WO2013001606A1 - Method for bonding film base materials - Google Patents

Method for bonding film base materials Download PDF

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Publication number
WO2013001606A1
WO2013001606A1 PCT/JP2011/064817 JP2011064817W WO2013001606A1 WO 2013001606 A1 WO2013001606 A1 WO 2013001606A1 JP 2011064817 W JP2011064817 W JP 2011064817W WO 2013001606 A1 WO2013001606 A1 WO 2013001606A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
electron beam
film base
polyethylene
bases
Prior art date
Application number
PCT/JP2011/064817
Other languages
French (fr)
Japanese (ja)
Inventor
植木　貴之
泉 八木
椎名　徳之
Original Assignee
大日本印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to PCT/JP2011/064817 priority Critical patent/WO2013001606A1/en
Publication of WO2013001606A1 publication Critical patent/WO2013001606A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
    • B29C65/1467—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/735—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
    • B29C66/7352—Thickness, e.g. very thin
    • B29C66/73521—Thickness, e.g. very thin of different thickness, i.e. the thickness of one of the parts to be joined being different from the thickness of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B29C66/8341—Roller, cylinder or drum types; Band or belt types; Ball types
    • B29C66/83411—Roller, cylinder or drum types
    • B29C66/83413—Roller, cylinder or drum types cooperating rollers, cylinders or drums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
    • B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00141—Protective gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/84—Specific machine types or machines suitable for specific applications
    • B29C66/851—Bag or container making machines
    • B29C66/8511—Bag making machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7128—Bags, sacks, sachets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Definitions

  • the present invention relates to a method for adhering film base materials, and more particularly, to a method for adhering films made of different materials without performing a lamination process or the like.
  • a package made from a film or the like is used.
  • a multifunctional film in which various materials are laminated is used as a film to be used in order to develop a desired function depending on the contents to be filled.
  • a film having an ultraviolet absorption function is used, or in order to prevent the contents from being altered by oxygen, a gas-impermeable film or oxygen absorption is used.
  • a film having a function is used.
  • Packaging is generally performed by processing a long film, but in order to process it into a bag shape, the end portions of the films are bonded together.
  • a laminate resin adheresive
  • the films are pressed and sealed, or the two films are overlapped and heated at the ends.
  • a so-called heat sealing process is performed to add and fuse.
  • the films can be bonded easily and simply.
  • the heat sealing process is a method in which the films are partially melted or semi-melted, and the films are bonded to each other, so that different films, for example, a polyolefin film and a polyester film are bonded to each other. It cannot be bonded by heat sealing.
  • a film made of a resin that can be fused at a relatively low temperature it is necessary to use a film made of a resin that can be fused at a relatively low temperature. Therefore, a multilayer film in which a heat sealable resin layer such as polyolefin resin is provided on the outermost surface layer is used. (For example, JP-A-55-107428).
  • the components of the laminating resin are appropriately selected according to the type of film to be used (type of resin).
  • type of resin for example, when processing into a bag shape by bonding a polyester film and a nylon film, a urethane adhesive has been used (for example, JP-A-52-82594).
  • the laminate resin component may gradually elute or volatilize in the package, and the contents may be altered.
  • contamination of the contents by the laminate resin may be a problem.
  • the laminate resin itself may deteriorate due to long-term use of the package, and particularly in exterior applications that are used outdoors, the weather resistance of the laminated package may become a problem.
  • the laminating technique using an adhesive since a resin component diluted in a solvent is generally applied, the solvent remains after laminating to form a final product such as a package. There was a case.
  • Patent Document 3 proposes that a crosslinked composite fluorine-based resin can be obtained by irradiating the fluorine-based resin with radiation.
  • Journal of Photopolymer Science and Technology Technology Vol.19, No. 1 (2006), pp123-127 (Non-Patent Document 1) is a polytetrafluoroethylene film and a polyimide film laminated to an electron beam at high temperature ( In the following, it has been proposed to bond each other by irradiating EB. Also, in Material Transactions Vol. 50, No.
  • Non-patent Document 2 the surface of polycarbonate resin is covered with a nylon film, and an electron beam (hereinafter abbreviated as EB) may be applied from above.
  • EB electron beam
  • the films can be firmly bonded to each other without using a laminate resin or the like by irradiating the films with an electron beam. , And got the knowledge.
  • the present invention is based on this finding.
  • an object of the present invention is to adhere strongly to each other without using a laminate resin in a method of adhering films made of different materials to each other, and to have excellent weather resistance without exuding foreign matter or residual solvent. Is to provide a method.
  • the method according to the present invention is a method for bonding film substrates made of different materials to each other, Prepare a pair of film bases made of different materials, Irradiating at least one of the film bases to be bonded with an electron beam, Adhering only the part irradiated with the electron beam to the other film substrate, It is characterized by comprising.
  • the other film base material is superposed on the surface of the film base material on which the electron beam is irradiated.
  • both film substrates are overlapped so that the surfaces of the film substrate irradiated with the electron beam face each other.
  • the film base material made of the different material is polyethylene terephthalate / nylon, polyethylene terephthalate / polyamide, polyethylene terephthalate / polyethylene, polyethylene terephthalate / polypropylene, polyethylene / nylon, polyethylene / polyamide, polypropylene / From nylon, polypropylene / polyamide, ethylene vinyl acetate / polyethylene, ethylene vinyl acetate / polypropylene, polyvinyl alcohol / polyethylene, polyvinyl alcohol / polypropylene, ethylene-vinyl alcohol copolymer / polyethylene, and ethylene-vinyl alcohol copolymer / polypropylene. It is preferable that the combination is selected.
  • both the film bases are pressed while being heated after the pair of film bases are overlapped.
  • the pressing is performed with a heat roller.
  • the absorbed dose of the electron beam is 20 to 1000 kGy, and the irradiation of the electron beam is performed at an acceleration voltage of 30 to 300 kV.
  • the resin films having a large difference in melting point and glass transition temperature are bonded.
  • a method for manufacturing a bag-like package by bonding different types of films to each other such as when a stretched resin film and an unstretched resin film are bonded, it can be firmly bonded without using a laminate resin.
  • FIG. 1 is a schematic diagram showing an embodiment of a method for producing a package according to the present invention, and shows an outline of a process for bonding film substrates made of different materials to each other.
  • the film substrate is not particularly limited, and is not limited to polyester such as polyethylene terephthalate, polycarbonate, polyamide, polyimide, cellulose acetate, polyethylene vinyl acetate, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polyvinylidene chloride, polyvinyl chloride.
  • plastic films such as polystyrene, fluororesin, polypropylene, polyethylene, ionomer, etc., and two types of film bases selected from these can be combined.
  • film base materials made of different materials as described above cannot be bonded to each other unless an adhesive is used.
  • an adhesive is interposed between them, hydrogen bonds and van der Waals forces are formed through the adhesive (laminate resin), thereby forming a film base made of different materials. Glues between materials.
  • the two film base materials are bonded to each other without using any adhesive such as a laminate resin.
  • combinations of film base materials that adhere to each other include polyethylene terephthalate / nylon, polyethylene terephthalate / polyamide, polyethylene terephthalate / polyethylene, polyethylene terephthalate / polypropylene, polyethylene / nylon, polyethylene / polyamide, polypropylene / nylon, polypropylene / Combinations selected from polyamide, ethylene vinyl acetate / polyethylene, ethylene vinyl acetate / polypropylene, polyvinyl alcohol / polyethylene, polyvinyl alcohol / polypropylene, ethylene-vinyl alcohol copolymer / polyethylene, and ethylene-vinyl alcohol copolymer / polypropylene It is preferable that
  • a pair of prepared film base materials made of different materials are overlapped, and as shown in FIG. 1 (2), at least one portion of the film base material to be bonded is irradiated with an electron beam.
  • the film base materials are bonded only to the portion irradiated with the electron beam.
  • the reason for this is not clear, but can be considered as follows.
  • electro beam does not include electromagnetic radiation having an irradiation energy of 15 eV or less, such as ultraviolet rays, corona discharge, and ion beams.
  • the surface of the film base material is uneven at the micro level, so even if the film base materials are overlapped with each other, they are not completely adhered to each other.
  • the contact area at is small.
  • adhesiveness improves.
  • the temperature to heat depends on the combination of the film base material to be used, it should just be a temperature which can heat-deform a resin film, for example, can be heated more than the glass transition temperature of resin which comprises a film base material.
  • the heating temperature is 80 to 180 ° C., preferably 130 to 160 ° C. If the heating temperature is too high, the generated radicals are deactivated, and a strong bond cannot be realized.
  • the pressing force contact pressure
  • the heat roller 6 or the like can be suitably used as described above.
  • the support roller 7 is placed at a position facing the heat roller 6 so that the superposed film bases 1 and 2 can be pressed against each other between the heat roller 6 and the support roller 7. It may be placed.
  • the support roller 7 by placing the support roller 7 at a position facing the heat roller 6, the contact between the film bases 1, 2 and the heat roller 6 is brought close to line contact, and the film base is heated by the heat from the heat roller 6. The deformation generated in the materials 1 and 2 can be minimized.
  • FIG. 3 is a schematic view showing another aspect of the bonding method according to the present invention.
  • each film base material is guided to the electron beam irradiation position 3 by a guide roller, and the electron beam 4 is irradiated to the film base materials 1 and 2.
  • the process of pressing the film substrates 1 and 2 with the heat roller 6 is continuously performed.
  • Each film substrate may be supplied in roll form.
  • the electron beam 4 When irradiating the electron beam 4 from the electron beam irradiation device 3 to the film bases 1 and 2, it is preferable to irradiate the electron beam 4 from the film base side having a smaller thickness. Since the electron beam has the property that the transmission power increases as the acceleration voltage increases, depending on the thickness of the film substrate, when the electron beam is irradiated from either film substrate side, the other The electron beam may not reach the film substrate. In that case, the electron beam can reach the deep part of the other film substrate by increasing the acceleration voltage of the electron beam, but as the electron beam energy increases, the film substrate itself is deteriorated. End up.
