facilitate the electrical connection between the voice film and the external input and output terminals, and to provide a flat plate speaker FPCB integrated lead plate to minimize the solder failure rate To provide.
  • the FPCB integrated lead plate for a flat panel speaker according to the present invention for solving the above problems is pattern printed on a flexible insulating substrate with a conductive material, and at one end, the pattern printed with a predetermined area to be connected to the voice coil plate and insulated from each other.
  • a pair of lead copper foils, a pair of external input / output terminals pattern-printed and insulated from each other at a predetermined area so as to be connected to an external power source, and the pair of lead copper foils and a pair of external input / output terminals are electrically connected to each other. It comprises a lead wire made of a conductor pattern to be connected by.
  • a pair of coil copper foils electrically connected to the both ends of the coil pattern-printed on the voice coil plate is formed, and the pair of coil copper foils are implemented to face-to-face contact with the pair of lead copper foils perpendicularly to each other. It is desirable for the convenience of soldering for electrical connection between copper foils.
  • both ends of the pattern-coiled coil may be formed on both sides of the same position with respect to the voice coil plate, respectively.
  • one end of the pattern printed coil is formed at the lower end or the upper side of one side based on the voice coil plate, and the other end of the pattern printed coil is formed at the lower end or the upper side of the other side based on the voice coil plate.
  • the voice coil plate is formed at the lower end or the upper side of the other side based on the voice coil plate.
  • the FPCB integrated lead plate for the flat panel speaker may be located between the diaphragm and the voice coil plate.
  • the FPCB integrated lead plate for the flat panel speaker may be located opposite to the portion where the voice coil plate is in contact with the diaphragm.
  • FIG. 1 is a structural diagram of a flat speaker to which an FPCB integrated lead plate according to a first embodiment of the present invention is applied.
  • FIG. 2 is a perspective view of an FPCB integrated lead plate according to a first embodiment of the present invention.
  • FIG. 3 is a structural diagram of a flat panel speaker to which an FPCB integrated lead plate according to a second exemplary embodiment of the present invention is applied.
  • FIG. 4 is a perspective view of an FPCB integrated lead plate according to a second embodiment of the present invention.
  • FIG. 5 is a structural diagram of a flat panel speaker to which an FPCB integrated lead plate according to a third exemplary embodiment of the present invention is applied.
  • FIG. 6 is a perspective view of an FPCB integrated lead plate according to a third embodiment of the present invention.
  • the FPCB integrated lead plate of the present invention refers to an integral part of a lead plate and an external input / output terminal of a flat speaker manufactured in the form of a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the lead plate and the external input / output terminals are divided into + and-terminals, and each same pole is connected to each other, and each of the + and-terminals of the lead plate is connected to the coil terminal of the voice film and the other terminal, respectively.
  • the FPCB integrated lead plate of the present invention is applied only to an even-layer multi-layer PCB voice film.
  • one end is formed at the lower end of the PCB after the coil winding in the track form, and the other end is located at the center of the PCB winding.
  • the middle part of the PCB winding it is impossible to make a soldering copper foil that can be connected to the + and-terminals of the lead plate.
  • one end is formed at the outer end of the first layer, and the second layer is formed in the form of a simple winding, and the other end is formed inside the three-layer winding, so that the PCB voice film and the + and-lead plates are formed. It is impossible to form a copper foil solder to connect the
  • the winding of the first layer is formed at both ends after the winding of the second layer through the inner through hole, so that it is possible to form a copper foil for soldering at both ends.
  • FIG. 1 is a structural diagram of a flat panel speaker to which an FPCB integrated lead plate according to a first embodiment of the present invention is applied
  • FIG. 2 is a perspective view of an FPCB integrated lead plate according to a first embodiment of the present invention.
  • the flat speaker to which the FPCB integrated lead plate according to the present invention is applied is a voice coil plate 16 pattern-printed with a voice coil in the form of a printed circuit pattern (PRINT CIRCUIT BOARD) and a voice.
  • a diaphragm 15 electrically connected to an upper portion of the lead plate 17 and connected to the upper portion of the lead plate 17 to transfer vibration energy to the negative.
  • a base frame (not shown) may be further formed.
  • the magnetic bodies 14a and 14b may be formed in the form of a combination of the magnets 11a and 11b and the yoke or the magnet plates 12a, 12b, 13a, and 13b at the top and bottom of the magnets 11a and 11b. While maintaining the pair, the pair is formed side by side and the voice coil plate 16 is inserted between the formed gaps.
  • the magnetic coil 17 is disposed at regular intervals on the voice coil plate 16 and both sides thereof, so that when the current flows through the voice coil, an organic electromotive force is generated according to the left law of flaming and the Lorentz principle.
  • the voice coil plate 16 moves up and down by the organic electromotive force.
  • the lead plate 17 is manufactured in the form of a flexible printed circuit board (FPCB), and is positioned between the voice coil plate 16 and the vibration plate 15 so that one side of the lead plate 17 is both ends of the coil of the voice coil plate 16. And soldered connection, the other side is formed with an external input and output terminal connected to the external power source.
  • FPCB flexible printed circuit board
  • the lead plate 17 can eliminate the existing wire-shaped lead wires and facilitate the soldering operation for connecting the lead wires to the + and-terminals of the voice coil plate 16 and the external input / output terminals.
