WO2012102168A1

WO2012102168A1 - Lighting device, display device, and television receiver

Info

Publication number: WO2012102168A1
Application number: PCT/JP2012/051080
Authority: WO
Inventors: 達朗黒田
Original assignee: シャープ株式会社
Priority date: 2011-01-26
Filing date: 2012-01-19
Publication date: 2012-08-02

Abstract

This lighting device is characterized by comprising: cold cathode tubes (17); a chassis (14) that is formed by a conductive material and accommodates the cold-cathode tubes (17); a control circuit board (40) attached to the chassis (14); a circuit board cover (60) formed from a conductive material, attached to the chassis (14), and disposed so as to cover the control circuit board (40); and a conductive member (80) intervening between the chassis (14) and the circuit board cover (60) and being elastically in contact with both the chassis (14) and circuit board cover (60). The lighting device is further characterized by at least part of a contact surface (63D), which is on the circuit board cover (60) and in contact with the conductive member (80), having a protruding part (70) formed thereon that protrudes toward the chassis (14).

Description

Lighting device, display device, and television receiver

The present invention relates to a lighting device, a display device, and a television receiver.

Conventionally, since a liquid crystal panel used for a liquid crystal display device such as a liquid crystal television does not emit light spontaneously, a backlight device is separately provided as a lighting device. This backlight device is well known to be installed on the back side of the liquid crystal panel (opposite to the display surface). The backlight device is installed on the inner surface of the bottom plate of the chassis and the chassis having a shape opened on the liquid crystal panel side. A plurality of light sources (for example, cold-cathode tubes and LEDs), an optical member (such as a diffusion plate) that is disposed in the opening of the chassis and efficiently emits light emitted from the light sources to the liquid crystal panel side, And a light reflecting sheet that reflects light from the light source toward the optical member and the liquid crystal panel.

Also, it is known that a circuit board for driving a liquid crystal display device is attached to the chassis, and a board cover is attached so as to cover the circuit board. As an example of a liquid crystal display device provided with such a substrate cover, one described in Patent Document 1 below is known.

When driving a circuit board (circuit component) as described above, electromagnetic waves caused by harmonics of digital signals may be radiated in the air. Such radiated electromagnetic waves may be emitted from other electronic devices. There is concern about the situation (EMI) that affects the operation.

As a configuration for suppressing the emission of such electromagnetic waves, a configuration in which the above-described substrate cover and chassis are made of a conductive material and the substrate cover and the chassis are electrically connected is known. Thereby, electromagnetic waves generated from the circuit board can be effectively shielded by the board cover and the chassis.

Also, by electrically connecting the board cover and the chassis, the electrical energy caused by the electromagnetic waves is transmitted to the chassis via the board cover, and is more easily consumed. For this reason, the situation where the substrate cover is affected by the electromagnetic waves generated from the circuit board and acts as an antenna (the situation where electromagnetic waves are generated through the substrate cover) can be suppressed, and EMI countermeasures can be more effectively taken.

And, the above-described electrical connection between the substrate cover and the chassis is generally made through a conductive member (gasket) having elasticity. Such a conductive member is interposed between the board cover and the chassis so as to be compressed. As a result, the conductive member adheres to both the board cover and the chassis so that the board cover and the chassis are electrically connected. Connected.

JP 2005-197510 A

(Problems to be solved by the invention)
However, if the conductive member is arranged in a compressed form, the substrate cover and the chassis may be bent away from each other due to the reaction force (restoring force) of the conductive member. As a result, the adhesion between the conductive member and both the board cover and the chassis is impaired. As a result, the electrical connection between the board cover and the chassis becomes insufficient, and the electromagnetic shielding performance may be deteriorated. .

The present invention has been completed based on the above circumstances, and an object of the present invention is to provide an illumination device capable of more reliably performing electrical connection between a chassis and a substrate cover. Moreover, it aims at providing the display apparatus provided with such an illuminating device, and a television receiver.

(Means for solving problems)
In order to solve the above-described problems, a lighting device of the present invention is formed of a light source, a conductive material, a chassis in which the light source is accommodated, a circuit board attached to the chassis, and a conductive material. And a board cover attached to the chassis and arranged to cover the circuit board, interposed between the chassis and the board cover, and elastically contacted with both the chassis and the board cover, respectively. In either one of the board cover or the chassis, at least a part of the contact surface in contact with the conductive member faces the other one of the board cover or the chassis. This is characterized in that a protruding portion is formed.

In the present invention, the substrate cover and the chassis are formed of a conductive material, and the conductive member is in contact with both the substrate cover and the chassis. Thereby, the substrate cover and the chassis are electrically connected via the conductive member. With this configuration, even when electromagnetic waves are generated from the circuit board when the circuit board is driven, the electromagnetic waves can be effectively blocked by the board cover and the chassis, and the electromagnetic waves are externally transmitted. It is possible to suppress the situation of radiation.

In addition, the conductive member is elastically in contact with both the substrate cover and the chassis, and is configured to ensure contact more reliably. By the way, in a state where the conductive member is elastically in contact with both the substrate cover and the chassis, that is, in a state where the conductive member is compressed between the chassis and the substrate cover, the chassis or the substrate is caused by the repulsive force of the conductive member. Any one (or both) of the covers may be bent in a direction away from the conductive member. When the chassis (or the substrate cover) is bent in this manner, the contact pressure with the conductive member is reduced, and as a result, the contact with the conductive member may be insufficient.

In this regard, in the present invention, a protrusion projecting toward the chassis is formed on the contact surface of the substrate cover with the conductive member. By doing in this way, an electroconductive member can be compressed more strongly compared with the structure in which the protrusion is not formed. That is, the contact pressure between the conductive member and the chassis (or substrate cover) can be increased. Thereby, even if the chassis (or the substrate cover) is bent in a direction away from the conductive member, the contact pressure with the conductive member can be secured, and the electrical contact with the conductive member can be ensured. The contact, and thus the electrical connection between the chassis and the substrate cover can be reliably performed. Thereby, electromagnetic waves can be more reliably shielded by the substrate cover and the chassis, and the electromagnetic shielding performance can be further enhanced.

In the above configuration, the substrate cover has a pair of attachment portions that are respectively attached to the chassis, and the protrusions are arranged between the pair of attachment portions in the arrangement direction of the pair of attachment portions. Can be.

The above-described flexure of the chassis (or board cover) tends to increase as the distance from the mounting position (attachment portion) between the board cover and the chassis increases. That is, in the configuration in which the pair of attachment portions are attached to the chassis as in the present invention, a portion corresponding between the pair of attachment portions is a portion that is relatively easily bent. For this reason, in this invention, it was set as the structure which distribute | arranges a protrusion between a pair of attachment parts in the sequence direction of a pair of attachment parts. Thereby, in a chassis (or board | substrate cover), a chassis (and board | substrate cover) and a conductive member can be made to contact reliably in the location where bending tends to become large.

In addition, a plurality of the protrusions are arranged along the arrangement direction of the pair of attachment parts, and each of the protrusions is arranged between the pair of attachment parts in the arrangement direction of the pair of attachment parts. Can be.

In the present invention, a plurality of protrusions are arranged along the arrangement direction of the pair of attachment parts. If it is such a structure, the magnitude | size of the contact pressure of the electroconductive member which acts on a chassis (and board | substrate cover) will be adjusted by adjusting the formation number and formation location of a protrusion in the arrangement direction of a pair of attachment part. It can be easily changed.

Further, the protruding portion may have a shape in which the protruding height increases as the distance from the mounting position of the substrate cover to the chassis increases.

The above-described flexure of the chassis (or board cover) tends to increase as the distance from the mounting position of the board cover to the chassis increases. For this reason, in this invention, it was set as the shape which the protrusion height becomes large as it protrudes from the said attachment location. As a result, the contact pressure between the chassis (and the substrate cover) and the conductive member can be more reliably ensured at a location that is far from the mounting location and is likely to bend greatly.

Further, a plurality of the protrusions may be formed by knurling at least a part of the contact surface that is in contact with the conductive member.

A plurality of protrusions can be formed more easily by forming the protrusions by knurling. Moreover, if it is a knurling process, it is possible to form many minute protrusions. When a plurality of minute protrusions contact the conductive member, a high frictional force can be obtained with the conductive member. Thereby, the situation where the position of a conductive member shifts can be controlled more certainly.

In addition, the substrate cover has a square shape in plan view, and the conductive member has end portions on both sides in the one side direction of the substrate cover and the other side direction orthogonal to the one side direction in the plan view. Are arranged so as to overlap with both ends of the substrate cover, and the protrusions are arranged on both sides of the substrate cover in the one side direction and on both sides of the substrate cover in the other side direction. Each may be formed at each end.

In the present invention, the substrate cover has a square shape in plan view, and the conductive members are arranged on the four sides (the ends on both sides in one side direction and the ends on both sides in the other side direction) of the substrate cover. And the protrusion is formed in the edge part of the both sides in the one side direction and other side direction of a substrate cover, respectively. Thereby, the contact pressure between the conductive member and the chassis (and the substrate cover) can be made uniform over the entire circumference of the peripheral end portion of the substrate cover. Can be more reliably brought into contact with each other.

In the protrusion, an end wall portion is erected at the end portion on the circuit board side toward the substrate cover, and the end portion on the circuit board side of the conductive member abuts on the standing wall portion. Thereby, it can be set as the structure which regulates the displacement to the said circuit board side of the said electroconductive member.

The conductive member that is elastically in contact with both the chassis and the substrate cover may extend along the contact surface of the chassis by being compressed. When the conductive member extends along the contact surface of the chassis, there is a concern that the conductive member may come into contact with, for example, the circuit board and affect the operation of the circuit board. In particular, in the present invention, the conductive member is more strongly compressed by forming a protrusion on the contact surface, and the amount of the conductive member that extends along the contact surface of the chassis when the conductive member is compressed is large. Prone. In this regard, in the present invention, the displacement of the conductive member toward the circuit board can be restricted by the standing wall portion. For this reason, the situation where a conductive member contacts a circuit board can be controlled.

Next, in order to solve the above-described problem, a display device according to the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.

Also, a liquid crystal panel can be exemplified as the display panel. Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.

Next, in order to solve the above-described problem, a television receiver according to the present invention includes the display device.

(The invention's effect)
ADVANTAGE OF THE INVENTION According to this invention, the illuminating device which can perform the electrical connection of a chassis and a board | substrate cover more reliably can be provided. In addition, it is possible to provide a display device and a television receiver including such a lighting device.

