WO2013017372A1 - Structure comprising a plurality of optoelectronic modules - Google Patents

Structure comprising a plurality of optoelectronic modules Download PDF

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Publication number
WO2013017372A1
WO2013017372A1 PCT/EP2012/063166 EP2012063166W WO2013017372A1 WO 2013017372 A1 WO2013017372 A1 WO 2013017372A1 EP 2012063166 W EP2012063166 W EP 2012063166W WO 2013017372 A1 WO2013017372 A1 WO 2013017372A1
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WO
WIPO (PCT)
Prior art keywords
layer
optoelectronic
module
support substrate
optoelectronic modules
Prior art date
Application number
PCT/EP2012/063166
Other languages
French (fr)
Inventor
Benoit Domercq
Antoine Luijkx
Original Assignee
Agc Glass Europe
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Publication date
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Publication of WO2013017372A1 publication Critical patent/WO2013017372A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Definitions

  • the field of the invention is that of structures, more particularly light structures, comprising a plurality of optoelectronic modules. More specifically, the invention relates to a structure comprising a plurality of optoelectronic modules, said modules being interconnected electrically with each other by an encapsulation means.
  • optical modules organic electroluminescent devices known by the acronym OLED (organic light emitting device), light collecting devices such as organic photovoltaic cells known by the acronym OPV (Organic Photovoltaics), organic thin film transistors known by the acronym OTFT (organic thin-film transistor) or solar cells Grâzel also called photosensitive pigment cells known by the acronym DSSC (Dye Sensitized Solar Cells), preferably, is meant to designate organic electroluminescent devices.
  • OLED organic light emitting device
  • OPV Organic Photovoltaic cells
  • OTFT organic thin film transistor
  • DSSC Dynamic Sensitized Solar Cells
  • an organic electroluminescent device is in the form of a transparent substrate on which are deposited successively a transparent conductive layer acting as anode, a stack of organic layers, a metal cathode and a glass cover or encapsulation glass.
  • Organic electroluminescent devices are known for their theoretical potential to provide low power lighting solutions electric, said solutions preferably having a large surface area and having freely selectable shapes.
  • OLEDs organic electroluminescent devices
  • One of the major technological obstacles consists in producing light sources having a large surface so as to obtain a sufficient amount of light (or luminous flux).
  • the difficulties encountered in producing such sources lie in the uniformity of organic deposits over large areas and in the availability, at reasonable cost, of industrial equipment of sufficient size to obtain such deposits and also in the resistance of the transparent conductive layer (for example the anode) which induces ohmic losses all the more important as one moves away from the current supply connectors.
  • a solution commonly used to solve the problem of ohmic losses is the addition of fine conductive metal grids, however said metal grids have the drawback of being visible and thereby depreciate the aesthetics of the light sources using them.
  • a conventionally used solution consists in producing structures comprising a plurality of small size electroluminescent organic devices and assembling them on a support substrate such as a glass substrate.
  • the different modules can be interconnected with one another using a conductive transparent layer.
  • This solution has two disadvantages.
  • the first disadvantage lies in mechanical problems related to the use of three substrates, at least two of which are transparent, said substrates notably being glass-forming: a support substrate in plate form serving as a base on which all the optoelectronic modules are deposited and level of each individual module: a substrate specific to said module on which the anode, the electroluminescent layers and the cathode are deposited and a protective or encapsulating cover substrate for protecting the electroluminescent layers of the external environment.
  • the invention particularly aims to overcome these disadvantages of the prior art.
  • an objective of the invention in at least one of its embodiments, is to provide a structure comprising a plurality of optoelectronic modules that is robust and aesthetically pleasing.
  • the invention in at least one of its embodiments, still aims to provide a structure comprising a plurality of optoelectronic modules comprising at least organic electroluminescent devices which is a light source having a large surface so as to obtain a amount of light (or luminous flux) sufficient.
  • Another object of the invention in at least one of its embodiments, is to implement a method of manufacturing the entire structure which is simple and during which the formation of the connections between the carrier substrate of the all of the modules and the carrier substrate of the individual optoelectronic module is easy.
  • an object of the invention is also to provide a method of repairing said structure.
  • the invention relates to a structure consisting of a plurality of individual optoelectronic modules sensitive to water and / or moisture.
  • said individual modules comprise, consist essentially, successively a substrate specific to each individual module, said substrate being preferentially transparent, a first electrode, a light-emitting, photoactive or electro-active layer, preferentially electroluminescent, a second electrode and said modules are devoid of individual encapsulation means over most of the surface of the second electrode
  • said structure comprising means for encapsulating the plurality of optoelectronic modules, said means comprising a support substrate in the form of transparent plate based on glass or polymer, preferably based on glass, and an electric conduction layer deposited on at least a portion of at least one face of the support substrate in the form of a transparent plate, said conduction layer being form of discontinuous areas, cha module being in electrical contact with two distinct adjacent discrete zones, said layer providing the power supply of said module by the face comprising the second electrode
  • the general principle of the invention is based on the suppression of the transparent protective cover and / or encapsulating, in particular glass, optoelectronic modules and in that the support substrate in the form of a transparent plate based on glass or polymer, preferably glass-based, performs the functions of electrical interconnection between the optoelectronic modules.
  • the invention is based on a completely new and inventive approach to reducing the number of substrates constituting the structure by the removal of the transparent substrate protective cover and / or encapsulation generally provided with a cavity and therefore fragile and facilitate the electrical interconnection of the optoelectronic modules, in particular between organic electroluminescent devices.
  • Said structure also makes it possible to obtain a light source having a large surface so as to obtain a sufficient quantity of light (or luminous flux) when it comprises a plurality of optoelectronic modules comprising, consisting essentially of organic electroluminescent devices or organic photovoltaic cells, said structure being obtained cheaply and easily.
  • substrate specific to each individual module is meant that the substrate is specific to each individual module taken separately.
  • transparent glass-based or polymer-based plate is meant that the plate consists of a material comprising at least 50% by weight of glass or polymer, preferably 100% by weight of glass or of polymer.
  • the structure consisting of a plurality of optoelectronic modules is such that it comprises only two substrates, the specific substrate, preferentially transparent, individual modules, and the support substrate in the form of a transparent plate based on of glass or polymer forming part of the encapsulating means of the plurality of optoelectronic modules.
  • the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of transparent base plate is based on glass.
  • the glass according to the invention can belong to various categories.
  • the glass may thus be a soda-lime type glass, a boron glass, a glass comprising one or more additives homogeneously distributed in its mass, such as, for example, at least one inorganic dye, an oxidizing compound, a viscosity regulating agent and / or a melt facilitating agent.
  • the glass of the invention is of the soda-lime type.
  • the glass of the invention may be a float glass, a drawn glass.
  • silica-lime glass is used here in its broad sense and refers to any glass that contains the following basic components (expressed as percentages by total weight of glass): Si0 2 60 to 75%
  • extra clear means a glass containing at most 0.020% by weight of total Fe glass expressed as Fe 2 O 3 and preferably not more than 0.015% by weight. The use of an extra clear type of glass makes it possible to obtain a higher energy and light transmission.
  • the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of a transparent plate is textured.
  • the support substrate in the form of a transparent plate is preferably a glass sheet, said sheet being printed or textured by roll or acid or alkaline chemical etching, that is to say which has a macroscopic relief, for example in the form of patterns of type pyramid or cone, the patterns may be convex (protruding from the general plane of the printed side) or concave (hollow in the mass of the glass).
  • the glass sheet is printed or textured on at least one of its faces.
  • Such a textured glass substrate combines the effect of allowing an increase in the opto energetic performance of said structure and, on the other hand, of providing protection for the modules with respect to oxygen and external moisture.
  • the structure consisting of a plurality of optoelectronic molds is such that the support substrate in the form of a transparent plate comprises a sol-gel-type antireflection layer, said layer being located on the face opposite to the face carrying the electrical conduction layer and / or between said transparent plate and the electrical conduction layer.
  • the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of a transparent plate with a thickness of between 1.0 mm and 5.0 mm, the inventors having determined that surprising such a range of thickness provides a good compromise between the strength of the structure, its weight and the insulation of the module vis-à-vis oxygen and external moisture.