  • both the film bases to be overlapped are thick, as shown in FIG. 3, another electron beam irradiation device 3 is placed at a position facing the electron beam irradiation apparatus 3 so that the electron beams can be irradiated from both film bases. You may provide electron beam irradiation apparatus 3 '. According to this aspect, since the irradiation energy of an electron beam can be adjusted according to the thickness of a film base material, both film base materials can be adhere
  • the irradiation energy of the electron beam can be reduced regardless of the thickness of the film substrate.
  • a pair of electron beam irradiation devices 3 and 3 ′ are provided, and the electron beams 4 and 4 are respectively applied to both the film bases 1 and 2 similarly to the embodiment shown in FIG. 3. 4 'may be irradiated.
  • FIG. 5 is a schematic view showing another embodiment of the method for bonding a film substrate according to the present invention.
  • the electron beam irradiation is performed after the film substrates 1 and 2 are overlapped and pressed by the heat roller 6.
  • a pair of supplied film base materials 1 and 2 are led to a guide roller and overlapped.
  • the film bases 1 and 2 are pressed by the heat roller 6 and the support roller 7, and heating is performed by the heat roller 6.
  • the electron beam irradiation device 3 irradiates the surfaces of the film bases 1 and 2 with the electron beam 4 to continuously adhere the film bases. Also in the embodiment shown in FIG.
  • a pair of electron beam irradiation devices 3 and 3 ′ are provided, and the electron beams are applied to both film bases 1 and 2 in the same manner as in the embodiments shown in FIGS. 3 and 4. 4,4 ′ may be irradiated.
  • the irradiation energy of the electron beam needs to be appropriately adjusted according to the material and thickness of the film base as described above.
  • the electron beam is irradiated in an irradiation energy range of about 20 to 750 keV, preferably 25 to 400 keV, more preferably about 30 to 300 keV, but a lower irradiation energy is preferable, and 20 to 200 keV. Can do.
  • the absorbed dose of the electron beam is in the range of 10 to 2000 kGy, preferably 20 to 1000 kGy.
  • an electron beam irradiation apparatus conventionally known ones can be used.
  • a curtain type electron irradiation apparatus (LB1023, manufactured by I. Electron Beam Co., Ltd.) or a line irradiation type low energy electron beam irradiation apparatus (EB-ENGINE). , Manufactured by Hamamatsu Photonics Co., Ltd.) can be preferably used.
  • the oxygen concentration is preferably 100 ppm or less. This is because irradiation with an electron beam in the presence of oxygen generates ozone, which adversely affects the environment and the surface of the film substrate may react with ozone to change the film characteristics.
  • the film substrate may be irradiated with an electron beam in a vacuum or in an inert gas atmosphere such as nitrogen or argon. For example, by filling the electron beam irradiation apparatus with nitrogen. An oxygen concentration of 100 ppm or less can be achieved.
  • the front and back surfaces of the multilayer laminated film can also be suitably applied to the case where the two are bonded to form a bag.
  • a packaging body used in the medical field such as a syringe packaging bag or a packaging body for filling and packaging a powder or granular pharmaceutical product, uses the functional multilayer film as described above. If the adhesive method according to the present invention is used when manufacturing a packaging body from a porous multilayer film, the packaging body can be produced without using any laminate resin, etc., so that the quality of the pharmaceutical product as a filler can be maintained. Can do.
  • Example 1 Preparation of film substrate> As a film substrate composed of two different materials, a biaxially stretched polyethylene terephthalate film (Espet T4102, manufactured by Toyobo Co., Ltd.) having a thickness of 25 ⁇ m and an unstretched linear low density polyethylene film (Evolu SP2020, stock) having a thickness of 80 ⁇ m Company Prime Polymer) was prepared.
  • Espet T4102 manufactured by Toyobo Co., Ltd.
  • Evolu SP2020 unstretched linear low density polyethylene film
  • ⁇ Adhesion of film base> The films were overlapped so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other. Next, using a curtain type electron beam irradiation apparatus (LB1023, manufactured by I. Electron Beam Co., Ltd.), an electron beam was irradiated from the polyethylene terephthalate film side on the laminated film surface under the following irradiation conditions.
  • LB1023 curtain type electron beam irradiation apparatus
  • Example 2 The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation. Voltage: 165 kV, current value: 3.9 mA, irradiation dose: 500 kGy
  • Example 3 The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation. Voltage: 165 kV, current value: 3.9 mA, irradiation dose: 250 kGy
  • Comparative Example 1 The same two types of films used in Example 1 were superposed on each other, and the film was pressed from above the film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
  • Comparative Example 2 The same two types of films used in Example 1 were prepared, and these films were overlapped with each other via a urethane adhesive having the following composition. The film was pressed under the condition of 6 Mpa.
  • Example 4 Before preparing the same film as the two types of films used in Example 1 and superimposing each other so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other.
  • a curtain type electron beam irradiation device (LB1023, manufactured by I. Electron Beam Co., Ltd.) on both of the adhesion surfaces of each film, the electron beams are irradiated under the following irradiation conditions, and then overlap each other. It was.
  • the film was pressed from above the laminated film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa. Voltage: 90 kV, current value: 4.9 mA, irradiation dose: 750 kGy In-apparatus film transport speed: 5 m / min In-apparatus oxygen concentration: 100 ppm or less
  • Example 5 The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation. Voltage: 90 kV, current value: 4.9 mA, irradiation dose: 500 kGy
  • Example 6 ⁇ Preparation of film substrate>
  • a biaxially stretched polyethylene terephthalate film (Espet T4102, manufactured by Toyobo Co., Ltd.) with a thickness of 25 ⁇ m supplied in a roll form having a width of 170 mm and a length of 200 m, and the same size
  • An unstretched linear low-density polyethylene film (Evolue SP2020, manufactured by Prime Polymer Co., Ltd.) having a thickness of 80 ⁇ m and supplied in a roll form was prepared.
  • Example 7 The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation. Voltage: 145 kV, current value: 5.2 mA, irradiation dose: 360 kGy
  • Example 8 The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation. Voltage: 145 kV, current value: 2.9 mA, irradiation dose: 200 kGy
  • Example 9 Before preparing the same film as the two types of films used in Example 1 and superimposing each other so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other
  • both of the adhesive surfaces of each film were irradiated with an electron beam under the following irradiation conditions using a line irradiation type low energy electron beam irradiation apparatus (EB-ENGINE, manufactured by Hamamatsu Photonics Co., Ltd.) Are superimposed.
  • EB-ENGINE line irradiation type low energy electron beam irradiation apparatus
  • the film was pressed from above the laminated film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
  • irradiation dose 650 kGy In-apparatus film transport speed: 20 mm / sec
  • In-apparatus oxygen concentration 100 ppm or less
  • Example 10 The films made of different materials were adhered to each other in the same manner as in Example 9 except that the electron beam irradiation dose and the film conveyance speed were changed as follows. Voltage: 70 kV, current value: 1 mA, irradiation dose: 430 kGy In-apparatus film transport speed: 30 mm / second
  • Example 11 Preparation of film substrate> As a film substrate made of two different materials, a biaxially stretched nylon film (emblem, manufactured by Toyobo Co., Ltd.) with a thickness of 25 ⁇ m and an unstretched linear low-density polyethylene film (Evolu SP2020, Prime Polymer Co., Ltd.) with a thickness of 80 ⁇ m Prepared).
  • a biaxially stretched nylon film emblem, manufactured by Toyobo Co., Ltd.
  • an unstretched linear low-density polyethylene film Evolu SP2020, Prime Polymer Co., Ltd.
  • Example 12 The films made of different materials were adhered to each other in the same manner as in Example 9 except that the electron beam irradiation dose and the film conveyance speed were changed as follows. Voltage: 70 kV, current value: 1 mA, irradiation dose: 430 kGy In-apparatus film transport speed: 30 mm / second
  • Example 3 a polyethylene terephthalate film is formed on the surface of the laminated film under the following irradiation conditions using a xenon lamp (excimer scan stand-alone device, manufactured by M. Diexima Co., Ltd.) instead of electron beam irradiation.
  • the films made of different materials were bonded to each other in the same manner as in Example 1 except that the ionizing radiation was irradiated from the side.
  • Integrated illuminance 50 mW / cm 2
  • Irradiation distance 2mm from lamp tube surface to base material

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Abstract

Provided is a method for bonding together films made of different types of materials to produce a packaging article given a bag shape, wherein firm bonding is possible without the use of a laminate resin, there is no seepage of foreign matter, residual solvent, or the like, and the weather resistance is also excellent. A method for bonding together films made of different types of materials to produce a packaging article given a bag shape, wherein the method comprises preparing a pair of film base materials made of different types of materials, irradiating with an electron beam a portion of at least one film base material where bonding is to take place, and bonding only the portion that has been irradiated with the electron beam, to the other film base material, to make a bag shape.

Description

フィルム基材の接着方法Method for bonding film base material
　本発明は、フィルム基材の接着方法に関し、より詳細には、ラミネート加工等を行わずに異種材料からなるフィルムどうしを接着する方法に関する。 The present invention relates to a method for adhering film base materials, and more particularly, to a method for adhering films made of different materials without performing a lamination process or the like.
