WO2013106997A1 - Led fluorescent lamp - Google Patents

Led fluorescent lamp Download PDF

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Publication number
WO2013106997A1
WO2013106997A1 PCT/CN2012/070478 CN2012070478W WO2013106997A1 WO 2013106997 A1 WO2013106997 A1 WO 2013106997A1 CN 2012070478 W CN2012070478 W CN 2012070478W WO 2013106997 A1 WO2013106997 A1 WO 2013106997A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
led
lamp holder
lamp
Prior art date
Application number
PCT/CN2012/070478
Other languages
French (fr)
Chinese (zh)
Inventor
顾毅天
Original Assignee
无锡市爱尔电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 无锡市爱尔电子有限公司 filed Critical 无锡市爱尔电子有限公司
Priority to PCT/CN2012/070478 priority Critical patent/WO2013106997A1/en
Publication of WO2013106997A1 publication Critical patent/WO2013106997A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of LED lamp technology, and more specifically to an LED fluorescent lamp.
  • LED tube in order to avoid the light spot and uniform illumination, all adopt high-atomization PC lampshade, densely-packed low-power LED, 1. 2 meter lamp, most of the lamp beads are more than 200, The light output transmittance is about 85% (transmission rate is the luminous flux output of the lamp after adding the PC lamp cover divided by the output light flux of the PC lamp cover lamp).
  • transmission rate is the luminous flux output of the lamp after adding the PC lamp cover divided by the output light flux of the PC lamp cover lamp.
  • the same material has a transmittance of 95% on a spherical PC lampshade, and the strip PC lampshade has a transmittance of only 85%.
  • the low transmittance is due to the addition of excessive atomizing agent to the PC lampshade.
  • a long strip of PC lampshade causes a lot of light to be reflected.
  • Usually built-in power LED tube due to structural and thermal constraints, can only be 30W or less.
  • the LED beads are mounted on the aluminum substrate using SMT, and then the aluminum substrate is mounted on the LED aluminum tube socket.
  • the aluminum substrate is generally formed by laminating a wiring layer, an insulating layer, and an aluminum substrate, and the insulating layer is an epoxy film or a glass fiber cloth or a polyimide (polyimide), and the circuit layer is formed by etching a copper foil.
  • the domestic patent ZL200710123947. 1 discloses a structure of an LED fluorescent tube. In this structure, the LED is only disposed at both ends of the tube, and an emission film and a diffusion film are disposed on the inner wall of the tube. This design ingeniously avoids the LED. The heat dissipation problem in the arrangement, but the LED is arranged at the two ends in a plurality of rows arranged in the lamp tube, the luminous efficiency is low, and the heat dissipation is not really good, and the brightness is uniform.
  • An object of the present invention is to solve the above-mentioned drawbacks in the prior art, and to provide an LED ⁇ which is coated with a high-reflection film on an LED light-emitting surface (excluding a light-emitting point) or sprayed or printed with a highly reflective material on an LED light-emitting surface thereof. Lights.
  • an LED fluorescent lamp which comprises a lampshade, an LED, a reflective film, a printed circuit board and a lamp socket, wherein the LED fluorescent light emitting surface is covered with a high reflective film in addition to the LED light emitting point.
  • the lamp holder adopts an aluminum heat dissipation lamp holder, and the printed circuit board and the lamp holder are an integrated structure, and the integrated structure of the printed circuit board and the lamp holder comprises a circuit layer, an insulation layer and a lamp holder, and the printed circuit board and the lamp holder are integrated
  • the structure is to directly attach the circuit layer and the insulating layer to the lamp holder, thereby reducing the cost, reducing the thermal resistance and improving the reliability of the product.
  • the insulating layer is made of epoxy film or fiberglass cloth or polyacryl.
  • the amine composition, the circuit layer is an etched copper foil, and the LED wafer is directly fixed, lined, dispensed, and packaged on the integrated structure of the printed circuit board and the lamp holder.