  • the invention also relates to a structure consisting of a plurality of optoelectronic modules such that the electrical conduction layer comprises at least one layer based on at least one doped oxide and / or a layer based on silver.
  • the structure consisting of a plurality of optoelectronic modules is such that the electrical conduction layer comprises a set of dielectric layers disposed on either side of the silver-based layer.
  • the structure consisting of a plurality of optoelectronic modules is such that at least one dielectric layer is located between the silver layer and at least one optoelectronic module, said dielectric layer having a thickness less than the thickness of the dielectric layer (s) located between the silver-based layer and the transparent base plate.
  • the structure consisting of a plurality of optoelectronic modules is such that the dielectric layer located between the silver-based layer and at least one optoelectronic module is based on a conductive oxide.
  • the structure consisting of a plurality of optoelectronic modules is such that it comprises between the electrical conduction layer and the transparent layer, a so-called barrier layer for limiting the sodium ion diffusion from the second support substrate in the form of a transparent base plate.
  • the invention also relates to a structure consisting of a plurality of optoelectronic modules such as the electrical conduction layer are in the form of discrete adjacent discontinuous areas, especially in the form of parallel strips.
  • the structure consisting of a plurality of optoelectronic modules is such that each optoelectronic module comprises an encapsulation seal, said seal being an individual seal specific to the module.
  • the structure consisting of a plurality of optoelectronic modules is such that the plurality of modules comprises a common encapsulation joint.
  • An object of the invention also relates to a structure manufacturing method consisting of the plurality of optoelectronic modules.
  • the manufacturing method of the structure consisting of a plurality of optoelectronic modules according to the invention comprises the implementation of the following successive steps: the deposition of the conductive layer on the support substrate in the form of a transparent plate, followed by an etching of the said conductive layer, the production of the individual optoelectronic modules by deposition on a substrate specific to each module, preferably transparent, of a first electrode , at least one electroluminescent layer and a second electrode following these steps being able to be independent of one another, the individual optoelectronic modules are deposited on the support substrate in the form of a transparent plate covered with the layer conductive or conversely, the production of an encapsulation seal, said seal being based on glass, for example a paste or glass frit or a welding glass optionally rigidified by laser or polymer-based for example an adhesive, the making additional electrical contact (s) between the electrical
  • the step of carrying out the additional electrical contact (s) can optionally be followed by a so-called secondary encapsulation step by thin film deposition methods (such as, for example, ALD English Atomic layer deposition) in order to make the joint of the structure even more watertight.
  • thin film deposition methods such as, for example, ALD English Atomic layer deposition
  • Another object of the invention also relates to a method of repairing a structure consisting of a plurality of optoelectronic modules according to the invention, comprising the following steps: the detection of the defective optoelectronic module ⁇ the loosening of the optoelectronic module the positioning of the optoelectronic replacement module on the support substrate in the form of a transparent plate, said module being in electrical contact with two adjacent discrete discontinuous zones of the electrical conduction layer by the face comprising the second electrode, sealing of the replacement module on the support substrate in the form of a transparent plate by an individual encapsulation seal 5.
  • FIG. a conventional diagram representing the structure of the OLED, in which there is an encapsulating glass (1), a metal cathode (2), a stack of organic layers constituting the organic part of the OLED (3), an anode for example based on conductive oxide, generally made of ITO (mixed indium tin oxide) (4), a transparent substrate glass (5) specific to the individual OLED module and an encapsulation adhesive or frit (6), the arrow denoted L representing the direction of the emitted light.
  • FIG. a conventional diagram representing the structure of the OLED, in which there is an encapsulating glass (1), a metal cathode (2), a stack of organic layers constituting the organic part of the OLED (3), an anode for example based on conductive oxide, generally made of ITO (mixed indium tin oxide) (4), a transparent substrate glass (5) specific to the individual OLED module and an encapsulation adhesive or frit (6), the arrow denoted L representing the direction of the
  • FIG. 2 illustrates a conventional way of producing a large electroluminescent panel based on OLED modules, based on the report of complete OLED modules (7) (as shown in FIG. 1) on a plate-shaped support substrate (FIG. 10), in particular a glass plate, said plate being provided with connectors (9), and an etched conduction layer, the line 8 representing the etching of the conduction layer.
  • Figure 3 schematically illustrates an example of etching (8) of the conduction layer performed on the support substrate in the form of transparent plate (10).
  • FIG. 4 describes a conventional interconnection system of different modules (7) to each other by using a transparent conduction layer (4 '), for example of Sn0 2 : F or ITO type, which has undergone etching, for example laser-emitting type, and where the current leads are made at the end of the panel by connectors (9), for example tinned copper foils, said modules being deposited on a support substrate in the form of a plate (10) and connected to the transparent conduction layer of said plate by the conductive son (11), the arrows denoted L indicating the direction of the emitted light.
  • a transparent conduction layer (4 ') for example of Sn0 2 : F or ITO type, which has undergone etching, for example laser-emitting type, and where the current leads are made at the end of the panel by connectors (9), for example tinned copper foils, said modules being deposited on a support substrate in the form of a plate (10) and connected to the transparent conduction layer of said plate by the conductive son
  • FIGS. 5 and 6 describe connection means (11, 13) between the OLED module (7) and the support substrate in the form of a plate (10), said plate being coated with a transparent conduction layer, said connecting means being for example a conductive wire (11) (Fig.5) or a conductive adhesive (13) (Fig.6), the arrows denoted L indicating the direction of the emitted light.
  • FIG. 7 illustrates an embodiment of the structure comprising a plurality of electronic modules according to the invention, the optoelectronic modules being, for example, OLEDs modules, a support substrate in the form of a plate, a conduction layer. transparent (4 '), a conductive adhesive (13), an encapsulation seal (6) and a substrate, specific to the individual OLED module, covered by at least one conductive layer acting as an electrode, by a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counterelectrode (15).
  • the optoelectronic modules being, for example, OLEDs modules, a support substrate in the form of a plate, a conduction layer. transparent (4 '), a conductive adhesive (13), an encapsulation seal (6) and a substrate, specific to the individual OLED module, covered by at least one conductive layer acting as an electrode, by a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counter
  • FIG. 8 schematically illustrates an OLED module incorporated within the structure comprising a plurality of optoelectronic modules according to the invention before deposition on the support substrate in the form of a transparent plate, said module consisting of a glass substrate ( 5) specific to said module, an anode (4), a stack of organic layers (16) constituting the organic part of the OLED, a conductive adhesive (13), a metal cathode (2) , a seal for encapsulation in glue or frit (6).
  • FIG. 9 schematically represents an OLED module prior to its deposition on the support substrate in the form of a plate, said module comprising a substrate (5) specific to the individual OLED module, a conductive layer acting as anode (4) , a stack of organic layers constituting the organic part of the OLED (16), and a counter electrode (2).
  • FIG. 10 schematically represents one embodiment of the manufacturing method of the structure consisting of a plurality of optoelectronic modules according to the invention comprising the steps of laser etching of the support substrate in the form of a glass plate coated with a conductive transparent layer (1) deposited on a glass substrate specific to the individual module of the anode, the organic layers and the cathode constituting the OLED (2), depositing the OLED modules produced in step (2) on the support substrate etched in step (1), adding electrical connectors (4).
  • the structure according to the invention comprises a plurality of electronic modules, for example OLEDs modules, deposited on a plate-like support substrate (10) covered with a conductive transparent layer (4), said OLED modules (15) comprising a substrate specific to each individual module covered with a conductive layer, playing the role of anode for example, a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counter electrode said modules further comprising a conductive adhesive (13) and an encapsulation seal (6).
  • OLEDs modules deposited on a plate-like support substrate (10) covered with a conductive transparent layer (4)
  • said OLED modules (15) comprising a substrate specific to each individual module covered with a conductive layer, playing the role of anode for example, a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counter electrode said modules further comprising a conductive adhesive (13) and an encapsulation seal (6).
  • a structure comprising a plurality of optoelectronic modules according to the invention is obtained from a support substrate in the form of a glass plate, for example a Plannibel G type glass from AGC, said glass being a coated glass.
  • OLED modules for example 100 mm * 100 mm in size are made in a controlled atmosphere (clean room and oxygen-free) by deposition of an anode, a stack of organic layer and a cathode according to FIG. 9.
