WO2013129186A1 - Pressure-sensor package and method for producing same - Google Patents

Pressure-sensor package and method for producing same Download PDF

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Publication number
WO2013129186A1
WO2013129186A1 PCT/JP2013/054019 JP2013054019W WO2013129186A1 WO 2013129186 A1 WO2013129186 A1 WO 2013129186A1 JP 2013054019 W JP2013054019 W JP 2013054019W WO 2013129186 A1 WO2013129186 A1 WO 2013129186A1
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WO
WIPO (PCT)
Prior art keywords
pressure sensor
lid
package
sensor package
pressure
Prior art date
Application number
PCT/JP2013/054019
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French (fr)
Japanese (ja)
Inventor
佳孝 安達
晃宏 奥川
正男 清水
禎 甲斐
井上　勝之
Original Assignee
オムロン株式会社
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Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to DE112013001218.9T priority Critical patent/DE112013001218B4/en
Publication of WO2013129186A1 publication Critical patent/WO2013129186A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/161—Cap
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    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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Definitions

  • the present invention relates to a pressure sensor package on which a diaphragm type pressure sensor is mounted and a method for manufacturing the same, and more particularly to a method for installing a pressure guiding portion.
  • a pressure sensor is a device that measures the pressure of a gas or liquid with a pressure-sensitive element via a diaphragm, converts the pressure into an electrical signal, and outputs the electrical signal.
  • a semiconductor strain gauge is formed on the surface of the diaphragm, and changes in electrical resistance due to the piezoresistive effect, which is a pressure-sensitive resistance element generated by deformation of the diaphragm by external force (pressure), are converted into electrical signals. is doing.
  • the above pressure sensor measures absolute pressure based on the absolute vacuum, and any comparison pressure such as atmospheric pressure It is roughly classified into two types: a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to (reference pressure).
  • a pressure sensor package disclosed in Patent Document 1 is known as a conventional technique related to a pressure sensor package on which the diaphragm type pressure sensor is mounted.
  • the pressure sensor package 100 disclosed in Patent Document 1 includes a rectangular box-shaped package 101 to which an absolute pressure sensor 110 is fixed, and a lid 120 that is a lid that covers the upper opening of the package 101. And.
  • the absolute pressure sensor 110 has a vacuum cavity 111 therein, and a plurality of piezoresistors (not shown) in which the deformation of the diaphragm 112 due to the pressure difference between the vacuum cavity 111 and the outside is arranged around the diaphragm 112. Therefore, the size is detected.
  • the detection value of the absolute pressure sensor 110 is output to an external device (not shown) via an external connection terminal 102 formed on the lower side of the rectangular box-shaped package 101.
  • an opening 121 which is a pressure guiding portion, is formed immediately above the absolute pressure sensor 110, that is, at the center position of the lid 120, thereby exposing the inside of the pressure sensor package 100 to the pressure to be measured. It is like that.
  • Patent Document 2 Another conventional pressure sensor package is disclosed in Patent Document 2.
  • the planar shape is on both ends on one diagonal line in the lid 220 having a square shape. Pressure introducing holes 221 and 221 are formed.
  • Japanese Patent Publication Japanese Patent Laid-Open No. 2010-96505 (published on April 30, 2010)” Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-28169 (published on Dec. 16, 2010)”
  • the present invention has been made in view of the above-described conventional problems, and its purpose is to prevent stray light to the pressure sensor when the pressure guiding portion is provided, to prevent deterioration of the characteristics of the pressure sensor, and
  • An object of the present invention is to provide a pressure sensor package and a method for manufacturing the same that can suppress an increase in cost.
  • the pressure sensor package of the present invention covers the package main body in a state in which a concave-shaped package main body in which the pressure sensor is mounted and the internal space is secured above the diaphragm of the pressure sensor.
  • a pressure sensor package including a lid made of a light shielding member, the package body and the lid are partially bonded at a plurality of locations, and the portion other than the partial adhesion between the package body and the lid Is characterized in that a gap is formed to communicate the outside of the package body and the internal space.
  • the pressure sensor package includes a recess-shaped package body in which the pressure sensor is mounted, and a light shielding member that covers the package body in a state where an internal space is secured above the diaphragm of the pressure sensor. And a lid.
  • a pressure guiding unit that communicates the outside air with the pressure sensor is required.
  • noise is generated in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
  • it is conceivable to drill a pressure guiding portion in the package body but when the package body is made of a ceramic material, it is difficult to drill in the ceramic material. That is, in the ceramic material, even if the through hole is provided, it is fired in the final process, so it is difficult to ensure the shape of the through hole.
  • the pressure guiding portion is formed by devising the structure of the lid. Specifically, in the pressure sensor package of the present invention, the package main body and the lid are partially bonded at a plurality of locations, and the package body has a portion other than the partial adhesion between the package main body and the lid. A gap that communicates the outside of the main body and the internal space is formed.
  • the gap is provided in the lateral direction of the pressure sensor package. As a result, stray light is not applied to the pressure sensor through the gap, and noise is not generated in the sensor characteristics and the assumed sensitivity cannot be achieved.
  • the pressure guiding portion when the pressure guiding portion is provided, it is possible to provide a pressure sensor package that can prevent stray light to the pressure sensor to prevent the pressure sensor characteristics from deteriorating and suppress an increase in cost.
  • a pressure sensor package manufacturing method is a pressure sensor package manufacturing method for manufacturing the pressure sensor package described above, wherein a plurality of lids are attached to a metal plate. Each lid is formed by electroforming plating so that the cross-sectional shape of each lid becomes a hat-like shape, and bumps are included in the part to be partially bonded, and then is divided into individual pieces.
  • the pressure sensor package when the pressure sensor package is manufactured, a plurality of lids are included in the metal plate, and the bumps are included in the part to be partially bonded so that the cross-sectional shape of each lid is a hat shape.
  • the sheet is formed by electroforming plating. Then, it is separated into pieces.
  • This electroforming plating is a method of making a product by super-thinning electroplating to a thickness of millimeters on a mold, and then peeling off to make a product. In the field, it is mainly used for the production of arts and crafts and Buddha.
  • the pressure guiding portion when the pressure guiding portion is provided, it is possible to provide a method of manufacturing a pressure sensor package that can prevent stray light to the pressure sensor, prevent a decrease in the characteristics of the pressure sensor, and suppress an increase in cost.
  • the package main body and the lid are partially bonded at a plurality of locations, and the portion other than the partial adhesion between the package main body and the lid is A gap is formed to communicate the outside of the package body and the internal space.
  • the manufacturing method of the pressure sensor package according to the present invention includes a plurality of lids on the metal plate, and the bumps are included in the part to be partially bonded so that the cross-sectional shape of each lid is a hat shape. After forming by electroforming plating, it is a method of dividing into pieces.
  • (A) shows one Embodiment of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the sectional view on the AA line of (a). . It is a perspective view which shows the structure of the said pressure sensor package.
  • (A) (b) (c) is a top view which shows the various adhesion
  • (A) (b) (c) is a front view which shows the various shapes of a bump. It is sectional drawing which shows the structure of the height adjustment member which consists of a bead in the said adhesion location.
  • (A) shows the manufacturing method of a pressure sensor package, Comprising: It is a top view which shows the some lid which carried out the die-forming of the sheet form by electroforming plating, (b) is the principal part side view. (C) is an enlarged cross-sectional view of the main part of (b). It is sectional drawing which shows the structure of the said conventional pressure sensor package. (A) is sectional drawing which shows the structure of the said other conventional pressure sensor package, (b) is a perspective view which shows the structure of the said pressure sensor package.
  • FIGS. 1 to 6 An embodiment of the present invention will be described with reference to FIGS. 1 to 6 as follows.
  • the pressure sensor package of the present embodiment is a package in which a pressure sensor such as an absolute pressure sensor is mounted, for example.
  • a pressure sensor such as an absolute pressure sensor
  • the pressure sensor is an absolute pressure sensor.
  • the pressure sensor is not necessarily limited to this, and may be a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to an arbitrary pressure to be compared (reference pressure) such as atmospheric pressure.
  • FIG. 1A is a plan view showing the configuration of the pressure sensor package 1 of the present embodiment
  • FIG. 1B is a cross-sectional view taken along the line AA of FIG.
  • FIG. 2 is a perspective view showing the configuration of the pressure sensor package 1.
  • the pressure sensor package 1 includes, for example, a rectangular recess-shaped package body 20 on which the pressure sensor 10 is mounted, and will be described later.
  • a lid 30 is provided as a lid that covers the opening of the package body 20 with the internal space 21 secured above the diaphragm 11.
  • the pressure sensor 10 is an absolute pressure sensor, and as shown in FIG. 1B, a diaphragm 11 having a plurality of piezoresistors (not shown) as pressure-sensitive resistance elements formed on the periphery thereof, and a piezo in the diaphragm 11
  • a semiconductor sensor substrate 13 having a cavity 12 formed of, for example, a cylindrical space in a vacuum state is provided on the surface opposite to the surface on which the resistor is formed.
  • the diaphragm 11 is distorted according to the pressure of the internal space 21 added to the outer surface, so that the resistance values of the plurality of piezoresistors change according to the degree of distortion.
  • the midpoint potential of the bridge circuit constituted by the plurality of piezoresistors is output as a sensor output to an external device (not shown).
  • the absolute pressure can be measured by the differential pressure between the outside air and the vacuum.
  • the recess-shaped package body 20 is made of a ceramic material and has two steps of recesses.
  • the package body 20 is not necessarily made of a ceramic material, but may be made of a resin material.
  • the two-stage concave portion includes a shallow wide concave portion 22 and a narrow deep concave portion 23 formed inside the shallow wide concave portion 22.
  • the horizontal section is also square.
  • the pressure sensor 10 is mounted by being adhered to a narrow deep recess bottom 23 a as a pressure sensor mounting floor in the narrow deep recess 23 of the package body 20.
  • a plurality of pads 14 are formed around the diaphragm 11 of the pressure sensor 10, and wires 15 made of, for example, gold (Au) are connected to the pads 14.
  • the other end of the wire 15 is connected to a wire bonding pad 25 formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20.
  • the wire bonding pad 25 includes a through via wiring 26 as a through electrode wiring formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20 and an external connection terminal 27 formed on the back surface of the package body 20. It is connected to the.
  • the electrical signal from the piezoresistor of the pressure sensor 10 is electrically connected to an external device (not shown) via the wire 15, the wire bonding pad 25, the through via wiring 26 and the external connection terminal 27. Yes.
  • the lid 30 is made of, for example, a metal plate that is a light shielding member, and covers the opening of the package body 20.
  • the lid 30 is not necessarily a metal plate, and may be made of a light shielding member such as a non-conductor.
  • the lid 30 has a hat-like cross-sectional shape, and has a rectangular cap portion 31 protruding upward at the center and a flange portion 32 around the cap portion 31.