  • the high-reflection film is a commonly used high-reflection film for backlights, such as an E6QV material.
  • This material is a white plastic sheet, usually used in LCD backlights, with a reflectivity of 98% and good heat resistance.
  • the light output transmittance can be as high as 92%, and the transmittance can be increased by more than 7%.
  • the same lamp is tested under the same conditions. Without the PC lamp cover, the luminous flux is 39,801m.
  • the luminous flux of the E6QV reflection film is 33,621m
  • the transmittance is 84.5%
  • the luminous flux after adding the reflective film is 36,731m.
  • the transmittance was 92.3% and the light output transmittance increased by 7.8%.
  • the LED adopts medium and high power LED, and the number of LED lamps of 1.2 meters is less than 100.
  • the top surface of the printed circuit board and the lamp holder integrated structure is a concave structure.
  • the lamp holder is provided with a built-in power supply, and the built-in power supply adopts a 30W to 50W high power built-in ultra-thin power supply.
  • Another LED fluorescent lamp is characterized in that a groove is arranged on the top surface of the lamp holder, and the groove is provided therein.
  • Printed circuit board, the printed circuit board is provided with a plurality of LEDs, and the top surface of the lamp holder and the surface of the printed circuit board are covered with a high-reflection film in addition to the LED light-emitting point.
  • Another type of LED fluorescent lamp is characterized in that a printed circuit board is arranged on the top surface of the lamp holder, and a plurality of LEDs are arranged on the printing circuit board.
  • the top surface of the lamp holder and the surface of the printed circuit board are covered with a high reflective film in addition to the LED light-emitting point.
  • the covered high reflective film structure is replaced by a spray or printed highly reflective material.
  • the light transmittance can be improved by more than 92%, and the light uniformity is improved, and the luminous efficiency of the LED tube is improved.
  • the circuit layer and the insulating layer on the traditional aluminum substrate are directly attached to the aluminum heat-dissipating lamp holder to form a printed circuit board integrated lamp holder structure, which reduces the thermal resistance, saves the cost of the aluminum substrate, and increases the distance between the LED lamp bead and the PC lamp cover.
  • the light uniformity is improved, the cost and unreliable factors of the combination of the conventional aluminum substrate and the heat sink are eliminated, and the heat dissipation effect is better.
  • the number of LED lamps with 1.2 meters is less than 100, the assembly cost is low, the reliability is high, and the use of medium and high power LEDs has significantly improved the heat resistance of fluorescent lamps.
  • the LED power can be as high as 50W and the luminous flux can reach 5000 lumens.
  • One such LED tube can replace 2, 3 traditional 36W fluorescent lamps, which has low cost and remarkable energy saving effect.
  • LED chip can be fixed and lined directly on the printed circuit board integrated lamp holder, which can reduce thermal resistance, save cost and improve reliability.
  • FIG. 4 is a partial structural view of Embodiment 2;
  • FIG. 5 is a cross-sectional structural view of Embodiment 3;
  • FIG. 6 is a partial structural view of Embodiment 3;
  • FIG. 7 is a cross-sectional structural view of Embodiment 4.
  • Printed circuit board and lamp holder are integrated structure 5.
  • the LED fluorescent lamp comprises a PC lamp cover, an LED, a reflective film, a printed circuit board and a lamp holder as an integrated structure, and a plurality of LEDs are arranged on the printed circuit board, and the LED adopts medium and high power.
  • LED the number of LED lamps with 1.2 meters is less than 100.
  • the LED light-emitting surface is covered with a high-reflection film in addition to the LED light-emitting point.
  • the high-reflection film can be made of, for example, an E6QV material, or a highly reflective material can be sprayed or printed on the surface.
  • the integrated structure of the printed circuit board and the lamp holder is formed by applying the pressure sensitive adhesive or the circuit layer directly to the lamp holder.
