WO2013018177A1

WO2013018177A1 - Lamp and illumination device

Info

Publication number: WO2013018177A1
Application number: PCT/JP2011/067529
Authority: WO
Inventors: 裕美子林田; 西村　潔; 川島　淨子; 上村　幸三; 小柳津　剛; 周平松田; 浩貴玉井; 壮一渋沢; 正弘緒方
Original assignee: 東芝ライテック株式会社
Priority date: 2011-07-29
Filing date: 2011-07-29
Publication date: 2013-02-07

Abstract

According to an embodiment whereby a replacement for a fluorescent lamp does not cause discomfort, a lamp comprises: a pipe (12); caps (13a, 13b) which are attached on the end parts of the pipe; and a plurality of light emitting modules (15) which are housed in the pipe (12) and arranged in the direction in which the pipe extends, and which further comprise a substrate (21) and a plurality of semiconductor light emitting elements (45). The long side of the substrate (21) is in the direction in which the pipe (12) extends. The substrate (21) further comprises a plurality of substrate regions (E1-E5). Each light emitting element (45) is mounted in each mounting region (E1-E5), arranged in the direction in which the substrate (21) extends. The light emitting elements in each substrate region are made a group. The number of elements of the light element groups which are mounted in the substrate region (E1) which are located closest to the caps (13a, 13b) is different from the number of elements of the light element groups which are mounted in the substrate regions (E2-E5) other than the substrate region (E1).

Description

Lamp and lighting device

Embodiments of the present invention relate to a lamp having a semiconductor light emitting element such as an LED (light emitting diode), and an illumination device including the lamp.

At present, straight tube fluorescent lamps occupy a large number of straight tube lamps. In this lamp, bases are fixed to both ends of the translucent pipe, and these bases support the filament. The filament is disposed inside the longitudinal end of the pipe. For this reason, in the lighting state, the pipe end corresponding to the space between the filament and the base becomes relatively dark compared to the intermediate part of the pipe. Moreover, this darkness increases as it approaches the base.

Recently, a straight tube LED lamp has been developed as a replacement for a straight tube fluorescent lamp. In this case, even if both ends of the pipe of the straight tube type LED lamp are formed so as to become darker as they approach the base, there is no sense of incongruity as a replacement. In addition, there are various demands for realizing the replacement, for example, it may be desired to increase the brightness of the end of the pipe.

By the way, a fluorescent lamp type LED illumination device in which a light emitting module in which a plurality of LEDs are arranged on a substrate is arranged in a straight and transparent pipe is known as a prior art. Furthermore, an LED array that can be used in a light emitting module of this type of lighting device is also known. This LED array is provided with a plurality of first conductive patterns, second conductive patterns, LED chips, bonding wires, and transparent resins on a printed board.

The surface of the printed circuit board is covered with white resist. The first and second conductive patterns are arranged along the longitudinal direction of the printed circuit board. The second conductive patterns are individually adjacent to the plurality of first conductive patterns arranged at an equal pitch. The first conductive pattern is larger than the LED chip. Each LED chip is die-bonded to the first conductive pattern. The bonding wire electrically connects the LED chip and the second conductive pattern adjacent to the first conductive pattern to which the LED chip is die-bonded. The transparent resin is provided by embedding LED chips, bonding wires, and the like.

However, although these conventional technologies replace the fluorescent lamp with an LED lamp, they do not teach any of the various problems described above.

JP 2001-351402 A JP-A-5-299702

Embodiment is to provide a lamp and a lighting device that do not give a sense of incongruity as a replacement from a fluorescent lamp.

The lamp of the embodiment includes a pipe, a base attached to an end of the pipe, a substrate and a plurality of semiconductor light emitting elements, and a plurality of light emitting modules housed in the pipe side by side in a direction in which the pipe extends. Are provided. The substrate formed long in the direction in which the pipe extends has a plurality of substrate regions. Each light emitting element is mounted in each substrate region side by side in the longitudinal direction of the substrate. The light emitting elements for each substrate region are grouped. The number of elements of the light emitting element group mounted on the substrate region closest to the base is made different from the number of elements of the light emitting element group mounted on the substrate region other than the substrate region closest to the base.

FIG. 1 is a perspective view illustrating the lighting apparatus according to the first embodiment. FIG. 2 is a cross-sectional view showing the lighting apparatus of FIG. FIG. 3 is a front view showing a state in which a plurality of light emitting modules included in the lamp of the lighting fixture of FIG. 1 are arranged. FIG. 4 is a front view showing one of the light emitting modules of FIG. FIG. 5 is an enlarged front view showing a portion F5 in FIG. 6 is an enlarged front view showing the F6 portion in FIG. 7 is a cross-sectional view taken along line F7-F7 in FIG. FIG. 8 is a cross-sectional view taken along line F8-F8 in FIG. FIG. 9 is a front view showing the light emitting module of FIG. 4 in a state where each mounting component and the sealing member are removed. FIG. 10 is an enlarged view of a portion F10 in FIG. FIG. 11 is an enlarged view showing a part of F11 in FIG. FIG. 12 is a schematic diagram illustrating a configuration of a sealing member included in the light emitting module of FIG. 4. FIG. 13 is a front view showing a wiring pattern of the light emitting module of FIG. FIG. 14 is a front view showing another light emitting module. FIG. 15 is a front view showing still another light emitting module. FIG. 16 is a front view showing a wiring pattern of the light emitting module of FIG. FIG. 17 is a diagram showing an electric circuit of a lamp provided in the lighting fixture of FIG. 18 is a connection diagram of the lighting fixture of FIG.

The lamp of Embodiment 1 includes a pipe formed of a light-transmitting material; a base attached to an end of the pipe; a substrate having a plurality of substrate regions and formed long in the direction in which the pipe extends; And a plurality of semiconductor light emitting elements mounted side by side in the longitudinal direction of the substrate on each of the substrate regions, and the light emitting elements for each of the substrate regions are grouped, and the light emitting element group is arranged in a direction in which the pipe extends. A plurality of light emitting modules housed in the pipe side by side, and the number of elements of the light emitting element group mounted on the substrate region closest to the base is other than the substrate region closest to the base This is different from the number of elements of the light emitting element group mounted on the substrate region.

In Embodiment 1, for example, a polycarbonate resin can be suitably used as the resin material forming the pipe, but glass may also be used. This pipe is preferably formed by mixing an appropriate amount of a light diffusing material with a resin material. In Embodiment 1, a single-layer or multi-layer resin substrate, a ceramic substrate, or the like can be used as the substrate of the light emitting module. Furthermore, when the substrate is a resin substrate, it is preferable that a metal foil such as aluminum, iron, or copper is laminated on the back surface. Thereby, it is possible to suppress the warpage of the substrate and improve the heat dissipation from the substrate. In Embodiment 1, the substrate region of the substrate refers to a region where a plurality of light emitting elements are mounted.

In the first embodiment, the semiconductor light-emitting element can typically be an LED (light-emitting diode) chip, but a semiconductor laser can also be used, and an EL (electroluminescence) element can also be used. Is possible. When an LED chip is used for the light emitting element, the emission color may be any of red, green, and blue. It is also possible to use a combination of LED chips of different emission colors.

In the first embodiment, the number of elements of the light emitting element group mounted on the substrate region closest to the base is different from the number of elements of the light emitting element group mounted on the substrate region other than the substrate region closest to the base. The term “includes” includes cases where the number of elements in the former is larger and smaller than the number of elements in the latter.