  • the dimensions of the lid 30 are, for example, 3.6 mm in length ⁇ 3.6 mm in width, and the thickness of the cap portion 31 is, for example, 0.2 mm.
  • a pressure guiding portion that communicates the outside air and the pressure sensor 10 is necessary.
  • noise is generated in sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
  • the package body 20 of the present embodiment is made of a ceramic material, it is difficult to make a hole in the ceramic material. That is, in the ceramic material, even if the through hole is provided, it is fired in the final process, so it is difficult to ensure the shape of the through hole.
  • the pressure guiding portion is formed by devising the structure of the lid 30.
  • the upper surface 20a of the package body 20 and the flange portion 32 of the lid 30 are adhesive 33 at a plurality of locations as shown in FIG.
  • a gap 34 as a pressure guiding portion is formed in a portion other than the partial adhesion between the package main body 20 and the lid 30.
  • the plurality of locations where the package body 20 and the lid 30 are partially bonded to each other include, for example, two locations at the corners of the flange portion 32 of the rectangular lid 30 as shown in FIG. It can be set as three places with one place in the center of the collar part 32 of the opposing side. Moreover, as shown in FIG. 3B and FIG. 1A, there can be four locations, one at the center of each side of the flange 32 in the rectangular lid 30. Thus, it can support more stably than three places by setting it as four places. Furthermore, as shown in (c) of FIG. 3, four places in each corner of the flange 32 can be added to the four places shown in (b) of FIG. Thereby, the lid 30 can be supported more stably. In addition, the position of partial adhesion is not necessarily limited to this, and may be another position.
  • an adhesive 33 containing a silicone resin such as a conductive paste is used for partial adhesion.
  • a flexible silicone-based resin is used as an adhesive, a seismic isolation structure is obtained, which is resistant to impact.
  • the adhesive 33 is flattened, so that a sufficient gap 34 between the package main body 20 and the lid 30 is obtained. May not be secured.
  • a height adjusting member 35 is provided at a location where the package body 20 and the lid 30 are partially bonded. For this reason, a sufficient height for communicating the outside of the package body 20 and the internal space 21 can be given to the gap 34 in a portion other than the partial adhesion between the package body 20 and the lid 30.
  • the height adjusting member 35 is composed of, for example, a bump 35a. That is, the bump 35a is a protrusion formed by plating on a semiconductor electrode portion. For this reason, the protrusion as the height adjusting member can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor 10 and the pressure sensor package 1.
  • the bump 35a is provided as the height adjusting member 35, an adhesive 33 is disposed around the bump 35a as shown in FIG. Therefore, the tip of the bump 35a comes into contact with the upper surface 20a of the package body 20 or a metal wiring pattern 28 described later.
  • FIG. 4 (a), FIG. 4 (b), and FIG. 4 (c) various shapes can be considered as shown in FIG. 4 (a), FIG. 4 (b), and FIG. 4 (c).
  • FIG. 4 (a) it can be a truncated cone or a truncated pyramid, or as shown in FIG. 4 (b), it can be a cone or a polygonal pyramid such as a triangular pyramid. .
  • a cylinder or a prism such as a triangular prism or a quadrangular prism can be used.
  • the truncated cone or the truncated pyramid shown in FIGS. 4A and 4B, or a polygonal pyramid such as a cone or a triangular pyramid is easier to remove. There are benefits.
  • the height adjustment member 35 is made of the bump 35a.
  • the present invention is not limited to this.
  • a bead 35b is used as the height adjustment member 35.
  • glass beads or metal balls can be applied to the beads 35b.
  • the beads 35b it can be used by being mixed in the adhesive 33.
  • the lid 30 may accumulate electric charges. Thus, when the lid 30 has an electric charge, this electric charge may adversely affect the pressure sensor 10, and for example, a failure such as a large voltage fluctuation of the pressure sensor 10 occurs.
  • a metal wiring pattern 28 is formed on the upper surface 20a of the package body 20 as shown in FIG.
  • the bump 35a or the bead 35b made of a metal sphere comes into contact with both the lid 30 and the metal wiring pattern 28.
  • the metal wiring pattern 28 is connected to the wire bonding pad 25 formed on the shallow wide recess bottom 22a of the shallow wide recess 22 in the package body 20 described above. Therefore, when charges are accumulated in the lid 30, the bump 35 a or the bead 35 b made of a metal sphere, the metal wiring pattern 28, the wire bonding pad 25, the through via wiring 26, and the external connection terminal 27 are not illustrated. Electrically grounded to the equipment ground.
  • the lid 30 does not have a charge, so that the pressure sensor 10 is not adversely affected. Therefore, the electromagnetic noise of the pressure sensor 10 can be removed.
  • the beads 35b made of glass balls are used as the height adjusting member 35, the electrical connection between the lid 30 and the metal wiring pattern 28 can be ensured by using the conductive adhesive 33. .
  • the bumps 35a are integrally formed with the lid 30 by electroforming plating or press working.
  • the bump 35a is formed integrally with the lid 30, it is possible to reduce the number of steps in the manufacturing process and to reduce the cost as compared with the case where the bump 35a is provided after the lid 30 is formed.
  • the bump 35a of a desired shape is realizable with the shape of a metal mold
  • the lid 30 can be manufactured. Therefore, the process can be simplified in the manufacturing process, and the cost can be reduced.
  • the bumps 35a are not necessarily formed integrally with the lid 30 by electroforming plating or pressing, and may be provided separately.
  • FIG. 6A shows a method for manufacturing a pressure sensor package, and is a plan view showing a plurality of lids formed by electroforming plating on a sheet, and FIG. It is a principal part side view, (c) of FIG. 6 is a principal part expanded sectional view of (b) of FIG.
  • lids 30 when manufacturing the lid 30 of the pressure sensor package 1, a plurality of lids 30 are provided on the metal plate.
  • the lids 30 are formed by electroforming plating so that the cross-sectional shape of each lid 30 is a hat shape and the bumps 35a are included in the partially bonded portions.
  • 18 ⁇ 18 lids 30 are formed in one sheet form, for example, in a matrix form by electroforming plating. Thereafter, it is separated into pieces by dicing.
  • This electroforming plating is a method of making a product by super-thinning electroplating to a thickness of millimeters on a mold, and then peeling off to make a product. In the field, it is mainly used for the production of arts and crafts and Buddha.
  • the pressure sensor package 1 includes a package body 20 having a concave shape in which the pressure sensor 10 is mounted, and a package body with the internal space 21 secured above the diaphragm 11 of the pressure sensor 10. And a lid 30 made of a light shielding member that covers 20.
  • the package body 20 and the lid 30 are partially bonded at a plurality of locations, and the outside of the package body 20 and the internal space 21 are communicated with portions other than the partial adhesion between the package body 20 and the lid 30.
  • a gap 34 is formed.
  • the gap 34 is provided in the lateral direction of the pressure sensor package 1. As a result, stray light is not applied to the pressure sensor through the gap 34, and noise is not generated in the sensor characteristics and the assumed sensitivity cannot be achieved.
  • the pressure guiding portion when the pressure guiding portion is provided, it is possible to provide the pressure sensor package 1 that can prevent stray light to the pressure sensor 10 to prevent the characteristics of the pressure sensor 10 from deteriorating and suppress an increase in cost.
  • the package body 20 is made of a ceramic material
  • the lid 30 is made of a metal material. Since this ceramic material has high rigidity, a small linear expansion coefficient, heat resistance, and chemical resistance, it is excellent in mounting the pressure sensor 10. Therefore, the high-performance pressure sensor 10 can be provided as compared with the package body made of resin.
  • the pressure guiding portion can be easily provided by devising the structure of the lid 30 without drilling in the ceramic material.
  • the lid 30 is made of a metal material, it is opaque and has a light shielding property. For this reason, noise does not occur in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
  • a height adjusting member 35 is provided at a location where the package body 20 and the lid 30 are partially bonded. For this reason, a sufficient height for communicating the outside of the package body 20 and the internal space 21 can be given to the gap 34 in a portion other than the partial adhesion between the package body 20 and the lid 30.
  • the height adjusting member 35 is composed of bumps 35a. For this reason, the protrusion as the height adjusting member 35 can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor 10 and the pressure sensor package 1.
  • the bump 35a is formed integrally with the lid 30 by electroforming plating, press working, or punching.
  • the ground metal wiring pattern 28 is disposed on the bonding surface of the package body 20 with the lid 30. Thereby, the lid 30 can be grounded, and the generation of electromagnetic noise of the pressure sensor 10 can be prevented.
  • the lid 30 is formed in a hat shape in cross section. Therefore, since the strength can be increased as compared with the case where the lid 30 is made of a flat plate, the lid 30 can be thinned and the height of the pressure sensor package 1 can be reduced. . Further, when the pressure sensor 10 is mounted inside the concave package body 20 and the pressure sensor 10 is connected by the wire 15, the wire 15 can be prevented from coming into contact with the lid 30.
  • an adhesive containing a flexible silicone resin is used for partial adhesion.
  • it becomes a seismic isolation structure and becomes strong against an impact.
  • it is possible to alleviate distortion caused by a difference in thermal expansion coefficient between the package body 20 made of a ceramic material and the lid 30 made of a metal material.
  • the manufacturing method of the pressure sensor package 1 according to the present embodiment includes a plurality of lids 30 on a metal plate, and includes bumps 35a in a portion where the cross-sectional shape of each lid 30 is a hat shape and is partially bonded.
  • the manufacturing method of the pressure sensor package 1 according to the present embodiment includes a plurality of lids 30 on a metal plate, and includes bumps 35a in a portion where the cross-sectional shape of each lid 30 is a hat shape and is partially bonded.
  • a method of manufacturing the pressure sensor package 1 that can prevent stray light to the pressure sensor 10 to prevent a decrease in the characteristics of the pressure sensor 10 and suppress an increase in cost is provided. Can do.
  • the package body is made of a ceramic material and the lid is made of a metal material.
  • the package body is made of a ceramic material. Since this ceramic material has high rigidity, a small linear expansion coefficient, heat resistance, and chemical resistance, it is excellent in mounting a pressure sensor. Therefore, a high-performance pressure sensor can be provided as compared with a package body made of resin.
  • the pressure guiding portion can be easily provided by devising the structure of the lid without piercing the ceramic material.
  • the lid is made of a metal material, it is opaque and has light shielding properties. For this reason, noise does not occur in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
  • a height adjusting member is provided at a location where the package body and the lid are partially bonded.
  • a height adjusting member is provided at a location where the package main body and the lid are partially bonded. For this reason, sufficient height for communicating the exterior and internal space of a package main body with respect to the clearance gap in parts other than the partial adhesion
  • attachment between a package main body and a cover body can be given.
  • the height adjusting member can be made of a bump.
  • a bump is a protrusion formed by plating on a semiconductor electrode portion.
  • the protrusion as the height adjusting member can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor and the pressure sensor package.
