WO2013111693A1

WO2013111693A1 - Cooling device and sensible heat exchanger

Info

Publication number: WO2013111693A1
Application number: PCT/JP2013/051053
Authority: WO
Inventors: 秀板橋
Original assignee: 株式会社ニットー冷熱製作所
Priority date: 2012-01-25
Filing date: 2013-01-21
Publication date: 2013-08-01
Also published as: JP5654670B2; DE112013000685T5; JPWO2013111693A1

Abstract

Provided are a cooling device and a sensible heat exchanger with which design restrictions with respect to the heat exchanger can be reduced in comparison with a conventional cooling device and sensible heat exchanger. This cooling device (1) has: a vaporization filter (10) that humidifies and thus lowers the temperature of a passing primary-side airflow; a sensible heat exchanger (13) that exchanges sensible heat between the primary-side airflow that has passed through the vaporization filter (10) and a secondary-side airflow that circulates in a control panel (2); a fan (14) that discharges to the outside the primary-side airflow that has passed through the sensible heat exchanger (13); and a fan (15) that circulates the secondary-side airflow between the control panel (2) and the sensible heat exchanger (13).

Description

Cooling device and sensible heat exchanger

The present invention relates to a cooling device and a sensible heat exchanger.

This application is based on Japanese Patent Application No. 2012-012929 filed in Japan by the applicant on January 25, 2012, the entire contents of which are incorporated into this application by reference.

As a conventional cooling device, water is sprayed on the flow path of the sensible heat exchanger that exchanges sensible heat between the primary airflow and the secondary airflow that circulates the object to be cooled, and the primary airflow passage of the sensible heat exchanger. There is known one having a spraying means for humidifying (see, for example, Patent Document 1).

This cooling device changes the cooling capacity by changing the spray area of the spray means, and suppresses the accumulation of impurities on the sensible heat exchanger by making the spray amount per unit area constant.

JP 2002-206834 A

However, according to the conventional cooling device, since the cooling capacity is changed by changing the spray area, in order to achieve the predetermined cooling capacity, the inlet of the flow path of the primary side airflow of the sensible heat exchanger is changed. As for the area, it is necessary to secure an area corresponding to the predetermined cooling capacity, which limits the design of the sensible heat exchanger.

Therefore, an object of the present invention is to provide a cooling device and a sensible heat exchanger that reduce the restriction on the design of the sensible heat exchanger compared to the conventional cooling device and sensible heat exchanger.

One embodiment of the present invention provides the following cooling device and sensible heat exchanger in order to achieve the above object.

[1] A vaporization filter that humidifies the passing primary airflow to lower the temperature;
The primary side airflow and the secondary side are arranged by overlapping the primary side tube through which the primary side airflow that has passed through the vaporization filter passes and the secondary side tube through which the secondary airflow that circulates the cooling target passes. The sensible heat is exchanged between the air flow and has a pair of convex shapes having a height to maintain the interval between the plate members constituting the primary side tube and the secondary side tube on the plate members facing each other. A sensible heat exchanger,
A fan that discharges the primary airflow that has passed through the sensible heat exchanger to the outside;
A cooling device comprising: a fan that circulates the secondary airflow between the cooling object and the sensible heat exchanger.

[2] The cooling device according to [1], wherein the convex shape of the sensible heat exchanger is a dome shape.

[3] The cooling device according to [1] or [2], wherein the convex shape of the sensible heat exchanger is uniformly formed on a plate material.

[4] The cooling device according to any one of [1] to [3], wherein the outside from which the primary airflow is discharged and the cooling target to be cooled by the secondary airflow are hermetically separated. .

[5] The cooling device according to any one of [1] to [4], wherein the cooling target to be cooled by the secondary airflow is airtight.

[6] The primary-side airflow and the secondary-side tube through which the primary-side airflow that has passed through the vaporization filter and the secondary-side tube through which the secondary-side airflow that circulates the object to be cooled are overlapped and arranged. A sensible heat is exchanged with the secondary side airflow, and a convex shape having a height that holds the interval between the primary side tube and the plate material constituting the secondary side tube is placed on the plate material facing each other. A sensible heat exchanger in pairs.