  • An encapsulation seal for example based on UV radiation crosslinkable adhesive as marketed by the firm Nagase, for example, is then produced around the organic part of these modules, while a dye-based adhesive Silver as marketed by the company Epotecny for example is deposited at the location of the electrical connections as shown in Figure 8.

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Abstract

The invention relates to a structure consisting of a plurality of individual optoelectronic modules (15) that are sensitive to water and/or moisture, said individual modules (15) successively comprising a preferably transparent first substrate specific to each individual module, a first electrode, an electroluminescent, photoactive or electroactive layer, preferably electroluminescent, and a second electrode. Said modules do not have individual encapsulation means over the majority of the surface of the second electrode, the structure comprising a means for encapsulating the plurality of optoelectronic modules, said means comprising a support substrate (10) in the form of a glass-based or polymer-based transparent plate, preferably glass-based, and an electrical conduction layer (4') deposited on at least a part of at least one face of the support substrate in the form of the transparent plate, said conduction layer having discontinuous zones, each module being in electrical contact (13) with two separate, adjacent discontinuous zones, said layer (4') ensuring the supply of electricity to said module via the face that comprises the second electrode.

Description

Structure comprenant une pluralité de modules optoélectroniques  Structure comprising a plurality of optoelectronic modules
1. Domaine de l'invention 1. Field of the invention
Le domaine de l'invention est celui des structures, plus particulièrement des structures lumineuses, comprenant une pluralité de modules opto électroniques . Plus précisément, l'invention concerne une structure comprenant une pluralité de modules optoélectroniques, lesdits modules étant interconnectés électriquement entre eux par un moyen d'encapsulation. The field of the invention is that of structures, more particularly light structures, comprising a plurality of optoelectronic modules. More specifically, the invention relates to a structure comprising a plurality of optoelectronic modules, said modules being interconnected electrically with each other by an encapsulation means.
Par les termes « modules optoélectroniques », on entend désigner des dispositifs organiques électroluminescents connus sous l'acronyme OLED (organic light emitting device), des dispositifs collecteurs de lumière tels que les cellules photovoltaïques organiques connues sous l'acronyme OPV (Organic Photovoltaïcs), des transistors organiques en couches minces connus sous l'acronyme OTFT (organic thin-film transistor) ou bien des cellules solaires Grâzel appelée également cellules à pigment photosensible connues sous l'acronyme DSSC (Dye Sensitized Solar Cells), préférentiellement, on entend désigner des dispositifs organiques électroluminescents. By the term "optoelectronic modules" is meant organic electroluminescent devices known by the acronym OLED (organic light emitting device), light collecting devices such as organic photovoltaic cells known by the acronym OPV (Organic Photovoltaics), organic thin film transistors known by the acronym OTFT (organic thin-film transistor) or solar cells Grâzel also called photosensitive pigment cells known by the acronym DSSC (Dye Sensitized Solar Cells), preferably, is meant to designate organic electroluminescent devices.
2. Solutions de l'art antérieur 2. Solutions of the prior art
D ans une structure classique , un dispo sitif organique électroluminescent se présente sous la forme d'un substrat transparent sur lequel sont déposés successivement une couche conductrice transparente faisant office d'anode, un empilement de couches organiques, une cathode métallique et un verre couvercle ou verre d'encapsulation. In a conventional structure, an organic electroluminescent device is in the form of a transparent substrate on which are deposited successively a transparent conductive layer acting as anode, a stack of organic layers, a metal cathode and a glass cover or encapsulation glass.
Les dispositifs organiques électroluminescents sont connus pour leur potentiel théorique à fournir des solutions d'éclairage à faible consommation électrique, lesdites solutions devant préférentiellement être de large surface et présenter des formes pouvant être librement choisies. Cependant, il existe plusieurs défis technologiques à résoudre afin de pouvoir utiliser les dispositifs organiques électroluminescents ou OLEDs dans des applications d'éclairage. L'un des obstacles technologiques majeurs consiste en la réalisation de sources de lumière ayant une grande surface de manière à obtenir une quantité de lumière (ou flux lumineux) suffisante. Les difficultés rencontrées dans la réalisation de telles sources résident dans l'uniformité des dépôts organiques sur de large surfaces ainsi que dans la disponibilité, à coût raisonnable, d'équipement industriels de taille suffisante permettant d'obtenir de tels dépôts et également dans la résistance de la couche conductrice transparente (par exemple l'anode) qui induit des pertes ohmiques d'autant plus importantes que l'on s'éloigne des connecteurs d'amenées de courant. Une solution couramment utilisée pour résoudre le problème de pertes ohmiques consiste en l'ajout de fines grilles métalliques conductrices, cependant lesdites grilles métalliques ont l'inconvénient d'être visibles et de ce fait de déprécier l'esthétique des sources de lumière les utilisant. Organic electroluminescent devices are known for their theoretical potential to provide low power lighting solutions electric, said solutions preferably having a large surface area and having freely selectable shapes. However, there are several technological challenges to be solved in order to use organic electroluminescent devices or OLEDs in lighting applications. One of the major technological obstacles consists in producing light sources having a large surface so as to obtain a sufficient amount of light (or luminous flux). The difficulties encountered in producing such sources lie in the uniformity of organic deposits over large areas and in the availability, at reasonable cost, of industrial equipment of sufficient size to obtain such deposits and also in the resistance of the transparent conductive layer (for example the anode) which induces ohmic losses all the more important as one moves away from the current supply connectors. A solution commonly used to solve the problem of ohmic losses is the addition of fine conductive metal grids, however said metal grids have the drawback of being visible and thereby depreciate the aesthetics of the light sources using them.
Une solution classiquement utilisée consiste à réaliser des structures comprenant une pluralité de dispositifs organiques électroluminescents de tailles réduites et de les assembler sur un substrat support tel qu'un substrat verrier. Les différents modules peuvent être interconnectés entre eux en utilisant une couche transparente conductrice. Cette solution présente toutefois deux inconvénients. Le premier inconvénient réside dans des problèmes mécaniques liés à l'utilisation de trois substrats dont au moins deux sont transparents, lesdits substrats étant notamment verriers : un substrat support sous forme plaque servant de base sur lequel l'ensemble des modules optoélectroniques sont déposés et au niveau de chaque module individuel : un substrat spécifique audit module sur lequel l'anode, les couches électroluminescentes et la cathode sont déposées ainsi qu'un substrat couvercle protecteur ou encapsulant permettant de protéger les couches électroluminescentes de l'environnement extérieur. L 'utilisation simultanée de ces trois substrats entraîne une fragilisation de la structure se traduisant par des casses mais également par une complexité du procédé de fabrication de l'ensemble de la structure. Le second problème réside dans la formation de connections entre le substrat support de l'ensemble des modules et le substrat spécifique du module optoélectronique individuel. 3. Objectifs de l'invention A conventionally used solution consists in producing structures comprising a plurality of small size electroluminescent organic devices and assembling them on a support substrate such as a glass substrate. The different modules can be interconnected with one another using a conductive transparent layer. This solution, however, has two disadvantages. The first disadvantage lies in mechanical problems related to the use of three substrates, at least two of which are transparent, said substrates notably being glass-forming: a support substrate in plate form serving as a base on which all the optoelectronic modules are deposited and level of each individual module: a substrate specific to said module on which the anode, the electroluminescent layers and the cathode are deposited and a protective or encapsulating cover substrate for protecting the electroluminescent layers of the external environment. The simultaneous use of these three substrates leads to a weakening of the structure translating by breaks but also by a complexity of the manufacturing process of the whole structure. The second problem lies in the formation of connections between the support substrate of all the modules and the specific substrate of the individual optoelectronic module. 3. Objectives of the invention
L'invention a notamment pour objectif de pallier ces inconvénients de l'art antérieur. The invention particularly aims to overcome these disadvantages of the prior art.
Plus précisément, un objectif de l'invention, dans au moins un de ses modes de réalisation, est de fournir une structure comportant une pluralité de modules optoélectroniques qui soit robuste et d'esthétique agréable. More specifically, an objective of the invention, in at least one of its embodiments, is to provide a structure comprising a plurality of optoelectronic modules that is robust and aesthetically pleasing.