In Embodiment 1, among a plurality of light emitting modules housed in a pipe, a plurality of light emitting elements are arranged as follows with respect to the substrate of the light emitting module adjacent to the base. That is, the light emitting element group is mounted on each of the plurality of substrate regions of the substrate, but the number of elements of the light emitting element group mounted on the substrate region closest to the base is the position closest to the base. It is different from the number of elements of the light emitting element group mounted on the board area other than the board area.

Thereby, in the lamp of the first embodiment, the end of the pipe positioned closest to the base is illuminated according to the number of light emitting elements mounted on the substrate region positioned closest to the base. At this time, when each light emitting element forming the light emitting element group is connected in parallel and the number of light emitting elements mounted on the substrate region closest to the base is large, or mounted on the substrate region closest to the base When the number of light emitting elements is small, the brightness of the light emitting element group mounted on this substrate region is relatively lowered as compared with the brightness of the light emitting element group mounted on another substrate region. Thereby, the edge part of a pipe becomes comparatively dark compared with the middle of a pipe. However, this does not give a sense of incongruity as a lamp because the lamp of Embodiment 1 is a replacement for a fluorescent lamp having a filament that becomes a dark part.

Furthermore, when the number of light emitting elements mounted on the substrate region closest to the base is large, the end of the pipe is brightened, and the brightness of this end and the brightness of the pipe other than the pipe end are The difference can be reduced. Also, if the light diffusion performance of the pipe is high, the end of the pipe is noticeably dark due to the light diffusion performance at the end of the pipe, even if the number of light emitting elements mounted in the mounting area closest to the base is small. It is suppressed. Therefore, it is possible to suppress the end portion of the pipe from becoming conspicuously dark with respect to other pipe portions while reducing the number of light emitting elements used in the entire lamp.

Therefore, according to the first embodiment, it is possible to provide a lamp that does not give a sense of incongruity as a replacement from the fluorescent lamp.

The lamp according to the second embodiment is the same as the lamp according to the first embodiment except that the number of elements of the plurality of light emitting element groups mounted on the substrate region closest to the base is the substrate other than the substrate region closest to the base. More than the number of elements of the plurality of light emitting element groups mounted in the region.

In the second embodiment, as already described in the first embodiment, the pipe end is brightened, and the difference between the brightness of this end and the other pipe portions can be reduced. For this reason, it can suppress that the edge part of a pipe becomes conspicuously dark with respect to other pipe parts.

In the lamp of Embodiment 3, in Embodiment 1, the light emitting elements in the substrate regions are electrically connected in parallel, and the light emitting element groups are electrically connected in series.

In Embodiment 3, in Embodiment 1, the light emitting element groups connected in parallel in each substrate region of the substrate are electrically connected in series. Thereby, all the light emitting elements to which power is supplied can emit light while the lamp is on. Furthermore, a plurality of light emitting elements constituting each light emitting element group are electrically connected in parallel. Thereby, even if electricity supply with respect to one part of each light emitting element connected in parallel becomes defective, light emission of the other light emitting elements can be continued.

In the lamp according to the fourth embodiment, the light emitting module substrate closest to the one of the light emitting modules that bears power supply among the light emitting modules in the first embodiment is made of resin, and the substrate further includes a component mounting region. An electrical component that generates heat when energized is mounted in the component mounting region, and a portion between the component mounting region and the substrate region adjacent to the component mounting region in the width direction of the substrate. A cross-sectional restricting portion is formed to reduce the cross-sectional area along the width direction of the board in the board region and the component mounting area.

In Embodiment 4, the cross-section restricting portion can be formed by a hole opened in the substrate, a groove opened at the edge of the substrate, or both. At the same time, the cross-section restricting portion made of a hole may be a single hole or a plurality of holes.

When the lamp according to the fourth embodiment is implemented, the cross-sectional area along the width direction of the board at the portion as in the fifth embodiment is the cross-sectional area along the width direction of the board at the board area and the component mounting area. It is preferable to be 55% or more and 70%. Furthermore, it is preferable to form the cross section restricting portion with a hole extending in the width direction of the substrate as in the sixth embodiment.

In the fourth to sixth embodiments, the cross-sectional area of the portion between the board region and the component mounting region is further restricted by the cross-section restricting portion in the first embodiment, and the thermal conductivity of the resin-made substrate is reduced. Is relatively low. As a result, the heat generated by the electrical component mounted in the component mounting area is suppressed from spreading to the board area. Therefore, it is possible to suppress the temperature rise of the light emitting element mounted on the board region adjacent to the component mounting region.

The lighting device according to the seventh embodiment includes a device main body; a lighting device that is attached to the device main body and outputs a direct current; a first socket that is attached to the device main body and is supplied with the output of the lighting device; and the lighting device A second socket attached to the apparatus main body in a non-conductive state and paired with the first socket; a straight tube lamp removably supported by the first and second sockets; The lighting device includes a lamp having the following configuration.

The lamp includes a pipe formed of a light-transmitting material; a base attached to an end of the pipe; a substrate having a plurality of substrate regions and formed long in a direction in which the pipe extends; and each of the substrates A plurality of semiconductor light emitting elements mounted in a region in the longitudinal direction of the substrate, and a group of light emitting elements for each substrate region, and the light emitting element group is arranged in the pipe extending direction in the pipe A plurality of housed light emitting modules, wherein the number of elements of the light emitting element group mounted in the mounting area closest to the base is the board area other than the mounting area closest to the base It differs from the number of elements of the light emitting element group mounted on the board.

The lighting device according to the seventh embodiment includes the lamp described in the first embodiment. For this reason, according to the illuminating device of Embodiment 7, the effect that it is possible to provide the lamp which does not give a sense of incongruity as a replacement item from a fluorescent lamp lamp can be expected.

Hereinafter, the straight tube lamp according to the first embodiment and a lighting device including the straight lamp will be described in detail with reference to FIGS.

In FIG. 1 and FIG. 2, reference numeral 1 exemplifies a direct-mounted lighting fixture. The lighting fixture 1 includes a device main body (device main body) 2, a lighting device 3, first and

second sockets

4 a and 4 b that make a pair, a reflecting member 5, a straight tube lamp 11 that forms a light source, and the like. It has.

2 is made of, for example, an elongated metal plate. The apparatus main body 2 extends in the front and back direction of the paper surface depicting FIG. The apparatus main body 2 is fixed to, for example, an indoor ceiling using a plurality of screws (not shown).

The lighting device 3 is fixed to the middle portion of the device body 2 in the longitudinal direction. The lighting device 3 is configured to receive a commercial AC power supply and generate a DC output, and supplies the DC output to a lamp 11 described later.

Note that a power terminal block (not shown), a plurality of member support brackets, a pair of socket support members, and the like are attached to the apparatus main body 2. The power supply terminal block is connected with a power line of commercial AC power drawn from behind the ceiling. Furthermore, the power terminal block is electrically connected to the lighting device 3 via an in-appliance wiring (not shown).

The

sockets

4a and 4b are connected to the socket support member and disposed at both ends in the longitudinal direction of the apparatus main body 2, respectively. The

sockets

4a and 4b are of a rotational mounting type. These

sockets

4a and 4b are existing sockets suitable for, for example, G13 type caps 13a and 13b provided in the lamp 11 described later.

As shown in FIG. 18, the

sockets

4a and 4b are provided with a pair of terminal fittings 8 or 9 to which lamp pins 16a and 16b described later are connected. In order to supply power to a later-described lamp 11, only the terminal fitting 8 of the first socket 4a is connected to the lighting device 3 through the in-apparatus wiring as shown in FIG. No wiring is connected to the terminal fitting 9 of the second socket 4b.

