WO2012134177A2

WO2012134177A2 - Antenna using a flexible printed circuit board and method for manufacturing same

Info

Publication number: WO2012134177A2
Application number: PCT/KR2012/002291
Authority: WO
Inventors: 서문규; 이상천; 이상훈; 최철; 박정수; 오영균
Original assignee: Seo Moon-Kyu; Lee Sang-Cheon; Lee Sang-Hoon; Choi Chul; Park Jeong-Su; Oh Young-Kyun
Priority date: 2011-03-28
Filing date: 2012-03-28
Publication date: 2012-10-04
Also published as: KR20120110061A; WO2012134177A3; KR101342524B1

Abstract

Provided is an antenna using a flexible printed circuit board and a method for manufacturing same. The antenna using a flexible printed circuit board comprises: a first substrate made of a flexible and insulating material; and a circuit layer, which is formed on the first substrate into a thin-film pattern from a corrosion-resistant, oxidation-resistant, and conductive material, and which has a terminal portion connected to an external device. The circuit layer can be made of aluminum, and an antenna with excellent performance may thereby be manufactured.

Description

Antenna and flexible manufacturing method using flexible circuit board

The present invention relates to a structure and a manufacturing method of an antenna using a flexible circuit board.

Recently, due to the rapid development of communication, the spread of wireless communication terminals such as mobile phones and tablet PCs is increasing, and miniaturization and multifunctionalization are rapidly progressing. In addition, wireless communication technologies such as WIFI / UWB are embedded in PCs, notebooks, and home appliances, and most devices are equipped with wireless communication functions. In order to improve portability as the communication technology, in particular, wireless communication technology, various technologies for miniaturization have been developed. In the case of an antenna, an external antenna was used initially, but recently, various internal antennas mounted in a portable terminal have been developed in accordance with a trend.

Conventional built-in antenna is implemented by forming a metal thin film pattern on a non-conductive material substrate. In detail, in forming a metal thin film pattern on a non-conductive material, conventionally, a metal is welded to a non-conductive material, a double injection, and a method using a flexible circuit board.

1 is a view showing the structure of a flexible circuit board of a conventional built-in antenna.

Referring to FIG. 1, a flexible circuit board of a conventional built-in antenna includes a first substrate D, a circuit layer F, and a PSR (Photo Solder Resist) layer (I), and the first substrate (D). And a first adhesive layer E for adhesion between the circuit layer F. In addition, the flexible circuit board of the conventional built-in antenna may further include one or more of the IR ink layer (J), the terminal reinforcing plate (B) and the plating layers (H, G). In addition, an adhesive tape layer A may be further formed below the first substrate D. FIG.

The first substrate D is made of a non-conductive and flexible material, and serves as a support for maintaining an antenna pattern such as the circuit layer F. FIG.

The circuit layer F is generally formed of copper, which is a conductive material, and may be formed in a pattern for electromagnetic radiation. The circuit layer (F) is generally formed on the first substrate (D) by bonding the copper thin film with a thermocompression bonding or an adhesive and then photosensitive or printing and etching the copper thin film.

However, copper is susceptible to oxidation and corrosion, so that oxidation and corrosion occur when exposed to air. Oxidation and corrosion of the copper pattern may change antenna characteristics, which may cause antenna operation problems.

In order to prevent this, a built-in antenna using a general flexible circuit board covers the circuit layer F using PSR ink (I). However, the PSR ink I is not applied to the terminal portion F ′ for transmitting the RF signal, which is supplied with power or received from the outside, to the outside. Accordingly, in order to prevent corrosion of the terminal portion F ′ and to improve conductivity, a plating layer may be further included. Here, the plating layer may be formed to include a base plating layer (G) and a gold plating layer (H) using nickel (Ni) for ease of plating.

On the other hand, since the terminal portion F ′ may be stressed while being connected to an external device, a built-in antenna using a flexible circuit board may include a terminal reinforcement plate B and a terminal reinforcement plate B for strength reinforcement. It may further include an adhesive (C) for the adhesion between the first substrate (D).

Hereinafter, referring to FIG. 1, a problem in the step of forming the PSR layer will be described.