L'invention, dans au moins un de ses modes de réalisation, a encore pour objectif de fournir une structure comportant une pluralité de modules optoélectroniques comprenant au moins des dispositifs organiques électroluminescents qui soit une source de lumière ayant une grande surface de manière à obtenir une quantité de lumière (ou flux lumineux) suffisante. The invention, in at least one of its embodiments, still aims to provide a structure comprising a plurality of optoelectronic modules comprising at least organic electroluminescent devices which is a light source having a large surface so as to obtain a amount of light (or luminous flux) sufficient.
Un autre objectif de l'invention, dans au moins un de ses modes de réalisation, est de mettre en œuvre un procédé de fabrication de l'ensemble de la structure qui soit simple et durant lequel la formation des connections entre le substrat porteur de l'ensemble des modules et le substrat porteur du module optoélectronique individuel soit aisée. En outre, un objectif de l'invention est également de fournir un procédé de réparation de ladite structure. Another object of the invention, in at least one of its embodiments, is to implement a method of manufacturing the entire structure which is simple and during which the formation of the connections between the carrier substrate of the all of the modules and the carrier substrate of the individual optoelectronic module is easy. In addition, an object of the invention is also to provide a method of repairing said structure.
4. Exposé de l'invention 4. Presentation of the invention
Conformément à un mode de réalisation particulier, l'invention concerne une structure constituée d'une pluralité de modules optoélectroniques individuels sensibles à l'eau et/ou à l'humidité. Selon l'invention, lesdits modules individuels comprennent, consistent, consistent essentiellement en, successivement un substrat spécifique à chaque module individuel, ledit substrat étant préférentiellement transparent, une première électrode, une couche électroluminescente, photo-active ou électro- active, préférentiellement électroluminescente, une seconde électrode et lesdits modules sont dépourvus de moyen d'encapsulation individuel sur la majeure partie de la surface de la seconde électrode, ladite structure comprenant un moyen d' encapsulation de la pluralité de modules optoélectroniques, ledit moyen comprenant un substrat support sous forme de plaque transparente à base de verre ou de polymère, préférentiellement à base de verre, et une couche de conduction électrique déposée sur au moins une partie d'au moins une face du substrat support sous forme de plaque transparente, ladite couche de conduction se présentant sous forme de zones discontinues, chaque module étant en contact électrique avec deux zones discontinues adjacentes distinctes, ladite couche assurant l'alimentation électrique dudit module par la face comportant la seconde électrode. According to a particular embodiment, the invention relates to a structure consisting of a plurality of individual optoelectronic modules sensitive to water and / or moisture. According to the invention, said individual modules comprise, consist essentially, successively a substrate specific to each individual module, said substrate being preferentially transparent, a first electrode, a light-emitting, photoactive or electro-active layer, preferentially electroluminescent, a second electrode and said modules are devoid of individual encapsulation means over most of the surface of the second electrode, said structure comprising means for encapsulating the plurality of optoelectronic modules, said means comprising a support substrate in the form of transparent plate based on glass or polymer, preferably based on glass, and an electric conduction layer deposited on at least a portion of at least one face of the support substrate in the form of a transparent plate, said conduction layer being form of discontinuous areas, cha module being in electrical contact with two distinct adjacent discrete zones, said layer providing the power supply of said module by the face comprising the second electrode.
Le principe général de l'invention repose sur la suppression du substrat transparent couvercle protecteur et/ou encapsulant, notamment en verre, des modules optoélectroniques et dans le fait que le substrat support sous forme de plaque transparente à base de verre ou de polymère, préférentiellement à base de verre, assure les fonctions d'interconnexion électrique entre les modules opto électroniques . The general principle of the invention is based on the suppression of the transparent protective cover and / or encapsulating, in particular glass, optoelectronic modules and in that the support substrate in the form of a transparent plate based on glass or polymer, preferably glass-based, performs the functions of electrical interconnection between the optoelectronic modules.
Ainsi, l'invention repose sur une approche tout à fait nouvelle et inventive de réduction du nombre de substrats constitutifs de la structure par la suppression du substrat transparent couvercle protecteur et/ou d'encapsulation généralement pourvu d'une cavité et donc fragile et de faciliter l'interconnexion électrique des modules optoélectroniques, notamment entre des dispositifs organique électroluminescents. Ladite structure permet en outre d'obtenir une sources de lumière ayant une grande surface de manière à obtenir une quantité de lumière (ou flux lumineux) suffisante lorsqu'elle comporte une pluralité de modules optoélectroniques comprenant, consistant en, consistant essentiellement en des dispositifs organiques électroluminescents ou bien en des cellules photovoltaïques organiques, ladite structure étant obtenue à moindre coût et de manière aisée. Par les termes « substrat spécifique à chaque module individuel», on entend désigné le fait que le substrat est propre à chaque module individuel pris séparément. Par les termes « plaque transparente à base de verre ou de polymère», on entend désigné le fait que la plaque est constituée d'un matériau comprenant au moins 50% en poids de verre ou de polymère, préférentiellement 100% en poids de verre ou de polymère. Thus, the invention is based on a completely new and inventive approach to reducing the number of substrates constituting the structure by the removal of the transparent substrate protective cover and / or encapsulation generally provided with a cavity and therefore fragile and facilitate the electrical interconnection of the optoelectronic modules, in particular between organic electroluminescent devices. Said structure also makes it possible to obtain a light source having a large surface so as to obtain a sufficient quantity of light (or luminous flux) when it comprises a plurality of optoelectronic modules comprising, consisting essentially of organic electroluminescent devices or organic photovoltaic cells, said structure being obtained cheaply and easily. By the terms "substrate specific to each individual module" is meant that the substrate is specific to each individual module taken separately. By the term "transparent glass-based or polymer-based plate" is meant that the plate consists of a material comprising at least 50% by weight of glass or polymer, preferably 100% by weight of glass or of polymer.
Selon un mode de réalisation préféré, la structure constituée d'une pluralité de modules optoélectroniques est telle qu'elle ne comporte que deux substrats, le substrat spécifique, préférentiellement transparent, des modules individuels, et le substrat support sous forme de plaque transparente à base de verre ou de polymère faisant partie du moyen d'encapsulation de la pluralité de modules optoélectroniques. According to a preferred embodiment, the structure consisting of a plurality of optoelectronic modules is such that it comprises only two substrates, the specific substrate, preferentially transparent, individual modules, and the support substrate in the form of a transparent plate based on of glass or polymer forming part of the encapsulating means of the plurality of optoelectronic modules.
Avantageusement, la structure constituée d'une pluralité de modules optoélectroniques est telle que le substrat support sous forme de plaque transparente de base est à base de verre. Le verre selon l'invention peut appartenir à diverses catégories. Le verre peut ainsi être un verre de type sodo-calcique, un verre au bore, un verre comprenant un ou plusieurs additifs répartis de manière homogène dans sa masse, tels que, par exemple, au moins un colorant inorganique, un composé oxydant, un agent régulateur de la viscosité et/ou un agent facilitant la fusion. De préférence, le verre de l'invention est de type sodo- calcique. Le verre de l'invention peut être un verre flotté, un verre étiré. Il peut être clair, extra-clair, sablé et/ou maté, de préférence il est extra-clair. L'expression "verre sodo-calcique" est utilisée ici dans son sens large et concerne tout verre qui contient les composants de base suivants (exprimés en pourcentages en poids total de verre) : Si02 60 à 75 % Advantageously, the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of transparent base plate is based on glass. The glass according to the invention can belong to various categories. The glass may thus be a soda-lime type glass, a boron glass, a glass comprising one or more additives homogeneously distributed in its mass, such as, for example, at least one inorganic dye, an oxidizing compound, a viscosity regulating agent and / or a melt facilitating agent. Preferably, the glass of the invention is of the soda-lime type. The glass of the invention may be a float glass, a drawn glass. It can be clear, extra-clear, sandblasted and / or matte, preferably it is extra-clear. The term "soda-lime glass" is used here in its broad sense and refers to any glass that contains the following basic components (expressed as percentages by total weight of glass): Si0 2 60 to 75%
Na20 10 à 20 % Na 2 0 10 to 20%
CaO 0 à 16 % CaO 0 to 16%
K20 0 à 10 % MgO 0 à 10 % K 2 0 0 to 10% MgO 0 to 10%
A1203 0 à 5 % A1 2 0 3 0 to 5%
BaO 0 à 2 % BaO 0 to 2%
BaO + CaO + MgO 10 à 20 % BaO + CaO + MgO 10 at 20%
K20 + Na20 10 à 20 %. Elle désigne aussi tout verre comprenant les composants de base précédents qui peut comprendre en outre un ou plusieurs additifs. Le terme extra clair désigne un verre contenant au plus 0,020%) en poids du verre de Fe total exprimé en Fe203 et de préférence au plus 0,015% en poids. L'utilisation d'un verre de type extra clair permet d'obtenir une transmission énergétique et lumineuse plus élevée. K 2 0 + Na 2 0 10 to 20%. It also refers to any glass comprising the preceding basic components which may further comprise one or more additives. The term extra clear means a glass containing at most 0.020% by weight of total Fe glass expressed as Fe 2 O 3 and preferably not more than 0.015% by weight. The use of an extra clear type of glass makes it possible to obtain a higher energy and light transmission.