　フィルム等を袋状に加工した包装体が使用されている。このような包装体は、充填される内容物に応じて所望される機能を発現させるために、使用するフィルムとして種々の材料を積層した多機能フィルム等が使用されている。例えば、内容物の紫外線等による劣化を抑止するために、紫外線吸収機能を有するフィルムを用いたり、また、内容物が酸素により変質してしまうのを防ぐために、ガス非透過性のフィルムや酸素吸収機能を有するフィルム等が用いられている。 A package made from a film or the like is used. In such a package, a multifunctional film in which various materials are laminated is used as a film to be used in order to develop a desired function depending on the contents to be filled. For example, in order to prevent deterioration of the contents due to ultraviolet rays, etc., a film having an ultraviolet absorption function is used, or in order to prevent the contents from being altered by oxygen, a gas-impermeable film or oxygen absorption is used. A film having a function is used.
　包装体は、一般的に長尺状のフィルムを加工することより行われているが、袋状に加工するには、フィルムどうしを重ね合わせてその端部を接着することが行われている。フィルムどうしを接着する方法としては、ラミネート樹脂（接着剤）を接着しようとするフィルムの端部に塗布してフィルムどうしを押圧してシールしたり、フィルムどうしを重ね合わせて、その端部に熱を加えて融着させるいわゆるヒートシール加工が行われるのが一般的である。 Packaging is generally performed by processing a long film, but in order to process it into a bag shape, the end portions of the films are bonded together. As a method of bonding films, a laminate resin (adhesive) is applied to the ends of the films to be bonded, and the films are pressed and sealed, or the two films are overlapped and heated at the ends. In general, a so-called heat sealing process is performed to add and fuse.
　ヒートシール加工は、フィルムどうしを接着する際にラミネート樹脂等を用いないため、簡易かつ簡便にフィルムどうしを接着することができる。しかしながら、ヒートシール加工は、フィルムを部分的に溶融ないし半溶融させて、互いのフィルムを融着させて接着する方法であるため、異種のフィルムどうし、例えば、ポリオレフィン系フィルムとポリエステル系フィルムとをヒートシール加工により接着することができない。また、ヒートシール加工においては、比較的低温で融着可能な樹脂からなるフィルムを用いる必要があるため、最表面層にポリオレフィン系樹脂等のヒートシール性樹脂層を設けた多層フィルムが用いられていた（例えば、特開昭５５－１０７４２８号公報等）。 Since heat sealing does not use a laminate resin or the like when bonding the films, the films can be bonded easily and simply. However, the heat sealing process is a method in which the films are partially melted or semi-melted, and the films are bonded to each other, so that different films, for example, a polyolefin film and a polyester film are bonded to each other. It cannot be bonded by heat sealing. In addition, in heat seal processing, it is necessary to use a film made of a resin that can be fused at a relatively low temperature. Therefore, a multilayer film in which a heat sealable resin layer such as polyolefin resin is provided on the outermost surface layer is used. (For example, JP-A-55-107428).
　一方、ラミネート加工によりフィルムどうしを接着する場合には、使用するフィルムの種類（樹脂の種類）に応じてラミネート樹脂の成分を適宜選択することが行われている。
例えば、ポリエステル系フィルムとナイロン系フィルムとを接着することにより袋状に加工する際には、ウレタン系接着剤が使用されていた（例えば、特開昭５２－８２５９４号公報等）。 On the other hand, when films are bonded together by laminating, the components of the laminating resin are appropriately selected according to the type of film to be used (type of resin).
For example, when processing into a bag shape by bonding a polyester film and a nylon film, a urethane adhesive has been used (for example, JP-A-52-82594).
　しかしながら、異種材料からなるフィルムどうしをラミネート樹脂を介して接着し包装体としたものは、ラミネート樹脂成分が徐々に包装体内に溶出または揮発し、内容物を変質させる場合があり、特に、安全性やクリーン性が重視される医療用分野においては、ラミネート樹脂による内容物の汚染が問題となることがあった。また、包装体の長期使用によりラミネート樹脂自体が劣化することもあり、特に屋外等で使用される外装用途においては、ラミネート加工した包装体の耐候性が問題となることもあった。また、接着剤を用いたラミネート技術においては、一般的に溶剤に希釈した樹脂成分を塗布することが行われるため、ラミネートして包装体等のような最終製品となった後にも溶剤が残留してしまうことがあった。 However, in the case of a package made by bonding films made of different materials through a laminate resin, the laminate resin component may gradually elute or volatilize in the package, and the contents may be altered. In the medical field where cleanliness is important, contamination of the contents by the laminate resin may be a problem. In addition, the laminate resin itself may deteriorate due to long-term use of the package, and particularly in exterior applications that are used outdoors, the weather resistance of the laminated package may become a problem. In addition, in the laminating technique using an adhesive, since a resin component diluted in a solvent is generally applied, the solvent remains after laminating to form a final product such as a package. There was a case.
　ところで、放射線や電子線を用いて材料の表面改質を行うことが従来から行われている。例えば、特開２００３－１１９２９３号公報（特許文献３）には、フッ素系樹脂に放射線を照射することにより架橋複合フッ素系樹脂が得られることが提案されている。また、Journal of Photopolymer Science and Technology Vol.19, No. 1 (2006), pp123-127（非特許文献１）には、ポリテトラフルオロエチレンフィルムとポリイミドフィルムとを積層させて高温下で電子線（以下、ＥＢと略す場合もある）を照射することにより、互いを接着することが提案されている。また、Material Transactions Vol.50, No.7 (2009), pp1859-1863（非特許文献２）には、ポリカーボネート樹脂の表面をナイロンフィルムで覆い、その上から電子線（以下、ＥＢと略す場合もある）を照射することにより、ポリカーボネート樹脂表面にナイロンフィルムを接着する技術が提案されている。さらに、日本金属学会誌第７２巻第７号（２００８）、ｐｐ５２６－５３１（非特許文献３）には、シリコーンゴム上に置いたナイロンフィルムの上からＥＢを照射することにより、互いを接着できることが記載されている。 Incidentally, it has been conventionally performed to modify the surface of a material using radiation or an electron beam. For example, Japanese Patent Laid-Open No. 2003-119293 (Patent Document 3) proposes that a crosslinked composite fluorine-based resin can be obtained by irradiating the fluorine-based resin with radiation. Journal of Photopolymer Science and Technology Technology Vol.19, No. 1 (2006), pp123-127 (Non-Patent Document 1) is a polytetrafluoroethylene film and a polyimide film laminated to an electron beam at high temperature ( In the following, it has been proposed to bond each other by irradiating EB. Also, in Material Transactions Vol. 50, No. 7 (2009), pp1859-1863 (Non-patent Document 2), the surface of polycarbonate resin is covered with a nylon film, and an electron beam (hereinafter abbreviated as EB) may be applied from above. A technique for adhering a nylon film to a polycarbonate resin surface has been proposed. Furthermore, in the Journal of the Japan Institute of Metals, Vol. 72, No. 7 (2008), pp526-531 (non-patent document 3), it is possible to bond each other by irradiating EB from a nylon film placed on silicone rubber. Is described.
特開昭５５－１０７４２８号公報JP-A-55-107428 特開昭５２－８２５９４号公報JP-A-52-82594 特開２００３－１１９２９３号公報JP 2003-119293 A
　本発明者らは、今般、異種材料からなるフィルムどうしを接着する場合であっても、フィルムに電子線を照射することにより、ラミネート樹脂等を用いることなく、互いを強固に接着することができる、との知見を得た。本発明はかかる知見によるものである。 In the present invention, even when films made of different materials are bonded to each other, the films can be firmly bonded to each other without using a laminate resin or the like by irradiating the films with an electron beam. , And got the knowledge. The present invention is based on this finding.
　したがって、本発明の目的は、異種材料からなるフィルムどうしを互いに接着する方法において、ラミネート樹脂を用いることなく強固に接着でき、異物や残留溶剤等が滲出することがなく耐候性にも優れた接着方法を提供することである。 Accordingly, an object of the present invention is to adhere strongly to each other without using a laminate resin in a method of adhering films made of different materials to each other, and to have excellent weather resistance without exuding foreign matter or residual solvent. Is to provide a method.
　本発明による方法は、異種材料からなるフィルム基材どうしを互いに接着する方法であって、
　異種材料からなる一対のフィルム基材を準備し、
　少なくとも一方の前記フィルム基材の接着しようとする部分に電子線を照射し、
　前記電子線が照射された部分のみを他方のフィルム基材に接着する、
ことを含んでなることを特徴とするものである。 The method according to the present invention is a method for bonding film substrates made of different materials to each other,
Prepare a pair of film bases made of different materials,
Irradiating at least one of the film bases to be bonded with an electron beam,
Adhering only the part irradiated with the electron beam to the other film substrate,
It is characterized by comprising.
　また、本発明の態様によれば、前記一対のフィルム基材を重ね合わせた後に、いずれか一方のフィルム基材側から電子線照射を行うことが好ましい。 Moreover, according to the aspect of the present invention, it is preferable to perform electron beam irradiation from either one of the film bases after the pair of film bases are overlapped.
　また、本発明の態様によれば、前記一対のフィルム基材を重ね合わせる前に、いずれか一方のフィルム基材側から電子線照射を行うことが好ましい。 Moreover, according to the aspect of the present invention, it is preferable to perform electron beam irradiation from either one of the film bases before the pair of film bases are overlapped.
　また、本発明の態様によれば、前記フィルム基材の電子線を照射した側の面に、他方のフィルム基材を重ね合わせることが好ましい。 Moreover, according to the aspect of the present invention, it is preferable that the other film base material is superposed on the surface of the film base material on which the electron beam is irradiated.
　また、本発明の態様によれば、前記一対のフィルム基材を重ね合わせる前に、両方のフィルム基材に電子線を照射することがこのましい。 Also, according to the aspect of the present invention, it is preferable to irradiate both film bases with an electron beam before the pair of film bases are overlapped.
　また、本発明の態様によれば、前記フィルム基材の電子線を照射した側の面どうしが対向するように、両方のフィルム基材を重ね合わせることが好ましい。 In addition, according to the aspect of the present invention, it is preferable that both film substrates are overlapped so that the surfaces of the film substrate irradiated with the electron beam face each other.
