WO2012058676A3 - Substrate shipper - Google Patents

Substrate shipper Download PDF

Info

Publication number
WO2012058676A3
WO2012058676A3 PCT/US2011/058615 US2011058615W WO2012058676A3 WO 2012058676 A3 WO2012058676 A3 WO 2012058676A3 US 2011058615 W US2011058615 W US 2011058615W WO 2012058676 A3 WO2012058676 A3 WO 2012058676A3
Authority
WO
WIPO (PCT)
Prior art keywords
container
substrate
horizontally
base member
integrally formed
Prior art date
Application number
PCT/US2011/058615
Other languages
French (fr)
Other versions
WO2012058676A2 (en
Inventor
John Burns
Mark V. Smith
Eric S. Olson
Russ V. Raschke
Original Assignee
Entegris, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris, Inc. filed Critical Entegris, Inc.
Publication of WO2012058676A2 publication Critical patent/WO2012058676A2/en
Publication of WO2012058676A3 publication Critical patent/WO2012058676A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Abstract

A substrate shipping container suitable for shipping solar cells, substrate wafers, or other suitable media. In some embodiments, the readily constructed container is made up of two identical container portions, each container portion having a horizontally-disposed base member and two adjacent vertically-disposed side members constructed of impact- absorbing double walls. The two container portions are shaped to be coupled using integrally formed tabs and slots located about the perimeter of the container portions. The horizontally-disposed base member of each container portion is equipped with a plurality of integrally formed pads. These pads serve as cushions to provide shock absorption in the vertical direction to substrates that are stacked between these members. Embodiments may further be comprised of molded polymers or pulp.
PCT/US2011/058615 2010-10-29 2011-10-31 Substrate shipper WO2012058676A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40844810P 2010-10-29 2010-10-29
US61/408,448 2010-10-29

Publications (2)

Publication Number Publication Date
WO2012058676A2 WO2012058676A2 (en) 2012-05-03
WO2012058676A3 true WO2012058676A3 (en) 2012-06-21

Family

ID=45994853

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/058615 WO2012058676A2 (en) 2010-10-29 2011-10-31 Substrate shipper

Country Status (2)

Country Link
TW (1) TW201219279A (en)
WO (1) WO2012058676A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10242897B2 (en) 2015-12-14 2019-03-26 Solarcity Corporation Micro-environment container for photovoltaic cells
USD914071S1 (en) 2018-11-02 2021-03-23 Esab Ab Welding device enclosure
CA3116678A1 (en) * 2018-11-02 2020-05-07 Esab Ab Wire feeder

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0791540A2 (en) * 1992-07-17 1997-08-27 Minnesota Mining And Manufacturing Company Reusable, two-piece storage container
JPH11157595A (en) * 1997-11-26 1999-06-15 Moriroku Company Ltd Packaging structure for liquid crystal panel module
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6533123B1 (en) * 1995-08-30 2003-03-18 Achilles Corporation Semiconductor wafer retaining structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0791540A2 (en) * 1992-07-17 1997-08-27 Minnesota Mining And Manufacturing Company Reusable, two-piece storage container
US6533123B1 (en) * 1995-08-30 2003-03-18 Achilles Corporation Semiconductor wafer retaining structure
JPH11157595A (en) * 1997-11-26 1999-06-15 Moriroku Company Ltd Packaging structure for liquid crystal panel module
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers

Also Published As

Publication number Publication date
TW201219279A (en) 2012-05-16
WO2012058676A2 (en) 2012-05-03

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