WO2013052403A1 - Décalage de compensation de courbe de température - Google Patents

Décalage de compensation de courbe de température Download PDF

Info

Publication number
WO2013052403A1
WO2013052403A1 PCT/US2012/058251 US2012058251W WO2013052403A1 WO 2013052403 A1 WO2013052403 A1 WO 2013052403A1 US 2012058251 W US2012058251 W US 2012058251W WO 2013052403 A1 WO2013052403 A1 WO 2013052403A1
Authority
WO
WIPO (PCT)
Prior art keywords
duty cycle
leds
lighting device
led
calibrated
Prior art date
Application number
PCT/US2012/058251
Other languages
English (en)
Inventor
Everett BRADFORD
Original Assignee
Cree, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/565,166 external-priority patent/US8890420B2/en
Application filed by Cree, Inc. filed Critical Cree, Inc.
Priority to CN201280059080.7A priority Critical patent/CN103947291A/zh
Publication of WO2013052403A1 publication Critical patent/WO2013052403A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light

Definitions

  • the present disclosure relates to a solid-state lighting device that safely handles over-temperature conditions.
  • Solid-state lighting devices typically employ an array of light emitting diodes (LEDs) as a light source.
  • the LEDs are generally driven with a direct current (DC) or pulse width modulated (PWM) signal.
  • DC direct current
  • PWM pulse width modulated
  • the array of LEDs must be associated with control electronics to at least generate the DC or pulse width modulated signals.
  • solid-state lighting devices are much more efficient than incandescent light bulbs, the LEDs and the associated control electronics can still generate heat during operation sufficient to damage the LEDs or the control electronics if the heat is not managed appropriately. The excessive heat may also lead to fires and other hazardous conditions.
  • heat sinks are often employed to direct heat away from the LEDs and the associated electronics, and thus, maintain the LEDs and the associated electronics within desired operating temperatures.
  • the present disclosure relates to a lighting device that includes a first array of LEDs, a temperature sensor, memory, and a system controller.
  • the memory may include a first duty cycle offset and first curve information that defines a relationship between temperature and a duty cycle for driving at least one LED of the first array of LEDs.
  • the system controller will determine a temperature based on information from the temperature sensor. Based on the temperature, the system controller will determine a first pre-calibrated duty cycle that corresponds to the temperature from the first curve information and then adjust the first pre-calibrated duty cycle with the first duty cycle offset to generate a first calibrated duty cycle. The LED is then driven with a first pulse width modulated signal having the first calibrated duty cycle.
  • the curve information represents pre-calibrated relationships between temperature and the duty cycle of the pulse width modulated signal that is used to drive the LED. While the pre-calibrated duty cycle may not result in the lighting device emitting light at the desired intensity or color temperature, the first duty cycle offset is determined to be the offset to the pre-calibrated duty cycle that is necessary to cause the lighting device to emit light at the desired intensity and color temperature.
  • the memory may be configured with unique curve information for the different array configurations. As such, the particular curve information for the array of LEDs that is mated with the system controller may be selected and used by the system controller.
  • Figure 1 is an isometric view of the front of an exemplary lighting device and power supply according to one embodiment of how the disclosure may be implemented.
  • Figure 2 is an isometric view of the back of the lighting device of Figure 1 .
  • Figure 3A is cross-sectional view of the power supply of Figure 1 .
  • Figure 3B is an exploded isometric view of the lighting device of Figure 1 .
  • Figure 4 is an isometric view of the front of the lighting device of Figure 1 without the lens, diffuser, and reflector.
  • Figure 5 is an isometric view of the front of the lighting device of Figure 1 without the lens and diffuser.
  • Figure 6 is a cross-sectional view of the lighting device of Figure 5.
  • Figure 7 is a cross-sectional view of a first type of LED architecture.
  • Figure 8 is a cross-sectional view of a second type of LED architecture.
  • Figure 9 is a schematic of the exemplary control module electronics according to a first embodiment of the disclosure.
  • Figure 10 is a schematic of the exemplary control module electronics according to a second embodiment of the disclosure.
  • Figure 1 1 is a schematic of the exemplary control module electronics according to a third embodiment of the disclosure.
  • Figure 12 is a schematic of the exemplary control module electronics according to a fourth embodiment of the disclosure.
  • Figure 13 is a graph of the duty cycle for a pulse width modulated signal used to drive a red LED versus temperature for four different LED arrays.
  • the present disclosure relates to a solid-state lighting device with an improved ability to handle over-temperature conditions.
  • the following description first describes an exemplary solid-state lighting device prior to describing how the solid-state lighting device may be configured to handle over-temperature conditions.
  • Figures 1 and 2 a unique lighting device 10 and power supply 12 are illustrated according to one embodiment of the present disclosure. While this particular lighting device 10 is used for reference, those skilled in the art will recognize that virtually any type of solid-state lighting device may benefit from the subject disclosure.
  • the lighting device 10 includes a mounting structure 14 and a lens 16.
