WO2013038802A1 - Dispositif d'émission de lumière par la surface et dispositif d'affichage à cristaux liquides doté de celui-ci - Google Patents

Dispositif d'émission de lumière par la surface et dispositif d'affichage à cristaux liquides doté de celui-ci Download PDF

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Publication number
WO2013038802A1
WO2013038802A1 PCT/JP2012/068158 JP2012068158W WO2013038802A1 WO 2013038802 A1 WO2013038802 A1 WO 2013038802A1 JP 2012068158 W JP2012068158 W JP 2012068158W WO 2013038802 A1 WO2013038802 A1 WO 2013038802A1
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WIPO (PCT)
Prior art keywords
region
light emitting
mounting portion
light
substrate mounting
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Application number
PCT/JP2012/068158
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English (en)
Japanese (ja)
Inventor
信二 住ノ江
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シャープ株式会社
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Publication of WO2013038802A1 publication Critical patent/WO2013038802A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

Definitions

  • the present invention relates to a surface light emitting device having a plurality of light emitting elements and a liquid crystal display device including the surface light emitting device.
  • FIG. 10 is a cross-sectional view showing a schematic configuration of a conventional liquid crystal display device 100 including a direct type backlight 101.
  • 10 is a horizontal sectional view, and the direction in which the LEDs (light emitting diodes) 102 are arranged in FIG. 10 corresponds to the left-right direction of the liquid crystal display device 100.
  • the backlight 101 includes a plurality of LEDs 102, an LED substrate 103, a diffusion plate 104, a backlight chassis 105, a reflection sheet 106, and a circuit substrate 107.
  • Such a backlight 101 and a liquid crystal panel 108 are fixed to a cabinet 110 via a fixing member 109 to constitute a liquid crystal display device 100.
  • the plurality of LEDs 102 are mounted on and supported by the LED substrate 103.
  • the diffusing plate 104 diffuses the light emitted from each LED 102 to make it uniform and emit it.
  • the backlight chassis 105 includes a flat substrate mounting portion 105a on which the LED substrate 103 is mounted, and a diffusion plate support portion 105b that is connected to the substrate mounting portion 105a and supports the diffusion plate 104 positioned on the light emitting side of each LED 102. And have.
  • the reflection sheet 106 has an opening corresponding to the position of each LED 102, and is formed on the surface of the substrate mounting portion 105 a and the diffusion plate support portion 105 b so as to cover the LED substrate 103.
  • the circuit board 107 includes a circuit board for controlling the light emission of each LED 102 and a circuit board for driving the liquid crystal panel 108.
  • the liquid crystal panel 108 is provided on the light emission side of the diffusion plate 104 via optical sheets (not shown) including a lens sheet and the like.
  • the circuit board 107 is disposed on the opposite side of the diffusion plate 104 with the substrate mounting portion 105a of the backlight chassis 105 and the gap S therebetween.
  • the gap S is provided between the board mounting portion 105a and the circuit board 107 because the heat generated in the LED 102 and the heat generated in the circuit board 107 are mixed with each other and the temperature rises. This is for the purpose of suppressing and ensuring a ventilation path for heat dissipation of the LED 102 and the circuit board 107.
  • the configuration in which the circuit board 107 is arranged via the flat board mounting portion 105a and the gap S is similarly adopted in the liquid crystal display device disclosed in Patent Document 1, for example.
  • JP 2011-134474 A (see FIG. 1 etc.)
  • the thickness of the backlight 101 increases accordingly. That is, in the configuration of FIG. 10, the thickness of the thickest portion of the backlight 101 is the distance from the circuit board 107 to the diffusion plate 104, and the thickness of the backlight 101 includes the gap S and the thickness of the circuit board 107. Therefore, the thickness of the backlight 101 increases accordingly.
  • the present invention has been made to solve the above-described problems, and its purpose is to reduce the thickness of the circuit board and the light emitting element without hindering heat dissipation even when the circuit board is arranged outside the board mounting portion.
  • An object of the present invention is to provide a surface light emitting device capable of performing the above and a liquid crystal display device including the surface light emitting device.