As shown in FIG. 2, the reflecting member 5 has, for example, a metal bottom plate portion 5a, a side plate portion 5b, and an end plate 5c, and has a trough shape with an open upper surface. The bottom plate portion 5a is flat. The side plate portion 5b is bent obliquely upward from both ends in the width direction of the bottom plate portion 5a. The end plate 5c closes the end surface opening formed by the longitudinal ends of the bottom plate portion 5a and the side plate portion 5b. The metal plate that forms the bottom plate portion 5a and the side plate portion 5b is made of a color steel plate whose surface exhibits a white color. For this reason, the surface of the baseplate part 5a and the side plate part 5b is a reflective surface. Socket through holes (not shown) are opened at both ends in the longitudinal direction of the bottom plate portion 5a.

The reflection member 5 covers the device main body 2 and each component attached thereto. This state is held by a removable decorative screw 6 (see FIG. 1). The decorative screw 6 penetrates the bottom plate portion 5a upward and is screwed into the member support fitting. This decorative screw 6 can be manually operated without using a tool. The

sockets

4a and 4b protrude through the socket through holes to the lower side of the bottom plate portion 5a.

The lighting fixture 1 is not restricted to the structure which supports only one lamp | ramp 11 demonstrated below. For example, it is also possible to implement as a lighting fixture that includes two pairs of sockets and can support two lamps 11.

The lamp 11 detachably supported by the

sockets

4a and 4b will be described below with reference to FIGS.

The lamp 11 has the same dimensions and outer diameter as the existing fluorescent lamp. The lamp 11 includes a pipe 12, first and

second caps

13 a and 13 b attached to both ends of the pipe 12, a beam 14, and a plurality of, for example, four light emitting modules 15. In the case of distinguishing the four light emitting modules 15, the subscripts a to d are attached and illustrated and described.

The pipe 12 is made of a translucent resin material, for example, in a long shape. As the resin material forming the pipe 12, a polycarbonate resin mixed with a light diffusing material can be suitably used. The diffuse transmittance of the pipe 12 is preferably 90% to 95%. As shown in FIG. 2, the pipe 12 has a pair of convex parts 12a on the inner surface of the upper part in its use state.

The first base 13 a is attached to one end of the pipe 12 in the longitudinal direction, and the second base 13 b is attached to the other end in the longitudinal direction of the pipe 12. These first and

second caps

13a and 13b are detachably connected to the

sockets

4a and 4b. The lamp 11 supported by the

sockets

4 a and 4 b by this connection is disposed immediately below the bottom plate portion 5 a of the reflecting member 5. A part of the light emitted from the lamp 11 to the outside enters the side plate portion 5 b of the reflecting member 5.

As shown in FIG. 18, the first base 13a has two lamp pins 16a protruding to the outside. These lamp pins 16a are electrically insulated from each other. At the same time, the tip portions of the two lamp pins 16a are bent at a substantially right angle so as to be separated from each other and have an L shape. As shown in FIG. 18, the second base 13b has a single lamp pin 16b projecting to the outside. The lamp pin 16b has a cylindrical shaft portion and a front end portion (not shown) which is provided at the front end and has an elliptical shape or an oval shape, and has a side T shape.

The lamp pin 16a of the first base 13a is connected to the terminal fitting 8 of the socket 4a, and the lamp pin 16b of the second base 13b is connected to the terminal fitting 9 of the socket 4b, whereby the lamp 11 is connected to the

sockets

4a and 4b. Mechanically supported. In this supported state, power can be supplied to the lamp 11 by the terminal fitting 8 in the first socket 4a and the lamp pin 16a of the first base 13a in contact therewith.

As shown in FIG. 2, the beam 14 is accommodated in the pipe 12. The beam 14 is a bar material having excellent mechanical strength, and is formed of, for example, an aluminum alloy for weight reduction. Both longitudinal ends of the beam 14 are electrically insulated and connected to the

caps

13a and 13b. The beam 14 has, for example, a plurality of substrate support portions 14a each having a rib shape (only one is shown in FIG. 2).

As shown in FIG. 3, the four light emitting modules 15a to 15d are all formed in a long and narrow rectangle, and are arranged in a straight line. The length of the light emitting module row is substantially equal to the total length of the beam 14. The light emitting modules 15a to 15d are fixed by screws (not shown) that are screwed into the beam 14 through the light emitting modules 15a to 15d.

Therefore, the light emitting modules 15a to 15d are accommodated in the pipe 12 together with the beam 14. In this supported state, both ends in the width direction of the light emitting modules 15a to 15d are placed on the convex portions 12a of the pipe 12. Accordingly, the light emitting modules 15a to 15d are disposed substantially horizontally above the maximum width portion in the pipe 12.

Each light emitting module 15 includes a substrate 21, a wiring pattern 25, a protection member 41, a plurality of light emitting elements 45, a first wire 51, a second wire 52, a sealing member 54, and various electrical components 55. To 59.

The substrate 21 is formed of a base 22, a metal foil 23, and a cover layer 24. Further, the substrate 21 of the

light emitting modules

15a and 15d has a plurality of, for example, five substrate regions E1 to E5 (see FIGS. 4 and 14) arranged in the longitudinal direction. Similarly, the substrate 21 of the

light emitting modules

15b and 15c has, for example, a plurality of substrate regions E1 to E6 (see FIG. 25) arranged in the longitudinal direction.

The base 22 is made of a flat plate made of resin such as glass epoxy resin. This glass epoxy resin substrate (FR-4) has a low thermal conductivity and is relatively inexpensive. The base 22 may be formed of a glass composite substrate (CEM-3) or other synthetic resin material.

7 and 8, the metal foil 23 is laminated on the back surface of the substrate 21 and is made of, for example, copper foil. The cover layer 24 is laminated over the peripheral rear surface of the base 22 and the metal foil 23. The cover layer 24 is made of a resist layer made of an insulating material such as synthetic resin. The substrate 21 is reinforced by the metal foil 23 and the cover layer 24 laminated on the back surface thereof so as not to warp.

The wiring pattern 25 has a three-layer structure as shown in FIGS. 7 and 8 and is formed on the surface of the base 22 (that is, the surface of the substrate 21). The first layer U is formed of copper plated on the surface of the base 22. The second layer M is plated on the first layer U and is formed of nickel. The third layer T is plated on the second layer M and is made of silver.

Therefore, the surface of the wiring pattern 25 is made of silver. The silver third layer T forms a reflecting surface, and the total light reflectance thereof is 90% or more.

The wiring pattern 25 formed on the substrate 21 of the light emitting module 15a disposed at one end of the light emitting module row is shown in detail in FIG. As the wiring pattern 25, a first wiring pattern 25a and a second wiring pattern 25b are provided.

The first wiring pattern 25 a has a plurality of pattern portions 31 arranged in the longitudinal direction of the substrate 21. Each pattern portion 31 has a mounting region 31a and a conductive region 31b.

The mounting region 31 a extends in the longitudinal direction of the substrate 21, and is formed in such a size that a plurality of mounting pads 26 described later are arranged in the longitudinal direction of the substrate 21. For this reason, the width | variety of the mounting area | region 31a is wider than the diameter of the mounting pad 26 (pad diameter D1) mentioned later. These mounting regions 31a are provided in the substrate regions E1 to E5, respectively.