  • the bump is formed integrally with the lid body by electroforming plating, press working or punching.
  • the bumps are formed integrally with the lid, so that the number of steps in the manufacturing process can be reduced and the cost can be reduced as compared with the case where the bumps are provided after the lid is formed.
  • the bump of desired shape is realizable with the shape of a metal mold
  • electroforming plating a method such as punching or drawing from a metal plate is not used, so a plurality of lids including bumps are formed at once by electroforming plating and then separated into pieces. A lid can be manufactured. Therefore, the process can be simplified in the manufacturing process, and the cost can be reduced.
  • a metal wiring pattern for grounding is disposed on an adhesive surface of the package body with the lid.
  • the lid body can be grounded, and the generation of electromagnetic noise of the pressure sensor can be prevented.
  • the lid has a hat shape in cross section.
  • an adhesive containing a silicone resin is used for the partial adhesion.
  • a flexible silicone resin is used as an adhesive, which results in a seismic isolation structure and resistance to impact.
  • the present invention can be applied to a pressure sensor package such as an absolute pressure sensor package on which a diaphragm type pressure sensor is mounted and a manufacturing method thereof, and is particularly useful when a ceramic package is employed.
  • the pressure sensor package can be deployed in the fields of GPS, altimeter, barometer, for example, mobile terminals, tablet PCs, activity meters, health equipment, industrial equipment and the like.

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Abstract

This pressure-sensor package (1) is provided with a concave package body (20) having a pressure sensor (10) mounted in the interior thereof, and a lid (30) comprising a light-blocking member for covering the package body (20) in a state ensuring the presence of an interior space (21) above a diaphragm (11) of the pressure sensor (10). The package body (20) and the lid (30) are each sectionally adhered to one another in a plurality of locations. The sections between the package body (20) and the lid (30) other than the sectionally adhered areas have gaps (34) formed therein for connecting the exterior of the package body (20) to the interior space (21).

Description

圧力センサパッケージ及びその製造方法Pressure sensor package and manufacturing method thereof
　本発明は、ダイアフラム型の圧力センサを実装した圧力センサパッケージ及びその製造方法に関するものであり、詳細には、導圧部の設置方法に関する。 The present invention relates to a pressure sensor package on which a diaphragm type pressure sensor is mounted and a method for manufacturing the same, and more particularly to a method for installing a pressure guiding portion.
　圧力センサは、気体や液体の圧力を、ダイアフラムを介して感圧素子にて計測し、電気信号に変換して出力する機器である。原理的には、ダイアフラムの表面に半導体ひずみゲージを形成し、外部からの力（圧力）によってダイアフラムが変形して発生する圧力感応抵抗素子であるピエゾ抵抗効果による電気抵抗の変化を電気信号に変換している。 A pressure sensor is a device that measures the pressure of a gas or liquid with a pressure-sensitive element via a diaphragm, converts the pressure into an electrical signal, and outputs the electrical signal. In principle, a semiconductor strain gauge is formed on the surface of the diaphragm, and changes in electrical resistance due to the piezoresistive effect, which is a pressure-sensitive resistance element generated by deformation of the diaphragm by external force (pressure), are converted into electrical signals. is doing.
　上記圧力センサは、外部からの力（圧力）としてどのような圧力を使用するかによって、絶対真空を基準にして表した圧力を測定する絶対圧力センサと、大気圧等のある任意の比較する圧力（基準圧）に対して表した圧力を測定する差圧（相対圧）圧力センサとの２種類に大別される。 Depending on what pressure is used as the external force (pressure), the above pressure sensor measures absolute pressure based on the absolute vacuum, and any comparison pressure such as atmospheric pressure It is roughly classified into two types: a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to (reference pressure).
　上記のダイアフラム型の圧力センサを実装した圧力センサパッケージに関する従来技術として、例えば、特許文献１に開示された圧力センサパッケージが知られている。 For example, a pressure sensor package disclosed in Patent Document 1 is known as a conventional technique related to a pressure sensor package on which the diaphragm type pressure sensor is mounted.
　上記特許文献１に開示された圧力センサパッケージ１００は、図７に示すように、絶対圧力センサ１１０が固定された矩形箱状のパッケージ１０１と、パッケージ１０１の上側開口を覆う蓋部であるリッド１２０とを備えている。上記絶対圧力センサ１１０は、その内部に真空のキャビティ１１１を有しており、この真空のキャビティ１１１と外部との差圧によるダイアフラム１１２の変形をダイアフラム１１２の周辺に配した複数の図示しないピエゾ抵抗によりその大きさを検出するものとなっている。絶対圧力センサ１１０の検出値は、矩形箱状のパッケージ１０１の下側に形成された外部接続端子１０２を介して図示しない外部装置に出力されるようになっている。 As shown in FIG. 7, the pressure sensor package 100 disclosed in Patent Document 1 includes a rectangular box-shaped package 101 to which an absolute pressure sensor 110 is fixed, and a lid 120 that is a lid that covers the upper opening of the package 101. And. The absolute pressure sensor 110 has a vacuum cavity 111 therein, and a plurality of piezoresistors (not shown) in which the deformation of the diaphragm 112 due to the pressure difference between the vacuum cavity 111 and the outside is arranged around the diaphragm 112. Therefore, the size is detected. The detection value of the absolute pressure sensor 110 is output to an external device (not shown) via an external connection terminal 102 formed on the lower side of the rectangular box-shaped package 101.
　上記リッド１２０には、絶対圧力センサ１１０の直上に、つまりリッド１２０の中央位置に導圧部である開口１２１が形成されており、これによって、圧力センサパッケージ１００の内部が測定対象圧力に晒されるようになっている。 In the lid 120, an opening 121, which is a pressure guiding portion, is formed immediately above the absolute pressure sensor 110, that is, at the center position of the lid 120, thereby exposing the inside of the pressure sensor package 100 to the pressure to be measured. It is like that.
　また、他の従来の圧力センサパッケージとして、特許文献２に開示されたものがある。上記特許文献２に開示された圧力センサパッケージ２００では、図８の（ａ）、及び図８の（ｂ）に示すように、平面形状が方形の蓋体２２０における1つの対角線上の両端側に圧力導入孔２２１・２２１が形成されている。 Another conventional pressure sensor package is disclosed in Patent Document 2. In the pressure sensor package 200 disclosed in the above-mentioned Patent Document 2, as shown in FIGS. 8A and 8B, the planar shape is on both ends on one diagonal line in the lid 220 having a square shape. Pressure introducing holes 221 and 221 are formed.
日本国公開特許公報「特開２０１０－９６５０５号公報（２０１０年４月３０日公開）」Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-96505 (published on April 30, 2010)” 日本国公開特許公報「特開２０１０－２８１５６９号公報（２０１０年１２月１６日公開）」Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-28169 (published on Dec. 16, 2010)”
　しかしながら、上記従来の特許文献１，２に開示された圧力センサパッケージでは、蓋体の上面に導圧部である圧力導入孔が形成されている。 However, in the conventional pressure sensor package disclosed in Patent Documents 1 and 2, a pressure introduction hole as a pressure guiding portion is formed on the upper surface of the lid.
　この結果、圧力センサの上に圧力導入孔が存在しているので、圧力センサに光が照射されるとセンサ特性におけるノイズの主要因になり、圧力センサの特性が低下するという問題を有している。 As a result, since the pressure introduction hole exists on the pressure sensor, when light is irradiated to the pressure sensor, it becomes a main factor of noise in the sensor characteristics, and there is a problem that the characteristics of the pressure sensor deteriorate. Yes.
　また、蓋体に別途圧力導入孔を穿設しなければならず、蓋体に追加工費が発生し、結果的にコスト増加に繋がる。 Also, a separate pressure introduction hole must be drilled in the lid, which causes additional cost for the lid, resulting in increased costs.
　本発明は、上記従来の問題点に鑑みなされたものであって、その目的は、導圧部を設ける場合に、圧力センサへの迷光を防止して圧力センサの特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージ及びその製造方法を提供することにある。 The present invention has been made in view of the above-described conventional problems, and its purpose is to prevent stray light to the pressure sensor when the pressure guiding portion is provided, to prevent deterioration of the characteristics of the pressure sensor, and An object of the present invention is to provide a pressure sensor package and a method for manufacturing the same that can suppress an increase in cost.
　本発明の圧力センサパッケージは、上記課題を解決するために、内部に圧力センサを実装した凹部形状のパッケージ本体と、該圧力センサのダイアフラムの上方に内部空間を確保した状態で上記パッケージ本体を覆う光遮蔽部材からなる蓋体とを備えた圧力センサパッケージにおいて、上記パッケージ本体と蓋体とは、複数箇所で部分接着されており、上記パッケージ本体と蓋体との間における上記部分接着以外の部分には、該パッケージ本体の外部と上記内部空間とを連通する隙間が形成されていることを特徴としている。 In order to solve the above problems, the pressure sensor package of the present invention covers the package main body in a state in which a concave-shaped package main body in which the pressure sensor is mounted and the internal space is secured above the diaphragm of the pressure sensor. In a pressure sensor package including a lid made of a light shielding member, the package body and the lid are partially bonded at a plurality of locations, and the portion other than the partial adhesion between the package body and the lid Is characterized in that a gap is formed to communicate the outside of the package body and the internal space.
　上記の発明によれば、圧力センサパッケージは、内部に圧力センサを実装した凹部形状のパッケージ本体と、該圧力センサのダイアフラムの上方に内部空間を確保した状態で上記パッケージ本体を覆う光遮蔽部材からなる蓋体とを備えている。 According to the above invention, the pressure sensor package includes a recess-shaped package body in which the pressure sensor is mounted, and a light shielding member that covers the package body in a state where an internal space is secured above the diaphragm of the pressure sensor. And a lid.
　このような圧力センサパッケージにおいては、外気と圧力センサとを連通する導圧部が必要である。しかしながら、蓋体の上面に貫通穴を形成して導圧部とすると、迷光の影響からセンサ特性にノイズが発生し、想定する感度を達成することができない。この場合に、パッケージ本体に導圧部を穿設することが考えられるが、パッケージ本体がセラミック材料からなっている場合には、このセラミック材料に穿設するのは困難である。すなわち、セラミック材料では、貫通穴を設けたとしても最終工程で焼成するので、貫通穴の形状を確実に保証することは困難である。 In such a pressure sensor package, a pressure guiding unit that communicates the outside air with the pressure sensor is required. However, if a through hole is formed on the upper surface of the lid to form a pressure guiding portion, noise is generated in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved. In this case, it is conceivable to drill a pressure guiding portion in the package body, but when the package body is made of a ceramic material, it is difficult to drill in the ceramic material. That is, in the ceramic material, even if the through hole is provided, it is fired in the final process, so it is difficult to ensure the shape of the through hole.