  • the surface light-emitting device of the present invention includes an element mounting substrate on which a plurality of light emitting elements are mounted, a diffusion plate that diffuses and emits light emitted from each of the light emitting elements, and a substrate mounting portion on which the element mounting substrate is mounted
  • a chassis member coupled to the substrate mounting portion and having a diffusion plate support portion for supporting the diffusion plate located on the light emitting side of each light emitting device, and for controlling light emission of each light emitting device
  • a surface light emitting device including a circuit board, wherein the board mounting portion of the chassis member has a distance between the board mounting portion and the diffusion plate being different in at least two regions, and the distance is the same in the same region.
  • the chassis member is formed to be bent and the longest distance among the at least two areas is a first area, and the distance is shorter than the first area.
  • the circuit board is a space formed on the opposite side of the diffuser plate with respect to the substrate mounting portion in the second region, and the circuit board is bent by the substrate mounting portion. It is characterized in that it is arranged in a space corresponding to a step between the first region and the second region with a gap between the substrate mounting portion of the second region and the second region.
  • the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion.
  • the thickness of the thickest part of the surface light emitting device is from the substrate mounting part of the first region to the diffusion plate regardless of the thickness of the circuit board. Distance.
  • the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap. Therefore, the surface light emitting device can be thinned without impeding the heat dissipation of the circuit board and the light emitting element.
  • the chassis member has a recess formed by a part of the substrate mounting portion being recessed toward the diffusion plate, and the substrate mounting portion in the second region is The bottom of the recess is formed, and the circuit board is disposed in the recess, and is disposed through a gap with the substrate mounting portion in the second region that forms the bottom of the recess. May be.
  • the thickness of the thickest portion of the surface light emitting device is determined by the board mounting portion.
  • the surface light emitting device can be made thinner as compared with the configuration in which the circuit board protrudes outward from the flat substrate mounting portion.
  • the circuit board and the light emitting element can be dissipated by ventilating the gap. it can. Therefore, even if it is the structure which provides a circuit board in a recessed part, a surface emitting device can be reduced in thickness, without inhibiting heat dissipation of a circuit board and a light emitting element.
  • each light-emitting element is disposed in both the first region and the second region of the chassis member, and the arrangement density of the light-emitting elements in the second region May be higher than the arrangement density of the light emitting elements in the first region.
  • the distance between the light emitting element and the diffusion plate is shorter in the second region than in the first region. For this reason, in the second region, optical luminance unevenness is more likely to occur when each light emitting element emits light than in the first region.
  • the arrangement density of the light emitting elements in the second region higher than the arrangement density of the light emitting elements in the first region, the distance between the light emitting elements in the second region is shortened. Brightness unevenness can be reduced.
  • a light guide plate that guides light incident from an end face and emits the light toward the diffuser plate between the substrate mounting portion in the second region and the diffuser plate.
  • Each light emitting element is disposed in the first region and emits light toward the diffusion plate, and second light emission that emits light toward the end face of the light guide plate. And an element.
  • each light emitting element when each light emitting element is positioned between the substrate mounting portion in the second region and the diffusion plate and each light emitting element emits light toward the diffusion plate, the distance between each light emitting element and the diffusion plate Therefore, optical brightness unevenness is likely to occur when each light emitting element emits light.
  • the edge light method in which light is incident on the end face of the light guide plate and the surface light is emitted, uneven luminance can be reduced by surface light emission, but light loss occurs when light enters the light guide plate. Usage efficiency tends to decrease.
  • a light guide plate is disposed between the substrate mounting portion in the second region and the diffusion plate, and among the light emitting devices, the first light emitting device located in the first region emits light toward the diffusion plate.
  • the luminance unevenness is reduced by surface light emission on the light guide plate,
  • the direct type it is possible to avoid a decrease in light utilization efficiency that occurs in the edge light system.
  • the second region includes a central portion of the substrate mounting portion.
  • the circuit board In the central part of the board mounting part, heat is more likely to accumulate than the peripheral part, and the temperature tends to rise. Therefore, in the second region including the central portion of the substrate mounting portion, the circuit board is positioned in the space opposite to the diffusion plate with respect to the substrate mounting portion via the gap, so that the gap is used for heat dissipation. It is possible to reduce the thickness of the device while securing the ventilation path and improving the heat dissipation at least in the central portion of the substrate mounting portion.
