WO2012092383A1

WO2012092383A1 - Floor systems and methods of making and using same

Info

Publication number: WO2012092383A1
Application number: PCT/US2011/067616
Authority: WO
Inventors: Wesley King; David Earl
Original assignee: Mohawk Carpet Corporation
Priority date: 2010-12-30
Filing date: 2011-12-28
Publication date: 2012-07-05
Also published as: WO2012092561A1; EP2659568A1

Abstract

The various embodiments of the present invention are directed to floor systems and to methods of making and using the floor systems. The floor systems generally include a flooring unit. The flooring unit includes a decorative flooring unit component, a flooring unit platform, and a radiant heating system element. The flooring unit platform can be fabricated to comprise a portion of a mechanical joint, which is used to couple or mate two adjacent flooring unit components.

Description

FLOOR SYSTEMS AND

METHODS OF MAKING AND USING SAME

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 61/428,452, filed 30 December 2010 entitled "Floor Systems and Methods of Making and Using Same," and claims the benefit of U.S. Provisional Application No. 61/428,442, filed 30 December 2010 entitled "Method and Apparatus for Providing Wireless Power Transmission," which are incorporated herein by reference in their entirety as if fully set forth below.

TECHNICAL FIELD

The various embodiments of the present invention relate generally to floor systems and their installation. More particularly, the various embodiments of the invention relate to improved floor systems having heating elements incorporated therein and to methods of making and using such flooring systems.

BACKGROUND

Radiant heating involves the transfer of thermal energy from a heat source via radiation, which is in contrast to conventional heating means such as convection or conduction. Radiant heating can provide a variety of advantages over conventional heating. For example, relative to forced air heating systems, radiant heating systems can provide improved indoor air quality because they do not generate turbulence or movement of indoor air (and the allergens and particulates contained therein). This feature can be particularly important to persons who suffer from allergies. Other features that make radiant heating systems attractive include energy input flexibility (i.e., such systems are not limited to being used with a specific primary fuel or energy input source), compatibility with alternative or "green" power generation methods, relatively low system and installation costs, low maintenance, and ease of installation. As a result, radiant heating systems are becoming more prevalent. For example, radiant heating systems can be installed under the floor either as a replacement for, or to supplement, a primary heating system. Conventionally installed flooring (e.g., grouted ceramic tiles, nailed down wood floors, glued-down vinyl sheets, and the like), which can be termed "non-floating" flooring, is fixed in place to the sub-floor more-or-less permanently. When such flooring is used, the radiant heating systems include discrete heating elements (e.g., cables, wires, tubing, and the like) that must be installed separately before the flooring is fixed in place. The radiant heating systems can be installed under the sub-floor (e.g., under a wooden sub-floor) or in the sub-floor (e.g., within a cement slab). These types of installations are suitable for the initial construction, or a major renovation, of the flooring; otherwise, significant efforts would be needed to remove a previously existing floor and sub-floor in order to install the radiant heating system under or in the sub-floor. Moreover, if repairs were needed, it could be quite difficult, expensive, and even destructive to access the elements of the radiant heating system.

Alternatively, the radiant heating systems can be installed between the floor and the sub- floor. This type of installation allows for implementation of a radiant heating system at any time (i.e., during initial construction of the flooring, or afterward in a minor or major renovation thereof). One problem associated with such installations is that they require additional installation steps prior to installation of the flooring. Once installed on top of the sub-floor, the radiant heating system elements are subject to damage during subsequent installation of the flooring. Thus, great care must be exercised during installation of the flooring. For example, radiant heating elements installed under ceramic tile flooring can be placed on top of the sub- floor and then cemented to the sub-floor with a "thin-set" material; the ceramic tiles are then cemented to this layer using more thin-set. Damage to the heating elements can take place at any time during or after installation (e.g., if a crack develops in the sub-floor and damages the thin- set and ceramic tile flooring). Similarly, if a repair to either the floor or the radiant heating system elements is required, portions of the ceramic tile flooring, thin-set material, and/or the radiant heating system must be destructively removed in order to effect the repair.