The disassembled perspective view which shows schematic structure of the television receiver which concerns on Embodiment 1 of this invention. The disassembled perspective view which shows schematic structure of the liquid crystal display device with which the television receiver of FIG. 1 is provided. Sectional drawing which shows the cross-sectional structure along the long side direction of a liquid crystal display device. The top view which shows the back surface of the backlight apparatus with which the liquid crystal display device of FIG. 2 is provided. The top view which shows the state which attached the board | substrate cover in the backlight apparatus of FIG. The enlarged view which shows a board | substrate cover in FIG. The perspective view which expands and shows the corner part of a board | substrate cover in FIG. Sectional drawing which shows the cross-sectional structure along the short side direction of a board | substrate cover (corresponding to the figure cut | disconnected by the AA line of FIG. 6). Sectional drawing which shows the cross-sectional structure along the long side direction of a board | substrate cover (corresponding to the figure cut | disconnected by the BB line of FIG. 6). Sectional drawing which shows the cross-sectional structure along the long side direction of the substrate cover which concerns on Embodiment 2 of this invention. The top view which shows the board | substrate cover which concerns on Embodiment 3 of this invention. Sectional drawing which shows the cross-sectional structure along the long side direction of a substrate cover (corresponding to the figure cut | disconnected by the DD line | wire of FIG. 11). The top view which shows the board | substrate cover which concerns on Embodiment 4 of this invention. Sectional drawing which shows the cross-sectional structure along the long side direction of a substrate cover (corresponding to the figure cut | disconnected by the EE line of FIG. 13). The disassembled perspective view which shows schematic structure of the television receiver which concerns on Embodiment 5 of this invention. The disassembled perspective view which shows schematic structure of the liquid crystal display device with which the television receiver of FIG. 15 is provided. Sectional drawing which shows the cross-sectional structure along the long side direction of a liquid crystal display device. The top view which shows the back surface of the backlight apparatus with which the liquid crystal display device of FIG. 16 is provided. The top view which shows the state which attached the board | substrate cover in the backlight apparatus of FIG. The enlarged view which shows a board | substrate cover in FIG. The perspective view which expands and shows the corner part of a board | substrate cover in FIG. Sectional drawing which shows the cross-sectional structure along the short side direction of a board | substrate cover (corresponding to the figure cut | disconnected by the AA line of FIG. 20). Sectional drawing which shows the cross-sectional structure along the long side direction of a board | substrate cover (corresponding to the figure cut | disconnected by the BB line of FIG. 20). Sectional drawing which shows the cross-sectional structure along the long side direction of the backlight apparatus which concerns on Embodiment 6 of this invention. The top view which shows the backlight apparatus which concerns on Embodiment 7 of this invention. Sectional drawing which shows the cross-sectional structure along the long side direction of a backlight apparatus (corresponding to the figure cut | disconnected by the DD line | wire of FIG. 25). The top view which shows the backlight apparatus which concerns on Embodiment 8 of this invention. Sectional drawing which shows the cross-sectional structure along the long side direction of a backlight apparatus (corresponding to the figure cut | disconnected by the EE line of FIG. 27). The top view which shows the backlight apparatus which concerns on Embodiment 9 of this invention. Sectional drawing which shows the cross-sectional structure along the long side direction of a backlight apparatus (corresponding to the figure cut | disconnected by the FF line | wire of FIG. 29). Sectional drawing which shows the cross-sectional structure along the short side direction of a backlight apparatus (corresponding to the figure cut | disconnected by the GG line of FIG. 29). Sectional drawing which shows the process in which a board | substrate cover is attached with respect to a chassis (corresponding to the figure cut | disconnected by the GG line of FIG. 29).

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. First, the configuration of the television receiver TV including the liquid crystal display device 10 will be described. 1 is an exploded perspective view showing a schematic configuration of the television receiver of the present embodiment, FIG. 2 is an exploded perspective view showing a schematic configuration of a liquid crystal display device included in the television receiver of FIG. 1, and FIG. 3 is a liquid crystal display of FIG. It is sectional drawing which shows the cross-sectional structure along the long side direction of an apparatus. The long side direction of the liquid crystal display device 10 (and the chassis 14) is the X-axis direction, and the short side direction is the Y-axis direction. Also, the vertical direction in FIG. 3 is the Z-axis direction (front and back direction), the upper direction in FIG. 3 is the front side, and the lower direction is the back side.

As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power supply substrate P, and a tuner T. And a stand S. The liquid crystal display device 10 (display device) has a horizontally long rectangular shape as a whole, and is accommodated in a vertically placed state (a state in which the short side direction is arranged along the vertical direction). As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 (display panel) and a backlight device 12 (illumination device) as an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained.

Next, the liquid crystal panel 11 and the backlight device 12 constituting the liquid crystal display device 10 will be described. The liquid crystal panel 11 performs display using light from the backlight device 12, and a pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is supposed to be configured. One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. The substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film. Note that

polarizing plates

11a and 11b are attached to the outside of both substrates (see FIG. 3).

As shown in FIG. 2, the backlight device 12 is attached so as to cover a substantially box-shaped chassis 14 having an opening 14 b on the light emitting surface side (liquid crystal panel 11 side), and the opening 14 b of the chassis 14. Diffusion plate 15a, a plurality of optical sheets 15b arranged between the diffusion plate 15a and the liquid crystal panel 11, and a long side edge of the diffusion plate 15a arranged along the long side of the chassis 14 with the chassis 14 And a frame 16 that is held between them.

Further, in the chassis 14, a cold cathode tube 17 (light source), a lamp clip 18 for attaching the cold cathode tube 17 to the chassis 14, and a relay for relaying electrical connection at each end of the cold cathode tube 17. A connector 19 and a holder 20 that collectively covers the end of the cold cathode tube 17 group and the relay connector 19 group are accommodated. In the backlight device 12, the diffusion plate 15 a side than the cold cathode tube 17 is arranged on the light emitting side.

The chassis 14 is formed by sheet metal forming a plate-like conductive material (for example, a metal material) into a substantially box shape. Specifically, the chassis 14 includes a rectangular flat bottom plate 14a and an outer edge portion 21 that rises from each side and is folded back into a substantially U shape (a short side outer edge portion 21a in the short side direction and a long side in the long side direction). It has a substantially box shape composed of the outer edge portion 21b).

In the bottom plate 14a of the chassis 14, a plurality of attachment holes 22 for attaching the relay connector 19 are formed through both ends of the long side direction. Furthermore, a fixing hole (not shown) is formed through the upper surface of the long-side outer edge portion 21b of the chassis 14 so that the bezel 13, the frame 16, the chassis 14 and the like can be integrated with, for example, screws. It is said that.

As shown in FIGS. 2 and 8, a light reflecting sheet 23 is disposed on the inner surface side of the bottom plate 14a of the chassis 14 (the surface side facing the cold cathode tube 17). The light reflecting sheet 23 is made of synthetic resin, and the surface thereof is white with excellent reflectivity, and is laid so as to cover almost the entire area along the inner surface of the bottom plate 14a of the chassis 14 (FIG. In 3, the light reflecting sheet is not shown). With this light reflecting sheet 23, it is possible to reflect the light emitted from the cold cathode tube 17 toward the diffusion plate 15a.

On the other hand, a diffusion plate 15a and an optical sheet 15b are disposed on the opening 14b side of the chassis 14. The diffusion plate 15a is formed by dispersing and mixing light scattering particles in a plate member made of synthetic resin, and has a function of diffusing linear light emitted from the cold cathode tube 17 serving as a linear light source. As described above, the short side edge portion of the diffusion plate 15a is placed on the first surface 20a of the holder 20, and is not subjected to vertical restraining force. On the other hand, the long side edge of the diffusion plate 15 a is fixed by being sandwiched between the chassis 14 and the frame 16.

The optical sheet 15b disposed on the diffusion plate 15a is a laminate of a diffusion sheet, a lens sheet, and a reflective polarizing plate in order from the diffusion plate 15a side. The optical sheet 15b is emitted from the cold cathode tube 17 and passes through the diffusion plate 15a. It has a function of converting the light that has passed through into planar light. The liquid crystal panel 11 is installed on the upper surface side of the optical sheet 15 b, and the optical sheet 15 b is sandwiched between the diffusion plate 15 a and the liquid crystal panel 11.

The cold-cathode tube 17 has a long and narrow tubular shape, and a large number (20 in this embodiment) are parallel to each other in a state in which the length direction (axial direction) thereof coincides with the long side direction of the chassis 14. They are housed in the chassis 14 in a line-up state (see FIG. 2). Each end of the cold cathode tubes 17 is provided with a terminal (not shown) for receiving driving power, the end is fitted into the relay connector 19, and a holder 20 is attached so as to cover the relay connector 19. It has been.

The holder 20 that covers the end of the cold cathode tube 17 is made of a white synthetic resin and has an elongated, substantially box shape extending along the short side direction of the chassis 14. The holder 20 is arranged so as to partially overlap the short side outer edge portion 21a of the chassis 14, and constitutes the side wall of the backlight device 12 together with the short side outer edge portion 21a. As shown in FIG. 3, the insertion pin 24 protrudes from the surface of the holder 20 that faces the folded outer edge portion 21 a of the chassis 14, and the insertion pin 24 is formed on the upper surface of the short-side outer edge portion 21 a of the chassis 14. The holder 20 is attached to the chassis 14 by being inserted into the insertion hole 25.

As shown in FIG. 3, the stepped surface of the holder 20 consists of three surfaces parallel to the bottom plate 14a of the chassis 14, and the short side edge of the diffusion plate 15a is placed on the first surface 20a at the lowest position. Has been. Further, an inclined cover 26 that extends toward the bottom plate 14a of the chassis 14 extends from the first surface 20a. The short side edge portion of the liquid crystal panel 11 is placed on the second surface 20 b of the stepped surface of the holder 20. The third surface 20 c at the highest position among the stepped surfaces of the holder 20 is disposed at a position overlapping the short side outer edge portion 21 a of the chassis 14 and is in contact with the bezel 13.

As shown in FIGS. 2 and 4, an inverter board 30 and a control board 40 are attached to the outer surface side of the bottom plate 14a of the chassis 14 (on the opposite side to the cold cathode tube 17 and the back surface side). The above-described power supply board P (see FIG. 1, not shown in FIG. 4) is electrically connected to the inverter board 30, the control board 40, and the like, and serves as a power supply source that supplies power thereto.

As shown in FIG. 4, the inverter board 30 is provided at both ends in the long side direction of the chassis 14 and has a rectangular shape extending along the short side direction of the chassis 14. Each inverter board 30 is electrically connected to the cold cathode tube 17 via a connector 27 and a harness 28. Further, the inverter board 30 boosts the input voltage input from the power supply board P by an inverter circuit constituted by a transformer or the like, and outputs an output voltage higher than the input voltage to the cold cathode tube 17. 17 has a function of controlling turning on (or turning off).

As shown in FIG. 4, the control board 40 (circuit board) has a long rectangular shape in the long side direction (X-axis direction) of the chassis 14 in plan view. The control board 40 is arranged at a central portion in the long side direction of the chassis 14 and a position (upper side in FIG. 4) that is biased to one side in the short side direction of the chassis 14.

The control board 40 has a circuit component 41 mounted on a board made of synthetic resin (for example, made of paper phenol or glass epoxy resin), and receives various input signals such as TV signals from the tuner T as signals for driving the liquid crystal. And the function of supplying the converted liquid crystal driving signal to the liquid crystal panel 11.

As shown in FIGS. 2 and 5, a board cover 60 is attached to the bottom plate 14 a of the chassis 14 so as to cover the control board 40. A substrate cover 31 is attached to the bottom plate 14 a of the chassis 14 so as to cover each inverter substrate 30. 3 and 4 show a state in which the substrate covers 60 and 31 are removed. Such substrate covers 60 and 31 protect the

substrates

40 and 30, and have a function of preventing a hand from touching the substrate when the substrate becomes hot, for example, when the substrate is driven. ing.

Next, the configuration of the substrate cover 60 will be described with reference to FIGS. As shown in FIGS. 5 and 6, the substrate cover 60 has a rectangular shape that is long in the X-axis direction in plan view, and is formed by sheet metal forming a conductive material (for example, a metal material) having a plate shape. It is composed of that.

As shown in FIGS. 7 and 8, the substrate cover 60 has a substantially box shape opened toward the chassis 14, and has a main wall portion 61 disposed so as to sandwich the control substrate 40 with the chassis 14. And four side wall portions 62 rising from the peripheral ends of the four sides around the main wall portion 61 toward the chassis 14, and peripheral wall portions 63 (outer edge portions) extending from the end portions of the side wall portions 62. ing.

