WO2013115416A1 - Curable silicone composition, cured product thereof, and optical semiconductor device - Google Patents
Curable silicone composition, cured product thereof, and optical semiconductor device Download PDFInfo
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- WO2013115416A1 WO2013115416A1 PCT/JP2013/052965 JP2013052965W WO2013115416A1 WO 2013115416 A1 WO2013115416 A1 WO 2013115416A1 JP 2013052965 W JP2013052965 W JP 2013052965W WO 2013115416 A1 WO2013115416 A1 WO 2013115416A1
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- 239000000203 mixture Substances 0.000 title claims abstract description 116
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 83
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 230000003287 optical effect Effects 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 43
- 239000010703 silicon Substances 0.000 claims abstract description 43
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 41
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 40
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 38
- 125000000962 organic group Chemical group 0.000 claims abstract description 14
- 239000012463 white pigment Substances 0.000 claims abstract description 13
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 9
- 239000011256 inorganic filler Substances 0.000 claims abstract description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 8
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 54
- 125000000217 alkyl group Chemical group 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 30
- 238000005452 bending Methods 0.000 claims description 15
- 229910052681 coesite Inorganic materials 0.000 claims description 13
- 229910052906 cristobalite Inorganic materials 0.000 claims description 13
- 229910052682 stishovite Inorganic materials 0.000 claims description 13
- 229910052905 tridymite Inorganic materials 0.000 claims description 13
- 125000005417 glycidoxyalkyl group Chemical group 0.000 claims description 10
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 8
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 claims description 3
- 238000002845 discoloration Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- -1 siloxane units Chemical group 0.000 description 45
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 31
- 239000002245 particle Substances 0.000 description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 21
- 229910000831 Steel Inorganic materials 0.000 description 16
- 239000010959 steel Substances 0.000 description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 15
- 239000000377 silicon dioxide Substances 0.000 description 15
- 125000003700 epoxy group Chemical group 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 13
- 238000001721 transfer moulding Methods 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 11
- 229910052697 platinum Inorganic materials 0.000 description 11
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 11
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 10
- 239000010453 quartz Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000004593 Epoxy Chemical group 0.000 description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 9
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 9
- 239000011164 primary particle Substances 0.000 description 9
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- VTYCDJPJGNRAHU-UHFFFAOYSA-N tris(2-methylprop-1-enylsilyloxy)-phenylsilane Chemical compound C1(=CC=CC=C1)[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C VTYCDJPJGNRAHU-UHFFFAOYSA-N 0.000 description 7
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 6
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 125000006038 hexenyl group Chemical group 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- IENQTDRUPBYCHN-UHFFFAOYSA-N tetrakis(2-methylprop-1-enylsilyl) silicate Chemical compound CC(=C[SiH2]O[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)C IENQTDRUPBYCHN-UHFFFAOYSA-N 0.000 description 5
- 229910020447 SiO2/2 Inorganic materials 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- BSXVSQHDSNEHCJ-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)oxy-diphenylsilyl]oxy-dimethylsilicon Chemical compound C=1C=CC=CC=1[Si](O[Si](C)C)(O[Si](C)C)C1=CC=CC=C1 BSXVSQHDSNEHCJ-UHFFFAOYSA-N 0.000 description 4
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000002683 reaction inhibitor Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- GRGVQLWQXHFRHO-UHFFFAOYSA-N 3-methylpent-3-en-1-yne Chemical compound CC=C(C)C#C GRGVQLWQXHFRHO-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- DDJSWKLBKSLAAZ-UHFFFAOYSA-N cyclotetrasiloxane Chemical compound O1[SiH2]O[SiH2]O[SiH2]O[SiH2]1 DDJSWKLBKSLAAZ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- KVPNXFZHSSICLH-UHFFFAOYSA-N methyl-tris(2-methylprop-1-enylsilyloxy)silane Chemical compound C[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C KVPNXFZHSSICLH-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a curable silicone composition, cured product thereof, and to an optical semiconductor device using the cured product as a light reflection material.
- Curable silicone compositions that cure by a hydrosilylation reaction are used as protective agents, coating agents, lens-molding materials, light reflection materials, or the like for optical semiconductor elements in optical semiconductor devices such as photocouplers, light emitting diodes, solid-state imaging devices, or the like.
- organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, a white pigment; an inorganic filler other than the white pigment, a platinum metal-type catalyst; and a reaction inhibitor, wherein its cured product has a visible light average reflectance greater than or equal to 80% (refer to Japanese Unexamined Patent Application Publication No. 201 1 -140550).
- compositions have the following problems in transfer molding, injection molding, or compression molding: low mold filling, facile generation of voids and flashing, and/or a poor mold releasability; also, slow curing rate and a poor workability in the molding operation.
- the cured products obtained by curing these compositions have the advantage of little discoloration by heat and light
- the cured products have following problems of high linear expansion coefficients and/or a low mechanical strength at high temperature, as well as theassis of an insufficient light reflectance and great lowering of mechanical strength by heat or light.
- adhesion to the lead frame is poor.
- An object of the present invention is to provide a curable silicone composition that has excellent formability and forms a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, and has excellent dimensional stability.
- a further object of the present invention is to provide a cured product that has little discoloration and lowering of mechanical strength by heat and light, and has high light reflectance.
- a further object of the present invention is to provide an optical semiconductor device that has a light reflector material that bonds readily to the lead frame.
- a curable silicone composition of the present invention characteristically comprises:
- R 1 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 80 mole% of all R are phenyl groups, and 5 to 20 mole% of all R are alkenyl groups;
- R is a hydrogen atom or alkyl group having from 1 to 6 carbons; and
- R 3 3 SiO(R 3 2 SiO) m SiR 3 3 wherein R 3 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 70 mole% of all R 3 are phenyl groups, and at least one R 3 is an alkenyl group; and "m" is an integer in a range from 10 to 100;
- R 4 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, alkenyl groups having from 2 to 6 carbons, glycidoxyalkyl groups, or epoxycyclohexyl alkyl groups, provided that 15 to 60 mole% of all R 4 are phenyl groups, 3 to 30 mole% of all R 4 are alkenyl groups, and 5 to 30 mole% of all R 4 are glycidoxyalkyl groups or epoxycyclohexyl alkyl groups;
- R 5 is a hydrogen atom or an alkyl group having from 1 to 6 carbons; and
- the cured product of the present invention is characterisically provided by curing the aforementioned curable silicone composition.
- an optical semiconductor device of the present invention is characterized in comprising: an optical semiconductor element, a lead frame for electrical connection to the element, and a light reflection material, contacting the lead frame, for reflection of light emitted from the element; wherein the light reflection material is formed by a cured product of the curable silicone composition.
- the curable silicone composition of the present invention has excellent formability and upon curing characteristcically forms a crured product that exhibits little discoloration or lowering of mechanical strength by heat or light, and that has high light reflectance and excellent dimensional stability. Moreover, the cured product of the present invention has little discoloration or lowering of mechanical strength by heat or light and has high light reflectance. Furthermore, in the optical semiconductor device of the present invention, the light reflection material adheres well to the lead frame.
- Figure 1 is a cross-sectional view of an LED as one example of the optical semiconductor device of the present invention. Detailed Description of the Invention
- Component (A) is the main component of the present composition and is an organopolysiloxane represented by the following average unit formula:
- R 1 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons.
- Examples of the alkyl group of R 1 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups.
- Examples of the alkenyl group of R 1 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups.
- the content of phenyl groups in all R 1 is in a range from 30 to 80 mole%, and is preferably in a range from 40 to 70 mole%. When the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good. On the other hand, when the content of phenyl groups is less than or equal to the aforementioned upper limit, hardness of the obtained cured product is good at high temperature.
- the content of alkenyl groups in all R 1 in the formula is in a range from 5 to 20 mole%.
- the content of alkenyl groups is greater than or equal to the lower limit of the aforementioned range, hardness of the obtained cured product at room temperature is good.
- the content of alkenyl groups is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good.
- R 2 in the formula is a hydrogen atom or alkyl group having from 1 to 6 carbons.
- alkyl group of R 2 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, and hexyl groups.
- a is a number indicating the fraction of siloxane units represented by the general formula: and is a number satisfying: 0 ⁇ a ⁇ 0.3, and preferably 0 ⁇ a ⁇ 0.25.
- b is a number indicating the fraction of siloxane units represented by the general formula: R ⁇ SiO ⁇ , and is a number satisfying: 0 ⁇ b ⁇ 0.7, and preferably 0 ⁇ a ⁇ 0.6.
- c is a number indicating the fraction of siloxane units represented by the general formula:
- R'Si0 3/2 is a number satisfying: 0.3 ⁇ c ⁇ 0.9, and preferably: 0.35 ⁇ c ⁇ 0.85.
- c is greater than or equal to the lower limit of the aforementioned range, hardness of the obtained cured product at room temperature is good.
- c is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good.
- d is a number indicating the fraction of siloxane units represented by the general formula: Si0 4/2 , and is a number satisfying: 0 ⁇ d ⁇ 0.1.
- Component (B) is a component used for improving handling and processability of the present composition and adjusting hardness of the obtained cured product.
- Component (B) is an organopolysiloxane having 10 or less silicon atoms and not having a glycidoxyalkyl group or epoxycyclohexyl alkyl group, wherein 30 to 60 mole% of all silicon atom-bonded organic groups in this component are alkenyl groups having from 2 to 6 carbons.
- alkenyl groups in component (B) include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups.
- this group is exemplified by the methyl group and phenyl group, and preferably is the methyl group.
- the number of silicon atoms is less than or equal to 10. This is because viscosity of the composition is good when the number of silicon atoms is less than or equal to 10.
- component (B) examples include 1 ,3,5, 7-tetramethyl-l , 3, 5, 7- tetravinylcyclotetrasiloxane, tetrakis(dimethylvinylsiloxy)silane,
- methyltris(dimethylvinylsiloxy)silane methyltris(dimethylvinylsiloxy)silane, and phenyltris(dimethylvinylsiloxy)silane.
- the content of component (B) in the present composition per 100 parts by mass of component (A), is in a range from 5 to 50 parts by mass, and is preferably in a range from 5 to 40 parts by mass.
- the content of component (B) is greater than or equal to the lower limit of the aforementioned range, viscosity of the composition is good.
- the content of component (B) is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good.
- Component (C) is an optional component for adjusting viscosity of the present composition and for adjusting hardness and mechanical strength of the obtained cured product.
- Component (C) is an organopolysiloxane represented by the following general formula:
- R 3 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons.
- Examples of the alkyl group of R 3 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups.
- Examples of the alkenyl group of R 3 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups.
- the content of phenyl groups in all R 3 is in a range from 30 to 70 mole%, and is preferably in a range from 40 to 60 mole%. When the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good. On the other hand, when the content of phenyl groups is greater than or equal to the
- At least one R 3 is an alkenyl group. This component participates in the curing reaction when this component has at least one alkenyl group.
- m is an integer in a range from 10 to 100, and is preferably an integer in a range from 10 to 50.
- “m” is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good.
- “m” is less than or equal to the upper limit of the aforementioned range, handling and processability of the obtained composition is good.
- the content of component (C) in the present composition per 100 parts by mass of component (A), is in a range from 0 to 40 parts by mass, and is preferably in a range from 0 to 20 parts by mass.
