WO2012165666A1

WO2012165666A1 - Thermal fuse

Info

Publication number: WO2012165666A1
Application number: PCT/KR2011/003929
Authority: WO
Inventors: 이종호
Original assignee: Lee Jong-Ho
Priority date: 2011-05-27
Filing date: 2011-05-27
Publication date: 2012-12-06

Abstract

The present invention relates to a thermal fuse, more specifically to a thermal fuse which is arranged on a circuit of an electronic device, and prevents overheating of a circuit and an electronic equipment including the circuit by disconnecting the connected circuit when ambient temperature and the temperature of the circuit rise.

Description

Temperature fuse

The present invention relates to a temperature fuse, and more particularly, to a temperature fuse disposed on a circuit of an electronic device to prevent an abnormal heating of the circuit by disconnecting the connected circuit when the ambient temperature and the temperature of the circuit rise.

As is well known, on a circuit of a highly heat-generating electronic device such as a refrigerator or a PDP TV, a temperature fuse for disconnecting the circuit through melting of the melted material by abnormal heating and a current fuse for preventing damage to the circuit due to the application of overcurrent are provided. Each is provided to prevent damage to the circuit due to abnormal heating of the circuit and application of a temporary current.

On the other hand, Korean Patent Publication No. 560058 provides a protection device in the form of connecting a resistor separately manufactured to the outside of the temperature fuse containing the soluble material in series, and receiving the series connected temperature fuse and the resistor in a separate case, from the device The function of the current fuse in which the circuit is short-circuited by the overcurrent is achieved by the temperature fuse in which the circuit is short-circuited by the generated external heat.

However, since the protection element configured as described above has to provide a resistor manufactured separately outside the temperature fuse and accommodate the series connected temperature fuse and the resistor in a separate case, the structure is complicated and the accompanying cost of manufacturing increases. In addition, the heat generated from the resistor is difficult to conduct quickly to the soluble substance in the temperature fuse, and has a disadvantage in that the reaction rate is slow.

On the other hand, the inventors of the Republic of Korea No. 0936232 configured the movable terminal of the temperature fuse supported by the soluble substance as a resistor, the circuit by the heating of the movable terminal due to the melting of the soluble matter according to the abnormal heating of the ambient temperature, or the application of overcurrent A thermal fuse has been proposed to disconnect.

The spread of the temperature fuse has resulted in an increase in volume and a reduction in additional costs due to the provision of a separate current fuse. However, the patent invention adopts an organic compound having volatilization characteristics such as moisture as a soluble material supporting the movable terminal. As a result, the following problems occur and it is difficult to have stable durability.

That is, the temperature fuse repeats heating and cooling due to its characteristics, and the sealing structure formed between the case and the insulating bush having different thermal expansion rates is damaged, and moisture is introduced into the case containing the soluble material through the gap formed between the damaged case and the insulating bush. The phenomenon that the air containing the inflow may occur.

In this way, when the soluble substance is exposed to moisture-containing air for a long time, the volatilization or deformation of the soluble substance dissolves the support state of the movable terminal by the soluble substance, causing the circuit to be disconnected without abnormal overheating, resulting in stable durability. I don't have it

An object of the present invention devised to solve the above problems is to provide a temperature fuse configured to ensure a stable support state of the movable terminal through the support and the second spring even if air containing moisture into the housing space of the case is introduced. have.

The above object is achieved by the following configuration provided in the present invention.

The temperature fuse according to the present invention,

A case made of a conductive material having an open space on one side; A connection terminal connected to an outer wall of the case; A hollow insulating bush sealing one side of the receiving space of the open case; A lead terminal disposed in the hollow of the insulating bush and forming an insulating state with the case; A movable terminal installed in the accommodation space of the case and having a contact with an inner wall of the case; A first spring disposed between the heat transfer bush and the movable terminal and holding the movable terminal on the other side; And a second spring disposed between the movable terminal and the available material to hold the movable terminal in one piece to form a conductive state between the movable terminal and the lead terminal.