As shown in FIG. 6, the main wall portion 61 of the substrate cover 60 has a rectangular shape that is slightly larger than the control substrate 40, and is superimposed on the control substrate 40 in plan view. Further, in the substrate cover 60, the main wall portion 61 extends along the extending direction of the control board 40 and the bottom plate 14a of the chassis 14 as shown in FIG. Of the upper surface of the surface).

As shown in FIG. 8, the control board 40 and the board cover 60 are attached to the mounting base portion 50 formed on the bottom plate 14a of the chassis 14 via screws B1. The mounting base portion 50 is formed at a position corresponding to the four corners of the substrate cover 60 (and the control substrate 40) on the outer surface of the chassis 14 of the bottom plate 14a of the chassis 14.

As shown in FIGS. 6 and 8, each mounting pedestal portion 50 has a plan view shape, and is formed by protruding a part of the bottom plate 14a to the outer surface side of the chassis 14. The board cover 60 (and the control board 40) is arranged in a manner straddling a plurality (four pieces) of the mounting base parts 50.

In the main wall portion 61 of the substrate cover 60, attachment portions 64 are formed at locations corresponding to the respective attachment base portions 50. The attachment portion 64 is a portion attached to the chassis 14 via the screw B1, and as shown in FIG. 7, a part of the main wall portion 61 is punched out and bent to the attachment pedestal portion 50 side. Is formed. The attachment portion 64 is bent in a substantially L shape, and the tip portion 65 extends along the extending direction of the control board 40.

As shown in FIG. 8, an insertion hole 64 A through which the screw B 1 can be inserted is formed in the distal end portion 65 of the attachment portion 64. The control board 40 is formed with an insertion hole 40A through which the screw B1 can be inserted so as to overlap with the insertion hole 64A. Furthermore, the mounting base 50 of the chassis 14 is formed with a mounting hole 50A in which a screw is formed on the inner peripheral surface thereof.

The screw B1 is inserted into both the insertion hole 64A of the substrate cover 60 and the insertion hole 40A of the control board 40 from the front side (upper side in FIG. 8), and then the tip of the screw B1 is screwed into the mounting hole 50A. As a result, the control board 40 and the board cover 60 are attached to the chassis 14.

In addition, the attachment structure with respect to the chassis 14 of the board | substrate cover 31 and the inverter board | substrate 30 becomes a structure attached to the attachment base part 50 via screw B1, similarly to the attachment structure with respect to the chassis 14 of the board | substrate cover 60 and the control board 40. .

As shown in FIG. 6, the peripheral wall portion 63 of the substrate cover 60 has a rectangular frame shape that is long in the X-axis direction in plan view, and specifically, in the short side direction (Y-axis direction) of the substrate cover 60. Both side wall portions 63A (end portions on both sides in one side direction) and both side wall portions 63B (end portions on both sides in the other side direction) in the long side direction (X-axis direction) of the substrate cover 60 are provided. . As shown in FIG. 8, the peripheral wall portion 63 is arranged in an opposing manner so as to be parallel to the bottom plate 14 a of the chassis 14. A conductive member 80 is interposed between the bottom plate 14 a of the chassis 14 and the peripheral wall portion 63.

The conductive member 80 is configured, for example, by covering a surface of a core material having elasticity such as urethane foam with a conductive cloth, and has elasticity as a whole. Such a conductive member 80 is generally called a conductive gasket. In addition, as a conductive cloth, what woven the metal fine wire, what gave the metal plating to the surface of the woven cloth, etc. can be illustrated.

The conductive member 80 has a rectangular frame shape that overlaps with the peripheral wall portion 63 (both wall portions 63A and both wall portions 63B) of the substrate cover 60 in plan view, and the peripheral wall portion 63 (the substrate cover 60 of the substrate cover 60). It is arranged over the entire circumference at the peripheral edge (see FIGS. 7 to 9). The conductive member 80 may have a rectangular frame shape as an integral part, or may constitute a rectangular frame shape as a whole by combining four longitudinal members.

As shown in FIGS. 8 and 9, the conductive member 80 is in contact with both the bottom plate 14 a of the chassis 14 and the peripheral wall 63 of the substrate cover 60, and the chassis 14 and the substrate are interposed via the conductive member 80. The cover 60 is electrically connected. The conductive member 80 is in contact with substantially the entire surface of the peripheral wall portion 63 of the substrate cover 60.

The conductive member 80 has a thickness (length in the Z-axis direction) in a natural state (not shown) that is substantially constant over the entire surface. The thickness of the conductive member 80 is equal to that of the bottom plate 14a of the chassis 14 and the board cover 60. It is set to be larger than the facing distance Z1 (see FIG. 9) with the peripheral wall 63. For this reason, the electroconductive member 80 is arrange | positioned in the state compressed by the Z direction between the baseplate 14a and the surrounding wall part 63. FIG. Thereby, the electroconductive member 80 is closely_contact | adhered with respect to the baseplate 14a and the surrounding wall part 63, respectively. In other words, the conductive member 80 is disposed so as to close the gap between the peripheral wall portion 63 of the substrate cover 60 and the bottom plate 14 a of the chassis 14. The conductive member 80 may be bonded to both the peripheral wall portion 63 and the bottom plate 14a via, for example, a conductive tape, and in this way, the positional deviation in the X-axis direction and the Y-axis direction can be prevented. It can suppress more reliably.

In addition, after the conductive member 80 is installed on the bottom plate 14a in a natural state (uncompressed state), the substrate cover 60 is attached to the chassis 14 with the screws B1, so that the conductive plate 80 is interposed between the bottom plate 14a and the peripheral wall portion 63. It is configured to be compressed in the Z-axis direction. That is, the conductive member 80 is compressed by the fastening force of the screw B 1 with respect to the chassis 14.

As shown in FIGS. 8 and 9, in the peripheral wall 63 of the substrate cover 60, a protrusion 70 that protrudes toward the chassis 14 is formed on a part of the contact surface 63 D that contacts the conductive member 80. Yes. As shown in FIG. 6, the protrusion 70 is formed on each wall 63 A and each wall 63 B in the peripheral wall 63 of the substrate cover 60.

As shown in FIG. 6, the protrusion 70 has a shape extending in one side direction (short side direction or long side direction) of the peripheral wall portion 63. As shown in FIG. 9, the protruding length of the protruding portion 70 (the length in the Z-axis direction) is configured to be smaller than the facing distance Z 1 between the bottom plate 14 a and the peripheral wall portion 63.

By forming the protrusion 70 on the contact surface 63 D with the conductive member 80, the conductive member 80 is more strongly compressed at the formation portion of the protrusion 70 than at the portion where the protrusion 70 is not formed. The As shown in FIG. 9, the central portion 80 A of the conductive member 80 is pressed by the protrusion 70, and the amount of compression is larger than that of the end portion 80 B of the conductive member 80. As a result, the substrate cover 60 and the conductive member 80 are more closely adhered to each other at the location where the protrusion 70 is formed.

Further, as shown in FIG. 8, the protrusion 70 has, for example, a semicircular shape in a cross-sectional view. Thereby, in the protrusion 70, the contact surface with the electroconductive member 80 becomes a curved surface shape, and when the protrusion 70 and the electroconductive member 80 contact, the situation where the electroconductive member 80 is damaged can be suppressed.

Further, the protrusion 70 is formed at a central location in the long side direction of the wall 63A (or the wall 63B). For example, the protrusions 70 (denoted by reference numeral 70A in the following description) formed on the wall portions 63A on both sides in the short side direction of the peripheral wall portion 63 are centered in the long side direction (X-axis direction) of the wall portion 63A. It is formed at the side location.

More specifically, the protrusion 70 (for example, the lower protrusion 70A in FIG. 6) has two attachment portions 64 (a pair of attachment portions, for example, the lower attachment portion 64D in FIG. 6) adjacent thereto. , 64E). The protrusion 70A is arranged between the

attachment portions

64D and 64E in the arrangement direction (X-axis direction) of the pair of

attachment portions

64D and 64E. Here, “the protrusion 70A is disposed between the

attachment portions

64D and 64E” means that at least a part (or all) of the protrusion 70A is disposed between the

attachment portions

64D and 64E. Say that you are.

In addition, about the formation location of the protrusion 70B formed in the wall part 63B of the both sides of the long side direction in the surrounding wall part 63, it is the same as that of the protrusion 70A. That is, the protrusion 70B is arranged in a form extending in the Y-axis direction between two attachment parts 64 adjacent to the protrusion 70B (for example, the

left attachment parts

64F and 64E in FIG. 6).

As described above, the backlight device 12 of this embodiment includes the cold cathode tube 17, the chassis 14 that is formed of a conductive material and accommodates the cold cathode tube 17, and the control board 40 that is attached to the chassis 14. And a board cover 60 that is formed of a conductive material, is attached to the chassis 14 and is disposed so as to cover the control board 40, and is interposed between the chassis 14 and the board cover 60. 60, respectively, and at least a part of a contact surface 63D in contact with the conductive member 80 protrudes toward the chassis 14 in the board cover 60. A protrusion 70 is formed.

In the present embodiment, the substrate cover 60 and the chassis 14 are formed of a conductive material, and the conductive member 80 is in contact with both the substrate cover 60 and the chassis 14. Thereby, the substrate cover 60 and the chassis 14 are electrically connected via the conductive member 80. With such a configuration, even when electromagnetic waves are generated from the control board 40 when the control board 40 is driven, the electromagnetic waves can be effectively blocked by the board cover 60 and the chassis 14. The situation where electromagnetic waves are radiated to the outside can be suppressed.

In addition, the conductive member 80 is in elastic contact with both the substrate cover 60 and the chassis 14 and is configured to ensure contact more reliably. By the way, when the conductive member 80 is in elastic contact with both the substrate cover 60 and the chassis 14, that is, when compressed between the bottom plate 14 a of the chassis 14 and the peripheral wall portion 63 of the substrate cover 60, the conductive member 80 is conductive. Due to the repulsive force of the member 80, either the bottom plate 14 a or the peripheral wall portion 63 (or both) may be bent in a direction away from the conductive member 80.

As described above, when the bottom plate 14a (or the peripheral wall portion 63) is bent, the contact pressure with the conductive member 80 is reduced, so that the contact with the conductive member 80 may be insufficient. In FIG. 9, the bottom plate 14 a (chassis 14) bent in a direction away from the conductive member 80 is schematically illustrated by a two-dot chain line D 1 and bent in a direction away from the conductive member 80. The peripheral wall portion 63 (substrate cover 60) in a bent state is schematically shown by a two-dot chain line D2. Further, the bending of the bottom plate 14a and the peripheral wall portion 63 indicated by two-dot chain lines D1 and D2 is schematic, and the amount of bending, the shape of the bending, and the like are indicated by two-dot chain lines D1 and D2 in FIG. It is not limited to.

In this regard, in the present embodiment, a protrusion 70 protruding toward the chassis 14 is formed on the contact surface 63D of the substrate cover 60 with the conductive member 80. By doing in this way, the electroconductive member 80 can be compressed more strongly compared with the structure in which the protrusion 70 is not formed. That is, the contact pressure between the conductive member 80 and the chassis 14 (or the substrate cover 60) can be further increased. Thereby, even if the chassis 14 (or the substrate cover 60) is bent in a direction away from the conductive member 80, the contact pressure with the conductive member 80 can be ensured, and the conductive member 80 can be secured. Thus, the electrical contact between the chassis 14 and the board cover 60 can be ensured. Thereby, electromagnetic waves can be more reliably shielded by the substrate cover 60 and the chassis 14, and electromagnetic shielding performance can be further enhanced. Further, by forming the protrusion 70 on the substrate cover 60, the rigidity of the substrate cover 60 can be increased, and the bending of the substrate cover 60 itself can be suppressed.