- the content of component (C) is less than or equal to the aforementioned upper limit, hardness of the obtained cured product is good.
- Component (D) is a crosslinking agent of the present composition, and is an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein 20 to 70 mole% of all silicon atom-bonded organic groups in component (D) are phenyl groups.
- the number of the silicon atom-bonded hydrogen atoms in a molecule in component (D) is greater than or equal to 2. If this number of the silicon atom-bonded hydrogen atoms is present, crosslinking for curing is sufficient, and hardness of the obtained cured product is good.
- Examples of the silicon-bonded organic group in component (D) include a monovalent hydrocarbon group having no unsaturated aliphatic bond, as exemplified by an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, and the like; an aryl group such as a phenyl group, tolyl group, xylyl group, and the like; and an aralkyl group such as a benzyl group, phenethyl group, and the like.
- an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, cyclopentyl group, cyclohexyl group, cyclohept
- a phenyl group and an alkyl group having from 1 to 6 carbons are preferred.
- component (D) 20 to 70 mole% of all silicon atom-bonded organic groups are phenyl groups.
- the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product at high temperature is good.
- the content of phenyl groups is less than or equal to the aforementioned upper limit, mechanical strength of the obtained cured product is good.
- component (D) examples include an organotrisiloxane represented by the following general formula:
- R 6 are the same or different, and are phenyl groups or alkyl groups having from 1 to 6 carbons.
- alkyl group of R 6 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups.
- the content of phenyl groups in all R 6 is in a range from 30 to 70 mole%.
- R 7 are the same or different, and are hydrogen atoms, phenyl groups, or alkyl groups having from 1 to 6 carbons. At least two R 7 in the formula are hydrogen atoms. Examples of the alkyl group of R 7 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups. The content of phenyl groups in all R 7 except hydrogen atoms is in a range from 30 to 70 mole%.
- n is an integer in a range from 5 to 1 ,000.
- p is a positive number
- q is 0 or a positive number
- r is 0 or a positive number
- s is
- the ratio "q /p" is a number in a range from 0 to 10.
- the ratio "r / p” is a number in a range from 0 to 5.
- the ratio "s / (p + q + r +s)" is a number in a range from 0 to 0.3.
- t / (p + q + r +s) is a number in a range from 0 to 0.4.
- All of component (D) or the main component of component (D) is preferably an organotrisiloxane represented by the following general formula:
- the content of this organotrisiloxane in component (D) is preferably at least 50% by mass.
- the content of component (D) in the present composition is an amount such that the amount of silicon atom-bonded hydrogen atoms in this component, per 1 mole of the total amount of alkenyl groups in components (A) to (C) and component (E), is from 0.5 to 2.0 moles, and is preferably from 0.5 to 1.5 moles.
- hardness of the obtained cured product is good.
- Component (E) is an adhesion promoter of the present composition and is an organopolysiloxane represented by the average unit formula:
- R 4 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, alkenyl groups having from 2 to 6 carbons,
- glycidoxyalkyl groups or epoxycyclohexyl alkyl groups.
- alkyl group of R 4 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups.
- alkenyl group of R 4 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups.
- the glycidoxyalkyl group of R 4 include 3-glycidoxypropyl groups and 4- glycidoxybutyl groups.
- Examples of the epoxycyclohexyl alkyl group of R 4 include 2- (3,4-epoxycyclohexyl)ethyl groups and 3-(3,4-epoxycyclohexyl)propyl groups.
- the content of phenyl groups in all R 4 is in a range from 15 to 60 mole%, and is preferably in a range from 20 to 50 mole%.
- the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, adhesion and reflectance of the obtained cured product is good.
- the content of phenyl groups is less than or equal to the aforementioned upper limit, adhesion and heat resistance properties of the obtained cured product is good.
- the content of alkenyl groups in all R 4 is in a range from 3 to 30 mole%, and is preferably in a range from 5 to 20 mole%.
- the content of alkenyl groups is within the aforementioned range, adhesion of the obtained cured product is good.
- epoxycyclohexylalkyl groups in all R 4 is in a range from 5 to 30 mole%, and is preferably in a range from 10 to 20 mole%.
- content of epoxy group-containing organic groups is greater than or equal to the lower limit of the aforementioned range, adhesion of the obtained cured product to metal is good.
- content of epoxy group-containing organic groups is less than or equal to the aforementioned upper limit, heat resistance properties is good.
- R 5 in the formula is a hydrogen atom or alkyl group having from 1 to 6 carbons.
- alkyl group of R 5 include methyl groups, ethyl groups, butyl groups, pentyl groups, and hexyl groups.
- f ' is a number indicating the fraction of siloxane units represented by the general formula: R 4 3 SiOi/ 2 , and is a number satisfying: 0 ⁇ f ⁇ 0.5, and preferably 0 ⁇ f ⁇ 0.4.
- f ' is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good.
- g is a number indicating the fraction of siloxane units represented by the general formula: R 4 2 Si0 2/2 , and is a number satisfying: 0 ⁇ g ⁇ 0.9, and preferably
- h is a number indicating the fraction of siloxane units represented by the general formula: R Si0 3/2 , and is a number satisfying: 0 ⁇ h ⁇ 0.7, and preferably 0 ⁇ h ⁇ 0.6. When “h” is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good.
- "i" is a number indicating the fraction of siloxane units represented by the general formula: Si0 4/2 , and is a number satisfying: 0 ⁇ i ⁇ 0.3, and preferably 0 ⁇ i ⁇ 0.2. When “i” is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good.
- "j” is a number indicating the fraction of units represented by the general formula: R 5 0i /2 , and is a number satisfying: 0 ⁇ j ⁇ 0.02. When “j" is less than or equal to the upper limit of the aforementioned range, storage stability and usable life of the present composition are good. Furthermore, the sum off, "g", “h”, and “i” in the formula is 1.
- the content of component (E) in the present composition per 100 parts by mass of the total amount of components (A) to (D), is in a range from 0.5 to 5.0 parts by mass, and is preferably in a range from 1.0 to 3.0 parts by mass.
- the content of component (E) is less than or equal to the upper limit of the aforementioned range, heat resistance properties of the obtained cured product is good.
- the content of component (E) is greater than or equal to the lower limit of the aforementioned range, adhesion of the obtained cured product is good.
- Component (F) is a hydrosilylation reaction catalyst for accelerating the hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D).
- component (F) examples include platinum-type catalysts, rhodium-type catalysts, and palladium-type catalysts. Platinum-type catalysts are preferred due to the ability to remarkably accelerate curing of the composition. Examples of the platinum-type catalysts include platinum fine powder, chloroplatinic acid, alcoholic solutions of chloroplatinic acid, platinum-alkenylsiloxane complexes, platinum-olefin complexes, and platinum-carbonyl complexes., Platinum-alkenylsiloxane complexes are particularly preferred.
- alkenylsiloxane examples include 1 ,3 -di vinyl- 1 ,1 ,3,3- tetramethyldisiloxane, 1 ,3,5,7-tetramethyl-l ,3,5,7-tetravinyl cyclotetrasiloxane, alkenylsiloxanes having part of the methyl groups of these alkenylsiloxane substituted by ethyl groups, phenyl groups, or the like, and alkenylsiloxanes having vinyl groups of these alkenylsiloxane substituted by allyl groups, hexenyl groups, or the like.
- 1 ,3-divinyl- 1,1 ,3,3-tetramethyldisiloxane is particularly preferred due to high stability of the platinum- alkenylsiloxane complex. Due to the ability for improving the stability of the platinum- alkenylsiloxane complexes, combination is recommended of the platinum-alkenylsiloxane complexes with organosiloxane oligomers such as 1 ,3-divinyl-l ,1 ,3,3- tetramethyldisiloxane, l ,3-diallyl-l ,l ,3,3-tetramethyldisiloxane, l,3-divinyl-l ,3-dimethyl- 1 ,3-diphenyldisiloxane, l ,3-divinyl-l ,l ,3,3-tetraphenyldisiloxane, 1 ,3,5,7-tetramethyl- 1 ,3,5,7
- component (F) No particular limitation is placed on the content of component (F) in the composition as long as there is an amount sufficient to accelerate the hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D).
- this concentration in the present composition in terms of mass units, the content of the metal atoms in the component (F), is preferably from 0.01 to 500 ppm, further preferably is from 0.01 to 100 ppm, and particularly preferably is from 0.01 to 50 ppm.
- the content of component (F) is greater than or equal to the lower limit of the aforementioned range, the obtained composition exhibits an excellent cure.
- the content of component (F) is less than or equal to the upper limit of the aforementioned range, the obtained cured product is resistant to discoloration.
- Component (G) is a white pigment for coloring the cured product and composition of the present invention white and for increasing light reflectance.
- Preferred examples of the component (G) include metal oxides such as titanium oxide, alumina, zinc oxide, zirconium oxide, magnesium oxide, and the like; barium sulfate, zinc sulfate, or the like; and titanium oxide and zinc oxide are particularly preferred.
- the average particle diameter is preferably in a range from 0.05 to 10.0 ⁇ , and further is preferably in a range from 0.1 to 5.0 ⁇ .
- the white pigment may be surface-treated using a silane coupling agent, silica, alumina, or the like.
- the content of component (G) in the present composition per 100 parts by mass of the total amount of components (A) to (F), is greater than or equal to 25 parts by mass, and is preferably greater than or equal to 30 parts by mass. Light reflectance of the cured product is good when the content of component (G) is greater than or equal to the lower limit of the aforementioned range.
- Component (H) is an inorganic filler other than a white pigment for decreasing linear expansion coefficient of the cured product of the present invention, for improvement of dimensional stability, and for imparting appropriate viscosity to the composition.
- the inorganic filler of component (H) is exemplified by spherical silica, non-spherical silica, glass fiber, mica, and calcium carbonate.
- the spherical silica include dry- process silica, precipitated silica, fused silica, and pyrogenic silica.
- Examples of the spherical silica include quartz powder and glass beads.
- the glass fiber include chopped glass fibers and milled glass fibers.
- the average particle diameter of the inorganic filler of component (H) is preferably in a range from 0.1 to 20 ⁇ , and further preferably is in a range from 0.5 to 10 ⁇ .
- fiber diameter is preferably in a range from 1 to 50 ⁇ , and further preferably is in a range from 5 to 20 ⁇ .
- Fiber length is preferably in a range from 5 to 500 ⁇ , and further preferably is in a range from 10 to 300 ⁇ .
- the content of component (H) in the present composition per 100 parts by mass of the total amount of components (A) to (F), is greater than or equal to 40 parts by mass, and is preferably greater than or equal to 50 parts by mass.
- Linear expansion coefficient of the obtained cured product is low and dimensional stability is good when the content of component (H) is greater than or equal to the lower limit of the aforementioned range.
- the total content of components (G) and (H) in the present composition per 100 parts by mass of the total amount of components (A) to (F), is less than or equal to 300 parts by mass, and is preferably less than or equal to 250 parts by mass. Viscosity of the obtained composition is good when the total content of components (G) and (H) is less than or equal to the aforementioned upper limit.