Selon un mode de réalisation préféré, en particulier dans le cas d'applications solaires, la structure constituée d'une pluralité de modules optoélectroniques est telle que le substrat support sous forme de plaque transparente est texturé. Le substrat support sous forme de plaque transparente est préférentiellement une feuille de verre ladite feuille étant imprimée ou texturée par rouleau ou par attaque chimique acide ou alcaline, c'est-à-dire qui présente un relief macroscopique, par exemple sous forme de motifs du type pyramide ou cône, les motifs pouvant être convexes (en excroissance par rapport au plan général de la face imprimée) ou concaves (en creux dans la masse du verre). De préférence, la feuille de verre est imprimée ou texturée sur au moins une de ses faces. Un tel substrat verrier texturé cumule l'effet de permettre une augmentation des performances opto énergétiques de ladite structure et d'autre part d'assurer une protection des modules vis-à-vis de l'oxygène et de l'humidité extérieure. According to a preferred embodiment, in particular in the case of solar applications, the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of a transparent plate is textured. The support substrate in the form of a transparent plate is preferably a glass sheet, said sheet being printed or textured by roll or acid or alkaline chemical etching, that is to say which has a macroscopic relief, for example in the form of patterns of type pyramid or cone, the patterns may be convex (protruding from the general plane of the printed side) or concave (hollow in the mass of the glass). Preferably, the glass sheet is printed or textured on at least one of its faces. Such a textured glass substrate combines the effect of allowing an increase in the opto energetic performance of said structure and, on the other hand, of providing protection for the modules with respect to oxygen and external moisture.
Selon une variante avantageuse de l'invention, la structure constituée d'une pluralité de moules optoélectroniques est telle que le substrat support sous forme de plaque transparente comporte une couche antireflet de type sol-gel, ladite couche étant située sur la face opposée à la face portant la couche de conduction électrique et/ou entre ladite plaque transparente et la couche de conduction électrique. Selon un mode de réalisation préféré, la structure constituée d'une pluralité de modules optoélectroniques est telle que le substrat support sous forme de plaque transparente à une épaisseur comprise entre 1,0 mm et 5,0 mm, les inventeurs ayant déterminé que de manière surprenante une telle gamme d'épaisseur permet d'obtenir un bon compromis entre la solidité de la structure, son poids et l'isolation des module vis-à-vis de l'oxygène et de l'humidité extérieure. According to an advantageous variant of the invention, the structure consisting of a plurality of optoelectronic molds is such that the support substrate in the form of a transparent plate comprises a sol-gel-type antireflection layer, said layer being located on the face opposite to the face carrying the electrical conduction layer and / or between said transparent plate and the electrical conduction layer. According to a preferred embodiment, the structure consisting of a plurality of optoelectronic modules is such that the support substrate in the form of a transparent plate with a thickness of between 1.0 mm and 5.0 mm, the inventors having determined that surprising such a range of thickness provides a good compromise between the strength of the structure, its weight and the insulation of the module vis-à-vis oxygen and external moisture.
L'invention concerne également une structure constituée d'une pluralité de modules optoélectroniques telle que la couche de conduction électrique comprend au moins une couche à base d'au moins un oxyde dopé et/ou une couche à base d'argent. The invention also relates to a structure consisting of a plurality of optoelectronic modules such that the electrical conduction layer comprises at least one layer based on at least one doped oxide and / or a layer based on silver.
Selon un mode de réalisation préféré du mode précédent, la structure constituée d'une pluralité de modules optoélectronique est telle que la couche de conduction électrique comprend un ensemble de couches diélectriques disposées de part et d'autre de la couche à base d'argent. Selon un mode de réalisation avantageux des deux modes précédents, la structure constituée d'une pluralité de modules optoélectroniques est telle qu'au moins une couche diélectrique est située entre la couche d'argent et au moins un module optoélectronique, ladite couche diélectrique ayant une épaisseur inférieure à l'épaisseur de la (des) couche(s) diélectrique(s) située(s) entre la couche à base d'argent et la plaque transparente de base. According to a preferred embodiment of the preceding mode, the structure consisting of a plurality of optoelectronic modules is such that the electrical conduction layer comprises a set of dielectric layers disposed on either side of the silver-based layer. According to an advantageous embodiment of the two preceding modes, the structure consisting of a plurality of optoelectronic modules is such that at least one dielectric layer is located between the silver layer and at least one optoelectronic module, said dielectric layer having a thickness less than the thickness of the dielectric layer (s) located between the silver-based layer and the transparent base plate.
Selon un mode de réalisation avantageux des trois modes précédents, la structure constituée d'une pluralité de modules optoélectroniques est telle que la couche diélectrique située entre la couche à base d'argent et au moins un module optoélectronique est à base d'un oxyde conducteur. According to an advantageous embodiment of the three preceding modes, the structure consisting of a plurality of optoelectronic modules is such that the dielectric layer located between the silver-based layer and at least one optoelectronic module is based on a conductive oxide. .
Selon un mode de réalisation préféré, la structure constituée d'une pluralité de modules optoélectroniques est telle qu'elle comprend entre la couche de conduction électrique et la couche transparente, une couche dite barrière permettant de limiter la diffusion d'ion sodium provenant du second substrat support sous forme d'une plaque transparente de base. According to a preferred embodiment, the structure consisting of a plurality of optoelectronic modules is such that it comprises between the electrical conduction layer and the transparent layer, a so-called barrier layer for limiting the sodium ion diffusion from the second support substrate in the form of a transparent base plate.
L'invention concerne également une structure constituée d'une pluralité de modules optoélectroniques telle que la couche de conduction électrique se présentent sous la forme les zones discontinues adjacentes distinctes, notamment sous forme de bandes parallèles. The invention also relates to a structure consisting of a plurality of optoelectronic modules such as the electrical conduction layer are in the form of discrete adjacent discontinuous areas, especially in the form of parallel strips.
Selon un mode de réalisation préféré, la structure constituée d'une pluralité de modules optoélectroniques est, telle que chaque mo dule optoélectronique comporte un joint d'encapsulation, ledit joint étant un joint individuel propre au module. Selon un mode de réalisation avantageux, la structure constituée d'une pluralité de modules optoélectroniques est telle que la pluralité des modules comporte un joint d'encapsulation commun. According to a preferred embodiment, the structure consisting of a plurality of optoelectronic modules is such that each optoelectronic module comprises an encapsulation seal, said seal being an individual seal specific to the module. According to an advantageous embodiment, the structure consisting of a plurality of optoelectronic modules is such that the plurality of modules comprises a common encapsulation joint.
