WO2012137597A1

WO2012137597A1 - Protection circuit module and battery pack

Info

Publication number: WO2012137597A1
Application number: PCT/JP2012/057084
Authority: WO
Inventors: 亮介山本
Original assignee: 三洋電機株式会社
Priority date: 2011-04-01
Filing date: 2012-03-21
Publication date: 2012-10-11
Also published as: JP2014116329A

Abstract

[Problem] To provide a protective circuit module that can reduce production costs while maintaining high heat transfer between electronic elements that are sources of heat and a heat-sensitive element that detects that heat and to provide a battery pack provided with the same. [Solution] A substrate is formed from insulating layers inserted between metal wiring layers (140b1, ...) and these same metal wiring layers (140b1, ...). When the substrate, FET elements (142, 143), and a thermistor element (144) are viewed in a planar view in the direction of the Z axis, part of the metal wiring layer (140a2) is formed on the substrate in a state that overlaps part of the FET elements (142, 143) and all of the thermistor element (144). The thermistor element (144) detects the temperature of the FET elements (142, 143) via the metal wiring layer (140a2).

Description

Protection circuit module and battery pack

The present invention relates to a protection circuit module and a battery pack, and more particularly to a structure related to thermal coupling between a switching element and a thermal element in a circuit.

With the spread of mobile devices such as cellular phones and notebook personal computers (notebook personal computers), as well as electric assist bicycles, electric motorcycles, and electric vehicles, battery packs as power supply sources are widely used.
The battery pack has a configuration in which a secondary battery such as a lithium ion battery is housed in a case together with a protection circuit module and the like. The protection circuit module
An IC element, FET element, external connection terminal, and the like are mounted on the substrate. The protection circuit module also includes a thermistor element that detects the temperature of an external connection terminal, an FET element, and the like. A thermal coupling structure of the FET element and the thermistor element in the protection circuit module according to the prior art will be described with reference to FIG.

As shown in FIG. 7A, in the protection circuit module according to the prior art, the substrate 9
On one main surface of 40, two

FET elements

942 and 943 and a thermistor element 944 are mounted in the vicinity thereof. As shown in FIG.
The

elements

942 and 943 and the thermistor element 944 are thermally coupled by a silicone resin layer applied therebetween.

Thus, in the protection circuit module according to the prior art, a silicone resin layer is provided between an electronic element (such as an FET element) that becomes a heat generation source during charging and discharging and a thermal element (thermistor element) that detects the heat. By forming, the thermal detection accuracy and detection speed of the thermal element are increased.

JP-A-2004-87851 JP 2010-252538 A

However, at the time of manufacturing the protection circuit module, it is difficult to automate the formation of the silicone resin layer for the thermal coupling between the electronic element that is a heat source and the thermosensitive element, and manual work is required. For this reason, it becomes an obstacle of reduction of manufacturing cost from the necessity of the operation | work in formation of a silicone resin layer.
In view of the above problems, the present invention provides a protection circuit capable of reducing the manufacturing cost while maintaining high heat transfer between an electronic element as a heat source and a thermal element that detects the heat. An object is to provide a module and a battery pack provided with the module.

In order to achieve the above object, the present invention employs the following configuration.
A protection circuit module according to the present invention is a module that is inserted in an input / output path of power between a secondary battery and its mounting device, and includes a substrate, an electronic element,
A thermal element.
The substrate includes a plurality of metal wiring layers and an insulating layer interposed between the metal wiring layers.

The electronic element is mounted on one main surface of the substrate and is inserted in the power input / output path.
The thermal element is arranged on one main surface (the main surface on the side where the electronic element is mounted) or the other main surface (the main surface opposite to the main surface on which the electronic element is mounted) on the substrate. Yes.
The protection circuit module according to the present invention is a plan view of the substrate, the electronic element, and the thermosensitive element in a direction perpendicular to one main surface of the substrate, and
When seeing through the insulating layer on the substrate, among the plurality of metal wiring layers on the substrate,
A part of the inner metal wiring layer closest to the one main surface with the insulating layer sandwiched between the electronic elements is formed so as to overlap at least a part of the electronic elements and all of the thermal elements. Yes. The thermosensitive element detects the temperature of the electronic element through a part of the metal wiring layer.