  • the illustrated mounting structure 14 is cup-shaped and is capable of acting as a heat spreading device; however, different fixtures may include different mounting structures 14 that may or may not act as heat spreading devices.
  • a light source (not shown), which will be described in detail further below, is mounted inside the mounting structure 14 and oriented such that light is emitted from the mounting structure through the lens 16.
  • the electronics (not shown) that are required to drive the light source are described further below.
  • the power supply 12 is typically coupled to an alternating current (AC) source and used to provide power to the electronics of the lighting device 10. While the lighting device 10 is envisioned to be used predominantly in 4, 5, and 6 inch recessed lighting applications for industrial, commercial, and residential applications, those skilled in the art will recognize that the concepts disclosed herein are applicable to virtually any size and application.
  • the lens 16 may include one or more lenses that are made of clear or transparent materials, such as polycarbonate or acrylic glass or any other suitable material. As discussed further below, the lens 16 may be associated with a diffuser for diffusing the light emanating from the light source and exiting the mounting structure 14 via the lens 16. Further, the lens 16 may also be configured to shape or direct the light exiting the mounting structure 14 via the lens 16 in a desired manner.
  • the power supply 12 and the lighting device 10 may be modular, wherein different sizes, shapes, and types of power supplies 12 may be connected or otherwise coupled to the mounting structure 14 of the lighting device 10 using an appropriate wiring harness. While shown as being physically separate, the power supply 12 and the lighting device 10 may be integrated to form a single structure.
  • the mounting structure 14 is cup-shaped and includes a sidewall 18 that extends between a bottom panel 20 at the rear of the mounting structure 14, and a rim, which may be provided by an annular flange 22 at the front of the mounting structure 14.
  • One or more elongated slots 24 may be formed in the outside surface of the sidewall 18. There are two elongated slots 24, which extend parallel to a central axis of the lighting device 10 from the rear surface of the bottom panel 20 toward, but not completely to, the annular flange 22.
  • the elongated slots 24 may be used for a variety of purposes, such as providing a channel for a grounding wire that is connected to the mounting structure 14 inside the elongated slot 24, connecting additional elements to the lighting device 10, or as described further below, securely attaching the lens 16 to the mounting structure 14.
  • the annular flange 22 may include one or more mounting recesses 26 in which mounting holes are provided.
  • the mounting holes may be used for mounting the lighting device 10 to a mounting structure or for mounting accessories to the lighting device 10.
  • the mounting recesses 26 provide for counter-sinking the heads of bolts, screws, or other attachment means below or into the front surface of the annular flange 22.
  • the power supply 12 includes power supply electronics 28, which are encapsulated by a power supply housing 30 and a power supply cover 32.
  • the power supply housing 30 is cup-shaped and sized sufficiently to receive the power supply electronics 28.
  • the power supply cover 32 provides a cover that extends substantially over the opening of the power supply housing 30. Once the power supply cover 32 is in place, the power supply electronics 28 are contained within the power supply housing 30 and the power supply cover 32.
  • the power supply electronics 28 may be used to provide power and potentially certain control signals necessary to power and control a light source module of the lighting device 10.
  • a light source module 34 is illustrated within an exploded view of the lighting device 10.
  • the light source module 34 may be mounted on the front surface of the bottom panel 20 of the mounting structure 14 as shown, or in an aperture provided in the bottom panel 20 (not shown). Aligned holes or openings in the bottom panel 20 of the mounting structure 14 and the power supply cover 32 are provided to facilitate an electrical connection between the power supply electronics 28 in the power supply 12 and the light source module 34 of the lighting device 10.
  • the light source module 34 employs light emitting diodes (LEDs) and associated control electronics, which are generally mounted to a printed circuit board (PCB).
  • the control electronics are configured to drive the LEDs to generate light at a desired color, intensity and color temperature.
  • the control electronics and LEDs are shown mounted on the front side of the PCB, while the rear side of the PCB is mounted to the front surface of the bottom panel 20 of the mounting structure 14 directly or via a thermally conductive pad (not shown).
  • the thermally conductive pad has a low thermal resistivity, and therefore, efficiently transfers heat that is generated by the light source module 34 to the bottom panel 20 of the mounting structure 14.
  • the illustrated embodiment employs four bolts 44 to attach the PCB of the light source module 34 to the front surface of the bottom panel 20 of the mounting structure 14.
  • the bolts 44 screw into threaded holes provided in the front surface of the bottom panel 20 of the mounting structure 14.
  • the shape of the PCB is shown as being square, but the shape may be rectangular, circular, oval, polygonal, or the like.
  • a reflector cone 36 resides within the interior chamber provided by the mounting structure 14.
  • the reflector cone 36 has a conical wall that extends between a larger front opening and a smaller rear opening.
  • the larger front opening resides at and substantially corresponds to the dimensions of front opening in the mounting structure 14 that corresponds to the front of the interior chamber provided by the mounting structure 14.