　また、本発明の態様によれば、前記異種材料からなるフィルム基材が、ポリエチレンテレフタレート／ナイロン、ポリエチレンテレフタレート／ポリアミド、ポリエチレンテレフタレート／ポリエチレン、ポリエチレンテレフタレート／ポリプロピレン、ポリエチレン／ナイロン、ポリエチレン／ポリアミド、ポリプロピレン／ナイロン、ポリプロピレン／ポリアミド、エチレンビニルアセテート／ポリエチレン、エチレンビニルアセテート／ポリプロピレン、ポリビニルアルコール／ポリエチレン、ポリビニルアルコール／ポリプロピレン、エチレン－ビニルアルコール共重合体／ポリエチレン、およびエチレン－ビニルアルコール共重合体／ポリプロピレン、から選択される組み合わせであることが好ましい。 Further, according to an aspect of the present invention, the film base material made of the different material is polyethylene terephthalate / nylon, polyethylene terephthalate / polyamide, polyethylene terephthalate / polyethylene, polyethylene terephthalate / polypropylene, polyethylene / nylon, polyethylene / polyamide, polypropylene / From nylon, polypropylene / polyamide, ethylene vinyl acetate / polyethylene, ethylene vinyl acetate / polypropylene, polyvinyl alcohol / polyethylene, polyvinyl alcohol / polypropylene, ethylene-vinyl alcohol copolymer / polyethylene, and ethylene-vinyl alcohol copolymer / polypropylene. It is preferable that the combination is selected.
　また、本発明の態様によれば、前記一対のフィルム基材を重ね合わせた後に、加熱しながら両フィルム基材を押圧することが好ましい。 Moreover, according to the aspect of the present invention, it is preferable that both the film bases are pressed while being heated after the pair of film bases are overlapped.
　また、本発明の態様によれば、押圧をヒートローラで行うことが好ましい。 Moreover, according to the aspect of the present invention, it is preferable that the pressing is performed with a heat roller.
　また、本発明の態様によれば、前記一対のフィルム基材を重ね合わせて押圧した後に、いずれか一方のフィルム基材側から電子線照射を行うことが好ましい。 Moreover, according to the aspect of the present invention, it is preferable to perform electron beam irradiation from either one of the film bases after the pair of film bases are overlapped and pressed.
　また、本発明の態様によれば、前記電子線の吸収線量が、２０～１０００ｋＧｙであり、また、前記電子線の照射を、３０～３００ｋＶの加速電圧において行うことが好ましい。 Further, according to the aspect of the present invention, it is preferable that the absorbed dose of the electron beam is 20 to 1000 kGy, and the irradiation of the electron beam is performed at an acceleration voltage of 30 to 300 kV.
　さらに、本発明の別の態様によれば、上記した方法により異種材料からなるフィルムどうしを接着させた積層体や包装体も提供される。 Furthermore, according to another aspect of the present invention, there are also provided a laminate or a package in which films made of different materials are bonded to each other by the above-described method.
　本発明によれば、異種材料からなるフィルム基材どうし、とりわけ、極性材料からなる樹脂フィルムと非極性材料からなる樹脂フィルムとを接着する場合、融点やガラス転移温度差が大きい樹脂フィルムどうしを接着する場合、また、延伸樹脂フィルムと未延伸樹脂フィルムとを接着する場合などの異種フィルムどうしを互いに接着して袋状とした包装体を製造する方法において、ラミネート樹脂を用いることなく強固に接着でき、異物や残留溶剤等が滲出することがなく耐候性にも優れた包装体を製造することができる。 According to the present invention, when film substrates made of different materials are bonded, particularly when a resin film made of a polar material and a resin film made of a nonpolar material are bonded, the resin films having a large difference in melting point and glass transition temperature are bonded. In a method for manufacturing a bag-like package by bonding different types of films to each other, such as when a stretched resin film and an unstretched resin film are bonded, it can be firmly bonded without using a laminate resin. In addition, it is possible to manufacture a package that is excellent in weather resistance without causing foreign matter or residual solvent to exude.
本発明によるフィルム基材の接着方法の一実施形態を示した概略模式図である。It is the schematic diagram which showed one Embodiment of the adhesion method of the film base material by this invention. フィルム基材の接着方法の好ましい実施形態を示した概略拡大図である。It is the schematic enlarged view which showed preferable embodiment of the adhesion method of a film base material. 本発明によるフィルム基材の接着方法の別の実施形態を示した概略図である。It is the schematic which showed another embodiment of the adhesion method of the film base material by this invention. 本発明によるフィルム基材の接着方法の別の実施形態を示した概略図である。It is the schematic which showed another embodiment of the adhesion method of the film base material by this invention. 本発明によるフィルム基材の接着方法の別の実施形態を示した概略図である。It is the schematic which showed another embodiment of the adhesion method of the film base material by this invention.
　以下、図面を参照しながら、本発明による包装体の製造方法を説明する。図１は、本発明による包装体の製造方法の一実施形態を示した概略模式図であり、異種材料からなるフィルム基材どうしを互いに接着する工程の概略を示したものである。まず、異種材料からなる二種のフィルム基材を準備する（図１（１））。フィルム基材としては、特に制限さるものではなく、ポリエチレンテレフタレート等のポリエステル、ポリカーボネート、ポリアミド、ポリイミド、酢酸セルロース、ポリエチレンビニルアセテート、ポリビニルアルコール、エチレン－ビニルアルコール共重合体、ポリ塩化ビニリデン、ポリ塩化ビニル、ポリスチレン、フッ素樹脂、ポリプロピレン、ポリエチレン、アイオノマー等のプラスチックフィルム等が挙げられ、これら中から選択される二種のフィルム基材を組み合わせることができる。 Hereinafter, the manufacturing method of the package according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a method for producing a package according to the present invention, and shows an outline of a process for bonding film substrates made of different materials to each other. First, two types of film base materials made of different materials are prepared (FIG. 1 (1)). The film substrate is not particularly limited, and is not limited to polyester such as polyethylene terephthalate, polycarbonate, polyamide, polyimide, cellulose acetate, polyethylene vinyl acetate, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polyvinylidene chloride, polyvinyl chloride. And plastic films such as polystyrene, fluororesin, polypropylene, polyethylene, ionomer, etc., and two types of film bases selected from these can be combined.
　通常、上記したような異種材料からなるフィルム基材どうしは、接着剤を用いなければ互いを接着することができない。異種材料からなるフィルムどうしを接着する場合に、その間に接着剤を介在させると、接着剤（ラミネート樹脂）を介して水素結合やファンデルワールス力が形成されることにより、異種材料からなるフィルム基材どうしでも接着する。本発明においては、ラミネート樹脂等の接着剤を全く使用することなく、両フィルム基材どうしを接着するものである。 Usually, film base materials made of different materials as described above cannot be bonded to each other unless an adhesive is used. When bonding films made of different materials, if an adhesive is interposed between them, hydrogen bonds and van der Waals forces are formed through the adhesive (laminate resin), thereby forming a film base made of different materials. Glues between materials. In the present invention, the two film base materials are bonded to each other without using any adhesive such as a laminate resin.
　本発明において、互いを接着するフィルム基材の組み合わせとしては、ポリエチレンテレフタレート／ナイロン、ポリエチレンテレフタレート／ポリアミド、ポリエチレンテレフタレート／ポリエチレン、ポリエチレンテレフタレート／ポリプロピレン、ポリエチレン／ナイロン、ポリエチレン／ポリアミド、ポリプロピレン／ナイロン、ポリプロピレン／ポリアミド、エチレンビニルアセテート／ポリエチレン、エチレンビニルアセテート／ポリプロピレン、ポリビニルアルコール／ポリエチレン、ポリビニルアルコール／ポリプロピレン、エチレン－ビニルアルコール共重合体／ポリエチレン、およびエチレン－ビニルアルコール共重合体／ポリプロピレン、から選択される組み合わせであることが好ましい。 In the present invention, combinations of film base materials that adhere to each other include polyethylene terephthalate / nylon, polyethylene terephthalate / polyamide, polyethylene terephthalate / polyethylene, polyethylene terephthalate / polypropylene, polyethylene / nylon, polyethylene / polyamide, polypropylene / nylon, polypropylene / Combinations selected from polyamide, ethylene vinyl acetate / polyethylene, ethylene vinyl acetate / polypropylene, polyvinyl alcohol / polyethylene, polyvinyl alcohol / polypropylene, ethylene-vinyl alcohol copolymer / polyethylene, and ethylene-vinyl alcohol copolymer / polypropylene It is preferable that
　次に、準備した異種材料からなる一対のフィルム基材を重ね合わせて、図１（２）に示すように、少なくとも一方のフィルム基材の接着しようとする部分５に電子線を照射する。その結果、図１（３）に示すように、電子線が照射された部分のみ、互いのフィルム基材が接着される。この理由は定かではないが、以下のように考えられる。高分子からなる樹脂フィルムに電子線を照射すると、樹脂フィルムの表面にラジカルが発生する。異種材料からなる樹脂フィルムどうしであっても、両フィルムの表面に発生したラジカルが互いに結合して共有結合を形成したり、あるいは、ラジカルの発生により樹脂フィルムの表面に形成された官能基が水素結合を形成し、この水素結合と共有結合との組み合わせにより、異種材料からなる樹脂どうしであっても互いに強固に結合するものと考えられる。なお、本発明において、「電子線」とは、紫外線、コロナ放電、イオン線等の照射エネルギーが１５ｅＶ以下の電磁放射線は含まないものとする。 Next, a pair of prepared film base materials made of different materials are overlapped, and as shown in FIG. 1 (2), at least one portion of the film base material to be bonded is irradiated with an electron beam. As a result, as shown in FIG. 1 (3), the film base materials are bonded only to the portion irradiated with the electron beam. The reason for this is not clear, but can be considered as follows. When an electron beam is irradiated onto a polymer film made of a polymer, radicals are generated on the surface of the resin film. Even if the resin films are made of different materials, the radicals generated on the surfaces of both films are bonded to each other to form a covalent bond, or the functional groups formed on the surface of the resin film by the generation of radicals are hydrogen. By forming a bond and combining the hydrogen bond and the covalent bond, it is considered that resins made of different materials are firmly bonded to each other. In the present invention, “electron beam” does not include electromagnetic radiation having an irradiation energy of 15 eV or less, such as ultraviolet rays, corona discharge, and ion beams.