In addition, the battery pack according to the present invention includes one or a plurality of secondary batteries and the protection circuit module according to the present invention having the above-described configuration.

In the protection circuit module according to the present invention, when the substrate or the like is viewed in plan view,
The thermal element mounted on the substrate is in a state where all of it overlaps with a part of the inner metal wiring layer closest to the one main surface. For this reason, the heat generated in the electronic element is transmitted to a part of the metal wiring layer and is transmitted to the thermal element.
At this time, since all of the thermal element overlaps with a part of the metal wiring layer, it is not necessary to achieve thermal coupling between the electronic element and the thermal element by forming a silicone resin layer as in the prior art. The heat detection performance of the thermosensitive element can be maintained high.

Further, in the configuration of the protection circuit module according to the present invention, it is not necessary to manually form a silicone resin layer at the time of manufacturing, and automation in manufacturing can be further promoted, and manufacturing cost can be reduced. Is possible.
Therefore, the protection circuit module according to the present invention can reduce the manufacturing cost while maintaining high heat transfer between the electronic element that is a heat source and the thermal element that detects the heat.

In addition, since the battery pack according to the present invention includes the protection circuit module according to the present invention, the heat transfer between the electronic element that is a heat source and the thermal element that detects the heat is maintained high as described above. However, the manufacturing cost can be reduced.
In the protection circuit module and the battery pack according to the present invention, the following variation configurations can be adopted as an example.

In the protection circuit module and the battery pack according to the present invention, in the above configuration,
A configuration in which the electronic element is a switching element can be employed. However, in addition to the switching element, other elements such as a resistance element inserted in the power distribution path may be used.
In the protection circuit module and the battery pack according to the present invention, in the above configuration,
It is also possible to adopt a configuration in which the second switching element is mounted on the one main surface of the substrate in a state of being spaced from the switching element. In this case, the switching element and the second switching element are both FET elements, and a part of the inner metal wiring layer on the substrate serves to connect the drains of the switching element and the second switching element. It is also possible to adopt the configuration of being made. When such a configuration is adopted, heat is transferred to a part of the inner metal wiring layer through the drain of each FET element, so that heat is transferred at high speed with high accuracy.

In the protection circuit module and the battery pack according to the present invention, in the above configuration,
It is also possible to adopt a configuration in which the thermosensitive element is disposed between the switching element and the second switching element on the one main surface of the substrate.
When such a configuration is adopted, heat generated by the switching element and the second switching element is transmitted not only by a part of the metal wiring layer of the inner layer but also by radiation, thus ensuring higher detection performance. Is done.

Alternatively, in the protection circuit module and the battery pack according to the present invention, in the above configuration, a part of the inner metal wiring layer provided for the connection between the drains of the switching element and the second switching element is the switching element. A direction intersecting the first region between the drains of the second switching element and the direction connecting the drains from the first region (the extending direction of the imaginary straight line connecting the switching element and the second switching element at the shortest). A second region that bulges toward
It is also possible to adopt a configuration in which the first region and the second region are continuously formed and the thermal element is disposed at a position corresponding to the upper side of the second region.
Even when such a configuration is adopted, the heat generated by the switching element and the second switching element is conducted with high efficiency to the second region continuously formed with respect to the first region, and as a result, the thermal element Is also transmitted with high efficiency. Therefore, even when such a configuration is adopted, high detection performance of the thermal element is ensured.