One method to minimize the difficulty accessing and/or probability of damaging the radiant heating system elements, particularly where a repair to the radiant heating system is needed, involves the use of so-called "floating" flooring. Floating floors typically are not permanently affixed to the sub-floor or mounting surface and can be easily installed or removed, allowing ready access to the area under the floating floor. Radiant heating systems can have the same configurations indicated above for use with non-floating flooring, with the primary difference being that the individual flooring units for floating floors readily can be removed. When the radiant heating system elements are placed between the sub-floor and the floor, removal of the floating floor units allows for access the radiant heat system components. Nevertheless, installation of the radiant heating system still constitutes an additional step that is distinct and separate from the steps needed to install the flooring. As the radiant heating system elements are separate and distinct from the flooring, there still remains the possibility that these elements can be damaged after their installation during the subsequent steps taken to install the floating flooring. Regardless of where the radiant heating system is placed and the type of flooring used, in order to radiantly heat the space above the floor, heat must flow from the heating elements, through each layer above the heating elements, and finally through the flooring layer to its top surface. During this process, some of the heat energy is "lost" in the opposite direction (i.e., in a direction away from the space to be heated). Thus, the overall system efficiency is influenced by the relative rate of heat transfer to the flooring versus the rate of heat transfer away from the flooring. System efficiency can be improved by either reducing the rate of lost heat, increasing the rate of heat transferred to the flooring, or both. Current radiant heating systems do not provide a mechanism for reducing the rate of lost heat or for directing heat preferentially towards the flooring. Accordingly, there is a need for improved flooring systems. It would be advantageous if these improved flooring systems could overcome the above-described installation, access, and/or heat transfer difficulties associated with existing flooring systems. It is to the provision of such systems, and the associated methods of manufacture and use that the various embodiments of the present invention are directed. BRIEF SUMMARY

Various embodiments of the present invention are directed to improved floating floor systems. Other embodiments are directed to methods of making the floor systems. Still other embodiments are directed to methods of using the floor systems. The improved flooring systems generally contain a flooring unit. The flooring unit includes a flooring unit platform, a radiant heating system element, and a decorative flooring unit component. The decorative flooring unit component is disposed on or in the flooring unit platform. The radiant heating system element is disposed beneath the decorative flooring unit component, either between the decorative flooring unit component and the flooring unit platform, or within the flooring unit platform. The radiant heating system element is positioned such that the rate of heat transfer to the surface of the decorative flooring unit component is greater than the rate of heat transfer through the flooring unit platform, in a direction opposite the decorative flooring unit component, to the subfloor. The floor systems can also include easy-to-assemble flooring unit designs that can be installed using mechanical joints that allow adjacent flooring units to be mated together to form a floor surface. In some situations, the mechanical joints are so-called "tongue-and-groove" joints. Such floating floor systems with tongue-and-groove joint profiles can facilitate secure and easy installation, as well as provide one or more areas of reliable compression after engagement. Connection points between radiant heating system elements of adjacent flooring units can be placed at these locations of reliable compression to maintain secure connections once the floor is assembled, even when the floor is under dynamic load conditions.

In certain embodiments, the use of mechanical joint structures facilitates the interconnection of a number of such radiant heating system elements into a network. Other aspects and features of embodiments of the present invention will become apparent to those of ordinary skill in the art, upon reviewing the following detailed description in conjunction with the accompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a schematic illustration of a cross-section of two engaged flooring units, wherein the two circled regions of the mechanical joint in the flooring unit platform indicate that compressive forces exist even in the absence of an external load on the flooring units, in accordance with some embodiments of the present invention. Figure 2 is a schematic illustration of two engaged flooring units each having a radiant heating system element (represented as the black lines) disposed between the decorative flooring unit component and the flooring unit platform in accordance with some embodiments of the present invention. Figure 3 is a schematic illustration of a cross-section of two engaged flooring units having a cavity (represented as the black square) within the mechanical joint that can accommodate a radiant heating system element according to some embodiments of the present invention.