The conductive region 31b extends integrally from the mounting region 31a and extends to a substrate region adjacent to the substrate region where the mounting region 31a is formed. The conductive region 31b has a portion along an edge extending in the longitudinal direction of the substrate 21 and a plurality of branch portions branched substantially perpendicularly from this portion. The leading end of each branch portion forms a conductive connecting portion 27 described later.

As shown in FIGS. 4 and 14, for example, eight conductive connection portions 27 are disposed in each of the substrate regions E2 to E5 of the

light emitting modules

15a and 15d. On the other hand, in the substrate region E1 of the light emitting module 15a, the number of conductive connection portions 27 different from the number of the substrate regions E2 to E5 disposed is disposed. For example, there are more than nine arrangements for the substrate regions E2 to E5. Specifically, nine conductive connection portions 27 are arranged in the substrate region E1. As shown in FIG. 15, for example, eight conductive connection portions 27 are arranged in each of the substrate regions E1 to E6 of the

light emitting modules

15b and 15c.

Among the adjacent pattern portions 31 of the substrate 21, the mounting region 31 a of one pattern portion 31 and the conductive region 31 b of the other pattern portion 31 are aligned in the thickness direction of the substrate 21. The paired mounting region 31a and conductive region 31b are disposed in the substrate regions E1 to E5, respectively (see FIGS. 13 and 15). The number of the branch portions is the same as the number of mounting pads 26 to be described later formed in the mounting region 31a paired with the conductive region 31b having the branch portion.

As shown in FIGS. 4 and 9, etc., the substrate 21 of the light emitting module 15a further has a component mounting region 21a adjacent to one end of the row formed by the substrate regions E1 to E5. As shown in FIG. 13, a plurality of component mounting pads 28 are formed on the component mounting region 21a. One end portions of the first wiring pattern 25 a and the second wiring pattern 25 b extending to the component mounting region 21 a also serve as a part of the component mounting pad 28.

As shown in FIGS. 5 and 9, etc., the substrate 21 of the light emitting module 15a is provided with a cross-section restricting portion, for example, a hole 29. The hole 29 is disposed at a position between the component mounting area 21a and the board area E1 adjacent thereto. The component mounting area 21 a is formed extending in the width direction of the substrate 21. A plurality of holes 29 arranged in the width direction of the substrate 21 may be provided as the cross-section restricting portion.

The hole 29 defines the cross-sectional area of the portion along the width direction of the substrate 21 to be smaller than the cross-sectional area along the width direction of the portion other than the portion, that is, the component mounting region 21a and the substrate regions E1 to E5. . Specifically, the hole 29 is formed so that the cross-sectional area of the portion is 55% or more and 70% or less of the cross-sectional area along the width direction of the component mounting region 21a and the substrate regions E1 to E5.

The substrate 21 of the light emitting module 15d arranged at the other end of the light emitting module row has the same configuration as the substrate 21 of the light emitting module 15a except that it does not have the component mounting area 21a. The light emitting module 15d is manufactured by cutting out the part mounting region 21a using the hole 29 in the portion where the hole 29 of the light emitting module 15a is formed. As a result, the

light emitting modules

15a and 15d share the same parts, and thus the manufacturing cost can be reduced.

The two

light emitting modules

15b and 15c arranged between the

light emitting modules

15a and 15d have the same configuration. In this respect as well, the manufacturing cost can be reduced. These

light emitting modules

15b and 15c are longer than the

light emitting modules

15a and 15d. At the same time, the

light emitting modules

15b and 15c have, for example, one more board area E1 to E6 than the number of board areas of the

light emitting modules

15b and 15c (see FIG. 15).

For the protective member 41, for example, a white resist layer mainly composed of an electrically insulating synthetic resin can be suitably used. This white resist layer functions as a reflective layer having a high light reflectance. The protection member 41 is formed on the substrate 21 so as to cover most of the wiring pattern 25.

That is, as representatively shown in FIG. 9, the protection member 41 covers the wiring pattern 25 while leaving a plurality of positions of the second wiring pattern 25 b among the wiring patterns 25 as mounting pads 26. At the same time, the protection member 41 covers the wiring pattern 25 while leaving the leading end portions of the plurality of branches included in the first wiring pattern 25 a among the wiring patterns 25 as the conductive connection portions 27. Furthermore, the protection member 41 covers the wiring pattern 25 except for mounting locations for electrical components 55 to 59 described later.

Each mounting pad 26 and each conductive connection portion 27 are formed in a portion where the third layer T is exposed without being covered with the protective member 41 when the protective member 41 is formed on the substrate 21. As representatively shown in FIG. 9, the mounting pads 26 are arranged in the longitudinal direction of the substrate 21. Each conductive connection portion 27 is arranged in the vicinity of each mounting pad 26 in a pair with each mounting pad 26. Therefore, the respective conductive connection portions 27 are arranged in the longitudinal direction of the substrate 21 at the same arrangement pitch as that of the mounting pads 26.

The plurality of mounting pads 26 arranged in each substrate area form a pad row. The same number of mounting pads 26 as the conductive connection portions 27 have grooves 26a to 26d in at least one peripheral portion, for example, four locations, as shown in FIGS. The grooves 26a to 26b are separated from each other by 90 degrees. The depths of the grooves 26a to 26b are 1/10 to 1/5 of the pad diameter D1, which will be described later. Further, the peripheral edge of the mounting pad 26 has an edge portion 26e having an arc shape every 90 degrees. Each edge portion 26e is formed between the grooves 26a to 26d adjacent to each other in the circumferential direction of the mounting pad 26.

Since the mounting pad 26 has the grooves 26a to 26b and the edge 26e, the mounting pad 26 has a substantially clover shape. The groove 26a is larger than the other three grooves 26b to 26d, and the conductive connection portion 27 is disposed inside thereof. The mounting pad 26 is formed symmetrically with respect to a straight line L (shown by a one-dot chain line in FIG. 10) passing through the center and the conductive connection portion 27.

As described above, the mounting pad 26 having a substantially clover shape and the conductive connection portion 27 provided in the groove 26a can contribute to reducing the diameter D of the sealing member 54 described later. The pad diameter D1 of the mounting pad 26 is, for example, 3.6 mm. The pad diameter D1 is a dimension between the edge portions 26e positioned in pairs with the center of the mounting pad 26 as a boundary.

The protective member 41 is filled in each of the grooves 26a to 26b. The portion of the protection member 41 filled in the grooves 26a to 26b is referred to as a filling portion 42 (see FIGS. 7 and 11). Each filling portion 42 forms a convex portion that protrudes toward the center of the mounting pad 26. These filling portions 42 protrude from the surface of the third layer T in the stacking direction of the wiring pattern 25 (see FIG. 7). At least one of the filling portions 42 is used as a reference for determining the mounting position when a light emitting element 45 described later is mounted on the mounting pad 26. The filling portion 42 for the groove 26 a is filled in the groove 26 a avoiding the conductive connection portion 27.

The plurality of light emitting elements 45 are LED bare chips. For example, an LED bare chip that emits blue light is used as the bare chip. An LED bare chip has a light emitting layer on one surface of an element substrate made of sapphire and has a rectangular planar shape. As shown in FIG. 11, an electrode 45b forming an anode and an electrode 45a forming a cathode are provided in the light emitting layer side by side, for example, in the longitudinal direction of an LED bare chip.