In the protection circuit module and the battery pack according to the present invention, in the above configuration,
A conductive land, which is a part of the metal wiring layer on the one main surface of the substrate and to which the drains of the switching element and the second switching element are respectively connected, is a part of the inner metal wiring layer of the substrate. On the other hand, it is also possible to adopt a configuration in which each is connected by a plurality of through holes. When such a configuration is adopted, the heat generated by the switching element and the second switching element is part of the inner metal wiring layer through the plug in the through hole. Therefore, even when such a configuration is adopted, the detection performance of the thermal element can be further improved.

In the protection circuit module and the battery pack according to the present invention, in the above configuration,
It is possible to adopt a configuration in which the thermal element is a chip thermistor element.
In the case where the thermosensitive element has a configuration including an element body and a lead extending from the element body, all of the element bodies that contribute to heat detection in the element configuration are in the metal layer of the inner layer in plan view. It is sufficient that the arrangement overlaps a part of the wiring layer.
That is, the leads do not necessarily have to have overlapping positional relationships.

It is a model perspective view which shows the structure of the battery pack 1 which concerns on embodiment of invention. 2 is a schematic plan view showing an appearance of a protection circuit module 14 in the battery pack 1. FIG. 4 is a schematic perspective view showing the arrangement relationship of

FET elements

142 and 143, thermistor element 144, metal wiring layer 140a2, and the like in protection circuit module 14. FIG. 4 is a schematic cross-sectional view showing a positional relationship among

FET elements

142, 143, thermistor element 144, and metal wiring layer 140a2 in the protection circuit module 14. FIG. (A) is a schematic top view which shows the positional relationship of the thermistor element 144 and the thermal fuse element 147 with respect to FET element 142,143 in the protection circuit module 14, (b) is in the protection circuit module which concerns on the modification 1. FIG. 4 is a schematic plan view showing a positional relationship between a thermistor element 144 and a thermal fuse element 147 with respect to

FET elements

142 and 143. FIG. (A) is a schematic top view which shows the positional relationship of the thermistor element 344 and the thermal fuse element 347 with respect to FET element 142,143 in the protection circuit module which concerns on the modification 2, (b) is based on the modification 3. 6 is a schematic plan view showing the positional relationship of the thermistor element 444 and the thermal fuse element 447 with respect to the

FET elements

142 and 143 in the protection circuit module. FIG. (A) is a top view which shows the positional relationship of FET element 942,943 and thermistor element 944 in the protection circuit module of the battery pack based on a prior art, (b) is the sectional drawing.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In addition, the specific example shown below is an example used for easily explaining the configuration of the present invention and the operations and effects produced from the configuration, and the present invention is not limited to the components essential to the invention. The following specific examples are not limited at all.
[Embodiment]
1. Overall Configuration of Battery Pack 1 The overall configuration of the battery pack 1 will be described with reference to FIG.

As shown in FIG. 1, the battery pack 1 according to the present embodiment has a long exterior case 10 having a length in the X-axis direction that is longer than the width in the Y-axis direction and the height in the Z-axis direction. ,
Three

cylindrical unit cells

11, 12, 13 and a protection circuit module 14 connected to these

unit cells

11, 12, 13 are accommodated.
The three

unit cells

11, 12, 13 are both lithium ion secondary batteries,
They are arranged in series with the shaft cores combined in the X axis direction.

The protection circuit module 14 includes a strip-shaped substrate 140 that is long in the X-axis direction.
Arranged along the

unit cells

11, 12, and 13. In the protection circuit module 14, an external connection terminal 141 is mounted on the main surface (upper main surface in the Z-axis direction) of the substrate 140 for electrical connection with a mounted device.
In addition, in FIG. 1, in order to understand the internal structure of the battery pack 1, originally Z
The outer case disposed on the upper side in the axial direction is omitted.

2. Schematic Configuration of Protection Circuit Module 14 A schematic configuration of the protection circuit module 14 will be described with reference to FIG. FIG.
(A) shows the protection circuit module 14 on one main surface (front surface) of the substrate 140.
FIG. 2B is a plan view showing the protection circuit module 14 and the substrate 140.
It is a top view which shows the other main surface (back surface).