Figure 4 is a schematic illustration of a cross-section of two engaged flooring units each having a radiant heating system element disposed between the decorative flooring unit component and the flooring unit platform and having a third radiant heating system element disposed in a cavity within the mechanical joint created between the two flooring units, according to some embodiments of the present invention.

Figure 5 schematically illustrates the assembly of multiple tile flooring units into a flooring system with a network of radiant heating system elements that are individually connected at each mechanical joint between adjacent flooring units according to some embodiments of the present invention.

DETAILED DESCRIPTION

Referring now to the figures, wherein like reference numerals represent like parts throughout the several views, exemplary embodiments of the present invention will be described in detail. Throughout this description, various components may be identified having specific values or parameters, however, these items are provided as exemplary embodiments. Indeed, the exemplary embodiments do not limit the various aspects and concepts of the present invention as many comparable parameters, sizes, ranges, and/or values may be implemented. The terms "first," "second," and the like, "primary," "secondary," and the like, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Further, the terms "a," "an," and "the" do not denote a limitation of quantity, but rather denote the presence of "at least one" of the referenced item. Disclosed herein are improved floating floor systems and methods of making and using the floating floor systems. The improved floating floor systems are designed such that individual flooring units comprise radiant heating system elements that are positioned for improved heating system efficiency. In addition, because the flooring units comprise the radiant heating system elements, the need to install the radiant heating system elements separately from the floor system is eliminated. Further, any repair that is needed to a radiant heating system element can be effected by removing the flooring unit containing the damaged/defective radiant heating system element and either repairing that element or replacing the flooring unit with another flooring unit. Other than the radiant heating system elements, the flooring units each also include a decorative flooring unit component and a flooring unit platform.

The decorative flooring unit component can be formed from any material that is used as a flooring surface, including a ceramic tile, marble tile, granite tile, quartz tile, natural stone tile, porcelain tile, wood plank, glass tile, a variety of metal or polymer tiles, and the like. Structurally, the decorative flooring unit component is disposed on or in the flooring unit platform.

The flooring unit platform can serve a number of purposes, including, for example, providing a level surface for the bottom of the decorative flooring unit component, providing support to one or more decorative flooring unit components within a given flooring unit, facilitating connection of adjacent flooring units, minimizing exposure of the sides of the decorative tiles after installation, providing a medium for placement of the radiant heating system element, and the like. In some embodiments, the flooring unit platform can serve as a reservoir for a relatively high heat capacity material (e.g., a phase change material) that can improve the overall thermal performance of the flooring system.

The radiant heating system element can be any component of a radiant heating system. Radiant heating systems are generally known to those skilled in the art to which this disclosure pertains. Exemplary radiant heating systems include resistive systems, hydronic systems, and the like. Thus, the flooring unit can contain a cable, a wire, a tube, a film, a coating, a layer, or the like. The radiant heating system element is disposed beneath the decorative flooring unit component. That is, the radiant heating system is placed below at least the surface of the decorative flooring unit component that is visible to a person standing on the flooring unit. In some cases, it is interposed between the decorative flooring unit component and the flooring unit platform. In other cases, the radiant heating system element can be disposed within the flooring unit platform such that the flooring unit platform encapsulates the radiant heating system element.