　そこで、本発明では、蓋体の構造を工夫することにより導圧部を形成している。具体的には、本発明の圧力センサパッケージには、パッケージ本体と蓋体とは、複数箇所で部分接着されており、パッケージ本体と蓋体との間における部分接着以外の部分には、該パッケージ本体の外部と上記内部空間とを連通する隙間が形成されている。 Therefore, in the present invention, the pressure guiding portion is formed by devising the structure of the lid. Specifically, in the pressure sensor package of the present invention, the package main body and the lid are partially bonded at a plurality of locations, and the package body has a portion other than the partial adhesion between the package main body and the lid. A gap that communicates the outside of the main body and the internal space is formed.
　このため、隙間は、圧力センサパッケージの横方向に設けられることになる。この結果、隙間を介して迷光が圧力センサに照射されることはなく、センサ特性にノイズが発生して想定する感度を達成することができないということはない。 For this reason, the gap is provided in the lateral direction of the pressure sensor package. As a result, stray light is not applied to the pressure sensor through the gap, and noise is not generated in the sensor characteristics and the assumed sensitivity cannot be achieved.
　また、蓋体に別途導圧部を穿設することも行っていない。このため、蓋体に追加工費が発生して結果的にコスト増加に繋がるということもない。 Also, no separate pressure guiding part is drilled in the lid. For this reason, additional work costs are not generated in the lid, resulting in an increase in cost.
　したがって、導圧部を設ける場合に、圧力センサへの迷光を防止して圧力センサの特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージを提供することができる。 Therefore, when the pressure guiding portion is provided, it is possible to provide a pressure sensor package that can prevent stray light to the pressure sensor to prevent the pressure sensor characteristics from deteriorating and suppress an increase in cost.
　本発明の圧力センサパッケージの製造方法は、上記課題を解決するために、前記記載の圧力センサパッケージを製造するための圧力センサパッケージの製造方法であって、金属板に複数個の蓋体を、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプを含むように電鋳メッキにて形成した後、個片化することを特徴としている。 In order to solve the above problems, a pressure sensor package manufacturing method according to the present invention is a pressure sensor package manufacturing method for manufacturing the pressure sensor package described above, wherein a plurality of lids are attached to a metal plate. Each lid is formed by electroforming plating so that the cross-sectional shape of each lid becomes a hat-like shape, and bumps are included in the part to be partially bonded, and then is divided into individual pieces.
　上記の発明によれば、圧力センサパッケージを製造する場合には、金属板に複数個の蓋体を、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプを含むように電鋳メッキにてシート状に作製する。そして、その後、個片化する。 According to the above invention, when the pressure sensor package is manufactured, a plurality of lids are included in the metal plate, and the bumps are included in the part to be partially bonded so that the cross-sectional shape of each lid is a hat shape. As described above, the sheet is formed by electroforming plating. Then, it is separated into pieces.
　この結果、バンプ付きの蓋体を複数個集合したものを、電鋳メッキにて形成する。この電鋳メッキは、金型にミリ単位の膜厚となるような超厚付け電気メッキを施した後に、剥離して製品を作る方法であり、原型を忠実に再現できる複製技術として、装飾の分野では主に美術工芸品や仏具の製造に利用されているものである。 As a result, an assembly of a plurality of lid bodies with bumps is formed by electroforming plating. This electroforming plating is a method of making a product by super-thinning electroplating to a thickness of millimeters on a mold, and then peeling off to make a product. In the field, it is mainly used for the production of arts and crafts and Buddha.
　本発明では、この電鋳メッキを利用するので、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプを含むように、複数個のものを精度よく容易に形成することができる。この結果、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。 In the present invention, since this electroforming plating is used, a plurality of objects can be easily formed with high accuracy so that the cross-sectional shape of each lid body is a hat shape, and bumps are included in the part to be partially bonded. be able to. As a result, process simplification can be realized in the manufacturing process, and cost reduction can be realized.
　したがって、導圧部を設ける場合に、圧力センサへの迷光を防止して圧力センサの特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージの製造方法を提供することができる。 Therefore, when the pressure guiding portion is provided, it is possible to provide a method of manufacturing a pressure sensor package that can prevent stray light to the pressure sensor, prevent a decrease in the characteristics of the pressure sensor, and suppress an increase in cost.
　本発明の圧力センサパッケージは、以上のように、パッケージ本体と蓋体とは、複数箇所で部分接着されており、上記パッケージ本体と蓋体との間における上記部分接着以外の部分には、該パッケージ本体の外部と上記内部空間とを連通する隙間が形成されているものである。 In the pressure sensor package of the present invention, as described above, the package main body and the lid are partially bonded at a plurality of locations, and the portion other than the partial adhesion between the package main body and the lid is A gap is formed to communicate the outside of the package body and the internal space.
　本発明の圧力センサパッケージの製造方法は、以上のように、金属板に複数個の蓋体を、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプを含むように電鋳メッキにて形成した後、個片化する方法である。 As described above, the manufacturing method of the pressure sensor package according to the present invention includes a plurality of lids on the metal plate, and the bumps are included in the part to be partially bonded so that the cross-sectional shape of each lid is a hat shape. After forming by electroforming plating, it is a method of dividing into pieces.
　それゆえ、導圧部を設ける場合に、圧力センサへの迷光を防止して圧力センサの特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージ及びその製造方法を提供するという効果を奏する。 Therefore, in the case where the pressure guiding portion is provided, an effect of providing a pressure sensor package that can prevent stray light to the pressure sensor to prevent a decrease in the characteristics of the pressure sensor and suppress an increase in cost, and a method for manufacturing the same. Play.
（ａ）は本発明における圧力センサパッケージの実施の一形態を示すものであって、圧力センサパッケージの構成を示す平面図であり、（ｂ）は（ａ）のＡ－Ａ線断面図である。(A) shows one Embodiment of the pressure sensor package in this invention, Comprising: It is a top view which shows the structure of a pressure sensor package, (b) is the sectional view on the AA line of (a). . 上記圧力センサパッケージの構成を示す斜視図である。It is a perspective view which shows the structure of the said pressure sensor package. （ａ）（ｂ）（ｃ）は、パッケージ本体とリッドとの各種の接着箇所を示す平面図である。(A) (b) (c) is a top view which shows the various adhesion | attachment location of a package main body and a lid. （ａ）（ｂ）（ｃ）は、バンプの各種の形状を示す正面図である。(A) (b) (c) is a front view which shows the various shapes of a bump. 上記接着箇所におけるビーズにてなる高さ調整部材の構成を示す断面図である。It is sectional drawing which shows the structure of the height adjustment member which consists of a bead in the said adhesion location. （ａ）は圧力センサパッケージの製造方法を示すものであって、シート状に電鋳メッキにて金型形成した複数個のリッドを示す平面図であり、（ｂ）はその要部側面図であり、（ｃ）は（ｂ）の要部拡大断面図である。(A) shows the manufacturing method of a pressure sensor package, Comprising: It is a top view which shows the some lid which carried out the die-forming of the sheet form by electroforming plating, (b) is the principal part side view. (C) is an enlarged cross-sectional view of the main part of (b). 従来の上記圧力センサパッケージの構成を示す断面図である。It is sectional drawing which shows the structure of the said conventional pressure sensor package. （ａ）は従来の他の上記圧力センサパッケージの構成を示す断面図であり、（ｂ）は上記圧力センサパッケージの構成を示す斜視図である。(A) is sectional drawing which shows the structure of the said other conventional pressure sensor package, (b) is a perspective view which shows the structure of the said pressure sensor package.
　本発明の一実施形態について図１～図６に基づいて説明すれば、以下のとおりである。 An embodiment of the present invention will be described with reference to FIGS. 1 to 6 as follows.
　本実施の形態の圧力センサパッケージは、例えば絶対圧力センサ等の圧力センサを実装したパッケージとなっており、以下においては、圧力センサは絶対圧力センサであるとして説明する。尚、必ずしもこれに限らず、圧力センサは、大気圧等のある任意の比較する圧力（基準圧）に対して表した圧力を測定する差圧（相対圧）圧力センサであってもよい。 The pressure sensor package of the present embodiment is a package in which a pressure sensor such as an absolute pressure sensor is mounted, for example. In the following description, it is assumed that the pressure sensor is an absolute pressure sensor. However, the pressure sensor is not necessarily limited to this, and may be a differential pressure (relative pressure) pressure sensor that measures a pressure expressed with respect to an arbitrary pressure to be compared (reference pressure) such as atmospheric pressure.
　本実施の形態の圧力センサパッケージ１の構成について、図１の（ａ）、図１の（ｂ）及び図２に基づいて説明する。図１の（ａ）は本実施の形態の圧力センサパッケージ１の構成を示す平面図であり、図１の（ｂ）は図１の（ａ）のＡ－Ａ線断面図である。また、図２は、圧力センサパッケージ１の構成を示す斜視図である。 The configuration of the pressure sensor package 1 according to the present embodiment will be described with reference to FIG. 1A, FIG. 1B, and FIG. FIG. 1A is a plan view showing the configuration of the pressure sensor package 1 of the present embodiment, and FIG. 1B is a cross-sectional view taken along the line AA of FIG. FIG. 2 is a perspective view showing the configuration of the pressure sensor package 1.
　本実施の形態の圧力センサパッケージ１は、図１の（ａ）、図１の（ｂ）及び図２に示すように、圧力センサ１０を実装した例えば矩形の凹部形状のパッケージ本体２０と、後述するダイアフラム１１の上側に内部空間２１を確保した状態でパッケージ本体２０の開口部分を覆う蓋体としてのリッド３０とを備えている。 As shown in FIGS. 1A, 1B, and 2, the pressure sensor package 1 according to the present embodiment includes, for example, a rectangular recess-shaped package body 20 on which the pressure sensor 10 is mounted, and will be described later. A lid 30 is provided as a lid that covers the opening of the package body 20 with the internal space 21 secured above the diaphragm 11.
　上記の圧力センサ１０は、絶対圧力センサであり、図１の（ｂ）に示すように、周縁に複数の圧力感応抵抗素子としての図示しないピエゾ抵抗を形成したダイアフラム１１と、該ダイアフラム１１におけるピエゾ抵抗の形成面とは反対側の面に例えば円筒形状の真空状態の空間部からなるキャビティ１２を形成した半導体センサ基板１３とを有している。 The pressure sensor 10 is an absolute pressure sensor, and as shown in FIG. 1B, a diaphragm 11 having a plurality of piezoresistors (not shown) as pressure-sensitive resistance elements formed on the periphery thereof, and a piezo in the diaphragm 11 A semiconductor sensor substrate 13 having a cavity 12 formed of, for example, a cylindrical space in a vacuum state is provided on the surface opposite to the surface on which the resistor is formed.
