WO2012134832A2 - Coupled inductor to facilitate integrated power delivery - Google Patents
Coupled inductor to facilitate integrated power delivery Download PDFInfo
- Publication number
- WO2012134832A2 WO2012134832A2 PCT/US2012/029348 US2012029348W WO2012134832A2 WO 2012134832 A2 WO2012134832 A2 WO 2012134832A2 US 2012029348 W US2012029348 W US 2012029348W WO 2012134832 A2 WO2012134832 A2 WO 2012134832A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- smd
- aircoils
- inductor
- counter wound
- former
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/10—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
- H02M3/1584—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/02—Fixed inductances of the signal type without magnetic core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
Definitions
- the operation of the buck converter is fairly simple, with an inductor and two switches (usually a transistor and a diode) that control the inductor. It alternates between connecting the inductor to source voltage to store energy in the inductor and discharging the inductor into the load.
- FIG. 1 illustrates a SMD inductor according to one embodiment of the present invention.
- Embodiments of the present invention combine the two discrete components in an advantageous way to deliver a desired inductance with a lower equivalent series resistance (ESR), which delivers improved efficiency and reducing the physical size of implementation. More specifically, embodiments of the present invention provide a new inductor component to facilitate integration of switched mode buck voltage regulators, which may be integrated into system-on-chips (SOC). Embodiments of the present invention address a number of performance/integration issues identified during development of power delivery technology. To name a few, benefits may include: 1) Enables a biphase buck regulator to be implemented in a similar footprint to a single phase regulator (A buck converter is a step-down DC to DC converter.
- the step-up boost converter is a switched-mode power supply that may use two switches (a transistor and a diode in one embodiment - and in a preferred embodiment used in the synchronous buck converter of embodiments of the present invention, the diode may be replaced by a transistor which may effectively be switched in anti phase to the first transistor), an inductor and a capacitor); 2) Reduces ESR for a given inductance so increasing regulator efficiency; and 3) Biphase implementation with this coupled component offers some improvement in line in voltage ringing and thus enables reduction in silicon area for decoupling capacitance which is typically applied to reduce such ringing.
- FIG. 1 shown generally as 100, is a basic structure of embodiments of the present invention provide at least two counter wound aircoils 105 and 110 formed on the same SMD former 1 15.
- the coils are connected to three terminals 120, 125 and 130, on the SMD former 1 15.
- a single terminal is connected to a common node 130 of both windings with two independent terminals 120 and 125 accessing the other winding node.
- node A 130 is the common node and node B 120 and C 125 are connected to other terminals of counter wound coils 105 and 110.
- the principal electrical advantage in this component is the benefits afforded by mutual inductive coupling which is achieved as the windings are switched in antiphase (i.e. the signal current in winding 105 boosts the inductance in winding 2 1 10 and vice versa.
- the signal current in winding 105 boosts the inductance in winding 2 1 10 and vice versa.
- the advantage of this invention is that the physical size of the winding to deliver a given inductance will be smaller due to the benefits of mutual inductance. This in turn will lead to a reduction in equivalent series resistance (ESR), hence an improvement in efficiency and a reduction in the material content which will have a fractional cost implication.
- ESR equivalent series resistance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
An embodiment of the present invention provides an apparatus, comprising a surface mounted device (SMD) inductor, the SMD inductor including at least two counter wound aircoils formed on a same SMD former; wherein the at least two counter wound aircoils are connected to three terminals on the SMD former, wherein a single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node.
Description
COUPLED INDUCTOR TO FACILITATE INTEGRATED POWER DELIVERY
BACKGROUND
The operation of the buck converter is fairly simple, with an inductor and two switches (usually a transistor and a diode) that control the inductor. It alternates between connecting the inductor to source voltage to store energy in the inductor and discharging the inductor into the load.
However, inefficiencies exist in the state of the art related to this technology and thus, a strong need exists for a new inductor component to facilitate integration of switched mode buck voltage regulators in system on chips (SOCs) to facilitate integrated power delivery.
BRIEF DESCRIPTION OF THE DRAWINGS
The subject matter regarded as the invention is particularly pointed out and distinctly claimed in the concluding portion of the specification. The invention, however, both as to organization and method of operation, together with objects, features, and advantages thereof, may best be understood by reference to the following detailed description when read with the accompanying drawings in which:
FIG. 1 illustrates a SMD inductor according to one embodiment of the present invention.
It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals have been repeated among the figures to indicate corresponding or analogous elements.
DETAILED DESCRIPTION
In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
An algorithm, technique or process is here, and generally, considered to be a self- consistent sequence of acts or operations leading to a desired result. These include physical manipulations of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated. It has proven convenient at times, principally for reasons of common usage, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers or the like. It should be understood, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities.