  • the lead plate and external input / output terminals are formed on the FPCB at the same time, so it is not necessary to form a separate external input / output terminal, resulting in cost reduction effect.
  • the lead plate 17 of the present invention can bring about ease of soldering operation to maximize productivity, and the coil ends of the copper foil 20 for the lead formed on one end of the lead plate 17 and the voice coil plate 16 are provided.
  • the copper foil for coils 19 connected to each other are formed in a thin film form having a predetermined area to each other and face-to-face contact is made at right angles to each other.
  • solder 18 When the solder 18 is performed between the copper foils 19 and 20 on both sides in the state where the surface-to-face contact is made, the coil copper foil and the lead copper foils 19 and 20 are electrically connected to each other.
  • This type of soldering method is to perform soldering only in the area where there is a face-to-face contact, it is possible to improve the productivity and minimize the failure rate compared to soldering a conventional lead wire to the terminal.
  • the lead plate 17 is soldered to the coil copper foil 19 formed at the coil end of the voice coil plate 16 at one end, +,- Lead copper foils 24a and 24b are formed, and at the other end, external input / output terminals 25a and 25b electrically connected to the lead copper foils 24a and 24b are formed by conductors 21a and 21b.
  • Conductors 21a and 21b, lead copper foils 24a and 24b, and external input / output terminals 25a and 25b are printed on the insulator by conductive material to form an FPCB, and the conductors patterned on the insulators 22a and 22b ( 21a and 21b serve as lead wires 23a and 23b together with the insulators 22a and 22b.
  • the lead plate 17 integrally forms the lead wires 23a and 23b and the external input / output terminals 25a and 25b, and is manufactured in an FPCB form in which a conductor is pattern-printed on a flexible insulating board, thereby enabling mass production. It has the advantage of increasing the efficiency of.
  • FIG. 3 is a structural diagram of a flat panel speaker to which an FPCB integrated lead plate according to a second embodiment of the present invention is applied
  • FIG. 4 is a perspective view of an FPCB integrated lead plate according to a second embodiment of the present invention.
  • the pattern shape of the voice coil formed in the voice coil plate 36 is different from that of the flat speaker of FIG.
  • the voice coil of the voice coil plate 16 of FIG. 1 is in the form of a spiral winding where both ends of the coil are formed on both sides of the lower right side in the drawing, and the voice coil of the voice coil plate 36 of FIG. It is formed in the lower right side, and the other side is a spiral winding form formed in the lower left side of a back side.
  • one side of the lead copper foil 44a formed on the lead plate 37 of FIG. 4 is formed long in the form of a tail (long along the voice coil plate) to be soldered by face-to-face contact. .
  • the flat panel speaker has a voice coil plate 36 pattern-printed with a voice coil in the form of a track pattern printed with a track shape, and the voice coil plate 36 is fixed to the left and right sides of the voice coil plate 36.
  • a diaphragm 35 connected to an upper portion of the lead plate 17 to transmit vibration energy to a sound, and further formed of a base frame (not shown) of a synthetic resin material which forms various appearances and can be combined with various components. Can be.
  • the lead plate 37 is formed at one end with a copper foil 39 for the lead connected to one end of the coil of the voice coil plate 36 and a positive electrode (or -pole) lead copper foil 44b, and a coil connected to the other end of the coil.
  • the lead copper foil 44a of the -pole (or + pole) which is soldered with the copper foil 39 is formed, and the other end is electrically connected to the lead copper foils 44a and 44b by the conductors 41a and 41b.
  • Input and output terminals 45a and 45b are formed.
  • the conductors 41a and 41b, the lead copper foils 44a and 44b, and the external input / output terminals 45a and 45b are pattern printed on the insulating substrate with conductive material to form an FPCB, and the conductors patterned on the insulators 42a and 42b.
  • 41a and 41b serve as lead wires 43a and 43b together with insulators 42a and 42b.
  • FIG. 5 is a structural diagram of a flat panel speaker to which an FPCB integrated lead plate according to a third exemplary embodiment of the present invention is applied
  • FIG. 6 is a perspective view of an FPCB integrated lead plate according to a third exemplary embodiment of the present invention.
  • the pattern shape of the voice coil formed in the voice coil plate 56 is different from that of the flat speaker of FIG.
  • the voice coil of the voice coil plate 16 of FIG. 1 is a vortex winding form in which both ends of the coil are formed on both sides of the lower right side in the drawing, and both ends of the coil are formed in the portion in contact with the diaphragm 15, and the voice coil plate 56 of FIG.
  • the voice coil of) is a vortex winding form in which both ends of the coil are formed on both sides of the lower right side of the drawing, and both ends of the coil are formed on the opposite side of the portion where the vibration plate 55 abuts.
  • the lead plate 57 shown in FIGS. 5 and 6 has the same structure as that of the lead plate 37 shown in FIGS. 1 and 2, except that the case of FIG.
  • the lead plate 17 is interposed between the diaphragm 15 and the voice coil plate 16, and in the case of FIG. 5, only the lead plate 57 is positioned on the upper right side of the voice coil plate 56.
  • the flat panel speaker has a voice coil plate 56 pattern-printed with a voice coil in the form of a track pattern printed with a track shape, and the voice coil plate 56 is fixed to the left and right sides of the voice coil plate 56.
  • the structure of the lead plate 57 is almost the same as that of the lead plate 17 of FIG. 2, and the shape of the portion where the lead copper foil is formed is somewhat different, but it may be formed as in the structure of FIG. 2 or as in the structure of FIG. 6. You may form.
  • Another type of lead plate structure may be considered as follows.
  • the lead plate of FIG. 4 is formed at the position as shown in FIG. 5.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