Further, the board cover 60 has a pair of attachment portions 64 (for example,

attachment portions

64D and 64E) attached to the chassis 14, respectively, and the projecting portion 70A is an arrangement direction of the pair of

attachment portions

64D and 64E ( (In the X-axis direction), it is disposed between the pair of

attachment portions

64D and 64E.

The above-described deflection of the chassis 14 (or the substrate cover 60) is likely to increase as the distance from the attachment location (attachment portion 64) between the substrate cover 60 and the chassis 14 increases. That is, as in the present embodiment, for example, in a configuration in which the

attachment portions

64D and 64E are attached to the chassis 14, a portion corresponding between the pair of

attachment portions

64D and 64E is a portion that is relatively easily bent. For this reason, in this embodiment, it was set as the structure which distribute | arranges 70 A of protrusions between a pair of

attachment part

64D, 64E in the sequence direction of a pair of

attachment part

64D, 64E. Thereby, in the chassis 14 (or board cover 60), the contact pressure between the chassis 14 (and the board cover 60) and the conductive member 80 can be ensured at a location where the deflection is likely to increase.

In other words, in the present embodiment, in the configuration in which the conductive member 80 is arranged in a compressed state between the chassis 14 and the substrate cover 60, the protrusions 70 are formed at locations where bending is particularly likely to occur. With such a configuration, compared to a configuration in which the protrusion 70 is provided over the entire length of the peripheral wall portion 63 of the substrate cover 60, the cost for forming the protrusion 70 can be reduced.

The substrate cover 60 has a square shape in plan view, and the conductive member 80 has both wall portions 63A (both ends in one side direction) in the short side direction (Y-axis direction) of the substrate cover 60 in plan view. The board cover 60 is arranged so as to overlap with both wall parts 63B (both ends in the other side direction) in the long side direction (X-axis direction), and the protrusions 70 are both wall parts of the board cover 60. 63A and both wall parts 63B are formed respectively.

In this embodiment, the substrate cover 60 has a square shape in plan view, and the conductive member 80 is arranged on the four sides (both

wall portions

63A and 63B) of the substrate cover 60. Projections 70 are formed on both wall portions 63A and both wall portions 63B of the substrate cover 60, respectively. Thereby, the contact pressure between the conductive member 80 and the chassis 14 (and the substrate cover 60) can be made more uniform over the entire circumference of the peripheral wall portion 63 of the substrate cover 60, and the conductive member 80 and the chassis can be made uniform. 14 (and substrate cover 60) can be brought into contact with each other more reliably.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 112 of this embodiment, the shape of the protrusion 170 in the substrate cover 160 is different from that of the above embodiment.

As shown in FIG. 10, the protrusion 170 according to the present embodiment has a shape in which the protruding height increases toward the center in the extending direction (X-axis direction in FIG. 10). The protrusion 170A extending in the long side direction of the substrate cover 160 will be illustrated and described in detail. As shown in FIG. 10, the protrusion 170A has a protrusion height at the top portion P1 extending in the extending direction (X-axis direction). The projecting height at both ends P2 is greater than the projecting height at the apex P1. Further, the apex P1 of the protrusion 170A coincides with the intermediate position between the two

attachment portions

64D and 64E adjacent to the protrusion 170A in the X-axis direction.

That is, the protrusion 170A has a mounting portion 64 (in the region from the end portion P2 to the top portion P1.
As the distance from the mounting position of the substrate cover 160 to the chassis 14 (for example, indicated by reference numeral 64D) increases, the protruding height increases. Further, the protrusion 170B extending in the short side direction of the substrate cover 160 has a shape in which the protrusion height increases as the distance from the attachment part 64 increases.

As described above, when the conductive member 80 is compressed, the deflection of the chassis 14 (or the substrate cover 60) due to the reaction force of the conductive member 80 is caused by the attachment location (attachment portion) between the substrate cover 60 and the chassis 14. 64), the larger the distance, the larger the distance. In FIG. 10, the middle position between the two

attachment portions

64D and 64E is the place where bending is most likely. For this reason, in the present embodiment, the protruding portion 170 has a shape in which the protruding height increases as it moves away from the mounting portion 64, and the protruding height increases at the intermediate position between the two mounting

portions

64D and 64E. It was. Thereby, the chassis 14 (and the board cover 160) and the conductive member 80 can be more reliably brought into contact with each other at a location far from the mounting portion 64 and where the deflection tends to increase.

<Embodiment 3>
Next, a third embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 212 of this embodiment, the configuration of the protrusion 270 in the substrate cover 260 is different from that of the above embodiment.

As shown in FIG. 11, the protrusion 270 includes a wall portion constituting the peripheral wall portion 63 of the substrate cover 260, that is, wall portions 63 A (both end portions in the short side direction of the substrate cover) on both sides in the short side direction and a long length. It is formed in the wall part 63B (both ends in the long side direction of the substrate cover) on both sides in the side direction. In the longitudinal direction of each wall 63A (or 63B), a plurality of protrusions 270A (or 270B) having a substantially hemispherical shape are arranged.

The wall 63A and the protrusions 270A arranged on the lower side in FIG. 11 will be described in more detail as an example. The plurality of protrusions 270A are arranged in the direction in which the pair of

attachment parts

64D and 64E adjacent to them are arranged. A plurality (four in this embodiment) are arranged along the (X-axis direction). The plurality of protrusions 270A are disposed between the

attachment portions

64D and 64E (illustrated in the region X1) in the X-axis direction.

Thus, by providing the plurality of protrusions 270A, the conductive member 80 can be more strongly compressed at the locations where the protrusions 270A are formed, and contact with the substrate cover 260 and the chassis 14 is ensured. Can do. In addition, the protrusions 270A are arranged at equal intervals in the X-axis direction, and the conductive member 80 can be compressed with a uniform force in the X-axis direction.

The plurality of protrusions 270B formed on the wall 63B have the same configuration as that of the protrusions 270A. That is, each protrusion 270B is arranged in a region between a pair of attachment portions 64 (for example,

attachment portions

64E and 64F shown in FIG. 11) adjacent to these. In addition, the shape, the number of formation, and the arrangement interval of the protrusions 270 can be changed as appropriate.

In the present embodiment, a plurality of protrusions 270 are arranged along the arrangement direction of the pair of attachment parts 64. With such a configuration, the contact of the conductive member 80 acting on the chassis 14 (and the substrate cover 260) can be adjusted by adjusting the number and location of the protrusions 270 in the arrangement direction of the pair of attachment portions 64. The magnitude of the pressure can be easily changed.

In the present embodiment, the plurality of protrusions 270A are arranged in the region X1 that is between the attachment portions 64 (64D, 64E) in one direction (X-axis direction). A location corresponding to a position between the pair of attachment portions 64 (particularly an intermediate position between the pair of attachment portions 64) is a location where the bottom plate 14a of the chassis 14 and the peripheral wall portion 63 of the substrate cover 260 are relatively easily bent. For this reason, in this embodiment, it was set as the structure which forms several protrusion 270A in the area | region (area | region X1) between a pair of attachment parts 64. FIG. Thereby, even if it is a case where the location corresponding to the area | region between a pair of attachment parts 64 bends in the baseplate 14a (or peripheral edge part 63), a contact with the electroconductive member 80 is ensured. be able to.

In addition, you may provide the formation location of the some protrusion 270 in locations other than between a pair of attachment parts 64. FIG. However, if the number of locations where the protrusions 270 are formed increases, the number of locations where the conductive member 80 is compressed also increases. In this embodiment, when attaching the board | substrate cover 260 to the chassis 14, it has the structure which compresses the electroconductive member 80 by fastening screw B1. That is, the screw B 1 is fastened to the chassis 14 against the repulsive force of the conductive member 80. For this reason, by increasing the number of locations where the protrusions 270 are formed, when the number of locations compressed in the conductive member 80 (and thus the amount of compression) increases, the repulsive force when fastening the screw B1 increases accordingly. There is concern about the decline in workability.

For this reason, in the present embodiment, the protruding portion is provided only between the pair of mounting portions 64 (for example, the region X1) that are relatively easy to bend in the peripheral wall portion 63 of the substrate cover 260 (or the bottom plate 14a of the chassis 14). 270 was formed. Thereby, the formation location of the protrusion part 270 is decreased, and it suppresses that the compression amount in the electroconductive member 80 becomes large more than necessary. Thereby, the situation where the workability | operativity regarding the assembly | attachment of the board | substrate cover 260 falls is suppressed.

Further, in the present embodiment, by providing a plurality of protrusions 270, each protrusion 270 itself can be easily reduced. With such a configuration, for example, when the plate width of the peripheral wall portion 63 (wall portion 63A or wall portion 63B) is small, the protrusion 270 can be easily formed, which is preferable.

<Embodiment 4>
Next, a fourth embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. As shown in FIGS. 13 and 14, in the backlight device 312 of this embodiment, the configuration of the protrusions on the substrate cover is different from that of the above embodiment.

As shown in FIGS. 13 and 14, the protrusion 370 in the present embodiment performs knurling on the contact surface 63 D with the conductive member 80 in the peripheral wall 63 (walls 63 A and 63 B) of the substrate cover 360. A plurality are formed. Specifically, the knurling process is performed by cutting the contact surface 63D with a predetermined knurling tool to form a large number of groove-shaped recesses. At this time, the portions surrounded by the recesses are formed as minute protrusions 370 by crossing the recesses to form a lattice pattern.

In addition, in the contact surface 63D, a portion to be knurled (a portion where the protrusion 370 is formed) protrudes in advance to the bottom plate 14a side of the chassis 14 from other portions. Thereby, in the surrounding wall part 63, the protrusion end of each protrusion 370 protrudes to the bottom plate 14a side compared with the location in which the protrusion 370 is not formed. For this reason, the compression amount of the conductive member 80 is larger at the location where the plurality of protrusions 370 are formed (center portion 81) than at the other location (end portion 82).

And the protrusion part 370 is formed in the center side in the extending direction (long side direction) of wall part 63A (or wall part 63B). More specifically, the protrusion 370 is formed in a region between the two attachment portions 64 adjacent to the protrusion 370 (a relatively flexible portion, for example, a region X2 shown in FIG. 13).

Further, the protruding height of each protrusion 370 from the bottom plate 14a is preferably 0.3 to 1 mm, for example, and the interval between the protrusions 370 is preferably 0.3 to 2 mm, for example. In addition, the height of each protrusion 370 and the space | interval of each protrusion 370 are not limited to these values.

As in the present embodiment, by forming the protrusions 370 by knurling, a plurality of protrusions 370 can be easily formed. Moreover, if it is a knurling process, it is possible to form many minute protrusions. When a plurality of minute protrusions 370 come into contact with the conductive member 80, a high frictional force can be obtained between the conductive members 80. Thereby, in the extending direction (X-axis direction and Y-axis direction) of the bottom plate 14a, a situation in which the position of the conductive member 80 is displaced can be more reliably suppressed.