Since the process temperature must be high for the PSR ink process, the first substrate D must be formed of a heat resistant material that can withstand high temperatures. However, in general, the first substrate D is made of a synthetic resin, and since the synthetic resin has poor heat resistance, a heat treatment for enduring the PSR process should be added. Accordingly, it takes a lot of cost and time to perform the PSR ink process, there is a problem that cracks may occur when the ink used in the PSR layer (I) is formed on the curved surface.

According to one embodiment of the present invention, a manufacturing process time is shortened by changing and improving a manufacturing method, and an antenna using a flexible circuit board having excellent performance through a structural change and a method of manufacturing the same are provided.

In addition, according to an embodiment of the present invention, there is provided an antenna using a flexible circuit board which reduces the substrate structure of the antenna and increases the internal space utilization of the terminal, and a method of manufacturing the same.

According to a first embodiment of the present invention, there is provided a semiconductor device comprising: a first substrate formed of a material having flexibility and insulation properties; And

Provided is an antenna using a flexible circuit board formed of a thin film pattern of a conductive material on the first substrate and including a circuit layer having a terminal portion connected to the outside.

According to a second embodiment of the present invention, there is provided a semiconductor device comprising: a first substrate formed of a material having flexibility and insulation properties; And

A circuit layer formed under the first substrate in a thin film pattern of a conductive material and having a terminal portion connected to the outside;

The first substrate provides an antenna using a flexible circuit board formed to expose the terminal portion.

According to a third embodiment of the present invention, there is provided a method comprising: providing a first substrate;

Patterning a thin film of a conductive material on the first substrate to form a circuit layer having a terminal portion connected to an external circuit; And

It provides a method of manufacturing an antenna using a flexible circuit board comprising the step of forming a second substrate to expose the terminal portion.

According to a fourth embodiment of the present invention, there is provided a method including: providing a first substrate;

Patterning a thin film of a conductive material under the first substrate to form a circuit layer having a terminal portion connected to an external circuit;

The step of providing the first substrate provides a method of manufacturing an antenna using a flexible circuit board having a first substrate to expose the terminal portion.

According to an embodiment of the present invention, by improving the metal foil and synthetic resin sheet raw material of the flexible circuit board to improve the chemical performance, to reduce the manufacturing process time by changing and improving the manufacturing method, and to change the structure of the built-in antenna having excellent performance It can manufacture.

In addition, according to the embodiment of the present invention, it is possible to manufacture a built-in antenna that increases the internal space utilization of the terminal by reducing the substrate structure of the antenna. In addition, manufacturing costs can be reduced by changing raw materials and reducing the substrate structure of the antenna.

2-11 is a flowchart explaining the manufacturing method of the antenna which concerns on 1st Embodiment of this invention.

12-20 is a flowchart explaining the manufacturing method of the antenna which concerns on 2nd Embodiment of this invention.

21 to 24 show result data of a reliability test of an antenna manufactured according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing in detail the operating principle of the preferred embodiment of the present invention, if it is determined that the detailed description of the related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

In the drawings, parts irrelevant to the description are omitted for simplicity of explanation, and like reference numerals designate like parts throughout the specification.

In addition, when a part is said to "include" a certain component, this means that it may further include other components, except to exclude other components unless otherwise stated.

An antenna using the flexible circuit board of the present invention and a method of manufacturing the same suggest a direction for removing or replacing a PSR layer.

Specifically, according to the first embodiment of the present invention, the circuit layer formed of the existing copper thin film is composed of aluminum and at the same time, the existing PSR layer is replaced with a synthetic resin, and according to the second embodiment of the present invention, the existing copper thin film The circuit layer formed of aluminum may be composed of aluminum and two substrate layers may be replaced with one.

In particular, the prior art of FIG. 1 has a structure in which the first substrate layer is bonded to a non-conductive material, but the second embodiment of the present invention replaces the circuit layer with aluminum having high corrosion resistance and oxidation resistance, and at the same time, By adopting a bonding structure, the PSR layer can be removed.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail.