  • the insulating layer is composed of epoxy film or glass cloth or polyimide, and the circuit layer is an etched copper foil.
  • the lamp holder has a built-in power supply, and the built-in power supply uses high power Rate built-in ultra-thin power supply.
  • the printed wiring board and the socket are of a unitary structure and may be a depressed trapezoidal structure.
  • the top surface of the lamp holder is provided with a groove, and the groove is provided with a printed circuit board.
  • the top surface of the lamp holder is covered with a high-reflection film, and may also be on the surface thereof. Spray or print highly reflective materials.
  • the top surface of the lamp holder is provided with a printed circuit board, and the substrate is provided with a plurality of LEDs, and the top surface of the lamp holder and the surface of the substrate are covered with high LED light-emitting points.
  • the reflective film can also be coated or printed with highly reflective materials on its surface.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

An LED fluorescent lamp comprises a lampshade (1), LEDs (2), a reflective film (3), a printed circuit board (5), and a lamp holder (6). Several LEDs (2) are set on the printed circuit board (5). A light emitting surface of the LEDs (2) are coated with the highly reflective film (3) except for the light emitting points, or a surface of the LEDs (2) are coated and printed with a highly reflective material. An insulting layer and a circuit layer in an aluminum substrate are directly attached on the aluminum heat dissipation lamp holder (6), thereby forming an integrated structure of the printed circuit board (5) and the lamp holder (6). The present invention solves problems of low light transmittance, uneven brightness, and poor heat dissipation existing in a PC lampshade of an LED lamp tube.

Description

LED日光灯  LED fluorescent light
[技术领域] 本发明涉及 LED灯管技术领域， 具体的说是一种 LED日光灯。 [背景技术] 常规 LED灯管， 为了看不到光点以及发光均匀， 都是采取高雾化 PC灯罩， 密布小功率 LED, 1. 2米的灯管， 灯珠大多都在 200颗以上， 光输出透过率都在 85%左右（透过率就是加上 PC灯罩后灯具输出光通量除以不加 PC灯罩灯具输出 光通量）。 这样造成的结果就是， 制作 LED日光灯的成本很高， 且可靠性低， 而 且小功率 LED相比中大功率 LED, 耐热性和寿命都比较低。经过技术分析以及试 验验证发现， 相同材料在球形 PC灯罩上透过率能达 95%， 而条形 PC灯罩透过率 只有 85%，透过率低是因为 PC灯罩加入过多雾化剂和长条形状 PC灯罩造成大量 光线被反射。 通常内置电源 LED灯管， 因结构及散热条件限制， 只能做到 30W以下。 LED 灯珠都是采用 SMT贴装在铝基板上， 然后铝基板再安装在 LED铝管灯座上。 铝 基板一般为线路层、 绝缘层、 铝基材压合而成， 绝缘层为环氧胶片或玻璃纤维 布或 polyimide (聚酰亚胺）， 线路层是铜箔蚀刻线路而成。 如国内专利 ZL200710123947. 1公开了一种 LED日光灯管的结构， 在该结构 中 LED只是设在灯管的两头， 在管体内壁上设有发射膜和扩散膜， 这种设计巧 妙的避免了 LED排列中的散热问题， 但是 LED设在两端比起多个排列在灯管中， 发光效率低下， 无法真正的做到散热良好， 发光明暗均匀。 [Technical Field] The present invention relates to the field of LED lamp technology, and more specifically to an LED fluorescent lamp. [Background Art] Conventional LED tube, in order to avoid the light spot and uniform illumination, all adopt high-atomization PC lampshade, densely-packed low-power LED, 1. 