Ultimately, the radiant heating system element is positioned beneath the decorative flooring unit component in such a manner that the rate of heat transfer to the decorative flooring unit component is greater than the rate of heat transfer to a direction opposite the decorative flooring unit component. Thus, to achieve this heating directionality bias in situations where the radiant heating system element is disposed between the decorative flooring unit component and the flooring unit platform, the thermal conductivity of the flooring unit platform will be lower (i.e., the flooring unit platform is more thermally insulating) than that of the decorative flooring unit component. Similarly, when the radiant heating system element is disposed within the flooring unit platform, the flooring unit platform will be placed on a material with a lower thermal conductivity than the flooring unit platform. Alternately, the flooring unit platform can include a layer of a material that has a lower thermal conductivity than the primary material of the flooring unit platform, and that is disposed between the radiant heating system element and the sub-floor to serve to bias the flow of heat towards the decorative flooring unit. Desirably, in this latter arrangement, the decorative flooring unit component will have a thermal conductivity that is equal to or higher than that of the flooring unit platform. In addition, in an exemplary embodiment the bottom surface of the "floating" flooring unit and the top surface of the substrate can be in relatively imperfect, discontinuous and limited physical contact, greatly affecting the thermal contact and tending to reduce the rate of thermal transfer between the surfaces.

In some embodiments, each flooring unit will have a mechanism for engaging an adjacent flooring unit. In exemplary embodiments, this mechanism comprises a portion or component of a mechanical joint that is formed in the flooring unit platform. The general design and use of mechanical joints between individual flooring units not only facilitates the assembly of the individual flooring units into a floor, but simultaneously enables the secure connection of the radiant heating system elements between adjacent flooring units to form a complete radiant heating floor surface. Once installed, the mechanical joint designs ensure that the connections are under an at least substantially constant, connection-maintaining compressive force, even during dynamic loading conditions. The ability to connect two different radiant heating system elements will be dictated by the type of mechanical joint and the type of radiant heating system. If a resistive radiant heating system is used, then the connection between the two radiant heating system elements at the mechanical joint can be two conductive surfaces that maintain contact. In contrast, if a hydronic radiant heating system is used, then the connection between the two radiant heating system elements at the mechanical joint will have to enable the heating fluid or gas to flow between the two radiant heating system elements while also providing a fluidic seal so that the heating fluid does not leak from the radiant heating system elements.

In an advantageous feature of the floor systems of the present invention, the electrical or plumbing connections between the individual radiant heating system elements are assembled at the same time the individual flooring units are assembled into a floor, simultaneously simplifying the overall installation and reducing the probability of damaging the heating system components during installation.

For convenience, and not by way of limitation, reference will now be made to floating floor systems where the flooring unit component is a ceramic tile encased by a polymeric frame to provide a so-called "groutless tile" unit. Such groutless tile units and systems are described in commonly-assigned United States Patent Application Publication No. 2008/0184646, which is incorporated by reference herein in its entirety as if fully set forth below. These floor systems generally include so-called "tongue-and-groove" mechanical joints for connecting adjacent groutless tiles (flooring unit components). By way of illustration, another such floor system having a similar mechanical joint interconnection mechanism includes those laminate wood flooring systems manufactured and sold by Unilin / Mohawk Corporation under the trademark QUICKSTEP™.

Figure 1 illustrates a cross-section of two groutless tile units mated via the tongue of the first tile and the groove of the second tile to form a mechanically coupled joint or junction. The polymeric frame (cross-hatched), which surrounds the top decorative surface layer and forms the junction or joint area, with two primary components (a "male" and a "female"), is shown in the engaged or "installed" position. The polymeric frame is molded around the decorative surface layer and is then machined or milled to the desired geometry (the "profile"). The profile design is intended to cause a positive "locking" of one flooring unit to its neighbor, and the polymeric frame is intended to play a central role in the mechanical properties of the entire product.

One of the distinguishing features of this profile is the generation and maintenance of complementary tensile and compressive forces on certain portions of the profile, shown by reference numerals 105 and 110, when the joint is formed. In Figure 1, the circled regions 105 and 110 possess compressive forces after the joint is made, even in the absence of an external load on the floor. Such locations are ideal for placing the connections needed to join the separate radiant heating system elements in adjacent flooring units.