11 is a configuration diagram of an antenna using a flexible circuit board according to the first embodiment of the present invention. The antenna using the flexible circuit board according to the first embodiment of the present invention may include a first substrate D1, a circuit layer F, and a second substrate D2. Further, if necessary, a first adhesive layer (not shown) between the first substrate D1 and the circuit layer F, a second adhesive layer (not shown) between the second substrate D2 and the circuit layer F, and a first 1 may further include one or more of the adhesive tape layer (A) formed under the substrate (D1). In addition, if necessary, it may further include a plating layer H formed in a single layer or multiple layers on the terminal portion F ′, and may further include a terminal reinforcing plate B.

Hereinafter, with reference to FIG. 11, the structure of the antenna using the flexible circuit board which concerns on 1st Embodiment of this invention is demonstrated in detail.

Referring to FIG. 11, the first substrate D1 may be formed of a material having flexibility and insulation, and may perform a support function of the flexible circuit board.

The circuit layer F is formed of a thin film pattern of a material having conductivity (in addition, may have corrosion resistance and oxidation resistance) on the first substrate D1, and has a terminal portion F ′ connected to the outside. It can be provided. The circuit layer (F) has better corrosion resistance and oxidation resistance than copper, and may be made of a material such as aluminum having conductivity, and replaces a protective layer such as a conventional PSR layer (I) with a second substrate (D2). have. In addition, the material used for the circuit layer F can be formed in a thin film pattern so as not to be subject to the softness required as the flexible circuit board.

Aluminum may be mentioned as a material having the above characteristics. In addition, the antenna not only aims at radiating electromagnetic waves through the line but is not intended to transmit power through the line, and even if the antenna is made of aluminum instead of copper, the change in the resistance of the antenna is not large unless the antenna is enlarged. As an example, in the case of a 10cm mobile antenna, the resistance of the line is 0.02 ohm when made of copper and 0.04 ohm when made of aluminum, so the change of the radiation pattern by the line resistance is not large.

The second substrate D2 may be formed of a material having flexibility and insulation on the first substrate D1 and the circuit layer F, and may be formed to expose the terminal portion F ′ of the circuit layer F. . That is, according to the embodiment of the present invention, the second substrate D2 may take the role of the conventional PSR layer I. Accordingly, the high temperature process according to the application of the PSR ink may be omitted, and the time and cost required for manufacturing may be reduced.

The first substrate D1 and the second substrate D2 may be formed of a synthetic resin, and examples of the synthetic resin include polyethylene terephthalate (PET), polyimide (PI), and KAPTON resin. The first substrate D1 and the second substrate D2 may be formed of the same synthetic resin, or may be formed of different synthetic resins as necessary. In addition, the first substrate D1 and the second substrate D2 may be formed of an opaque synthetic resin or a colored synthetic resin in order to prevent pattern exposure of the circuit unit.

The bonding between the first substrate D1, the circuit layer F, and the second substrate D2 layer may be formed using a thermal bonding method, or may be formed using an adhesive layer (not shown).

When the interlayer junction is formed using the adhesive layer, the antenna using the flexible circuit board of the present invention may include a first adhesive layer (not shown) and a circuit layer (F) formed between the first substrate (D1) and the circuit layer (F). And a second adhesive layer (not shown) formed between the second substrates D2.

Meanwhile, an adhesive tape layer A may be formed under the first substrate D1 to bond the external device of the non-conductive material to the first substrate D1. In addition, the plating layer H may form (single layer) only a gold plating layer. After the base plating layer is formed of nickel (Ni), a gold plating layer may be formed.

As described above, according to the first embodiment of the present invention, since the PSR layer (I) using PSR ink can be replaced with the second substrate (D2) using synthetic resin, it is possible to reduce the antenna manufacturing time and lower the manufacturing cost. Can be.

Furthermore, according to the second embodiment of the present invention, the antenna may be configured to include the first substrate D1 and the circuit layer F. FIG. Hereinafter, the structure of the antenna using the flexible circuit board which concerns on 2nd Embodiment of this invention is demonstrated.

20 is a configuration diagram of an antenna using a flexible circuit board in a second embodiment of the present invention. to be. The antenna using the flexible circuit board according to the second embodiment of the present invention may be configured to include the first substrate D1 and the circuit layer F. FIG. In addition, if necessary, one or more of the first adhesive layer (not shown) and the adhesive tape layer A between the first substrate D1 and the circuit layer F may be further included, and the plating layer H or the terminal reinforcement may be further included. It may further include a plate (B).