  • the liquid crystal display device of the present invention may include the above-described surface light emitting device of the present invention and a liquid crystal panel that displays an image by modulating light supplied from the surface light emitting device.
  • the circuit board is a space formed on the side opposite to the diffusion plate with respect to the substrate mounting portion in the second region, and the first region and the second region due to the bending of the substrate mounting portion. Since it is arranged in a space corresponding to a step with the region, the thickness of the thickest portion of the surface light emitting device can be the distance from the substrate mounting portion of the first region to the diffusion plate, and surface light emission The apparatus can be thinned. Moreover, since the circuit board is disposed in the space via the substrate mounting portion in the second region and the gap, the circuit board and the light emitting element can be dissipated by ventilating the gap, The surface light emitting device can be thinned without hindering such heat dissipation.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a liquid crystal display device 1 of the present embodiment.
  • 1 is a horizontal sectional view, and the direction in which the LEDs 11 are arranged in FIG. 1 corresponds to the left-right direction of the liquid crystal display device 1, and the direction perpendicular to the plane of FIG. 1 corresponds to the up-down direction.
  • the cross-sectional views appearing below are also horizontal cross-sectional views unless otherwise specified, and the correspondence between the left, right, and top and bottom directions is the same as that in FIG.
  • the liquid crystal display device 1 is configured by fixing a backlight 2 and a liquid crystal panel 3 to a cabinet 5 via a fixing member 4.
  • the backlight 2 is a surface light emitting device for illuminating the liquid crystal panel 3 in a planar shape.
  • the liquid crystal panel 3 is a liquid crystal display element that displays light by modulating light supplied from the backlight 2.
  • details of the backlight 2 will be described.
  • FIG. 2 is a cross-sectional view showing the configuration of the backlight 2.
  • the backlight 2 includes an LED 11 as a plurality of light emitting elements, an LED substrate 12, a diffusion plate 13, a backlight chassis 14, a reflection sheet 15, and a circuit board 16, and in this embodiment, a direct type This is a surface light emitting device.
  • the plurality of LEDs 11 are mounted and supported in a line shape (left and right direction in FIG. 1) on an LED substrate 12 as a substrate for mounting light emitting elements.
  • Each LED board 12 is arranged side by side so that the plurality of LEDs 11 are two-dimensionally arranged.
  • the diffusion plate 13 diffuses and uniformizes the light emitted from each LED 11 that is a point light source, and emits the light in a planar shape.
  • the diffusion plate 13 is formed in a flat plate shape and disposed on the light emitting side of each LED 11. .
  • the backlight chassis 14 is a chassis member formed by bending one sheet metal into a predetermined shape, and includes a substrate mounting portion 14a on which a plurality of LED substrates 12 are mounted, and a diffusion plate support portion that supports the diffusion plate 13. 14b.
  • the diffusion plate support portion 14b is connected to the end portion of the substrate mounting portion 14a and supports the diffusion plate 13 located on the light emission side of each LED 11. More specifically, the diffusion plate support portion 14b is formed to extend obliquely from the end of the substrate mounting portion 14a toward the diffusion plate 13 and then be bent at an obtuse angle so as to be parallel to the diffusion plate 13. The diffusion plate 13 is supported by the bent end portion.
  • the reflection sheet 15 has an opening corresponding to the position of each LED 11, and is formed on the surface of the substrate mounting portion 14 a and the diffusion plate support portion 14 b so as to cover the LED substrate 12.
  • the circuit board 16 is a circuit board for controlling the light emission of each LED 11.
  • the circuit board 16 may include a circuit board for driving the liquid crystal panel 3 (see FIG. 1) and other boards (power supply board, control board).
  • the liquid crystal panel 3 is provided on the light emission side of the diffusion plate 13 via optical sheets (not shown) including a lens sheet, a prism sheet, a retroreflective sheet, and the like.
  • a recess 21 is formed in the substrate mounting portion 14a of the backlight chassis 14.
  • the recess 21 is formed by a part of the flat substrate mounting portion 14a being recessed toward the diffusion plate 13 side.
  • the concave portion 21 is formed in a groove shape along the vertical direction in the central portion of the substrate mounting portion 14 a corresponding to the central portion in the left-right direction of the backlight 2.