2 meter lamp, most of the lamp beads are more than 200, The light output transmittance is about 85% (transmission rate is the luminous flux output of the lamp after adding the PC lamp cover divided by the output light flux of the PC lamp cover lamp). As a result, the cost of making LED fluorescent lamps is high and the reliability is low, and the low-power LEDs have lower heat resistance and longevity than medium- and high-power LEDs. After technical analysis and experimental verification, the same material has a transmittance of 95% on a spherical PC lampshade, and the strip PC lampshade has a transmittance of only 85%. The low transmittance is due to the addition of excessive atomizing agent to the PC lampshade. A long strip of PC lampshade causes a lot of light to be reflected. Usually built-in power LED tube, due to structural and thermal constraints, can only be 30W or less. The LED beads are mounted on the aluminum substrate using SMT, and then the aluminum substrate is mounted on the LED aluminum tube socket. The aluminum substrate is generally formed by laminating a wiring layer, an insulating layer, and an aluminum substrate, and the insulating layer is an epoxy film or a glass fiber cloth or a polyimide (polyimide), and the circuit layer is formed by etching a copper foil. For example, the domestic patent ZL200710123947. 1 discloses a structure of an LED fluorescent tube. In this structure, the LED is only disposed at both ends of the tube, and an emission film and a diffusion film are disposed on the inner wall of the tube. This design ingeniously avoids the LED. The heat dissipation problem in the arrangement, but the LED is arranged at the two ends in a plurality of rows arranged in the lamp tube, the luminous efficiency is low, and the heat dissipation is not really good, and the brightness is uniform.
替换页 （细则第 26条） [发明内容] 本发明的目的是解决现有技术中上述缺陷， 提供一种在 LED发光面布满高 反射膜 （除去发光点外） 或者在其 LED发光面喷涂或者印刷高反射材料的 LED 曰光灯。 Replacement page (Article 26) SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks in the prior art, and to provide an LED 布 which is coated with a high-reflection film on an LED light-emitting surface (excluding a light-emitting point) or sprayed or printed with a highly reflective material on an LED light-emitting surface thereof. Lights.
为实现上述目的设计一种 LED日光灯， 包括灯罩、 LED、 反射膜、 印刷线路 板、 灯座， 其特征在于所述的 LED日光灯 LED发光面除 LED发光点外布满高反 射膜， 所述的灯座采用铝散热灯座， 所述的印刷线路板和灯座为一体式结构， 印刷线路板和灯座一体结构包括线路层、 绝缘层和灯座， 所述的印刷线路板和 灯座一体结构是将线路层和绝缘层直接贴合在灯座上， 这样就降低了成本， 降 低了热阻， 提高产品的可靠性， 所述的绝缘层由环氧胶片或玻璃纤维布或聚酰 亚胺组成， 线路层是蚀刻过的铜箔， 所述的 LED晶片直接固晶、 打线、 点胶， 封装在印刷线路板和灯座一体结构上。  In order to achieve the above object, an LED fluorescent lamp is designed, which comprises a lampshade, an LED, a reflective film, a printed circuit board and a lamp socket, wherein the LED fluorescent light emitting surface is covered with a high reflective film in addition to the LED light emitting point. The lamp holder adopts an aluminum heat dissipation lamp holder, and the printed circuit board and the lamp holder are an integrated structure, and the integrated structure of the printed circuit board and the lamp holder comprises a circuit layer, an insulation layer and a lamp holder, and the printed circuit board and the lamp holder are integrated The structure is to directly attach the circuit layer and the insulating layer to the lamp holder, thereby reducing the cost, reducing the thermal resistance and improving the reliability of the product. The insulating layer is made of epoxy film or fiberglass cloth or polyacryl. The amine composition, the circuit layer is an etched copper foil, and the LED wafer is directly fixed, lined, dispensed, and packaged on the integrated structure of the printed circuit board and the lamp holder.