Figure 2 provides a schematic illustration of an exemplary embodiment of a groutless tile system 200 having groutless tiles 200 A and 200B. In an exemplary embodiment, the groutless tiles 200A and 200B include radiant heating system elements 205 and 210. The exemplary embodiment of the radiant heating system elements 205 and 210 shown in Figure 2, which are disposed between the ceramic tile durable surface 215 and the polymeric frame substrate 220, are connected in a region where the profile design results in compressive forces that push the components together. As shown in the exemplary embodiment in Figure 2, the radiant heating system elements 205 and 210 are in full and complete contact with both the durable surface 215 and the polymer frame substrate 220 of their respective groutless tiles, 200A and 200B, such that a relatively high percent of the surface area of the radiant heating system elements 205 and 210 is in contact with both the durable surface 215 and the substrate 220. This significant and substantial contact for an exemplary embodiment of the radiant heating system elements 205 and 210 enables efficient heat, fluid, or electrical transfer between the radiant heating system elements 205 and 210 and the durable surface 215 of their respective groutless tiles 200 A and 200B. Additionally, in some embodiments the thermal conductivity of the groutless tile system 200A can be configured so as to directionally bias heat to flow in a desired direction from the radiant heating system element 205. For example, and not limitation, in the exemplary embodiment of the groutless tile system 200A in Figure 2, the substrate 220 can be provided with a lower thermal conductivity than the durable surface 215. In this non-limiting example, the lower thermal conductivity of the substrate 220 will promote heat flow from the radiant heating system element 205, up through the durable surface 215, thereby promoting heat transfer into the desired room area above the groutless tile system 200A. In addition to configuring thermal conductivities of the materials in the groutless tile system 200 to promote heat flow in desired directions, an exemplary embodiment of the groutless tile system 200 can be configured with radiant heating system elements of varying heating capacities for individual groutless tiles. For example, and not limitation, the radiant heating system element 205 of groutless tile 200A could have a higher radiant heat value than the radiant heating system element 210 of groutless tile 200B. Furthermore, an exemplary embodiment of the groutless tile system 200 can provide a suite of different groutless tiles having radiant heating system elements of varying radiant heat values, such as a range of heat values from 1 to 5, with 1 being the lowest heat value and 5 being the highest heat value. In an exemplary embodiment, the groutless tile system 200 could be configured in a room such that the groutless tiles with higher radiant heat values can be placed in the colder areas of the room. For example, and not limitation, groutless tiles with a radiant heat value of 5 could be placed near the doors and windows to counteract any drafts or other loss of room heat near the doors or windows. In this example, groutless tiles with a radiant heat value of 1 could be placed in the warmer areas of the room, such as near the inputs of an HVAC system to the room. As previously provided, a significant benefit to an exemplary embodiment of the groutless tile system 200 is that individual groutless tiles that are defective or otherwise undesired can easily be swapped out and replaced. Furthermore, an exemplary embodiment of the groutless tile system 200 can be reconfigured according to the desired radiant heat values of certain tiles. For example, and not limitation, if an area of the room is determined be colder than desired, an area of groutless tiles with a radiant heat value of 2 in a room can easily be replaced with tiles with a radiant heat value of 4.

During the manufacture of this exemplary embodiment, the heating elements 205 and 210, along with the decorative top layer, can be encapsulated within the polymer frame layer. After encapsulation, the specific profiles can be machined or milled into the polymer frame. As the polymer is milled, the radiant heating system element can also be milled such that the proper overall profile is achieved and a portion of the radiant heating system element is exposed on the edge surface of the milled profile.