<Embodiment 5>
A fifth embodiment of the present invention will be described with reference to FIGS. First, the configuration of the television receiver TV including the liquid crystal display device 5010 will be described. 15 is an exploded perspective view showing a schematic configuration of the television receiver of the present embodiment, FIG. 16 is an exploded perspective view showing a schematic configuration of a liquid crystal display device included in the television receiver of FIG. 14, and FIG. 17 is a liquid crystal display of FIG. It is sectional drawing which shows the cross-sectional structure along the long side direction of an apparatus. Note that the long side direction of the liquid crystal display device 5010 (and the chassis 5014) is the X-axis direction, and the short side direction is the Y-axis direction. Also, the vertical direction in FIG. 17 is the Z-axis direction (front and back direction), the upper direction in FIG. 17 is the front side, and the lower direction is the back side.

As shown in FIG. 15, the television receiver TV according to this embodiment includes a liquid crystal display device 5010, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 5010, a power supply substrate P, a tuner T, and the like. And a stand S. The liquid crystal display device 5010 (display device) has a horizontally long rectangular shape as a whole, and is accommodated in a vertically placed state (a state in which the short side direction is arranged along the vertical direction). As shown in FIG. 16, this liquid crystal display device 5010 includes a liquid crystal panel 5011 (display panel) and a backlight device 5012 (illumination device) that is an external light source, and these are integrated by a frame-like bezel 5013 or the like. Is supposed to be retained.

Next, the liquid crystal panel 5011 and the backlight device 5012 constituting the liquid crystal display device 5010 will be described. A liquid crystal panel 5011 performs display using light from the backlight device 5012. A pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is supposed to be configured. One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. The substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film. Note that

polarizing plates

5011a and 5011b are attached to the outside of both substrates (see FIG. 17).

As shown in FIG. 16, the backlight device 5012 is attached so as to cover a chassis 5014 having a substantially box shape having an opening 5014b on the light emitting surface side (liquid crystal panel 5011 side), and the opening 5014b of the chassis 5014. Diffusion plate 5015a, a plurality of optical sheets 5015b arranged between the diffusion plate 5015a and the liquid crystal panel 5011, and the long side edge of the diffusion plate 5015a arranged along the long side of the chassis 5014 with the chassis 5014. And a frame 5016 that is held between them.

Further, in the chassis 5014, a cold cathode tube 5017 (light source), a lamp clip 5018 for attaching the cold cathode tube 5017 to the chassis 5014, and a relay for relaying electrical connection at each end of the cold cathode tube 5017. A connector 5019 and a holder 5020 that collectively covers the end of the cold cathode fluorescent lamp 5017 group and the relay connector 5019 group are accommodated. In the backlight device 5012, the diffusion plate 5015a side is arranged on the light emitting side from the cold cathode tube 5017.

The chassis 5014 is formed by sheet metal forming a plate-like conductive material (for example, a metal material) into a substantially box shape. Specifically, the chassis 5014 includes a rectangular flat plate-shaped bottom plate 5014a and outer edge portions 5021 (short side outer edge portions 5021a in the short side direction and long sides in the long side direction) that are raised from the respective sides and folded back in a substantially U shape. It has a substantially box shape composed of an outer edge portion 5021b).

In the bottom plate 5014a of the chassis 5014, a plurality of attachment holes 5022 for attaching the relay connector 5019 are formed through both ends of the long side direction. Further, a fixing hole (not shown) is formed through the upper surface of the long side outer edge portion 5021b of the chassis 5014 so that the bezel 5013, the frame 5016, the chassis 5014, and the like can be integrated with, for example, screws. It is said that.

As shown in FIGS. 16 and 22, a light reflecting sheet 5023 is disposed on the inner surface side (the surface side facing the cold cathode tube 5017) of the bottom plate 5014 a of the chassis 5014. The light reflecting sheet 5023 is made of a synthetic resin, and the surface thereof is white with excellent reflectivity. The light reflecting sheet 5023 is laid along the inner surface of the bottom plate 5014a of the chassis 5014 so as to cover almost the entire region (see FIG. In FIG. 17, the light reflecting sheet is not shown). The light reflecting sheet 5023 can reflect the light emitted from the cold cathode fluorescent lamp 5017 toward the diffusion plate 5015a.

On the other hand, a diffusion plate 5015a and an optical sheet 5015b are disposed on the opening 5014b side of the chassis 5014. The diffusion plate 5015a is formed by dispersing and mixing light scattering particles in a synthetic resin plate-like member, and has a function of diffusing linear light emitted from the cold cathode tube 5017 serving as a linear light source. As described above, the short side edge portion of the diffusion plate 5015a is placed on the first surface 5020a of the holder 5020 and is not subjected to vertical restraining force. On the other hand, the long side edge of the diffusion plate 5015 a is fixed by being sandwiched between the chassis 5014 and the frame 5016.

An optical sheet 5015b disposed on the diffusion plate 5015a is a laminate of a diffusion sheet, a lens sheet, and a reflective polarizing plate in order from the diffusion plate 5015a side. The optical sheet 5015b is emitted from the cold cathode tube 5017 and passes through the diffusion plate 5015a. It has a function of converting the light that has passed through into planar light. A liquid crystal panel 5011 is installed on the upper surface side of the optical sheet 5015b, and the optical sheet 5015b is sandwiched between the diffusion plate 5015a and the liquid crystal panel 5011.

The cold-cathode tube 5017 has a long and narrow tubular shape, and its length direction (axial direction) is aligned with the long side direction of the chassis 5014, and a large number (20 in this embodiment) are parallel to each other. They are housed in the chassis 5014 in a line-up state (see FIG. 16). Each end of these cold cathode tubes 5017 is provided with a terminal (not shown) for receiving driving power, the end is fitted into the relay connector 5019, and a holder 5020 is attached so as to cover the relay connector 5019. It has been.

The holder 5020 that covers the end of the cold cathode fluorescent lamp 5017 is made of a synthetic resin that exhibits white color, and has a long and narrow box shape that extends along the short side direction of the chassis 5014. The holder 5020 is disposed so as to partially overlap with the short side outer edge portion 5021a of the chassis 5014, and constitutes a side wall of the backlight device 5012 together with the short side outer edge portion 5021a. As shown in FIG. 17, an insertion pin 5024 protrudes from a surface of the holder 5020 facing the folded outer edge portion 5021 a of the chassis 5014, and the insertion pin 5024 is formed on the upper surface of the short side outer edge portion 5021 a of the chassis 5014. The holder 5020 is attached to the chassis 5014 by being inserted into the insertion hole 5025.

As shown in FIG. 17, the stepped surface of the holder 5020 is composed of three surfaces parallel to the bottom plate 5014a of the chassis 5014, and the short side edge portion of the diffusion plate 5015a is placed on the lowest first surface 5020a. Has been. Further, an inclined cover 5026 that is inclined toward the bottom plate 5014a of the chassis 5014 extends from the first surface 5020a. A short side edge portion of the liquid crystal panel 5011 is placed on the second surface 5020 b of the stepped surface of the holder 5020. The third surface 5020c at the highest position among the stepped surfaces of the holder 5020 is arranged at a position overlapping the short side outer edge portion 5021a of the chassis 5014 and is in contact with the bezel 5013.

As shown in FIGS. 17 and 18, an inverter board 5030 and a control board 5040 are attached to the outer surface side of the bottom plate 5014a of the chassis 5014 (on the opposite side to the cold cathode tube 5017, the back surface side). Note that the above-described power supply board P (see FIG. 15, not shown in FIG. 18) is electrically connected to the inverter board 5030, the control board 5040, and the like, and serves as a power supply source for supplying power thereto.

As shown in FIG. 18, the inverter board 5030 is provided at both ends in the long side direction of the chassis 5014, and has a rectangular shape extending along the short side direction of the chassis 5014. Each inverter board 5030 is electrically connected to the cold cathode tube 5017 through a connector 5027 and a harness 5028. The inverter board 5030 boosts the input voltage input from the power supply board P by an inverter circuit configured by a transformer or the like, and outputs an output voltage higher than the input voltage to the cold cathode tube 5017. 5017 has a function of controlling turning on (or turning off).

As shown in FIG. 18, the control board 5040 (circuit board) has a long rectangular shape in the long side direction (X-axis direction) of the chassis 5014 in plan view. The control board 5040 is arranged at a center portion in the long side direction of the chassis 5014 and a position (upper side in FIG. 18) that is biased to one side in the short side direction of the chassis 5014.

The control board 5040 is configured by mounting circuit components 5041 on a synthetic resin board (for example, made of paper phenol or glass epoxy resin), and receives various input signals such as TV signals from the tuner T. The liquid crystal driving signal is converted into a signal for driving liquid crystal, and the converted liquid crystal driving signal is supplied to the liquid crystal panel 5011.

As shown in FIG. 19, a substrate cover 5060 is attached to the bottom plate 5014a of the chassis 5014 so as to cover the control substrate 5040. A substrate cover 5031 is attached to the bottom plate 5014a of the chassis 5014 so as to cover each inverter substrate 5030. 17 and 18 show a state where the substrate covers 5060 and 5031 are removed. Such a

substrate cover

5060, 5031 protects the

respective substrates

5040, 5030, and has a function of preventing a hand from touching the substrate when the substrate becomes hot, for example, when the substrate is driven. ing.

Next, the configuration of the substrate cover 5060 will be described with reference to FIGS. As shown in FIGS. 19 and 20, the substrate cover 5060 has a rectangular shape (long shape) that is long in the X-axis direction in plan view, and plate-shaped conductive material (for example, metal material) is formed by sheet metal. It is composed of that.

As shown in FIGS. 21 and 22, the substrate cover 5060 has a substantially box shape opened toward the chassis 5014, and a main wall portion 5061 disposed so as to sandwich the control substrate 5040 with the chassis 5014. And four side wall portions 5062 that rise from the peripheral edges of the four sides around the main wall portion 5061 toward the chassis 5014, and peripheral wall portions 5063 (outer edge portions) that extend from the end portions of the respective side wall portions 5062. ing.

As shown in FIG. 20, the main wall portion 5061 of the substrate cover 5060 has a square shape that is slightly larger than the control substrate 5040, and is superimposed on the control substrate 5040 in plan view. Further, as shown in FIG. 22, the main wall portion 5061 of the board cover 5060 extends along the extending direction of the control board 5040 and the bottom plate 5014a of the chassis 5014, and the mounting surface (see FIG. 22) of the control board 5040. It is arranged to face the upper surface).

As shown in FIG. 21, the control board 5040 and the board cover 5060 are attached to a mounting base part 5050 formed on the bottom plate 5014a of the chassis 5014 via screws B1. As shown in FIG. 20, the mounting base portion 5050 is formed at a position corresponding to the four corners of the main wall portion 5061 (and the control board 5040) on the outer surface of the chassis 5014 on the bottom plate 5014 a of the chassis 5014.

As shown in FIGS. 20 and 22, each mounting base portion 5050 has a plan view shape, and is formed by protruding a part of the bottom plate 5014 a to the outer surface side of the chassis 5014. The substrate cover 5060 (and the control substrate 5040) is arranged so as to straddle each mounting base portion 5050.

In the main wall portion 5061 of the substrate cover 5060, attachment portions 5064 are formed at locations corresponding to the attachment base portions 5050, respectively. The attachment portion 5064 is a portion attached to the chassis 5014 via the screw B1, and as shown in FIG. 21, a part of the main wall portion 5061 is punched out and bent to the attachment base portion 5050 side. Is formed. The attachment portion 5064 is bent in a substantially L shape, and the tip portion 5065 extends along the extending direction of the control board 5040.

As shown in FIG. 22, an insertion hole 5064 A through which the screw B 1 can be inserted is formed through the distal end portion 5065 of the attachment portion 5064. Further, an insertion hole 5040A through which the screw B1 can be inserted is formed in the control board 5040 so as to overlap with the insertion hole 5064A. Further, the mounting base 5050 of the chassis 5014 has a mounting hole 5050A in which a screw is formed on the inner peripheral surface thereof.

