WO2012164261A3 - Cooling unit and cooling system - Google Patents
Cooling unit and cooling system Download PDFInfo
- Publication number
- WO2012164261A3 WO2012164261A3 PCT/GB2012/051178 GB2012051178W WO2012164261A3 WO 2012164261 A3 WO2012164261 A3 WO 2012164261A3 GB 2012051178 W GB2012051178 W GB 2012051178W WO 2012164261 A3 WO2012164261 A3 WO 2012164261A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- cooling unit
- electronic equipment
- server cabinet
- cabinet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/2059—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20609—Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a cooling unit for electronic equipment housed within a server cabinet. The electronic equipment is mounted to front and/or rear vertical U- rails of the server cabinet. The cooling unit (20) comprises a heat exchanger and it is configured to hold the heat exchanger within or substantially within the confines of the server cabinet to the rear of the electronic equipment. This enables it to absorb heat from air exhausted from the rear of the electronic equipment. The cooling unit is preferably mounted to the rear vertical U-rails (17a, 17b) of the cabinet and provides passive cooling, !n one arrangement, the cooling unit is part of a cooling system that is arranged to operate as a thermosyphon. More than one of the cooling units (20) may be provided within the server cabinet, positioned according to the thermal loading.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB201108989A GB2493324A (en) | 2011-05-27 | 2011-05-27 | Cooling System with heat-exchanger mounted within a server cabinet |
GB1108989.3 | 2011-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012164261A2 WO2012164261A2 (en) | 2012-12-06 |
WO2012164261A3 true WO2012164261A3 (en) | 2013-01-24 |
Family
ID=44310542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2012/051178 WO2012164261A2 (en) | 2011-05-27 | 2012-05-24 | Cooling unit and cooling system |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2493324A (en) |
WO (1) | WO2012164261A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10448543B2 (en) | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
US10462935B2 (en) | 2015-06-23 | 2019-10-29 | Google Llc | Cooling electronic devices in a data center |
CN105682422A (en) * | 2016-02-29 | 2016-06-15 | 北京百度网讯科技有限公司 | Cooling apparatus used for data center machine cabinet, machine cabinet and cooling system |
US10349561B2 (en) | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
US11255611B2 (en) * | 2016-08-02 | 2022-02-22 | Munters Corporation | Active/passive cooling system |
US11839062B2 (en) | 2016-08-02 | 2023-12-05 | Munters Corporation | Active/passive cooling system |
CN107062467B (en) * | 2017-02-14 | 2022-04-26 | 南京佳力图机房环境技术股份有限公司 | Novel heat pipe backplate air conditioning system |
CN107801361B (en) * | 2017-11-29 | 2023-08-11 | 苏州工业职业技术学院 | Heat abstractor of electromechanical device |
CN109163398A (en) * | 2018-10-09 | 2019-01-08 | 郑州云海信息技术有限公司 | A kind of high density single cabinet formula data center |
EP3654743B1 (en) | 2018-11-15 | 2024-03-13 | Ovh | Rack arrangement for a data center |
CN110278690A (en) * | 2019-06-24 | 2019-09-24 | 苏州浪潮智能科技有限公司 | A kind of liquid-cooling type single cabinet formula data center |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010042616A1 (en) * | 2000-03-21 | 2001-11-22 | Baer Daniel B. | Method and apparatus for cooling electronic enclosures |
US6819563B1 (en) * | 2003-07-02 | 2004-11-16 | International Business Machines Corporation | Method and system for cooling electronics racks using pre-cooled air |
US20060232945A1 (en) * | 2005-04-18 | 2006-10-19 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
WO2008011458A1 (en) * | 2006-07-18 | 2008-01-24 | Liebert Corporation | Integral swivel hydraulic connectors, door hinges, and methods and systems for the use thereof |
US20090188264A1 (en) * | 2008-01-25 | 2009-07-30 | Philip Chappelle Fair | Modular in-frame pumped refrigerant distribution and heat removal system |
US20090225513A1 (en) * | 2008-03-10 | 2009-09-10 | Adrian Correa | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US20090262501A1 (en) * | 2008-04-21 | 2009-10-22 | International Business Machines Corporation | Rack With Integrated Rear-Door Heat Exchanger |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7397661B2 (en) * | 2006-08-25 | 2008-07-08 | International Business Machines Corporation | Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow |
US20080216493A1 (en) * | 2007-03-08 | 2008-09-11 | Liebert Corporation | Microchannel cooling condenser for precision cooling applications |
TW200912621A (en) * | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
GB2463956B (en) | 2008-05-20 | 2010-11-03 | Semper Holdings Ltd | Rack mounted cooling unit |
JP2010041007A (en) * | 2008-08-08 | 2010-02-18 | Hitachi Information & Communication Engineering Ltd | Cooling unit, electronic apparatus rack, cooling system, and construction method thereof |
US20100096105A1 (en) * | 2008-10-20 | 2010-04-22 | Vette Corp. | Rear door heat exchanger transition frame |
-
2011
- 2011-05-27 GB GB201108989A patent/GB2493324A/en not_active Withdrawn
-
2012
- 2012-05-24 WO PCT/GB2012/051178 patent/WO2012164261A2/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010042616A1 (en) * | 2000-03-21 | 2001-11-22 | Baer Daniel B. | Method and apparatus for cooling electronic enclosures |
US6819563B1 (en) * | 2003-07-02 | 2004-11-16 | International Business Machines Corporation | Method and system for cooling electronics racks using pre-cooled air |
US20060232945A1 (en) * | 2005-04-18 | 2006-10-19 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack |
WO2008011458A1 (en) * | 2006-07-18 | 2008-01-24 | Liebert Corporation | Integral swivel hydraulic connectors, door hinges, and methods and systems for the use thereof |
US20090188264A1 (en) * | 2008-01-25 | 2009-07-30 | Philip Chappelle Fair | Modular in-frame pumped refrigerant distribution and heat removal system |
US20090225513A1 (en) * | 2008-03-10 | 2009-09-10 | Adrian Correa | Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door |
US20090262501A1 (en) * | 2008-04-21 | 2009-10-22 | International Business Machines Corporation | Rack With Integrated Rear-Door Heat Exchanger |
Also Published As
Publication number | Publication date |
---|---|
GB201108989D0 (en) | 2011-07-13 |
GB2493324A (en) | 2013-02-06 |
WO2012164261A2 (en) | 2012-12-06 |
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