La présente invention porte sur un haut-parleur à panneau plat et, plus spécifiquement, sur une plaque de connexion combinée à une carte de circuit imprimé souple (FPCB) pour haut-parleur à panneau plat, qui est fabriquée sous la forme d'une FPCB et est configurée pour établir une connexion électrique à un film acoustique. La plaque de connexion combinée à une FPCB pour haut-parleur à panneau plat selon la présente invention est faite d'un matériau conducteur et est soumise à une formation de motifs et imprimée sur un substrat isolant souple, et comprend : une paire de feuilles de cuivre pour former une patte, qui sont soumises à une formation de motifs et imprimées dans une zone prédéterminée sur une extrémité de la plaque de connexion de manière à établir une connexion à une plaque de bobine acoustique et sont isolées l'une de l'autre ; une paire de bornes d'entrée et de sortie externes qui sont soumises à une formation de motifs et imprimées dans une zone prédéterminée sur l'autre extrémité de la plaque de connexion de manière à établir une connexion à une source d'alimentation externe et sont isolées l'une de l'autre ; un fil conducteur comprenant un motif conducteur pour connecter électriquement la paire de feuilles de cuivre de patte et la paire de bornes d'entrée et de sortie externes les unes aux autres, respectivement.
PCT/KR2013/001872 2012-03-08 2013-03-07 Plaque de connexion combinée à une fpcb pour haut-parleur à panneau plat WO2013133652A1 (fr)