As shown in FIG. 2A, in the protection circuit module 14, a substrate 140 is provided.
A plurality of electronic chips including the

FET elements

142 and 142 and the thermistor element 144 are mounted on the front surface, and an external connection terminal 141 is also mounted.
Here, one of the

FET elements

142 and 143 is an element for charging, and the other is an element for discharging. The thermistor element 144 is arranged in a state of being sandwiched between the

FET elements

142 and 143 in the X-axis direction (refer to part A).

2, a thermal fuse element 147 is also disposed below the thermistor element 144 in the Y-axis direction. The thermal fuse element 147 is also an element that detects the temperature of the

FET elements

142 and 143 and the like.
As shown in FIG. 2B, a control IC for protection is provided on the back surface of the substrate 140.
A plurality of electronic chips including the

elements

145 and 146 are mounted. FET
Each gate of the

elements

142 and 143 is connected to one IC element 145,
One terminal of the thermistor element 144 is connected to the other IC element 146 (detailed wiring layout and circuit diagram are omitted).

3.

FET elements

142 and 143 and thermistor element 144
A configuration relating to thermal coupling between the

FET elements

142 and 143 and the thermistor element 144 will be described with reference to FIG. The substrate 140 of the protection circuit module 14 according to the present embodiment includes a plurality of metal wiring layers 140a1, 140b1, 14
0c1, 140d1, 140e1, 140f1, 140g1, 140h1, 140a2,
140b2, 140a3, 140b3, 140a4, 140b4, and insulating layers 140a5, 140a6, 140a7 interposed between the respective layers. In FIG.
Of the configuration of the substrate 140, the insulating layers 140a5, 140a6, and 140a7 are drawn with two-dot chain lines for convenience of illustration, and the metal wiring layers 140a1, 140b1, and 14 are shown.
0c1, 140d1, 140e1, 140f1, 140g1, 140h1, 140a2,
140b2, 140a3, 140b3, 140a4 and 140b4 are also schematically drawn. Further, illustration of other components on the substrate 140 such as the thermal fuse element 147 is omitted.

As shown in FIG. 3, metal wiring layers 140 a 1, 140 are disposed on the front side of the substrate 14.
b1, 140c1, 140d1, 140e1, 140f1, 140g1, 140h1 are formed. Among these, the gate 142b of the FET element 142 is connected to the metal wiring layer 140a1, and the source 142c is connected to the metal wiring layer 140b1. The drain 142d of the FET element 142 is connected to the metal wiring layer 140c1. Similarly, the drain 143d of the FET element 143 is connected to the metal wiring layer 140f1, the gate 143b is connected to the metal wiring layer 140g1, and the source 143c is connected to the metal wiring layer 140h1.

The thermistor element 144 is a chip thermistor element.

Terminals

144b and 144c are provided at both ends of a. And metal wiring layer 1
The terminal 144b of the thermistor element 144 is connected to 40d1, and the metal wiring layer 14 is connected.
The other terminal 144c is connected to 0e1.
Next, as shown in FIG. 3, metal wiring layers 140a2 and 140b2 are provided in the second layer (the inner layer closest to the front surface) of the substrate 140. Among these, the metal wiring layer 140a2 is Metal wiring layers 140c1, 140f on the front side
1 and a plurality of through holes inserted through the insulating layer 140a5.
A metal wiring layer 140b2 is provided on the inner side of the metal wiring layer 140h1 in the Z-axis direction. Between the metal wiring layer 140h1 and the metal wiring layer 140b2,
They are connected by a plurality of through holes that pass through the insulating layer 140a5.