On the other side of the case accommodating space, a support made of a soluble material that is melted upon abnormal overheating is disposed, and a first spring for holding the movable terminal to the other side is disposed between the heat transfer bush and the movable terminal, and a soluble material is disposed between the movable terminal and the soluble material. A second spring for supporting the movable terminal in one piece by the support to form a conductive state between the movable terminal and the lead terminal is disposed, respectively, wherein the support is made of a metal soluble material.

On the other hand, the temperature fuse according to the second embodiment of the present invention, the case is made of a conductive material having an open receiving space; A connection terminal connected to an outer wall of the case; A hollow insulating bush sealing one side of the receiving space of the open case; A lead terminal disposed in the hollow of the insulating bush and forming an insulating state with the case; A movable terminal installed in the accommodation space of the case and having a contact with an inner wall of the case; A first spring disposed between the heat transfer bush and the movable terminal and holding the movable terminal on the other side; It is configured to include a second spring disposed between the movable terminal and the available material to hold the movable terminal in one piece to form a conductive state between the movable terminal and the lead terminal,

On the other side of the case accommodating space, a support made of a soluble material that is melted upon abnormal overheating is disposed, and a first spring for holding the movable terminal to the other side is disposed between the heat transfer bush and the movable terminal, and a soluble material is disposed between the movable terminal and the soluble material. A second spring for supporting the movable terminal to one side by a support to form a conductive state between the movable terminal and the lead terminal is disposed, respectively, while a metal having a lower melting point than the support is formed between one surface of the soluble material and the inner wall of the receiving space. It is characterized in that the sealing film made of a soluble material is formed.

Preferably, the soluble material of the metal material is any one of tin (Sn), bismuth (Bi), indium (in), lead (Pb), or an alloy mixture thereof, or an organic compound mixed with these metal materials. It consists of an alloy.

More preferably, the movable terminal is composed of a resistance heating element, and when the overcurrent is applied, the movable terminal is heated to melt the soluble material.

As described above, since the temperature fuse according to the present invention is damaged or deformed by the improvement of the material of the support itself or other conditions except for the temperature condition through the sealing of the support, the support is damaged by the air containing temperature moisture. Therefore, the phenomenon of disconnection between the movable terminal and the lead terminal can be prevented.

Further, in the present invention, by adding a contact cap to the movable terminal to adjust the contact angle between them by interference with the lead terminal, a stable contact state between the movable terminal and the lead terminal is always formed, according to the present invention Temperature fuse according to has a safety according to the current conduction.

In addition, by configuring the movable terminal as a resistance heating element as in the present invention to heat itself when the overcurrent is applied, and to melt the support, as well as the original function of the temperature fuse to control the disconnection of the circuit by the ambient temperature conditions In addition, the present invention also has the function of a current fuse, and the present invention also has the advantage that the general problem of adding a current fuse on the circuit can be solved.

1 and 2 show the decomposition state and the incision state of the temperature fuse proposed in the first embodiment of the present invention,

3 and 4 show the cross-sectional configuration and operating state of the temperature fuse proposed in the first embodiment in the present invention,

5 and 6 show the decomposition state and the incision state of the temperature fuse proposed in the second embodiment of the present invention,

7 and 8 show the cross-sectional configuration and the working state of the temperature fuse proposed in the second embodiment of the present invention.

Hereinafter, a temperature fuse according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 show the decomposition state and the cut-off state of the temperature fuse proposed in the first embodiment in the present invention, Figure 3 and Figure 4 is a cross section of the temperature fuse proposed in the first embodiment in the present invention 5 and 6 show the decomposition state and the cut-off state of the temperature fuse proposed as the second embodiment in the present invention, and FIGS. 7 and 8 show the second embodiment in the present invention. It shows the cross-sectional configuration and working state of the proposed temperature fuse.

The temperature fuse (1, 1 ') according to the present invention, as shown in Figures 1 to 8, the case 10 of the conductive material having a connection terminal 12 and the receiving space 11 is open one side; An insulating bush 20 of a hollow 21 for sealing one side of the receiving space 11 of the opened case 10; A lead terminal 30 disposed in the hollow 21 of the insulation bush 20 to form an insulation state with the case 10; And a movable terminal 40 installed in the accommodation space 11 of the case 10 and having a contact with the inner wall of the case 10.