  • the smaller rear opening of the reflector cone 36 resides about and substantially corresponds to the size of the LED or array of LEDs provided by the light source module 34.
  • the front surface of the reflector cone 36 is generally, but not necessarily, highly reflective in an effort to increase the overall efficiency and optical performance of the lighting device 10.
  • the reflector cone 36 is formed from metal, paper, a polymer, or a combination thereof.
  • the reflector cone 36 provides a mixing chamber for light emitted from the light source module 34 and may be used to help direct or control how the light exits the mixing chamber through the lens 16.
  • the lens 16 When assembled, the lens 16 is mounted on or over the annular flange 22 and may be used to hold the reflector cone 36 in place within the interior chamber of the mounting structure 14 as well as hold additional lenses and one or more planar diffusers 38 in place.
  • the lens 16 and the diffuser 38 generally correspond in shape and size to the front opening of the mounting structure 14 and are mounted such that the front surface of the lens 16 is substantially flush with the front surface of the annular flange 22.
  • a recess 48 is provided on the interior surface of the sidewall 18 and substantially around the opening of the mounting structure 14.
  • the recess 48 provides a ledge on which the diffuser 38 and the lens 16 rest inside the mounting structure 14.
  • the recess 48 may be sufficiently deep such that the front surface of the lens 16 is flush with the front surface of the annular flange 22.
  • the lens 16 may include tabs 40, which extend rearward from the outer periphery of the lens 16.
  • the tabs 40 may slide into corresponding channels on the interior surface of the sidewall 18 (see Figure 4).
  • the channels are aligned with corresponding elongated slots 24 on the exterior of the sidewall 18.
  • the tabs 40 have threaded holes that align with holes provided in the grooves and elongated slots 24.
  • Bolts 42 may be inserted through the holes in the elongated slots and screwed into the holes provided in the tabs 40 to affix the lens 16 to the mounting structure 14.
  • the diffuser 38 is sandwiched between the lens and the recess 48, and the reflector cone 36 is contained between the diffuser 38 and the light source module 34.
  • a retention ring (not shown) may attach to the flange 22 of the mounting structure 14 and operate to hold the lens 16 and diffuser 38 in place.
  • the degree and type of diffusion provided by the diffuser 38 may vary from one embodiment to another. Further, color, translucency, or opaqueness of the diffuser 38 may vary from one embodiment to another.
  • a separate diffuser 38 such as that illustrated in Figure 3B, is typically formed from a polymer, glass, or thermoplastic, but other materials are viable and will be appreciated by those skilled in the art.
  • the lens 16 is planar and generally corresponds to the shape and size of the diffuser 38 as well as the front opening of the mounting structure 14. As with the diffuser 38, the material, color, translucency, or opaqueness of the lens 16 may vary from one embodiment to another. Further, both the diffuser 38 and the lens 16 may be formed from one or more materials or one or more layers of the same or different materials. While only one diffuser 38 and one lens 16 are depicted, the lighting device 10 may have multiple diffusers 38 or lenses 16.
  • the light source module 34 provides an array of LEDs 50, as illustrated in Figure 4.
  • Figure 4 illustrates a front isometric view of the lighting device 10, with the lens 16, diffuser 38, and reflector cone 36 removed, such that the light source module 34 and the array of LEDs 50 are clearly visible within the mounting structure 14.
  • Figure 5 illustrates a front isometric view of the lighting device 10 with the lens 16 and diffuser 38 removed and the reflector cone 36 in place, such the array of LEDs 50 of the light source module 34 are aligned with the rear opening of the reflector cone 36.
  • the volume inside the reflector cone 36 and bounded by the rear opening of the reflector cone 36 and the lens 16 or diffuser 38 provides a mixing chamber.
  • the array of LEDs 50 of the light source module 34 may include LEDs 50 that emit different colors of light.
  • the array of LEDs 50 may include both red LEDs that emit reddish light and blue- shifted yellow (BSY) LEDs that emit bluish-yellow light or blue-shifted green (BSG) LEDs that emit bluish-green light, wherein the red and bluish-yellow or bluish-green light is mixed to form "white" light at a desired color temperature.
  • BSY blue- shifted yellow
  • BSG blue-shifted green
  • the array of LEDs may include a large number of red LEDs and BSY or BSG LEDs in various ratios. For example, two or three BSY or BSG LEDs may be associated with each red LED, and the total number of LEDs may be 10, 25, 50, 100, or more depending on the application. Figures 4, 5, and 6 only show nine LEDs in the array of LEDs for clarity.
  • reflected light rays emanate from the array of LEDs 50 of the light source module 34 and are reflected off of the front surface of the reflector cone 36 one or more times before exiting the mixing chamber through the diffuser 38 and lens 16. With these reflections, the reflected light rays are effectively mixed with each other and at least some of the non-reflected light rays within the mixing chamber before exiting the mixing chamber through the diffuser 38 and the lens 16.
  • the diffuser 38 functions to diffuse, and as result mix, the non-reflected and reflected light rays as they exit the mixing chamber, wherein the mixing chamber and the diffuser 38 provide the desired mixing of the light emanated from the array of LEDs 50 of the light source module 34 to provide a light beam of a consistent and desired color.