These light emitting elements 45 have the other surface of the element substrate opposite to the one surface fixed to a mounting pad 26 which is a reflective surface using an adhesive 46 (see FIGS. 7 and 8). In this case, each light emitting element 45 is bonded on the mounting pad 26 such that the alignment of the

electrodes

45 a and 45 b is aligned with the

grooves

26 a and 26 c of the mounting pad 26. The light emitting elements 45 thus mounted on the mounting pads 26 form a light emitting element array arranged in the longitudinal direction of the substrate 21 (the direction in which the central axis extends). In this row, the arrangement pitch of the light emitting elements 45 is not less than 5 mm and not more than 9 mm.

It is preferable that the bonding portion of the light emitting element 45 is the central portion of the mounting pad 26. As a result, the light emitted from the light emitting element 45 and incident on the mounting pad 26 can be reflected in the reflective surface area around the light emitting element 45.

In this case, the light incident on the mounting pad 26 becomes stronger as it approaches the light emitting element 45, and this strong light can be reflected by the reflection surface region. The grooves 26a to 26d are out of the reflective surface area that reflects the strong light. For this reason, the area of the surface (reflection surface) of the mounting pad 26 is reduced by the grooves 26a to 26d in the peripheral portion of the mounting pad 26. However, this substantially reduces the reflection performance of the mounting pad 26. It can be ignored.

Since light emission of the light emitting element 45 composed of a bare LED chip is realized by passing a forward current through a pn junction of a semiconductor, the light emitting element 45 is a solid element that directly converts electric energy into light. The light emitting element 45 that emits light by such a light emission principle has an energy saving effect as compared with an incandescent bulb that incandescents a filament to a high temperature by energization and emits visible light by its thermal radiation.

The adhesive 46 preferably has heat resistance in order to obtain adhesion durability, and further has translucency so that reflection can be performed directly under the light emitting element 45. As such an adhesive 46, a silicone resin adhesive can be suitably used.

The first wire 51 and the second wire 52 are made of fine metal wires, for example, gold fine wires, and are wired using a bonding machine.

As shown in FIG. 7, the first wire 51 is provided by electrically connecting the light emitting element 45 and the conductive connection portion 27 of the first wiring pattern 25a. In this case, one end 51 a of the first wire 51 is connected to the electrode 45 a of the light emitting element 45 by first bonding. The other end portion 51 b of the first wire 51 is connected to the conductive connection portion 27 by the second bonding.

One end 51 a of the first wire 51 protrudes in the direction away from the light emitting element 45 in the thickness direction of the light emitting element 45. The conductive connection portion 27 is closer to the substrate 21 than the

electrodes

45 a and 45 b of the light emitting element 45 with respect to the thickness direction of the light emitting element 45. The other end portion 51 b of the first wire 51 is connected to the conductive connection portion 27 at an angle.

The intermediate part 51c of the first wire 51 is a part occupying between the one end part 51a and the other end part 51b. As shown in FIG. 7, the intermediate portion 51 c is formed so as to bend from the one end portion 51 a and be parallel to the light emitting element 45. The protrusion height h of the intermediate portion 51c with respect to the light emitting element 45 is defined as 75 μm or more and 125 μm or less, preferably 60 μm or more and 100 μm or less. As a result, the wire-bonded first wire 51 is wired while maintaining a low height with respect to the light emitting element 45 (this wiring structure is referred to as a low-profile wiring loop in this specification).

Note that the fact that the intermediate portion 51 c of the first wire 51 is bent from the one end portion 51 a so as to be parallel to the light emitting element 45 includes that the intermediate portion 51 c is parallel to the light emitting element 45. . However, in reality, the intermediate portion 51 c may not be completely parallel to the light emitting element 45 due to manufacturing variations. Such variations are also included in the scope of the phrase “to be parallel”. For this reason, it can be paraphrased that the intermediate portion 51 c of the first wire 51 is substantially parallel to the light emitting element 45. Therefore, an aspect in which the intermediate portion 51c of the first wire 51 is obliquely bent from the one end portion 51a and the angle between the one end portion 51a and the intermediate portion 51c is an acute angle is out of the scope of the wording. It is.

The intermediate portion 51c and the other end portion 51b of the first wire 51 wired as described above extend in a direction orthogonal to the direction in which the light emitting elements 45 form a row. Such wiring is realized by the above-described arrangement of the light emitting element 45 with respect to the mounting pad 26. With this wiring, the length of the first wire 51 can be shortened. For this reason, the cost of the 1st wire 51 can be reduced compared with the case where the 1st wire 51 is wired diagonally with respect to a light emitting element in planar view.

The second wire 52 is provided by connecting the light emitting element 45 and the mounting pad 26 formed of a part of the first wiring pattern 25a by wire bonding. In this case, one end of the second wire 52 is connected to the electrode 45b of the light emitting element 45 by first bonding. The other end of the second wire 52 is connected to the mounting pad 26 by second bonding.

Therefore, the plurality of light emitting elements 45 mounted in the mounting region 31a provided in each substrate region E1 to E5 or E1 to E6 of each light emitting module 15 are electrically connected in parallel to each other. In addition, the light emitting element groups connected in parallel as described above are electrically connected in series.

Specifically, for the

light emitting modules

15a and 15d, four light emitting element groups in which eight light emitting elements 45 are connected in parallel and one light emitting element in which nine light emitting elements 45 are connected in parallel. Groups are connected in series. Regarding the

light emitting modules

15b and 15c, six light emitting element groups in which eight light emitting elements 45 are connected in parallel are connected in series. This circuit configuration is shown in FIG.

The sealing member 54 is formed by mixing an appropriate amount of a phosphor 54b and a filler 54c with a resin 54a as a main component, as schematically shown in FIG.

The resin 54a may be any thermoplastic resin having translucency. For example, a resin silicone resin is preferably used for the resin 54a. Since the resin-based silicone resin has a three-dimensionally crosslinked structure, the phosphor 54b that is harder than the translucent silicone rubber is excited by the light emitted from the light emitting element 45, and the light emitting element 45 emits. It emits light of a color different from the color of light. In Example 1, since the light emitting element 45 emits blue light, a yellow phosphor that emits yellow light having a complementary color relationship to the blue light by the excitation is used. Thereby, white light can be emitted as output light of the lamp 11 which is a light emitting device.

The sealing member 54 is formed on the substrate 21 by sealing the mounting pad 26, the conductive connection portion 27, the light emitting element 45, the first wire 51, and the second wire 52. The sealing member 54 is formed by being dripped over the light emitting element 45 in an uncured state, and then cured by heat treatment. A dispenser or the like is used for dropping (potting) the sealing member 54.

The cured sealing members 54 are arranged on the substrate 21 at predetermined intervals in the longitudinal direction of the substrate 21, and are arranged in a sealing member row according to the row of the light emitting elements 45. The cured sealing member 54 has a dome shape or a Mt. Fuji shape.

The diameter D (see FIG. 7) of the sealing member 54 is defined as 1.0 to 1.4 times the pad diameter D1, and in the case of Example 1, the diameter D is 4.0 mm to 5.0 mm. Thereby, a part of the mounting pad 26 does not protrude from the sealing member 54. At the same time, the number of sealing members 54 is not excessive with respect to the mounting pad 26, and the amount of the sealing member 54 used can be made appropriate while maintaining the aspect ratio described later. There is no frame or the like surrounding the light emitting element 45 or the like in order to define the height H and diameter D of the sealing member 54. Therefore, the diameter D and height H of the sealing member 54 are controlled by the amount of dripping of the sealing member 54, the hardness, and the time until it is cured.

The height H of the sealing member 54 with respect to the light emitting element 45 is 1.0 mm or more. In order to ensure the height H of 1.0 mm or more, the aspect ratio of the sealing member 54 is set to 0.22 to 1.00. Here, the aspect ratio of the sealing member 54 is a ratio (H / D) of the diameter D of the sealing member 54 to the height H of the sealing member 54 with respect to the light emitting element 45.