Metal wiring layers 140a3 and 140b3 are provided in the third layer of the substrate 140. The metal wiring layer 140a3 is connected to the upper metal wiring layer 140a2 by a plurality of through holes that pass through the insulating layer 140a6. The layer 140b3 is connected to the upper metal wiring layer 140b2 by a plurality of through holes that pass through the insulating layer 140a6.
Metal wiring layers 140a4 and 140b4 are provided on the back surface of the substrate 140.
The metal wiring layer 140a4 includes an inner metal wiring layer 140a3 immediately above the Z-axis direction,
The metal wiring layer 1 is connected by a plurality of through holes that pass through the insulating layer 140a7.
40b4 is connected to the inner metal wiring layer 140b3 directly above by a plurality of through-holes that pass through the insulating layer 140a7.

4). Heat Transfer Path from

FET Elements

142 and 143 to Thermistor Element 144 A heat transfer path from the

FET elements

142 and 143 to the thermistor element 144 will be described with reference to FIGS. 4 and 5A.
As shown in FIG. 4, each of the

drains

142d, 14 of the

FET elements

142, 143 is shown.
3d is connected to the metal wiring layers 140c1 and 140f1, and the metal wiring 140c.
1,140f1 is connected to the inner metal wiring layer 140a2 through the through holes 140i1 and 140j1. The thermistor element 144 is arranged directly above the Z-axis direction with respect to the metal wiring layer 140a2 via an insulating layer (not shown in FIG. 4, refer to FIG. 3).

As shown in FIG. 5A, the

FET elements

142 and 143 and the thermistor element 14
4 and the metal wiring layer 140a2 are arranged such that a part of the

FET elements

142 and 143 overlaps with a part of the lower metal wiring layer 140a2, and the whole thermistor element 144 overlaps with a part of the metal wiring layer 140a2. It is supposed to be.
As shown in FIG. 5A, in the present embodiment, the thermal fuse element 147 is arranged below the thermistor element 144 in the Y-axis direction and overlaps with a part of the metal wiring layer 140a2. Not done.

With the above configuration, in the protection circuit module 14, the FET elements 142,
Part of the heat generated at 143 is transferred from the

drains

142d and 143d to the metal wiring layer 14
It is transmitted to metal wiring layer 140a2 through 0c1, 140f1 and through holes 140i1, 140j1. The thermistor element 144 has a metal wiring layer 1.
Heat is transferred from 40a2 through insulating layer 140a5.

Further, as shown in FIGS. 2 and 3, the thermistor element 144 includes an FET element 1.
Since they are arranged in proximity to each other between 42 and 143, heat is transferred to the thermistor element 144 also by radiation.
Therefore, in the protection circuit module 14 according to the present embodiment, good thermal coupling between the

FET elements

142 and 143 and the thermistor element 144 can be achieved without providing a silicone resin layer as in the prior art shown in FIG. In addition to being able to protect with high accuracy, automation during manufacturing is not hindered.
[Modification 1]
The configuration of the protection circuit module according to Modification 1 will be described with reference to FIG. Note that the protection circuit module according to this modification has the same configuration as the above embodiment except for the shape of the metal wiring layer 240a2. For this reason, only differences from the above embodiment will be described below.

As shown in FIG. 5B, in the protection circuit module according to this modification, the FET
The metal wiring layer 240a2 that connects the drains of the

elements

142 and 143 has a shape that bulges downward in the Y-axis direction from the metal wiring layer 140a2 of the protection circuit module 14 according to the above embodiment. In the plan view, the entire thermistor element 144 is overlapped with the metal wiring layer 240a2, which is the same as the above embodiment. However, in the present modification, the entire temperature fuse element 147 is also made of metal. It overlaps with the wiring layer 240a2. Specifically, a region sandwiched between the FET element 142 and the FET element 143 in the metal wiring layer 140a2 is a first region A1.
When the region bulging downward in the Y-axis direction is the second region A2, the thermistor element 144 is disposed above the first region A1 in the Z-axis direction (front side in the drawing), and the thermal fuse element 147 is the second region A2. It is disposed above the area A2 in the Z-axis direction (front side of the sheet).