Referring to FIG. 20, the first substrate D1 may be formed to expose the terminal portion F ′ of the circuit layer F with a material having flexibility and insulation. The first substrate D1 functions as a support of the flexible circuit board, and may expose the terminal portion F ′ to be connected to an external device.

As described above, the first substrate D1 may be formed of a synthetic resin, and examples of the synthetic resin include PET, PI, and KAPTON resins. In addition, in order to prevent pattern exposure of the circuit part, the first substrate D1 may be formed of an opaque synthetic resin or a colored synthetic resin.

Meanwhile, the circuit layer F is formed of a thin film pattern of a material having conductivity (in addition, may have corrosion resistance and oxidation resistance) under the first substrate D1 and is connected to an external terminal portion F ′. ) May be provided. As mentioned above, aluminum is mentioned as an example of the material which forms the circuit layer (F).

In addition, the bonding between the first substrate D1 and the circuit layer F may be formed using a thermal bonding method or may be formed using an adhesive layer (not shown). When forming an interlayer junction using an adhesive layer (not shown), the antenna using the flexible circuit board of the present invention includes a first adhesive layer (not shown) formed between the first substrate D1 and the circuit layer F. FIG. can do. In addition, an adhesive tape layer A formed under the circuit layer F and the first substrate D1 may be further included for bonding to an external device made of a non-conductive material.

20 is a structure in which the second substrate layer D2 shown in FIG. 11 is removed and the circuit layer F is formed below the first substrate layer D1.

That is, the present invention removes the PSR layer (I), which was a large cost by changing the order of the structure and the constituent material of the circuit layer (F) in the antenna structure using a conventional flexible circuit board. Through the above-described configuration, in addition to the advantages obtained in the antenna structure shown in FIG. 2, it is possible to increase the internal space utilization of the terminal by reducing the substrate structure of the antenna.

2-11 is a flowchart explaining the manufacturing method of the antenna using the flexible circuit board which concerns on 1st Embodiment of this invention.

In the method for manufacturing an antenna using the flexible circuit board according to the first embodiment of the present invention, the joining of the substrates D1 and D2 and the circuit layer F may be formed by a thermal bonding method by heating and pressing. It can also be formed by using an adhesive layer (not shown). Hereinafter, a description will be given mainly on the thermal bonding method, it will be apparent to those skilled in the art that a separate adhesive layer may be used.

Hereinafter, with reference to FIG.2 and FIG.11, the manufacturing method of the antenna using the flexible circuit board which concerns on 1st Embodiment of this invention is demonstrated in detail.

First, after the first substrate D1 is formed, a circuit layer F having a terminal portion F ′ connected to an external circuit is formed by patterning a thin film of a conductive material on the first substrate D1. Step (see FIGS. 2 to 2E).

Specifically, the circuit layer F is adhered to the upper portion of the first substrate D1 (see FIG. 2). Next, the photosensitive dry film DF for forming a circuit may be attached to the surface of the circuit layer F (see FIG. 3). Thereafter, ultraviolet rays are irradiated through an exposure process to photocure only a necessary portion of the dry film DF, and then, the developing process may chemically remove the dry film DF of the uncured portion (see FIG. 4). . Next, an antenna pattern including the terminal part F ′ may be formed by etching the circuit layer F from which the dry film DF is removed in the developing process through an etching process (see FIG. 5). Thereafter, the remaining dry film DF on the first substrate D1 and the circuit layer F may be removed through a peeling process (see FIG. 6).

Thereafter, the method may include forming a second substrate D2 to expose the terminal portion F ′ (see FIG. 7).

Specifically, in the forming of the second substrate D2, after punching or etching the terminal portion F ′ of the second substrate D2 using a punching die, the second punched or etched through a hot press process. The substrate D2 may be bonded to the upper portion of the circuit layer F by heating and pressing (see FIG. 7).

In particular, according to the embodiment of the present invention, the second substrate D2 is bonded to the first substrate D1 and the circuit layer F, and not etched or punched, but instead of the second substrate D2. The position to be joined with the terminal portion can be etched or drilled and then joined. When etching or drilling after joining, process difficulty is high. However, since the material under the second substrate D2 is not taken into consideration before bonding, the difficulty of the process may be reduced, and the manufacturing speed of the second substrate D2 may be processed in parallel, thereby increasing the process speed.