Additional radiant heating system elements 205 and 210 can also be placed in the mechanical joint formed between the polymeric frame components of two adjacent flooring units in an exemplary embodiment. Figure 3 provides a schematic illustration of two floating floor units that have been installed. In this embodiment, the polymeric frame profiles are designed with a cavity 305 (shown as a solid square) that can accommodate a separate radiant heating system element therein. Those of skill in the art will appreciate that the cavity 305 can be a variety of shapes and sizes depending upon the dimensions of the joint profile and the radiant heating system. This separate radiant heating system element can be a connecting piece that facilitates and maintains a good connection between the radiant heating system elements of the flooring units, or it can be a separate radiant heating system element that runs along the length of the mechanical joint to provide additional thermal energy across that dimension of the flooring unit. An exemplary embodiment of the groutless tile system 200 having an additional radiant heating system element 405 being a connecting piece is shown in Figure 4. Figure 4 is a schematic illustration of two groutless tiles 200A and 200B that have been installed and that comprise integral radiant heating system elements 205 and 210 disposed between the ceramic tile durable surface 215 and the polymeric frame substrate 220 as shown in Figure 2. In this embodiment, the additional radiant heating system element 405, which is placed in the cavity 305 shown in Figure 3, is designed such that the radiant heating system continuity, made by connecting the individual radiant heating system elements, is maintained, and the junction formed between the individual elements can be constantly under a compressive load in the assembled floor. Such an arrangement would maintain a secure connection of the radiant heating system elements forming a completed heating circuit.

In the case of a resistive radiant heating system, the connecting piece would comprise at least one electrically conductive portion, and would electronically connect the separate radiant heating system elements. In the case of a hydronic radiant heating system, the connecting piece would form a secure, leak-proof seal between the separate heating elements. As mentioned above, the radiant heating system elements 205, 210, 405 shown in Figure 4 are preferentially positioned near, and directly in contact with, the decorative ceramic tile 215. Such positioning places a substantial portion of the polymeric frame 220 between the radiant heating system elements 205, 210, 405 and the sub-floor; which could be a heat sink. The polymeric frame 220 can have a relatively low thermal conductivity (e.g., as much as 10 times lower) compared to the decorative ceramic tile 215. Thus, the overall system will tend to increase the flow of heat energy in the desired direction towards the surface of the ceramic tile.

Once connected, an exemplary embodiment of the groutless tile system 200 forms a continuous floor surface and a continuous radiant heating system network 505. Figure 5 provides a schematic illustration of an exemplary embodiment of a radiant heating system element network 505 of a groutless tile system 200 that can be formed from separate radiant heating system elements, located in adjacent flooring units, by joining them using connecting pieces in the mechanical joint formed between the polymeric frame of the flooring units. Portions of the radiant heating system connecting pieces are disposed in each of the two primary profile components (male and female) such that when they are assembled, a completed network or path is formed.

The design and placement of the polymeric frame profiles and the connecting pieces is done with the intention to create and maintain a connection that is mechanically secure. For example, in the case of a resistive radiant heating system, the connecting pieces can comprise distinct parts/components that would be formed at specific locations on the frame profiles, or they could be conductive films, ribbons, coatings, or the like that are applied to certain portions of the frame profiles after they have been molded and/or machined. Alternatively, in the case of a hydronic radiant heating system, the connecting pieces can comprise any known device that couple two fluid conduits. Such coupling device can be formed in a specific location on one or both polymeric frame profile of the mechanical joint, or it can be applied to the specific location after molding and machining.

The embodiments of the present invention are not limited to the particular components, process steps, and materials disclosed herein as such components, process steps, and materials may vary somewhat. Moreover, the terminology employed herein is used for the purpose of describing exemplary embodiments only and the terminology is not intended to be limiting since the scope of the various embodiments of the present invention will be limited only by the appended claims and equivalents thereof.

Therefore, while embodiments of this disclosure have been described in detail with particular reference to exemplary embodiments, those skilled in the art will understand that variations and modifications can be effected within the scope of the disclosure as defined in the appended claims. Accordingly, the scope of the various embodiments of the present invention should not be limited to the above discussed embodiments, and should only be defined by the following claims and all equivalents.