- reaction inhibitor for example, alkyne alcohols such as 1-ethynyl-l-cyclohexanol, 2-methyl-3-butyn-2-ol, 3,5- dimethyl-l -hexyn-3-ol, 2-phenyl-3-butyn-2-ol, and the like; eneyne compounds such as 3- methyl-3-penten-l -yne, 3,5-dimethyl-3-hexen-l-yne, and the like; and 1 ,3,5,7-tetramethyl- 1 ,3,5,7-tetravinylcyclotetrasiloxane, l ,3,5,7-tetramethyl-l ,3,5,7- tetrahexenylcyclotetrasiloxane, benzotriazole, and the like.
- alkyne alcohols such as 1-ethynyl-l-cyclohexanol, 2-methyl-3-butyn-2-ol, 3,5- dimethyl-l
- components include organic resin powders of polymethacrylate resins, silicone resins, or the like; carnauba wax, metal stearate salts, methyl silicone oils, or the like mold release agents; and thermal stabilizers, flame retardants, solvents, or the like.
- the viscosity of the present composition is preferably in a range from 2 to 200 Pa- s, further is preferably in a range from 3 to 120 Pa- s, and particularly is preferably in a range from 5 to 80 Pa- s.
- the occurrence of flashing in the obtained molded article is suppressed when the viscosity is greater than or equal to the lower limit of the aforementioned range.
- type D durometer hardness as specified by JIS K 7215-1986 "Testing Methods for Durometer Hardness of Plastics" is preferably greater than or equal to 60, further is preferably greater than or equal to 65, and particularly is preferably greater than or equal to 70. Dimensional stability of the cured product improves and resistance to deformation of the cured product increases when hardness is greater than or equal to the lower limit of the aforementioned range.
- bending strength of the cured product of the present composition is preferably greater than or equal to 5 MPa, further preferably is greater than or equal to 7 MPa, and particularly preferably is greater than or equal to 10 MPa.
- Mechanical strength of the cured product is good, and the cured product becomes resistant to cracking or the like, when bending strength is greater than or equal to the lower limit of the
- total luminous reflectance as measured according to the method stipulated in JIS K 7375: 2008 "Plastics - Determination of Total Luminous Transmittance and Reflectance" is preferably greater than or equal to 80%, and particularly preferably is greater than or equal to 90%.
- the linear expansion coefficient of the cured product of the present composition measured according to the method stipulated in JIS K 7197-1991 "Testing Method for Linear Thermal Expansion Coefficient of Plastics by Thermomechanical Analysis" in the temperature range of 25 to 200°C has an average value that is preferably less than or equal to 200 ppm/°C, and particularly preferably is less than or equal to 150 ppm/°C.
- the composition of the present invention preferably is heated to cause rapid curing. Heating temperature is preferably in a range from 50 to 200°C, and further preferably is in a range from 100 to 150°C.
- the molding method of the present composition is exemplified by transfer molding, injection molding, and compression molding.
- the cured product of the present composition displays good adhesion toward various types of substrates and is particularly characterized in that adhesion is high toward a metallic lead frame.
- This adhesion measured as a die shear strength determined by die shear testing, for example, is preferably greater than or equal to 5 N/mm 2 , and particularly preferably is greater than or equal to 8 N/mm 2 .
- the cured product of the present invention is obtained by curing the aforementioned composition.
- the cured product of the present invention preferably has characteristics as described above.
- the optical semiconductor device of the present invention is characterized by comprising: an optical semiconductor element, a lead frame for electrical connection to the element, and a light reflection material, contacting the lead frame, for reflection of light emitted from the element; wherein the light reflection material is formed by a cured product of the curable silicone composition.
- This type of optical semiconductor device is exemplified by a light emitting diode (LED).
- the material of the lead frame in this optical semiconductor device is exemplified by silver, nickel, aluminum, copper, silver- plated copper, or the like.
- the light reflection material functions as a packaging material of the optical semiconductor device.
- Figure 1 shows a cross-sectional view of a surface mounted type LED, which is one example of the semiconductor device of the present invention.
- the optical semiconductor element 1 is die bonded to a lead frame 2 by a die bonding material, and lead frames 2,3 and this optical semiconductor element 1 are further wire bonded to the lead frame 2,3 by bonding wires 4,4'.
- a light reflection material 5 composed of the cured product formed from the aforementioned curable silicone composition is present.
- the optical semiconductor element 1 within this light reflection material 5 is sealed by the sealing agent 6.
- the method of production of the surface mounted type LED shown in Figure 1 is exemplified by a method including the steps of: (1) forming a light reflection material 5 integrated with the lead frames 2,3 by compression molding or transfer molding of the curable silicone composition, (2) die bonding of the optical semiconductor element 1 on the lead frame 2 using a die bonding material, (3) wire bonding the optical semiconductor element 1 and the lead frames 2,3 using bonding wires 4,4', and (4) sealing the optical semiconductor element 1 using the sealing agent 6.
- Hardness of the cured product was measured by a type D durometer as specified in JIS K 7215-1986 "Testing Methods for Durometer Hardness of Plastics.”
- Total luminous reflectance of the cured product was measured by the method specified in JIS K 7375:2008 "Plastics - Determination of Total Luminous Transmittance and Reflectance.”
- Average linear expansion coefficient of the cured product in the temperature range of 25 to 200°C was measured by the method specified in JIS K 7197-1991 "Testing Method for Linear Thermal Expansion Coefficient of Plastics by Thermomechanical Analysis.”
- a dispenser was used to coat the curable silicone composition on a 25 mm> ⁇ 75 mm aluminum plate at 5 locations using roughly 100 mg at each location.
- a 1 mm thick and 6 mm square aluminum chip was placed on the composition, and the assembly was pressure bonded by a 1 kg plate. Thereafter, the assembly was heated for 2 hours at 150°C, and the curable silicone composition was cured. After the assembly was cooled to room temperature, die shear strength was measured using a shear strength measurement apparatus (Bond Tester SS-100KP, manufactured by Seishin Trading Co., Ltd.). Also, die shear strength of silver-plated steel chip toward silver-plated steel plate was measured in the above described manner.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 76, a bending strength of 8.5 MPa, a total luminous reflectance of 94.5%, and a linear expansion coefficient of 1 18 ppm/°C.
- Die shear strength against an aluminum plate was 9.8 N/mm 2
- die shear strength against a silver-plated steel plate was 8.2 N/mm 2 .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 81 , a bending strength of 20 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 96 ppm/°C.
- Die shear strength against an aluminum plate was 14 N/mm 2
- die shear strength against a silver-plated steel plate was 12 N/mm .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 83, a bending strength of 17 MPa, a total luminous reflectance of 93.4%, and a linear expansion coefficient of 89 ppm/°C.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 84, a bending strength of 19 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 76 ppm/°C.
- Die shear strength against an aluminum plate was 12 N/mm 2
- die shear strength against a silver-plated steel plate was 10 N/mm 2 .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 75, a bending strength of 7.0 MPa, a total luminous reflectance of 94.5%, and a linear expansion coefficient of 121 ppm/°C.
- Die shear strength against an aluminum plate was 3.4 N/mm 2
- die shear strength against a silver-plated steel plate was 2.2 N/mm 2 .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a molded product free of flashing and voids was obtained by integrating molding with a lead frame at 120°C, although peeling was observed at the contacting part of the lead frame and the light reflection material.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 80, a bending strength of 14 MPa, a total luminous reflectance of 95.2%, and a linear expansion coefficient of 98 ppm/°C.
- Die shear strength against an aluminum plate was 7.0 N/mm 2
- die shear strength against a silver-plated steel plate was 6.2 N/mm .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 82, a bending strength of 16 MPa, a total luminous reflectance of 93.3%, and a linear expansion coefficient of 85 ppm/°C.
- Die shear strength against an aluminum plate was 3.3 N/mm
- die shear strength against a silver-plated steel plate was 1.0 N/mm 2 .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a molded product free of flashing and voids was obtained by integrating molding with a lead frame at 120°C, although peeling was observed at the contacting part of the lead frame and the light reflection material.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 84, a bending strength of 19 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 76 ppm/°C.
- Die shear strength against an aluminum plate was 5.0 N/mm 2
- die shear strength against a silver-plated steel plate was 2.9 N/mm 2
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C. However, peeling was observed at the contacting part between the lead frame and light reflection material.
- This composition was heated for 2 hours at 150°C to form a cured product.
- This cured product had a type D durometer hardness of 83, a bending strength of 16 MPa, a total luminous reflectance of 95.2%, and a linear expansion coefficient of 78 ppm/°C.
- Die shear strength against an aluminum plate was 6.5 N/mm 2
- die shear strength against a silver-plated steel plate was 4.1 N/mm 2 .
- a transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
- a good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C. However, peeling was observed at the contacting part between the lead frame and light reflection material.
- the curable silicone composition of the present invention has good formability, and the cured product has good adhesion to the metal used in a lead frame.
- the curable silicone composition of the present invention is suitable as a material for a white case material of a light emitting diode.
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Abstract
A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole% of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole%; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
Description
DESCRIPTION
CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF,
AND OPTICAL SEMICONDUCTOR DEVICE
Technical Field
[0001] The present invention relates to a curable silicone composition, cured product thereof, and to an optical semiconductor device using the cured product as a light reflection material.
[0002] Priority is claimed on Japanese Patent Application No. 2012-021280, filed on February 2, 2012, the content of which is incorporated herein by reference. Background Art
[0003] Curable silicone compositions that cure by a hydrosilylation reaction are used as protective agents, coating agents, lens-molding materials, light reflection materials, or the like for optical semiconductor elements in optical semiconductor devices such as photocouplers, light emitting diodes, solid-state imaging devices, or the like. Among these, the compositions used as light reflection materials can be exemplified by a resin composition for a mounting package that incorporates an optical semiconductor element, and comprises a thermosetting type addition reaction-capable silicone resin that has a structure where vinyl groups or allyl groups, and hydrogen atoms are directly bonded to silicon atoms, a platinum-type catalyst as a curing catalyst, and a white pigment (refer to Japanese Unexamined Patent Application Publication No. 2009-21394); and by an addition curable silicone resin composition comprises a vinyl-functional organopolysiloxane having a weight average molecular weight (Mw) greater than or equal to 30,000, an
organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, a white pigment; an inorganic filler other than the white pigment, a platinum metal-type catalyst; and a reaction inhibitor, wherein its cured product has a visible light average reflectance greater than or equal to 80% (refer to Japanese Unexamined Patent Application Publication No. 201 1 -140550).
[0004] These compositions have the following problems in transfer molding, injection molding, or compression molding: low mold filling, facile generation of voids and flashing, and/or a poor mold releasability; also, slow curing rate and a poor workability in the molding operation. In addition, although the cured products obtained by curing these compositions have the advantage of little discoloration by heat and light, the cured
products have following problems of high linear expansion coefficients and/or a low mechanical strength at high temperature, as well as the problemes of an insufficient light reflectance and great lowering of mechanical strength by heat or light. When such a composition is used to form a light reflection material in an optical semiconductor device in contact with a lead frame, adhesion to the lead frame is poor.
[0005] An object of the present invention is to provide a curable silicone composition that has excellent formability and forms a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, and has excellent dimensional stability. A further object of the present invention is to provide a cured product that has little discoloration and lowering of mechanical strength by heat and light, and has high light reflectance. A further object of the present invention is to provide an optical semiconductor device that has a light reflector material that bonds readily to the lead frame.