所述的高反射膜采用常用的背光用高反射膜， 例如 E6QV材料。 此材料是 一种白色塑胶片， 通常使用于 LCD背光， 反光率达 98% , 耐热性好。 灯管 LED 发光面加上这样的高反射膜， 光输出透过率可高达 92%左右， 提升透过率在 7% 以上。例如同一根灯管在同等条件下测试， 不加 PC灯罩， 光通量为 39801m, 加 上 PC灯罩后， 不加 E6QV反射膜光通量为 33621m,透过率为 84.5% , 加反射膜 后光通量变为 36731m, 透过率为 92.3% , 光输出透过率提升 7.8%。  The high-reflection film is a commonly used high-reflection film for backlights, such as an E6QV material. This material is a white plastic sheet, usually used in LCD backlights, with a reflectivity of 98% and good heat resistance. With the LED light-emitting surface and such a high-reflection film, the light output transmittance can be as high as 92%, and the transmittance can be increased by more than 7%. For example, the same lamp is tested under the same conditions. Without the PC lamp cover, the luminous flux is 39,801m. After adding the PC lampshade, the luminous flux of the E6QV reflection film is 33,621m, the transmittance is 84.5%, and the luminous flux after adding the reflective film is 36,731m. The transmittance was 92.3% and the light output transmittance increased by 7.8%.
所述的 LED采用中大功率 LED, 1.2米的 LED灯管灯珠数量低于 100颗。 所述的印刷线路板和灯座一体结构顶部表面为下凹结构。  The LED adopts medium and high power LED, and the number of LED lamps of 1.2 meters is less than 100. The top surface of the printed circuit board and the lamp holder integrated structure is a concave structure.
所述的灯座内设有内置电源， 所述的内置电源采用 30W至 50W高功率内置 式超薄电源。  The lamp holder is provided with a built-in power supply, and the built-in power supply adopts a 30W to 50W high power built-in ultra-thin power supply.
另外一种 LED 日光灯， 其特征在于灯座顶部表面设有一凹槽， 凹槽内设有 印刷线路板， 印刷线路板上设有若干 LED , 灯座顶部表面和印刷线路板表面除 LED发光点外布满高反射膜。 Another LED fluorescent lamp is characterized in that a groove is arranged on the top surface of the lamp holder, and the groove is provided therein. Printed circuit board, the printed circuit board is provided with a plurality of LEDs, and the top surface of the lamp holder and the surface of the printed circuit board are covered with a high-reflection film in addition to the LED light-emitting point.
另外一种 LED 日光灯， 其特征在于灯座顶部表面设有印刷线路板， 印刷线 路板上设有若干 LED,灯座顶部表面和印刷线路板表面除 LED发光点外布满高反 射膜。  Another type of LED fluorescent lamp is characterized in that a printed circuit board is arranged on the top surface of the lamp holder, and a plurality of LEDs are arranged on the printing circuit board. The top surface of the lamp holder and the surface of the printed circuit board are covered with a high reflective film in addition to the LED light-emitting point.
所述的布满高反射膜结构替换为喷涂或者印刷高反射材料。  The covered high reflective film structure is replaced by a spray or printed highly reflective material.
本发明同现有技术相比具有如下显著优点：  The present invention has the following significant advantages over the prior art:
由于采用了 LED发光表面布满高反射膜或者喷涂印刷高反射材料技术， 可 以提升光透过率高达 92%以上， 并改善了光均匀度， 提高 LED灯管发光效率。  Due to the use of LED light-emitting surface covered with high-reflection film or spray-printed high-reflection material technology, the light transmittance can be improved by more than 92%, and the light uniformity is improved, and the luminous efficiency of the LED tube is improved.
直接将传统铝基板上的线路层和绝缘层贴合在铝散热灯座， 做成印刷线路 板一体式灯座结构， 降低热阻， 节省铝基板成本， 增加了 LED灯珠到 PC灯罩 距离， 提高了光均匀度， 消除传统铝基板与散热器组合的成本及不可靠因素， 散热效果更好。  The circuit layer and the insulating layer on the traditional aluminum substrate are directly attached to the aluminum heat-dissipating lamp holder to form a printed circuit board integrated lamp holder structure, which reduces the thermal resistance, saves the cost of the aluminum substrate, and increases the distance between the LED lamp bead and the PC lamp cover. The light uniformity is improved, the cost and unreliable factors of the combination of the conventional aluminum substrate and the heat sink are eliminated, and the heat dissipation effect is better.
