WO2012115989A3 - Silicon-based cooling package with diamond coating for heat-generating devices - Google Patents

Silicon-based cooling package with diamond coating for heat-generating devices Download PDF

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Publication number
WO2012115989A3
WO2012115989A3 PCT/US2012/025985 US2012025985W WO2012115989A3 WO 2012115989 A3 WO2012115989 A3 WO 2012115989A3 US 2012025985 W US2012025985 W US 2012025985W WO 2012115989 A3 WO2012115989 A3 WO 2012115989A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
primary side
manifold
silicon
generating device
Prior art date
Application number
PCT/US2012/025985
Other languages
French (fr)
Other versions
WO2012115989A2 (en
Inventor
Gerald Ho KIM
Original Assignee
Kim Gerald Ho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kim Gerald Ho filed Critical Kim Gerald Ho
Publication of WO2012115989A2 publication Critical patent/WO2012115989A2/en
Publication of WO2012115989A3 publication Critical patent/WO2012115989A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Abstract

Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a heat-generating device are described. In one aspect, a thermal energy transfer apparatus comprises a silicon-based manifold having an internal cavity, a first primary side, and a second primary side opposite the first primary side. The second primary side of the manifold has at least one coolant inlet port and at least one coolant outlet port that are connected to the internal cavity of the manifold, the at least one coolant inlet port being at a position directly opposite a position on the diamond layer where the heat-generating device is received. A diamond layer covers at least a portion of the first primary side of the manifold such that the heat- generating device is in direct contact with the diamond layer when the heat- generating device is received on the first primary side of the manifold.
PCT/US2012/025985 2011-02-22 2012-02-21 Silicon-based cooling package with diamond coating for heat-generating devices WO2012115989A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161445171P 2011-02-22 2011-02-22
US61/445,171 2011-02-22

Publications (2)

Publication Number Publication Date
WO2012115989A2 WO2012115989A2 (en) 2012-08-30
WO2012115989A3 true WO2012115989A3 (en) 2014-04-24

Family

ID=46651784

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/025985 WO2012115989A2 (en) 2011-02-22 2012-02-21 Silicon-based cooling package with diamond coating for heat-generating devices

Country Status (2)

Country Link
US (1) US20120211199A1 (en)
WO (1) WO2012115989A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9042424B2 (en) * 2008-08-25 2015-05-26 Gerald Ho Kim Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070040A (en) * 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US20050046017A1 (en) * 2003-08-25 2005-03-03 Carlos Dangelo System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US20060126308A1 (en) * 2004-12-10 2006-06-15 International Business Machines Corporation Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
US20060131003A1 (en) * 2004-12-20 2006-06-22 Je-Young Chang Apparatus and associated method for microelectronic cooling
US20070269604A1 (en) * 2006-01-13 2007-11-22 Daniel Francis Method for manufacturing smooth diamond heat sinks
US20100000718A1 (en) * 2008-06-02 2010-01-07 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
US20100276701A1 (en) * 2009-04-29 2010-11-04 Hebert Francois Low thermal resistance and robust chip-scale-package (csp), structure and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US5146314A (en) * 1990-03-09 1992-09-08 The University Of Colorado Foundation, Inc. Apparatus for semiconductor circuit chip cooling using a diamond layer
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
US7215545B1 (en) * 2003-05-01 2007-05-08 Saeed Moghaddam Liquid cooled diamond bearing heat sink
US7365980B2 (en) * 2003-11-13 2008-04-29 Intel Corporation Micropin heat exchanger
EP2028432A1 (en) * 2007-08-06 2009-02-25 Université de Mons-Hainaut Devices and method for enhanced heat transfer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070040A (en) * 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US20050046017A1 (en) * 2003-08-25 2005-03-03 Carlos Dangelo System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
US20060126308A1 (en) * 2004-12-10 2006-06-15 International Business Machines Corporation Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
US20060131003A1 (en) * 2004-12-20 2006-06-22 Je-Young Chang Apparatus and associated method for microelectronic cooling
US20070269604A1 (en) * 2006-01-13 2007-11-22 Daniel Francis Method for manufacturing smooth diamond heat sinks
US20100000718A1 (en) * 2008-06-02 2010-01-07 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
US20100276701A1 (en) * 2009-04-29 2010-11-04 Hebert Francois Low thermal resistance and robust chip-scale-package (csp), structure and method

Also Published As

Publication number Publication date
WO2012115989A2 (en) 2012-08-30
US20120211199A1 (en) 2012-08-23

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