Next, the hole TH for the guide pin of the punching die may be processed for the external processing of the product (see FIG. 8). After the processing of the hole TH, the necessary characters or symbols K can be printed with the thermosetting ink and the IR ink (see Fig. 9).

Next, a plating layer H formed of a single layer or multiple layers may be formed on the terminal portion F ′ exposed to the outside (see FIG. 10). The reason why the plating layer H is formed on the terminal portion F 'in this manner is to protect the terminal portion F ′ exposed to the outside. The plating layer may be composed of copper, nickel, gold, and the like.

Thereafter, the terminal reinforcement plate B and the adhesive tape layer A may be formed under the first substrate D1 (see FIG. 11).

Although not illustrated, a structure for aligning the etched portion of the second substrate D2 with the terminal portion F ′ of the circuit layer F may include the circuit layer F, the first substrate D1, and the first substrate D1. It may be formed on one or more of the two substrates (D2).

12-20 is a flowchart explaining the manufacturing method of the antenna using the flexible circuit board which concerns on 2nd Embodiment of this invention.

First, after the first substrate D1 is formed, a circuit layer F having a terminal portion F ′ connected to an external circuit is formed by patterning a thin film of a conductive material under the first substrate D1. 12 to 16 may be included.

Specifically, after punching or etching the terminal portion F ′ of the first substrate D1 by using a punching die, the first substrate D1 that is punched or etched through the hot press process is formed on the circuit layer F. It can be bonded by heating and pressing on (see Fig. 12). As described above, the process difficulty is further lowered by etching or puncturing the position where the first substrate D1 and the circuit layer F are joined to the terminal portion F 'of the first substrate D1 before bonding. Can be. In addition, the configuration of the substrate is simpler than in the case of an antenna using a conventional flexible circuit board, thereby reducing the substrate structure of the antenna and increasing the internal space utilization of the terminal.

Next, the photosensitive dry film DF for forming a circuit may be attached to the surface of the circuit layer F (see FIG. 13). In this case, according to the embodiment of the present invention, the dry film DF can be attached to both the upper and lower portions of the first substrate D1. The reason is that in the case of the flexible circuit board according to the second embodiment of the present invention, the terminal portion F 'of the circuit layer F exposed by the perforation of the first substrate D1 in the development, etching, and peeling process is stressed. Because it can not endure, deformation can occur. Accordingly, the dry film DF is attached to both the upper and lower portions of the first substrate D1 to maintain surface tension, and the terminal portion F of the circuit layer F exposed through the perforation of the first substrate D1. The deformation of ') can be prevented.

Thereafter, ultraviolet rays are irradiated through an exposure process to photocure only a necessary portion of the dry film DF, and then the dry film DF of the uncured portion may be chemically removed through a developing process (see FIG. 14). . Next, an antenna pattern including the terminal part F ′ may be formed by etching the circuit layer F from which the dry film DF is removed in the developing process through an etching process (see FIG. 15). Thereafter, the remaining dry film DF on the first substrate D1 and the circuit layer F may be removed through a peeling process (see FIG. 16).

According to the second embodiment of the present invention, instead of the two substrates D1 and D2 described in the first embodiment, one substrate D1 is used for the protection of the circuit layer F, whereby the flexible circuit board can be thinned. There are technical effects that can be devised.

Next, the hole TH for the guide pin of the punching die may be processed for the external processing of the product (see FIG. 17). After the processing of the hole TH, the necessary letter or symbol K can be printed with a thermosetting ink or IR ink (see FIG. 18).

Next, a plating layer H formed of a single layer or multiple layers may be formed on the terminal portion F ′ exposed to the outside (see FIG. 19). The reason why the plating layer H is formed on the terminal portion F 'in this manner is to protect the terminal portion F ′ exposed to the outside. The plating layer may be composed of copper, nickel, gold, and the like.

Finally, the terminal reinforcement plate B and the adhesive tape layer A may be formed under the first substrate D1 (see FIG. 20).