　上記構成の絶対圧力センサからなる圧力センサ１０では、ダイアフラム１１が外面に付加される上記内部空間２１の圧力に応じて歪むことによって、その歪み度合いに応じて複数のピエゾ抵抗の抵抗値が変化し、この複数のピエゾ抵抗にて構成されたブリッジ回路の中点電位がセンサ出力として図示しない外部装置に出力される。これによって、外気と真空との差圧により絶対圧力が測定できるようになっている。 In the pressure sensor 10 including the absolute pressure sensor having the above-described configuration, the diaphragm 11 is distorted according to the pressure of the internal space 21 added to the outer surface, so that the resistance values of the plurality of piezoresistors change according to the degree of distortion. The midpoint potential of the bridge circuit constituted by the plurality of piezoresistors is output as a sensor output to an external device (not shown). As a result, the absolute pressure can be measured by the differential pressure between the outside air and the vacuum.
　上記凹部形状のパッケージ本体２０は、セラミック材料にて形成されており、２段の凹部を有してなっている。尚、本発明においては、パッケージ本体２０は、必ずしもセラミック材料に限らず、樹脂材料からなっているとすることも可能である。 The recess-shaped package body 20 is made of a ceramic material and has two steps of recesses. In the present invention, the package body 20 is not necessarily made of a ceramic material, but may be made of a resin material.
　上記２段の凹部は、具体的には、浅広凹部２２と、該浅広凹部２２の内側に形成された狭深凹部２３とからなっており、浅広凹部２２及び狭深凹部２３のいずれも水平断面が方形となっている。 Specifically, the two-stage concave portion includes a shallow wide concave portion 22 and a narrow deep concave portion 23 formed inside the shallow wide concave portion 22. The horizontal section is also square.
　そして、上記圧力センサ１０が、パッケージ本体２０の狭深凹部２３における圧力センサ実装床としての狭深凹部底２３ａに接着されて実装されている。圧力センサ１０のダイアフラム１１の周囲には、複数のパッド１４が形成されており、このパッド１４には例えば金（Ａｕ）からなるワイヤ１５が接続されている。 The pressure sensor 10 is mounted by being adhered to a narrow deep recess bottom 23 a as a pressure sensor mounting floor in the narrow deep recess 23 of the package body 20. A plurality of pads 14 are formed around the diaphragm 11 of the pressure sensor 10, and wires 15 made of, for example, gold (Au) are connected to the pads 14.
　ワイヤ１５の他端は、パッケージ本体２０における浅広凹部２２の浅広凹部底２２ａに形成されたワイヤボンディングパッド２５に接続されている。また、ワイヤボンディングパッド２５は、パッケージ本体２０における浅広凹部２２の浅広凹部底２２ａに形成された貫通電極配線としての貫通ビア配線２６、及びパッケージ本体２０の裏面に形成された外部接続端子２７に接続されている。 The other end of the wire 15 is connected to a wire bonding pad 25 formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20. The wire bonding pad 25 includes a through via wiring 26 as a through electrode wiring formed on the shallow wide recess bottom 22 a of the shallow wide recess 22 in the package body 20 and an external connection terminal 27 formed on the back surface of the package body 20. It is connected to the.
　この結果、圧力センサ１０の前記ピエゾ抵抗からの電気信号がワイヤ１５、ワイヤボンディングパッド２５、貫通ビア配線２６及び外部接続端子２７を介して図示しない外部装置に電気的に接続されるようになっている。 As a result, the electrical signal from the piezoresistor of the pressure sensor 10 is electrically connected to an external device (not shown) via the wire 15, the wire bonding pad 25, the through via wiring 26 and the external connection terminal 27. Yes.
　上記リッド３０は、光遮蔽部材である例えば金属板からなっており、パッケージ本体２０の開口部分を覆っている。尚、リッド３０は、本発明においては、必ずしも金属板に限らず、非導電体等の光遮蔽部材からなっていてもよい。 The lid 30 is made of, for example, a metal plate that is a light shielding member, and covers the opening of the package body 20. In the present invention, the lid 30 is not necessarily a metal plate, and may be made of a light shielding member such as a non-conductor.
　リッド３０は、本実施の形態では、断面形状がハット状に形成されており、中央において上側に突出する方形のキャップ部３１を有すると共に、その周りに鍔部３２を有している。リッド３０の寸法は、例えば、縦３．６ｍｍ×横３．６ｍｍであり、キャップ部３１の厚さは、例えば０．２ｍｍである。 In the present embodiment, the lid 30 has a hat-like cross-sectional shape, and has a rectangular cap portion 31 protruding upward at the center and a flange portion 32 around the cap portion 31. The dimensions of the lid 30 are, for example, 3.6 mm in length × 3.6 mm in width, and the thickness of the cap portion 31 is, for example, 0.2 mm.
　これにより、リッド３０が平板からなっているのに比べて、強度を増加することができ、撓みを防止することができる。また、凹部形状のパッケージ本体２０の内部に圧力センサ１０を実装して、圧力センサ１０からワイヤ１５にて接続する際に、そのワイヤ１５がリッド３０に接触することを防止することができる。 This makes it possible to increase the strength and prevent bending as compared with the case where the lid 30 is made of a flat plate. Further, when the pressure sensor 10 is mounted inside the concave package body 20 and the pressure sensor 10 is connected by the wire 15, the wire 15 can be prevented from coming into contact with the lid 30.
　ところで、上記構成の圧力センサパッケージ１においては、外気と圧力センサ１０とを連通する導圧部が必要である。しかしながら、リッド３０の上面に貫通穴を形成して導圧部とすると、迷光の影響からセンサ特性にノイズが発生し、想定する感度を達成することができない。この場合に、パッケージ本体２０に導圧部を穿設することが考えられる。しかし、本実施の形態のパッケージ本体２０はセラミック材料からなっているので、このセラミック材料に穿設するのは困難である。すなわち、セラミック材料では、貫通穴を設けたとしても最終工程で焼成するので、貫通穴の形状を確実に保証することは困難である。 By the way, in the pressure sensor package 1 having the above-described configuration, a pressure guiding portion that communicates the outside air and the pressure sensor 10 is necessary. However, if a through hole is formed on the upper surface of the lid 30 to form a pressure guiding portion, noise is generated in sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved. In this case, it is conceivable to make a pressure guiding portion in the package body 20. However, since the package body 20 of the present embodiment is made of a ceramic material, it is difficult to make a hole in the ceramic material. That is, in the ceramic material, even if the through hole is provided, it is fired in the final process, so it is difficult to ensure the shape of the through hole.
　そこで、本実施の形態では、リッド３０の構造を工夫することにより導圧部を形成している。具体的には、本実施の形態の圧力センサパッケージ１には、パッケージ本体２０の上面２０ａとリッド３０の鍔部３２とは、図１の（ａ）に示すように、複数箇所で接着剤３３にて部分接着されており、パッケージ本体２０とリッド３０との間における部分接着以外の部分には、図１の（ｂ）に示すように、導圧部である隙間３４が形成されている。この結果、パッケージ本体２０の外部つまり外気と内部空間２１とが隙間３４にて連通されるようになっている。 Therefore, in the present embodiment, the pressure guiding portion is formed by devising the structure of the lid 30. Specifically, in the pressure sensor package 1 of the present embodiment, the upper surface 20a of the package body 20 and the flange portion 32 of the lid 30 are adhesive 33 at a plurality of locations as shown in FIG. As shown in FIG. 1B, a gap 34 as a pressure guiding portion is formed in a portion other than the partial adhesion between the package main body 20 and the lid 30. As a result, the outside of the package body 20, that is, the outside air and the internal space 21 are communicated with each other through the gap 34.
　上述したパッケージ本体２０とリッド３０とが部分接着されている複数の箇所は、例えば、図３の（ａ）に示すように、方形のリッド３０における鍔部３２の隅角部における２箇所と、対向する側の鍔部３２の中央における１箇所との３箇所とすることができる。また、図３の（ｂ）及び図１の（ａ）に示すように、方形のリッド３０における鍔部３２の各辺の中央に１つとして４箇所とすることができる。このように、４箇所とすることによって、３箇所よりも安定して支持することができる。さらに、図３の（ｃ）に示すように、図３の（ｂ）の４箇所に、鍔部３２の各隅角部における４箇所を加えて８箇所とすることができる。これによって、さらに、安定してリッド３０を支持することができる。尚、部分接着の位置は、必ずしもこれに限らず、他の位置でもよい。 The plurality of locations where the package body 20 and the lid 30 are partially bonded to each other include, for example, two locations at the corners of the flange portion 32 of the rectangular lid 30 as shown in FIG. It can be set as three places with one place in the center of the collar part 32 of the opposing side. Moreover, as shown in FIG. 3B and FIG. 1A, there can be four locations, one at the center of each side of the flange 32 in the rectangular lid 30. Thus, it can support more stably than three places by setting it as four places. Furthermore, as shown in (c) of FIG. 3, four places in each corner of the flange 32 can be added to the four places shown in (b) of FIG. Thereby, the lid 30 can be supported more stably. In addition, the position of partial adhesion is not necessarily limited to this, and may be another position.
　ここで、本実施の形態では、部分接着には、例えば導電ペースト等のシリコーン系樹脂を含む接着剤３３が使用されている。これにより、柔軟なシリコーン系樹脂を接着剤として使用するため、免震構造となり、衝撃に強くなる。また、セラミック材料からなるパッケージ本体２０と金属材料からなるリッド３０との熱膨張係数差から生じる歪も緩和することが可能となる。 Here, in this embodiment, an adhesive 33 containing a silicone resin such as a conductive paste is used for partial adhesion. Thereby, since a flexible silicone-based resin is used as an adhesive, a seismic isolation structure is obtained, which is resistant to impact. In addition, it is possible to alleviate distortion caused by a difference in thermal expansion coefficient between the package body 20 made of a ceramic material and the lid 30 made of a metal material.
　ところで、パッケージ本体２０とリッド３０とが接着剤３３のみにて複数箇所で部分接着されている場合には、接着剤３３が扁平するので、パッケージ本体２０とリッド３０との間における充分な隙間３４を確保できない虞がある。 By the way, when the package main body 20 and the lid 30 are partially bonded only by the adhesive 33 at a plurality of locations, the adhesive 33 is flattened, so that a sufficient gap 34 between the package main body 20 and the lid 30 is obtained. May not be secured.
　そこで、本実施の形態では、パッケージ本体２０とリッド３０との部分接着された箇所には、高さ調整部材３５を設けている。このため、パッケージ本体２０とリッド３０との間における部分接着以外の部分における隙間３４に対して、パッケージ本体２０の外部と内部空間２１とを連通するための充分な高さを与えることができる。 Therefore, in the present embodiment, a height adjusting member 35 is provided at a location where the package body 20 and the lid 30 are partially bonded. For this reason, a sufficient height for communicating the outside of the package body 20 and the internal space 21 can be given to the gap 34 in a portion other than the partial adhesion between the package body 20 and the lid 30.