The screw B1 is inserted into both the insertion hole 5064A of the board cover 5060 and the insertion hole 5040A of the control board 5040 from the front side (upper side in FIG. 22), and then the tip of the screw B1 is screwed into the mounting hole 5050A. As a result, the control board 5040 and the board cover 5060 are attached to the chassis 5014.

Note that the mounting structure of the board cover 5031 and the inverter board 5030 to the chassis 5014 is configured to be attached to the mounting base 5050 via the screw B1 in the same manner as the mounting structure of the board cover 5060 and the control board 5040 to the chassis 5014. .

As shown in FIG. 20, the peripheral wall portion 5063 of the substrate cover 5060 has a rectangular frame shape that is long in the X-axis direction in plan view, and the wall portions 5063 A on both sides in the short side direction (Y-axis direction) of the substrate cover 5060. (Ends on both sides in one side direction) and wall portions 5063B (ends on both sides in the other side direction) on both sides in the long side direction (X-axis direction) of the substrate cover 5060. As shown in FIG. 22, the peripheral wall portion 5063 is arranged in an opposing manner so as to be parallel to the bottom plate 5014 a of the chassis 5014. A conductive member 5080 is interposed between the bottom plate 5014 a of the chassis 5014 and the peripheral wall portion 5063.

The conductive member 5080 is configured, for example, by covering a surface of an elastic core material such as urethane foam with a conductive cloth, and has elasticity as a whole. Such a conductive member 5080 is generally called a conductive gasket. In addition, as a conductive cloth, what woven the metal fine wire, what gave the metal plating to the surface of the woven cloth, etc. can be illustrated.

In the present embodiment, the four conductive members 5080 having a longitudinal shape are arranged in a rectangular frame shape, and are arranged so as to overlap with the peripheral wall portion 5063 of the substrate cover 5060 in a plan view. Specifically, as indicated by broken lines in FIG. 20, two conductive members 5080 (labeled with reference numeral 5080A) extending along the X axis overlap with the respective wall portions 5063A of the substrate cover 5060 in plan view. The two conductive members 5080 (denoted by reference numeral 5080B) extending along the Y-axis are arranged so as to overlap with the respective wall portions 5063B of the substrate cover 5060 in plan view. That is, the four conductive members 5080 are arranged over the entire circumference of the peripheral wall portion 5063 of the substrate cover 5060 (the peripheral end portion of the substrate cover 5060).

22 and 23, the conductive member 5080 is in contact with both the bottom plate 5014a of the chassis 5014 and the peripheral wall portion 5063 of the substrate cover 5060, and the chassis 5014 and the substrate are interposed via the conductive member 5080. The cover 5060 is electrically connected. The conductive member 5080 is in contact with almost the entire surface of the peripheral wall portion 5063 of the substrate cover 5060.

The conductive member 5080 has a thickness (length in the Z-axis direction) in a natural state (not shown) substantially constant over the entire surface, and the thickness of the conductive member 5080 is the same as that of the bottom plate 5014a of the chassis 5014 and the board cover 5060. It is set larger than the facing distance Z1 (see FIG. 22) with the peripheral wall portion 5063. Therefore, the conductive member 5080 is disposed in a state compressed in the Z-axis direction between the bottom plate 5014a and the peripheral wall portion 5063, and the conductive member 5080 is in close contact with the bottom plate 5014a and the peripheral wall portion 5063, respectively. Has been. In other words, the conductive member 5080 is disposed so as to close the gap between the peripheral wall portion 5063 of the substrate cover 5060 and the bottom plate 5014a of the chassis 5014. Note that the conductive member 5080 may be bonded to both the peripheral wall portion 5063 and the bottom plate 5014a via, for example, a conductive tape, and in this way, misalignment in the X-axis direction and the Y-axis direction can be achieved. It can suppress more reliably.

In addition, after the conductive member 5080 is installed on the bottom plate 5014a in a natural state (uncompressed state), the board cover 5060 is attached to the chassis 5014 with screws B1, so that the conductive plate 5080 is interposed between the bottom plate 5014a and the peripheral wall portion 5063. It is configured to be compressed in the Z direction. That is, the conductive member 5080 is compressed by the fastening force of the screw B1 with respect to the chassis 5014.

As shown in FIGS. 22 and 23, a protrusion 5070 that protrudes toward the substrate cover 5060 is formed on a part of the contact surface 5051A that contacts the conductive member 5080 on the bottom plate 5014a of the chassis 5014. . As shown in FIGS. 22 and 23, the protrusions 5070 are arranged so as to face the wall portions 5063A (both end portions in one side direction) and the wall portions 5063B (both end portions in the other side direction) of the substrate cover 5060, respectively. Has been. In the following description, reference numeral 5070A is assigned to the protrusion 5070 that faces the wall 5063A, and reference numeral 5070B is assigned to the protrusion 5070 that faces the wall 5063B.

As shown in FIG. 20, the protrusion 5070 has a shape extending along one side direction (short side direction or long side direction) of the peripheral wall portion 5063. As shown in FIG. 22, the protrusion length of the protrusion 5070 (the length in the Z-axis direction) is shorter than the facing distance Z1 between the bottom plate 5014a and the peripheral wall portion 5063.

By forming the protrusion 5070 on the contact surface 5051A of the bottom plate 5014a with the conductive member 5080, the conductive member 5080 is more formed at the portion where the protrusion 5070 is formed than at the portion where the protrusion 5070 is not formed. Strongly compressed. As shown in FIG. 23, for example, the central portion 5081 in the X-axis direction of the conductive member 5080A is pressed by the protrusion 5070, and the amount of compression is larger than the end portion 5082 in the X-axis direction of the conductive member 5080A. Is getting bigger. As a result, the substrate cover 5060 (or the bottom plate 5014a) and the conductive member 5080 are more reliably brought into close contact with each other at the location where the protrusion 5070 is formed.

Further, as shown in FIG. 22, the protrusion 5070 has, for example, a semicircular shape in a sectional view. Thereby, in the protrusion 5070, the contact surface with the electroconductive member 5080 becomes a curved surface shape, and when the protrusion 5070 and the electroconductive member 5080 contact, the situation which damages the electroconductive member 5080 can be suppressed.

Further, the protrusion 5070 is formed at a position closer to the center in the long side direction of the wall 5063A (or the wall 5063B) facing the protrusion 5070. For example, the protrusion 5070A is formed at a position closer to the center in the long side direction (X-axis direction) of the wall 5063A.

More specifically, the protrusion 5070 (for example, the lower protrusion 5070A in FIG. 20) has two attachment parts 5064 (a pair of attachment parts, for example, the lower attachment part 5064D in FIG. 20). , 5064E). The protrusion 5070A is arranged between the mounting

portions

5064D and 5064E in the arrangement direction (X-axis direction) of the pair of mounting

portions

5064D and 5064E. Here, “the projection 5070A is disposed between the mounting

portions

5064D and 5064E” means that at least a part (or all) of the projection 5070A is disposed between the mounting

portions

5064D and 5064E. Say that you are.

In addition, the formation part of the protrusion 5070B formed in the wall part 5063B on both sides in the long side direction in the peripheral wall part 5063 is the same as that of the protrusion 5070A. That is, the protrusion 5070B is arranged in the Y-axis direction so as to extend between two attachment parts 5064 adjacent to the protrusion 5070B (for example, the

left attachment parts

5064F and 5064E in FIG. 20).

As described above, the backlight device 5012 of the present embodiment includes the cold cathode tube 5017, the chassis 5014 formed of a conductive material and containing the cold cathode tube 5017, and the control board 5040 attached to the chassis 5014. A substrate cover 5060 formed of a conductive material and attached to the chassis 5014 and arranged to cover the control substrate 5040, and interposed between the chassis 5014 and the substrate cover 5060. The chassis 5014 and the substrate cover 5060, and conductive members 5080 that are elastically contacted with both of them. In the chassis 5014, at least a part of a contact surface 5051A that is in contact with the conductive members 5080 protrudes toward the substrate cover 5060. A protrusion 5070 is formed.

In this embodiment, the substrate cover 5060 and the chassis 5014 are formed of a conductive material, and the conductive member 5080 is in contact with both the substrate cover 5060 and the chassis 5014. Thereby, the substrate cover 5060 and the chassis 5014 are electrically connected via the conductive member 5080. With such a configuration, even when electromagnetic waves are generated from the control board 5040 when the control board 5040 is driven, the electromagnetic waves can be effectively blocked by the board cover 5060 and the chassis 5014. The situation where electromagnetic waves are radiated to the outside can be suppressed.

Further, the conductive member 5080 is elastically in contact with both the substrate cover 5060 and the chassis 5014 (bottom plate 5014a), and is configured to ensure contact more reliably. By the way, when the conductive member 5080 is elastically in contact with both the substrate cover 5060 and the bottom plate 5014a, that is, when the conductive member 5080 is compressed between the bottom plate 5014a and the substrate cover 5060, the conductive member 5080. Due to the repulsive force (restoring force), one (or both) of the bottom plate 5014a and the substrate cover 5060 may be bent in a direction away from the conductive member 5080. If the bottom plate 5014a (or the substrate cover 5060) bends in this manner, the contact pressure with the conductive member 5080 decreases, and as a result, the contact with the conductive member 5080 may be insufficient.

In FIG. 23, the bottom plate 5014a (chassis 5014) bent in a direction away from the conductive member 5080 is schematically illustrated by a two-dot chain line D1, and is bent in a direction away from the conductive member 5080. The peripheral wall portion 5063 (substrate cover 5060) in a bent state is schematically shown by a two-dot chain line D2. Further, the bending of the bottom plate 5014a and the peripheral wall portion 5063 indicated by the two-dot chain lines D1 and D2 is schematic, and the amount of bending and the shape of the bending are indicated by the two-dot chain lines D1 and D2 in FIG. It is not limited to.

In this embodiment, a protrusion 5070 that protrudes toward the substrate cover 5060 is formed on the contact surface 5051A of the chassis 5014 with the conductive member 5080. With such a configuration, the conductive member 5080 can be more strongly compressed as compared with a configuration in which the protrusion 5070 is not formed, and the conductive member 5080 and the chassis 5014 (or the substrate cover 5060) can be compressed. The contact pressure can be further increased. Accordingly, even if the chassis 5014 (or the substrate cover 5060) is bent in a direction away from the conductive member 5080, the contact pressure with the conductive member 5080 can be ensured, and the conductive member 5080 can be secured. Thus, the electrical connection between the chassis 5014 and the substrate cover 5060 can be ensured. Thereby, electromagnetic waves can be more reliably shielded by the substrate cover 5060 and the chassis 5014, and the electromagnetic shielding performance can be further enhanced. Further, by forming the protrusion 5070 on the bottom plate 5014a, the rigidity of the bottom plate 5014a can be increased, and the bending of the bottom plate 5014a itself can be suppressed.

In the above configuration, the substrate cover 5060 has a pair of attachment portions 5064 (for example,

attachment portions

5064D and 5064E) that are respectively attached to the chassis 5014, and the protrusions 5070 are arranged in the arrangement direction of the pair of attachment portions 5064. , Between the pair of mounting

portions

5064D and 5064E.