Hereinafter, a comparison result of a performance test of an antenna using a flexible circuit board manufactured according to an embodiment of the present invention and a conventional built-in antenna will be described.

First, Table 1 shows the results obtained by experiments of the average gain (average gain) for each frequency of the conventional built-in antenna and the antenna according to the embodiment of the present invention. As shown in Table 1, in the frequency bands 880 MHz to 960 MHz and 1710 MHz to 1880 MHz, the average gain of the antenna produced by the present invention is about the same as that of a conventional built-in antenna (including the circuit layer and PSR layer of copper). It can be seen that can be obtained. In addition to the frequency band, the performance may be the same in frequency bands such as Bluetooth, Wi-Fi, GPS, LTE, and the like.

That is, according to the embodiment of the present invention, it is possible to obtain almost the same average gain while reducing the cost and time required to perform the PSR ink process, and in particular, according to the second embodiment, the PSR layer is made of only the first substrate D1. Because it can play the role of can be obtained a technical effect to manufacture a thinner antenna than conventional.

Table 1

frequency	Average gain of the present invention	Average gain of the prior invention
880 MHz	-3.7 dBi	-3.6 dBi
896 MHz	-4.1 dBi	-4.0 dBi
915 MHz	-4.6 dBi	-4.5 dBi
925 MHz	-4.5 dBi	-4.4 dBi
944 MHz	-5.1 dBi	-5.1 dBi
960 MHz	-5.5 dBi	-5.5 dBi
1710 MHz	-3.7 dBi	-3.7 dBi
1744 MHz	-3.9 dBi	-3.9 dBi
1785 MHz	-4.0 dBi	-4.0 dBi
1805 MHz	-4.3 dBi	-4.3 dBi
1846 MHz	-4.5 dBi	-4.6 dBi
1880 MHz	-4.5 dBi	-4.5 dBi

21 to 24 show voltage standing wave ratios (VSWRs) obtained under test conditions according to Table 2 below for the antenna according to the embodiment of the present invention.

TABLE 2

number	test item	test requirements
One	Constant temperature and humidity	80 ℃, 80%, 120Hr
2	Thermal shock	-40 ℃ ~ + 85 ℃, 30 Cycle (Rising / Falling Time: within 5 minutes)
3	Salt spray	35 ° C., 5% NaCl, 48 Hr
4	Heat-resistant hot water	80 ℃, 2Hr

Reference numeral 411 of FIG. 21 denotes a voltage standing wave ratio (VSWR) before testing, and the reference numeral 412 denotes a voltage standing wave ratio (Voltage Standing Wave Ratio, VSWR) obtained under a constant temperature and humidity test condition of 80 ° C, 80%, and 120 Hr. ) Is shown.

As shown in FIG. 21, it can be seen that the voltage standing wave ratio VSWR before and after the

test

411 and 412 is almost the same.

The reference numeral 421 of FIG. 22 denotes a voltage standing wave ratio (VSWR) before the test, and the reference numeral 422 denotes a thermal shock test condition of -40 ° C to + 85 ° C and 30 cycles (Rising / Falling Time: within 5 minutes). The Voltage Standing Wave Ratio (VSWR) is shown below.

As shown in FIG. 22, it can be seen that the voltage standing wave ratio VSWR before and after the

test

421 and 422 is almost the same.

In addition, reference numeral 431 of FIG. 23 denotes a voltage standing wave ratio (Voltage Standing Wave Ratio, VSWR) before the test, and a reference numeral 432 denotes a voltage standing wave ratio (Voltage Standing Wave) obtained under a salt spray test condition of 35 ° C., 5% NaCl, and 48Hr. Ratio, VSWR).

As shown in FIG. 23, it can be seen that the voltage standing wave ratio VSWR before and after the

test

431 and 432 is almost the same.

Lastly, reference numeral 441 of FIG. 24 denotes a voltage standing wave ratio (VSWR) before the test, and the reference numeral 442 denotes a voltage standing wave ratio obtained under a hot water test condition of 80 ° C. and 2Hr. , VSWR).

As shown in FIG. 24, it can be seen that the voltage standing wave ratio VSWR before the test 441 and after the test 442 is almost the same.