  • the lens 16 and diffuser 38 may be designed and the reflector cone 36 shaped in a manner to control the relative concentration and shape of the resulting light beam that is projected from the lighting device 10.
  • a first lighting device 10 may be designed to provide a concentrated beam for a spotlight, wherein another may be designed to provide a widely dispersed beam for a floodlight.
  • the diffusion provided by the diffuser 38 also prevents the emitted light from looking pixelated and obstructs the ability for a user to see the individual LEDs of the array of LEDs 50.
  • the more traditional approach to diffusion is to provide a diffuser 38 that is separate from the lens 16.
  • the lens 16 is effectively transparent and does not add any intentional diffusion.
  • the intentional diffusion is provided by the diffuser 38.
  • the diffuser 38 and lens 16 are positioned next to one another as shown in Figure 6.
  • the diffusion may be integrated into the lens 16 itself.
  • a traditional package for an LED 52 of the array of LEDs 50 is illustrated in Figure 7.
  • a single LED chip 54 is mounted on a reflective cup 56 using solder or a conductive epoxy, such that ohmic contacts for the cathode (or anode) of the LED chip 54 are electrically coupled to the bottom of the reflective cup 56.
  • the reflective cup 56 is either coupled to or integrally formed with a first lead 58 of the LED 52.
  • One or more bond wires 60 connect ohmic contacts for the anode (or cathode) of the LED chip 54 to a second lead 62.
  • the reflective cup 56 may be filled with an encapsulant material 64 that encapsulates the LED chip 54.
  • the encapsulant material 64 may be clear or contain a wavelength conversion material, such as a phosphor, which is described in greater detail below.
  • the entire assembly is encapsulated in a clear protective resin 66, which may be molded in the shape of a lens to control the light emitted from the LED chip 54.
  • FIG. 8 An alternative package for an LED 52 is illustrated in Figure 8, wherein the LED chip 54 is mounted on a substrate 67.
  • the ohmic contacts for the anode (or cathode) of the LED chip 54 are directly mounted to first contact pads 68 on the surface of the substrate 67.
  • the ohmic contacts for the cathode (or anode) of the LED chip 54 are connected to second contact pads 70, which are also on the surface of the substrate 67, using bond wires 72.
  • the LED chip 54 resides in a cavity of a reflector structure 74, which is formed from a reflective material and functions to reflect light emitted from the LED chip 54 through the opening formed by the reflector structure 74.
  • the cavity formed by the reflector structure 74 may be filled with an encapsulant material 64 that encapsulates the LED chip 54.
  • the encapsulant material 64 may be clear or contain a wavelength conversion material, such as a phosphor. [0047] In either of the embodiments of Figure 7 and 8, if the encapsulant material 64 is clear, the light emitted by the LED chip 54 passes through the encapsulant material 64 and the protective resin 66 without any substantial shift in color. As such, the light emitted from the LED chip 54 is effectively the light emitted from the LED 52.
  • the encapsulant material 64 contains a wavelength conversion material
  • substantially all or a portion of the light emitted by the LED chip 54 in a first wavelength range may be absorbed by the wavelength conversion material, which will responsively emit light in a second wavelength range.
  • the concentration and type of wavelength conversion material will dictate how much of the light emitted by the LED chip 54 is absorbed by the wavelength conversion material as well as the extent of the wavelength conversion. In embodiments where some of the light emitted by the LED chip 54 passes through the wavelength conversion material without being absorbed, the light passing through the wavelength conversion material will mix with the light emitted by the wavelength conversion material. Thus, when a wavelength conversion material is used, the light emitted from the LED 52 is shifted in color from the actual light emitted from the LED chip 54.
  • the array of LEDs 50 may include a group of BSY or BSG LEDs 52 as well as a group of red LEDs 52.
  • BSY LEDs 52 include an LED chip 54 that emits bluish light, and the wavelength conversion material is a yellow phosphor that absorbs the blue light and emits yellowish light. Even if some of the bluish light passes through the phosphor, the resultant mix of light emitted from the overall BSY LED 52 is yellowish light.
  • the yellowish light emitted from a BSY LED 52 has a color point that typically falls above the Black Body Locus (BBL) on the 1931 CIE chromaticity diagram wherein the BBL corresponds to the various color temperatures of white light.
  • BBL Black Body Locus
  • BSG LEDs 52 include an LED chip 54 that emits bluish light; however, the wavelength conversion material is a greenish phosphor that absorbs the blue light and emits greenish light. Even if some of the bluish light passes through the phosphor, the resultant mix of light emitted from the overall BSG LED 52 is greenish light.
  • the greenish light emitted from a BSG LED 52 typically has a color point that also falls above the BBL on the 1931 CIE chromaticity diagram wherein the BBL corresponds to the various color temperatures of white light.
  • the red LEDs 52 generally emit reddish light at a color point on the opposite side of the BBL (or below) as the yellowish or greenish light of the BSY or BSG LEDs 52.
  • the reddish light from the red LEDs 52 mixes with the yellowish or greenish light emitted from the BSY or BSG LEDs 52 to generate white light that has a desired color temperature and falls within a desired proximity of the BBL.
  • the red LEDs 52 pulls the yellowish or greenish light from the BSY or BSG LEDs 52 to a desired color point on or near the BBL.