According to the inventions according to claims 1 and 6, it is possible to reduce restrictions on the design of the sensible heat exchanger as compared with the conventional cooling device and sensible heat exchanger.

According to the invention of claim 2, it is difficult for the plate material to be cracked or torn during the processing of the plate material of the sensible heat exchanger.

According to the invention of claim 3, it is difficult for the end portions of the plate material to become uneven when the plate material of the sensible heat exchanger is processed.

According to the invention of claim 4, the outside from which the primary airflow is discharged and the object to be cooled by the secondary airflow can be hermetically separated.

According to the invention of claim 5, it is possible to cool a cooling target that needs to be airtight.

FIG. 1 is a diagram showing a schematic configuration example of a cooling device according to an embodiment of the present invention. FIG. 2 is a schematic perspective view showing an example of the configuration of the sensible heat exchanger. FIG. 3 is a schematic perspective view showing an example of the configuration of the vaporization filter. FIG. 4 is a schematic perspective view illustrating an example of a flow path of the primary airflow and the secondary airflow of the cooling device. FIG. 5 is a moist air diagram illustrating an example of a state change of the primary airflow and the secondary airflow of the cooling device. FIG. 6A is a schematic perspective view illustrating a configuration example of a sensible heat exchanger. FIG. 6B is a cross-sectional perspective view taken along line AA showing a configuration example of the sensible heat exchanger. FIG. 6C is a cross-sectional view taken along the line AA showing a configuration example of the sensible heat exchanger. FIG. 7A is a perspective view for explaining a step of forming dimples on an aluminum thin plate. FIG. 7B is a perspective view for explaining a step of forming dimples on the aluminum thin plate. FIG. 7C is a perspective view for explaining a step of forming dimples on the aluminum thin plate. FIG. 7D is a perspective view for explaining a step of forming dimples on the aluminum thin plate. FIG. 8 is a cross-sectional view for explaining a process of forming dimples on an aluminum thin plate. FIG. 9 is a perspective view for explaining a manufacturing process of the sensible heat exchanger.

(Configuration of cooling device)
FIG. 1 is a diagram showing a schematic configuration example of a cooling device according to an embodiment of the present invention.

The cooling device 1 is used by being attached to a control panel 2 as an example of a cooling target, and a vaporizing filter 10 that humidifies input air to lower the temperature, and a water supply header 11 that supplies water to the vaporizing filter 10. And a drain pan 12 that receives water droplets of the vaporization filter 10 and a sensible heat exchanger 13 that exchanges only sensible heat without exchanging mutual latent heat (moisture) from two orthogonal air paths.

In addition, the cooling device 1 takes out the air in the control panel 2 and the fan 14 that generates an airflow (hereinafter referred to as “primary airflow”) that passes through the vaporization filter 10 and the sensible heat exchanger 13. And a fan 15 that generates an airflow (hereinafter referred to as “secondary airflow”) that sends air that has passed through the control panel 2 into the control panel 2.

In addition, arrangement | positioning of the

fans

14 and 15 is an example, and it is good also as another arrangement | positioning.

The cooling device 1 has a control unit (not shown), and controls the flow rate of the primary airflow by changing the rotation speed of the fan 14 and the flow rate of the secondary airflow by changing the rotation speed of the fan 15. To do.

The water supply header 11 is supplied with water from an external water source _Wext through an electromagnetic valve 11a that adjusts the amount of water supply according to an external signal.

Further, the drain pan 12 has a float switch 12a that outputs a signal based on the water level of the drain pan 12, and controls the electromagnetic valve 11a by the output signal of the float switch 12a to control the amount of water supplied from the water supply header 11 to the vaporization filter 10. Control.

FIG. 2 is a schematic perspective view showing an example of the configuration of the sensible heat exchanger 13.