Embodiments of the present invention combine the two discrete components in an advantageous way to deliver a desired inductance with a lower equivalent series resistance (ESR), which delivers improved efficiency and reducing the physical size of implementation. More specifically, embodiments of the present invention provide a new inductor component to facilitate integration of switched mode buck voltage regulators, which may be integrated into system-on-chips (SOC). Embodiments of the present invention address a number of performance/integration issues identified during development of power delivery technology. To name a few, benefits may include: 1) Enables a biphase buck regulator to be implemented in a similar footprint to a single phase regulator (A buck converter is a step-down DC to DC converter. Its design is similar to the step-up boost converter, and like the boost converter it is a switched-mode power supply that may use two switches (a transistor and a diode in one embodiment - and in a preferred embodiment used in the synchronous buck converter of embodiments of the present invention, the diode may be replaced by a transistor which may effectively be switched in anti phase to the first transistor), an inductor and a capacitor); 2) Reduces ESR for a given inductance so increasing regulator efficiency; and 3) Biphase implementation with this coupled component offers some improvement in line in voltage ringing and thus enables reduction in silicon area for decoupling capacitance which is typically applied to reduce such ringing.
Looking now at FIG. 1, shown generally as 100, is a basic structure of embodiments of the present invention provide at least two counter wound aircoils 105 and 110 formed on the same SMD former 1 15. The coils are connected to three terminals 120, 125 and 130, on the SMD former 1 15. A single terminal is connected to a common node 130 of both windings with two independent terminals 120 and 125 accessing the other winding node. A preferred embodiment provides where node A 130 is the common node and node B 120 and C 125 are connected to
other terminals of counter wound coils 105 and 110.
The principal electrical advantage in this component is the benefits afforded by mutual inductive coupling which is achieved as the windings are switched in antiphase (i.e. the signal current in winding 105 boosts the inductance in winding 2 1 10 and vice versa. Now for a given performance balloon there will be an optimum value of inductance. This will be determined by factors including efficiency, delivered power, voltage ripple, response time etc.
The advantage of this invention is that the physical size of the winding to deliver a given inductance will be smaller due to the benefits of mutual inductance. This in turn will lead to a reduction in equivalent series resistance (ESR), hence an improvement in efficiency and a reduction in the material content which will have a fractional cost implication. In addition there will be a physical size benefit in that since both phases of the bi-phase buck regulator are co- located, the substrate area required for component placement will be reduced, and in addition the routing from the SoC to the bi-phase inductor will occupy a narrower corridor, which is of benefit in a congested IO routing arrangement.
While certain features of the invention have been illustrated and described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims
1. An apparatus, comprising:
a surface mounted device (SMD) inductor, said SMD inductor including at least two counter wound aircoils formed on a same SMD former.
2. The apparatus of claim 1, wherein said at least two counter wound aircoils are connected to three terminals on said SMD former, wherein a single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node.
3. The apparatus of claim 2, wherein said SMD inductor is adapted to support Buck regulators in system-on-chip (SoC) technologies.
4. The apparatus of claim 3, wherein said at least two counter wound aircoils is two counter wound aircoils.
5. A method manufacturing a surface mounted device (SMD) inductor, comprising: counter winding at least two aircoils on a same SMD former of said surface mounted device (SMD) inductor.
6. The method of claim 5, further comprising connecting said at least two counter wound aircoils to three terminals on said SMD former, wherein a single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node.
7. The method of claim 6, further comprising adapting said SMD inductor to support Buck regulators in system-on-chip (SoC) technologies.
8. An apparatus, comprising:
a bi-phase buck regulator; and
a surface mounted device (SMD) inductor adapted to support said bi-phase buck regulator, said SMD inductor including at least two counter wound aircoils formed on a same SMD former.
9. The apparatus of claim 8, wherein said at least two counter wound aircoils are connected to three terminals on said SMD former, wherein a single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node.
10. The apparatus of claim 9, wherein said at least two counter wound aircoils is two counter wound aircoils.
11. A method of facilitating power delivery in a system on chip (SoC), comprising: coupling a surface mounted device (SMD) inductor with said SoC, said SMD inductor including at least two counter wound aircoils formed on a same SMD former.
12. The method of claim 1 1, wherein said at least two counter wound aircoils are connected to three terminals on said SMD former, wherein a single terminal is connected to a common node of both windings with two independent terminals accessing the other winding node.
13. The method of claim 12, wherein said SMD inductor is adapted to support Buck regulators in system-on-chip (SoC) technologies.