Un objet de l'invention concerne également un procédé de fabrication de structure constituée de la pluralité de modules optoélectroniques. Le procédé de fabrication de la structure constituée d'une pluralité de modules optoélectroniques selon l'invention comprend la mise en œuvre des étapes successives suivantes : le dépôt de la couche conductrice sur le substrat support sous forme de plaque transparente, suivi d'une gravure de la dite couche conductrice la réalisation des modules optoélectroniques individuels par dépôt sur un substrat spécifique à chaque module, préférentiellement transparent, d'une première électrode, d'au moins une couche électroluminescente et d'une seconde électrode à la suite de ces étapes pouvant être indépendantes l'une de l'autre, les modules optoélectroniques individuels sont déposés sur le substrat support sous forme de plaque transparente recouverte de la couche conductrice ou inversement, la réalisation d'un joint d'encapsulation, ledit joint étant à base de verre, par exemple une pâte ou fritte de verre ou un verre de soudure éventuellement rigidifïé par laser ou à base de polymère par exemple une colle, la réalisation de contact(s) électrique(s) additionnel(s) entre la couche de conductivité électrique et une source de courant éventuelle, par exemple par métallisation. An object of the invention also relates to a structure manufacturing method consisting of the plurality of optoelectronic modules. The manufacturing method of the structure consisting of a plurality of optoelectronic modules according to the invention comprises the implementation of the following successive steps: the deposition of the conductive layer on the support substrate in the form of a transparent plate, followed by an etching of the said conductive layer, the production of the individual optoelectronic modules by deposition on a substrate specific to each module, preferably transparent, of a first electrode , at least one electroluminescent layer and a second electrode following these steps being able to be independent of one another, the individual optoelectronic modules are deposited on the support substrate in the form of a transparent plate covered with the layer conductive or conversely, the production of an encapsulation seal, said seal being based on glass, for example a paste or glass frit or a welding glass optionally rigidified by laser or polymer-based for example an adhesive, the making additional electrical contact (s) between the electrical conductivity layer and a current source current, for example by metallization.
L'étape de réalisation la réalisation de contact(s) électrique(s) additionnel(s) peut éventuellement être suivie par d'une étape d'encapsulation dite secondaire par des méthodes de dépôt de films minces (telle que par exemple l'A.L.D. de l'anglais Atomic layer déposition) afin de rendre le joint de la structure encore plus étanche. Un autre objet de l'invention concerne également un procédé de réparation d'une structure constituée d'une pluralité de modules optoélectroniques selon l'invention, comportant les étapes suivantes : la détection du module optoélectronique défectueux · le descellement du module optoélectronique le positionnement du module optoélectronique de remplacement sur le substrat support sous forme de plaque transparente, ledit module étant en contact électrique avec deux zones discontinues adjacentes distinctes de la couche de conduction électrique par la face comportant la seconde électrode, le scellement du module de remplacement sur le substrat support sous forme de plaque transparent par un joint d'encapsulation individuel 5. Liste des figures The step of carrying out the additional electrical contact (s) can optionally be followed by a so-called secondary encapsulation step by thin film deposition methods (such as, for example, ALD English Atomic layer deposition) in order to make the joint of the structure even more watertight. Another object of the invention also relates to a method of repairing a structure consisting of a plurality of optoelectronic modules according to the invention, comprising the following steps: the detection of the defective optoelectronic module · the loosening of the optoelectronic module the positioning of the optoelectronic replacement module on the support substrate in the form of a transparent plate, said module being in electrical contact with two adjacent discrete discontinuous zones of the electrical conduction layer by the face comprising the second electrode, sealing of the replacement module on the support substrate in the form of a transparent plate by an individual encapsulation seal 5. List of Figures
D'autres caractéristiques et avantages de l'invention apparaîtront plus clairement à la lecture de la description suivante de modes de réalisation préférentiels, donnés à titre de simples exemples illustratifs et non limitatifs, et des figures annexées, parmi lesquels : · la figure 1 présente un schéma classique de représentation de la structure du OLED, dans laquelle on retrouve un verre encapsulant (1), une cathode métallique (2), un empilement de couches organiques constituant la partie organique de l'OLED (3), une anode par exemple à base d'oxyde conducteur généralement en ITO (oxyde mixte d'indium et d'étain) (4), un verre substrat transparent (5) spécifique au module OLED individuel et une colle ou fritte d'encapsulation (6), la flèche notée L représentant la direction de la lumière émise. • la figure 2 illustre une manière classique de réaliser de large panneau électroluminescent à base de modules OLEDs, en se basant sur le report de modules OLED complets (7) (tels que présenté en figure 1) sur un substrat support sous forme de plaque (10), notamment une plaque de verre, ladite plaque étant munie de connecteurs (9), et d'une couche de conduction gravée, la ligne 8 représentant la gravure de la couche de conduction. Other features and advantages of the invention will appear more clearly on reading the following description of preferred embodiments, given as simple illustrative and non-limiting examples, and the appended figures, among which: · FIG. a conventional diagram representing the structure of the OLED, in which there is an encapsulating glass (1), a metal cathode (2), a stack of organic layers constituting the organic part of the OLED (3), an anode for example based on conductive oxide, generally made of ITO (mixed indium tin oxide) (4), a transparent substrate glass (5) specific to the individual OLED module and an encapsulation adhesive or frit (6), the arrow denoted L representing the direction of the emitted light. FIG. 2 illustrates a conventional way of producing a large electroluminescent panel based on OLED modules, based on the report of complete OLED modules (7) (as shown in FIG. 1) on a plate-shaped support substrate (FIG. 10), in particular a glass plate, said plate being provided with connectors (9), and an etched conduction layer, the line 8 representing the etching of the conduction layer.
• la figure 3 illustre de manière schématique un exemple de gravure (8) de la couche de conduction effectuée sur le substrat support sous forme de plaque transparente (10). • Figure 3 schematically illustrates an example of etching (8) of the conduction layer performed on the support substrate in the form of transparent plate (10).
• la figure 4 décrit un système d'interconnexion classique de différents modules (7) entre eux en utilisant une couche de conduction transparente (4'), par exemple de type Sn02:F ou ITO, qui a subi une gravure, par exemple de type émargeage laser, et où les amenées de courant sont réalisées en extrémité de panneau par des connecteurs (9), par exemple des clinquants de cuivre étamé, lesdits modules étant déposés sur un substrat support sous forme d'une plaque (10) et reliés à la couche de conduction transparente de ladite plaque par les fils conducteurs (11), les flèches notées L indiquant la direction de la lumière émise. FIG. 4 describes a conventional interconnection system of different modules (7) to each other by using a transparent conduction layer (4 '), for example of Sn0 2 : F or ITO type, which has undergone etching, for example laser-emitting type, and where the current leads are made at the end of the panel by connectors (9), for example tinned copper foils, said modules being deposited on a support substrate in the form of a plate (10) and connected to the transparent conduction layer of said plate by the conductive son (11), the arrows denoted L indicating the direction of the emitted light.
• les figures 5 et 6 décrivent des moyens de connections (11, 13) entre le module OLED (7) et le substrat support sous forme d'une plaque (10), ladite plaque étant revêtue d'une couche de conduction transparente, lesdits moyens de connections étant par exemple un fil conducteur (11) (fig.5) ou une colle conductrice (13) (fig. 6), les flèches notées L indiquant la direction de la lumière émise. FIGS. 5 and 6 describe connection means (11, 13) between the OLED module (7) and the support substrate in the form of a plate (10), said plate being coated with a transparent conduction layer, said connecting means being for example a conductive wire (11) (Fig.5) or a conductive adhesive (13) (Fig.6), the arrows denoted L indicating the direction of the emitted light.
• la figure 7 illustre un mode de réalisation de la structure comprenant une pluralité de modules électroniques selon l'invention, les modules optoélectroniques étant par exemples des modules OLEDs, un substrat support sous forme d'une plaque (10), une couche de conduction transparente (4'), une colle conductrice (13), un joint d'encapsulation (6) et un substrat, spécifique au module OLED individuel, recouvert par au moins une couche conductrice jouant le rôle d'électrode, par un empilement de couches organiques constituant la partie organique de l'OLED et par une seconde couche conductrice jouant le rôle de contre électrode (15). FIG. 7 illustrates an embodiment of the structure comprising a plurality of electronic modules according to the invention, the optoelectronic modules being, for example, OLEDs modules, a support substrate in the form of a plate, a conduction layer. transparent (4 '), a conductive adhesive (13), an encapsulation seal (6) and a substrate, specific to the individual OLED module, covered by at least one conductive layer acting as an electrode, by a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counterelectrode (15).