采用中大功率 LED, 1.2米的 LED灯管灯珠数量低于 100颗， 组装成本低 可靠度高， 且中大功率 LED的运用使日光灯的耐热性得到了显著的提高。 LED 功率可以高达 50W， 光通量可达 5000流明， 一支这样的 LED灯管可以取代 2、 3支传统的 36W荧光灯， 成本低且节能效果显著。  With medium and high power LEDs, the number of LED lamps with 1.2 meters is less than 100, the assembly cost is low, the reliability is high, and the use of medium and high power LEDs has significantly improved the heat resistance of fluorescent lamps. The LED power can be as high as 50W and the luminous flux can reach 5000 lumens. One such LED tube can replace 2, 3 traditional 36W fluorescent lamps, which has low cost and remarkable energy saving effect.
可以将 LED晶片固晶打线点胶， 直接封装在印刷线路板一体式灯座上， 可 降低热阻， 节约成本， 提高可靠性。  LED chip can be fixed and lined directly on the printed circuit board integrated lamp holder, which can reduce thermal resistance, save cost and improve reliability.
[附图说明] 图 4是实施例 2的局部结构示意图； 图 5 是实施例 3的剖面结构图； 图 6是实施例 3的局部结构示意图； 图 7 是实施例 4的剖面结构图； 图 8是实施例 4的局部结构示意图； 图中： 1. PC灯罩 2. LED 3.反射膜 4. 印刷线路板和灯座为一体式结构 5.印制线路板 6.灯座 [Description of the Drawings] 4 is a partial structural view of Embodiment 2; FIG. 5 is a cross-sectional structural view of Embodiment 3; FIG. 6 is a partial structural view of Embodiment 3; FIG. 7 is a cross-sectional structural view of Embodiment 4. FIG. Schematic diagram of the partial structure; 1. In the figure: 1. PC lamp cover 2. LED 3. Reflective film 4. Printed circuit board and lamp holder are integrated structure 5. Printed circuit board 6. Lamp holder
[具体实施方式] 结合附图对本发明作进一步说明， 这种装置的制造技术对本专业的人来说 是非常清楚的。 实施例 1： 如图 1、 图 2所示， LED日光灯包括 PC灯罩、 LED、 反射膜、 印刷线路板 和灯座为一体式结构， 印制电路板上设有若干 LED, LED采用中大功率 LED, 1.2米的 LED灯管灯珠数量低于 100颗。 LED发光表面除 LED发光点外布满高 反射膜， 高反射膜可采用例如 E6QV材料制成， 也可以在其表面喷涂或者印刷 高反射材料。 印刷线路板和灯座为一体式结构是将绝缘层和线路层用感压胶或 直接贴合在灯座上而成。 所述的绝缘层由环氧胶片或玻璃纤维布或聚酰亚胺组 成， 线路层是蚀刻过的铜箔。 灯座内设有内置电源， 所述的内置电源采用高功 率内置式超薄电源。 DETAILED DESCRIPTION OF THE INVENTION The present invention will be further described with reference to the accompanying drawings, and the manufacturing technique of such a device will be apparent to those skilled in the art. Embodiment 1: As shown in FIG. 1 and FIG. 2, the LED fluorescent lamp comprises a PC lamp cover, an LED, a reflective film, a printed circuit board and a lamp holder as an integrated structure, and a plurality of LEDs are arranged on the printed circuit board, and the LED adopts medium and high power. LED, the number of LED lamps with 1.2 meters is less than 100. The LED light-emitting surface is covered with a high-reflection film in addition to the LED light-emitting point. The high-reflection film can be made of, for example, an E6QV material, or a highly reflective material can be sprayed or printed on the surface. The integrated structure of the printed circuit board and the lamp holder is formed by applying the pressure sensitive adhesive or the circuit layer directly to the lamp holder. The insulating layer is composed of epoxy film or glass cloth or polyimide, and the circuit layer is an etched copper foil. The lamp holder has a built-in power supply, and the built-in power supply uses high power Rate built-in ultra-thin power supply.