Sensible heat exchanger 13 includes a primary cylinder 13a which passes the primary air flow F _1, a structure superimposed alternately so as to be orthogonal to the secondary side cylinder 13b of the secondary-side stream F ₂ passes. Note that the airflow passage direction of the primary side tube 13a and the airflow passage direction of the secondary side tube 13b are not limited to being orthogonal to each other, but may be any different angle.

As an example, the pitch (width) of the primary side cylinder 13a and the secondary side cylinder 13b is 2 mm, the plate thickness is 0.2 mm, and may be formed by bending a plate material, or at both ends between a plurality of plate materials. A square member having a pitch thickness may be provided and bonded. Also, since the plate thickness is thin, the plate material may bend when the air flow is passed through the primary side tube 13a and the secondary side tube 13b. A plurality of them may be provided to suppress deflection. In addition, the convex shape increases the heat transfer area, and also has the purpose of improving the heat exchange efficiency due to the heat transfer enhancement effect caused by overflow.

As an example, the size of the sensible heat exchanger 13 is 320 mm long × 320 mm wide × 160 mm deep. That is, the heat transfer area on both the primary side and the secondary side is 8.09 m ² .

Primary cylinder 13a and secondary cylinder 13b is formed with a good thermal conductivity such as aluminum or copper material, the flow path of the primary side stream F ₁ and the secondary-side air flow F ₂ is hermetically. Since the primary airflow F ₁ and the secondary airflow F ₂ passing through the sensible heat exchanger 13 exchange only sensible heat without replacing latent heat (moisture), the absolute humidity varies depending on the input and output. Without it, only the temperature will change.

Here, the wind speed of the airflow passing through the primary side cylinder 13a and the secondary side cylinder 13b is about 2 m / s, and an average air-side thermal conductivity of 0.05 kW / m ² · k, which is comparable to that of a gas-liquid fin tube, is achieved. Assuming that the effective primary / secondary heat transfer area ratio is 1, the expected heat transmission rate is 1 / (1 / 0.05 + 1 / 0.05) = 25 W / m ² · k.

Therefore, if the average temperature difference between the secondary and primary sides is 5K, for example, the effective heat transfer area necessary to achieve the cooling capacity of 1000 W is 1000 W ÷ 25 W / m ² · k ÷ 5 K = 8 m ² . That is, the above-described heat transfer area of 8.09 m ² satisfies this condition.

FIG. 3 is a schematic perspective view showing an example of the configuration of the vaporization filter 10.

The vaporization filter 10 has a filter medium 100 in which high moisture absorption / release fibers are knitted in a mesh shape so that the primary airflow F ₁ passes through. The filter medium 100 receives water from the water supply header 11 and always maintains a wet state. . Moreover, the vaporization filter 10 has a size of 80 mm in length, 320 mm in width, and 150 mm in depth, for example, and has an input side vent 10a and an output side vent 10b. In addition, the humidifier filter medium of Ueno Kogyo etc. can be used as an example of a high moisture absorption / release fiber.

Here, the input and output of the primary airflow F ₁ passing through the vaporization filter 10 increases the humidity and decreases the temperature, but there is no change in the specific enthalpy of input and output.

(Cooling device operation)
Below, the operation example of the cooling device 1 is demonstrated, referring each figure.

FIG. 4 is a schematic perspective view showing an example of a flow path of the primary airflow and the secondary airflow of the cooling device 1.

First, when the power supply of the cooling device 1 is turned on, a control unit (not shown) controls the

fans

14 and 15 to generate a primary airflow F ₁ and a secondary airflow F ₂ . As an example, the airflows of the primary airflow F ₁ and the secondary airflow F ₂ are 3 m ³ / min.

Further, the control unit controls the electromagnetic valve 11a of the water supply header 11 and starts water supply to the vaporization filter 10. The amount of water supply is adjusted by controlling the solenoid valve 11 a based on the water level of the drain pan 12 by a float switch 12 a provided in the drain pan 12.