  • the shape in the horizontal cross section of the backlight chassis 14 becomes a substantially W shape as a whole, as shown in FIG.
  • the circuit board 16 described above is disposed in the recess 21, and is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S.
  • the substrate mounting portion 14 a that forms the bottom of the recess 21 is the substrate mounting portion 14 a that is located on the opposite side of the opening 21 a of the recess 21, and the LED substrate 12 is placed in the formation region of the recess 21.
  • the substrate mounting portion 14a is the substrate mounting portion 14 a that is located on the opposite side of the opening 21 a of the recess 21, and the LED substrate 12 is placed in the formation region of the recess 21.
  • the thickness of the thickest part of the backlight 2 is changed from a portion other than the formation region of the recess 21 in the substrate mounting portion 14 a to the diffusion plate 13.
  • the backlight 2 can be thinned.
  • the thickness of the surface light emitting device is opposite to that of the diffusion plate as in the conventional configuration in which the circuit board is arranged with a gap between the substrate mounting portion and the substrate mounting portion in a flat shape. It is not necessary to consider the distance (including the thickness of the circuit board) of the portion protruding to the side, and the surface light emitting device can be made thinner accordingly.
  • a thin liquid crystal display device 1 that illuminates the liquid crystal panel 3 with a thin surface light emitting device can be realized. Therefore, when the liquid crystal display device 1 is commercialized as, for example, a liquid crystal television, the commercial value can be increased at least in terms of thinness.
  • the circuit board 16 when the circuit board 16 is provided behind the LED 11, the heat generated by the LED 11 and the heat generated by the circuit board 16 are mixed with each other and the temperature is likely to rise.
  • the circuit board 16 is disposed via the substrate mounting portion 14 a that forms the bottom of the recess 21 and the gap S, and there is a gap S between the LED 11 and the circuit board 16. Therefore, by ventilating the gap S, the LED 11 and the circuit board 16 can be dissipated. Therefore, the backlight 2 and thus the liquid crystal display device 1 can be thinned without hindering the heat radiation of the LED 11 and the circuit board 16.
  • the surface area of the substrate mounting portion 14a is increased due to the formation of the recess 21 and the ventilation area is increased, the heat dissipation effect by ventilation can be further enhanced.
  • the gap S can be increased to suppress mutual interference between the heat of the LED 11 and the heat of the circuit board 16.
  • a high-definition liquid crystal television having a resolution of 4000 ⁇ 2000 pixels or more is called 4K2K (K indicates 10 3 ), and has a pixel number four times that of full HD (full high definition).
  • K indicates 10 3
  • full HD full high definition
  • the edge light method using the light guide plate causes loss when entering the light guide plate and lowers the light utilization efficiency as compared with the direct type, so that the power consumption increases. Furthermore, in the edge light system, it is necessary to use a thick light guide plate in consideration of warpage of the light guide plate, but in this case, the weight becomes heavy.
  • the backlight 2 of the present embodiment is a direct type in which the LEDs 11 are two-dimensionally arranged, has high light utilization efficiency, can sufficiently obtain luminance, and has the concave portion 21 as described above. Thinning can be realized without considering the thickness of the circuit board 16, and a light guide plate such as an edge light system is unnecessary (since the weight of the light guide plate need not be considered), the above high-definition liquid crystal It will be suitable for television.
  • the recess 21 is formed in a size that can further accommodate a reinforcing member for securing the overall strength of the liquid crystal display device 1, a speaker, a wall hanging member (wall hanging bracket), and the like. Then, all of these members or at least one of these members may be disposed in the recess 21. Even in this case, the amount of protrusion of the member from the back surface of the backlight chassis 14 is reliably reduced and the thickness of the liquid crystal display device 1 is increased as compared with the configuration in which the reinforcing member is disposed without forming the recess 21. Can be avoided.
  • the substrate mounting portion 14a has different distances between the substrate mounting portion 14a and the diffusion plate 13 in at least two regions and the same region. Then, it can be said that it is bent and formed so that the above-mentioned distance is the same. Therefore, in the backlight chassis 14, in the backlight chassis 14, the region having the longest distance among the above two regions is referred to as a first region R1, and the region other than the first region R1, that is, the distance is the first region. A region shorter than the region R1 is referred to as a second region R2. In this case, the substrate mounting portion 14a in the second region R2 forms the bottom of the recess 21 described above.