14. The method of claim 13, wherein said at least two counter wound aircoils is two counter wound aircoils.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/078,333 | 2011-04-01 | ||
| US13/078,333 US20120249107A1 (en) | 2011-04-01 | 2011-04-01 | Coupled inductor to facilitate integrated power delivery |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2012134832A2 true WO2012134832A2 (en) | 2012-10-04 |
| WO2012134832A3 WO2012134832A3 (en) | 2013-01-03 |
Family
ID=46926347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2012/029348 Ceased WO2012134832A2 (en) | 2011-04-01 | 2012-03-16 | Coupled inductor to facilitate integrated power delivery |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120249107A1 (en) |
| JP (1) | JP2012216784A (en) |
| CN (1) | CN102737811B (en) |
| WO (1) | WO2012134832A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101509752B1 (en) * | 2013-12-23 | 2015-04-07 | 현대자동차 주식회사 | Apparatus and method for charging the battery of vehicle |
| US10103140B2 (en) * | 2016-10-14 | 2018-10-16 | Alpha And Omega Semiconductor Incorporated | Switch circuit with controllable phase node ringing |
| US10545902B2 (en) * | 2018-06-25 | 2020-01-28 | Western Digital Technologies, Inc. | Devices and methods for decoupling of physical layer |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3477051A (en) * | 1967-12-26 | 1969-11-04 | Ibm | Die casting of core windings |
| US4704592A (en) * | 1984-09-13 | 1987-11-03 | Siemens Aktiengesellschaft | Chip inductor electronic component |
| JP3470372B2 (en) * | 1994-01-17 | 2003-11-25 | 株式会社安川電機 | Sheet coil |
| JP3554209B2 (en) * | 1997-12-17 | 2004-08-18 | 太陽誘電株式会社 | Surface mount type coil parts |
| US6157283A (en) * | 1998-11-24 | 2000-12-05 | Taiyo Yuden Co., Ltd. | Surface-mounting-type coil component |
| US6366069B1 (en) * | 2001-02-01 | 2002-04-02 | Intel Corporation | Hysteretic-mode multi-phase switching regulator |
| DE10135599A1 (en) * | 2001-07-20 | 2003-02-13 | Thomson Brandt Gmbh | Switched-mode power supply with power factor correction, and coil for a corresponding correction circuit |
| US20030090244A1 (en) * | 2001-11-05 | 2003-05-15 | Krishna Shenai | Multislice DC-DC converter |
| US6683510B1 (en) * | 2002-08-08 | 2004-01-27 | Northrop Grumman Corporation | Ultra-wideband planar coupled spiral balun |
| US8416043B2 (en) * | 2010-05-24 | 2013-04-09 | Volterra Semiconductor Corporation | Powder core material coupled inductors and associated methods |
| US7315463B2 (en) * | 2004-09-30 | 2008-01-01 | Intel Corporation | Apparatus and method for multi-phase transformers |
| US7453250B2 (en) * | 2005-02-10 | 2008-11-18 | Intersil Americas Inc. | PWM controller with dual-edge modulation using dual ramps |
| US7221251B2 (en) * | 2005-03-22 | 2007-05-22 | Acutechnology Semiconductor | Air core inductive element on printed circuit board for use in switching power conversion circuitries |
| US7233132B1 (en) * | 2006-01-30 | 2007-06-19 | Virginia Tech Intellectual Properties, Inc. | Current sensing in multiple coupled inductors by time constant matching to leakage inductance |
| US8717137B2 (en) * | 2006-05-31 | 2014-05-06 | Broadcom Corporation | On-chip inductor using redistribution layer and dual-layer passivation |
| US7791321B2 (en) * | 2007-02-23 | 2010-09-07 | Virginia Tech Intellectual Properties, Inc. | Coupled-inductor multi-phase buck converters |
| JP2008277485A (en) * | 2007-04-27 | 2008-11-13 | Fuji Electric Device Technology Co Ltd | Transformer unit and power conversion device |
| US20110248814A1 (en) * | 2007-08-28 | 2011-10-13 | Bor-Shiun Lee | Shielded-type inductor |
| JP4582196B2 (en) * | 2008-05-29 | 2010-11-17 | Tdk株式会社 | Inductor component mounting structure |
| JP4737268B2 (en) * | 2008-10-31 | 2011-07-27 | Tdk株式会社 | Surface mount pulse transformer and method and apparatus for manufacturing the same |
| CN102097204A (en) * | 2009-12-15 | 2011-06-15 | 台达电子工业股份有限公司 | Transformer module and transformer thereof |
-
2011
- 2011-04-01 US US13/078,333 patent/US20120249107A1/en not_active Abandoned
-
2012
- 2012-03-09 JP JP2012053192A patent/JP2012216784A/en active Pending
- 2012-03-16 WO PCT/US2012/029348 patent/WO2012134832A2/en not_active Ceased
- 2012-03-29 CN CN201210099450.1A patent/CN102737811B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102737811A (en) | 2012-10-17 |
| WO2012134832A3 (en) | 2013-01-03 |
| JP2012216784A (en) | 2012-11-08 |
| US20120249107A1 (en) | 2012-10-04 |
| CN102737811B (en) | 2016-08-03 |
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