First, the primary airflow F ₁ passes through the vaporization filter 10. State S ₁₁ of the input of the primary-side air flow F ₁ of vaporized filter 10, as an example, the ambient temperature 35 ° C., when the relative humidity of 40%, the specific enthalpy is 17kcal / kg.

The primary-side state S ₁₂ at the output of the air flow F ₁ of vaporized filter 10 is determined from the psychrometric chart shown below.

FIG. 5 is a moist air diagram showing an example of changes in the state of the primary side airflow and the secondary side airflow of the cooling device 1.

Since the specific enthalpy 17 kcal / kg does not change in the state S ₁₂ of the primary air flow F ₁ after passing through the vaporization filter 10 with respect to the state S ₁₁ , the temperature S is 26.5 ° C. and the relative humidity is 80% as an example. To.

Here, the amount of water supplied per hour to the vaporization filter 10 necessary to achieve the state S ₁₂ described above, the absolute humidity of the state S ₁₁ is 0.014 kg / kg, the absolute humidity of the state S ₁₂ is 0. 0175kg / kg, since the air volume is 3m ³ / min, the specific volume of the state S ₁₁ is ^{0.892m 3 / kg, (0.0175-0.0140)} kg / kg × 3m 3 / min × 60min ÷ 0. 892 m ³ /kg=0.71 kg / h.

In addition, the amount of water required for water supply is 0.71 kg / h × 24 h × 30 day = 511 l per month. If this is converted into a general water bill, it will be about 150-200 yen.

Next, the primary airflow F ₁ passes through the primary cylinder 13 a of the sensible heat exchanger 13. Further, the secondary air flow F ₂ passes through the secondary cylinder 13 b of the sensible heat exchanger 13.

Since the input of the primary side air flow F ₁ of the sensible heat exchanger 13 is the state S ₁₂ , if the output state S ₁₃ of the primary side air flow F ₁ is a temperature of 45 ° C., the absolute humidity is 0.0175 kg / kg. Therefore, the relative humidity is 28%. Further, the difference in specific enthalpy between the state S ₁₂ and the state S ₁₃ is 17 kcal / kg-21.5 kcal / kg = −4.5 kcal / kg.

The primary airflow F ₁ and the secondary airflow F ₂ each exchange only sensible heat without changing the absolute humidity. This exchange, the difference in specific enthalpy of the state S ₂₂ at the output of the secondary-side air flow F ₂ and the difference in specific enthalpy between the states S ₂₁ of the input of the secondary air flow F ₂ is the state S ₁₂ and state S ₁₃ Is equal to +4.5 kcal / kg.

Therefore, the state S ₂₁ of the secondary-side air flow F ₂ of sensible heat exchanger 13 is a temperature 50 ° C., When the relative humidity of 18%, a state S ₂₂ of the secondary-side air flow F ₂ is temperature 31.5 ° C., relative The humidity is 47%.

By comparing the states S ₂₂ and the state S _21, the cooling capacity of the cooling device 1, the specific enthalpy is 20.6kcal / kg of states S _21, the specific enthalpy of the state S ₂₂ is 16.1kcal / kg, the air volume 3m ³ / min, since the specific volume of the state S ₂₁ is ^{0.934m 3 / kg, (20.6-16.1)} kcal / kg × 3m 3 /min×60min÷0.934m 3 / kg ÷ 0. 86 kcal / W≈1000 W.

Here, the magnitude of the internal load of the control panel 2 is that the average temperature in the control panel 2 is 40.75 ° C., the surface area of the case exterior of the control panel 2 is 5 m ² , and the heat passage rate of the case exterior is 5 W / Assuming m ² · K, 1000 W + (40.75-35) K × 5 m ² × 5 W / m ² · K = 1144 W.

The average temperature in the control panel 2 when the cooling device 1 is not operated is 35 ° C. + 1144 W ÷ 5 m ² ÷ 5 W / m ² · K = 81 ° C.