实施例 2:  Example 2:
如图 3、 图 4所示， 与实施例 1不同的是其印刷线路板和灯座为一体式结构 可以是下陷的梯形结构。  As shown in Figs. 3 and 4, unlike the first embodiment, the printed wiring board and the socket are of a unitary structure and may be a depressed trapezoidal structure.
实施例 3：  Example 3:
如图 5、 图 6所示， 与实施例 1不同的是其灯座顶部表面设有一凹槽， 凹槽 内设有印刷线路板， 灯座顶部表面布满高反射膜， 也可以在其表面喷涂或者印 刷高反射材料。  As shown in FIG. 5 and FIG. 6, different from the embodiment 1, the top surface of the lamp holder is provided with a groove, and the groove is provided with a printed circuit board. The top surface of the lamp holder is covered with a high-reflection film, and may also be on the surface thereof. Spray or print highly reflective materials.
实施例 4:  Example 4:
如图 7、 图 8所示， 与实施例 1不同的是灯座顶部表面设有印刷电路板， 所 述基板上设有若干 LED,灯座顶部表面和基板表面除 LED发光点外布满高反射 膜， 也可以在其表面喷涂或者印刷高反射材料。  As shown in FIG. 7 and FIG. 8 , different from the first embodiment, the top surface of the lamp holder is provided with a printed circuit board, and the substrate is provided with a plurality of LEDs, and the top surface of the lamp holder and the surface of the substrate are covered with high LED light-emitting points. The reflective film can also be coated or printed with highly reflective materials on its surface.

Claims

O 2013/106997 权 要 求 书 PCT/CN2012/070478 O 2013/106997 Claim for PCT/CN2012/070478
1. 一种 LED日光灯， 包括灯罩、 LED、 反射膜、 印刷线路板、 灯座， 其特征 在于所述的 LED日光灯 LED发光面除 LED发光点外布满高反射膜， 所述 的灯座采用铝散热灯座， 所述的印刷线路板和灯座为一体式结构， 印刷 线路板和灯座一体结构包括线路层、 绝缘层和灯座， 所述的印刷线路板 和灯座一体结构是将线路层和绝缘层直接贴合在灯座上， 所述的绝缘层 由环氧胶片或玻璃纤维布或聚酰亚胺组成， 线路层是蚀刻过的铜箔， 所 述的 LED晶片直接固晶、 打线、 点胶， 封装在印刷线路板和灯座一体结 构上。 1. An LED fluorescent lamp, comprising a lampshade, an LED, a reflective film, a printed circuit board, and a lamp holder, wherein the LED fluorescent lamp surface is covered with a high-reflection film in addition to the LED light-emitting point, and the lamp holder is used The aluminum heat sink base, the printed circuit board and the lamp holder are a unitary structure, and the printed circuit board and the lamp holder integrated structure comprise a circuit layer, an insulation layer and a lamp holder, and the printed circuit board and the lamp holder integrated structure are The circuit layer and the insulating layer are directly attached to the lamp holder. The insulating layer is composed of epoxy film or glass fiber cloth or polyimide, the circuit layer is an etched copper foil, and the LED chip is directly bonded. , wire bonding, dispensing, packaged on a printed circuit board and lamp holder integrated structure.
2. 如权利要求 1所述的一种 LED 日光灯， 其特征在于所述的高反射膜采用 白色塑胶高反射膜片。  2. An LED fluorescent lamp according to claim 1, wherein said highly reflective film is a white plastic highly reflective film.