• La figure 8 illustre de manière schématique un module OLED incorporé au sein de la structure comprenant une pluralité de modules optoélectroniques selon l'invention avant dépôt sur le substrat support sous forme de plaque transparente, ledit module étant constitué d'un substrat en verre (5) spécifique audit module, d'une anode (4), d'un empilement de couches organiques (16) constituant la partie organique de l'OLED, d'une colle conductrice (13), d'une cathode métallique (2), d'un joint pour l'encapsulation en colle ou fritte (6). FIG. 8 schematically illustrates an OLED module incorporated within the structure comprising a plurality of optoelectronic modules according to the invention before deposition on the support substrate in the form of a transparent plate, said module consisting of a glass substrate ( 5) specific to said module, an anode (4), a stack of organic layers (16) constituting the organic part of the OLED, a conductive adhesive (13), a metal cathode (2) , a seal for encapsulation in glue or frit (6).
• La figure 9 représente de manière schématique un module OLED préalablement à son dépôt sur le substrat support sous forme de plaque, ledit module comprenant un substrat (5) spécifique au module OLED individuel, une couche conductrice jouant le rôle d'anode (4), un empilement de couches organiques constituant la partie organique de l'OLED (16), et d'une contre électrode (2). FIG. 9 schematically represents an OLED module prior to its deposition on the support substrate in the form of a plate, said module comprising a substrate (5) specific to the individual OLED module, a conductive layer acting as anode (4) , a stack of organic layers constituting the organic part of the OLED (16), and a counter electrode (2).
• La figure 10 représente de manière schématique un mode de mise en œuvre du procédé de fabrication de la structure constituée d'une pluralité de modules optoélectronique selon l'invention comprenant les étapes de gravure laser du substrat support sous forme de plaque de verre revêtu d'une couche transparente conductrice (1), de dépôt sur un substrat en verre spécifique au module individuel de l'anode, des couches organiques et de la cathode constituant l'OLED (2), de dépôt des modules OLED réalisé à l'étape (2) sur le substrat support gravé à l'étape (1), d'ajout de connecteurs électriques (4). FIG. 10 schematically represents one embodiment of the manufacturing method of the structure consisting of a plurality of optoelectronic modules according to the invention comprising the steps of laser etching of the support substrate in the form of a glass plate coated with a conductive transparent layer (1) deposited on a glass substrate specific to the individual module of the anode, the organic layers and the cathode constituting the OLED (2), depositing the OLED modules produced in step (2) on the support substrate etched in step (1), adding electrical connectors (4).
6. Description d'un mode de réalisation de l'invention On présente, en relation avec la figure 7, un mode de réalisation de la structure selon l'invention. Bien entendu, l'invention n'est pas limitée aux exemples de réalisation mentionnés ci-dessus. La structure selon l'invention comprend une pluralité de modules électroniques, par exemple des modules OLEDs, déposés sur un substrat support sous forme de plaque (10) recouvert d'une couche transparente conductrice (4), lesdits modules OLED (15) comprenant un substrat spécifique à chaque module individuel recouvert d'une couche conductrice, jouant le rôle d'anode par exemple, d'un empilement de couches organiques constituant la partie organique de l'OLED et d'une seconde couche conductrice jouant le rôle de contre électrode, lesdits modules comprenant en outre une colle conductrice (13) et un joint d'encapsulation (6). 6. Description of an embodiment of the invention In relation to FIG. 7, an embodiment of the structure according to the invention is presented. Of course, the invention is not limited to the embodiments mentioned above. The structure according to the invention comprises a plurality of electronic modules, for example OLEDs modules, deposited on a plate-like support substrate (10) covered with a conductive transparent layer (4), said OLED modules (15) comprising a substrate specific to each individual module covered with a conductive layer, playing the role of anode for example, a stack of organic layers constituting the organic part of the OLED and a second conductive layer acting as a counter electrode said modules further comprising a conductive adhesive (13) and an encapsulation seal (6).
La comparaison de l'exemple de structure comprenant une pluralité de modules optoélectroniques selon l'invention présenté aux figures 7, 8 et 9 avec les exemples comparatifs présentés aux figures 3, 4, 5 et 6 montre les avantages liés à l'invention qui sont d'une part la réduction du nombre de composants constitutifs du système, notamment la réduction du nombre de substrats de trois à deux, cette réduction se traduisant par la suppression du verre d'encapsulation (1) et d'autre part la facilité d'interconnexion électrique entre les modules, notamment les modules OLEDs. Une structure comprenant une p luralité de mo dul e s optoélectroniques selon l'invention est obtenue au départ d'un substrat support sous forme de plaque en verre, par exemple un verre de type Plannibel G de la société AGC, ledit verre étant un verre revêtu d'un film conducteur à base de Sn02:F, préalablement lavé et rodé. Le substrat support est ensuite gravé en utilisant un procédé de gravure laser, par exemple un laser ayant une puissance de l'ordre de 40W à 552 nm. On obtient alors un substrat support conforme à la figure 3, signalons toutefois que le schéma électrique résultant dans le substrat support peut être adapté suivant la configuration, la géométrie voire l'esthétisme désiré de la structure finale. Des modules OLEDs, par exemple de dimension 100 mm * 100 mm sont réalisés en atmosphère contrôlée (de type salle blanche et exempte d'oxygène) par déposition d'une anode, d'un empilement ce couche organique et d'une cathode conformément à la figure 9. Un joint d'encapsulation, par exemple à base de colle réticulable par radiation UV telle que commercialisée par la firme Nagase par exemple, est alors réalisé autour de la partie organique de ces modules, tandis qu'une colle à base d'argent telle que commercialisée par la société Epotecny par exemple est déposée à l'endroit des connections électriques comme indiqué à la figure 8. The comparison of the exemplary structure comprising a plurality of optoelectronic modules according to the invention presented in FIGS. 7, 8 and 9 with the comparative examples presented in FIGS. 3, 4, 5 and 6 shows the advantages related to the invention which are on the one hand the reduction of the number of components constituting the system, in particular the reduction of the number of substrates from three to two, this reduction resulting in the removal of the encapsulation glass (1) and on the other hand the ease of electrical interconnection between modules, including OLED modules. A structure comprising a plurality of optoelectronic modules according to the invention is obtained from a support substrate in the form of a glass plate, for example a Plannibel G type glass from AGC, said glass being a coated glass. a conductive film based on Sn0 2 : F, previously washed and ground. The support substrate is then etched using a laser etching process, for example a laser having a power of the order of 40W at 552 nm. A support substrate according to FIG. 3 is then obtained, but it should be noted that the resulting electric diagram in the support substrate can be adapted according to the desired configuration, geometry or even aesthetics of the final structure. OLED modules, for example 100 mm * 100 mm in size are made in a controlled atmosphere (clean room and oxygen-free) by deposition of an anode, a stack of organic layer and a cathode according to FIG. 9. An encapsulation seal, for example based on UV radiation crosslinkable adhesive as marketed by the firm Nagase, for example, is then produced around the organic part of these modules, while a dye-based adhesive Silver as marketed by the company Epotecny for example is deposited at the location of the electrical connections as shown in Figure 8.