　本発明においては、フィルム基材に電子線を照射した直後に、図２に示すようにローラー等を用いて重ね合わせたフィルム基材を押圧することが好ましい。フィルム基材の表面は、図２に示すようにミクロレベルで凹凸があるため、互いのフィルム基材を重ね合わせても完全に密着しておらず、両フィルム基材１，２の接触界面５での接触面積が小さい。
本発明においては、電子線を照射した直後にローラー等でフィルム基材１，２を押圧することにより、フィルム基材界面５での接触面積が増加するため、密着性が向上する。 In the present invention, immediately after irradiating the film substrate with an electron beam, it is preferable to press the overlapped film substrate using a roller or the like as shown in FIG. As shown in FIG. 2, the surface of the film base material is uneven at the micro level, so even if the film base materials are overlapped with each other, they are not completely adhered to each other. The contact area at is small.
In this invention, since the contact area in the film base-material interface 5 increases by pressing the film base materials 1 and 2 with a roller etc. immediately after irradiating an electron beam, adhesiveness improves.
　フィルム基材を重ね合わせた後フィルム基材を押圧する際には、加熱しながら両フィルム基材１，２を押圧することが好ましい。加熱しながら押圧することにより、フィルム基材の柔軟性が向上し、フィルム基材界面での接触面積をより増加させることができるため、密着性がより向上する。加熱する温度は、用いるフィルム基材の組み合わせにもよるが、樹脂フィルムが熱変形できる温度であればよく、例えば、フィルム基材を構成する樹脂のガラス転移温度以上に加熱することができる。例えば、異種材料からなるフィルム基材の組み合わせとして、ポリエチレンテレフタレートフィルムとポリエチレンフィルムとを重ね合わせる場合には、加熱温度は８０～１８０℃、好ましくは１３０～１６０℃とする。加熱温度を高くしすぎると、発生したラジカルが失活してしまい、強固な結合を実現できなくなる。なお、押圧の力（接圧）を高くしてもよく、接圧を高くすることにより、加熱温度を低くすることができる。 When the film base material is pressed after the film base materials are overlapped, it is preferable to press both the film base materials 1 and 2 while heating. By pressing while heating, the flexibility of the film base material is improved and the contact area at the film base material interface can be further increased, so that the adhesion is further improved. Although the temperature to heat depends on the combination of the film base material to be used, it should just be a temperature which can heat-deform a resin film, for example, can be heated more than the glass transition temperature of resin which comprises a film base material. For example, when a polyethylene terephthalate film and a polyethylene film are overlaid as a combination of film bases made of different materials, the heating temperature is 80 to 180 ° C., preferably 130 to 160 ° C. If the heating temperature is too high, the generated radicals are deactivated, and a strong bond cannot be realized. The pressing force (contact pressure) may be increased, and the heating temperature can be lowered by increasing the contact pressure.
　重ね合わせたフィルム基材１，２を押圧するには、上記したようにヒートローラ６等を好適に使用できる。また、図２に示すように、重ね合わせたフィルム基材１，２がヒートローラ６と支持ローラー７との間で圧接可能となるように、ヒートローラ６と対向する位置に支持ローラー７を載置してもよい。このようにヒートローラ６と対向する位置に支持ローラー７を載置することにより、フィルム基材１，２とヒートローラ６との接触を線接触に近づけて、ヒートローラ６からの熱によりフィルム基材１，２に発生する変形を最小限に抑えることができる。 In order to press the laminated film bases 1 and 2, the heat roller 6 or the like can be suitably used as described above. In addition, as shown in FIG. 2, the support roller 7 is placed at a position facing the heat roller 6 so that the superposed film bases 1 and 2 can be pressed against each other between the heat roller 6 and the support roller 7. It may be placed. Thus, by placing the support roller 7 at a position facing the heat roller 6, the contact between the film bases 1, 2 and the heat roller 6 is brought close to line contact, and the film base is heated by the heat from the heat roller 6. The deformation generated in the materials 1 and 2 can be minimized.
　図３は、本発明による接着方法の別の態様を示した概略図である。異種材料からなる一対のフィルム基材１，２を重ね合わせて接着する工程において、それぞれのフィルム基材をガイドローラにより電子線照射位置３まで導き、電子線４をフィルム基材１，２に照射した後にヒートローラ６により互いのフィルム基材１，２を押圧する工程を連続的に行うものである。それぞれのフィルム基材はロール状形態として供給されてもよい。 FIG. 3 is a schematic view showing another aspect of the bonding method according to the present invention. In the process of stacking and bonding a pair of film base materials 1 and 2 made of different materials, each film base material is guided to the electron beam irradiation position 3 by a guide roller, and the electron beam 4 is irradiated to the film base materials 1 and 2. After that, the process of pressing the film substrates 1 and 2 with the heat roller 6 is continuously performed. Each film substrate may be supplied in roll form.
　電子線照射装置３からフィルム基材１，２に電子線４を照射する場合、厚みがより小さい方のフィルム基材側から電子線４を照射することが好ましい。電子線は加速電圧が増加するほどその透過力も増大する性質を有しているため、何れか一方のフィルム基材側から電子線を照射した場合に、フィルム基材の厚さによっては、他方のフィルム基材まで電子線が届かないことがある。その場合には、電子線の加速電圧を増加させることにより、他方のフィルム基材の深部まで電子線を到達させることができるが、電子線エネルギーが高くなるに従い、フィルム基材自体を劣化させてしまう。そのため、厚肉のフィルム基材と薄肉のフィルム基材とを重ね合わせて接着する際には、電子線エネルギーをそれほど増大させることなく、薄肉のフィルム基材側から電子線を照射するのが好ましい。このような電子線照射方法を採用することにより、フィルム基材の劣化を最小限に留めることができる。 When irradiating the electron beam 4 from the electron beam irradiation device 3 to the film bases 1 and 2, it is preferable to irradiate the electron beam 4 from the film base side having a smaller thickness. Since the electron beam has the property that the transmission power increases as the acceleration voltage increases, depending on the thickness of the film substrate, when the electron beam is irradiated from either film substrate side, the other The electron beam may not reach the film substrate. In that case, the electron beam can reach the deep part of the other film substrate by increasing the acceleration voltage of the electron beam, but as the electron beam energy increases, the film substrate itself is deteriorated. End up. Therefore, it is preferable to irradiate an electron beam from the thin film substrate side without increasing the electron beam energy so much when the thick film substrate and the thin film substrate are bonded together. . By adopting such an electron beam irradiation method, it is possible to minimize deterioration of the film substrate.
　重ね合わせるフィルム基材が両方とも厚肉である場合には、図３に示すように両方のフィルム基材側から電子線が照射できるように、電子線照射装置３と対向する位置に、別の電子線照射装置３’を設けてもよい。この態様によれば、フィルム基材の厚みに応じて電子線の照射エネルギーを調整することができるため、フィルム基材を劣化させることなく両フィルム基材どうしを接着することができる。 When both the film bases to be overlapped are thick, as shown in FIG. 3, another electron beam irradiation device 3 is placed at a position facing the electron beam irradiation apparatus 3 so that the electron beams can be irradiated from both film bases. You may provide electron beam irradiation apparatus 3 '. According to this aspect, since the irradiation energy of an electron beam can be adjusted according to the thickness of a film base material, both film base materials can be adhere | attached, without deteriorating a film base material.
　図４は、本発明によるフィルム基材の接着方法の別の態様を示した概略図である。この実施態様においては、電子線の照射が、フィルム基材を重ね合わせる前に行われる。先ず、供給されてきた一対のフィルム基材１，２は、両フィルム基材が重ね合わされる前に、電子線照射装置３（３’）により、フィルム基材１（２）へ電子線４（４’）が照射される。図３に示した実施態様では、フィルム基材の電子線照射側と反対側の面どうしが対向するように両フィルム基材を重ね合わせたのに対し、図４に示す実施態様では、フィルム基材の電子線照射側の面どうしが対向するように両フィルム基材を重ね合わせる点が相違している。このように、フィルム基材１の電子線を照射した側の面に他方のフィルム基材２を重ね合わせることにより、フィルム基材の厚みによらず、電子線の照射エネルギーをより小さくすることができ、その結果、フィルム基材の電子線照射による劣化をより低減することができる。 FIG. 4 is a schematic view showing another aspect of the method for bonding a film base according to the present invention. In this embodiment, the electron beam irradiation is performed before the film base material is overlaid. First, the pair of supplied film bases 1 and 2 are transferred to the film base 1 (2) by the electron beam irradiation device 3 (3 ′) before the both film bases are overlapped. 4 ′) is irradiated. In the embodiment shown in FIG. 3, both film bases are overlapped so that the surfaces of the film base opposite to the electron beam irradiation side face each other, whereas in the embodiment shown in FIG. The difference is that the two film base materials are overlapped so that the surfaces on the electron beam irradiation side of the material face each other. Thus, by superimposing the other film substrate 2 on the surface of the film substrate 1 that has been irradiated with the electron beam, the irradiation energy of the electron beam can be reduced regardless of the thickness of the film substrate. As a result, it is possible to further reduce deterioration of the film base material caused by electron beam irradiation.