Furthermore, the ratio of the orthogonal diameters of the sealing member 54 is 0.55 to 1.00. Here, the ratio of the orthogonal diameters refers to the ratio of the diameters X and Y orthogonal to each other on the bottom surface of the sealing member 54 bonded to the substrate 21 as shown in FIG. The diameter X is a diameter of the bottom surface arbitrarily drawn through the center of the light emitting element 45. The diameter Y is the diameter of the bottom surface drawn perpendicular to the diameter X.

The electrical component 55 shown in any of FIGS. 4 to 6 is a capacitor. The electrical component 56 is a connector. The electrical component 57 is a rectifying diode. The electrical component 58 is a resistor. The electrical component 59 is an input connector. The

electric parts

57 and 58 generate heat when energized.

The electrical component 55 made of a capacitor is mounted on each of the four light emitting modules 15. This capacitor is electrically connected in parallel as shown in FIG. 17 to each of the light emitting element groups connected in parallel on the mounting region 31a of the first wiring pattern 25a.

The electrical component 55 arranged in this manner functions as a bypass element that bypasses the noise superimposed on the wiring pattern 25 of each light emitting module 15 to the light emitting element group. Thereby, the superimposition of noise on the light emitting element group is suppressed. Accordingly, it is possible to prevent the lamp 11 from being lit darkly due to noise flowing into the light emitting element 45 in a state where the power is turned off by the switch SW shown in FIG.

As shown in FIG. 3, the electrical component 56 formed of a connector is mounted only on one end of the

light emitting modules

15a and 15d disposed at both ends in the longitudinal direction of the light emitting module row. Further, as shown in FIG. 15, the electrical component 56 is mounted at both ends in the longitudinal direction of the

light emitting modules

15 b and 15 c disposed between the

light emitting modules

15 a and 15 d. These electrical components 56 are connected to the terminal portion of the first wiring pattern 25a and the terminal portion of the second wiring pattern 25b (see FIG. 14).

At the same time, the electrical components 56 of the adjacent light emitting modules 15 are connected to each other by an unillustrated electric wire. With such connection, the light emitting modules 15 are electrically connected in series.

As shown in FIG. 5, the electrical components 57 to 59 are all mounted in the component mounting area 21a of the light emitting module 15a. An electrical component 59 composed of an input connector is connected to the wiring pattern 25 of the light emitting module 15a. Electric wires (not shown) connected to the electrical component 59 are respectively connected to the lamp pins 16a of the first base 13a disposed closer to the electrical component 59.

When the switch SW is turned on in a state where both ends of the straight tube lamp 11 having the above structure are supported by the

sockets

4 a and 4 b of the lighting fixture 1, the first cap of the lamp 11 is connected via the lighting device 3. Power is supplied to 13a from the first socket 4a. By this power supply, the light emitting elements 45 emit light all at once, and accordingly, the white light emitted from the sealing member 54 is diffused by the pipe 12 and transmitted through the pipe 12 to be emitted to the outside. Thereby, the space below the lamp 11 is illuminated. At the same time, part of the white light emitted from the pipe 12 is reflected by the side plate portion 5 b of the reflecting member 5 to illuminate the space above the lamp 11.

In the lamp 11, among the plurality of light emitting modules 15a to 15d accommodated in the pipe 12, the plurality of light emitting elements 45 are as follows with respect to the substrate 21 of the

light emitting modules

15a and 15d adjacent to the

bases

13a and 13b. It is arranged. That is, the same number of light emitting elements 45 are not mounted on each of the plurality of substrate regions E1 to E5 of the substrate 21, but the light emitting elements 45 mounted on the substrate region E1 closest to the

bases

13a and 13b. Is greater than the number of light emitting elements 45 mounted on each of the other substrate regions E2 to E5.

As a result, in the lamp of the first embodiment, the end of the pipe 12 positioned closest to the

caps

13a and 13b is light-emitting mounted on the substrate region E1 positioned closest to the

caps

13a and 13b of the light-emitting

modules

15a and 15d. Illuminated according to the number of elements. At this time, the light emitting elements 45 constituting the light emitting element group are connected in parallel, and the number of light emitting elements mounted on the substrate area E1 closest to the

caps

13a and 13b of the

light emitting modules

15a and 15d is the other substrate area. More than the number of light emitting elements mounted on E2 to E5, etc.

For this reason, the brightness of the light emitting element group mounted on the substrate region E1 is relatively lower than the brightness of the light emitting element groups mounted on the other substrate regions E2 to E5. As a result, the end of the pipe 12 becomes relatively dark compared to the middle of the pipe 12. However, this does not give a sense of incongruity as the lamp because the lamp 1 of the first embodiment is a replacement for the fluorescent lamp.

Furthermore, both ends of the pipe 12 positioned closest to the

caps

13a and 13b are illuminated by the plurality of light emitting elements 45 mounted on the substrate region E1 positioned closest to the

caps

13a and 13b of the

light emitting modules

15a and 15d. The amount of light that illuminates the end of the pipe 12 increases as compared with the amount of light emitted by the plurality of light emitting elements 45 respectively mounted on the substrate regions E2 to E5. Thereby, the edge part of the pipe 12 becomes bright, and the difference between this edge part and the brightness of a pipe part other than that becomes small.

In this case, the plurality of light emitting elements 45 mounted on the substrate region E1 are connected in parallel. As a result, the voltage applied to each light emitting element 45 mounted on the substrate region E1 decreases, and the light emission luminance of each light emitting element 45 decreases.

However, as described above, since the number of light emitting elements 45 mounted on the substrate region E1 is one more than the number of light emitting elements mounted on E2 to E5, the pipes are not significantly affected by the decrease in light emission luminance. It was found that the brightness at the end of 12 can be sufficiently improved.

Incidentally, the results of performing the lighting test by changing the number of the light emitting elements 45 mounted on the substrate region E1 to 8, 9, and 10 will be described below.

When the number of the light emitting elements 45 was 8, the brightness of the end of the pipe was relatively satisfactory, but there was a tendency that each light emitting element 45 became a bright spot and reflected on the pipe 12. . Therefore, it was determined as “bad” as the overall evaluation.

When there are ten light emitting elements 45, there is a limit to the space for arranging these light emitting elements, so that the interval between adjacent light emitting elements can be reduced. For this reason, as a way of seeing the pipe end, each light emitting element 45 becomes a bright spot and does not appear in the pipe 12, but there is a tendency that the brightness of the pipe end cannot be sufficiently obtained. Therefore, it was determined as “bad” as the overall evaluation.

On the other hand, when the number of the light emitting elements 45 is nine, as the appearance of the pipe end portions, in addition to the fact that each light emitting element 45 becomes a bright spot and does not appear in the pipe 12, the brightness of the pipe end portions Was fully obtained. Therefore, it was determined as “good” as the overall evaluation.

Therefore, it is suppressed that the both ends of the pipe 12 become conspicuously dark with respect to other pipe portions. Along with this, giving a sense of incongruity regarding the brightness of the entire pipe 12 covering the light emitting element 45 is alleviated. Therefore, it is possible to optimize the brightness of both end portions and the intermediate portion of the pipe 12.