(Effect of embodiment)
According to the above-described embodiment, since it is not necessary to spray water directly on the sensible heat exchanger 13, the design restriction of the sensible heat exchanger 13 can be reduced, and the primary side tube 13a of the sensible heat exchanger 13 can be reduced. As an example, the pitch of the secondary cylinder 13b can be set to 2 mm, and a sufficient heat transfer area can be ensured. As a result, a sufficient cooling capacity (1000 W) can be achieved.

Further, since only a fan needs to be driven, as an example, the power consumption is about 66 W, and the cooling capacity is 1000 W (OA 35 ° C.-40%, RA 50 ° C.-18%), so that the energy consumption efficiency 15.2 It is. On the other hand, a cooling device that sends air cooled by a compressor-type cooling method into a case such as a control panel and cools the temperature inside the case requires electric power of 670 W to operate the compressor, and has a cooling capacity of 1000 W ( OA 35 ℃ -40%, RA35 ℃ -40%), the energy consumption efficiency is 1.5, which can greatly improve the energy consumption efficiency compared to the energy consumption efficiency 6 which is the best value of home appliances it can. Incidentally, as the temperature of the state S ₂₁ is high, the humidity of S ₁₁ is improved lower the cooling capacity.

Also, the cooling side (primary side) and the cooled side (secondary side) are separated in an airtight manner, that is, the air passing through the cooling side and the air passing through the cooled side are separated without mixing. Therefore, it is not necessary to consider the air cleanliness outside the control panel 2 in order to maintain the air cleanliness within the control panel 2. The secondary side may be separated from other spaces and hermetically sealed. In “airtight separation” and “airtight”, external air other than the separated space is used for the purpose of adjusting the pressure level of the separated space or maintaining the life of animals and plants. Including the case of capturing.

In addition, since a compressor or the like is not required, the weight can be reduced as compared with the conventional cooling device, and the configuration can be simplified. Moreover, rain water etc. can also be used for the quality of the water supplied to the vaporization filter 10, and the cost required for driving can be reduced.

[Example]
In the following, embodiments of the cooling device of the present invention will be specifically described with reference to FIGS. 6A-6C, FIGS. 7A-7D, FIGS.

FIG. 6A is a schematic perspective view showing a configuration example of a sensible heat exchanger.

As shown in FIG. 6A, the sensible heat exchanger 13A of the embodiment is configured by stacking a plurality of aluminum thin plates 131 at predetermined intervals. The sensible heat exchanger 13A has a plurality of dimples 130 in order to maintain the interval.

In addition, it may replace with the aluminum thin plate 131, and may use the resin-made board | plate material with good heat conductivity, or a paper board | substrate.

FIG. 6B is a cross-sectional perspective view taken along line AA showing a configuration example of the sensible heat exchanger 13A.

The aluminum thin plate 131 has a dimple 130t formed in a dome shape in the vertical upward direction of the drawing and a dimple 130b formed in a dome shape in the vertical downward direction. Further, the dimples 130t and the dimples 130b are formed so as to face each other between the adjacent aluminum thin plates 131.

The dimple 130 preferably has a dome shape so that the aluminum thin plate 131 is not cracked or torn when the aluminum thin plate 131 is pressed as described later. Other shapes may be used as long as the problem of cracking and tearing does not occur.

FIG. 6C is a cross-sectional view taken along the line AA showing a configuration example of the sensible heat exchanger 13A.

Aluminum sheet 131 has a thickness T _l, the height of the

dimples

130t and 130b H _l, the interval between the

dimples

130t and 130b is the distance W _l, from end to

dimple

130t or 130b is formed in W _e The Dimensions described above in this _{_{example, H l = 1mm, T l}} = 0.1mm, W l = 20mm, a W _e = 20 mm. T ₁ can be appropriately changed between 0.05 and 0.3 mm.

The flat bar 133 has a thickness T _f and a width W _f and is bonded to the aluminum thin plate 131 by the adhesive 132. As the adhesive 132, a resin adhesive having water resistance and heat resistance can be used. In this embodiment, a double-sided adhesive tape in which a nonwoven fabric is impregnated with a pressure sensitive adhesive is used. Instead of the adhesive 132, the aluminum thin plate and the flat bar 133 may be fixed by soldering or brazing. The amount of the adhesive 132 is adjusted so that the thickness becomes _Tb . In the examples, the dimensions described above are T _f = 2 mm, W _f = 10 mm, and T _b = 0.12 mm.