　また、図４に示した実施態様においても、一対の電子線照射装置３，３’を設けて、図３に示した実施態様と同様に両方のフィルム基材１，２へそれぞれ電子線４，４’を照射してもよい。これらの組み合わせにより、よりフィルム基材の劣化を少なくして接着強度を向上させることができる。 Also in the embodiment shown in FIG. 4, a pair of electron beam irradiation devices 3 and 3 ′ are provided, and the electron beams 4 and 4 are respectively applied to both the film bases 1 and 2 similarly to the embodiment shown in FIG. 3. 4 'may be irradiated. By these combinations, the deterioration of the film substrate can be further reduced and the adhesive strength can be improved.
　図５は、本発明によるフィルム基材の接着方法の別の態様を示した概略図である。この実施態様においては、両フィルム基材１，２を重ね合わせてヒートローラ６により押圧した後に電子線照射を行うものである。先ず、供給されてきた一対のフィルム基材１，２は、ガイドローラに導かれて重ね合わされる。続いて、ヒートローラ６と支持ローラー７とにより両フィルム基材１，２が押圧されるとともに、ヒートローラ６により加熱が行われる。その後、電子線照射装置３によりフィルム基材１，２の表面に電子線４が照射されてフィルム基材の接着が連続的に行われる。また、図５に示した実施態様においても、一対の電子線照射装置３，３’を設けて、図３及び４に示した実施態様と同様に両方のフィルム基材１，２へそれぞれ電子線４，４’を照射してもよい。これらの組み合わせにより、よりフィルム基材の劣化を少なくして接着強度を向上させることができる。 FIG. 5 is a schematic view showing another embodiment of the method for bonding a film substrate according to the present invention. In this embodiment, the electron beam irradiation is performed after the film substrates 1 and 2 are overlapped and pressed by the heat roller 6. First, a pair of supplied film base materials 1 and 2 are led to a guide roller and overlapped. Subsequently, the film bases 1 and 2 are pressed by the heat roller 6 and the support roller 7, and heating is performed by the heat roller 6. Thereafter, the electron beam irradiation device 3 irradiates the surfaces of the film bases 1 and 2 with the electron beam 4 to continuously adhere the film bases. Also in the embodiment shown in FIG. 5, a pair of electron beam irradiation devices 3 and 3 ′ are provided, and the electron beams are applied to both film bases 1 and 2 in the same manner as in the embodiments shown in FIGS. 3 and 4. 4,4 ′ may be irradiated. By these combinations, the deterioration of the film substrate can be further reduced and the adhesive strength can be improved.
　電子線の照射エネルギーは、上記したようにフィルム基材の材質や厚みに応じて適宜調整する必要がある。本発明においては、２０～７５０ｋｅＶ、好ましくは２５～４００ｋｅＶ、より好ましくは３０～３００ｋｅＶ程度の照射エネルギー範囲で電子線を照射するが、より低い照射エネルギーとすることが好ましく、２０～２００ｋｅＶとすることができる。このように低い照射エネルギーとすることにより、フィルムの劣化を抑制できるだけでなく、フィルム表面のラジカル発生がより効率的におこるため、より強固な結合を実現することができる。また、電子線の吸収線量は、１０～２０００ｋＧｙ、好ましくは２０～１０００ｋＧｙの範囲である。 The irradiation energy of the electron beam needs to be appropriately adjusted according to the material and thickness of the film base as described above. In the present invention, the electron beam is irradiated in an irradiation energy range of about 20 to 750 keV, preferably 25 to 400 keV, more preferably about 30 to 300 keV, but a lower irradiation energy is preferable, and 20 to 200 keV. Can do. Thus, by setting it as low irradiation energy, not only deterioration of a film can be suppressed, but since radical generation | occurrence | production of a film surface occurs more efficiently, stronger bond can be implement | achieved. The absorbed dose of the electron beam is in the range of 10 to 2000 kGy, preferably 20 to 1000 kGy.
　このような電子線照射装置としては、従来公知のものを使用でき、例えばカーテン型電子照射装置（ＬＢ１０２３、株式会社アイ・エレクトロンビーム社製）やライン照射型低エネルギー電子線照射装置（ＥＢ－ＥＮＧＩＮＥ、浜松フォトニクス株式会社製）等を好適に使用することができる。 As such an electron beam irradiation apparatus, conventionally known ones can be used. For example, a curtain type electron irradiation apparatus (LB1023, manufactured by I. Electron Beam Co., Ltd.) or a line irradiation type low energy electron beam irradiation apparatus (EB-ENGINE). , Manufactured by Hamamatsu Photonics Co., Ltd.) can be preferably used.
　電子線を照射する際には、酸素濃度を１００ｐｐｍ以下とすることが好ましい。酸素存在下で電子線を照射するとオゾンが発生するため環境に悪影響を及ぼすとともにフィルム基材の表面がオゾンと反応してフィルム特性が変化してしまう場合があるからである。酸素濃度を１００ｐｐｍ以下とするには、真空下または窒素やアルゴン等の不活性ガス雰囲気下において、フィルム基材に電子線を照射すればよく、例えば、電子線照射装置内を窒素充填することにより、酸素濃度１００ｐｐｍ以下を達成することができる。 When the electron beam is irradiated, the oxygen concentration is preferably 100 ppm or less. This is because irradiation with an electron beam in the presence of oxygen generates ozone, which adversely affects the environment and the surface of the film substrate may react with ozone to change the film characteristics. In order to reduce the oxygen concentration to 100 ppm or less, the film substrate may be irradiated with an electron beam in a vacuum or in an inert gas atmosphere such as nitrogen or argon. For example, by filling the electron beam irradiation apparatus with nitrogen. An oxygen concentration of 100 ppm or less can be achieved.
　上記した接着方法によって、異種材料からなるフィルム基材どうしを接着すると、従来のラミネート樹脂を用いた接着と同等またはそれ以上の接着強度を実現できる。また、ラミネート樹脂等を全く用いていないため、積層フィルムを使用する際にも異物や残留溶剤等が滲出することがなく、また耐候性にも優れるものとなる。 When the film bases made of different materials are bonded to each other by the bonding method described above, an adhesive strength equal to or higher than that using a conventional laminate resin can be realized. In addition, since no laminate resin or the like is used, foreign matter and residual solvent do not ooze out when using a laminated film, and the weather resistance is excellent.
　異種材料からなる基材フィルムを貼り合わせて積層フィルムを製造する場合に限らず、多層積層フィルムにように表と裏とが異種材料フィルム基材からなる場合に、多層積層フィルムの表面と裏面とを貼り合わせて袋状とする場合にも、本発明による接着方法が好適に適用できる。特に、医療分野で使用されている包装体、例えばシリンジ包装袋や粉末あるいは顆粒状の医薬品を充填包装するための包装体等は、上記のような機能性多層フィルムが使用されており、これら機能性多層フィルムから包装体を製造する際に本発明による接着方法を用いれば、ラミネート樹脂等を全く使用することなく包装体を製造することができるため、充填物である医薬品の品質を保持することができる。 Not only when manufacturing a laminated film by laminating base films made of different materials, but when the front and back are made of different material film base materials as in the multilayer laminated film, the front and back surfaces of the multilayer laminated film The bonding method according to the present invention can also be suitably applied to the case where the two are bonded to form a bag. In particular, a packaging body used in the medical field, such as a syringe packaging bag or a packaging body for filling and packaging a powder or granular pharmaceutical product, uses the functional multilayer film as described above. If the adhesive method according to the present invention is used when manufacturing a packaging body from a porous multilayer film, the packaging body can be produced without using any laminate resin, etc., so that the quality of the pharmaceutical product as a filler can be maintained. Can do.
実施例１
＜フィルム基材の準備＞
　２種の異なる材料からなるフィルム基材として、厚み２５μｍの二軸延伸ポリエチレンテレフタレートフィルム（エスペットＴ４１０２、東洋紡株式会社製）と、厚み８０μｍの未延伸直鎖状低密度ポリエチレンフィルム（エボリューＳＰ２０２０、株式会社プライムポリマー製）を準備した。 Example 1
<Preparation of film substrate>
As a film substrate composed of two different materials, a biaxially stretched polyethylene terephthalate film (Espet T4102, manufactured by Toyobo Co., Ltd.) having a thickness of 25 μm and an unstretched linear low density polyethylene film (Evolu SP2020, stock) having a thickness of 80 μm Company Prime Polymer) was prepared.
＜フィルム基材の接着＞
　二軸延伸ポリエチレンテレフタレートフィルムの未処理面と未延伸直鎖状低密度ポリエチレンフィルムとが対向するように互いのフィルムを重ね合わせた。次いで、カーテン型電子線照射装置（ＬＢ１０２３、株式会社アイ・エレクトロンビーム製）を用いて、下記の照射条件にて、積層フィルム表面にポリエチレンテレフタレートフィルム側から電子線を照射した。
　電圧：１６５ｋＶ、電流値：３．９ｍＡ、照射線量：７５０ｋＧｙ
　装置内フィルム搬送速度：５ｍ／分
　装置内酸素濃度：１００ｐｐｍ以下
　続いて、電子線照射した後すぐに、重ね合わせたフィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。 <Adhesion of film base>
The films were overlapped so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other. Next, using a curtain type electron beam irradiation apparatus (LB1023, manufactured by I. Electron Beam Co., Ltd.), an electron beam was irradiated from the polyethylene terephthalate film side on the laminated film surface under the following irradiation conditions.
Voltage: 165 kV, current value: 3.9 mA, irradiation dose: 750 kGy
In-apparatus film transport speed: 5 m / min In-apparatus oxygen concentration: 100 ppm or less Subsequently, immediately after irradiation with an electron beam, the film was heated on a superposed film by a rubber heat roll at 150 ° C. and 0.6 MPa. Was pressed.