  • the red LEDs 52 may have LED chips 54 that natively emit reddish light wherein no wavelength conversion material is employed.
  • the LED chips 54 may be associated with a wavelength conversion material, wherein the resultant light emitted from the wavelength conversion material and any light that is emitted from the LED chips 54 without being absorbed by the wavelength conversion material mixes to form the desired reddish light.
  • the blue LED chip 54 used to form either the BSY or BSG LEDs 52 may be formed from a gallium nitride (GaN), indium gallium nitride (InGaN), silicon carbide (SiC), zinc selenide (ZnSe), or like material system.
  • the red LED chip 54 may be formed from an aluminum indium gallium nitride (AllnGaP), gallium phosphide (GaP), aluminum gallium arsenide (AIGaAs), or like material system.
  • Exemplary yellow phosphors include cerium-doped yttrium aluminum garnet (YAG:Ce), yellow BOSE (Ba, O, Sr, Si, Eu) phosphors, and the like.
  • Exemplary green phosphors include green BOSE phosphors, Lutetium aluminum garnet (LuAg), cerium doped LuAg (LuAg:Ce), Maui M535 from Lightscape Materials, Inc. of 201 Washington Road, Princeton, NJ 08540, and the like.
  • the above LED architectures, phosphors, and material systems are merely exemplary and are not intended to provide an exhaustive listing of architectures, phosphors, and materials systems that are applicable to the concepts disclosed herein.
  • the array of LEDs 50 on the light source module 34 may include a mixture of red LEDs 52 and either BSY or BSG LEDs 52.
  • the light source module 34 may also include a variety of control electronics, such as a system controller 76, a communication port 78, a temperature sensor 80, and a regulated direct current (DC) supply 82.
  • the off-board power supply 12 receives a variable voltage AC signal, perhaps from a triac in a light switch (not shown) with dimming control, and provides a DC drive current to port P1 of the light source module 34.
  • the drive current is provided at a level sufficient to drive the array of LEDs 50 at an intensity level generally commensurate to the desired lumen output of the array of LEDs 50 based on the level of dimming sensed from the AC signal received from the triac.
  • the drive current may be variable and generally corresponds to the level of dimming set at the light switch.
  • One or more capacitors C1 may be provided at the output of the power supply 12, either internally or externally as shown, in an effort to stabilize the voltage at which the drive current is provided to the array of LEDs 50.
  • the drive current provided by the power supply 12 may also be used to power the system controller 76.
  • the voltage provided at port P1 is regulated down by the regulated DC supply 82 to a relatively fixed voltage to power the system controller 76.
  • the drive current provided at port P1 is generally fixed at a maximum value for a maximum intensity level and at corresponding lesser values for any given level of dimming.
  • the array of LEDs 50 includes a string of series connected LEDs D1 -D7 wherein the string is coupled between port P1 and a switch S1 , which is coupled to ground.
  • the system controller 76 must close switch S1 , which may be a transistor, such as a bipolar junction transistor (BJT) or field effect transistor (FET).
  • switch S1 is an N-channel FET where the drain is coupled to the string of series connected LEDs D1 -D7, the source is coupled to ground, and the gate is coupled to a control output of the system controller 76 and a pull down resistor R1 , which is coupled to ground.
  • the array of LEDs 50 may be of different types.
  • the string of series connected LEDs D1 -D7 may be of different types.
  • LEDs D1 -D7 are illustrated, but any number of LEDs may be employed.
  • LEDs D1 , D2, D5 and D6 are of a BSY type and emit yellowish light
  • LEDs D3, D4, and D7 are of a red type (R) and emit reddish light.
  • R red type
  • the reddish and yellowish light emitted from the various LEDs D1 -D7 mix together to form "white" light at a desired color temperature.
  • Switches S2 and S3 may be provided to effectively tune the color temperature, the intensity, or both the color temperature and intensity of the combined light emitted from the string of series connected LEDs D1 -D7. As described below, the system controller 76 can use switch S2 to effectively control the amount of reddish light emitted the array of LEDs 50 and can use switch S3 to effectively control the amount of yellowish light emitted by the array of LEDs 50.
  • Switch S2 is coupled across the red type LED D7 and controlled by the system controller 76.
  • Switch S3 is coupled across the BSY type LED D5 and also controlled by the system controller 76. Closing the switches S2 and S3 effectively provides an electrical short across the respective LEDs D7 and D5, respectively, and thus, redirects the drive current around the LEDs D7 and D5 through the switches S2 and S3.
  • the system controller 76 may drive the switches S2 and S3 with individual pulse width modulated (PWM) signals, each of which is effectively a series of pulses that rapidly switches the red type LED D7 and the BSY type LED D5 on and off while drive current is being provided to the string of series connected LEDs D1 -D7.
  • PWM pulse width modulated
  • the respective duty cycles for the PWM signals control how long the red type LED D7 and BSY type LED D5 are on and off for a given cycle.
  • the duty cycle for the PWM signal that drives switch S2 controls the average intensity of reddish light emitted from the red type LED D7, and as such, controls the amount of reddish light the red type LED D7 adds to the overall light emitted from the other LEDs D1 -D6.
  • the duty cycle for the PWM signal that drives switch S3 controls the average intensity of the yellowish light emitted from the BSY type LED D5, and as such, controls the amount of yellowish light the BSY type LED D5 adds to the overall light emitted from the other LEDs D1 -D4 and D6-D7.