Claims

WHAT IS CLAIMED IS:

1. A groutless tile system comprising:

a plurality of groutless tiles, wherein each groutless tile comprises:

a substrate, the substrate having a bottom surface;

a durable surface disposed within a groove defined by the substrate, the durable surface having a top surface; and

a first radiant heating element disposed between the bottom surface and the top surface.

2. The groutless tile system of claim 1, wherein the durable surface has a higher thermal conductivity than the substrate such that heat from the first heating element is directionally biased to flow through the durable surface.

3. The groutless tile system of claim 1, wherein the first radiant heating element is disposed within the substrate.

4. The groutless tile system of claim 1, wherein the first radiant heating element is disposed between the substrate and the durable surface.

5. The groutless tile system of claim 1, wherein each of the plurality of groutless tiles further comprises a connecting mechanism in communication with the first radiant heating element, the connecting mechanism enabling the first radiant heating element of a first groutless tile to connect to a second heating element of a second groutless tile.

6. The groutless tile system of claim 5, wherein the first groutless tile has a first coupling member and the second groutless tile has a second coupling member, and wherein the first coupling member can be connected to the second coupling member such that a compressive load maintains a connection between the first groutless tile and the second groutless tile.

7. The groutless tile system of claim 6, wherein the compressive load maintains a connection between the first radiant heating element and the second radiant heating element.

8. The groutless tile system of claim 5, wherein first radiant heating element is an electric heating element.

9. The groutless tile system of claim 8, wherein the connecting mechanism is an electrically conducting connecting mechanism.

10. The groutless tile system of claim 5, wherein first radiant heating element is a hydronic radiant heating element.

11. The groutless tile system of claim 10, wherein the connecting mechanism is enabled to connect at least two fluid conduits.

12. The groutless tile system of claim 6, wherein a cavity is formed between the joined first coupling member and the second coupling member.

13. The groutless tile system of claim 12, wherein a third radiant heating element is disposed in the cavity.

14. A groutless tile system comprising:

a first groutless tile, wherein the first groutless tile comprises:

a first substrate, the first substrate having a first bottom surface;

a first durable surface disposed within a first groove defined by the substrate, the first durable surface having a first top surface;

a first radiant heating element disposed between the first bottom surface and the first top surface;

a first connecting mechanism in communication with the first radiant heating element;

a second groutless tile, wherein the second groutless tile comprises:

a second substrate, the second substrate having a second bottom surface;

a second durable surface disposed within a second groove defined by the second substrate, the second durable surface having a second top surface; and

a second radiant heating element disposed between the second bottom surface and the second top surface;

a second connecting mechanism in communication with the second radiant heating element.

15. The groutless tile system of claim 14, wherein a first radiant heat value of the first radiant heating element of the first groutless tile is higher than a second radiant heat value of a second radiant heating element of a second groutless tile.

16. The groutless tile system of claim 14, wherein the first connecting mechanism enables the first radiant heating element of the first groutless tile to connect to the second heating element of the second groutless tile.

17. The groutless tile system of claim 16, wherein the first groutless tile has a first coupling member and the second groutless tile has a second coupling member, and wherein the first coupling member can be connected to the second coupling member such that a compressive load maintains a connection between the first groutless tile and the second groutless tile.

18. The groutless tile system of claim 17, wherein the compressive load maintains a connection between the first radiant heating element and the second radiant heating element.

19. A groutless tile system comprising:

a plurality of groutless tiles, wherein each groutless tile comprises:

a substrate, the substrate having a bottom surface;

a first radiant heating element disposed between the bottom surface and the top surface;

wherein the plurality of groutless tiles can be installed into a contiguous flooring surface.

20. The groutless tile system of claim 19, wherein each of the plurality of groutless tiles in the contiguous flooring surface can be easily and individually replaced after installation without detriment to any of the other groutless tiles in the contiguous floor surface.