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Application Number Priority Date Filing Date Title
KR1020120023781A KR101297658B1 (ko) 2012-03-08 2012-03-08 평판 스피커용 ｆｐｃｂ 일체형 리드 플레이트
KR10-2012-0023781 2012-03-08

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Cited By (9)

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US9084845B2 (en) 2011-11-02 2015-07-21 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
US9427505B2 (en) 2012-05-15 2016-08-30 Smith & Nephew Plc Negative pressure wound therapy apparatus
CN105916071A (zh) * 2016-07-06 2016-08-31 沈伟 一种柔性受话器、扬声器
US9452244B2 (en) 2004-04-27 2016-09-27 Smith & Nephew Plc Wound cleansing apparatus with stress
US9901664B2 (en) 2012-03-20 2018-02-27 Smith & Nephew Plc Controlling operation of a reduced pressure therapy system based on dynamic duty cycle threshold determination
US9956121B2 (en) 2007-11-21 2018-05-01 Smith & Nephew Plc Wound dressing
WO2020034706A1 (fr) * 2018-08-13 2020-02-20 瑞声声学科技(深圳)有限公司 Haut-parleur
US10682446B2 (en) 2014-12-22 2020-06-16 Smith & Nephew Plc Dressing status detection for negative pressure wound therapy
CN112616116A (zh) * 2020-12-31 2021-04-06 苏州东立电子有限公司 一种超线性喇叭工艺

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CN104822111B (zh) * 2015-03-31 2018-10-12 歌尔股份有限公司 一种扬声器模组
KR102061173B1 (ko) * 2018-08-07 2020-02-11 임성진 슬림 자기 코어를 구비한 장방형의 평판형 슬림 스피커

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KR20120016838A (ko) * 2010-08-17 2012-02-27 주식회사 엑셀웨이 평판형 스피커용 보이스 코일판의 댐퍼 및 리드 와이어 기능을 갖는 댐퍼-리드 플레이트
KR20120016719A (ko) * 2010-08-17 2012-02-27 주식회사 엑셀웨이 평판형 스피커용 보이스 코일판과 진동판 사이에 장착되는 진동-리드 플레이트

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KR100963559B1 (ko) * 2009-07-20 2010-06-15 범진아이엔디(주) 슬림형 스피커
KR20120016838A (ko) * 2010-08-17 2012-02-27 주식회사 엑셀웨이 평판형 스피커용 보이스 코일판의 댐퍼 및 리드 와이어 기능을 갖는 댐퍼-리드 플레이트
KR20120016719A (ko) * 2010-08-17 2012-02-27 주식회사 엑셀웨이 평판형 스피커용 보이스 코일판과 진동판 사이에 장착되는 진동-리드 플레이트

Cited By (33)