  • the system controller 76 can control switches S2 and S3 to individually effectively vary the intensity of the reddish light emitted from LED D7 and the yellowish light emitted from LED D5, and thus the overall intensity and color temperature of the light emitted from the LEDs D1 -D7 as a whole.
  • the switches S1 and S2 may be transistors, such as BJTs or FETs.
  • switch S2 is an N-channel FET where the drain is coupled to the anode of LED D7, the source is coupled to the cathode of LED D7, and the gate is coupled to a control output of the system controller 76.
  • Switch S3 is an P- channel FET where the drain is coupled to the anode of LED D5, the source is coupled to the cathode of LED D5, and the gate is coupled to a control output of the system controller 76.
  • the system controller 76 may power up such that switch S1 is closed. With switch S1 closed, the drive current provided by the power supply 12 is delivered through LEDs D1 -D7, if the system controller 76 is configured to power up with switches S2 and S3 open. If the system controller is configured to power up with one or both of switches S2 and S3 closed, the drive current will bypass the corresponding one or both of the LEDs D7 and D5.
  • the system controller 76 After powering up, the system controller 76 will begin sending the respective PWM signals to switches S2 and S3 to control the amount of reddish and yellowish light emitted from the respective LEDs D7 and D5, and thus, set the overall intensity, color temperature, and the like of the overall light emitted from the lighting device 10.
  • the system controller 76 will monitor the temperature of, at, or proximate the light source module 34 as provided by the temperature sensor 80 in an effort to detect an over-temperature condition of the array of LEDs 50.
  • the temperature sensor 80 may be separate from or integrated with the system controller 76 and may include a resistive, inductive, capacitive, or semiconductive element that varies with temperature.
  • An over-temperature condition may correspond to the monitored temperature exceeding a maximum threshold, the monitored temperature exceeding a nominal threshold for a given period of time, or the like.
  • an over-temperature condition may be triggered any time the monitored temperature exceeds 160° Fahrenheit or when the monitored temperature exceeds 140° Fahrenheit for more than ten (10) minutes.
  • the monitored temperature may be integrated over time and compared to a given threshold.
  • a shutdown procedure is invoked.
  • the shutdown procedure entails opening switch S1 to stop the flow of the drive current through the LEDs D1 - D7. Since the LEDs D1 - D7 are a primary source of heat generation when the drive current is applied, stopping the flow of drive current through the LEDs D1 - D7 significantly reduces the generation of heat by the light source module 34.
  • the power supply 12 may not recognize the over-temperature condition on the light source module 34 and that the drive current is no longer being supplied to the LEDs D1 -D7, the power supply 12 will continue to try to supply power to the light source module 34. Since the drive current for the LEDs D1 - D7 is no longer passed through LEDs D1 -D7, the voltage at the output (node P1 ) of the power supply may raise significantly given the reduced load. Thus, even if the over-temperature condition abates, the higher voltage provided by the output of the power supply 12 at port P1 may exceed what is safe to apply to the string of series connected LEDs D1 - D7.
  • applying the excessive voltage to the string of series connected LEDs D1 - D7 by closing switch S1 may result in delivering an excessive current surge to the LEDs D1 - D7.
  • the excessive current may damage the LEDs D1 - D7 to an extent that causes immediate failure or will lead to failure of the LEDs D1 - D7 after repeated over-temperature conditions are experienced.
  • the first protection scenario involves having the system controller 76 enter a state that prohibits switch S1 from being closed until a system reset occurs.
  • a system reset will typically involve removing the power that is supplied to the power supply 12, such as when a light switch is turned off.
  • the power supply itself will stop providing the power to the port P1 .
  • the capacitor C1 along with any output capacitance of the power supply 12 will have a charge stored at the excessive voltage levels. This charge will be drained by the electronics of the light source module 34, and in particular, by the system controller 76.
  • the voltage supplied to the DC supply 82 will decrease until the minimum operating voltage of the system controller 76 can no longer be provided by the DC supply 82 to the system controller 76. At this point, the system controller 76 will stop functioning. The electronics of the system controller 76 will ensure that the switch S1 stays off until the system controller 76 can no longer function due to the decaying operating voltage.
  • the power supply 12 When power is again supplied to the power supply 12, the power supply 12 will again provide power to the light source module 34. As power is applied, the system controller 76 will power up in a state where switch S1 is closed. With switch S1 closed, the drive current will flow though the string of series connected LEDs D1 -D7 before the voltage on port P1 reaches excessive levels. In short, the power supply 12 is presented an initial load when power is applied, and by presenting the initial load, the power supply 12 is prevented from supplying excessive loads to the array of LEDs 50.