As described above, when the aluminum thin plates 131 are bonded to the flat bar 133 with the adhesive 132, the distance between the facing

dimples

130t and 130b is C. In the present embodiment, the above-described dimension is C = 0.24 mm. The pitch P of the aluminum thin plate 131 is P = T ₁ + T _b + T _f + T _b = 0.1 + 0.12 + 2 + 0.12 = 2.34 mm. Note that P can be appropriately changed between 1-3 mm. Moreover, all the above-mentioned dimensions can be appropriately changed according to the design.

(Manufacturing process of sensible heat exchanger 13A)
Hereinafter, the manufacturing process of the sensible heat exchanger 13A will be described with reference to FIGS.

7A to 7D are perspective views for explaining a process of forming the dimple 130 on the aluminum thin plate 131. FIG.

First, as shown in FIG. 7A, a lower die 131 ₁ having a hole for forming a dome-shaped dimple 130 having a height of 1 mm is prepared, and an aluminum thin plate 131 to be processed is placed on the lower die 131 _1. Overlapping. Further, overlapping rubber sheets 131 ₂ for cracking prevention during processing on an aluminum thin plate 131, further overlaying press type receiving plate 131 ₃ having a pore diameter 9mm undergoing pressing die 131 ₄ described later.

Next, as shown in FIG 7B, to form a

dimple

130t or 130b by the hole of the push-type receiving plate 131 ₃ presses the push-type 131 ₄ diameter 11 mm.

FIG. 8 is a cross-sectional view for explaining a process of forming the dimple 130 on the aluminum thin plate 131.

Pressing die 131 _4, by being limited to push-in amount by press-type receiving plate 131 _3, deforming only 1mm aluminum sheet 131 in the normal direction of the plate surface. Further, the lower mold 131 ₁ is configured so that the deformed shape of the aluminum thin plate 131 is a dome shape.

Thereafter, the lower die 131 _1, the rubber sheet 131 _2,

dimples

130t or 130b by removing the pressing die receiving plate 131 ₃ and the push-type 131 ₄ are formed.

Next, as shown in FIG. 7C, a lower die 131 ₁ is prepared, and an aluminum thin plate 131 on which _one of the

dimples

130t or 130b is formed is overlaid on the lower die 131 ₁ . Further, overlapping rubber sheets 131 ₅ having a hole at a position corresponding to the

dimples

130t or 130b for cracking prevention during processing on an aluminum thin plate 131, further overlaying press type receiving plate 131 _3.

Next, as shown in FIG. 7D, to form the

dimple

130b or 130t by pressing the push-type 131 ₄ in a hole other than the

dimples

130t or 130b of the push-type receiving plate 131 ₃ holes.

FIG. 9 is a perspective view for explaining a manufacturing process of the sensible heat exchanger 13A.

A plurality of aluminum thin plates 131 on which the

dimples

130t and 130b are formed are stacked such that the

dimples

130t and 130b face each other. Further, the flat bars 133 are disposed between the plurality of aluminum thin plates 131 and at the end portions of the aluminum thin plates 131, and are disposed in directions orthogonal to each other between the adjacent aluminum thin plates 131.

The sensible heat exchanger 13A according to the present embodiment is higher in height than the case where the

dimples

130t and 130b are formed in a dome shape without edges and the

dimples

130t and 130b are opposed to each other so that the dimples are provided only on one plate. Therefore, the deformation amount of the aluminum thin plate 131 can be suppressed during the processing of the

dimples

130t and 130b, and the problem that the aluminum thin plate 131 is cracked or broken during the processing is reduced, and the yield is improved.

Further, since the dimples 130 are uniformly arranged on the aluminum thin plate 131, the aluminum thin plate 131 is not easily distorted, and the end portions of the plurality of aluminum thin plates 131 are less likely to be uneven, and as a result, the plurality of aluminum thin plates 131 are arranged. The process of cutting and aligning the ends of the film becomes unnecessary.