実施例２
　電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：１６５ｋＶ、電流値：３．９ｍＡ、照射線量：５００ｋＧｙ Example 2
The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation.
Voltage: 165 kV, current value: 3.9 mA, irradiation dose: 500 kGy
実施例３
　電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：１６５ｋＶ、電流値：３．９ｍＡ、照射線量：２５０ｋＧｙ Example 3
The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation.
Voltage: 165 kV, current value: 3.9 mA, irradiation dose: 250 kGy
比較例１
　実施例１で用いた２種のフィルムと同じものを互いに重ね合わせ、フィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。 Comparative Example 1
The same two types of films used in Example 1 were superposed on each other, and the film was pressed from above the film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
比較例２
　実施例１で用いた２種のフィルムと同じものを用意し、これらフィルムを、下記の組成のウレタン系接着剤を介して重ね合わせ、フィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。
＜ウレタン接着剤組成＞
　主剤：ＲＵ０００４（ロックペイント製）
　硬化剤：Ｈ－１（ロックペイント製）
　混合比率：主剤／硬化剤＝７．４７／１（重量比率）
　溶剤：酢酸エチル Comparative Example 2
The same two types of films used in Example 1 were prepared, and these films were overlapped with each other via a urethane adhesive having the following composition. The film was pressed under the condition of 6 Mpa.
<Urethane adhesive composition>
Main agent: RU0004 (Rock Paint)
Hardener: H-1 (Rock Paint)
Mixing ratio: main agent / curing agent = 7.47 / 1 (weight ratio)
Solvent: ethyl acetate
実施例４
　実施例１で用いた二種のフィルムと同じものを用意し、二軸延伸ポリエチレンテレフタレートフィルムの未処理面と未延伸直鎖状低密度ポリエチレンフィルムとが対向するように互いのフィルムを重ね合わせる前に、各フィルムの接着面側の両方に、カーテン型電子線照射装置（ＬＢ１０２３、株式会社アイ・エレクトロンビーム製）を用いて、下記の照射条件にて電子線を照射した後、互いを重ね合わせた。次いで、重ね合わせたフィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。
　電圧：９０ｋＶ、電流値：４．９ｍＡ、照射線量：７５０ｋＧｙ
　装置内フィルム搬送速度：５ｍ／分
　装置内酸素濃度：１００ｐｐｍ以下 Example 4
Before preparing the same film as the two types of films used in Example 1 and superimposing each other so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other In addition, using a curtain type electron beam irradiation device (LB1023, manufactured by I. Electron Beam Co., Ltd.) on both of the adhesion surfaces of each film, the electron beams are irradiated under the following irradiation conditions, and then overlap each other. It was. Next, the film was pressed from above the laminated film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
Voltage: 90 kV, current value: 4.9 mA, irradiation dose: 750 kGy
In-apparatus film transport speed: 5 m / min In-apparatus oxygen concentration: 100 ppm or less
実施例５
　電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
電圧：９０ｋＶ、電流値：４．９ｍＡ、照射線量：５００ｋＧｙ Example 5
The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation.
Voltage: 90 kV, current value: 4.9 mA, irradiation dose: 500 kGy
実施例６
＜フィルム基材の準備＞
２種の異なる材料からなるフィルム基材として、幅１７０ｍｍ、長さ２００ｍのロール状形態で供給される厚み２５μｍの二軸延伸ポリエチレンテレフタレートフィルム（エスペットＴ４１０２、東洋紡株式会社製）と、同サイズのロール状形態で供給される厚み８０μｍの未延伸直鎖状低密度ポリエチレンフィルム（エボリューＳＰ２０２０、株式会社プライムポリマー製）を準備した。 Example 6
<Preparation of film substrate>
As a film base made of two different materials, a biaxially stretched polyethylene terephthalate film (Espet T4102, manufactured by Toyobo Co., Ltd.) with a thickness of 25 μm supplied in a roll form having a width of 170 mm and a length of 200 m, and the same size An unstretched linear low-density polyethylene film (Evolue SP2020, manufactured by Prime Polymer Co., Ltd.) having a thickness of 80 μm and supplied in a roll form was prepared.
＜フィルム基材の接着＞
　上記のフィルムを用い、電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：１４５ｋＶ、電流値：１０ｍＡ、照射線量：６９０ｋＧｙ
　装置内のＷＥＢ搬送ラフィルム：３ｍ／分
　装置内酸素濃度：１００ｐｐｍ以下 <Adhesion of film base>
The films made of different materials were bonded to each other in the same manner as in Example 1 except that the above film was used and the electron beam irradiation was changed under the following conditions.
Voltage: 145 kV, current value: 10 mA, irradiation dose: 690 kGy
WEB transport film in the device: 3 m / min Oxygen concentration in the device: 100 ppm or less
実施例７
電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：１４５ｋＶ、電流値：５．２ｍＡ、照射線量：３６０ｋＧｙ Example 7
The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation.
Voltage: 145 kV, current value: 5.2 mA, irradiation dose: 360 kGy
実施例８
電子線の照射を下記の条件を代えた以外は実施例１と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：１４５ｋＶ、電流値：２．９ｍＡ、照射線量：２００ｋＧｙ Example 8
The films made of different materials were adhered to each other in the same manner as in Example 1 except that the following conditions were changed for the electron beam irradiation.
Voltage: 145 kV, current value: 2.9 mA, irradiation dose: 200 kGy
実施例９
　実施例１で用いた二種のフィルムと同じものを用意し、二軸延伸ポリエチレンテレフタレートフィルムの未処理面と未延伸直鎖状低密度ポリエチレンフィルムとが対向するように互いのフィルムを重ね合わせる前に、各フィルムの接着面側の両方に、ライン照射型低エネルギー電子線照射装置（ＥＢ－ＥＮＧＩＮＥ、浜松フォトニクス株式会社製）を用いて、下記の照射条件にて電子線を照射した後、互いを重ね合わせた。次いで、重ね合わせたフィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。
　電圧：７０ｋＶ、電流値：１ｍＡ、照射線量：６５０ｋＧｙ
　装置内フィルム搬送速度：２０ｍｍ／秒
　装置内酸素濃度：１００ｐｐｍ以下 Example 9
Before preparing the same film as the two types of films used in Example 1 and superimposing each other so that the untreated surface of the biaxially stretched polyethylene terephthalate film and the unstretched linear low-density polyethylene film face each other In addition, both of the adhesive surfaces of each film were irradiated with an electron beam under the following irradiation conditions using a line irradiation type low energy electron beam irradiation apparatus (EB-ENGINE, manufactured by Hamamatsu Photonics Co., Ltd.) Are superimposed. Next, the film was pressed from above the laminated film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
Voltage: 70 kV, current value: 1 mA, irradiation dose: 650 kGy
In-apparatus film transport speed: 20 mm / sec In-apparatus oxygen concentration: 100 ppm or less
実施例１０
　電子線の照射線量及びフィルム搬送速度を下記に変更した以外は実施例９と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：７０ｋＶ、電流値：１ｍＡ、照射線量：４３０ｋＧｙ
　装置内フィルム搬送速度：３０ｍｍ／秒 Example 10
The films made of different materials were adhered to each other in the same manner as in Example 9 except that the electron beam irradiation dose and the film conveyance speed were changed as follows.
Voltage: 70 kV, current value: 1 mA, irradiation dose: 430 kGy
In-apparatus film transport speed: 30 mm / second
実施例１１
＜フィルム基材の準備＞
　２種の異なる材料からなるフィルム基材として、厚み２５μｍの二軸延伸ナイロンフィルム（エンブレム、東洋紡株式会社製）と、厚み８０μｍの未延伸直鎖状低密度ポリエチレンフィルム（エボリューＳＰ２０２０、株式会社プライムポリマー製）を準備した。 Example 11
<Preparation of film substrate>
As a film substrate made of two different materials, a biaxially stretched nylon film (emblem, manufactured by Toyobo Co., Ltd.) with a thickness of 25 μm and an unstretched linear low-density polyethylene film (Evolu SP2020, Prime Polymer Co., Ltd.) with a thickness of 80 μm Prepared).
＜フィルム基材の接着＞
二軸延伸ナイロンフィルムの未処理面と未延伸直鎖状低密度ポリエチレンフィルムとが対向するように互いのフィルムを重ね合わせる前に、各フィルムの接着面側の両方に、ライン照射型低エネルギー電子線照射装置（ＥＢ－ＥＮＧＩＮＥ、浜松フォトニクス株式会社製）を用いて、下記の照射条件にて電子線を照射した後、互いを重ね合わせた。次いで、重ね合わせたフィルム上からゴム製のヒートロールにより、１５０℃、０．６Ｍｐａの条件でフィルムの押圧を行った。
　電圧：７０ｋＶ、電流値：１ｍＡ、照射線量：６５０ｋＧｙ
　装置内のＷＥＢ搬送ライン速度：２０ｍｍ／秒
　装置内酸素濃度：１００ｐｐｍ以下 <Adhesion of film base>
Before superimposing each other so that the untreated surface of the biaxially stretched nylon film and the unstretched linear low-density polyethylene film face each other, the line irradiation type low-energy electrons are placed on both the adhesive surfaces of each film. Using an electron beam irradiation device (EB-ENGINE, manufactured by Hamamatsu Photonics Co., Ltd.), the electron beams were irradiated under the following irradiation conditions, and then superposed on each other. Next, the film was pressed from above the laminated film with a rubber heat roll under the conditions of 150 ° C. and 0.6 Mpa.