  • the system controller 76 Upon powering up, the system controller 76 will check to see if there is an over-temperature condition. If an over-temperature condition exists, the system controller 76 will again open switch S1 to effectively turn off the array of LEDs 50. Again, the system controller 76 will keep switch S1 open until a system reset occurs. In essence, the system controller 76 forces a user to shut off power to the lighting device 10 and to leave it off for a sufficient amount of time to drain the capacitive charge stored in the power supply 12 to at least a safe level before allowing the drive current to be presented to the array of LEDs 50.
  • the system controller 76 is also configured to monitor the voltage at port P1 and take action to open switch S1 in the case of an excessive-voltage condition at port P1 or prevent the closing of switch S1 if there is an excessive-voltage condition at port P1 .
  • the light source module 34 is configured with a voltage divider circuit formed by resistors R2 and R3. Resistors R2 and R3 are connected in series between port P1 and ground. The node where resistors R2 and R3 are connected provides the voltage divider output and is coupled to the system controller 76.
  • the voltage divider output is directly proportional to the voltage at port P1 , and as such, the system controller 76 can monitor the voltage divider output and determine the actual or relative voltage at the port P1 . If the voltage of the voltage divider output exceeds a defined threshold, an excessive voltage condition is detected by the system controller 76, which will either open the switch S1 , if the switch S1 is closed, or prevent switch S1 from being closed while the excessive voltage condition is present.
  • the light source module 34 is illustrated as having a resistor R4 and switch S4, which are connected in series between port P1 and ground. If an excessive voltage condition is present because switch S1 is open and the voltage at port P1 has floated to an excessive level because there is no drive current being provided to the LEDs D1 -D7, the system controller 76 can close switch S4 to present resistor R4 as a load to the power supply 12. Resistor R4 may have a resistance approximating the resistive load of the string of series connected LEDs D1 -D7, and thus draw a drive current that is analogous to that drawn by the LEDs D1 -D7 from the power supply 12.
  • Switch S3 is coupled across LED D5 in the first string and D5' in the second string such that the system controller 76 can control the amount of yellowish light emitted by LEDs D5 and D5'.
  • Using additional strings of LEDs generally correlates to greater lumen output of the array of LEDs 50.
  • each string could be separately coupled to ground using different switches S1 and S1 ', as illustrated in Figure 12.
  • the system controller 76 may open and close both of the switches S1 and S1 ' at the same time.
  • system controller 76 may simply set a bit or store sufficient information in a non-volatile portion of memory 84 to indicate that at least one over-temperature condition has occurred. Typically, the system controller 76 will immediately store the over-temperature information upon detecting an over-temperature condition before entering one of the above- described protection modes.
  • the array of LEDs 50 may have different LED configurations depending on the required lumen output, color temperature, and the like for the lighting device 10. As such, the different arrays of LEDs 50 may have different types, numbers, or configurations of LEDs.
  • each array of LEDs 50 will have some red type LEDs and some BSY type LEDs and that the system controller 76 will be able to vary the duty cycle of the PWM signal used to drive at least one of the red type LEDs, such as LED D7, and one of the BSY type LEDs, such as LED D5, as illustrated in Figure 9.
  • the lighting device 10 may be powered up and allowed to warm up for calibration.
  • the system controller 76 will determine the operating temperature and then determine the pre-calibrated duty cycle for the red type LED D7 based on the operating temperature in light of the selected curve information stored in memory 84.
  • the system controller 76 will also determine the pre-calibrated BSY duty cycle associated with the identified curve, and then begin driving switch S2 with the pre-calibrated duty cycle for the red type LED D7 and switch S3 with the selected pre-calibrated BSY duty cycle.
  • the lighting device 10 is providing pre-calibrated light, which may not meet the manufacture's specifications for lumens, color temperature, and the like.
  • the pre-calibrated light is analyzed and a determination is made as to whether the pre-calibrated light meets the manufacture's specifications. If the specifications are not met, offsets for one or both of the pre-calibrated red duty cycle and the pre-calibrated BSY duty cycle are calculated. The offsets in the duty cycles are intended to be sufficient to ensure that the light output from the lighting device 10 meets the manufacture's specifications. The offsets are then presented to the system controller 76 of the lighting device 10 via the
  • the offset for the BSY duty cycle is added to the pre- calibrated BSY duty cycle associated with the identified curve to provide a calibrated BSY duty cycle.
  • the system controller 76 will then begin driving switch S3 with the calibrated BSY duty cycle.
  • the lighting device 10 is providing calibrated light, which should meet the manufacture's specifications for lumens, color temperature, and the like.
  • curves may also be developed and used for the BSY duty cycles as a function of temperature.
  • curves for both red and BSY type LEDs may be stored in memory 84 wherein offsets for one or both of the selected red and BSY duty cycles may be determined during calibration, sent to the lighting device 10, and applied during operation of the lighting device 10.
  • the concepts provided herein apply to all types of arrays of LEDs 50 that employ different types of LEDs, and are not limited to arrays of LEDs 50 with red or BSY type LEDs.

