WO2012061050A3 - Methods for improving pool boiling and apparatuses thereof - Google Patents
Methods for improving pool boiling and apparatuses thereof Download PDFInfo
- Publication number
- WO2012061050A3 WO2012061050A3 PCT/US2011/057413 US2011057413W WO2012061050A3 WO 2012061050 A3 WO2012061050 A3 WO 2012061050A3 US 2011057413 W US2011057413 W US 2011057413W WO 2012061050 A3 WO2012061050 A3 WO 2012061050A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- pool boiling
- apparatuses
- methods
- fluid
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A method and apparatus for pool boiling includes introducing a fluid into a chamber of a housing which has one or more protruding features. One or more diverters extend at least partially across the one or more protruding features in the chamber. One or more bubbles are formed in the fluid in the chamber as a result of bubble nucleation. At least one of growth and motion of the one or more of the bubbles are diverted with the one or more diverters to generate additional localized motion of the fluid along at least one of the one or more protruding features and other surfaces in the chamber of the housi ng to at least one of transfer additional heat to the liquid and increase the critical heat flux limit.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/925,584 US20120097373A1 (en) | 2010-10-25 | 2010-10-25 | Methods for improving pool boiling and apparatuses thereof |
US12/925,584 | 2010-10-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012061050A2 WO2012061050A2 (en) | 2012-05-10 |
WO2012061050A3 true WO2012061050A3 (en) | 2012-08-16 |
Family
ID=45971976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/057413 WO2012061050A2 (en) | 2010-10-25 | 2011-10-23 | Methods for improving pool boiling and apparatuses thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120097373A1 (en) |
WO (1) | WO2012061050A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2950133B1 (en) * | 2009-09-14 | 2011-12-09 | Commissariat Energie Atomique | THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY |
US11073340B2 (en) * | 2010-10-25 | 2021-07-27 | Rochester Institute Of Technology | Passive two phase heat transfer systems |
US10018430B2 (en) * | 2013-03-14 | 2018-07-10 | Rochester Institute Of Technology | Heat transfer system and method incorporating tapered flow field |
US11092391B2 (en) | 2014-04-18 | 2021-08-17 | Rochester Institute Of Technology | Enhanced boiling with selective placement of nucleation sites |
WO2015174423A1 (en) * | 2014-05-12 | 2015-11-19 | 国立大学法人横浜国立大学 | Cooler and cooling device using same, and cooling method for heating element |
US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
US10473410B2 (en) * | 2015-11-17 | 2019-11-12 | Rochester Institute Of Technology | Pool boiling enhancement with feeder channels supplying liquid to nucleating regions |
CN107148201B (en) * | 2017-07-14 | 2020-03-31 | 四川大学 | Cooling device utilizing micro boiling high-efficiency heat exchange technology |
US11723173B1 (en) | 2022-03-23 | 2023-08-08 | Rolls-Royce Corporation | Stacked cold plate with flow guiding vanes and method of manufacturing |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6719040B2 (en) * | 2001-09-14 | 2004-04-13 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with improved tunnel structure |
US7261144B2 (en) * | 2004-06-18 | 2007-08-28 | Ecole polytechnique fédérale de Lausanne (EPFL) | Bubble generator |
US7265979B2 (en) * | 2004-06-24 | 2007-09-04 | Intel Corporation | Cooling integrated circuits using a cold plate with two phase thin film evaporation |
JP2009281646A (en) * | 2008-05-21 | 2009-12-03 | Toyota Industries Corp | Plate heat exchanger for evaporation cooling |
WO2010050129A1 (en) * | 2008-10-29 | 2010-05-06 | 日本電気株式会社 | Cooling structure, electronic device, and cooling method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4653163A (en) * | 1984-09-14 | 1987-03-31 | Hitachi, Ltd. | Method for producing a heat transfer wall for vaporizing liquids |
JP3451737B2 (en) * | 1994-09-06 | 2003-09-29 | 株式会社デンソー | Boiling cooling device |
US6729383B1 (en) * | 1999-12-16 | 2004-05-04 | The United States Of America As Represented By The Secretary Of The Navy | Fluid-cooled heat sink with turbulence-enhancing support pins |
-
2010
- 2010-10-25 US US12/925,584 patent/US20120097373A1/en not_active Abandoned
-
2011
- 2011-10-23 WO PCT/US2011/057413 patent/WO2012061050A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6719040B2 (en) * | 2001-09-14 | 2004-04-13 | Denso Corporation | Cooling apparatus boiling and condensing refrigerant with improved tunnel structure |
US7261144B2 (en) * | 2004-06-18 | 2007-08-28 | Ecole polytechnique fédérale de Lausanne (EPFL) | Bubble generator |
US7265979B2 (en) * | 2004-06-24 | 2007-09-04 | Intel Corporation | Cooling integrated circuits using a cold plate with two phase thin film evaporation |
JP2009281646A (en) * | 2008-05-21 | 2009-12-03 | Toyota Industries Corp | Plate heat exchanger for evaporation cooling |
WO2010050129A1 (en) * | 2008-10-29 | 2010-05-06 | 日本電気株式会社 | Cooling structure, electronic device, and cooling method |
Also Published As
Publication number | Publication date |
---|---|
WO2012061050A2 (en) | 2012-05-10 |
US20120097373A1 (en) | 2012-04-26 |
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