The lamp 11 includes a number of light emitting elements 45 arranged in a row in the longitudinal direction. It can be considered that the used light emitting element 45 rarely contains defective products after the lamp is used. Furthermore, there is a possibility that a connection failure between the light emitting element 45 and the first wire 51 and the second wire 52 connected thereto may occur after using the lamp due to, for example, a bonding failure. In such a case, power supply to the light emitting element 45 related to poor connection or the like is stopped, so that the light emitting element 45 cannot emit light.

However, as described above, the plurality of light emitting elements 45 constituting the light emitting element group are electrically connected in parallel and mounted on each of the substrate regions E1 to E6. Therefore, even if one light emitting element 45 cannot emit light due to disconnection or the like, the emission of the entire light emitting element group including the light emitting elements whose light emission has been stopped is not stopped, and the light emission of some of the light emitting elements 45 is stopped. The conspicuous stop is suppressed. At the same time, since the light emitting element groups of the substrate regions E1 to E6 are electrically connected in series, the light emission of the entire lamp 11 does not stop.

That is, even when power cannot be supplied to some of the light emitting elements 45, it is possible to keep the lamps 11 lit so that the light output of the straight tube lamps 11 is not greatly reduced.

Among the plurality of light emitting modules 15a to 15d provided in the lamp 11, the light emitting module 15a is disposed closest to the first base 13a that carries power. The substrate 21 included in the light emitting module 15a has a component mounting region 21a, and

electrical components

57 and 58 that generate heat upon energization are mounted on the component mounting region 21a. In both cases, a hole 29 is formed in a portion between the substrate region E1 of the substrate 21 and the component mounting region 21a of the light emitting module 15a. Due to the holes 29, the cross-sectional area along the width direction of the substrate 21 at the portion is smaller than the cross-sectional areas along the width direction of the substrate 21 in the substrate regions E1 to E5 and the component mounting region 21a.

For this reason, coupled with the relatively low thermal conductivity of the resin substrate 21, the heat generated by the

electrical components

27 and 28 during the lighting of the lamp 11 spreads to the substrate region E1 adjacent to the component mounting region 21a. It is suppressed. Therefore, the temperature rise of the light emitting element 45 mounted on the substrate region E1 is suppressed.

This was confirmed by the following comparative test.

In a comparative example in which the length of the substrate 21 without the holes 29 is 300 mm and the width is 20 mm, the lamp is turned on, and the operating temperature of the light emitting element 45 mounted on the substrate region E1 is measured. The measurement temperature in this comparative example was 106 ° C.

In contrast, the above-described substrate using the substrate having the same size as the substrate of the comparative example and having the hole 29 so that the cross-sectional area of the portion where the hole 29 is provided is 60% of the cross-sectional area of the substrate 21. In Example 1, the operating temperature of the light emitting element 45 at the same position as in the comparative example was measured. The measurement temperature in Example 1 was 100 ° C.

Thus, the operating temperature of the light emitting element 45 mounted on the substrate region E1 of the substrate 21 can be lowered by the hole 29 provided in the substrate 21 of the light emitting module 15a. Thereby, it is possible to suppress a decrease in light emission efficiency and luminous flux maintenance factor of the light emitting element 45.

The straight tube lamp 11 having the above-described configuration has a configuration in which the light emitting module 15 is electrically insulated by a pipe 12 that accommodates the light emitting module 15. At the same time, the wiring pattern 25 of the light emitting module 15 is electrically connected only to the two lamp pins 16a of the first base 13a on the power supply side. On the other hand, the lamp pin 16b and the wiring pattern 25 included in the second base 13b are in a non-conductive state and are not electrically connected.

Thus, the lamp 11 is not grounded in a state where it is supported by the

sockets

4a and 4b that make a pair of the apparatus main body 2. For this reason, stray capacitance is not generated between the apparatus main body 2 and the wiring pattern 25 included in the light emitting module 15 in the pipe 12.

Therefore, when the switch SW is turned off and the lamp 11 is turned off, a minute current due to stray capacitance does not flow to the light emitting element 45 of the light emitting module 15. For this reason, erroneous lighting (dark lighting) of the lamp 11 is prevented.

That is, according to the straight tube lamp 11 of the first embodiment, it is possible to expect an effect that it is possible to prevent dark lighting in a state where the power is turned off.

Furthermore, wiring for electrically connecting the wiring pattern 25 and the lamp pin 16b of the second base 13b is not necessary. Accordingly, it is not necessary to form the pattern portion that bears the wiring on the substrate 21 as a part of the wiring pattern 25. For this reason, formation of the wiring pattern 25 with respect to the board | substrate 21 is easy, and the cost for forming the wiring pattern 25 can be reduced in connection with it. At the same time, an electric wire, a connector, and the like extending between the pattern portion and the lamp pin 16b of the second base 13b are not necessary. In this respect, the cost can be reduced.

Moreover, by using the lamp 11 described above, no problem occurs even if the apparatus main body 2 is provided in a non-grounded state. Along with this, ground wiring is unnecessary, which is advantageous in installing the lighting fixture 1. Furthermore, by using the lamp 11 described above, it is not necessary to connect the power supply wire to the second socket 4b that supports the second base 13b. Thereby, the number of the electric wires wired in the apparatus main body 2 decreases. In this respect, the cost can be reduced.

Further, the mounting pad 26 of the light emitting module 15 provided in the lamp 11 is formed with a part of the wiring pattern 25 made of silver. Thereby, each mounting pad 26 on which each of the light emitting elements 45 is mounted functions as a light reflecting surface.

At the same time, the sealing member 54 in which the mounting pad 26, the light emitting element 45, the conductive connection portion 27, the first wire 51 and the like are filled and sealed is formed of a resin-based silicone resin. The resin-based silicone resin has a three-dimensional cross-linking structure. For this reason, compared with silicone oil and silicone rubber, the performance of gas such as oxygen and water vapor is low.

Thus, the mounting pad 26 which is a silver reflection layer is sealed with a resin-based silicone resin having low gas permeability. Thereby, the deterioration of the reflection performance due to the discoloration of the mounting pad 26 caused by the gas in the atmosphere or the gas generated from the resin substrate 21 being transmitted through the sealing member 54 is suppressed. Therefore, the luminous flux maintenance factor can be improved. By the way, the luminous flux maintenance factor of the straight tube type LED lamp provided conventionally is about 70% in 40,000 hours. In comparison with this, it was confirmed by the inventor's test that the lamp 11 of Example 1 can improve the luminous flux maintenance factor to 94% in 40,000 hours.

Incidentally, each time the lamp 11 is repeatedly turned on and off, the sealing member 54 expands and contracts. Along with this, stress is applied to the first wire 51 embedded in the sealing member 54. On the other hand, resin-based silicone resins have higher hardness than silicone rubber. If the hardness of the sealing member 54 is high, the stress applied to the first wire 51 increases as the protrusion height h of the first wire 51 with respect to the light emitting element 45 increases.

However, the first wire 51 is wired in a low-profile wiring loop. That is, the intermediate portion 51 c of the first wire 51 is formed to be bent from one end portion 51 a of the first wire 51 connected to the light emitting element 45 and to be parallel to the light emitting element 45. At the same time, the protrusion height h of the intermediate portion 51c with respect to the light emitting element 45 is not less than 75 μm and not more than 125 μm. As described above, the first wire 51 extending between the light emitting element 45 and the conductive connection portion 27 is wired with the height thereof being defined low.

Thereby, it is possible to reduce the stress applied to the first wire 51 as the sealing member 54 expands and contracts. For this reason, it is suppressed that the 1st wire 51 is cut | disconnected by the connection part of the one end part 51a of the 1st wire 51 and the light emitting element 45 by the heat cycle based on lighting / extinguishing of the lamp | ramp 11. FIG. Even if the wire breaks, the light output of the lamp 11 does not drop significantly as described above.