Landscapes

  • Circuit Arrangement For Electric Light Sources In General (AREA)

Abstract

L'invention porte sur un dispositif d'éclairage, lequel dispositif comprend un premier groupement de diodes électroluminescentes, un capteur de température, une mémoire et un dispositif de commande de système. La mémoire peut comprendre un premier décalage de rapport cyclique et une première information de courbe qui définit une relation entre la température et un rapport cyclique pour commander au moins une diode électroluminescente du premier groupement de diodes électroluminescentes. Le dispositif de commande du système déterminera une température sur la base d'une information à partir du capteur de température. Sur la base de la température, le dispositif de commande du système déterminera un premier rapport cyclique pré-calibré qui correspond à la température à partir de la première information de courbe, puis ajustera le premier rapport cyclique pré-calibré avec le premier décalage de rapport cyclique afin de générer un premier rapport cyclique calibré. La diode électroluminescente est ensuite commandée avec un premier signal modulé en largeur d'impulsion ayant le premier rapport cyclique calibré.
PCT/US2012/058251 2011-10-02 2012-10-01 Décalage de compensation de courbe de température WO2013052403A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280059080.7A CN103947291A (zh) 2011-10-02 2012-10-01 温度曲线补偿偏移

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161542276P 2011-10-02 2011-10-02
US61/542,276 2011-10-02
US13/565,166 2012-08-02
US13/565,166 US8890420B2 (en) 2011-10-02 2012-08-02 Temperature curve compensation offset

Publications (1)

Publication Number Publication Date
WO2013052403A1 true WO2013052403A1 (fr) 2013-04-11

Family

ID=48044100

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/058251 WO2013052403A1 (fr) 2011-10-02 2012-10-01 Décalage de compensation de courbe de température

Country Status (2)

Country Link
CN (1) CN103947291A (fr)
WO (1) WO2013052403A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8970131B2 (en) 2013-02-15 2015-03-03 Cree, Inc. Solid state lighting apparatuses and related methods
US9414454B2 (en) 2013-02-15 2016-08-09 Cree, Inc. Solid state lighting apparatuses and related methods

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015211454A1 (de) * 2015-06-22 2016-12-22 Tridonic Gmbh & Co Kg Sensorspeisung mit einem Konstantstrom-Konverter für Leuchtmittel
CN105578651A (zh) * 2016-01-18 2016-05-11 上海康耐司信号设备有限公司 一种led工作灯温度保护电路

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002047438A2 (fr) * 2000-12-07 2002-06-13 Koninklijke Philips Electronics N.V. Led luminary system
US20050082553A1 (en) * 2003-10-21 2005-04-21 Isao Yamamoto Light emission control apparatus and light emission control method with temperature-sensitive driving current control
WO2008056321A1 (fr) * 2006-11-10 2008-05-15 Koninklijke Philips Electronics N.V. Méthode et pilote déterminant les valeurs de commande d'un éclairage
WO2008139369A1 (fr) * 2007-05-10 2008-11-20 Philips Intellectual Property & Standards Gmbh Dispositif d'éclairage avec une pluralité d'émetteurs de lumière
US20090020684A1 (en) * 2007-07-16 2009-01-22 Cheng-Chung Shih Illumination apparatus and optical radiation control method thereof
US20100134020A1 (en) * 2008-12-02 2010-06-03 Sheng-Kai Peng Led lighting control integrated circuit having embedded programmable nonvolatile memory

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002047438A2 (fr) * 2000-12-07 2002-06-13 Koninklijke Philips Electronics N.V. Led luminary system
US20050082553A1 (en) * 2003-10-21 2005-04-21 Isao Yamamoto Light emission control apparatus and light emission control method with temperature-sensitive driving current control
WO2008056321A1 (fr) * 2006-11-10 2008-05-15 Koninklijke Philips Electronics N.V. Méthode et pilote déterminant les valeurs de commande d'un éclairage
WO2008139369A1 (fr) * 2007-05-10 2008-11-20 Philips Intellectual Property & Standards Gmbh Dispositif d'éclairage avec une pluralité d'émetteurs de lumière
US20090020684A1 (en) * 2007-07-16 2009-01-22 Cheng-Chung Shih Illumination apparatus and optical radiation control method thereof
US20100134020A1 (en) * 2008-12-02 2010-06-03 Sheng-Kai Peng Led lighting control integrated circuit having embedded programmable nonvolatile memory

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8970131B2 (en) 2013-02-15 2015-03-03 Cree, Inc. Solid state lighting apparatuses and related methods
US9414454B2 (en) 2013-02-15 2016-08-09 Cree, Inc. Solid state lighting apparatuses and related methods

Also Published As

Publication number Publication date
CN103947291A (zh) 2014-07-23

Similar Documents

Publication Publication Date Title
US8890420B2 (en) Temperature curve compensation offset
US9591707B2 (en) Solid state lighting device and method for operating the same
US9705594B2 (en) Optical communication for solid-state light sources
US8829800B2 (en) Lighting component with independent DC-DC converters
US9967928B2 (en) Replaceable lighting fixture components
US9066405B2 (en) Lighting device with variable color rendering based on ambient light
US10098197B2 (en) Lighting devices with individually compensating multi-color clusters
US8919975B2 (en) Lighting device providing improved color rendering
US10161612B2 (en) Ambient light monitoring in a lighting fixture
US9288877B2 (en) Sensor module for a lighting fixture
US20140268737A1 (en) Direct view optical arrangement
US20140001972A1 (en) Modular lighting control
WO2013052403A1 (fr) Décalage de compensation de courbe de température
US20150138784A1 (en) Sensor module for a lighting fixture
US9022616B2 (en) Lens assembly for a solid-state lighting fixture
US9022599B2 (en) Multi-point to single point optic
US9549443B2 (en) Detection of linear and PWM dimming in a solid state lighting device
WO2013052401A1 (fr) Gestion de surchauffe de dispositif d'éclairage
WO2013101320A1 (fr) Gestion de surtension d'un dispositif d'éclairage
WO2009138894A1 (fr) Source de lumière à agrégats électroluminescents

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12781514

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12781514

Country of ref document: EP

Kind code of ref document: A1