3. 如权利要求 1所述的一种 LED日光灯， 其特征在于所述的 LED采用中大 功率 LED, 1.2米的 LED灯管灯珠数量低于 100颗。  3. The LED fluorescent lamp according to claim 1, wherein the LED is a medium-high power LED, and the number of 1.2-meter LED lamp beads is less than 100.
4. 如权利要求 1所述的一种 LED 日光灯， 其特征在于所述的印刷线路板和 灯座一体结构顶部表面为下凹结构。  4. An LED fluorescent lamp according to claim 1, wherein said printed circuit board and said socket top structure have a concave structure.
5. 如权利要求 1所述的一种 LED 日光灯， 其特征在于所述的灯座内设有内 置电源， 所述的内置电源采用 30W至 50W高功率内置式超薄电源。  5. The LED fluorescent lamp according to claim 1, wherein the lamp holder is provided with a built-in power source, and the built-in power source adopts a 30W to 50W high power built-in ultra-thin power source.
6. —种 LED 日光灯， 其特征在于灯座顶部表面设有一凹槽， 凹槽内设有印 刷线路板， 印刷线路板上设有若干 LED , 灯座顶部表面和印刷线路板表面 除 LED发光点外布满高反射膜。  6. A kind of LED fluorescent lamp, characterized in that a top surface of the lamp holder is provided with a groove, a printed circuit board is arranged in the groove, and a plurality of LEDs are arranged on the printed circuit board, and the top surface of the lamp holder and the surface of the printed circuit board except the LED light-emitting point It is covered with a high-reflection film.
7. 一种 LED 日光灯， 其特征在于灯座顶部表面设有印刷线路板， 印刷线路 板上设有若干 LED,灯座顶部表面和印刷线路板表面除 LED发光点外布满 高反射膜。  7. An LED fluorescent lamp, characterized in that a printed circuit board is arranged on a top surface of the lamp holder, and a plurality of LEDs are arranged on the printed circuit board, and the top surface of the lamp holder and the surface of the printed circuit board are covered with a high-reflection film in addition to the LED light-emitting point.
8. 如权利要求 1或 6或 7所述的一种 LED日光灯， 其特征在于所述的布满 高反射膜结构替换为喷涂或者印刷高反射材料 ( 8. An LED fluorescent lamp as claimed in claim 1 or claim 6 or claim 7 wherein said full Highly reflective film structure replaced with sprayed or printed highly reflective material (
PCT/CN2012/070478 2012-01-17 2012-01-17 Led fluorescent lamp WO2013106997A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050122742A1 (en) * 2003-12-02 2005-06-09 Ho Sung T. Led lamp tube
CN201014273Y (en) * 2007-03-28 2008-01-30 王国忠 LED sun lamp integrating package
CN201513762U (en) * 2009-08-28 2010-06-23 许富昌 Energy-efficient LED fluorescent lamp with high luminous efficiency
CN201724005U (en) * 2010-01-05 2011-01-26 艾迪光电（杭州）有限公司 High-efficiency LED illuminating module
CN201964162U (en) * 2010-10-29 2011-09-07 陈波 Luminous novel LED illumination fluorescent tube of hi-lite entire body

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050122742A1 (en) * 2003-12-02 2005-06-09 Ho Sung T. Led lamp tube
CN201014273Y (en) * 2007-03-28 2008-01-30 王国忠 LED sun lamp integrating package
CN201513762U (en) * 2009-08-28 2010-06-23 许富昌 Energy-efficient LED fluorescent lamp with high luminous efficiency
CN201724005U (en) * 2010-01-05 2011-01-26 艾迪光电（杭州）有限公司 High-efficiency LED illuminating module
CN201964162U (en) * 2010-10-29 2011-09-07 陈波 Luminous novel LED illumination fluorescent tube of hi-lite entire body

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