　ここで、本実施の形態では、図１の（ｂ）に示すように、高さ調整部材３５は、例えばバンプ３５ａからなっている。すなわち、バンプ３５ａは、半導体の電極部にメッキで形成した突起である。このため、圧力センサ１０及び圧力センサパッケージ１を製造するための半導体技術により、高さ調整部材としての突起を、バンプ形成技術を適用して容易に形成することができる。上記バンプ３５ａを高さ調整部材３５として設ける場合には、図１の（ｂ）に示すように、バンプ３５ａの周りに接着剤３３が配される。したがって、バンプ３５ａの先端がパッケージ本体２０の上面２０ａ又は後述する金属配線パターン２８に接触するようになっている。 Here, in the present embodiment, as shown in FIG. 1B, the height adjusting member 35 is composed of, for example, a bump 35a. That is, the bump 35a is a protrusion formed by plating on a semiconductor electrode portion. For this reason, the protrusion as the height adjusting member can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor 10 and the pressure sensor package 1. When the bump 35a is provided as the height adjusting member 35, an adhesive 33 is disposed around the bump 35a as shown in FIG. Therefore, the tip of the bump 35a comes into contact with the upper surface 20a of the package body 20 or a metal wiring pattern 28 described later.
　バンプ３５ａの形状は、図４の（ａ）、図４の（ｂ）、及び図４の（ｃ）に示すように、種々のものが考えられる。例えば、図４の（ａ）に示すように、円錐台又は角錐台とすることができ、又は図４の（ｂ）に示すように、円錐、又は三角錐等の多角錐とすることができる。或いは、図４の（ｃ）に示すように、円柱又は、三角柱若しくは四角柱等の角柱とすることができる。金型にて成形する場合には、図４の（ａ）及び図４の（ｂ）に示す円錐台若しくは角錐台、又は円錐、若しくは三角錐等の多角錐の方が、脱型し易いというメリットがある。 As the shape of the bump 35a, various shapes can be considered as shown in FIG. 4 (a), FIG. 4 (b), and FIG. 4 (c). For example, as shown in FIG. 4 (a), it can be a truncated cone or a truncated pyramid, or as shown in FIG. 4 (b), it can be a cone or a polygonal pyramid such as a triangular pyramid. . Alternatively, as shown in FIG. 4 (c), a cylinder or a prism such as a triangular prism or a quadrangular prism can be used. In the case of molding with a mold, the truncated cone or the truncated pyramid shown in FIGS. 4A and 4B, or a polygonal pyramid such as a cone or a triangular pyramid is easier to remove. There are benefits.
　尚、上述の説明では、高さ調整部材３５はバンプ３５ａにてなっているとしていたが、必ずしもこれに限らず、例えば、図５に示すように、高さ調整部材３５としてビーズ３５ｂを用いることが可能である。ビーズ３５ｂは、例えばガラス玉又は金属球を適用することができる。ビーズ３５ｂの場合は、接着剤３３に混入して使用することが可能である。 In the above description, the height adjustment member 35 is made of the bump 35a. However, the present invention is not limited to this. For example, as shown in FIG. 5, a bead 35b is used as the height adjustment member 35. Is possible. For example, glass beads or metal balls can be applied to the beads 35b. In the case of the beads 35b, it can be used by being mixed in the adhesive 33.
　ここで、リッド３０においては、電荷が溜まる場合がある。このように、リッド３０が電荷を持った場合には、この電荷が圧力センサ１０に対して悪影響を及ぼすことがあり、例えば、圧力センサ１０の電圧変動が大きくなる等の障害が発生する。 Here, the lid 30 may accumulate electric charges. Thus, when the lid 30 has an electric charge, this electric charge may adversely affect the pressure sensor 10, and for example, a failure such as a large voltage fluctuation of the pressure sensor 10 occurs.
　そこで、本実施の形態においては、リッド３０が電荷を持つことを防止するために、図１の（ａ）に示すように、パッケージ本体２０の上面２０ａに金属配線パターン２８が形成されている。そして、上記バンプ３５ａ又は金属球からなるビーズ３５ｂは、リッド３０及び上記金属配線パターン２８の両方に接触するようになっている。また、この金属配線パターン２８は、前述したパッケージ本体２０における浅広凹部２２の浅広凹部底２２ａに形成されたワイヤボンディングパッド２５に接続されている。したがって、リッド３０に電荷が蓄積された場合には、バンプ３５ａ又は金属球からなるビーズ３５ｂ、並びに金属配線パターン２８、ワイヤボンディングパッド２５、貫通ビア配線２６及び外部接続端子２７を介して図示しない外部装置のアースに電気的に接地される。この結果、リッド３０が電荷を持つことがなくなるので、圧力センサ１０に対して悪影響を及ぼすことがない。したがって、圧力センサ１０の電磁ノイズを除去することができる。尚、高さ調整部材３５として、ガラス玉からなるビーズ３５ｂを使用する場合には、導電性の接着剤３３を使用することによって、リッド３０と金属配線パターン２８との導通を確保することができる。 Therefore, in the present embodiment, in order to prevent the lid 30 from being charged, a metal wiring pattern 28 is formed on the upper surface 20a of the package body 20 as shown in FIG. The bump 35a or the bead 35b made of a metal sphere comes into contact with both the lid 30 and the metal wiring pattern 28. The metal wiring pattern 28 is connected to the wire bonding pad 25 formed on the shallow wide recess bottom 22a of the shallow wide recess 22 in the package body 20 described above. Therefore, when charges are accumulated in the lid 30, the bump 35 a or the bead 35 b made of a metal sphere, the metal wiring pattern 28, the wire bonding pad 25, the through via wiring 26, and the external connection terminal 27 are not illustrated. Electrically grounded to the equipment ground. As a result, the lid 30 does not have a charge, so that the pressure sensor 10 is not adversely affected. Therefore, the electromagnetic noise of the pressure sensor 10 can be removed. When the beads 35b made of glass balls are used as the height adjusting member 35, the electrical connection between the lid 30 and the metal wiring pattern 28 can be ensured by using the conductive adhesive 33. .
　ここで、本実施の形態の圧力センサパッケージ１においては、バンプ３５ａは、電鋳メッキ、プレス加工によりリッド３０と一体に形成されている。これにより、バンプ３５ａをリッド３０と一体に形成するので、リッド３０を形成した後にバンプ３５ａを設けるのに比べて、製造工程において工数の削減を図り、延いてはコストダウンを図ることができる。また、電鋳メッキを行う場合は、金型の形状により所望形状のバンプ３５ａを実現することができる。 Here, in the pressure sensor package 1 of the present embodiment, the bumps 35a are integrally formed with the lid 30 by electroforming plating or press working. Thereby, since the bump 35a is formed integrally with the lid 30, it is possible to reduce the number of steps in the manufacturing process and to reduce the cost as compared with the case where the bump 35a is provided after the lid 30 is formed. Moreover, when performing electroforming plating, the bump 35a of a desired shape is realizable with the shape of a metal mold | die.
　さらに、電鋳メッキを行う場合は、金属板から打ち抜き又は絞り加工のような手法を使用しないため、バンプ３５ａを含む複数個のリッド３０を電鋳メッキにて一度に形成した後、個片化して、リッド３０を製造することができる。したがって、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。尚、本発明においては、必ずしもバンプ３５ａを電鋳メッキ、プレス加工によりリッド３０と一体に形成する必要はなく、別途に設けてもよい。 Furthermore, when electroforming plating is performed, a method such as punching or drawing from a metal plate is not used, and thus a plurality of lids 30 including bumps 35a are formed at once by electroforming plating, and then separated into pieces. Thus, the lid 30 can be manufactured. Therefore, the process can be simplified in the manufacturing process, and the cost can be reduced. In the present invention, the bumps 35a are not necessarily formed integrally with the lid 30 by electroforming plating or pressing, and may be provided separately.
　上記構成の圧力センサパッケージ１におけるリッド３０の製造方法の詳細について、図６の（ａ）、図６の（ｂ）、及び図６の（ｃ）に基づいて説明する。図６の（ａ）は、圧力センサパッケージの製造方法を示すものであって、シート状に電鋳メッキにて形成した複数個のリッドを示す平面図であり、図６の（ｂ）はその要部側面図であり、図６の（ｃ）は図６の（ｂ）の要部拡大断面図である。 Details of the method of manufacturing the lid 30 in the pressure sensor package 1 having the above-described configuration will be described with reference to FIGS. 6 (a), 6 (b), and 6 (c). FIG. 6A shows a method for manufacturing a pressure sensor package, and is a plan view showing a plurality of lids formed by electroforming plating on a sheet, and FIG. It is a principal part side view, (c) of FIG. 6 is a principal part expanded sectional view of (b) of FIG.
　図６の（ａ）、図６の（ｂ）、及び図６の（ｃ）に示すように、圧力センサパッケージ１のリッド３０を製造する場合には、金属板に複数個のリッド３０…を、各リッド３０の断面形状がハット状となるように、かつ部分接着する部分にバンプ３５ａを含むように電鋳メッキにて形成する。本実施の形態では、１シート状に、例えば、マトリクス状に１８×１８のリッド３０が電鋳メッキにて形成される。その後、ダイシングにより、個片化する。 6 (a), 6 (b), and 6 (c), when manufacturing the lid 30 of the pressure sensor package 1, a plurality of lids 30 are provided on the metal plate. The lids 30 are formed by electroforming plating so that the cross-sectional shape of each lid 30 is a hat shape and the bumps 35a are included in the partially bonded portions. In the present embodiment, 18 × 18 lids 30 are formed in one sheet form, for example, in a matrix form by electroforming plating. Thereafter, it is separated into pieces by dicing.
　この電鋳メッキは、金型にミリ単位の膜厚となるような超厚付け電気メッキを施した後に、剥離して製品を作る方法であり、原型を忠実に再現できる複製技術として、装飾の分野では主に美術工芸品や仏具の製造に利用されているものである。 This electroforming plating is a method of making a product by super-thinning electroplating to a thickness of millimeters on a mold, and then peeling off to make a product. In the field, it is mainly used for the production of arts and crafts and Buddha.
　したがって、本実施の形態では、この電鋳メッキを利用するので、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプ３５ａを含むように、複数個のものを精度よく容易に形成することができる。この結果、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。 Therefore, in the present embodiment, since this electroforming plating is used, a plurality of objects are accurately obtained so that the cross-sectional shape of each cover body is a hat shape and the bump 35a is included in the part to be partially bonded. It can be formed easily and well. As a result, process simplification can be realized in the manufacturing process, and cost reduction can be realized.
　それゆえ、導圧部を設ける場合に、光の圧力センサへの照射を防止して圧力センサの特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージの製造方法を提供することができる。 Therefore, to provide a pressure sensor package manufacturing method capable of preventing light pressure sensor from being irradiated to prevent deterioration of pressure sensor characteristics and suppressing an increase in cost when a pressure guiding portion is provided. Can do.