The thermal fuses 1 and 1 'have a conductive state when the movable terminal 40 installed in the accommodation space 11 of the case 10 is transferred to one side to form an energized state with the lead terminal 30. When the movable terminal 40 is transferred to the other side and spaced apart from the lead terminal 30, the circuit is configured to form a disconnected state.

To this end, support bodies 50 and 50 'made of a soluble material that is melted upon abnormally overheating are disposed in the other piece of the receiving space 11 of the case 10, between the insulating bush 20 and the movable terminal 40. A first spring 61 is disposed, and a second spring 62 is disposed between the movable terminal 40 and the supports 50 and 50 '.

At this time, the holding force of the second spring 62 is made larger than the holding force of the first spring 61, so that the second spring 62 is the support (50, 50 ') as shown in Figs. In the compressed and supported state, the movable terminal 40 moves to one side to form an energized state with the lead terminal 30, and as shown in FIGS. 4 and 8, the supports 50 and 50 'are melted to support the support ( When the support of the second spring 62 through the 50, 50 'is canceled, the movable terminal 40 is transferred to the other side by the holding force of the first spring 61, the lead terminal 30 and the movable terminal 40 It will disconnect between them.

Here, whether the movable terminal 40 is supported by the second spring 62 is set according to whether or not the supports 50 and 50 'made of a soluble material are melted.

That is, at temperatures lower than the melting point as shown in FIGS. 3 and 7, the supports 50 and 50 ′ maintain a solid state, thereby stably supporting the second spring 62, as shown in FIGS. 4 and 8. As described above, when a temperature condition higher than the melting point of the

supports

50 and 50 ′ is formed due to abnormal overheating, the supports 50 and 50 ′ melt and lose the supporting function of the second spring 62.

Therefore, in the temperature fuses 1 and 1 'according to the present invention, at a temperature lower than the melting point of the supports 50 and 50', the movable terminal 40 is in close contact with the lead terminal to form an energized state of the circuit, and abnormally overheated. When the supports 50 and 50 'are melted, the close contact between the movable terminal 40 and the lead terminal 30 is released to form a disconnected state of the circuit, thereby preventing abnormal overheating of the circuit and the electronic apparatus including the circuit. prevent.

In the present invention, the tip 41 of the movable terminal 40 facing the lead terminal 30 has a hemispherical shape, and the hemispherical seating groove 42a is formed in the tip 41 of the movable terminal 40. It press-fits and has a contact cap 42 which has.

At this time, the increasingly cam 43 is assembled in the form of a ball joint to the tip 41 of the movable terminal 40, it is possible to adjust the angle independently.

Accordingly, as shown in FIGS. 3 and 7, the contact cam 42 installed in the movable terminal 40 has its own angle adjusted by close contact with the lead terminal 30 in a close contact with the lead terminal 30. As a result, a stable contact state between the lead terminal 30 and the movable terminal 40 is formed. That is, even if the movable terminal 40 is not arranged in a straight line with the lead terminal 30, the movable terminal 40 is stably in close contact with the lead terminal 30 by adjusting the angle through the contact cam 43. The contact can be formed.

[제 1 실시형태][First embodiment]

On the other hand, in the first embodiment of the present invention to implement such a temperature fuse 1, as shown in Figures 1 to 4 to control the support of the second spring 62, the movable terminal 40 and the lead terminal By improving the material of the support body 50 to set the energization between the 30, to solve the general problems of the support body made of a conventional organic compound, it has a durable and stable functional stability.

In detail, in the present embodiment, the support 50 for the support of the second spring 62 is made of a soluble metal material, and a gap (not shown) is formed between the case 10 and the insulating bush 20. Even if air containing moisture is introduced into the receiving space 11 of the case 10 to have a stable shape stability without loss of volume due to shape deformation or volatilization.

Examples of the metal soluble material constituting the support 50 include indium (In) having a soluble point of 156.63 ° C., bismuth (Bi) having a soluble point of 271.5 ° C., and lead (Pb) having a soluble point of 327.5 ° C. ), And tin (Sn) having a soluble point of 231.93 ° C, or an alloy having a solubilization point adjusted by mixing them, or an alloy having a solubility point controlled by mixing these metal materials and an organic compound.