Claims

REVENDICATIONS
1. Structure constitué e d ' une p luralité de mo dul e s optoélectroniques individuels sensibles à l'eau et/ou à l'humidité, caractérisée en ce que lesdits modules individuels comprennent successivement un substrat spécifique à chaque module individuel, préférentiellement transparent, une première électrode, une couche électroluminescente, photo-active ou électro- active, préférentiellement électroluminescente, une seconde électrode et lesdits modules sont dépourvus de moyen d'encapsulation individuel sur la majeure partie de la surface de la seconde électrode, ladite structure comprenant un moyen d'encapsulation de la pluralité de modules optoélectroniques, ledit moyen comprenant un substrat support sous forme d'une plaque transparente à base de verre ou de polymère, préférentiellement à base de verre, et une couche de conduction électrique déposée sur au moins une partie d'au moins une face du substrat support sous forme de plaque transparente, ladite couche de conduction se présentant sous forme de zones discontinues, chaque module étant en contact électrique avec deux zones discontinues adjacentes distinctes, ladite couche assurant l'alimentation électrique dudit module par la face comportant la seconde électrode, 1. Structure consisting of a plurality of individual optoelectronic modules sensitive to water and / or moisture, characterized in that said individual modules successively comprise a substrate specific to each individual module, preferably transparent, a first electrode, a light-emitting, photo-active or electro-active layer, preferably electroluminescent, a second electrode and said modules are devoid of individual encapsulation means over most of the surface of the second electrode, said structure comprising means for encapsulation of the plurality of optoelectronic modules, said means comprising a support substrate in the form of a transparent plate based on glass or polymer, preferably based on glass, and an electrical conduction layer deposited on at least a portion of at least one side of the support substrate in the form of a transparent plate, said conduction layer in the form of discontinuous zones, each module being in electrical contact with two distinct adjacent discontinuous zones, said layer providing the power supply of said module by the face comprising the second electrode,
2. S tructure constitué e d ' une p luralité de mo dule s optoélectronique selon la revendication 1, telle qu'elle ne comporte que deux substrats, le substrat spécifique, préférentiellement transparent, des modules individuels, et le substrat support sous forme d'une plaque transparente à base de verre ou de polymère faisant partie du moyen d'encapsulation de la pluralité de modules optoélectroniques, 2. A structure consisting of a plurality of optoelectronic modules according to claim 1, such that it comprises only two substrates, the specific substrate, preferentially transparent, individual modules, and the support substrate in the form of a substrate. transparent glass-based or polymer-based plate forming part of the encapsulating means of the plurality of optoelectronic modules,
3. S tructure constitué e d ' une p luralité de mo dule s optoélectroniques selon une quelconque des revendications précédentes, telle que le substrat support sous forme de plaque transparente est à base de verre de type clair ou extra-clair, 3. The structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that the support substrate in the form of a transparent plate is based on clear or extra-clear type glass,
4. Structure constituée d'une pluralité de modules optoélectroniques selon une quelconques des revendications précédentes, telle que le substrat support sous forme de plaque transparente comporte une couche antireflet de type sol-gel, ladite couche étant située sur la face opposée à la face portant la couche de conduction électrique et/ou entre le substrat support sous forme de plaque transparente et la couche de conduction électrique, 4. Structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that the support substrate in the form of a transparent plate comprises a sol-gel type antireflection layer, said layer being located on the face opposite to the bearing surface. the electrical conduction layer and / or between the transparent plate-shaped support substrate and the electrical conduction layer,
5. Structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications précédentes, telle que le substrat support sous forme de plaque transparente à une épaisseur comprise entre 1,0 mm et 5,0 mm, 5. Structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such as the support substrate in the form of a transparent plate with a thickness of between 1.0 mm and 5.0 mm,
6. Structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications précédentes, telle que la couche de conduction électrique comprend au moins une couche à base d'au moins un oxyde dopé et/ou une couche à base d'argent, 6. Structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that the electrical conduction layer comprises at least one layer based on at least one doped oxide and / or a layer based on silver,
7. Structure constituée d'une pluralité de modules optoélectroniques selon la revendication 6, telle qu'elle comprend un ensemble de couches diélectriques disposées de part et d'autre de ladite couche à base d'argent, 7. Structure consisting of a plurality of optoelectronic modules according to claim 6, such that it comprises a set of dielectric layers disposed on either side of said silver-based layer,
8. Structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications 6 et 7, telle que la(es) couche(s) diélectrique(s) située(s) entre la couche d'argent et au moins un module optoélectronique a une épaisseur inférieure à l'épaisseur de la (des) couche(s) diélectrique(s) située(s) entre la couche à base d'argent et le substrat support sous forme de plaque transparente, 8. Structure consisting of a plurality of optoelectronic modules according to any one of claims 6 and 7, such as the (s) layer (s) dielectric (s) located (s) between the silver layer and at least one optoelectronic module has a thickness less than the thickness of the dielectric layer (s) located between the silver-based layer and the support substrate in the form of a transparent plate,
9. Structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications 6, 7, 8, telle que la couche diélectrique située entre la couche à base d'argent et au moins un module optoélectronique est à base d'un oxyde conducteur, 9. Structure consisting of a plurality of optoelectronic modules according to any one of claims 6, 7, 8, such that the dielectric layer between the silver-based layer and at least one optoelectronic module is based on a conductive oxide. ,
10. S tructure constitué e d ' une p luralité de mo dule s optoélectroniques selon une quelconque des revendications précédentes, telle qu'elle comprend entre la couche de conduction électrique et la couche transparente, une couche dite barrière permettant de limiter la diffusion d'ion sodium provenant du substrat support sous forme de plaque transparente, 10. A structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that it comprises between the electrical conduction layer and the transparent layer, a barrier layer for limiting ion diffusion. sodium from the support substrate in the form of a transparent plate,
11. S tructure constitué e d ' une p luralité de mo dule s optoélectroniques selon une quelconque des revendications précédentes, telle que la couche de conduction électrique se présente sous la forme les zones discontinues adjacentes distinctes, notamment sous forme de bandes parallèles, 11. A structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that the electric conduction layer is in the form of the discrete adjacent discontinuous zones, in particular in the form of parallel strips,
12. S tructure constitué e d ' une p luralité de mo dule s optoélectroniques selon une quelconques des revendications précédentes, telle que chaque module optoélectronique comporte un joint d'encapsulation, ledit joint étant un joint individuel propre au module, 12. S tructure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, such that each optoelectronic module comprises an encapsulation seal, said seal being an individual seal specific to the module,
13. S tructure constitué e d ' une p luralité de mo dule s optoélectroniques selon une quelconques des revendications 1 à 12, telle que la pluralité des modules comporte un joint d'encapsulation commun 13. The structure consisting of a plurality of optoelectronic modules according to any one of claims 1 to 12, such that the plurality of modules comprises a joint encapsulation joint.
14. Procédé de fabrication d'une structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications précédentes, comprenant les étapes suivantes : · Etape de dépôt de la couche conductrice sur le substrat support sous forme de plaque transparente, suivi d'une gravure de la dite couche conductrice 14. A method of manufacturing a structure consisting of a plurality of optoelectronic modules according to any one of the preceding claims, comprising the following steps: · Step of depositing the conductive layer on the support substrate in the form of a transparent plate, followed by an etching of said conductive layer
• Etape de réalisation des modules optoélectroniques individuels par dépôt sur un substrat spécifique à chaque module, préférentiellement transparent, d'une première électrode, d'au moins une couche électroluminescente et d'une seconde électrode Step of producing the individual optoelectronic modules by deposition on a substrate specific to each module, preferably transparent, of a first electrode, at least one electroluminescent layer and a second electrode;
• A la suite de ces étapes pouvant être indépendantes l'une de l'autre, les modules optoélectroniques individuels sont déposés sur le substrat support sous forme de plaque transparente recouverte de la couche conductrice ou inversement, • Following these steps, which may be independent, one of the other, the individual optoelectronic modules are deposited on the support substrate in the form of a transparent plate covered with the conductive layer or vice versa,
• Etape de réalisation d'un joint d'encapsulation, ledit joint étant à base de verre ou de polymère ((de pâte de verre (solder glass) rigidifïcation laser, polymère (colle)) • Step of making an encapsulation seal, said seal being based on glass or polymer ((of glass paste (solder glass) laser stiffening, polymer (glue))
• Etape de réalisation de contact(s) électrique(s) additionnel(s) entre la couche de conductivité électrique et une source de courant éventuelle. • Step of making additional electrical contact (s) between the electrical conductivity layer and a potential current source.
15. Procédé de réparation d'une structure constituée d'une pluralité de modules optoélectroniques selon une quelconque des revendications de 12, comportant les étapes suivantes 15. A method of repairing a structure consisting of a plurality of optoelectronic modules according to any of the claims of 12, comprising the following steps
• détection du module optoélectronique défectueux • defective optoelectronic module detection
• descellement du module optoélectronique • loosening of the optoelectronic module
• positionnement du module optoélectronique de remplacement sur le substrat support sous forme de plaque transparent ledit module étant en contact électrique avec deux zones discontinues adjacentes distinctes de la couche de conduction électrique par la face comportant la seconde électrode, scellement du module de remplacement sur le substrat support sous forme de plaque transparent par un joint d'encapsulation individuel Positioning of the replacement optoelectronic module on the support substrate in the form of a transparent plate, said module being in electrical contact with two adjacent discrete discontinuous zones of the electrical conduction layer by the face comprising the second electrode, sealing of the replacement module on the substrate support in the form of transparent plate by an individual encapsulation seal
PCT/EP2012/063166 2011-08-04 2012-07-05 Structure comprising a plurality of optoelectronic modules WO2013017372A1 (en)

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