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Publication number Priority date Publication date Assignee Title
US9526817B2 (en) 2004-04-27 2016-12-27 Smith & Nephew Plc Wound cleansing apparatus with stress
US11617823B2 (en) 2004-04-27 2023-04-04 Smith & Nephew Plc Wound cleansing apparatus with stress
US10342729B2 (en) 2004-04-27 2019-07-09 Smith & Nephew Plc Wound cleansing apparatus with stress
US9452244B2 (en) 2004-04-27 2016-09-27 Smith & Nephew Plc Wound cleansing apparatus with stress
US11179276B2 (en) 2007-11-21 2021-11-23 Smith & Nephew Plc Wound dressing
US11364151B2 (en) 2007-11-21 2022-06-21 Smith & Nephew Plc Wound dressing
US11129751B2 (en) 2007-11-21 2021-09-28 Smith & Nephew Plc Wound dressing
US9956121B2 (en) 2007-11-21 2018-05-01 Smith & Nephew Plc Wound dressing
US10016309B2 (en) 2007-11-21 2018-07-10 Smith & Nephew Plc Wound dressing
US10744041B2 (en) 2007-11-21 2020-08-18 Smith & Nephew Plc Wound dressing
US10231875B2 (en) 2007-11-21 2019-03-19 Smith & Nephew Plc Wound dressing
US10555839B2 (en) 2007-11-21 2020-02-11 Smith & Nephew Plc Wound dressing
US11351064B2 (en) 2007-11-21 2022-06-07 Smith & Nephew Plc Wound dressing
US11648342B2 (en) 2011-11-02 2023-05-16 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
US11253639B2 (en) 2011-11-02 2022-02-22 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
US9084845B2 (en) 2011-11-02 2015-07-21 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
US10143783B2 (en) 2011-11-02 2018-12-04 Smith & Nephew Plc Reduced pressure therapy apparatuses and methods of using same
US10881764B2 (en) 2012-03-20 2021-01-05 Smith & Nephew Plc Controlling operation of a reduced pressure therapy system based on dynamic duty cycle threshold determination
US11730877B2 (en) 2012-03-20 2023-08-22 Smith & Nephew Plc Controlling operation of a reduced pressure therapy system based on dynamic duty cycle threshold determination
US9901664B2 (en) 2012-03-20 2018-02-27 Smith & Nephew Plc Controlling operation of a reduced pressure therapy system based on dynamic duty cycle threshold determination
US10299964B2 (en) 2012-05-15 2019-05-28 Smith & Nephew Plc Negative pressure wound therapy apparatus
US10702418B2 (en) 2012-05-15 2020-07-07 Smith & Nephew Plc Negative pressure wound therapy apparatus
US9545465B2 (en) 2012-05-15 2017-01-17 Smith & Newphew Plc Negative pressure wound therapy apparatus
US9427505B2 (en) 2012-05-15 2016-08-30 Smith & Nephew Plc Negative pressure wound therapy apparatus
US11654228B2 (en) 2014-12-22 2023-05-23 Smith & Nephew Plc Status indication for negative pressure wound therapy
US10973965B2 (en) 2014-12-22 2021-04-13 Smith & Nephew Plc Systems and methods of calibrating operating parameters of negative pressure wound therapy apparatuses
US10780202B2 (en) 2014-12-22 2020-09-22 Smith & Nephew Plc Noise reduction for negative pressure wound therapy apparatuses
US10737002B2 (en) 2014-12-22 2020-08-11 Smith & Nephew Plc Pressure sampling systems and methods for negative pressure wound therapy
US10682446B2 (en) 2014-12-22 2020-06-16 Smith & Nephew Plc Dressing status detection for negative pressure wound therapy
CN105916071A (zh) * 2016-07-06 2016-08-31 沈伟 一种柔性受话器、扬声器
WO2020034706A1 (fr) * 2018-08-13 2020-02-20 瑞声声学科技(深圳)有限公司 Haut-parleur
CN112616116B (zh) * 2020-12-31 2022-04-22 苏州东立电子有限公司 一种超线性喇叭工艺
CN112616116A (zh) * 2020-12-31 2021-04-06 苏州东立电子有限公司 一种超线性喇叭工艺

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