The soluble materials of such metal materials have properties such that volume or shape is not deformed by moisture or the external environment due to moisture resistance and non-volatility that conventional soluble materials of organic compounds do not have.

Table 1 below shows the mixing ratios of the alloy materials in which the metal materials are mixed, and an soluble point.

As shown in the table below, the mixture of these metal materials can be set lower or higher than the original soluble point of the metal depending on the type of metal and the mixing ratio. It can be used.

Table 1

Material name	Mixed rain
indium
	51%	0%	0%
Bismuth	32.5%	46	57.42%
lead	0%	20	One%	37%
Remark	16.5%	34	41.58%	63%

Availability point (temperature)	60 ℃	96 ℃	135 ℃	183 ℃

In addition, when the support 50 is formed through the soluble material of the metal and the support of the second spring 62 is supported through the support 50, moisture, air inflow, volatilization, etc. Since the deformation of the support is prevented, the circuit can be disconnected only at the time of overheating, which is an original function of a stable temperature fuse.

[제 2 실시형태]Second Embodiment

Meanwhile, in the second embodiment of the present invention, as shown in FIGS. 5 and 8, the support 50 'is made of an organic compound soluble material, and the support 50' is sealed to prevent moisture from excluding overheating. A temperature fuse 1 'is proposed to prevent deformation of the support 50' due to inflow of air, volatilization, or other conditions.

To this end, a support 50 'made of a soluble material of an organic compound disposed on the other side of the accommodation space 11 of the case 10 is disposed, and an accommodation space of the case 10 on one side of the support 50' 11) A sealing film 51 made of a metal soluble material having a sealed state with the inner wall is disposed.

As a soluble substance of the metal which comprises the said sealing film 51, indium (In) which has a soluble point of 156.63 degreeC, the bismuth (Bi) which has a soluble point of 271.5 degreeC, 327.5 degreeC similarly to 1st Embodiment Lead (Pb) having a soluble point of, and tin (Sn) having a soluble point of 231.93 ° C., or an alloy obtained by mixing them to adjust the soluble point may be adopted.

The sealing process of the support 50 'through the sealing film 51 is performed in a state in which the sealing film 51 disposed on one surface of the support 50' is available in a gel state by external heating. The pressure diffusion plate 62a provided in the spring 62 uniformly presses the available sealing film 51 in a gel state to diffuse (expand) outward.

Accordingly, the edge of the sealing film 51 diffused to the outside by heating and pressurizing is fused to the inner wall of the housing space 11 of the case 10, the hermetic seal fused to the housing space 11 of the case 10 The film 51 may form a stable sealed state of the support 50 'made of an organic compound.

The process of heating and sealing the sealing film 51 in the receiving space 11 of the case 10 in which the support 50 'is accommodated may be implemented by heating of the electronic device during use, It is preferable to carry out by considering the quality stability aspect.

In addition, the soluble material of the metal constituting the sealing film 51 is manufactured so that the melting point is relatively lower than the soluble material of the organic compound material constituting the support (50 '), it is maintained in a solid state in the normal organic compound material The support made of the soluble material of is to be sealed, and if abnormal overheating occurs, it melts before the organic compound.

Thus, the temperature fuse 1 'according to the present embodiment also prevents deformation of the support due to moisture, inflow of air, volatilization, and other conditions except for the temperature condition, in the same manner as the temperature fuse 1 of the above embodiment. Stable temperature fuse The circuit can be disconnected only when abnormal overheating is an inherent function.

In addition, in the present invention, in implementing the temperature fuses 1 and 1 'of the embodiments, the movable terminal 40 is configured by a resistive heating element that generates heat by itself according to the amount of current rather than a simple conductor. When an overcurrent is applied to the terminal, the movable terminal 40 is heated to melt the supports 50 and 50 'made of a soluble material.

Accordingly, the temperature fuses 1 and 1 'according to the present invention control the energization or disconnection of the circuit not only in accordance with the ambient temperature but also in the conducting current, so that the circuit of the electronic device is subjected to overcurrent conduction. There is no need to install a separate current fuse.