The above-described deflection of the chassis 5014 (or the substrate cover 5060) is likely to increase as the distance from the attachment location (attachment portion 5064) between the substrate cover 5060 and the chassis 5014 increases. That is, in the configuration in which the substrate cover 5060 and the chassis 5014 are attached via the pair of

attachment portions

5064D and 5064E as in the present embodiment, the corresponding portion between the pair of

attachment portions

5064D and 5064E is relatively bent. It becomes an easy place. For this reason, in the present embodiment, the protrusion 5070 is arranged between the pair of

attachment portions

5064D and 5064E in the arrangement direction of the pair of

attachment portions

5064D and 5064E (for example, the X-axis direction). Accordingly, in the chassis 5014 (or the substrate cover 5060), the contact between the chassis 5014 (and the substrate cover 5060) and the conductive member 5080 can be ensured at a place where the bending is likely to increase.

In other words, in the present embodiment, in the configuration in which the conductive member 5080 is arranged in a compressed state between the chassis 5014 and the substrate cover 5060, the protrusion 5070 is formed at a location where bending is particularly likely to occur. With such a configuration, compared to a configuration in which the protrusions 5070 are provided corresponding to the entire length of the peripheral wall portion 5063 of the substrate cover 5060, the number of formation portions of the protrusions 5070 can be reduced, and the formation of the protrusions 5070 can be reduced. The cost concerning can be reduced.

Further, the substrate cover 5060 has a square shape in plan view, and the conductive member 5080 has both wall portions 5063A (both ends in one side direction) on both sides in the short side direction (Y-axis direction) of the substrate cover 5060 in plan view. The board cover 5060 is disposed so as to overlap with both wall portions 5063B (both end portions in the other side direction) on both sides in the long side direction (X-axis direction), and the protrusion 5070 is provided on both sides of the board cover 5060. It is formed at a location facing the wall portion 5063A and a location facing the both wall portions 5063B.

In this embodiment, the substrate cover 5060 has a planar shape, and the conductive member 5080 is arranged on the four sides (both wall portions 5063A and both wall portions 5063B) of the substrate cover 5060. In the chassis 5014, the protrusions 5070 are formed at locations facing the both wall portions 5063A and both wall portions 5063B of the substrate cover 5060, respectively. Accordingly, the contact pressure between the conductive member 5080 and the chassis 5014 (and the substrate cover 5060) can be made uniform over the entire circumference of the peripheral wall portion 5063 of the substrate cover 5060, and the conductive member 5080 and the chassis 5014 can be made uniform. (And the substrate cover 5060) can be brought into contact with each other more reliably.

<Embodiment 6>
Next, Embodiment 6 of the present invention will be described with reference to FIG. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 5112 of this embodiment, the shape of the protrusion 5170 formed on the chassis 5014 is different from that of the above embodiment.

As shown in FIG. 24, the protrusion 5170 of the present embodiment has a shape in which the protrusion height increases toward the center in the extending direction (X-axis direction in FIG. 24). The protrusion 5170A extending in the long side direction of the substrate cover 5060 will be exemplified and described in detail. As shown in FIG. 24, the protrusion 5170A has a protrusion height at the top P1 extending in the extending direction (X-axis direction). The projecting height at both ends P2 is greater than the projecting height at the apex P1. Further, the top portion P1 of the protrusion 5170A coincides with, for example, an intermediate position between the two

attachment portions

5064D and 5064E adjacent to the protrusion 5170A in the X-axis direction.

That is, in the region between the end P2 and the top P1, the protrusion 5170A has a protrusion height that increases as it moves away from the attachment portion 5064 (where the board cover 5060 is attached to the chassis 5014, for example, indicated by reference numeral 5064D). It has a larger shape. Further, the protrusion 5170B extending in the short side direction of the substrate cover 5060 has a shape in which the protrusion height increases as the distance from the attachment part 5064 increases.

As described in the fifth embodiment, when the conductive member 5080 is compressed, the deflection of the chassis 5014 (or the substrate cover 5060) due to the reaction force (restoring force) of the conductive member 5080 is the same as that of the substrate cover 5060. The distance from the mounting location (mounting portion 5064) with the chassis 5014 tends to increase. In the present embodiment, for example, the intermediate position in the X-axis direction between the two

attachment portions

5064D and 5064E is the place where bending is most likely.

For this reason, in this embodiment, the protrusion 5170 has a shape in which the protrusion height increases as the distance from the attachment part 5064 increases, and the protrusion height is the highest at the intermediate position in the X-axis direction of the two

attachment parts

5064D and 5064E. The shape becomes larger. Accordingly, even if the chassis 5014 (or the substrate cover 5060) is bent at a location far from the mounting portion 5064 and is likely to be bent, the chassis 5014 (and the substrate cover 5060) and the conductive member 5080 (5080A) are bent. ) Can be more reliably brought into contact with each other.

<Embodiment 7>
Next, a seventh embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 5212 of this embodiment, the configuration of the protrusion 5270 formed on the chassis 5014 is different from that of the above embodiment.

As shown in FIGS. 25 and 26, a plurality of protrusions 5270 are formed on the bottom plate 5014a of the chassis 5014 at locations facing the peripheral wall portion 5063 of the substrate cover 5060. Specifically, the protrusion 5270 has a substantially hemispherical shape, and wall portions 5063A (both ends in the short side direction of the substrate cover) on both sides of the substrate cover 5060 and wall portions 5063B (both sides in the long side direction of the substrate cover). Are arranged along the longitudinal direction of the both ends of the. In the following description, reference numeral 5270A is assigned to the protrusion 5270 that faces the wall 5063A, and reference numeral 5270B is assigned to the protrusion 5270 that faces the wall 5063B.

The configuration of the protrusion 5270 will be described more specifically by taking the wall part 5063A and the protrusion 5270A arranged on the lower side in FIG. 25 as an example, and the plurality of protrusions 5270A are a pair of attachments adjacent thereto. A plurality (four in this embodiment) are arranged along the arrangement direction (X-axis direction) of the

portions

5064D and 5064E. The plurality of protrusions 5270A are arranged between the

attachment portions

5064D and 5064E (illustrated in the region X1) in the X-axis direction.

As described above, by providing the plurality of protrusions 5270A, the conductive member 5080 can be more strongly compressed at the positions where the protrusions 5270A are formed, and contact with the substrate cover 5060 and the chassis 5014 can be ensured. Can do. The protrusions 5270A are arranged at equal intervals in the X-axis direction, and the conductive member 5080 can be compressed with a uniform force in the X-axis direction.

The plurality of protrusions 5270B formed on the wall 5063B have the same configuration as that of the protrusions 5270A. That is, each protrusion 5270B is arranged in a region between a pair of attachment portions 5064 adjacent to them (for example,

attachment portions

5064E and 5064F shown in FIG. 25). In addition, the shape, the number of formation, and the arrangement interval of the protrusions 5270 can be changed as appropriate.

In the present embodiment, a plurality of protrusions 5270 are arranged along the arrangement direction of the pair of attachment parts 5064. With such a configuration, the contact of the conductive member 5080 acting on the chassis 5014 (and the substrate cover 5060) can be adjusted by adjusting the number and positions of the protrusions 5270 in the arrangement direction of the pair of attachment portions 5064. The pressure magnitude and the contact pressure distribution can be easily changed.

In the present embodiment, the plurality of protrusions 5270A are arranged in the region X1 that is between the

attachment portions

5064D and 5064E in the X-axis direction. In the X-axis direction, a portion corresponding to a position between the mounting

portions

5064D and 5064E (particularly an intermediate position between the mounting

portions

5064D and 5064E) is a portion where the bottom plate 5014a of the chassis 5014 and the peripheral wall portion 5063 of the substrate cover 5060 are relatively easily bent. . For this reason, in this embodiment, it was set as the structure which forms several protrusion 5270A between

attachment part

5064D, 5064E (area | region X1). Thereby, even if it is a case where the location corresponding to the area | region X1 bends, a contact with the electroconductive member 5080 is securable.

In addition, you may provide the formation location of the some protrusion 5270 in locations other than between the attaching

parts

5064D and 5064E. However, if the number of locations where the protrusions 5270 are formed increases, the number of locations where the conductive member 5080 is compressed also increases. In this embodiment, when the board cover 5060 is attached to the chassis 5014, the conductive member 5080 is compressed by fastening the screw B1. That is, the screw B1 is fastened to the chassis 14 against the repulsive force of the conductive member 5080. For this reason, by increasing the number of locations where the protrusions 5270 are formed, when the number of locations to be compressed in the conductive member 5080 increases, the repulsive force when fastening the screw B1 increases accordingly, and workability decreases. Concerned.

For this reason, in the present embodiment, in the bottom plate 5014a of the chassis 5014 (or the peripheral wall portion 5063 of the substrate cover 5060), the protrusion 5270 is provided only between the pair of attachment portions 5064 (for example, the region X1) that is a relatively flexible portion. It was decided to form. Thereby, the formation location of the protrusion 5270 is reduced, and the situation where the workability concerning the assembly of the substrate cover 5060 is suppressed is suppressed.

Further, in the present embodiment, by providing a plurality of protrusions 5270, the size of the protrusions 5270 in plan view can be easily adjusted. This also makes it easy to reduce the size of each protrusion 5270. Such a configuration is suitable because, for example, when the plate width of the peripheral wall portion 5063 (wall portion 5063A or wall portion 5063B) is small, the protrusion 5270 can be easily formed.

<Eighth embodiment>
Next, an eighth embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 5312 of this embodiment, the configuration of the protrusion formed on the chassis 5014 is different from that of the above embodiment.

As shown in FIGS. 27 and 28, the protrusion 5370 in the present embodiment has a peripheral wall portion 5063 (

wall portions

5063A, 5063B) of the substrate cover 5060 on the contact surface 5051A that contacts the conductive member 5080 of the bottom plate 5014a of the chassis 5014. And a plurality of knurls are formed on the portions facing each other. Such knurling is performed, for example, by cutting the contact surface 5051A with a predetermined knurling tool to form a number of groove-shaped recesses (shown by broken lines in FIG. 27). At this time, the portions surrounded by the recesses are formed as minute protrusions 5370 by intersecting the recesses with each other to form a lattice pattern. In FIG. 27, reference numeral 5370A is assigned to the protrusion 5370 that faces the wall 5063A, and reference numeral 5370B is assigned to the protrusion 5370 that faces the wall 5063B.

Note that, in the contact surface 5051A, a portion to be knurled (a portion where the protrusion 5370 is formed) protrudes in advance to the bottom plate 5014a side of the chassis 5014 from other portions. Thereby, in the bottom plate 5014a, the protruding end of each protruding portion 5370 protrudes toward the peripheral wall portion 5063 as compared with a portion where the protruding portion 5370 is not formed. For this reason, the compression amount of the conductive member 5080 is larger at the location where the plurality of protrusions 5370 are formed (center portion 5081) than at the other location (end portion 5082).

And the protrusion 5370 is formed in the location which overlaps with the center part of wall part 5063A (or wall part 5063B). More specifically, the projecting portion 5370 is formed in a region between the two mounting portions 5064 adjacent to the projecting portion 5370 in a plan view (a relatively flexible portion, for example, the region X2 shown in FIG. 27). It has become. Note that the protruding height of each protrusion 5370 from the bottom plate 5014a is preferably, for example, 0.3 to 1 mm. Further, the interval between the protrusions 5370 (the groove width of the concave portion indicated by a broken line in FIG. 27) is preferably set to 0.3 to 2 mm, for example.