As described above, according to the embodiment of the present invention, the chemical performance is improved by changing the metal foil and the synthetic resin sheet raw material of the flexible circuit board, the manufacturing process time is shortened by changing and improving the manufacturing method, and the performance by changing the structure This excellent built-in antenna can be manufactured.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and it is common in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be apparent to those skilled in the art.

Claims

A first substrate formed of a flexible and insulating material; And

An antenna using a flexible circuit board formed of a thin film pattern of a conductive material on the first substrate, the circuit layer having a terminal portion connected to the outside.
The method of claim 1,

The circuit layer,

Antenna using a flexible circuit board formed of aluminum.
The method of claim 1,

An antenna using a flexible circuit board,

And a second substrate formed of a material having flexibility and insulation on the first substrate and the circuit layer, the second substrate being formed to expose the terminal portion.
The method of claim 3,

The first substrate or the second substrate,

An antenna using a flexible circuit board formed of a synthetic resin.
The method of claim 3,

The first substrate or the second substrate,

Antenna using a flexible circuit board formed of one of PET, PI and KAPTON.
The method of claim 3,

The first substrate or the second substrate,

An antenna using a flexible circuit board formed of opaque synthetic resin or colored synthetic resin.
The method of claim 3,

The antenna using the flexible circuit board,

And an adhesive tape layer formed under the first substrate.
The method of claim 1,

The antenna using the flexible circuit board,

The antenna using a flexible circuit board further comprises a plating layer formed on the terminal portion in a single layer or multiple layers.
A first substrate formed of a flexible and insulating material; And

A circuit layer formed under the first substrate in a thin film pattern of a conductive material and having a terminal portion connected to the outside;

The first substrate is an antenna using a flexible circuit board is formed so that the terminal portion is exposed.
The method of claim 9,

The circuit layer,

Antenna using a flexible circuit board formed of aluminum.
The method of claim 9,

The first substrate,

An antenna using a flexible circuit board formed of a synthetic resin.
The method of claim 9,

The first substrate,

Antenna using a flexible circuit board formed of one of PET, PI and KAPTON.
The method of claim 9,

The first substrate,

An antenna using a flexible circuit board formed of opaque synthetic resin or colored synthetic resin.
The method of claim 9,

The antenna using the flexible circuit board,

And an adhesive tape layer formed under the circuit layer and the first substrate.
The method of claim 9,

The antenna using the flexible circuit board,

The antenna using a flexible circuit board further comprises a plating layer formed on the terminal portion in a single layer or multiple layers.
Providing a first substrate;

Patterning a thin film of a conductive material on the first substrate to form a circuit layer having a terminal portion connected to an external circuit; And

A method of manufacturing an antenna using a flexible circuit board comprising the step of forming a second substrate to expose the terminal portion.
The method of claim 16,

The circuit layer,

An antenna manufacturing method using a flexible circuit board formed by patterning aluminum.
The method of claim 16,

Forming the circuit layer,

Forming a thin film of a conductive material on the first substrate; And

And etching the thin film to form an antenna pattern including the terminal part.
The method of claim 16,

Forming the second substrate,

Providing a second substrate;

Etching or drilling an area of the terminal portion of the second substrate; And

And attaching the etched or perforated second substrate to the upper circuit layer.
The method of claim 16,

The first substrate or the second substrate,

A method of manufacturing an antenna using a flexible circuit board formed of synthetic resin.
Providing a first substrate;

Patterning a thin film of a conductive material under the first substrate to form a circuit layer having a terminal portion connected to an external circuit;

The step of providing the first substrate is a method of manufacturing an antenna using a flexible circuit board having a first substrate to expose the terminal portion.
The method of claim 21,

The circuit layer,

An antenna manufacturing method using a flexible circuit board formed by patterning aluminum.
The method of claim 21,

The step of providing the first substrate,

A method of manufacturing an antenna using a flexible circuit board, the method comprising etching or drilling an area of the terminal portion of the first substrate.
The method of claim 21,

Forming the circuit layer,

Forming a thin film of a material having corrosion resistance, oxidation resistance, and conductivity under the first substrate; And

And etching the thin film to form an antenna pattern including the terminal part.
The method of claim 21,

The first substrate,

A method of manufacturing an antenna using a flexible circuit board formed of synthetic resin.