　このように、本実施の形態の圧力センサパッケージ１は、内部に圧力センサ１０を実装した凹部形状のパッケージ本体２０と、圧力センサ１０のダイアフラム１１の上方に内部空間２１を確保した状態でパッケージ本体２０を覆う光遮蔽部材からなるリッド３０とを備えている。そして、パッケージ本体２０とリッド３０とは、複数箇所で部分接着されており、パッケージ本体２０とリッド３０との間における部分接着以外の部分には、パッケージ本体２０の外部と内部空間２１とを連通する隙間３４が形成されている。 As described above, the pressure sensor package 1 according to the present embodiment includes a package body 20 having a concave shape in which the pressure sensor 10 is mounted, and a package body with the internal space 21 secured above the diaphragm 11 of the pressure sensor 10. And a lid 30 made of a light shielding member that covers 20. The package body 20 and the lid 30 are partially bonded at a plurality of locations, and the outside of the package body 20 and the internal space 21 are communicated with portions other than the partial adhesion between the package body 20 and the lid 30. A gap 34 is formed.
　このため、隙間３４は、圧力センサパッケージ１の横方向に設けられることになる。この結果、隙間３４を介して迷光が圧力センサに照射されることはなく、センサ特性にノイズが発生して想定する感度を達成することができないということはない。 For this reason, the gap 34 is provided in the lateral direction of the pressure sensor package 1. As a result, stray light is not applied to the pressure sensor through the gap 34, and noise is not generated in the sensor characteristics and the assumed sensitivity cannot be achieved.
　また、リッド３０に別途導圧部を穿設することも行っていない。このため、リッド３０に追加工費が発生して結果的にコスト増加に繋がるということもない。 Also, no separate pressure guiding part is drilled in the lid 30. For this reason, additional work costs are not generated in the lid 30, resulting in an increase in cost.
　したがって、導圧部を設ける場合に、圧力センサ１０への迷光を防止して圧力センサ１０の特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージ１を提供することができる。 Therefore, when the pressure guiding portion is provided, it is possible to provide the pressure sensor package 1 that can prevent stray light to the pressure sensor 10 to prevent the characteristics of the pressure sensor 10 from deteriorating and suppress an increase in cost.
　また、本実施の形態の圧力センサパッケージ１では、パッケージ本体２０は、セラミック材料からなっていると共に、リッド３０は、金属材料からなっている。このセラミック材料は、剛性が高く、線膨張係数が小さくかつ耐熱性を有し、さらに耐薬品性を有しているので、圧力センサ１０の実装に優れている。したがって、樹脂からなるパッケージ本体に比べて、高性能の圧力センサ１０を提供することができる。 Further, in the pressure sensor package 1 of the present embodiment, the package body 20 is made of a ceramic material, and the lid 30 is made of a metal material. Since this ceramic material has high rigidity, a small linear expansion coefficient, heat resistance, and chemical resistance, it is excellent in mounting the pressure sensor 10. Therefore, the high-performance pressure sensor 10 can be provided as compared with the package body made of resin.
　また、パッケージ本体２０がセラミック材料からなっている場合、セラミック材料に穿設するのは困難である。これに対して、本実施の形態では、セラミック材料に穿設することなく、リッド３０の構造を工夫することによって、容易に導圧部を設けることができるものとなっている。 Further, when the package body 20 is made of a ceramic material, it is difficult to make a hole in the ceramic material. On the other hand, in the present embodiment, the pressure guiding portion can be easily provided by devising the structure of the lid 30 without drilling in the ceramic material.
　さらに、リッド３０は、金属材料からなっているので、不透明であり、光遮蔽性を有している。このため、迷光の影響からセンサ特性にノイズが発生し、想定する感度を達成することができないということはない。 Furthermore, since the lid 30 is made of a metal material, it is opaque and has a light shielding property. For this reason, noise does not occur in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
　また、本実施の形態の圧力センサパッケージ１では、パッケージ本体２０とリッド３０との部分接着された箇所には、高さ調整部材３５が設けられている。このため、パッケージ本体２０とリッド３０との間における部分接着以外の部分における隙間３４に対して、パッケージ本体２０の外部と内部空間２１とを連通するための充分な高さを与えることができる。 Further, in the pressure sensor package 1 of the present embodiment, a height adjusting member 35 is provided at a location where the package body 20 and the lid 30 are partially bonded. For this reason, a sufficient height for communicating the outside of the package body 20 and the internal space 21 can be given to the gap 34 in a portion other than the partial adhesion between the package body 20 and the lid 30.
　また、本実施の形態の圧力センサパッケージ１では、高さ調整部材３５はバンプ３５ａからなっている。このため、圧力センサ１０及び圧力センサパッケージ１を製造するための半導体技術により、高さ調整部材３５としての突起を、バンプ形成技術を適用して容易に形成することができる。 Further, in the pressure sensor package 1 of the present embodiment, the height adjusting member 35 is composed of bumps 35a. For this reason, the protrusion as the height adjusting member 35 can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor 10 and the pressure sensor package 1.
　また、本実施の形態の圧力センサパッケージ１では、バンプ３５ａは、電鋳メッキ、プレス加工又は打ち抜き成形によりリッド３０と一体に形成されている。 Further, in the pressure sensor package 1 of the present embodiment, the bump 35a is formed integrally with the lid 30 by electroforming plating, press working, or punching.
　これにより、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。 This makes it possible to simplify the process in the manufacturing process and thus to reduce the cost.
　また、本実施の形態の圧力センサパッケージ１では、パッケージ本体２０におけるリッド３０との接着面には、接地用の金属配線パターン２８が配されている。これにより、リッド３０を接地することができ、圧力センサ１０の電磁ノイズの発生を防止することが可能となる。 Further, in the pressure sensor package 1 of the present embodiment, the ground metal wiring pattern 28 is disposed on the bonding surface of the package body 20 with the lid 30. Thereby, the lid 30 can be grounded, and the generation of electromagnetic noise of the pressure sensor 10 can be prevented.
　また、本実施の形態の圧力センサパッケージ１では、リッド３０は、断面形状がハット状に形成されている。これにより、リッド３０が平板からなっているのに比べて、強度を増加することができるため、リッド３０を薄くすることができ、かつ圧力センサパッケージ１の高さを低背化することができる。また、凹部形状のパッケージ本体２０の内部に圧力センサ１０を実装して、圧力センサ１０からワイヤ１５にて接続する際に、そのワイヤ１５がリッド３０に接触することを防止することができる。 Further, in the pressure sensor package 1 of the present embodiment, the lid 30 is formed in a hat shape in cross section. Thereby, since the strength can be increased as compared with the case where the lid 30 is made of a flat plate, the lid 30 can be thinned and the height of the pressure sensor package 1 can be reduced. . Further, when the pressure sensor 10 is mounted inside the concave package body 20 and the pressure sensor 10 is connected by the wire 15, the wire 15 can be prevented from coming into contact with the lid 30.
　また、本実施の形態の圧力センサパッケージ１では、部分接着には、柔軟なシリコーン系樹脂を含む接着剤が使用されている。これにより、免震構造となり、衝撃に強くなる。また、例えば、セラミック材料からなるパッケージ本体２０と金属材料からなるリッド３０との熱膨張係数差から生じる歪も緩和することが可能となる。 Further, in the pressure sensor package 1 of the present embodiment, an adhesive containing a flexible silicone resin is used for partial adhesion. Thereby, it becomes a seismic isolation structure and becomes strong against an impact. In addition, for example, it is possible to alleviate distortion caused by a difference in thermal expansion coefficient between the package body 20 made of a ceramic material and the lid 30 made of a metal material.
　また、本実施の形態の圧力センサパッケージ１の製造方法は、金属板に複数個のリッド３０を、各リッド３０の断面形状がハット状となるように、かつ部分接着する部分にバンプ３５ａを含むように電鋳メッキにて形成した後、個片化する。これにより、複数個のリッド３０を精度よくかつ容易に形成することができる。この結果、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。 In addition, the manufacturing method of the pressure sensor package 1 according to the present embodiment includes a plurality of lids 30 on a metal plate, and includes bumps 35a in a portion where the cross-sectional shape of each lid 30 is a hat shape and is partially bonded. Thus, after forming by electroforming plating, it separates into pieces. Thereby, the some lid 30 can be formed accurately and easily. As a result, process simplification can be realized in the manufacturing process, and cost reduction can be realized.
　したがって、導圧部を設ける場合に、圧力センサ１０への迷光を防止して圧力センサ１０の特性の低下を防止し、かつコストの増大を抑制し得る圧力センサパッケージ１の製造方法を提供することができる。 Therefore, when the pressure guiding portion is provided, a method of manufacturing the pressure sensor package 1 that can prevent stray light to the pressure sensor 10 to prevent a decrease in the characteristics of the pressure sensor 10 and suppress an increase in cost is provided. Can do.
　以上のように、本発明の圧力センサパッケージでは、前記パッケージ本体は、セラミック材料からなっていると共に、前記蓋体は、金属材料からなっていることが好ましい。 As described above, in the pressure sensor package of the present invention, it is preferable that the package body is made of a ceramic material and the lid is made of a metal material.
　本発明では、パッケージ本体は、セラミック材料からなっている。このセラミック材料は、剛性が高く、線膨張係数が小さくかつ耐熱性を有し、さらに耐薬品性を有しているので、圧力センサの実装に優れている。したがって、樹脂からなるパッケージ本体に比べて、高性能の圧力センサを提供することができる。 In the present invention, the package body is made of a ceramic material. Since this ceramic material has high rigidity, a small linear expansion coefficient, heat resistance, and chemical resistance, it is excellent in mounting a pressure sensor. Therefore, a high-performance pressure sensor can be provided as compared with a package body made of resin.
　また、パッケージ本体がセラミック材料からなっている場合、セラミック材料に穿設するのは困難である。これに対して、本発明では、セラミック材料に穿設することなく、蓋体の構造を工夫することによって、容易に導圧部を設けることができる。 Also, when the package body is made of a ceramic material, it is difficult to make a hole in the ceramic material. On the other hand, in the present invention, the pressure guiding portion can be easily provided by devising the structure of the lid without piercing the ceramic material.
　さらに、蓋体は、金属材料からなっているので、不透明であり、光遮蔽性を有している。このため、迷光の影響からセンサ特性にノイズが発生し、想定する感度を達成することができないということはない。 Furthermore, since the lid is made of a metal material, it is opaque and has light shielding properties. For this reason, noise does not occur in the sensor characteristics due to the influence of stray light, and the assumed sensitivity cannot be achieved.
　本発明の圧力センサパッケージでは、前記パッケージ本体と蓋体との部分接着された箇所には、高さ調整部材が設けられていることが好ましい。 In the pressure sensor package of the present invention, it is preferable that a height adjusting member is provided at a location where the package body and the lid are partially bonded.