  • the above-described circuit board 16 can also be expressed as being disposed in the space T via the board mounting portion 14a and the gap S in the second region R2.
  • the space T is a space formed on the opposite side of the diffusion plate 13 with respect to the substrate mounting portion 14a in the second region R2, and the first region R1 due to the bending of the substrate mounting portion 14a. It refers to a space corresponding to a step with the second region R2.
  • FIG. 3 shows the above-described space T by hatching different from the hatching that shows the substrate mounting portion 14a.
  • the space T is formed by the step d between the first region R1 and the second region R2 due to the bending of the substrate mounting portion 14a. Therefore, when the surface constituting the lowermost part of the space T (the surface farthest from the substrate mounting portion 14a in the second region R2 in the space T) is virtually considered, this virtual surface is the first region R1. It becomes the same surface as the surface opposite to the diffusion plate 13 in the substrate mounting portion 14a. In other words, the space T corresponding to the step d between the first region R1 and the second region R2 is further below the space T from the substrate mounting portion 14a of the first region R1 (on the opposite side to the diffusion plate 13). ) Means that it is formed without jumping out.
  • the circuit board 16 is disposed in the space T (by being disposed closer to the diffusion plate 13 than the virtual surface including the virtual plane), so that Regardless of the thickness of the circuit board 16, the thickness of the thick part can be the distance from the substrate mounting portion 14a to the diffusion plate 13 in the first region R1. Therefore, it can be said that the backlight can be thinned by arranging the circuit board 16 in the space T.
  • the circuit board 16 since the circuit board 16 is disposed in the space T via the board mounting portion 14a in the second region R2 and the gap S, the circuit board 16 inhibits heat radiation of the circuit board and the light emitting element due to the ventilation of the gap S. Therefore, the backlight 2 can be made thinner.
  • the LED substrate 12 is arranged in both the first region R1 and the second region R2, and therefore, the plurality of LEDs 11 are arranged in the first region R1. It is arranged in both the region R1 and the second region R2. At this time, the LEDs 11 are arranged such that the arrangement density of the LEDs 11 in the second region R2 is higher than the arrangement density of the LEDs 11 in the first region R1.
  • the arrangement density of each LED 11 refers to the number of LEDs 11 per unit area.
  • the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1. For this reason, if each LED 11 of 1st area
  • the light can be reliably made uniform by the diffusion by the diffusion plate 13, and the luminance unevenness can be reduced.
  • the arrangement pitch of the LEDs 11 (or the distance between the LEDs 11) and the minimum distance between the LED 11 and the diffusion plate 13 when no optical luminance unevenness occurs are in a proportional relationship, and if the arrangement pitch of the LEDs 11 is shortened. Even if the distance between the LED 11 and the diffusion plate 13 is shortened, no optical luminance unevenness occurs. On the contrary, this means that when the distance is shortened, optical luminance unevenness occurs unless the arrangement pitch of the LEDs 11 is shortened.
  • the recess 21 is formed in the substrate mounting portion 14a, the distance between the LED 11 and the diffusion plate 13 is shorter in the second region R2 than in the first region R1, By shortening the arrangement pitch of the LEDs 11 in the second region R2, it is possible to prevent optical luminance unevenness from occurring. That is, the luminance unevenness caused by forming the concave portion 21 can be easily reduced by changing the arrangement pitch of the LEDs 11 between the first region R1 and the second region R2. As a result, it is possible to realize the backlight 2 in which luminance unevenness does not occur with the minimum number of LEDs 11.
  • the LEDs 11 in the second region R2 higher than the arrangement density of the LEDs 11 in the first region R1, for example, the LEDs 11 in the first region R1 having a lower arrangement density. Can be emitted with a high luminance, and the LEDs 11 in the second region R2 having a higher arrangement density can emit a light with a low luminance to achieve uniform luminance over the entire surface. Thereby, the electric power per LED11 of 2nd area
  • region R2 can be suppressed, and the raise of the temperature of LED11 (LED terminal temperature) and the temperature rise of the solder joint part of LED11 can be suppressed.