In this modification employing the above-described configuration, the thermistor element 144 is an FET.
In addition to the same point as described above for the temperature detection of the

elements

142 and 143, the temperature fuse element 147 also has excellent temperature detection characteristics of the

FET elements

142 and 143 and the like. Therefore, in this modification, without forming the silicone resin layer,
High safety can be ensured.
[Modification 2]
A configuration of the protection circuit module according to Modification 2 will be described with reference to FIG. In FIG. 6A, only the part corresponding to FIG. 5A and FIG. 5B is extracted from the configuration of the protection circuit module.

As shown in FIG. 6 (a), in the protection circuit module according to this modification, the FET
A thermal fuse element 347 is disposed between the

elements

142 and 143, and the thermistor element 344 is disposed on the lower side in the Y-axis direction with respect to the thermal fuse element 347.
In addition, as shown in FIG. 6A, the FET element 142,
The metal wiring layer 340a2 connecting the drains of the 143 is the

FET element

142,1.
43 1st area | region A11 and 2nd area | region A which bulged below the Y-axis direction rather than the said area | region
12 and is configured. In this modification, the thermal fuse element 347 is used.
Is disposed above the first region A11 of the metal wiring layer 340a2 in the Z-axis direction (front side in the drawing), and the thermistor element 344 is formed in the Z region of the second region A12 of the metal wiring layer 340a2.
It is arranged on the upper side in the axial direction (front side of the paper).

Also in this modified example employing the above-described configuration, since the thermistor element 344 and the thermal fuse element 347 are both located immediately above the metal wiring layer 340a2, the heat generated by the

FET elements

142 and 143 is highly efficient. Element 344
As described above, it is transmitted to the thermal fuse element 347 and the silicone resin layer need not be formed.
[Modification 3]
A configuration of the protection circuit module according to Modification 3 will be described with reference to FIG. Also in FIG. 6B, only the portion corresponding to FIGS. 5A and 5B and FIG. 6A is extracted from the configuration of the protection circuit module.

As shown in FIG. 6B, in the protection circuit module according to this modification, all the thermistor elements 444 are located above the second region A22 in the metal wiring layer 440a2 in the Z-axis direction (front side in the drawing). Instead, only a part thereof is located above the second region A22 in the metal wiring layer 440a2 in the Z-axis direction (front side on the paper surface). However, all of the thermal fuse elements 447 are located above the first region A21 in the metal wiring layer 440a2 in the Z-axis direction (front side in the drawing). For this reason, the thermistor element 444 can obtain a certain degree of heat transfer effect by heat transfer through the metal wiring 440a2. Will fall.

However, depending on the degree of overlap of the thermistor element 344 with respect to the metal wiring layer 340a2, it is possible to obtain heat detection characteristics equal to or higher than those of the protection circuit module according to the above-described prior art, and manufacture as much as the silicone resin layer need not be formed Cost can be reduced.
Further, in the present modification, all of the thermal fuse element 447 is located above the metal wiring layer 440a2, so that the FE in the thermal fuse element 447 is the same.
The performance of detecting the heat of the

T elements

142 and 143 is high.
[Other matters]
In the above embodiment, as shown in FIG. 1, the battery pack 1 including the three

unit cells

11, 12, and 13 is taken as an example, but the present invention is directed to the number and arrangement of unit cells, and protection against the unit cells. Various variation configurations can be employed with respect to the arrangement of the circuit modules. For example, the unit cell is not limited to a lithium ion battery, and a nickel cadmium secondary battery, a nickel hydride secondary battery, or the like can also be adopted. Can also be used, and further, a metal laminate outer battery can be used.