　すなわち、パッケージ本体と蓋体とが、例えば接着剤にて複数箇所で部分接着されている場合には、パッケージ本体と蓋体との間における充分な隙間を確保できない虞がある。 That is, when the package main body and the lid are partially bonded by, for example, an adhesive, there is a possibility that a sufficient gap between the package main body and the lid cannot be secured.
　そこで、本発明では、パッケージ本体と蓋体との部分接着された箇所には、高さ調整部材を設けている。このため、パッケージ本体と蓋体との間における部分接着以外の部分における隙間に対して、パッケージ本体の外部と内部空間とを連通するための充分な高さを与えることができる。 Therefore, in the present invention, a height adjusting member is provided at a location where the package main body and the lid are partially bonded. For this reason, sufficient height for communicating the exterior and internal space of a package main body with respect to the clearance gap in parts other than the partial adhesion | attachment between a package main body and a cover body can be given.
　本発明の圧力センサパッケージでは、前記高さ調整部材は、バンプからなっているとすることができる。 In the pressure sensor package of the present invention, the height adjusting member can be made of a bump.
　すなわち、一般的に、バンプは、半導体の電極部にメッキで形成した突起である。このため、圧力センサ及び圧力センサパッケージを製造するための半導体技術により、高さ調整部材としての突起を、バンプ形成技術を適用して容易に形成することができる。 That is, generally, a bump is a protrusion formed by plating on a semiconductor electrode portion. For this reason, the protrusion as the height adjusting member can be easily formed by applying the bump forming technique by the semiconductor technique for manufacturing the pressure sensor and the pressure sensor package.
　本発明の圧力センサパッケージでは、前記バンプは、電鋳メッキ、プレス加工又は打ち抜き成形により前記蓋体と一体に形成されていることが好ましい。 In the pressure sensor package of the present invention, it is preferable that the bump is formed integrally with the lid body by electroforming plating, press working or punching.
　これにより、バンプを蓋体と一体に形成するので、蓋体を形成した後にバンプを設けるのに比べて、製造工程において工数の削減を図り、延いてはコストダウンを図ることができる。また、電鋳メッキを行う場合は、金型の形状により所望形状のバンプを実現することができる。また、電鋳メッキを行う場合は、金属板から打ち抜き又は絞り加工のような手法を使用しないため、バンプを含む複数個の蓋体を電鋳メッキにて一度に形成した後、個片化して、蓋体を製造することができる。したがって、製造工程において工程簡略化を実現し、延いてはコストダウンを実現することができる。 As a result, the bumps are formed integrally with the lid, so that the number of steps in the manufacturing process can be reduced and the cost can be reduced as compared with the case where the bumps are provided after the lid is formed. Moreover, when performing electroforming plating, the bump of desired shape is realizable with the shape of a metal mold | die. In addition, when electroforming plating is performed, a method such as punching or drawing from a metal plate is not used, so a plurality of lids including bumps are formed at once by electroforming plating and then separated into pieces. A lid can be manufactured. Therefore, the process can be simplified in the manufacturing process, and the cost can be reduced.
　本発明の圧力センサパッケージでは、前記パッケージ本体における前記蓋体との接着面には、接地用の金属配線パターンが配されていることが好ましい。 In the pressure sensor package of the present invention, it is preferable that a metal wiring pattern for grounding is disposed on an adhesive surface of the package body with the lid.
　これにより、バンプと接地用の金属配線パターンとを導通させることによって、蓋体を接地することができ、圧力センサの電磁ノイズの発生を防止することが可能となる。 Thereby, by making the bump and the metal wiring pattern for grounding conductive, the lid body can be grounded, and the generation of electromagnetic noise of the pressure sensor can be prevented.
　本発明の圧力センサパッケージでは、前記蓋体は、断面形状がハット状に形成されていることが好ましい。 In the pressure sensor package of the present invention, it is preferable that the lid has a hat shape in cross section.
　これにより、蓋体が平板からなっているのに比べて、強度を増加することができるため、蓋体を薄くすることができ、かつ圧力センサパッケージの高さを低背化することができる。また、凹部形状のパッケージ本体の内部に圧力センサを実装して、圧力センサからワイヤにて接続する際に、そのワイヤが蓋体に接触することを防止することができる。 This makes it possible to increase the strength as compared with the case where the lid is made of a flat plate, so that the lid can be made thin and the height of the pressure sensor package can be reduced. In addition, when a pressure sensor is mounted inside the concave package body and the pressure sensor is connected by a wire, the wire can be prevented from coming into contact with the lid.
　本発明の圧力センサパッケージでは、前記部分接着には、シリコーン系樹脂を含む接着剤が使用されていることが好ましい。 In the pressure sensor package of the present invention, it is preferable that an adhesive containing a silicone resin is used for the partial adhesion.
　これにより、柔軟なシリコーン系樹脂を接着剤として使用するため、免震構造となり、衝撃に強くなる。また、例えば、セラミック材料からなるパッケージ本体と金属材料からなる蓋体との熱膨張係数差から生じる歪も緩和することが可能となる。 Because of this, a flexible silicone resin is used as an adhesive, which results in a seismic isolation structure and resistance to impact. In addition, for example, it is possible to reduce distortion caused by a difference in thermal expansion coefficient between a package body made of a ceramic material and a lid made of a metal material.
　尚、本発明は、上述した実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能であり、本実施形態にそれぞれ開示された技術的手段を適宜組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。 Note that the present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the claims, and can be obtained by appropriately combining technical means disclosed in the present embodiment. Embodiments are also included in the technical scope of the present invention.
　本発明は、ダイアフラム型の圧力センサを実装した絶対圧センサ用パッケージ等の圧力センサパッケージ及びその製造方法に適用でき、特に、セラミックパッケージを採用する場合に有用である。また、圧力センサパッケージは、ＧＰＳ、高度計、気圧計を必要とする例えば携帯端末、タブレットＰＣ、活動量計、健康機器、産業機器等の分野に展開ができる。 The present invention can be applied to a pressure sensor package such as an absolute pressure sensor package on which a diaphragm type pressure sensor is mounted and a manufacturing method thereof, and is particularly useful when a ceramic package is employed. Further, the pressure sensor package can be deployed in the fields of GPS, altimeter, barometer, for example, mobile terminals, tablet PCs, activity meters, health equipment, industrial equipment and the like.
　１　　　圧力センサパッケージ
１０　　　圧力センサ
１１　　　ダイアフラム
１２　　　キャビティ
１３　　　半導体センサ基板
１５　　　ワイヤ
２０　　　パッケージ本体
２０ａ　　上面
２１　　　内部空間
２８　　　金属配線パターン
３０　　　リッド（蓋体）
３１　　　キャップ部
３２　　　鍔部
３３　　　接着剤
３４　　　隙間
３５　　　高さ調整部材
３５ａ　　バンプ
３５ｂ　　ビーズ DESCRIPTION OF SYMBOLS 1 Pressure sensor package 10 Pressure sensor 11 Diaphragm 12 Cavity 13 Semiconductor sensor substrate 15 Wire 20 Package main body 20a Upper surface 21 Internal space 28 Metal wiring pattern 30 Lid (lid body)
31 Cap part 32 Gutter part 33 Adhesive 34 Gap 35 Height adjustment member 35a Bump 35b Bead

Claims (9)

  1. 　内部に圧力センサを実装した凹部形状のパッケージ本体と、該圧力センサのダイアフラムの上方に内部空間を確保した状態で上記パッケージ本体を覆う光遮蔽部材からなる蓋体とを備えた圧力センサパッケージにおいて、
    　上記パッケージ本体と蓋体とは、複数箇所で部分接着されており、
    　上記パッケージ本体と蓋体との間における上記部分接着以外の部分には、該パッケージ本体の外部と上記内部空間とを連通する隙間が形成されていることを特徴とする圧力センサパッケージ。     In a pressure sensor package comprising a recess-shaped package body having a pressure sensor mounted therein, and a lid made of a light shielding member that covers the package body in a state in which an internal space is secured above the diaphragm of the pressure sensor,
    The package body and the lid are partially bonded at a plurality of locations,
    A pressure sensor package characterized in that a gap is formed between the package body and the lid body other than the partial adhesion so as to communicate the outside of the package body and the internal space.
  2. 　前記パッケージ本体は、セラミック材料からなっていると共に、
    　前記蓋体は、金属材料からなっていることを特徴とする請求項１記載の圧力センサパッケージ。     The package body is made of a ceramic material,
    The pressure sensor package according to claim 1, wherein the lid is made of a metal material.
  3. 　前記パッケージ本体と蓋体との部分接着された箇所には、高さ調整部材が設けられていることを特徴とする請求項１又は２記載の圧力センサパッケージ。 3. A pressure sensor package according to claim 1, wherein a height adjusting member is provided at a part where the package body and the lid are partially bonded.
  4. 　前記高さ調整部材は、バンプからなっていることを特徴とする請求項３記載の圧力センサパッケージ。 4. The pressure sensor package according to claim 3, wherein the height adjusting member comprises a bump.
  5. 　前記バンプは、電鋳メッキ、プレス加工又は打ち抜き成形により前記蓋体と一体に形成されていることを特徴とする請求項４記載の圧力センサパッケージ。 5. The pressure sensor package according to claim 4, wherein the bump is formed integrally with the lid body by electroforming plating, press working or punching.
  6. 　前記パッケージ本体における前記蓋体との接着面には、接地用の金属配線パターンが配されていることを特徴とする請求項４記載の圧力センサパッケージ。 5. The pressure sensor package according to claim 4, wherein a grounding metal wiring pattern is arranged on an adhesive surface of the package body with the lid.
  7. 　前記蓋体は、断面形状がハット状に形成されていることを特徴とする請求項１～６のいずれか１項に記載の圧力センサパッケージ。 The pressure sensor package according to any one of claims 1 to 6, wherein the lid has a hat-like cross-sectional shape.
  8. 　前記部分接着には、シリコーン系樹脂を含む接着剤が使用されていることを特徴とする請求項１～７のいずれか１項に記載の圧力センサパッケージ。 The pressure sensor package according to any one of claims 1 to 7, wherein an adhesive containing a silicone resin is used for the partial adhesion.
  9. 　請求項１～８のいずれか１項に記載の圧力センサパッケージを製造するための圧力センサパッケージの製造方法であって、
    　金属板に複数個の蓋体を、各蓋体の断面形状がハット状となるように、かつ部分接着する部分にバンプを含むように電鋳メッキにて形成した後、個片化することを特徴とする圧力センサパッケージの製造方法。     A method for manufacturing a pressure sensor package for manufacturing the pressure sensor package according to any one of claims 1 to 8,
    Forming a plurality of lids on a metal plate by electroforming plating so that the cross-sectional shape of each lid is a hat shape and including a bump in the part to be partially bonded, A method for manufacturing a pressure sensor package.
PCT/JP2013/054019 2012-02-29 2013-02-19 Pressure-sensor package and method for producing same WO2013129186A1 (en)

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