  • the arrangement density of the LEDs 11 and the magnitude of the current flowing through the LEDs it is possible to achieve a desired brightness using the minimum number of LEDs 11 while maintaining a uniform temperature distribution. it can.
  • FIG. 4 is a cross-sectional view showing a schematic configuration of the liquid crystal display device 1 of the present embodiment.
  • the liquid crystal display device 1 has the same configuration as that of the first embodiment except that the second region R2 of the backlight 2 is an edge light system. This will be specifically described below.
  • the light guide plate 31 is disposed in the second region R2. More specifically, the light guide plate 31 is disposed between the substrate mounting portion 14 a in the second region R 2, that is, the substrate mounting portion 14 a that forms the bottom of the recess 21, and the diffusion plate 13.
  • the light guide plate 31 guides light incident from the end surface (side surface) inside and emits the light toward the diffusion plate 13 from the surface facing the diffusion plate 13.
  • FIG. 5 is a plan view (front view) when the light guide plate 31 disposed in the second region R2 is viewed from the diffusion plate 13 side.
  • each LED 11 as a point light source includes an LED 11a (see FIG. 4) as a first light emitting element constituting a direct type and an edge light.
  • LED11b (refer FIG. 5) as the 2nd light emitting element which comprises a system is included.
  • the LED 11 a is a light emitting element that is located in the first region R 1, that is, in a region other than the region where the recess 21 is formed, and emits light toward the diffusion plate 13.
  • the LED 11 b is a light emitting element that emits light toward the end face of the light guide plate 31.
  • the LED 11b may emit light toward any of the left, right, top, and bottom end surfaces of the light guide plate 31 that does not face the diffusion plate 13 (opposite any of the four left, right, top, and bottom end surfaces that do not face the diffusion plate 13). May be arranged).
  • each LED 11 When the LED 11 is arranged in the second region R2 where the concave portion 21 is formed and the LED 11 emits light toward the diffusion plate 13, the distance between each LED 11 and the diffusion plate 13 is short, so that each LED 11 As described in the first embodiment, optical luminance unevenness is likely to occur when the light is emitted.
  • the luminance unevenness can be reduced by the surface light emission, but at least about 10% due to the surface reflection when entering the light guide plate. Since light loss occurs, light utilization efficiency decreases. Therefore, in order to obtain the same luminance on the entire surface, it is necessary to increase power consumption.
  • the light guide plate 31 is disposed between the substrate mounting portion 14a and the diffusion plate 13 in the second region R2, and each LED 11a emits light toward the diffusion plate 13, while each LED 11b.
  • the use of the direct type can avoid a decrease in light utilization efficiency that occurs in the edge light system.
  • the edge light system as a part of the backlight 2, it is possible to realize the backlight 2 that is thin and has no luminance unevenness compared to a simple (entire-surface) direct-type structure, and has a thickness limitation. Since the light directing efficiency is better in the direct part (first region R1) than in the edge light system, the backlight 2 with low power consumption and excellent environmental performance can be realized.
  • the LED 11b is disposed at the end of the light guide plate 31, so that the LED is not disposed in a region where the temperature is likely to rise (for example, the central portion of the second region R2), and the temperature rises. It is also possible to avoid deterioration of LED characteristics (for example, luminance reduction).
  • the mounting portion (mounting region) of the LED substrate 12 in the substrate mounting portion 14a is composed of a central portion C and two peripheral portions P.
  • the central portion C of the substrate mounting portion 14a is a region including the center of the substrate mounting portion 14a, and is, for example, a vertically long region in the vertical direction.
  • the peripheral portion P of the substrate mounting portion 14a is a region around the central portion C.
  • the peripheral portion P is located on the left side and the right side of the central portion C and is a vertically long region.
  • the backlight chassis 14 only needs to have at least one space T corresponding to a step between the first region R1 and the second region R2, and the space T It is clear that the position to be formed is not limited to the central portion of the substrate mounting portion 14a.
  • the substrate mounting portion 14 a of the backlight chassis 14 may be formed to be bent so that one of the two peripheral portions P is shifted to the diffusion plate 13 side. Further, as shown in FIG. 7, the substrate mounting portion 14a may be formed to be bent so that the central portion C and the one peripheral portion P are combined and shifted to the diffusion plate 13 side. Further, as shown in FIG. 8, the substrate mounting portion 14a may be formed to be bent so that both peripheral portions P are shifted to the diffusion plate 13 side.