Voltage: 70 kV, current value: 1 mA, irradiation dose: 650 kGy
WEB conveyance line speed in the apparatus: 20 mm / second Oxygen concentration in the apparatus: 100 ppm or less
実施例１２
　電子線の照射線量及びフィルム搬送速度を下記に変更した以外は実施例９と同様にして、異種材料からなるフィルムどうしの接着を行った。
　電圧：７０ｋＶ、電流値：１ｍＡ、照射線量：４３０ｋＧｙ
　装置内フィルム搬送速度：３０ｍｍ／秒 Example 12
The films made of different materials were adhered to each other in the same manner as in Example 9 except that the electron beam irradiation dose and the film conveyance speed were changed as follows.
Voltage: 70 kV, current value: 1 mA, irradiation dose: 430 kGy
In-apparatus film transport speed: 30 mm / second
比較例３
　実施例１において、電子線の照射に代えて、キセノンランプ（エキシマスキャン式スタンドアローン装置、株式会社エム・ディエキシマ社製）を用いて、下記の照射条件にて、積層フィルム表面にポリエチレンテレフタレートフィルム側から電離放射線を照射した以外は、実施例１と同様にして異種材料からなるフィルムどうしの接着を行った。
　照射エネルギー：７．２ｅＶ
　積算照度：５０ｍＷ／ｃｍ２
　照射距離：ランプ管面から基材まで２ｍｍ
　装置内フィルム搬送速度：１ｍ／分
　装置内酸素濃度：窒素フローにより１％に制御 Comparative Example 3
In Example 1, a polyethylene terephthalate film is formed on the surface of the laminated film under the following irradiation conditions using a xenon lamp (excimer scan stand-alone device, manufactured by M. Diexima Co., Ltd.) instead of electron beam irradiation. The films made of different materials were bonded to each other in the same manner as in Example 1 except that the ionizing radiation was irradiated from the side.
Irradiation energy: 7.2 eV
Integrated illuminance: 50 mW / cm 2
Irradiation distance: 2mm from lamp tube surface to base material
In-apparatus film transport speed: 1 m / min In-apparatus oxygen concentration: controlled to 1% by nitrogen flow
＜フィルム接着強度の評価＞
　実施例１～１２及び比較例１～３において得られた積層フィルムを幅１５ｍｍの短冊状になるように切り出し、引張試験機（テンシロン万能材料試験機ＲＴＣ－１３１０Ａ、ＯＲＩＥＮＴＥＣ社製）を用いて、５０ｍｍ／分の剥離速度にて接着強度試験を行った。なお、比較例１および３の試験片は、剥離試験を行うまでもなく、互いのフィルムが接着していなかった。評価結果は下記の表１に示される通りであった。 <Evaluation of film adhesive strength>
The laminated films obtained in Examples 1 to 12 and Comparative Examples 1 to 3 were cut into strips having a width of 15 mm, and a tensile tester (Tensilon Universal Material Tester RTC-1310A, manufactured by ORIENTEC) was used. The adhesion strength test was performed at a peeling rate of 50 mm / min. In addition, the test piece of Comparative Examples 1 and 3 did not adhere to each other's film without performing a peel test. The evaluation results were as shown in Table 1 below.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　１，２　フィルム基材、３　電子線照射装置、４　電子線、５　フィルム基材接触界面、６　ヒートローラ、７　支持ローラー 1, 2, film substrate, 3, electron beam irradiation device, 4, electron beam, 5, film substrate contact interface, 6 heat roller, 7 support roller

Claims (15)

  1. 　異種材料からなるフィルム基材どうしを互いに接着する方法であって、
    　異種材料からなる一対のフィルム基材を準備し、
    　少なくとも一方の前記フィルム基材の接着しようとする部分に電子線を照射し、
    　前記電子線が照射された部分のみを他方のフィルム基材に接着する、
    ことを含んでなることを特徴とする、方法。     A method of bonding film substrates made of different materials to each other,
    Prepare a pair of film bases made of different materials,
    Irradiating at least one of the film bases to be bonded with an electron beam,
    Adhering only the part irradiated with the electron beam to the other film substrate,
    A method comprising the steps of:
  2. 　前記一対のフィルム基材を重ね合わせた後に、いずれか一方のフィルム基材側から電子線照射を行う、請求項１に記載の方法。 The method according to claim 1, wherein after the pair of film base materials are overlapped, electron beam irradiation is performed from either one of the film base materials.
  3. 　前記一対のフィルム基材を重ね合わせる前に、いずれか一方のフィルム基材側から電子線照射を行う、請求項１に記載の方法。 The method according to claim 1, wherein the electron beam irradiation is performed from either one of the film bases before the pair of film bases are overlapped.
  4. 　前記フィルム基材の電子線を照射した側の面に、他方のフィルム基材を重ね合わせる、請求項３に記載の方法。 The method according to claim 3, wherein the other film base material is superposed on the surface of the film base material on which the electron beam is irradiated.
  5. 　前記一対のフィルム基材を重ね合わせる前に、両方のフィルム基材に電子線を照射する、請求項１に記載の方法。 The method according to claim 1, wherein both the film bases are irradiated with an electron beam before the pair of film bases are superposed.
  6. 前記フィルム基材の電子線を照射した側の面どうしが対向するように、両方のフィルム基材を重ね合わせる、請求項５に記載の方法。 The method according to claim 5, wherein both film substrates are overlapped so that the surfaces of the film substrate irradiated with an electron beam face each other.
  7. 　前記異種材料からなるフィルム基材が、ポリエチレンテレフタレート／ナイロン、ポリエチレンテレフタレート／ポリアミド、ポリエチレンテレフタレート／ポリエチレン、ポリエチレンテレフタレート／ポリプロピレン、ポリエチレン／ナイロン、ポリエチレン／ポリアミド、ポリプロピレン／ナイロン、ポリプロピレン／ポリアミド、エチレンビニルアセテート／ポリエチレン、エチレンビニルアセテート／ポリプロピレン、ポリビニルアルコール／ポリエチレン、ポリビニルアルコール／ポリプロピレン、エチレン－ビニルアルコール共重合体／ポリエチレン、およびエチレン－ビニルアルコール共重合体／ポリプロピレンから選択される組み合わせである、請求項１～６のいずれか一項に記載の方法。 The film substrate made of the different material is polyethylene terephthalate / nylon, polyethylene terephthalate / polyamide, polyethylene terephthalate / polyethylene, polyethylene terephthalate / polypropylene, polyethylene / nylon, polyethylene / polyamide, polypropylene / nylon, polypropylene / polyamide, ethylene vinyl acetate / A combination selected from polyethylene, ethylene vinyl acetate / polypropylene, polyvinyl alcohol / polyethylene, polyvinyl alcohol / polypropylene, ethylene-vinyl alcohol copolymer / polyethylene, and ethylene-vinyl alcohol copolymer / polypropylene. 7. The method according to any one of 6.
  8. 　前記一対のフィルム基材を重ね合わせた後に、加熱しながら両フィルム基材を押圧する、請求項１～７のいずれか一項に記載の方法。 The method according to any one of claims 1 to 7, wherein after the pair of film base materials are overlapped, both film base materials are pressed while being heated.
  9. 　押圧をヒートローラで行う、請求項８に記載の方法。 The method according to claim 8, wherein the pressing is performed with a heat roller.
  10. 　前記一対のフィルム基材を重ね合わせて押圧した後に、いずれか一方のフィルム基材側から電子線照射を行う、請求項２に記載の方法。 The method according to claim 2, wherein after the pair of film base materials are overlapped and pressed, electron beam irradiation is performed from either one of the film base materials.
  11. 　前記電子線の吸収線量が、２０～１０００ｋＧｙである、請求項１～１０に記載の方法。 The method according to any one of claims 1 to 10, wherein the absorbed dose of the electron beam is 20 to 1000 kGy.
  12. 　前記電子線の照射を、３０～３００ｋＶの加速電圧において行う、請求項１～１１に記載の方法。 The method according to any one of claims 1 to 11, wherein the electron beam irradiation is performed at an acceleration voltage of 30 to 300 kV.
  13. 　請求項１～１２のいずれか一項に記載の方法により異種材料からなるフィルムどうしを接着させた積層体。 A laminate in which films made of different materials are bonded together by the method according to any one of claims 1 to 12.
  14. 　請求項１～１２のいずれか一項に記載の方法を用いて包装体を製造する方法。 A method for producing a package using the method according to any one of claims 1 to 12.
  15. 　請求項１４に記載の方法により得られた包装体。 A package obtained by the method according to claim 14.
PCT/JP2011/064817 2011-06-28 2011-06-28 Method for bonding film base materials WO2013001606A1 (en)

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JP2016147694A (en) * 2015-02-13 2016-08-18 凸版印刷株式会社 Biaxially stretched polyester film and packaging bag including the same
JP2016199724A (en) * 2015-04-14 2016-12-01 凸版印刷株式会社 Surface treatment method for biaxially stretched polyester film
JP6048563B1 (en) * 2015-10-27 2016-12-21 凸版印刷株式会社 Biaxially stretched polyester film, packaging bag using the same, and method for imparting heat sealability
JP2017001311A (en) * 2015-06-11 2017-01-05 凸版印刷株式会社 Film, packaging bag and method for imparting heat sealability to film
WO2017006521A1 (en) * 2015-07-07 2017-01-12 凸版印刷株式会社 Film, packaging bag obtained tehrefrom, and method for imparting heat sealability to film
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WO2017006521A1 (en) * 2015-07-07 2017-01-12 凸版印刷株式会社 Film, packaging bag obtained tehrefrom, and method for imparting heat sealability to film
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JP6048563B1 (en) * 2015-10-27 2016-12-21 凸版印刷株式会社 Biaxially stretched polyester film, packaging bag using the same, and method for imparting heat sealability
JP2017082070A (en) * 2015-10-27 2017-05-18 凸版印刷株式会社 Biaxially oriented polyester film, packaging bag using the same and method for imparting heat sealability
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