Here, the amount of heat generated by the movable terminal 40 according to the conduction of the current may be set as the material of the resistance heating element.

However, in the present invention, in order to secure the commonality of the movable terminal 40 to reduce the incidental cost according to the manufacturing, to form a cutout portion 43 on the movable terminal 40 to the cutting amount of the cutout portion 43 The heat generation amount of the movable terminal 40 according to the electric current to be challenged by adjusting the diameter of the movable terminal 40 is set.

That is, as shown in FIG. 3, when the cutout portion 43 is formed in the movable terminal 40 to make the diameter of the movable terminal 40 small, the heat generation amount of the movable terminal 40 increases due to the electric current. As shown in FIG. 7, when the cutout 43 is formed in the movable terminal 40 to increase the diameter of the movable terminal 40, the amount of heat generated by the movable terminal 40 due to the electric current is reduced.

Accordingly, the temperature fuses 1 and 1 'according to the present invention adopt a movable terminal 40 having a diameter suitable for the amount of current required in the manufacturing process, so that the circuit is disconnected when more current than that required for application is applied. The function of the current fuse can be implemented.

Claims

A case made of a conductive material having an open space on one side; A connection terminal connected to an outer wall of the case; A hollow insulating bush sealing one side of the receiving space of the open case; A lead terminal disposed in the hollow of the insulating bush and forming an insulating state with the case; A movable terminal installed in the accommodation space of the case and having a contact with an inner wall of the case; A first spring disposed between the heat transfer bush and the movable terminal and holding the movable terminal on the other side; And a second spring disposed between the movable terminal and the available material to hold the movable terminal in one piece to form a conductive state between the movable terminal and the lead terminal.

On the other side of the case accommodating space, a support made of a soluble material that is melted upon abnormal overheating is disposed, and a first spring for holding the movable terminal to the other side is disposed between the heat transfer bush and the movable terminal, and a soluble material is disposed between the movable terminal and the soluble material. And a second spring for holding the movable terminal on one side by the support to form a conductive state between the movable terminal and the lead terminal, while the support is made of a metal soluble material.
A case made of a conductive material having an open space on one side; A connection terminal connected to an outer wall of the case; A hollow insulating bush sealing one side of the receiving space of the open case; A lead terminal disposed in the hollow of the insulating bush and forming an insulating state with the case; A movable terminal installed in the accommodation space of the case and having a contact with an inner wall of the case; A first spring disposed between the heat transfer bush and the movable terminal and holding the movable terminal on the other side; It is configured to include a second spring disposed between the movable terminal and the available material to hold the movable terminal in one piece to form a conductive state between the movable terminal and the lead terminal,

On the other side of the case accommodating space, a support made of a soluble material that is melted upon abnormal overheating is disposed, and a first spring for holding the movable terminal to the other side is disposed between the heat transfer bush and the movable terminal, and a soluble material is disposed between the movable terminal and the soluble material. A second spring for supporting the movable terminal to one side by a support to form a conductive state between the movable terminal and the lead terminal is disposed, respectively, while a metal having a lower melting point than the support is formed between one surface of the soluble material and the inner wall of the receiving space. Temperature fuse, characterized in that the sealing film made of a soluble material formed.
The soluble material of the metal material is any one of tin (Sn), bismuth (Bi), indium (in), lead (Pb), or alloys thereof, or these metals. A temperature fuse, characterized in that the alloy is a mixture of organic compounds in the material.
The temperature fuse according to claim 1 or 2, wherein the movable terminal comprises a resistance heating element, and when the overcurrent is applied, the movable terminal is heated to melt the soluble material.
3. The temperature fuse according to claim 1 or 2, wherein the tip of the movable terminal facing the lead terminal has a hemispherical shape and a contact cap having a hemispherical seating groove is disposed at the tip of the movable terminal.
The inner wall of the housing space of the case is formed by diffusion through the pressure diffusion plate disposed at the end of the second spring in a state where the sealing membrane is available in a gel state by external heating. Is fused, the temperature fuse, characterized in that configured to seal the support contained in the accommodation space of the case.