  • the backlight chassis 14 has two second regions R2, and two spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. .
  • substrate mounting part 14a may be bent and formed so that the center part C and a part of both peripheral part P may shift to the diffusion plate 13 side.
  • the backlight chassis 14 has three second regions R2, and three spaces T corresponding to the step between the first region R1 and the second region R2 are also formed. . Although not shown, four or more spaces T may be formed.
  • the circuit board 16 is disposed in the space T corresponding to the step between the first region R1 and the second region R2, and the second region
  • the circuit board 16 does not jump out of the backlight chassis 14, and a gap S for heat dissipation of the LED 11 and the circuit board 16 is also secured. Therefore, similarly to the first and second embodiments, the backlight 2 and thus the liquid crystal display device 1 can be thinned without inhibiting the heat radiation of the LED 11 and the circuit board 16.
  • the second region R2 includes the central portion C of the substrate mounting portion 14a as in the configurations of FIGS.
  • a space T corresponding to a step between the first region R1 and the second region R2 is formed at least on the side opposite to the diffusion plate 13 with respect to the central portion C of the substrate mounting portion 14a.
  • the circuit board 16 By disposing the circuit board 16 in the space T via the substrate mounting portion 14a and the gap S, the heat dissipation at the central portion C of the substrate mounting portion 14a that is likely to rise in temperature due to the ventilation of the gap S is improved.
  • the backlight 2 and thus the liquid crystal display device 1 can be thinned.
  • a recess 21 constituting the space T is formed in the central portion of the substrate mounting portion 14a, and a circuit is formed in the recess 21 via the substrate mounting portion 14a and the gap S. Since the board
  • the backlight 2 and thus the liquid crystal display device 1 by appropriately combining the configurations of the above-described embodiments.
  • the configuration of the first embodiment in which the arrangement density of the LEDs 11 is changed between the first region R1 and the second region R2 can be applied to the configurations of FIGS. 6 to 9 of the third embodiment.
  • the configuration of the second embodiment in which the light guide plate 31 is provided in the second region R2 and the edge light system is used can be applied to the configurations of FIGS. 6 to 9 of the third embodiment.
  • the backlight 2 can also be used alone as a room illuminating device.
  • the surface light-emitting device of the present invention can be used, for example, for a backlight of a liquid crystal display device or a room lighting device.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

Dans la présente invention, un châssis de rétroéclairage (14) d'un éclairage arrière (2) comprend une unité (14a) pour montage de substrat sur laquelle est monté un substrat à LED (12) et une unité (14b) de support de plaque de diffusion qui est contiguë à l'unité (14a) pour montage de substrat et qui supporte une plaque de diffusion (13) disposée sur le côté sortie de lumière des LED (11). Dans le châssis de rétroéclairage (14), si une région ayant la plus grande distance entre l'unité (14a) pour montage de substrat et la plaque de diffusion (13) est une première région (R1) et si une région où cette distance est inférieure à celle dans la première région (R1) est une seconde région (R2), une carte de circuit imprimé (16) est disposée dans un espace (T), qui est un espace formé sur le côté opposé à la plaque de diffusion (13) sur toute l'unité (14a) pour montage de substrat et correspond à la différence de hauteur entre la première région (R1) et la seconde région (R2), un interstice (S) se trouvant entre la carte de circuit imprimé et l'unité (14a) pour montage de substrat dans la seconde région (R2).
PCT/JP2012/068158 2011-09-13 2012-07-18 Dispositif d'émission de lumière par la surface et dispositif d'affichage à cristaux liquides doté de celui-ci WO2013038802A1 (fr)

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JP2011-199468 2011-09-13
JP2011199468 2011-09-13

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EP2863255B1 (fr) * 2013-10-16 2018-04-11 Samsung Electronics Co., Ltd. Appareil d'affichage à cristaux liquides
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EP4375737A1 (fr) * 2022-11-22 2024-05-29 Lg Electronics Inc. Dispositif d'affichage

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EP4375737A1 (fr) * 2022-11-22 2024-05-29 Lg Electronics Inc. Dispositif d'affichage

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