As in the present embodiment, a plurality of protrusions 5370 can be easily formed by forming the protrusions 5370 by knurling. Moreover, if it is a knurling process, it is possible to form many minute protrusions. When a plurality of minute protrusions 5370 come in contact with the conductive member 5080, a high frictional force can be obtained between the conductive member 5080 and the conductive member 5080. Thereby, the situation where the position of the electroconductive member 5080 shift | deviates in the extending direction (X-axis direction and Y-axis direction) of the baseplate 5014a can be suppressed more reliably.

<Ninth Embodiment>
Next, a ninth embodiment of the present invention will be described with reference to FIGS. The same parts as those in the above embodiment are denoted by the same reference numerals, and redundant description is omitted. In the backlight device 5412 of this embodiment, the configuration of the protrusion formed on the chassis 5014 is different from that of the above embodiment.

In this embodiment, as shown in FIGS. 29 and 30, the protrusions 5470 are formed on the bottom plate 5014a of the chassis 5014 at locations facing the

wall portions

5063A and 5063B of the substrate cover 5060, respectively. As shown in FIG. 29, each protrusion 5470 has a substantially rectangular shape extending along the extending direction of the

walls

5063A and 5063B in plan view.

As shown in FIG. 31, each protrusion 5470 has a substantially rectangular shape in cross section, and is configured to sandwich each conductive member 5080 between the wall portion 5063A and the wall portion 5063B of the substrate cover 5060. In FIG. 29, reference numeral 5470A is assigned to the protrusion 5470 that faces the wall 5063A, and reference numeral 5470B is assigned to the protrusion 5470 that faces the wall 5063B.

As shown in FIGS. 29 and 31, in the protrusion 5470, a standing wall portion 5471 that rises toward the substrate cover 5060 is formed at an end portion on the control substrate 5040 side. The standing wall portion 5471 is formed over the entire length of the protruding portion 5470 in the extending direction of the protruding portion 5470. As shown in FIG. 31, the height Z3 of the standing wall portion 5471 is a gap between the tip of the standing wall portion 5471 and the wall portion 5063A (or 5063B) of the substrate cover 5060 in a state where the substrate cover 5060 is attached to the chassis 5014. It is set to a size that causes The end face 5083 (end part) on the control board 5040 side of the conductive member 5080 is in contact with the standing wall part 5471, whereby the displacement of the conductive member 5080 toward the control board 5040 is restricted.

The effect produced by providing the standing wall portion 5471 will be specifically described with reference to FIGS. 31 and 32. FIG. FIG. 32 is a cross-sectional view showing a process of attaching the substrate cover 5060 to the chassis 5014. As shown in FIG. 32, when attaching the substrate cover 5060, the conductive member 5080 is arranged on the bottom plate 5014a in advance. The conductive member 5080 has a thickness Z2 (length in the Z-axis direction) in the uncompressed natural state (the state shown in FIG. 32), and the peripheral wall portion 5063 and the bottom plate 5014a in a state where the substrate cover 5060 is attached to the chassis 5014. Is set to a value larger than the facing interval Z1 (see FIG. 31).

Thus, in a state where the substrate cover 5060 is attached to the chassis 5014, the conductive member 5080 is sandwiched between the peripheral wall portion 5063 and the bottom plate 5014a (projecting portion 5470) and compressed in the Z-axis direction. Accordingly, the conductive member 5080 is in close contact with both the peripheral wall portion 5063 and the bottom plate 5014a, and the electrical connection between the peripheral wall portion 5063 and the bottom plate 5014a becomes more reliable. Here, as in the above-described embodiments, the conductive member 5080 is more strongly compressed at the locations where the protrusions 5470 are formed than at locations where the protrusions 5470 are not formed (see FIG. 30).

Thus, when the substrate cover 5060 is attached, the conductive member 5080 is compressed in the Z-axis direction. On the other hand, when the conductive member 5080 is compressed in the Z-axis direction, the conductive member 5080 extends in the direction along the contact surface 5051A of the chassis 5014 (X-axis direction and Y-axis direction). If the conductive member 5080 extends in the direction along the contact surface 5051A of the chassis 5014 in the configuration that does not include the standing wall portion 5471, the end surface 5083 of the conductive member 5080 is displaced to the control board 5040 side. As a result, there is a concern that the conductive member 5080 contacts the control board 5040 and affects the operation of the control board 5040.

In particular, in the present embodiment, by forming the protrusion 5470 on the contact surface 5051A of the chassis 5014, the conductive member 5080 is more strongly compressed at the portion where the protrusion 5470 is formed. The amount of elongation in the direction along the contact surface 5051A of the chassis when the is compressed is likely to increase. In this regard, in this embodiment, since the end surface 5083 of the conductive member 5080 is in contact with the standing wall portion 5471, when the conductive member 5080 is compressed in the Z-axis direction, the control board 5040 of the conductive member 5080. The displacement to the side can be regulated. Thereby, the situation where the conductive member 5080 contacts the control board 5040 can be more reliably suppressed.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

(1) The shapes of the

protrusions

70, 170, 270, 370, 5070, 5170, 5270, 5370, and 5470 are not limited to those illustrated in the above embodiment. The protrusion may have any shape that protrudes toward the

chassis

14 and 5014, and the shape can be changed as appropriate. Further, the formation location and the number of the

projections

70, 170, 270, 370, 5070, 5170, 5270, 5370, and 5470 are not limited to those exemplified in the above embodiment.

(2) The materials of the

chassis

14 and 5014 and the substrate covers 60 and 5060 are not limited to metal and can be appropriately changed, and may be any material having conductivity.

(3) The shape of the substrate covers 60, 160, 260, 360, 5060 is not limited to a planar view shape, and can be changed as appropriate.

(4) The materials of the

conductive members

80 and 5080 are not limited to those exemplified in the above embodiment. The

conductive members

80 and 5080 can be applied as long as they are materials having elasticity and conductivity.

(5) The means for attaching the

control boards

40 and 5040 and the board covers 60 and 5060 to the

chassis

14 and 5014 is not limited to the screw B1 and can be changed as appropriate. For example, the

control boards

40 and 5040 and the board covers 60 and 5060 may be attached to the

chassis

14 and 5014 using bolts and nuts. The

control boards

40 and 5040 and the board covers 60 and 5060 may be individually attached to the

chassis

14 and 5014 by different attachment means.

(6) The configuration of the

attachment portions

64 and 5064 in the substrate covers 60 and 5060 is not limited to that exemplified in the above embodiment. The “attachment portion” in the present invention refers to a portion (attachment location) attached to the

chassis

14, 5014 in the substrate covers 60, 5060, and depends on the means for attaching the substrate covers 60, 5060 to the

chassis

14, 5014. Can be changed as appropriate.

(7) In the above-described fourth embodiment, a configuration in which a plurality of protrusions are formed by performing knurling on the contact surface of the substrate cover is illustrated. However, in addition to knurling, for example, on the contact surface of the substrate cover A plurality of protrusions may be formed by performing a blasting process or the like.

(8) In the above embodiment, the

control boards

40 and 5040 are illustrated as circuit boards, but the invention is not limited to this. As long as the circuit board and the board cover are attached to the

chassis

14 and 5014, the configuration of the present invention (configuration in which the

protrusions

70 and 5070 are provided) can be applied. For example, the

protrusions

70 and 5070 may be formed in the

peripheral wall portions

32 and 5032 of the substrate covers 31 and 5031 that cover the

inverter substrates

30 and 5030.

(9) In the above embodiment, the

cold cathode tubes

17 and 5017 are used as the light source. However, the present invention is not limited to this. It is also possible to use a hot cathode tube or an LED as the light source.

(10) In the above embodiment, the

liquid crystal panels

11 and 5011 and the

chassis

14 and 5014 are illustrated in a vertically placed state in which the short side direction coincides with the vertical direction, but the

liquid crystal panels

11 and 5011 and the chassis 14 are illustrated. , 5014 is also included in the present invention in a vertically placed state in which the long side direction coincides with the vertical direction.

(11) In the above embodiment, the TFT is used as the switching element of the liquid

crystal display devices

10 and 5010. However, the present invention is also applicable to a liquid crystal display device using a switching element other than TFT (for example, a thin film diode (TFD)) The present invention can be applied to a liquid crystal display device for monochrome display in addition to a liquid crystal display device for color display.

(12) In the above embodiment, the liquid

crystal display devices

10 and 5010 using the

liquid crystal panels

11 and 5011 are exemplified as the display panel. However, the present invention can be applied to display devices using other types of display panels. .

(13) In the above embodiment, the television receiver TV provided with the tuner is exemplified, but the present invention can also be applied to a display device not provided with the tuner.

DESCRIPTION OF

SYMBOLS

10, 5010 ... Liquid crystal display device (display device) 11, 5011 ... Liquid crystal panel (display panel), 12, 112, 212, 312, 5012, 5112, 5212, 5312, 5412 ... Backlight device (illumination device), 14 , 5014 ... chassis, 17, 5017 ... cold cathode tube (light source), 40, 5040 ... control board (circuit board), 60, 160, 260, 360, 5060 ... board cover, 63, 5063 ... peripheral wall (of the board cover) Peripheral end), 63A, 5063A ... Wall (end on one side of the substrate cover), 63B, 5063B ... Wall (end on the other side of the substrate cover), 63D ... Contact surface, 64, 5064 ... Mounting Part (placement of the board cover to the chassis), 64D, 64E, 5064D, 5064E... Attachment part (a pair of attachment parts), 0,170,270,370,5070,5170,5270,5370,5470 ... projection, 80,5080 ... conductive member, TV ... television receiver apparatus

Claims

A light source;
A chassis formed of a conductive material and containing the light source;
A circuit board attached to the chassis;
A board cover formed of a conductive material and attached to the chassis and arranged to cover the circuit board;
A conductive member interposed between the chassis and the substrate cover and elastically contacting both the chassis and the substrate cover,
In either the substrate cover or the chassis, a protrusion projecting toward the other of the substrate cover or the chassis is formed on at least a part of the contact surface that is in contact with the conductive member. A lighting device characterized by comprising:
The board cover has a pair of attachment parts attached to the chassis,
The lighting device according to claim 1, wherein the protrusion is disposed between the pair of attachment portions in an arrangement direction of the pair of attachment portions.
A plurality of the protrusions are arranged along the arrangement direction of the pair of attachment parts,
3. The lighting device according to claim 2, wherein each of the plurality of protrusions is disposed between the pair of attachment portions in the arrangement direction of the pair of attachment portions.
The lighting device according to any one of claims 1 to 3, wherein the protruding portion has a shape in which a protruding height increases as the distance from the mounting position of the substrate cover with respect to the chassis increases. .
5. The plurality of protrusions are formed by performing knurling on at least a part of the contact surface that is in contact with the conductive member. The lighting device described in 1.
The substrate cover has a planar view shape,
In a plan view, the conductive member is arranged so as to overlap with both end portions in one side direction of the substrate cover and end portions on both sides in the other side direction orthogonal to the one side direction of the substrate cover. Has been
The said protrusion is formed in the edge part of the said both sides in the said one side direction of the said board | substrate cover, and the edge part of the said both sides in the said other edge direction, respectively. Item 6. The lighting device according to any one of Items 5.
In the protrusion, an end wall portion is erected at the end on the circuit board side toward the substrate cover,
The said standing wall part is the structure which regulates the displacement to the said circuit board side of the said conductive member, when the edge part by the side of the said circuit board in the said conductive member contact | abuts. The lighting device according to claim 6.
The lighting device according to any one of claims 1 to 7,
And a display panel that performs display using light from the lighting device.
The display device according to claim 8, wherein the display panel is a liquid crystal panel using liquid crystal.
A television receiver comprising the display device according to claim 8 or 9.