Further, when the primary airflow F ₁ and the secondary airflow F ₂ are passed between the aluminum thin plates 131 corresponding to the primary cylinder 13 a and the secondary cylinder 13 b, the primary airflow F ₁ and the secondary airflow F _{Even when} the wind pressure of ₂ varies, the facing

dimples

130t and 130b suppress the deflection of the aluminum thin plate 131.

Further, since the opposing

dimples

130t and 130b suppress the deflection of the aluminum thin plate 131 as described above, the aluminum thin plate 131 having a thickness of 0.05 to 0.3 mm can be used, and the pitch P between the aluminum thin plates 131 is set to be small. It can be as small as 1-3 mm.

In addition, since the pitch P between the aluminum thin plates 131 is reduced to about 1-3 mm as described above, a large heat transfer area can be secured with a sensible heat exchanger having a small volume.

The primary-side air flow F ₁ passing through the primary-side tube 13a since humidity is close to saturation, it is necessary to process the condensed water, sensible heat exchanger as the primary air flow F ₁ passes vertically The vessel 13 was arranged so that the condensed water dropped in the vertical direction under its own weight. At this time, if the pitch P between the aluminum thin plates 131 is too small, water stays between the aluminum thin plates 131 and is blown out of the sensible heat exchanger 13 by the wind pressure, but when the pitch P is 2 mm. It was confirmed that the condensed water falls vertically due to its own weight.

[Other embodiments]
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the cooling target is not limited to the control panel, but can be applied to a server rack, a storage, a warehouse, a living room, and the like.

The cooling device and the sensible heat exchanger of the present invention are industrially useful because they can reduce the restrictions on the design of the sensible heat exchanger compared to the conventional cooling device and the sensible heat exchanger.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Control panel 10 Evaporation filter 10a Input side vent 10b Output side vent 11 Water supply header 11a Solenoid valve 12 Drain pan 12a Float switch 13 Sensible heat exchanger 13A Sensible heat exchanger 13a Primary side cylinder 13b Secondary side cylinder 14 Fan 15 Fan 100

Filter medium

130, 130b, 130t Dimple 131 Aluminum thin plate 132 Adhesive 133 Flat bar 131 ₁ Lower die 131 ₂ Rubber sheet 131 ₃ Push die receiving plate 131 ₄ Push die 131 ₅ Rubber sheet

Claims

A vaporization filter that humidifies the passing primary air stream and lowers the temperature;
The primary side airflow and the secondary side are arranged by overlapping the primary side tube through which the primary side airflow that has passed through the vaporization filter passes and the secondary side tube through which the secondary airflow that circulates the cooling target passes. The sensible heat is exchanged between the air flow and has a pair of convex shapes having a height to maintain the interval between the plate members constituting the primary side tube and the secondary side tube on the plate members facing each other. A sensible heat exchanger,
A fan that discharges the primary airflow that has passed through the sensible heat exchanger to the outside;
A cooling device comprising: a fan that circulates the secondary airflow between the cooling object and the sensible heat exchanger.
The cooling device according to claim 1, wherein the convex shape of the sensible heat exchanger is a dome shape.
The cooling device according to claim 1 or 2, wherein the convex shape of the sensible heat exchanger is uniformly formed on a plate material.
The cooling device according to any one of claims 1 to 3, wherein the outside from which the primary airflow is discharged and the cooling target to be cooled by the secondary airflow are hermetically separated.
The cooling device according to any one of claims 1 to 4, wherein the cooling target to be cooled by the secondary airflow is airtight.
The primary side airflow and the secondary side airflow are arranged by overlapping the primary side tube through which the primary airflow that has passed through the vaporization filter passes and the secondary side tube through which the secondary airflow that circulates the cooling target passes. Sensible heat is exchanged between the plate member and the plate member constituting the primary side tube and the secondary side tube. Heat exchanger.