Disclosure of Invention
[0006J A curable silicone composition of the present invention characteristically comprises:
(A) 100 parts by mass of an organopolysiloxane represented by the following average unit formula:
(R! 3Si01/2)a
(R'Si03/2)c (Si04/2)d (R201/2)e
wherein R1 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 80 mole% of all R are phenyl groups, and 5 to 20 mole% of all R are alkenyl groups; R is a hydrogen atom or alkyl group having from 1 to 6 carbons; and "a", "b", "c", "d", and "e" are numbers that respectively satisfy: 0 < a < 0.3, 0 < b < 0.7, 0.3 < c < 0.9, 0 < d < 0.1 , 0 < e < 0.1 , and a + b + c + d = 1 ;
(B) 5 to 50 parts by mass of an organopolysiloxane having 10 or less silicon atoms and not having a glycidoxyalkyl group or epoxycyclohexyl alkyl group, wherein 30 to 60 mole% of all silicon atom-bonded organic groups in this component are alkenyl groups having from 2 to 6 carbons;
(C) 0 to 40 parts by mass of an organopolysiloxane represented by the following general formula:
R3 3SiO(R3 2SiO)m SiR3 3
wherein R3 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 70 mole% of all R3 are phenyl groups, and at least one R3 is an alkenyl group; and "m" is an integer in a range from 10 to 100;
(D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein 20 to 70 mol% of all silicon atom-bonded organic groups in this component are phenyl groups, in an amount that provides 0.5 to 2.0 moles of the silicon atom-bonded hydrogen atoms in this component per 1 mole of the total amount of alkenyl groups in components (A) to (C) and component (E);
(E) an organopolysiloxane represented by the following average unit formula:
(R4 3Si01/2)f (R4 2Si02/2)g (R4Si03/2)h (Si04/2)i (R50,/2)j
wherein R4 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, alkenyl groups having from 2 to 6 carbons, glycidoxyalkyl groups, or epoxycyclohexyl alkyl groups, provided that 15 to 60 mole% of all R4 are phenyl groups, 3 to 30 mole% of all R4 are alkenyl groups, and 5 to 30 mole% of all R4 are glycidoxyalkyl groups or epoxycyclohexyl alkyl groups; R5 is a hydrogen atom or an alkyl group having from 1 to 6 carbons; and "f ', "g", "h", "i", and "j" are numbers that respectively satisfy: 0 < f < 0.5, 0 < g < 0.9, 0 < h < 0.7, 0 < i < 0.3, 0 < j < 0.02, and f + g + h + i = l , in an amount of 0.5 to 5.0 parts by mass per 100 parts by mass of the total amount of components (A) to (D);
(F) a hydrosilylation reaction catalyst in an amount sufficient to accelerate a
hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D);
(G) a white pigment in an amount of at least 25 parts by mass per 100 parts by mass of the total amount of components (A) to (F); and
(H) an inorganic filler other than a white pigment in an amount of at least 40 parts by mass per 100 parts by mass of the total amount of components (A) to (F),
wherein the content of the total amount of components (G) and (H) is not more than 300 parts by mass per 100 parts by mass of the total amount of components (A) to (F).
[0007] Moreover, the cured product of the present invention is characterisically provided by curing the aforementioned curable silicone composition.
[0008] Furthermore, an optical semiconductor device of the present invention is characterized in comprising: an optical semiconductor element, a lead frame for electrical
connection to the element, and a light reflection material, contacting the lead frame, for reflection of light emitted from the element; wherein the light reflection material is formed by a cured product of the curable silicone composition.
Effects of Invention
[0009] The curable silicone composition of the present invention has excellent formability and upon curing characteristcically forms a crured product that exhibits little discoloration or lowering of mechanical strength by heat or light, and that has high light reflectance and excellent dimensional stability. Moreover, the cured product of the present invention has little discoloration or lowering of mechanical strength by heat or light and has high light reflectance. Furthermore, in the optical semiconductor device of the present invention, the light reflection material adheres well to the lead frame.
Brief Description of the Drawings
[0010] Figure 1 is a cross-sectional view of an LED as one example of the optical semiconductor device of the present invention. Detailed Description of the Invention
[0011] Firstly, the curable silicone composition of the present invention will be explained in detail.
[0012] Component (A) is the main component of the present composition and is an organopolysiloxane represented by the following average unit formula:
[0013] In the formula, R1 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons.
Examples of the alkyl group of R1 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups. Examples of the alkenyl group of R1 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups. In the formula, the content of phenyl groups in all R1 is in a range from 30 to 80 mole%, and is preferably in a range from 40 to 70 mole%. When the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good. On the other hand, when the content of phenyl groups is less than or equal to the aforementioned upper limit, hardness of the obtained cured product is good at high temperature.
Moreover, the content of alkenyl groups in all R1 in the formula is in a range from 5 to 20
mole%. When the content of alkenyl groups is greater than or equal to the lower limit of the aforementioned range, hardness of the obtained cured product at room temperature is good. On the other hand, when the content of alkenyl groups is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good.
[0014] Moreover, R2 in the formula is a hydrogen atom or alkyl group having from 1 to 6 carbons. Examples of the alkyl group of R2 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, and hexyl groups.
[0015] Moreover, in the formula, "a" is a number indicating the fraction of siloxane units represented by the general formula:
and is a number satisfying: 0 < a < 0.3, and preferably 0 < a < 0.25. When the value of "a" is less than or equal to the
aforementioned upper limit, hardness of the obtained cured product at room temperature is good. Moreover, "b" is a number indicating the fraction of siloxane units represented by the general formula: R^SiO^, and is a number satisfying: 0 < b < 0.7, and preferably 0 < a < 0.6. When the value of "b" is less than or equal to the aforementioned upper limit, hardness of the obtained cured product at room temperature is good. Moreover, "c" is a number indicating the fraction of siloxane units represented by the general formula:
R'Si03/2, and is a number satisfying: 0.3 < c < 0.9, and preferably: 0.35 < c < 0.85. When the value of "c" is greater than or equal to the lower limit of the aforementioned range, hardness of the obtained cured product at room temperature is good. On the other hand, when the value of "c" is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good. Moreover, "d" is a number indicating the fraction of siloxane units represented by the general formula: Si04/2, and is a number satisfying: 0 < d < 0.1. When the value of "d" is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good. Moreover, "e" is a number indicating the fraction of units represented by the general formula: R20i/2, and is a number satisfying: 0 < e < 0.1. When the value of "e" is less than or equal to the aforementioned upper limit, hardness of the obtained cured product at room temperature is good. Furthermore, the sum of "a", "b", "c", and "d" in the formula is 1.
[0016] Component (B) is a component used for improving handling and processability of the present composition and adjusting hardness of the obtained cured product.
Component (B) is an organopolysiloxane having 10 or less silicon atoms and not having a
glycidoxyalkyl group or epoxycyclohexyl alkyl group, wherein 30 to 60 mole% of all silicon atom-bonded organic groups in this component are alkenyl groups having from 2 to 6 carbons. Examples of the alkenyl groups in component (B) include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups. Although no particular limitation is placed on the silicon-bonded organic group other than the alkenyl groups in component (B), this group is exemplified by the methyl group and phenyl group, and preferably is the methyl group. 30 to 60 mole% of all silicon atom-bonded organic groups in component (B) are alkenyl groups having from 2 to 6 carbons. When the content of alkenyl groups is greater than or equal to the lower limit of the aforementioned range, hardness of the obtained cured product is good. On the other hand, when the content of alkenyl groups is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good. Furthermore, the number of silicon atoms is less than or equal to 10. This is because viscosity of the composition is good when the number of silicon atoms is less than or equal to 10.
[0017] Examples of component (B) include 1 ,3,5, 7-tetramethyl-l , 3, 5, 7- tetravinylcyclotetrasiloxane, tetrakis(dimethylvinylsiloxy)silane,
methyltris(dimethylvinylsiloxy)silane, and phenyltris(dimethylvinylsiloxy)silane.
[0018] The content of component (B) in the present composition, per 100 parts by mass of component (A), is in a range from 5 to 50 parts by mass, and is preferably in a range from 5 to 40 parts by mass. When the content of component (B) is greater than or equal to the lower limit of the aforementioned range, viscosity of the composition is good. On the other hand, when the content of component (B) is less than or equal to the upper limit of the aforementioned range, mechanical strength of the obtained cured product is good.
[0019] Component (C) is an optional component for adjusting viscosity of the present composition and for adjusting hardness and mechanical strength of the obtained cured product. Component (C) is an organopolysiloxane represented by the following general formula:
R3 3SiO(R3 2SiO)m SiR3 3
[0020] In the formula, R3 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons.
Examples of the alkyl group of R3 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups.
Examples of the alkenyl group of R3 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups. In the formula, the content of phenyl groups in all R3 is in a range from 30 to 70 mole%, and is preferably in a range from 40 to 60 mole%. When the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good. On the other hand, when the content of phenyl groups is greater than or equal to the
aforementioned upper limit, hardness of the obtained cured product is good. Moreover, at least one R3 is an alkenyl group. This component participates in the curing reaction when this component has at least one alkenyl group.
[0021] In the formula, "m" is an integer in a range from 10 to 100, and is preferably an integer in a range from 10 to 50. When "m" is greater than or equal to the lower limit of the aforementioned range, mechanical strength of the obtained cured product is good. On the other hand, when "m" is less than or equal to the upper limit of the aforementioned range, handling and processability of the obtained composition is good.
[0022] The content of component (C) in the present composition, per 100 parts by mass of component (A), is in a range from 0 to 40 parts by mass, and is preferably in a range from 0 to 20 parts by mass. When the content of component (C) is less than or equal to the aforementioned upper limit, hardness of the obtained cured product is good.
[0023] Component (D) is a crosslinking agent of the present composition, and is an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein 20 to 70 mole% of all silicon atom-bonded organic groups in component (D) are phenyl groups. The number of the silicon atom-bonded hydrogen atoms in a molecule in component (D) is greater than or equal to 2. If this number of the silicon atom-bonded hydrogen atoms is present, crosslinking for curing is sufficient, and hardness of the obtained cured product is good. Examples of the silicon-bonded organic group in component (D) include a monovalent hydrocarbon group having no unsaturated aliphatic bond, as exemplified by an alkyl group such as a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, and the like; an aryl group such as a phenyl group, tolyl group, xylyl group, and the like; and an aralkyl group such as a benzyl group, phenethyl group, and the like. Of these, a phenyl group and an alkyl group having from 1 to 6 carbons are preferred. In component (D), 20 to 70 mole% of all silicon atom-bonded organic groups are phenyl groups. When the content of phenyl groups is greater than or equal to the
lower limit of the aforementioned range, mechanical strength of the obtained cured product at high temperature is good. On the other hand, when the content of phenyl groups is less than or equal to the aforementioned upper limit, mechanical strength of the obtained cured product is good.
[0024] Examples of component (D) include an organotrisiloxane represented by the following general formula:
(HR6 2SiO)2SiR6 2
a linear chain organopolysiloxane represented by the following general formula:
and a branched chain organopolysiloxane represented by the following average unit formula:
(R7Si03/2)p (R7 2Si02/2)q (R7 3Si01/2)r (Si04/2)s (X01/2)t
[0025] In the formula, R6 are the same or different, and are phenyl groups or alkyl groups having from 1 to 6 carbons. Examples of the alkyl group of R6 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups. The content of phenyl groups in all R6 is in a range from 30 to 70 mole%.
[0026] In the formula, R7 are the same or different, and are hydrogen atoms, phenyl groups, or alkyl groups having from 1 to 6 carbons. At least two R7 in the formula are hydrogen atoms. Examples of the alkyl group of R7 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups. The content of phenyl groups in all R7 except hydrogen atoms is in a range from 30 to 70 mole%.
[0027] In the formula, "n" is an integer in a range from 5 to 1 ,000. In the formula, "p" is a positive number, "q" is 0 or a positive number, "r" is 0 or a positive number, "s" is
0 or a positive number, and "t" is 0 or a positive number. Also, the ratio "q /p" is a number in a range from 0 to 10. The ratio "r / p" is a number in a range from 0 to 5.
The ratio "s / (p + q + r +s)" is a number in a range from 0 to 0.3. The ratio
"t / (p + q + r +s)" is a number in a range from 0 to 0.4.
[0028] All of component (D) or the main component of component (D) is preferably an organotrisiloxane represented by the following general formula:
(HR6 2SiO)2 SiR6 2
The content of this organotrisiloxane in component (D) is preferably at least 50% by mass.
[0029] The content of component (D) in the present composition is an amount such that the amount of silicon atom-bonded hydrogen atoms in this component, per 1 mole of the total amount of alkenyl groups in components (A) to (C) and component (E), is from 0.5 to 2.0 moles, and is preferably from 0.5 to 1.5 moles. When the content of component (D) is within the aforementioned range, hardness of the obtained cured product is good.
[0030] Component (E) is an adhesion promoter of the present composition and is an organopolysiloxane represented by the average unit formula:
(R4 3Si01/2)f (R4 2Si02/2)g (R4Si03/2)h (Si04/2)i (R501/2)j
[0031] In the formula, R4 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, alkenyl groups having from 2 to 6 carbons,
glycidoxyalkyl groups, or epoxycyclohexyl alkyl groups. Examples of the alkyl group of R4 include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclopentyl groups, and cyclohexyl groups. Examples of the alkenyl group of R4 include vinyl groups, allyl groups, butenyl groups, pentenyl groups, and hexenyl groups. Examples of the glycidoxyalkyl group of R4 include 3-glycidoxypropyl groups and 4- glycidoxybutyl groups. Examples of the epoxycyclohexyl alkyl group of R4 include 2- (3,4-epoxycyclohexyl)ethyl groups and 3-(3,4-epoxycyclohexyl)propyl groups. In the formula, the content of phenyl groups in all R4 is in a range from 15 to 60 mole%, and is preferably in a range from 20 to 50 mole%. When the content of phenyl groups is greater than or equal to the lower limit of the aforementioned range, adhesion and reflectance of the obtained cured product is good. When the content of phenyl groups is less than or equal to the aforementioned upper limit, adhesion and heat resistance properties of the obtained cured product is good. In the formula, the content of alkenyl groups in all R4 is in a range from 3 to 30 mole%, and is preferably in a range from 5 to 20 mole%. When the content of alkenyl groups is within the aforementioned range, adhesion of the obtained cured product is good. Also, the content of glycidoxyalkyl groups or
epoxycyclohexylalkyl groups in all R4 is in a range from 5 to 30 mole%, and is preferably in a range from 10 to 20 mole%. When the content of epoxy group-containing organic groups is greater than or equal to the lower limit of the aforementioned range, adhesion of the obtained cured product to metal is good. When the content of epoxy group-containing organic groups is less than or equal to the aforementioned upper limit, heat resistance properties is good.
[0032] Moreover, R5 in the formula is a hydrogen atom or alkyl group having from 1
to 6 carbons. Examples of the alkyl group of R5 include methyl groups, ethyl groups, butyl groups, pentyl groups, and hexyl groups.
[0033] Moreover, in the formula, "f ' is a number indicating the fraction of siloxane units represented by the general formula: R4 3SiOi/2, and is a number satisfying: 0 < f < 0.5, and preferably 0 < f < 0.4. When "f ' is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good. Moreover, in the formula, "g" is a number indicating the fraction of siloxane units represented by the general formula: R4 2Si02/2, and is a number satisfying: 0 < g < 0.9, and preferably
0 < g < 0.8. When "g" is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good. Moreover, "h" is a number indicating the fraction of siloxane units represented by the general formula: R Si03/2, and is a number satisfying: 0 < h < 0.7, and preferably 0 < h < 0.6. When "h" is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good. Moreover, "i" is a number indicating the fraction of siloxane units represented by the general formula: Si04/2, and is a number satisfying: 0 < i < 0.3, and preferably 0 < i < 0.2. When "i" is less than or equal to the upper limit of the aforementioned range, adhesion of the obtained cured product is good. Moreover, "j" is a number indicating the fraction of units represented by the general formula: R50i/2, and is a number satisfying: 0 < j < 0.02. When "j" is less than or equal to the upper limit of the aforementioned range, storage stability and usable life of the present composition are good. Furthermore, the sum off, "g", "h", and "i" in the formula is 1.
[0034] The content of component (E) in the present composition, per 100 parts by mass of the total amount of components (A) to (D), is in a range from 0.5 to 5.0 parts by mass, and is preferably in a range from 1.0 to 3.0 parts by mass. When the content of component (E) is less than or equal to the upper limit of the aforementioned range, heat resistance properties of the obtained cured product is good. When the content of component (E) is greater than or equal to the lower limit of the aforementioned range, adhesion of the obtained cured product is good.
[0035] Component (F) is a hydrosilylation reaction catalyst for accelerating the hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D).
Examples of component (F) include platinum-type catalysts, rhodium-type catalysts, and palladium-type catalysts. Platinum-type catalysts are preferred due to the ability to
remarkably accelerate curing of the composition. Examples of the platinum-type catalysts include platinum fine powder, chloroplatinic acid, alcoholic solutions of chloroplatinic acid, platinum-alkenylsiloxane complexes, platinum-olefin complexes, and platinum-carbonyl complexes., Platinum-alkenylsiloxane complexes are particularly preferred. Examples of the alkenylsiloxane include 1 ,3 -di vinyl- 1 ,1 ,3,3- tetramethyldisiloxane, 1 ,3,5,7-tetramethyl-l ,3,5,7-tetravinyl cyclotetrasiloxane, alkenylsiloxanes having part of the methyl groups of these alkenylsiloxane substituted by ethyl groups, phenyl groups, or the like, and alkenylsiloxanes having vinyl groups of these alkenylsiloxane substituted by allyl groups, hexenyl groups, or the like. 1 ,3-divinyl- 1,1 ,3,3-tetramethyldisiloxane is particularly preferred due to high stability of the platinum- alkenylsiloxane complex. Due to the ability for improving the stability of the platinum- alkenylsiloxane complexes, combination is recommended of the platinum-alkenylsiloxane complexes with organosiloxane oligomers such as 1 ,3-divinyl-l ,1 ,3,3- tetramethyldisiloxane, l ,3-diallyl-l ,l ,3,3-tetramethyldisiloxane, l,3-divinyl-l ,3-dimethyl- 1 ,3-diphenyldisiloxane, l ,3-divinyl-l ,l ,3,3-tetraphenyldisiloxane, 1 ,3,5,7-tetramethyl- 1 ,3,5,7-tetravinyl cyclotetrasiloxane, or the like alkenylsiloxane, or dimethylsiloxane oligomers. The addition of alkenylsiloxanes is particularly preferred.
[0036] No particular limitation is placed on the content of component (F) in the composition as long as there is an amount sufficient to accelerate the hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D). However, this concentration in the present composition, in terms of mass units, the content of the metal atoms in the component (F), is preferably from 0.01 to 500 ppm, further preferably is from 0.01 to 100 ppm, and particularly preferably is from 0.01 to 50 ppm. When the content of component (F) is greater than or equal to the lower limit of the aforementioned range, the obtained composition exhibits an excellent cure. On the other hand, when the content of component (F) is less than or equal to the upper limit of the aforementioned range, the obtained cured product is resistant to discoloration.
[0037] Component (G) is a white pigment for coloring the cured product and composition of the present invention white and for increasing light reflectance. Preferred examples of the component (G) include metal oxides such as titanium oxide, alumina, zinc oxide, zirconium oxide, magnesium oxide, and the like; barium sulfate, zinc sulfate, or the like; and titanium oxide and zinc oxide are particularly preferred.
[0038] Although no particular limitation is placed on the shape and the average particle diameter of component (G), the average particle diameter is preferably in a range from 0.05 to 10.0 μη , and further is preferably in a range from 0.1 to 5.0 μηι. In order to increase the compatibility and dispersion ability of the white pigment with the resin and inorganic filler, the white pigment may be surface-treated using a silane coupling agent, silica, alumina, or the like.
[0039] The content of component (G) in the present composition, per 100 parts by mass of the total amount of components (A) to (F), is greater than or equal to 25 parts by mass, and is preferably greater than or equal to 30 parts by mass. Light reflectance of the cured product is good when the content of component (G) is greater than or equal to the lower limit of the aforementioned range.
[0040] Component (H) is an inorganic filler other than a white pigment for decreasing linear expansion coefficient of the cured product of the present invention, for improvement of dimensional stability, and for imparting appropriate viscosity to the composition. The inorganic filler of component (H) is exemplified by spherical silica, non-spherical silica, glass fiber, mica, and calcium carbonate. Examples of the spherical silica include dry- process silica, precipitated silica, fused silica, and pyrogenic silica. Examples of the spherical silica include quartz powder and glass beads. Examples of the glass fiber include chopped glass fibers and milled glass fibers.
[0041] Although no particular limitation is placed on average particle diameter of the inorganic filler of component (H), in the case of spheres, the average particle diameter is preferably in a range from 0.1 to 20 μιη, and further preferably is in a range from 0.5 to 10 μπι. In the case of fibers, fiber diameter is preferably in a range from 1 to 50 μπι, and further preferably is in a range from 5 to 20 μιη. Fiber length is preferably in a range from 5 to 500 μπι, and further preferably is in a range from 10 to 300 μηι.
[0042 J The content of component (H) in the present composition, per 100 parts by mass of the total amount of components (A) to (F), is greater than or equal to 40 parts by mass, and is preferably greater than or equal to 50 parts by mass. Linear expansion coefficient of the obtained cured product is low and dimensional stability is good when the content of component (H) is greater than or equal to the lower limit of the aforementioned range.
[0043] The total content of components (G) and (H) in the present composition, per 100 parts by mass of the total amount of components (A) to (F), is less than or equal to 300
parts by mass, and is preferably less than or equal to 250 parts by mass. Viscosity of the obtained composition is good when the total content of components (G) and (H) is less than or equal to the aforementioned upper limit.
[0044] Although the aforementioned components (A) to (H) are essential components of the present composition, other optional components include a reaction inhibitor, for example, alkyne alcohols such as 1-ethynyl-l-cyclohexanol, 2-methyl-3-butyn-2-ol, 3,5- dimethyl-l -hexyn-3-ol, 2-phenyl-3-butyn-2-ol, and the like; eneyne compounds such as 3- methyl-3-penten-l -yne, 3,5-dimethyl-3-hexen-l-yne, and the like; and 1 ,3,5,7-tetramethyl- 1 ,3,5,7-tetravinylcyclotetrasiloxane, l ,3,5,7-tetramethyl-l ,3,5,7- tetrahexenylcyclotetrasiloxane, benzotriazole, and the like. Although no limitation is placed on the content of this reaction inhibitor, the content in the present composition, in terms of mass units, is preferably in a range from 1 to 5,000 ppm.
[0045] As long as the object of the present invention is not impaired, other optional components may be included in the present composition. Such other optional
components include organic resin powders of polymethacrylate resins, silicone resins, or the like; carnauba wax, metal stearate salts, methyl silicone oils, or the like mold release agents; and thermal stabilizers, flame retardants, solvents, or the like.
[0046] Although no particular limitation is placed on the viscosity of the present composition at 25°C, the viscosity is preferably in a range from 2 to 200 Pa- s, further is preferably in a range from 3 to 120 Pa- s, and particularly is preferably in a range from 5 to 80 Pa- s. The occurrence of flashing in the obtained molded article is suppressed when the viscosity is greater than or equal to the lower limit of the aforementioned range.
Handling and processability of the obtained composition is good when viscosity is less than or equal to the upper limit of the aforementioned range.
[0047] Although no particular limitation is placed on the hardness of the cured product of the present invention, type D durometer hardness as specified by JIS K 7215-1986 "Testing Methods for Durometer Hardness of Plastics" is preferably greater than or equal to 60, further is preferably greater than or equal to 65, and particularly is preferably greater than or equal to 70. Dimensional stability of the cured product improves and resistance to deformation of the cured product increases when hardness is greater than or equal to the lower limit of the aforementioned range. Although no particular limitation is placed on the bending strength of the cured product of the present composition, bending strength as specified by JIS K 691 1-1995 "General Testing Methods of Thermosetting Plastics" is
preferably greater than or equal to 5 MPa, further preferably is greater than or equal to 7 MPa, and particularly preferably is greater than or equal to 10 MPa. Mechanical strength of the cured product is good, and the cured product becomes resistant to cracking or the like, when bending strength is greater than or equal to the lower limit of the
aforementioned range.
[0048] Although no particular limitation is placed on reflectance of the cured product of the present invention, total luminous reflectance as measured according to the method stipulated in JIS K 7375: 2008 "Plastics - Determination of Total Luminous Transmittance and Reflectance" is preferably greater than or equal to 80%, and particularly preferably is greater than or equal to 90%. Although no particular limitation is placed on the linear expansion coefficient of the cured product of the present composition, the linear expansion coefficient measured according to the method stipulated in JIS K 7197-1991 "Testing Method for Linear Thermal Expansion Coefficient of Plastics by Thermomechanical Analysis" in the temperature range of 25 to 200°C has an average value that is preferably less than or equal to 200 ppm/°C, and particularly preferably is less than or equal to 150 ppm/°C.
[0049] Although the curing reaction of the present composition progresses at room temperature or due to heating, the composition of the present invention preferably is heated to cause rapid curing. Heating temperature is preferably in a range from 50 to 200°C, and further preferably is in a range from 100 to 150°C. The molding method of the present composition is exemplified by transfer molding, injection molding, and compression molding.
[0050] The cured product of the present composition displays good adhesion toward various types of substrates and is particularly characterized in that adhesion is high toward a metallic lead frame. This adhesion, measured as a die shear strength determined by die shear testing, for example, is preferably greater than or equal to 5 N/mm2, and particularly preferably is greater than or equal to 8 N/mm2.
[0051] The cured product of the present invention will be explained next in detail.
[0052] The cured product of the present invention is obtained by curing the aforementioned composition. The cured product of the present invention preferably has characteristics as described above.
[0053] The optical semiconductor device of the present invention will be explained next in detail.
[0054] The optical semiconductor device of the present invention is characterized by comprising: an optical semiconductor element, a lead frame for electrical connection to the element, and a light reflection material, contacting the lead frame, for reflection of light emitted from the element; wherein the light reflection material is formed by a cured product of the curable silicone composition. This type of optical semiconductor device is exemplified by a light emitting diode (LED). The material of the lead frame in this optical semiconductor device is exemplified by silver, nickel, aluminum, copper, silver- plated copper, or the like. Also, the light reflection material functions as a packaging material of the optical semiconductor device.
[0055] Figure 1 shows a cross-sectional view of a surface mounted type LED, which is one example of the semiconductor device of the present invention. In the LED shown in Figure 1, the optical semiconductor element 1 is die bonded to a lead frame 2 by a die bonding material, and lead frames 2,3 and this optical semiconductor element 1 are further wire bonded to the lead frame 2,3 by bonding wires 4,4'. At the periphery of this optical semiconductor element 1 , with the exception of the upper part thereof, a light reflection material 5 composed of the cured product formed from the aforementioned curable silicone composition is present. The optical semiconductor element 1 within this light reflection material 5 is sealed by the sealing agent 6.
[0056] The method of production of the surface mounted type LED shown in Figure 1 is exemplified by a method including the steps of: (1) forming a light reflection material 5 integrated with the lead frames 2,3 by compression molding or transfer molding of the curable silicone composition, (2) die bonding of the optical semiconductor element 1 on the lead frame 2 using a die bonding material, (3) wire bonding the optical semiconductor element 1 and the lead frames 2,3 using bonding wires 4,4', and (4) sealing the optical semiconductor element 1 using the sealing agent 6.
Examples
[0057] The curable silicone composition, cured product thereof, and optical semiconductor device of the present invention will be explained in further detail using practical examples. Viscosity values are values at 25°C. Moreover, in the formulae, "Me", "Ph", "Vi", and "Ep" respectively represent the methyl group, phenyl group, vinyl group, and 3-glycidoxypropyl group. Characteristics of the cured product were measured in the below described manner.
[0058]
[Hardness]
Hardness of the cured product was measured by a type D durometer as specified in JIS K 7215-1986 "Testing Methods for Durometer Hardness of Plastics."
[0059]
[Bending Strength]
Bending strength of the cured product was measured according to the method specified in JIS K 691 1-1995 "General Testing Methods of Thermosetting Plastics."
[0060]
[Total Luminous Reflectance]
Total luminous reflectance of the cured product was measured by the method specified in JIS K 7375:2008 "Plastics - Determination of Total Luminous Transmittance and Reflectance."
[0061]
[Linear Expansion Coefficient]
Average linear expansion coefficient of the cured product in the temperature range of 25 to 200°C was measured by the method specified in JIS K 7197-1991 "Testing Method for Linear Thermal Expansion Coefficient of Plastics by Thermomechanical Analysis."
[0062]
[Die Shear Strength]
A dispenser was used to coat the curable silicone composition on a 25 mm><75 mm aluminum plate at 5 locations using roughly 100 mg at each location. A 1 mm thick and 6 mm square aluminum chip was placed on the composition, and the assembly was pressure bonded by a 1 kg plate. Thereafter, the assembly was heated for 2 hours at 150°C, and the curable silicone composition was cured. After the assembly was cooled to room temperature, die shear strength was measured using a shear strength measurement apparatus (Bond Tester SS-100KP, manufactured by Seishin Trading Co., Ltd.). Also, die shear strength of silver-plated steel chip toward silver-plated steel plate was measured in the above described manner.
[0063] Moreover, adhesion of the light reflection material to the lead frame of the optical semiconductor device was evaluated in the following manner.
[0064]
[Adhesion to the Lead Frame]
By transfer molding the curable silicone composition, a case of an optical semiconductor device that had a light reflection material molded in an integrated manner to a silver-plated lead frame was produced. The bonded state of the light reflection material of this case to the lead frame was visually observed.
[0065]
[Practical Example 1 ]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSi02/2)o.i5 ( e2Si02/2)o.i5 (Ph2SiO2/2)0.30 (PhSi03/2)0.4o (HO„2)0.04
25 parts by mass of 1 ,3,5, 7-tetramethyl- 1 ,3,5, 7-tetravinylcyclotetrasiloxane represented by the following formula:
(MeViSiO)4
2.0 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)o 2 (MeEpSi02/2)o.25 (PhSiO3/2)0 55 (HO1/2)0 oos
62 parts by mass of l ,l ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2 SiPh2
in an amount that provides 1.0 mole of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3, 5, 7-tetramethyl- 1 ,3, 5, 7-tetravinylcyclotetrasiloxane, and epoxy group-containing polysiloxane, l ,3-divinyl-l ,l ,3,3-tetramethyldisiloxane solution of l,3-divinyl-l ,l ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l -cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 100 parts by mass of titanium oxide having an average primary particle diameter of 0.2 μιη (SX-3103, manufactured by Sakai Chemical Industry Co., Ltd.), 135 parts by mass of crushed quartz powder having an average particle diameter of 5 μηι (CRYSTALITE VX-52, manufactured by Tatsumori Ltd.), and 1 10 parts by mass of spherical silica having 15 μπι average particle diameter (HS-202, manufactured by Nippon Steel & Sumikin Materials Co., Ltd.) were blended to prepare a curable silicone composition that had a viscosity of 38 Pa- s.
[0066] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 76, a bending strength of 8.5 MPa, a total luminous reflectance of 94.5%, and a linear expansion coefficient of 1 18 ppm/°C. Die shear strength against an aluminum plate was 9.8 N/mm2, and die shear strength against a silver-plated steel plate was 8.2 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1. A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
[0067]
[Practical Example 2]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSiO2/2)0.25 (Ph2Si02/2)o.3 (PhSiO3/2)0 45 (H01/2)o.04
37.5 parts by mass of phenyltris(dimethylvinylsiloxy)silane represented by the following formula:
(ViMe2SiO)3SiPh
3.0 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me3SiO,/2)0.2 (Me2ViSiO,/2)o.2 (EpSiO3/2)0.2 (PhSiO3/2)0.4 (HOi/2)0 oi
87 parts by mass of l ,l ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2 SiPh2
in an amount that provides 1.0 mole of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, phenyltris(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, 10 parts by mass of a silicon atom-bonded hydrogen atom- containing methylphenylpolysiloxane represented by the following average unit formula:
(Me2HSi01/2)o.6 (PhSi03/2)0.4
in an amount that provides 0.13 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, phenyltris(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, l ,3-divinyl-l ,l ,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of
the platinum metal in terms of mass units in the present composition, 1-ethynyl-l - cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 80 parts by mass of titanium oxide having an average primary particle diameter of 0.24 μιη (TIPAQUE R-630, manufactured by Ishihara Sangyo Kaisha Ltd.), 65 parts by mass of crushed quartz powder having an average particle diameter of 5 μηι (MIN-U-SIL #5, manufactured by Hayashi Kasei Co., Ltd.), and 135 parts by mass of spherical silica having 30 μιτι average particle diameter (FB-570, manufactured by Denki Kagaku Kogyo K.K.) were blended to prepare a curable silicone composition that had a viscosity of 10.2 Pa- s.
[0068] This composition was heated for 2 hours at 150°C to form a cured product.
This cured product had a type D durometer hardness of 81 , a bending strength of 20 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 96 ppm/°C.
Die shear strength against an aluminum plate was 14 N/mm2, and die shear strength against a silver-plated steel plate was 12 N/mm . A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
[0069]
[Practical Example 3]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSi02/2)o.io (Me2Si02/2)o.15 (PhSiO3/2)0.75 (H01/2)o.oi
37 parts by mass of tetrakis(dimethylvinylsiloxy)silane represented by the following formula:
Si(OSiMe2Vi)4
6.0 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me2ViSiO1/2)0 2 (Ph2Si02/2)o.4 (EpSi03/2)o.4
87 parts by mass of l,l ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 1.1 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned
methylvinylphenylpolysiloxane, tetrakis(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, l ,3-divinyl-l ,l ,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1 ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l- cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 80 parts by mass of titanium oxide having an average primary particle diameter of 0.24 μηι (TIPAQUE R-630, manufactured by Ishihara Sangyo Kaisha Ltd.), 65 parts by mass of crushed quartz powder having an average particle diameter of 5 μηι (MIN-U-SIL #5, manufactured by Hayashi Kasei Co., Ltd.), and 135 parts by mass of spherical silica having 30 μπι average particle diameter (FB-570, manufactured by Denki Kagaku Kogyo K.K.) were blended to prepare a curable silicone composition that had a viscosity of 7.8 Pa- s.
[0070] This composition was heated for 2 hours at 150°C to form a cured product.
This cured product had a type D durometer hardness of 83, a bending strength of 17 MPa, a total luminous reflectance of 93.4%, and a linear expansion coefficient of 89 ppm/°C.
Die shear strength against an aluminum plate was 13 N/mm2, and die shear strength against a silver-plated steel plate was 1 1 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
[0071]
[Practical Example 4]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)0.2o (PhSi03/2)o.80 (H01/2)o.02
8 parts by mass of l,3,5,7-tetramethyl-l,3,5,7-tetravinylcyclotetrasiloxane represented by the following formula:
(MeViSiO)4
20 parts by mass of a dimethylvinylsiloxy-terminated polymethylphenylsiloxane represented by the following formula:
ViMe2SiO(MePhSiO)n 5 SiViMe2
5.0 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)o.2 (Ph2Si02/2)o.4 (EpSiO3/2)0.4
86.5 parts by mass of l ,l ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 0.78 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3,5,7-tetramethyl- 1 ,3,5,7- tetravinylcyclotetrasiloxane, dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group-containing polysiloxane, 7.5 parts by mass of a silicon atom-bonded hydrogen-containing
methylphenylpolysiloxane represented by the following average unit formula:
(Me2HSi01/2)o.6 (PhSi03/2)o.4
in an amount that provides 0.17 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3,5,7-tetramethyl-l ,3,5,7-tetravinylcyclotetrasiloxane, and dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group- containing polysiloxane, 1,3-divinyl- 1 , 1,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1 ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 5 ppm of the platinum metal in terms of mass units in the present composition, 1 -ethynyl-l- cyclohexanol in an amount that provides 250 ppm in terms of mass units in the present composition, 1 10 parts by mass of titanium oxide having an average primary particle diameter of 0.2 μτη (SX-3103, manufactured by Sakai Chemical Industry Co., Ltd.), 100 parts by mass of crushed quartz powder having an average particle diameter of 5 μπι (SILICIC SAB-500, manufactured by Yamamori Tsuchimoto Mining Co., Ltd.), and 180 parts by mass of spherical silica having 15 μηι average particle diameter (HS-202, manufactured by Nippon Steel & Sumikin Materials Co., Ltd.) were blended to prepare a curable silicone composition that had a viscosity of 100 Pa- s.
[0072] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 84, a bending strength of 19 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 76 ppm/°C. Die shear strength against an aluminum plate was 12 N/mm2, and die shear strength against a silver-plated steel plate was 10 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C.
[0073]
[Comparative Example 1 ]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSi02/2)o.15 (Me2SiO2/2)0.15 (Ph2Si02/2)o.3o (PhSiO3/2)0 40 (HO 1/2)0 04
25 parts by mass of 1 ,3, 5, 7-tetramethyl- 1 ,3, 5,7-tetravinylcyclotetrasiloxane represented by the following formula:
(MeViSiO)4
56 parts by mass of 1 ,1 ,5, 5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 0.9 moles of silicon atom-bonded hydrogen atoms in this component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane and l ,3,5,7-tetramethyl-l ,3,5,7- tetravinylcyclotetrasiloxane, l ,3-divinyl-l ,l ,3,3-tetramethyldisiloxane solution of 1 ,3- divinyl-l ,l ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l- cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 100 parts by mass of titanium oxide having an average primary particle diameter of 0.2 μιη (SX-3103, manufactured by Sakai Chemical Industry Co., Ltd.), 135 parts by mass of crushed quartz powder having an average particle diameter of 5 μπι (CRYSTALITE VX-52, manufactured by Tatsumori Ltd.), and 1 10 parts by mass of spherical silica having 15 μη average particle diameter (HS-202, manufactured by Nippon Steel & Sumikin Materials Co., Ltd.) were blended to prepare a curable silicone composition that had a viscosity of 39 Pa- s.
[0074] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 75, a bending strength of 7.0 MPa, a total luminous reflectance of 94.5%, and a linear expansion coefficient of 121 ppm/°C. Die shear strength against an aluminum plate was 3.4 N/mm2, and die shear strength against a silver-plated steel plate was 2.2 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1.
A molded product free of flashing and voids was obtained by integrating molding with a lead frame at 120°C, although peeling was observed at the contacting part of the lead frame and the light reflection material.
[0075]
[Comparative Example 2]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSiO2/2)0 25 (Ph2Si02/2)o.3 (PhSiO3/2)0 45 (HO,/2)0.o4
37.5 parts by mass of phenyltris(dimethylvinylsiloxy)silane represented by the following formula:
(ViMe2SiO)3SiPh
3.0 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me3Si01/2)o.2 (Me2ViSiOI/2)o.2 (EpSi03/2)o.2 (PhSiO3/2)0.4 (MeO1/2)0 3
85 parts by mass of 1 , 1 ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 1.0 mole of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, phenyltris(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, 10 parts by mass of a silicon atom-bonded hydrogen atom- containing methylphenylpolysiloxane represented by the following average unit formula:
(Me2HSi01/2)0.6 (PhSi03/2)o.4
in an amount that there is 0.1 moles of silicon atom-bonded hydrogen atoms in the present component relative to 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, phenyltris(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, l,3-divinyl-l ,l,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1,1 ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l- cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 80 parts by mass of titanium oxide having an average primary particle diameter of 0.24 μπι (TIPAQUE R-630, manufactured by Ishihara Sangyo Kaisha Ltd.), 65 parts by mass of crushed quartz powder having an average particle diameter of 5 μηι
(MIN-U-SIL #5, manufactured by Hayashi Kasei Co., Ltd.), and 135 parts by mass of spherical silica having 30 μηι average particle diameter (FB-570, manufactured by Denki Kagaku Kogyo K.K.) were blended to prepare a curable silicone composition that had a viscosity of 9.8 Pa- s.
[0076] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 80, a bending strength of 14 MPa, a total luminous reflectance of 95.2%, and a linear expansion coefficient of 98 ppm/°C. Die shear strength against an aluminum plate was 7.0 N/mm2, and die shear strength against a silver-plated steel plate was 6.2 N/mm . A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1. A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C. However, after the composition was set aside for 24 hours at room temperature and molding was performed in the same manner, a molded product was obtained that had multiple voids in the light reflection material. Viscosity was checked and found to have risen to an extremely high value, i.e. greater than or equal to 250 Pa- s.
[0077]
[Comparative Example 3]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(MeViSiO2/2)0.10 (Me2SiO2/2)0.15 (PhSi03/2)o.75 (HO1/2)0 0i
37.5 parts by mass of tetrakis(dimethylvinylsiloxy)silane represented by the following formula:
Si(OSiMe2Vi)4
92 parts by mass of 1 ,1 ,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 1.1 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, tetrakis(dimethylvinylsiloxy)silane, and epoxy group- containing polysiloxane, 1 , 3 -divinyl- 1 ,1 ,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1 ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 3.5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l-
cyclohexanol in an amount that provides 200 ppm in terms of mass units in the present composition, 80 parts by mass of titanium oxide having an average primary particle diameter of 0.24 μπι (TIPAQUE R-630, manufactured by Ishihara Sangyo Kaisha Ltd.), 65 parts by mass of crushed quartz powder having an average particle diameter of 5 μιη (ΜΓΝ-U-SIL #5, manufactured by Hayashi Kasei Co., Ltd.), and 135 parts by mass of spherical silica having 30 μπι average particle diameter (FB-570, manufactured by Denki Kagaku Kogyo K.K.) were blended to prepare a curable silicone composition that had a viscosity of 9.4 Pa- s.
[0078] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 82, a bending strength of 16 MPa, a total luminous reflectance of 93.3%, and a linear expansion coefficient of 85 ppm/°C.
Die shear strength against an aluminum plate was 3.3 N/mm , and die shear strength against a silver-plated steel plate was 1.0 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1. A molded product free of flashing and voids was obtained by integrating molding with a lead frame at 120°C, although peeling was observed at the contacting part of the lead frame and the light reflection material.
[0079]
[Comparative Example 4]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(Me2ViSiOI/2)o.2o (PhSi03/2)o.80 (HO1/2)0.02
8 parts by mass of 1 ,3,5, 7-tetramethyl-l , 3,5, 7-tetravinylcyclotetrasiloxane represented by the following formula:
(MeViSiO)4
20 parts by mass of a dimethylvinylsiloxy-terminated polymethylphenylsiloxane represented by the following formula:
ViMe2SiO(MePhSiO),7 5 SiViMe2
0.5 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)0.2 (Me2Si02/2)o.4 (EpSi03/2)o.4,
35 parts by mass of 1 ,1 ,5, 5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 0.77 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3,5,7-tetramethyl-l ,3,5,7- tetravinylcyclotetrasiloxane, dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group-containing polysiloxane, 7.5 parts by mass of a silicon atom-bonded hydrogen-containing
methylphenylpolysiloxane represented by the following average unit formula:
(Me2HSi01/2)o.6 (PhSi03/2)o
in an amount that provides 0.18 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, l ,3,5,7-tetramethyl-l,3,5,7-tetravinylcyclotetrasiloxane, and dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group- containing polysiloxane, l ,3-divinyl-l,l ,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 5 ppm of the platinum metal in terms of mass units in the present composition, 1 -ethynyl- 1 - cyclohexanol in an amount that provides 250 ppm in terms of mass units in the present composition, 1 10 parts by mass of titanium oxide having an average primary particle diameter of 0.2 μπι (SX-3103, manufactured by Sakai Chemical Industry Co., Ltd.), 100 parts by mass of crushed quartz powder having an average particle diameter of 5 μιτι (SILICIC SAB-500, manufactured by Yamamori Tsuchimoto Mining Co., Ltd.), and 250 parts by mass of spherical silica having 15 μηι average particle diameter (HS-202, manufactured by Nippon Steel & Sumikin Materials Co., Ltd.) were blended to prepare a curable silicone composition that had a viscosity of 100 Pa- s.
[0080] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 84, a bending strength of 19 MPa, a total luminous reflectance of 95.3%, and a linear expansion coefficient of 76 ppm/°C.
Die shear strength against an aluminum plate was 5.0 N/mm2, and die shear strength against a silver-plated steel plate was 2.9 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1. A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C. However, peeling was observed at the contacting part between the lead frame and light reflection material.
[0081]
[Comparative Example 5]
100 parts by mass of a methylvinylphenylpolysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)o.20 (PhSi03/2)o.8o (HOi/2)0.o2
8 parts by mass of 1 ,3, 5, 7-tetramethyl-l ,3, 5, 7-tetravinylcyclotetrasiloxane represented by the following formula:
(MeViSiO)4
20 parts by mass of a dimethylvinylsiloxy-terminated polymethylphenylsiloxane represented by the following formula:
ViMe2SiO(MePhSiO)i 7.5 SiViMe2
12 parts by mass of an epoxy group-containing polysiloxane represented by the following average unit formula:
(Me2ViSiO,/2)o.2 (Me2SiO2/2)04 (EpSiO3/2)0.4
38 parts by mass of l,l,5,5-tetramethyl-3,3-diphenyltrisiloxane represented by the following formula:
(HMe2SiO)2SiPh2
in an amount that provides 0.78 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3, 5, 7-tetramethyl-l , 3, 5,7-tetravinylcyclotetrasiloxane, dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group-containing polysiloxane, 8 parts by mass of a silicon atom-bonded hydrogen-containing
methylphenylpolysiloxane represented by the following average unit formula:
(Me2HSi01/2)o.6 (PhSi03/2)o.4
in an amount that provides 0.18 moles of silicon atom-bonded hydrogen atoms in the present component per 1 mole of the total amount of vinyl groups in the aforementioned methylvinylphenylpolysiloxane, 1 ,3, 5, 7-tetramethyl-l ,3, 5, 7-tetravinylcyclotetrasiloxane, and dimethylvinylsiloxy-terminated polymethylphenylsiloxane, and epoxy group- containing polysiloxane, l ,3-divinyl-l,l ,3,3-tetramethyldisiloxane solution of 1 ,3-divinyl- 1 ,1 ,3,3-tetramethyldisiloxane complex of platinum in an amount that provides 5 ppm of the platinum metal in terms of mass units in the present composition, 1-ethynyl-l - cyclohexanol in an amount that provides 250 ppm in terms of mass units in the present composition, 1 10 parts by mass of titanium oxide having an average primary particle diameter of 0.2 μπι (SX-3103, manufactured by Sakai Chemical Industry Co., Ltd.), 100
parts by mass of crushed quartz powder having an average particle diameter of 5 μιη (SILICIC SAB-500, manufactured by Yamamori Tsuchimoto Mining Co., Ltd.), and 250 parts by mass of spherical silica having 15 μιη average particle diameter (HS-202, manufactured by Nippon Steel & Sumikin Materials Co., Ltd.) were blended to prepare a curable silicone composition that had a viscosity of 86 Pa- s.
[0082] This composition was heated for 2 hours at 150°C to form a cured product. This cured product had a type D durometer hardness of 83, a bending strength of 16 MPa, a total luminous reflectance of 95.2%, and a linear expansion coefficient of 78 ppm/°C. Die shear strength against an aluminum plate was 6.5 N/mm2, and die shear strength against a silver-plated steel plate was 4.1 N/mm2. A transfer molding machine and this composition were used to produce the optical semiconductor device shown in Figure 1. A good molded product free of flashing, voids, and peeling was obtained by integrating molding with a lead frame at 120°C. However, peeling was observed at the contacting part between the lead frame and light reflection material.
Industrial Applicability
[0083] The curable silicone composition of the present invention has good formability, and the cured product has good adhesion to the metal used in a lead frame. Thus, the curable silicone composition of the present invention is suitable as a material for a white case material of a light emitting diode.
Description of Symbols
[0084]
optical semiconductor element
2 lead frame
3 lead frame
4, 4' bonding wire
5 light reflection material composed of cured silicone
6 sealing agent
Claims
A curable silicone composition comprising:
(A) 100 parts by mass of an organopolysiloxane represented by the following average unit formula:
(R'3Si01/2)a (R^SiO^b (R1Si03/2)c (Si04/2)d (R201/2)e
wherein R1 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 80 mole% of all R1 are phenyl groups, and 5 to 20 mole% of all R1 are alkenyl groups; R is a hydrogen atom or alkyl group having from 1 to 6 carbons; and "a", "b", "c", "d", and "e" are numbers that respectively satisfy: 0 < a < 0.3, 0 < b < 0.7, 0.3 < c < 0.9, 0 < d < 0.1 , 0 < e < 0.1 , and a + b + c + d = 1 ;
(B) 5 to 50 parts by mass of an organopolysiloxane having 10 or less silicon atoms and not having a glycidoxyalkyl group or epoxycyclohexyl alkyl group, wherein 30 to 60 mole% of all silicon atom-bonded organic groups in this component are alkenyl groups having from 2 to 6 carbons;
(C) 0 to 40 parts by mass of an organopolysiloxane represented by the following general formula:
R3 3SiO(R3 2SiO)m SiR3 3
wherein R3 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, or alkenyl groups having from 2 to 6 carbons, provided that 30 to 70 mole% of all R3 are phenyl groups, and at least one R3 is an alkenyl group; and "m" is an integer in a range from 10 to 100;
(D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein 20 to 70 mole% of all silicon atom-bonded organic groups in this component are phenyl groups, in an amount that provides 0.5 to 2.0 moles of silicon atom-bonded hydrogen atoms in this component per 1 mole of the total amount of alkenyl groups in components (A) to (C) and component (E);
(E) an organopolysiloxane represented by the following average unit formula:
(R4 3SiO,/2)f (R4 2Si02/2)g (R4Si03/2)h (Si04/2)i (R50,/2)j
wherein R4 are the same or different, and are phenyl groups, alkyl groups having from 1 to 6 carbons, alkenyl groups having from 2 to 6 carbons, glycidoxyalkyl groups, or epoxycyclohexyl alkyl groups, provided that 15 to 60 mole% of all R4 are phenyl groups, 3 to 30 mole% of all R4 are alkenyl groups, and 5 to 30 mole% of all R4 are glycidoxyalkyl groups or epoxycyclohexyl alkyl groups; R5 is a hydrogen atom or an alkyl group having from 1 to 6 carbons; and "f ', "g", "h" "i", and "j" are numbers that respectively satisfy: 0 < f < 0.5, 0 < g < 0.9, 0 < h < 0.7, 0 < i < 0.3, 0 < j < 0.02, and f + g +h + i = 1, in an amount of 0.5 to 5.0 parts by mass per 100 parts by mass of the total amount of components (A) to (D);
(F) a hydrosilylation reaction catalyst in an amount sufficient to accelerate a
hydrosilylation reaction between the alkenyl groups in components (A) to (C) and component (E) and the silicon atom-bonded hydrogen atoms in component (D);
(G) a white pigment in an amount of at least 25 parts by mass per 100 parts by mass of the total amount of components (A) to (F); and
(H) an inorganic filler other than a white pigment in an amount of at least 40 parts by mass per 100 parts by mass of the total amount of components (A) to (F), wherein the content of the total amount of components (G) and (H) is not more than 300 parts by mass per 100 parts by mass of the total amount of components (A) to (F).
2. The curable silicone composition according to claim 1 , wherein a viscosity at 25°C is from 5 to 200 Pa- s.
3. The curable silicone composition according to claim 1 , wherein the curable silicone composition cures to form a cured product having a type D durometer hardness greater than or equal to 60, and a bending strength greater than or equal to 5 MPa.
4. The curable silicone composition according to claim 1 , wherein the curable silicone composition cures to form a cured product having a total luminous reflectance greater than or equal to 80%.
5. The curable silicone composition according to claim 1 , wherein the curable silicone composition cures to form a cured product having an average coefficient of linear expansion in a temperature range of 25 to 200°C less than or equal to 200 ppm/°C.
6. A cured product produced by curing the curable silicone composition
according to any one of claims 1 to 5. An optical semiconductor device comprising: an optical semiconductor element, a lead frame for electrical connection to the element, and a light reflection material, contacting the lead frame, for reflection of light emitted from the element; wherein the light reflection material is formed by a cured product of the curable silicone composition according to any one of claims 1 to 5.
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| KR1020147023470A KR20140130135A (en) | 2012-02-02 | 2013-02-01 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| EP13706078.6A EP2809727A1 (en) | 2012-02-02 | 2013-02-01 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| US14/375,977 US9045641B2 (en) | 2012-02-02 | 2013-02-01 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| CN201380010318.1A CN104136545A (en) | 2012-02-02 | 2013-02-01 | Curable silicone composition, cured product thereof, and optical semiconductor device |
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| JP2012021280A JP2013159671A (en) | 2012-02-02 | 2012-02-02 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| JP2012-021280 | 2012-02-02 |
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| US (1) | US9045641B2 (en) |
| EP (1) | EP2809727A1 (en) |
| JP (1) | JP2013159671A (en) |
| KR (1) | KR20140130135A (en) |
| CN (1) | CN104136545A (en) |
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- 2012-02-02 JP JP2012021280A patent/JP2013159671A/en not_active Abandoned
-
2013
- 2013-02-01 CN CN201380010318.1A patent/CN104136545A/en active Pending
- 2013-02-01 EP EP13706078.6A patent/EP2809727A1/en not_active Withdrawn
- 2013-02-01 TW TW102104073A patent/TW201333119A/en unknown
- 2013-02-01 US US14/375,977 patent/US9045641B2/en not_active Expired - Fee Related
- 2013-02-01 WO PCT/JP2013/052965 patent/WO2013115416A1/en active Application Filing
- 2013-02-01 KR KR1020147023470A patent/KR20140130135A/en not_active Application Discontinuation
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| US20090118440A1 (en) * | 2005-06-28 | 2009-05-07 | Koji Nakanishi | Curable Organopolysiloxane Resin Composition And Optical Part Molded Therefrom |
| JP2009021394A (en) | 2007-07-12 | 2009-01-29 | Nitto Denko Corp | Resin composition for mount-packaging for containing optical semiconductor element, and optical semiconductor light emitting device using the same |
| US20090258216A1 (en) * | 2008-04-11 | 2009-10-15 | Shin-Etsu Chemical Co., Ltd. | Silicone adhesive for semiconductor element |
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| "General Testing Methods of Thermosetting Plastics", JIS K 6911-1995 |
| "Plastics - Determination of Total Luminous Transmittance and Reflectance", JIS K 7375:2008 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2878638A4 (en) * | 2012-07-27 | 2015-12-16 | Lg Chemical Ltd | Hardening composition |
| CN106715591A (en) * | 2014-06-03 | 2017-05-24 | 道康宁东丽株式会社 | Curable silicone composition and optical semiconductor device |
| US10005906B2 (en) | 2014-06-03 | 2018-06-26 | Dow Corning Toray Co., Ltd. | Curable silicone composition, and optical semiconductor device |
| US20220064382A1 (en) * | 2020-04-14 | 2022-03-03 | Shin-Etsu Chemical Co., Ltd. | Silylated isocyanurate compound, metal corrosion inhibitor, curable organosilicon resin composition, and semiconductor apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013159671A (en) | 2013-08-19 |
| CN104136545A (en) | 2014-11-05 |
| EP2809727A1 (en) | 2014-12-10 |
| TW201333119A (en) | 2013-08-16 |
| US9045641B2 (en) | 2015-06-02 |
| KR20140130135A (en) | 2014-11-07 |
| US20150001569A1 (en) | 2015-01-01 |
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