As described above, according to the lamp 11 of Example 1, it is possible to improve the luminous flux maintenance factor while suppressing the disconnection of the first wire 51 connected to the light emitting element 45.

Furthermore, the phosphor 54b is mixed in the sealing member 54 provided in the lamp 11 of the first embodiment. At the same time, the aspect ratio (H / D) representing the relationship between the height H of the sealing member 54 with respect to the light emitting element 45 and the diameter D of the sealing member 54 is defined as 0.22 to 1.00. By defining the aspect ratio, it is possible to secure a distance of 1 mm or more from the light emitting element 45 to each position on the surface of the sealing member 54.

Thereby, the color difference in the angle is suppressed, and the color unevenness of the pipe 12 illuminated by the light emitted from the sealing member 54 and the side plate portion 5b of the reflecting member 5 illuminated by the light transmitted through the pipe 12 is uneven. It can be suppressed. In other words, it is possible to suppress a conspicuous mixture of a region in which the emission color of the light emitting element 45 is strong and shining with blueness and a region in which the emitted light from the phosphor 54b is strong and shining with yellowishness.

Moreover, in Example 1, since the filler 54c is mixed with the sealing member 54, the hardness after the formation of the sealing member 54 is specified as 54 to 94 in Shore hardness. Thereby, it is possible to suppress the angular color difference.

That is, when the sealing member 54 contains the filler 54c, the Shore hardness of the sealing member 54 is in the range of (74 ± 20). Thereby, the thixotropy in the uncured state of the sealing member 54 provided by potting is improved. For this reason, it is suppressed that the potting sealing member spreads until it is heated and cured thereafter, and the height H is lowered.

Therefore, the predetermined aspect ratio (H / D) described above is secured, and the distance from the light emitting element 45 to each position on the surface of the sealing member 54 can be secured 1 mm or more.

In contrast, if the filler 54c is not mixed, the thixotropy is lowered. Along with this, the sealing member 54 easily spreads until it is cured, and the height of the sealing member 54 is lowered. Therefore, it is difficult to secure a distance of 1 mm or more from the light emitting element 45 to each position on the surface of the sealing member 54. Moreover, when the content rate of the filler 54c is too high, the fluidity | liquidity of an uncured sealing member will fall from a regulation value. For this reason, an appropriate amount of potting becomes difficult, and the possibility of causing a potting failure increases.

Furthermore, grooves 26a to 26d are formed in the peripheral portion of the mounting pad 26 provided in the lamp 11 of the first embodiment, and the filling portion 42 of the protective member 41 filled in these grooves 26a to 26d is sealed. The sealing member 54 is covered and bonded to the sealing member 54.

In Example 1, the adhesion between the silicone resin sealing member 54 and the silver surface of the mounting pad 26 covered with the sealing member 54 is inferior to the adhesion between the resins. Therefore, when the diameter D of the sealing member 54 is reduced, the possibility that the sealing member 54 is peeled off from the substrate 21 is increased.

However, as described above, the filling portion 42 of the protective member 41 into the grooves 26a to 26d of the mounting pad 26 is bonded to the sealing member 54. Thereby, the holding | maintenance performance with respect to the board | substrate 21 of the sealing member 54 which sealed the mounting pad 26 grade | etc., Is improved. Therefore, even when the mounting pad 26 is reduced in diameter, peeling of the mounting pad 26 is suppressed. For this reason, the usage-amount of the sealing member 54 can be reduced. In addition, for example, it is suitable for increasing the arrangement density of the mounting pads 26 and the light emitting elements 45.

Furthermore, in Example 1, the resin-made pipe 12 having the diffuse translucency that accommodates the light emitting module 15 diffuses the light emitted from the light emitting module 15 and emits it as illumination light to the outside. The light transmittance of the pipe 12 is 85% or less, and the arrangement pitch of the light emitting elements 45 is 5 mm or more and 9 mm or less.

When the light transmittance of the pipe 12 exceeds 85% and the light transmittance is increased, the tendency that the plurality of light emitting elements 45 arranged in the longitudinal direction of the substrate 21 become bright spots and appear in the pipe 12 increases. When the arrangement pitch of the light emitting elements 45 is less than 5 mm, the light emitting elements 45 are arranged with high density along the longitudinal direction of the substrate 21. On the contrary, when the arrangement pitch of the light emitting elements 45 exceeds 9 mm, the light emitting elements 45 are arranged in a low density along the longitudinal direction of the substrate 21 accordingly, and the tendency of the reflection is increased.

Therefore, in the first embodiment in which the diffusion light transmittance of the pipe 12 and the arrangement pitch of the light emitting elements 45 are defined as described above, it is low cost that a plurality of light emitting elements 45 become bright spots and appear in the pipe 12. Can be suppressed. At the same time, the pipe 12 can be illuminated with a substantially uniform brightness.

Claims

A pipe formed of a translucent material;
A base attached to the end of this pipe;
A substrate having a plurality of substrate regions and formed long in the direction in which the pipe extends, and a plurality of semiconductor light emitting elements mounted in the substrate region in the longitudinal direction of the substrate, A plurality of light emitting modules housed in the pipe in which the light emitting element groups are arranged in a direction in which the pipe extends;
Comprising
The number of elements of the light emitting element group mounted on the substrate area closest to the base is different from the number of elements of the light emitting element group mounted on the substrate area other than the substrate area closest to the base. Lamp.
2. The lamp according to claim 1, wherein the number of elements of the plurality of light emitting element groups mounted on the substrate region at a position closest to the base is mounted on the substrate region other than the substrate region at a position closest to the base. More than the number of elements in the plurality of light emitting element groups.
2. The lamp according to claim 1, wherein the light emitting elements in each of the substrate regions are electrically connected in parallel, and the light emitting element groups are electrically connected in series.
The lamp according to claim 1, wherein the substrate of the light emitting module closest to the one of the caps that bears power supply among the light emitting modules is made of resin, and the substrate further includes a component mounting region, An electrical component that generates heat upon energization is mounted in the component mounting region, and a cross-sectional area along the width direction of the substrate at the portion is located between the component mounting region and the board region adjacent to the component mounting region. A cross-section restricting portion is formed to further reduce the cross-sectional area along the width direction of the board in the board area and the component mounting area.
5. The lamp according to claim 4, wherein a cross-sectional area of the portion along the width direction of the substrate is 55% or more and 70% of a cross-sectional area of the substrate region and the component mounting region along the width direction of the substrate.
5. The lamp according to claim 4, wherein the cross-section restricting portion is formed by a hole extending in the width direction of the substrate.
The device body;
A lighting device that is attached to the device body and outputs direct current:
A first socket attached to the device body and supplied with the output of the lighting device;
A second socket attached to the device body in a non-conductive state with the lighting device and paired with the first socket;
A straight tube lamp removably supported by these first and second sockets;
A lighting device comprising:
The lamp
A pipe formed of a translucent material;
A base attached to the end of this pipe;
A substrate having a plurality of substrate regions and formed long in the direction in which the pipe extends, and a plurality of semiconductor light emitting elements mounted in the substrate region in the longitudinal direction of the substrate, A plurality of light emitting modules housed in the pipe in which the light emitting element groups are arranged in a direction in which the pipe extends;
Comprising
The number of elements of the light emitting element group mounted on the mounting area closest to the base is different from the number of elements of the light emitting element group mounted on the substrate area other than the mounting area closest to the base. Yes.