In the above embodiment, the protection circuit module 14 incorporated in the battery pack 1 is taken as an example. However, the protection circuit module does not necessarily have to be packaged together with the unit cell. That is, it can be a device composed of a single protection circuit module.
Further, the shape of the substrate in the protection circuit module is not limited to an elongated strip shape, but may be a square shape, a circular shape, or an elliptical shape.

Further, in the above-described embodiments and modifications, the thermistor element is not particularly mentioned. For example, PTC (Positive Tempera)
true Coefficient (NT) element, NTC (Negative Te)
For example, a temperature coefficient element or a thermal fuse may be employed.
In the embodiment and the modification described above, the temperature of the

FET elements

142 and 143 is detected by the thermistor elements 144 and 244. However, the detection target is other switching elements such as transistor elements, resistance elements, and external connections. It can also be a terminal, connection wiring, or the like.

Furthermore, as a constituent material of the metal wiring layer, copper (Cu) having high thermal conductivity is desirable, but aluminum (Al), nickel (Ni) plated steel, etc. can also be used.

INDUSTRIAL APPLICABILITY The present invention is useful for realizing a battery pack with a low manufacturing cost while having high quality as a power source for mobile devices and vehicles.

1. Battery pack 10.

Exterior case

11, 12, 13. Unit cell 14. Protection circuit module 140. Substrate 141.

External connection terminals

142, 143.

FET elements

144, 244, 344.

Thermistor elements

145 and 146.

IC elements

147, 347, 447. Thermal fuse elements 140a1, 140b1, 140c1, 140d1, 140e1, 140f1, 140g
1,140h1,140a2,140b2,140a3,140b3,140a4,14
0b4, 240a2, 340a2, 440a2. Metal wiring layers 140a5, 140a6, 140a7. Insulating layers 140i1, 140j1. Through hole

Claims

A protection circuit module inserted in an input / output path of power between the secondary battery and the mounted device,
A substrate comprising a plurality of metal wiring layers and an insulating layer interposed between the metal wiring layers;
An electronic element mounted on one main surface of the substrate and inserted in the power input / output path;
A thermal element disposed on the one main surface or the other main surface of the substrate;
With
When the substrate, the electronic element, and the thermosensitive element are viewed in a plan view from a direction orthogonal to one main surface of the substrate, and the insulating layer in the substrate is seen through,
Of the plurality of metal wiring layers on the substrate, a part of the inner metal wiring layer closest to the one main surface sandwiching the insulating layer between the electronic elements is at least one of the electronic elements. Formed in a state overlapping with all of the thermosensitive element,
The said heat sensitive element detects the temperature of the said electronic element through a part of said metal wiring layer. The protection circuit module characterized by the above-mentioned.
The protection circuit module according to claim 1, wherein the electronic element is a switching element.
A second switching element is mounted on the one main surface of the substrate in a state spaced from the switching element,
The switching element and the second switching element are both FET elements,
3. The protection circuit module according to claim 2, wherein a part of the inner metal wiring layer in the substrate is provided for connection between drains of the switching element and the second switching element.
The protection circuit module according to claim 3, wherein the thermal element is disposed between the switching element and the second switching element on the one main surface of the substrate.
A part of the inner metal wiring layer provided for connection between the drains of the switching element and the second switching element is a first region between the drains of the switching element and the second switching element; A second region bulging from the first region toward the direction intersecting the direction connecting the drains,
The first region and the second region are continuously formed, and the thermal element is
The protection circuit module according to claim 3, wherein the protection circuit module is disposed at a position corresponding to the upper side of the second region.
The conductive land, which is a part of the metal wiring layer on the one main surface and to which the drains of the switching element and the second switching element are respectively connected, is part of the metal wiring layer of the inner layer on the substrate The protection circuit module according to claim 3, wherein the protection circuit modules are connected by a plurality of through holes.
The protection circuit module according to claim 1, wherein the thermal element is a chip thermistor element.
One or more secondary batteries;
A protection circuit module according to any one of claims 1 to 7,
A battery pack comprising: