WO2012026652A1 - High-rigidity electromagnetic shielding composition and molded articles thereof - Google Patents

High-rigidity electromagnetic shielding composition and molded articles thereof Download PDF

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Publication number
WO2012026652A1
WO2012026652A1 PCT/KR2010/009244 KR2010009244W WO2012026652A1 WO 2012026652 A1 WO2012026652 A1 WO 2012026652A1 KR 2010009244 W KR2010009244 W KR 2010009244W WO 2012026652 A1 WO2012026652 A1 WO 2012026652A1
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Prior art keywords
metal
electromagnetic shielding
composition
molded article
shielding composition
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PCT/KR2010/009244
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French (fr)
Korean (ko)
Inventor
임윤숙
박강열
신찬균
박지권
김두영
Original Assignee
제일모직 주식회사
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Publication date
Priority claimed from KR1020100129506A external-priority patent/KR20120034538A/en
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Priority to CN2010800680310A priority Critical patent/CN102985492A/en
Publication of WO2012026652A1 publication Critical patent/WO2012026652A1/en
Priority to US13/775,300 priority patent/US20130177765A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/10Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives

Definitions

  • the present invention relates to a highly rigid electromagnetic wave shielding composition and a molded article thereof. More specifically, the present invention relates to a high-strength electromagnetic shielding composition and a molded article having excellent mechanical strength and EMI shielding properties, which can reduce the production cost by replacing an existing magnesium material, and have excellent processability.
  • Electromagnetic wave is a noise phenomenon generated by electrostatic discharge, and it is known to not only cause noise and malfunction to surrounding components or devices, but also to have a harmful effect on the human body. Recently, the possibility of electromagnetic wave is rapidly increasing through high-efficiency, high power consumption, and highly integrated electric and electronic products, and the regulation of electromagnetic waves is strengthened not only in advanced countries but also in Korea.
  • thermoplastics Accordingly, a method of replacing thermoplastics with ease of molding, excellent molding precision, and economical efficiency or productivity has been proposed.
  • metal substitute resin modulus is less than FM 20GPa, electromagnetic shielding effect is about 30dB (@ 1GHz), there is a disadvantage that the rigidity and EMI shielding is significantly lower than the metal.
  • a method of increasing the fiber content has been proposed, but in the case of a high fiber content, not only the impact strength is low, but also the fluidity is low and the processing is difficult, which makes it difficult to apply practically and the surface resistance is high. There is a problem that the conductivity is too low to use.
  • the surface resistance is lowered by conducting plating in order to solve this problem, but it causes a price increase due to the plating process and the subsequent process, and has a disadvantage in that the surface is peeled off when used for a long time.
  • An object of the present invention is to provide a high rigidity electromagnetic shielding composition having excellent mechanical strength and a molded article thereof.
  • Another object of the present invention is to provide a highly rigid electromagnetic shielding composition suitable for EMI shielding and its molded article having excellent conductivity and low surface resistance.
  • the composition comprises (A) about 10 to 34% by weight of a polyamide resin containing an aromatic group in the main chain; (B) about 65 to 85 weight percent of carbon fibers; And (C) about 1 to 20 weight percent of a metal filler.
  • the (A) polyamide resin may be a wholly aromatic polyamide, a semiaromatic polyamide or a mixture thereof.
  • the semiaromatic polyamide may be a polymer of aromatic diamine and aliphatic dicarboxylic acid.
  • the semiaromatic polyamide may be represented by the following Chemical Formula 1:
  • Ar is an aromatic group
  • R is a C 4-20 alkylene group
  • n is an integer of 50 to 500.
  • the (B) carbon fiber may include a bundle form.
  • the metal filler (C) may be metal powder, metal beads, metal fibers, metal flakes, metal coated particles, metal coated fibers, and the like, and these may be used alone or in combination of two or more thereof.
  • metal filler (C) aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, two or more kinds thereof, and the like may be used. These can be used individually or in mixture of 2 or more types.
  • the composition may include carbon nanotubes in a range of about 0 to 20 parts by weight or less based on 100 parts by weight of (A) + (B) + (C).
  • the composition may further comprise a metal coated graphite.
  • the metal-coated graphite may have particles, fibers, flakes, amorphous or a combination thereof.
  • the metal-coated graphite may have an average particle diameter of about 10 to 200 ⁇ m.
  • the metal may be aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, and the like, and two or more alloys thereof may also be applied.
  • the composition may further include additives such as flame retardants, plasticizers, coupling agents, thermal stabilizers, light stabilizers, inorganic fillers, mold release agents, dispersants, anti-dropping agents, weather stabilizers. These can be used individually or in mixture of 2 or more types.
  • the composition has a tensile strength of at least about 40 GPa at a thickness of 3.2 mm by ASTM D638, a flexural modulus of at least 40 GPa at a thickness of 6.4 mm by ASTM D790, EMI D790 at a thickness of 1 GHz, 1 mm.
  • the shielding effect according to the standard is about 50 dB or more
  • the volume resistance by the four-point probe method is about 0.2 ⁇ ⁇ cm or less for specimens of 1 mm thickness
  • 100 pieces are measured after extraction at 550 °C / 1hr.
  • the average value of one residual fiber length may be about 2 to 6 mm.
  • the molded article may have a structure in which (A) carbon fiber and (C) metal filler are impregnated into a polyamide resin containing an aromatic group in the main chain (A).
  • the molded article may be an LCD protective bracket of a portable display product.
  • the molded article comprises (A) melting a polyamide resin containing an aromatic group in a main chain and (C) a metal filler; Impregnating the melt with (B) carbon fiber and pelletizing it; And it may be prepared including the step of molding the pellets.
  • the pelletization may be pelletized by cutting the impregnated carbon fibers.
  • the pellet may have a length of about 8 to 20 mm.
  • the carbon fiber having a length of about 0.5 to 6 mm in the molded article may be at least about 80% by weight of the total carbon fibers in the molded article.
  • the present invention is suitable for EMI shielding due to its excellent mechanical strength and conductivity, and low surface resistance, excellent fluidity and formability, no post-processing, excellent economy and productivity, excellent dimensional stability, and can replace existing magnesium materials.
  • the high rigidity electromagnetic wave shielding composition and its molded article have the effect of this invention.
  • the highly rigid electromagnetic wave shielding composition of the present invention comprises (A) a polyamide resin containing an aromatic group in the main chain; (B) carbon fiber; And (C) a metal filler.
  • A a polyamide resin containing an aromatic group in the main chain
  • B carbon fiber
  • C a metal filler
  • the polyamide resin (A) that can be used in the present invention, an aromatic polyamide resin containing an aromatic group in the main chain can be used.
  • the (A) polyamide resin may be a wholly aromatic polyamide, a semiaromatic polyamide or a mixture thereof.
  • the aromatic polyamide of the present invention contains an aromatic group in the main chain, it is possible to give higher rigidity and strength.
  • the wholly aromatic polyamide means a polymer of aromatic diamine and aromatic dicarboxylic acid.
  • the semiaromatic polyamide is meant to include at least one aromatic unit and non-aromatic units between amide bonds.
  • the semiaromatic polyamide may be a polymer of aromatic diamine and aliphatic dicarboxylic acid.
  • the semi-aromatic polyamide may comprise a polyamide represented by the following formula (1):
  • Ar is an aromatic group
  • R is a C 4-20 alkylene group
  • n is an integer of 50 to 500.
  • Ar in Formula 1 may be a substituted or unsubstituted aromatic group.
  • the aromatic group may be one or more.
  • R may be a C 4-20 linear or branched alkylene group.
  • the semiaromatic polyamide may be a polymer of aliphatic diamine and aromatic dicarboxylic acid, as shown in the following Formula 2.
  • Ar is an aromatic group
  • R is a C 1-20 alkylene group
  • n is an integer of 50 to 500.
  • Ar in Formula 1 may be a substituted or unsubstituted aromatic group.
  • the aromatic group may be one or more.
  • R may be a C 1-20 linear or branched alkylene group.
  • aromatic diamine p-xylenediamine, m-xylenediamine, etc. may be used, but are not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
  • aromatic dicarboxylic acid examples include phthalic acid, isophthalic acid, terephthalic acid, naphthalene-2,6-dicarboxylic acid, diphenyl 4,4'-dicarboxylic acid, 1,3-phenylenedioxydiacetic acid, and the like. May be used, but is not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
  • the aliphatic diamine may be 1,2-ethylenediamine, 1,3-propylenediamine, 1,6-hexamethylenediamine, 1,12-dodecylenediamine, piperazine and the like, but is not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
  • the aliphatic dicarboxylic acid may be adipic acid, sebacic acid, succinic acid, glutaric acid, azelaic acid, dodecanedioic acid, dimer acid, cyclohexanedicarboxylic acid, and the like, but is not limited thereto. These can be used individually or in mixture of 2 or more types.
  • the polyamide resin (A) may have a glass transition temperature (Tg) of about 80 to 120 ° C, preferably about 83 to 100 ° C. It is possible to obtain the balance of physical properties of excellent fluidity, rigidity and low moisture absorption in the above range.
  • Tg glass transition temperature
  • the polyamide resin (A) includes nylon MXD6, nylon 6T, nylon 9T, nylon 10T, nylon 6I / 6T, and most preferably nylon MXD6. These can be used individually or in mixture of 2 or more types.
  • an aliphatic polyamide resin can be further added to the polyamide resin (A).
  • the aliphatic polyamide may be nylon 6, nylon 66, nylon 11, nylon12 or a mixture thereof.
  • the polyamide resin may be used in about 10 to 34% by weight, preferably about 15 to 30% by weight of the component (A) + (B) + (C). If the (A) polyamide resin exceeds 34% by weight, the modulus and strength are lowered, the volume resistance is increased, and the EMI shielding performance is lowered. On the other hand, when the content of (A) polyamide resin is less than 10% by weight, moldability may be deteriorated.
  • Carbon fiber used in the present invention is already well known to those skilled in the art, it is easy to purchase commercially, it can be produced by conventional methods.
  • the carbon fiber may be one prepared from a PAN system or a pitch system.
  • the average diameter of the carbon fiber may be used that is about 1 to 30 ⁇ m, preferably about 3 to 20 ⁇ m, more preferably about 5 to 15 ⁇ m. Excellent physical properties and conductivity can be obtained in the above range.
  • the carbon fiber may be used that has been surface-treated.
  • the carbon fiber may use a bundle form.
  • the carbon fiber may be a long carbon fiber in the form of a bundle of about 400 to 3000 TEX, preferably about 800 to 2400 TEX, more preferably about 800 to 1700 TEX. Impregnation can be good in the above range.
  • the carbon fiber having a bundle form is impregnated in the melt of the polyamide resin (A) to bury the polyamide resin (A) on the surface, and then the carbon fiber having the polyamide resin (A) is squeezed in the pelletizing process. It is cut into 8-20 mm lengths and made into pellets about 8-20 mm long. Since the length is cut along the length of the carbon fiber, the length of the pellet is the same as the length of the cut carbon fiber. That is, a pellet of about 8-20 mm in length will contain carbon fibers of about 8-20 mm in length.
  • the pellets prepared as described above may be manufactured into a molding through a molding process such as injection, and the final molding has a structure in which carbon fibers are dispersed from each other.
  • the carbon fiber is usually cut after the molding, most of the length of the residual fiber in the molded article is about 0.5 to 6mm when the long carbon fiber of about 8 to 20 mm length is applied as in the present invention.
  • the length of the residual fiber refers to the length of the fiber after pelletizing and then forming.
  • the molding process is a common general molding condition. For example, injection conditions with a temperature of about 280 to 320 ° C. and a pressure of about 170 Mpa to 190 Mpa are common. Examples of the molding conditions are merely examples for reference, but are not necessarily limited thereto.
  • the carbon fiber having a length of about 0.5 to 6 mm of residual fiber in the molded article is about 80 wt% or more, and in the embodiment, about 90 wt% or more of the total carbon fibers.
  • the average value may be about 2mm or more, in embodiments about 3mm or more.
  • the carbon fiber may be used in about 65 to 85% by weight, preferably about 65 to 80% by weight of the component (A) + (B) + (C). If (B) the carbon fiber is less than 65% by weight, the modulus and flexural modulus are lowered, the volume resistance and the moisture absorption rate are increased, and the EMI shielding performance is lowered. On the other hand, if the content of (B) the carbon fiber exceeds 85% by weight, the fluidity may be lowered and the impact strength and flexural modulus may fall.
  • the metal filler (C) used in the present invention may be used without limitation as long as the filler has conductivity.
  • aluminum, stainless, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, two or more alloys thereof, and the like may be used. These can be used individually or in mixture of 2 or more types. In one embodiment it may be an alloy of iron-chromium-nickel.
  • metal oxides or metal carbides such as tin oxide, indium oxide, silicon carbide, zirconium carbide, titanium carbide, and the like may also be used.
  • a low melting point comprising a main component selected from the group consisting of tin, lead and combinations thereof and a subcomponent selected from the group consisting of copper, aluminum, nickel, silver, germanium, indium, zinc and combinations thereof Metals
  • the low melting point metal may be used having a melting point of about 300 ° C. or less, preferably about 275 ° C. or less, and more preferably about 250 ° C. or less.
  • the filler-to-pillar network can be easily formed to further improve the electromagnetic shielding efficiency.
  • a low melting point metal preferably has a solidus temperature (Solidus temp .: temperature at which solidification ends) lower than the composite process process temperature of the polyamide resin (A).
  • the solidus temperature of the low melting point metal is 20 ° C or more lower than the process process temperature of the polyamide resin (A) in terms of the composite manufacturing process and the network formation between the fillers, and the stability is about 100 ° C or more higher than the composite use environment.
  • tin / copper (90 to 99/1 to 10 weight ratio) and tin / copper / silver (90 to 96/3 to 8/1 to 3 weight ratio) may be used as the melting point of about 300 ° C. or less.
  • the metal filler may be formed of metal powder, metal beads, metal fibers, metal flakes, metal coated particles, metal coated fibers, and the like, but are not limited thereto. These can be used individually or in mixture of 2 or more types.
  • the average particle diameter may be 30 to 300 ⁇ m. There is an advantage that feeding is good when extrusion in the above range.
  • the form of the metal filler when used in the form of a metal fiber, it may have a length of about 50 to 500 mm and a diameter range of about 10 to 100 ⁇ m.
  • the metal fiber may be used having a density of about 0.7 to 6.0 g / ml. It is possible to maintain proper feeding during the extrusion process in the above range.
  • the average size may be about 50 to 500 ⁇ m. There is an advantage in maintaining the proper feeding during the extrusion processing in the above range.
  • the metal powder, metal beads, metal fibers, etc. may be a single metal or an alloy of two or more kinds, and may have a multilayer structure.
  • the metal-coated particles and the metal-coated fibers form a core of a resin, ceramic, metal, carbon, and the like, and the core is coated with metal.
  • the resin-based fine particles or fibers may be coated with a metal such as nickel or nickel-copper, and the metal coating may be a single layer or a multilayer.
  • the metal coated particles may have an average particle diameter of about 30 to 300 ⁇ m. There is an advantage that feeding is good when extrusion in the above range.
  • the metal-coated fibers may have an average diameter of about 10 to 100 ⁇ m and a length of about 50 to 500 mm. There is an advantage in maintaining the proper feeding during the extrusion processing in the above range.
  • the metal filler (C) may be used in about 1 to 20% by weight, preferably about 3 to 15% by weight of the component (A) + (B) + (C). If the metal filler (C) is less than 1% by weight, the conductivity is lowered, and when the content of the metal filler (C) is more than 20% by weight, the fluidity may be lowered and the impact strength and the bending modulus may fall.
  • the composition may further include carbon nanotubes.
  • the carbon nanotubes may be used for any of single walls, double walls, and multiple walls, and a combination thereof may be applied. Preferably it is a multi-walled carbon nanotube. When the carbon nanotubes are contained, the surface resistance is significantly lowered, and thus the electromagnetic wave shielding performance and rigidity may be more excellent.
  • the carbon nanotubes may be included in the range of about 0 to 20 parts by weight or less based on 100 parts by weight of (A) + (B) + (C). It can have excellent fluidity and rigidity and electromagnetic shielding performance in the above range. It is preferably about 1 to 15 parts by weight, more preferably about 1 to 10 parts by weight.
  • the composition may further include metal coated graphite.
  • the metal coated graphite may have particles, fibers, flakes, amorphous or a combination thereof. When the metal-coated graphite has a fiber shape, it may form a network structure with carbon fibers. When the metal-coated graphite is thus contained, the surface resistance is remarkably reduced, and it may have more excellent electromagnetic shielding performance and rigidity.
  • the metal-coated graphite may have an average particle diameter of about 10 to 200 ⁇ m.
  • the average diameter is preferably about 10 to 200 ⁇ m, and the average length is about 15 to 100 ⁇ m. While excellent in electrical conductivity in the above range, there is an advantage that the decrease in mechanical properties by addition.
  • the metal may be used as long as the metal is conductive.
  • aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt and the like may be used, and two or more kinds thereof may also be applied.
  • the metal coating may be formed of not only a single layer but also two or more layers.
  • the metal-coated graphite may be included in the range of about 10 parts by weight or less based on 100 parts by weight of (A) + (B) + (C). Preferably it is about 0.1-7 weight part.
  • the metal-coated graphite may be applied together with carbon nanotubes, wherein the metal-coated graphite content is about 0.1 to 3 parts by weight based on 100 parts by weight of (A) + (B) + (C).
  • additives such as a flame retardant, a plasticizer, a coupling agent, a thermal stabilizer, a light stabilizer, an inorganic filler, a mold release agent, a dispersant, an antidropping agent, a carbon filler, and a weathering stabilizer may be added in a conventional range. These can be used individually or in mixture of 2 or more types.
  • the carbon filler various carbon fillers except for the carbon fiber (B) may be applied. Specific examples may include graphite, carbon nanotubes, carbon black, and the like, and metal coatings thereof may also be included. For example, the metal-coated graphite described above may also be included.
  • the composition has a tensile strength of at least about 40 GPa at 3.2 mm thickness according to ASTM D638, a flexural modulus of at least about 40 GPa at 6.4 mm thickness according to ASTM D790, EMI at 1 GHz, 1 mm thickness
  • the shielding effect according to D790 standard is about 50 dB or more
  • the volume resistivity by the 4-point probe method is about 0.2 ⁇ ⁇ cm or less for specimens of 1 mm thickness
  • 100 pieces are extracted after 550 °C / 1hr.
  • the average value of the measured residual fiber length may be about 2 to 6 mm.
  • the composition has a tensile strength of about 315-420 MPa at a thickness of 3.2 mm by ASTM D638, a flexural modulus of about 40-55 GPa at a thickness of 6.4 mm by ASTM D790, and a thickness of 1 GHz, 1 mm.
  • the shielding effect according to the EMI D790 standard is about 53 ⁇ 85 dB
  • the volume resistance by the 4-point probe method is about 0.05 ⁇ 0.18 ⁇ ⁇ cm for 1 mm thick specimens, and 100 pieces after 550 °C / 1hr for the molded product.
  • the average value of the residual fiber length measured by extracting may be about 3.0 to 6 mm.
  • the molded article may have a structure in which (B) carbon fibers and (C) metal filler are dispersed in a polyamide resin (A) containing an aromatic group in a main chain.
  • the molded article comprises (A) melting a polyamide resin containing an aromatic group in a main chain and (C) a metal filler; (B) impregnated by passing the carbon fiber through the melt and then cut and pelletized; And it may be prepared including the step of molding the pellets.
  • the pelletization may be pelletized by cutting the impregnated carbon fibers.
  • the melting is a temperature at which the polyamide resin can be melted. Therefore, the metal filler may be dispersed in the polyamide in the melt.
  • the carbon fiber may have a bundle form.
  • the polyamide resin (A) and the metal filler (C) containing an aromatic group in the main chain may be first introduced into the extruder and melted, and then carbon fiber (B) may be added and impregnated.
  • the molded article is (A) polyamide resin containing an aromatic group in the main chain and (C) a metal filler in an extruder and the first pelletized to produce a composite resin pellet; Melting the composite resin pellets; (B) impregnating the composite resin pellets by passing carbon fibers and then pelletizing them; And it may be prepared including the step of molding the carbon pellet impregnated secondary pellets.
  • the impregnated mixture may be extruded in the form of long fibers and then cut into pellets to pelletize. In embodiments it may be pelletized by cutting to a length of about 8 to 20 mm, preferably about 10 to 15 mm.
  • the shape of the carbon fiber of the long fiber is maintained in the above range can be obtained excellent shielding properties and strength.
  • the prepared pellets may be manufactured in various forms through injection molding, compression molding, casting molding, and the like.
  • the carbon fibers having a bundle shape may be dispersed with each other so that the fibers may be dispersed in a network shape in the final molded product.
  • the network shape refers to a form in which the fibers form a plurality of contact points and are connected to each other.
  • the carbon fiber may be partially cut after the molding.
  • the carbon fiber having a length of about 0.5 to 6 mm may be dispersed in a network shape in the molded article.
  • the carbon fiber having a length of about 0.5 to 6 mm is at least about 80% by weight, in embodiments at least about 90% by weight of the total carbon fiber.
  • residual fiber length is extracted to measure the length in the longitudinal direction may have an average value of about 2mm or more.
  • the molded article has excellent electromagnetic shielding properties, conductivity, mechanical properties, and moldability, and thus may be preferably applied to the LCD protective bracket of a portable display product.
  • Carbon fiber A chopped carbon fiber manufactured by Zoltek having an average diameter of 7 ⁇ m and a length of 6 mm was used.
  • micro stainless steel fiber MSF150 (short metal fiber with 65-15-10 Fe-Cr-Ni) manufactured by Mirae Materials Co., Ltd. was used.
  • the pellets were melted using a long-screw extruder, and impregnated with carbon fibers (B) by a pultrusion method, and cut into long pellets having a length of 12 mm to prepare a carbon fiber having a length of 12 mm.
  • Specimens for measuring physical properties and evaluating applications such as EMI and resistance at the injection temperature of 270 ° C were prepared using a long fiber injection machine. After the specimens were allowed to stand for 48 hours at 23 ° C. and 50% relative humidity, the physical properties were evaluated by the following method, and the results are shown in Table 1.
  • EMI shielding (dB) After leaving the sample for 48 hours at 23 ° C., 50% relative humidity, the electromagnetic shielding performance of the 1 mm thick sample (6 ⁇ 6) at 1 GHz was measured according to EMI D790.
  • Residual fiber length (mm) after ignition loss 100 residual fiber lengths were extracted after 550 ° C./1hr, and the length was measured in the longitudinal direction to be an arithmetic mean value for the length.
  • Comparative Examples 1 to 3 were carried out in the same manner as in Example 1 except for changing the composition of each component as shown in Table 2 below.
  • Comparative Example 4 was carried out in the same manner as in Example 1 except that the length of the carbon fiber to 6mm by cutting the pellet length to 6mm after impregnating the carbon fiber by the pultrusion method.
  • Example 1 the metal filler was used to have a high modulus and a high EMI shielding effect, as well as a low volume resistivity of 0.2 ⁇ ⁇ cm or less, whereas Comparative Example 1 without the metal filler had a modulus and EMI shielding effect. It is similar but the resistance is high.
  • Examples 1 to 5 a long fiber reinforced thermoplastic resin having a pellet length of 12 mm extruded by pultrusion method, overall performance such as modulus, EMI shielding effect, and resistance was higher than that of Comparative Example 4 using 6 mm carbon fiber extruded in the same method.
  • the comparative example 4 in particular, the length of the fibers (ash) remaining after the loss of ignition is also shortened so that there is a significant difference in EMI shielding and electrical resistance, which is important for networking in the injection molding.
  • Comparative Example 5 using a 6mm general chopped CF also showed a significant decrease in modulus, EMI shielding effect and resistance.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

The high-rigidity electromagnetic shielding composition of the present invention comprises: (A) approximately 10-34 wt% of polyamide resin having an aromatic group in the backbone structure; (B) approximately 65-85 wt% of carbon fiber; and (C) approximately 1-20 wt% of metallic filler. The composition has high modulus, electromagnetic shielding effects, and high surface conductance, and can thus be used to replace frames, brackets and the like for electronic devices.

Description

고강성 전자파 차폐 조성물 및 그 성형품High Rigidity Electromagnetic Shielding Composition and Molded Articles
본 발명은 고강성 전자파 차폐 조성물 및 그 성형품에 관한 것이다. 보다 구체적으로 본 발명은 기계적 강도와 EMI 차폐성이 우수하여 기존 마그네슘 소재를 대체하여 생산단가를 낮출 수 있고, 가공성이 우수한 고강성 전자파 차폐 조성물 및 그 성형품에 관한 것이다. The present invention relates to a highly rigid electromagnetic wave shielding composition and a molded article thereof. More specifically, the present invention relates to a high-strength electromagnetic shielding composition and a molded article having excellent mechanical strength and EMI shielding properties, which can reduce the production cost by replacing an existing magnesium material, and have excellent processability.
전자파는 정전기 방전에 의하여 발생하는 노이즈(Noise)현상으로, 주변의 부품 또는 기기에 노이즈와 오작동을 일으킬 뿐만 아니라 인체에도 해로운 영향을 주는 것으로 알려져 있다. 최근에는 고효율, 고소비전력, 고집적화되는 전기/전자 제품을 통해 전자파 발생 가능성이 급격히 증가하고 있으며, 선진 각국은 물론 국내에서도 전자파의 규제가 강화되고 있다. Electromagnetic wave is a noise phenomenon generated by electrostatic discharge, and it is known to not only cause noise and malfunction to surrounding components or devices, but also to have a harmful effect on the human body. Recently, the possibility of electromagnetic wave is rapidly increasing through high-efficiency, high power consumption, and highly integrated electric and electronic products, and the regulation of electromagnetic waves is strengthened not only in advanced countries but also in Korea.
종래 전자파를 차폐하기 위한 방법으로 금속재를 이용하는 방법이 있다. 예컨대, 휴대폰, 노트북, PDA, 기타 mobile item 과 같은 휴대용 디스플레이 제품에 사용되는 IT용 브라켓(Bracket)의 경우 LCD를 보호하고 전자파를 차폐하며, Frame 역할을 하기 때문에, 높은 강성과 EMI 차폐성이 요구된다. 근래에는 브라켓, 프레임 등의 소재로 마그네슘, 알루미늄, Stainless steel 등과 같은 금속이 주로 사용되고 있다. 그런데, 이러한 금속재의 경우 전자기파를 효과적으로 차단할 수 있는 장점이 있지만, Die-casting 하는 방식으로 생산되어 생산단가가 높고 불량률이 높은 단점이 있다. Conventionally, there is a method using a metal material as a method for shielding electromagnetic waves. For example, IT brackets used in portable display products such as mobile phones, laptops, PDAs, and other mobile items protect LCDs, shield electromagnetic waves, and act as frames, requiring high rigidity and EMI shielding. . Recently, metals such as magnesium, aluminum and stainless steel are mainly used as materials for brackets and frames. By the way, in the case of such a metal material has an advantage that can effectively block the electromagnetic wave, it is produced by the die-casting method has a disadvantage of high production cost and high defective rate.
이에 따라, 상기 금속 소재들에 비해, 성형이 용이하고, 성형 정밀도가 우수하며, 경제성이나 생산성이 우수한 열가소성 플라스틱을 대체하는 방법이 제기되고 있다. Accordingly, a method of replacing thermoplastics with ease of molding, excellent molding precision, and economical efficiency or productivity has been proposed.
현재 개발된 금속 대체수지의 모듈러스는 FM 20GPa 이하, 전자파 차폐효과는 30dB(@1GHz) 정도로, 금속에 비해 강성이나 EMI 차폐성이 현저히 떨어지는 단점이 있다. 모듈러스를 높이기 위해 fiber함량을 높이는 방법이 제기되었으나, fiber함량이 고함량의 경우 충격강도가 낮을 뿐만 아니라, 유동성이 낮고, 가공이 어려워 실질적인 적용에 어려움이 있고, 표면저항이 높아 전자기기의 소재로 사용하기에도 전도도가 지나치게 낮은 문제가 있다. Currently developed metal substitute resin modulus is less than FM 20GPa, electromagnetic shielding effect is about 30dB (@ 1GHz), there is a disadvantage that the rigidity and EMI shielding is significantly lower than the metal. In order to increase the modulus, a method of increasing the fiber content has been proposed, but in the case of a high fiber content, not only the impact strength is low, but also the fluidity is low and the processing is difficult, which makes it difficult to apply practically and the surface resistance is high. There is a problem that the conductivity is too low to use.
특히 폴리아미드계 수지를 기초수지로 적용할 경우, 치수안정성이 낮고 흡습율이 높아 제품열화가 가속화되고, 또한 저유동 base 에서는 high filler loading이 어렵다. 근래에는 카본계 섬유를 50% 이상 사용하여 고 모듈러스 및 30dB이상의 전자파 차폐효과를 갖는 제품이 개발되고 있지만 금속을 대체하기에는 부족하며, 가공에 어려움이 있다. 더욱이 이러한 소재를 전자기기의 소재로 사용하기에는 전도도가 낮아 문제점이 있다. 예를 들면, 일반 휴대폰 브라켓(Bracket) 사용시 접지성능 저하 및 안테나 성능 저하와 같은 문제가 발생되고 있다. In particular, when the polyamide-based resin is applied as a base resin, the product deterioration is accelerated due to low dimensional stability and high moisture absorption rate, and high filler loading is difficult in a low flow base. Recently, products having high modulus and electromagnetic shielding effect of more than 30dB using carbon-based fibers over 50% have been developed, but it is insufficient to replace metals, and there is difficulty in processing. Moreover, there is a problem that the conductivity is low to use such a material as the material of the electronic device. For example, problems such as deterioration of grounding performance and antenna performance have occurred when using a general mobile phone bracket.
일반 고강성 수지에서는 이를 해결하기 위해 전도성 도금을 하여 표면저항을 낮추고 있지만, 도금공정과 후속공정 등으로 인해 가격상승을 초래하고 있고 장기간 사용시 표면이 벗겨지는 단점이 있다. In general high stiffness resin, the surface resistance is lowered by conducting plating in order to solve this problem, but it causes a price increase due to the plating process and the subsequent process, and has a disadvantage in that the surface is peeled off when used for a long time.
따라서, 우수한 유동성과 충격강도 및 강성을 가지며, 전도성과 차폐성능이 탁월하여 기존 마그네슘 소재를 대체할 수 있는 새로운 소재의 개발이 필요한 실정이다. Therefore, there is a need for the development of a new material that can replace the existing magnesium material with excellent fluidity, impact strength and rigidity, excellent conductivity and shielding performance.
본 발명의 목적은 기계적 강도가 우수한 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.An object of the present invention is to provide a high rigidity electromagnetic shielding composition having excellent mechanical strength and a molded article thereof.
본 발명의 다른 목적은 전도성이 뛰어나고 표면저항이 낮아 EMI 차폐에 적합한 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.Another object of the present invention is to provide a highly rigid electromagnetic shielding composition suitable for EMI shielding and its molded article having excellent conductivity and low surface resistance.
본 발명의 또 다른 목적은 유동성과 성형성이 우수한 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.It is still another object of the present invention to provide a highly rigid electromagnetic shielding composition having excellent flowability and formability and a molded article thereof.
본 발명의 또 다른 목적은 후가공이 불필요하고 경제성 및 생산성이 뛰어난 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.It is still another object of the present invention to provide a high rigidity electromagnetic shielding composition and its molded article which do not require post-processing and are excellent in economy and productivity.
본 발명의 또 다른 목적은 치수안정성이 우수한 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.It is still another object of the present invention to provide a highly rigid electromagnetic shielding composition having excellent dimensional stability and a molded article thereof.
본 발명의 또 다른 목적은 기존 마그네슘 소재를 대체할 수 있는 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 것이다.It is still another object of the present invention to provide a highly rigid electromagnetic shielding composition and its molded article which can replace the existing magnesium material.
본 발명이 이루고자 하는 기술적 과제들은 이상에서 언급한 기술적 과제들로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.
본 발명의 하나의 관점은 고강성 전자파 차폐 조성물에 관한 것이다. 상기 조성물은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지 약 10 내지 34 중량%; (B) 카본섬유 약 65 내지 85 중량%; 및 (C) 금속 필러 약 1 내지 20 중량%를 포함하여 이루어진다. One aspect of the invention relates to a high rigidity electromagnetic shielding composition. The composition comprises (A) about 10 to 34% by weight of a polyamide resin containing an aromatic group in the main chain; (B) about 65 to 85 weight percent of carbon fibers; And (C) about 1 to 20 weight percent of a metal filler.
구체예에서 상기 (A) 폴리아미드 수지는 전방향족 폴리아미드, 반방향족 폴리아미드 또는 이들의 혼합물일 수 있다. In embodiments, the (A) polyamide resin may be a wholly aromatic polyamide, a semiaromatic polyamide or a mixture thereof.
상기 반방향족 폴리아미드는 방향족 디아민과 지방족 디카르복실산의 중합체일 수 있다. The semiaromatic polyamide may be a polymer of aromatic diamine and aliphatic dicarboxylic acid.
한 구체예에서는 상기 반방향족 폴리아미드는 하기 화학식 1로 표시될 수 있다:In one embodiment, the semiaromatic polyamide may be represented by the following Chemical Formula 1:
[화학식 1][Formula 1]
Figure PCTKR2010009244-appb-I000001
Figure PCTKR2010009244-appb-I000001
상기에서 Ar은 방향족기이며, R은 C4~20의 알킬렌기이고, n은 50 내지 500의 정수임.Ar is an aromatic group, R is a C 4-20 alkylene group, n is an integer of 50 to 500.
구체예에서, 상기 (B) 카본섬유는 번들 형태인 것을 포함할 수 있다.In embodiments, the (B) carbon fiber may include a bundle form.
구체예에서, 상기 (C) 금속 필러는 금속분, 금속비드, 금속 섬유, 금속 플레이크, 금속 코팅된 입자 및 금속 코팅된 섬유 등이 사용될 수 있으며, 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. In an embodiment, the metal filler (C) may be metal powder, metal beads, metal fibers, metal flakes, metal coated particles, metal coated fibers, and the like, and these may be used alone or in combination of two or more thereof.
상기 (C) 금속 필러는 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트, 이들의 2종 이상 합금 등이 사용될 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. As the metal filler (C), aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, two or more kinds thereof, and the like may be used. These can be used individually or in mixture of 2 or more types.
상기 조성물은 탄소나노튜브를 (A)+(B)+(C) 100 중량부에 대하여 약 0 초과 20 중량부 이하의 범위로 포함될 수 있다. The composition may include carbon nanotubes in a range of about 0 to 20 parts by weight or less based on 100 parts by weight of (A) + (B) + (C).
상기 조성물은 금속코팅된 흑연을 더 포함할 수 있다. 상기 금속코팅된 흑연은 입자, 섬유, 플레이크, 무정형 또는 이들의 조합된 형상을 가질 수 있다. The composition may further comprise a metal coated graphite. The metal-coated graphite may have particles, fibers, flakes, amorphous or a combination thereof.
상기 금속코팅된 흑연은 평균 입경이 약 10 내지 200 ㎛일 수 있다. The metal-coated graphite may have an average particle diameter of about 10 to 200 ㎛.
구체예에서 상기 금속은 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트 등이 사용될 수 있으며, 이들의 2종 이상 합금도 적용될 수 있다. In embodiments, the metal may be aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, and the like, and two or more alloys thereof may also be applied.
구체예에서는 상기 조성물은 난연제, 가소제, 커플링제, 열안정제, 광안정제, 무기필러, 이형제, 분산제, 적하방지제, 내후안정제 등의 첨가제를 더 포함할 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. In embodiments, the composition may further include additives such as flame retardants, plasticizers, coupling agents, thermal stabilizers, light stabilizers, inorganic fillers, mold release agents, dispersants, anti-dropping agents, weather stabilizers. These can be used individually or in mixture of 2 or more types.
하나의 구체예에서는 상기 조성물은 ASTM D638에 의한 3.2 mm 두께에서 인장강도가 약 40 GPa 이상이며, ASTM D790에 의한 6.4 mm 두께에서 굴곡 모듈러스가 40 GPa 이상이며, 1 GHz, 1 mm 두께에서 EMI D790 규격에 의한 차폐효과가 약 50 dB 이상이고, 1 mm 두께의 시편에 대해 4점 프로브 방법에 의한 체적저항이 약 0.2 Ω·cm 이하이며, 성형품에 대하여 550℃/1hr 후 100개를 추출하여 측정한 잔류섬유길이의 평균값이 약 2 내지 6 mm 일 수 있다. In one embodiment the composition has a tensile strength of at least about 40 GPa at a thickness of 3.2 mm by ASTM D638, a flexural modulus of at least 40 GPa at a thickness of 6.4 mm by ASTM D790, EMI D790 at a thickness of 1 GHz, 1 mm. The shielding effect according to the standard is about 50 dB or more, the volume resistance by the four-point probe method is about 0.2 Ω · cm or less for specimens of 1 mm thickness, and 100 pieces are measured after extraction at 550 ℃ / 1hr. The average value of one residual fiber length may be about 2 to 6 mm.
본 발명의 다른 관점은 상기 조성물로부터 제조된 성형품에 관한 것이다. 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지에 (B) 카본섬유와 (C) 금속 필러가 함침된 구조를 가질 수 있다. Another aspect of the invention relates to a molded article made from the composition. The molded article may have a structure in which (A) carbon fiber and (C) metal filler are impregnated into a polyamide resin containing an aromatic group in the main chain (A).
구체예에서는 상기 성형품은 휴대용 디스플레이 제품의 LCD 보호용 브라켓일 수 있다. In an embodiment the molded article may be an LCD protective bracket of a portable display product.
구체예에서, 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지와 (C) 금속 필러를 용융시키고; 상기 용융물에 (B) 카본섬유를 통과시켜 함침한 후 펠렛화하고; 그리고 상기 펠렛을 성형하는 단계를 포함하여 제조 될 수 있다. 구체예에서는 상기 펠렛화는 상기 함침된 카본섬유를 커팅하여 펠렛화할 수 있다. In an embodiment, the molded article comprises (A) melting a polyamide resin containing an aromatic group in a main chain and (C) a metal filler; Impregnating the melt with (B) carbon fiber and pelletizing it; And it may be prepared including the step of molding the pellets. In embodiments, the pelletization may be pelletized by cutting the impregnated carbon fibers.
상기 펠렛은 약 8 내지 20 mm의 길이를 가질 수 있다. The pellet may have a length of about 8 to 20 mm.
구체예에서, 상기 성형품 내에는 약 0.5 내지 6mm의 길이를 갖는 카본 섬유가 성형품내 전체 카본섬유중 약 80 중량% 이상일 수 있다. In embodiments, the carbon fiber having a length of about 0.5 to 6 mm in the molded article may be at least about 80% by weight of the total carbon fibers in the molded article.
본 발명은 기계적 강도 및 전도성이 뛰어나고 표면저항이 낮아 EMI 차폐에 적합하며, 유동성과 성형성이 우수하고, 후가공이 불필요하고 경제성 및 생산성이 뛰어나며, 치수안정성이 우수하고, 기존 마그네슘 소재를 대체할 수 있는 고강성 전자파 차폐 조성물 및 그 성형품을 제공하는 발명의 효과를 갖는다. The present invention is suitable for EMI shielding due to its excellent mechanical strength and conductivity, and low surface resistance, excellent fluidity and formability, no post-processing, excellent economy and productivity, excellent dimensional stability, and can replace existing magnesium materials. The high rigidity electromagnetic wave shielding composition and its molded article have the effect of this invention.
본 발명의 고강성 전자파 차폐 조성물은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지; (B) 카본섬유; 및 (C) 금속 필러를 포함하여 이루어진다. 이하, 상기 각 성분에 대해 상세히 설명한다. The highly rigid electromagnetic wave shielding composition of the present invention comprises (A) a polyamide resin containing an aromatic group in the main chain; (B) carbon fiber; And (C) a metal filler. Hereinafter, each said component is explained in full detail.
(A) 폴리아미드 수지(A) polyamide resin
본 발명에서 사용될 수 있는 폴리아미드 수지(A)는 주쇄에 방향족기를 함유하는 방향족 폴리아미드 수지가 사용될 수 있다. 구체예에서 상기 (A) 폴리아미드 수지는 전방향족 폴리아미드, 반방향족 폴리아미드 또는 이들의 혼합물일 수 있다. As the polyamide resin (A) that can be used in the present invention, an aromatic polyamide resin containing an aromatic group in the main chain can be used. In embodiments, the (A) polyamide resin may be a wholly aromatic polyamide, a semiaromatic polyamide or a mixture thereof.
이와 같이 본 발명의 방향족 폴리아미드는 주쇄에 방향족기를 함유하므로 보다 높은 강성(rigidity)과 강도(strength)를 부여할 수 있다. As described above, since the aromatic polyamide of the present invention contains an aromatic group in the main chain, it is possible to give higher rigidity and strength.
상기 전방향족 폴리아미드는 방향족 디아민과 방향족 디카르복실산의 중합체를 의미한다. The wholly aromatic polyamide means a polymer of aromatic diamine and aromatic dicarboxylic acid.
상기 반방향족 폴리아미드는 아미드 결합 사이에 최소한 하나의 방향족 단위와 비방향족 단위를 포함하는 것을 의미한다. 한 구체예에서는 상기 반방향족 폴리아미드는 방향족 디아민과 지방족 디카르복실산의 중합체일 수 있다. The semiaromatic polyamide is meant to include at least one aromatic unit and non-aromatic units between amide bonds. In one embodiment, the semiaromatic polyamide may be a polymer of aromatic diamine and aliphatic dicarboxylic acid.
바람직한 구체예에서는 상기 반방향족 폴리아미드는 하기 화학식 1로 표시되는 폴리아미드를 포함할 수 있다:In a preferred embodiment the semi-aromatic polyamide may comprise a polyamide represented by the following formula (1):
[화학식 1][Formula 1]
Figure PCTKR2010009244-appb-I000002
Figure PCTKR2010009244-appb-I000002
상기에서 Ar은 방향족기이며, R은 C4~20의 알킬렌기이고, n은 50 내지 500의 정수임.Ar is an aromatic group, R is a C 4-20 alkylene group, n is an integer of 50 to 500.
상기 화학식 1에서 Ar은 치환 혹은 비치환된 방향족기일 수 있다. 상기 방향족기는 하나 이상일 수 있다. 또한 R은 C4~20의 선형 혹은 가지형 알킬렌기일 수 있다. Ar in Formula 1 may be a substituted or unsubstituted aromatic group. The aromatic group may be one or more. In addition, R may be a C 4-20 linear or branched alkylene group.
다른 구체예에서는 상기 반방향족 폴리아미드는 하기 화학식 2에 표시된 바와 같이 지방족 디아민과 방향족 디카르복실산의 중합체일 수 있다. In another embodiment, the semiaromatic polyamide may be a polymer of aliphatic diamine and aromatic dicarboxylic acid, as shown in the following Formula 2.
[화학식 2][Formula 2]
[규칙 제26조에 의한 보정 17.01.2011] 
Figure WO-DOC-FIGURE-59
[Revision 17.01.2011 under Rule 26]
Figure WO-DOC-FIGURE-59
상기에서 Ar은 방향족기이며, R은 C1~20의 알킬렌기이고, n은 50 내지 500의 정수임.Ar is an aromatic group, R is a C 1-20 alkylene group, n is an integer of 50 to 500.
상기 화학식 1에서 Ar은 치환 혹은 비치환된 방향족기일 수 있다. 상기 방향족기는 하나 이상일 수 있다. 또한 R은 C1~20의 선형 혹은 가지형 알킬렌기일 수 있다. Ar in Formula 1 may be a substituted or unsubstituted aromatic group. The aromatic group may be one or more. In addition, R may be a C 1-20 linear or branched alkylene group.
상기 방향족 디아민은 p-자일렌디아민, m-자일렌디아민 등이 사용될 수 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. As the aromatic diamine, p-xylenediamine, m-xylenediamine, etc. may be used, but are not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
상기 방향족 디카르복실산의 예로는 프탈산, 이소프탈산, 테레프탈산, 나프탈렌-2,6-디카르복실산, 디페닐4,4'-디카르복실산, 1,3-페닐렌디옥시디아세틱산 등이 사용될 수 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. Examples of the aromatic dicarboxylic acid include phthalic acid, isophthalic acid, terephthalic acid, naphthalene-2,6-dicarboxylic acid, diphenyl 4,4'-dicarboxylic acid, 1,3-phenylenedioxydiacetic acid, and the like. May be used, but is not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
상기 지방족 디아민은 1,2-에틸렌디아민, 1,3-프로필렌디아민, 1,6-헥사메틸렌디아민, 1,12-도데실렌디아민, 피페라진 등이 사용될 수 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. The aliphatic diamine may be 1,2-ethylenediamine, 1,3-propylenediamine, 1,6-hexamethylenediamine, 1,12-dodecylenediamine, piperazine and the like, but is not necessarily limited thereto. These can be used individually or in mixture of 2 or more types.
상기 지방족 디카르복실산은 아디프산, 세바식산, 숙신산, 글루타릭산, 아젤라익산, 도데칸디오익산, 다이머산, 사이클로헥산디카르복실산 등이 사용될 수 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. The aliphatic dicarboxylic acid may be adipic acid, sebacic acid, succinic acid, glutaric acid, azelaic acid, dodecanedioic acid, dimer acid, cyclohexanedicarboxylic acid, and the like, but is not limited thereto. These can be used individually or in mixture of 2 or more types.
한 구체예에서는 상기 폴리아미드 수지(A)는 유리전이온도(Tg)가 약 80 내지 120 ℃, 바람직하게는 약 83 내지 100 ℃일 수 있다. 상기 범위에서 우수한 유동성과 강성, 낮은 흡습율의 물성 발란스를 얻을 수 있다.In one embodiment, the polyamide resin (A) may have a glass transition temperature (Tg) of about 80 to 120 ° C, preferably about 83 to 100 ° C. It is possible to obtain the balance of physical properties of excellent fluidity, rigidity and low moisture absorption in the above range.
바람직하게는 상기 폴리아미드 수지(A)는 나일론 MXD6, 나일론 6T, 나일론 9T, 나일론 10T, 나일론 6I/6T 등이 있으며, 가장 바람직하게는 나일론 MXD6이다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. Preferably, the polyamide resin (A) includes nylon MXD6, nylon 6T, nylon 9T, nylon 10T, nylon 6I / 6T, and most preferably nylon MXD6. These can be used individually or in mixture of 2 or more types.
다른 구체예에서는 상기 폴리아미드 수지(A)에 지방족 폴리아미드 수지를 더 부가하여 사용할 수 있다. 구체예에서 상기 지방족 폴리아미드는 nylon 6, nylon 66, nylon 11, nylon12 또는 이들의 혼합물일 수 있다.In another embodiment, an aliphatic polyamide resin can be further added to the polyamide resin (A). In embodiments, the aliphatic polyamide may be nylon 6, nylon 66, nylon 11, nylon12 or a mixture thereof.
본 발명에서 상기 폴리아미드 수지는 (A)+(B)+(C) 성분 중 약 10 내지 34 중량%, 바람직하게는 약 15 내지 30 중량%로 사용될 수 있다. 만일 (A) 폴리아미드 수지가 34 중량%를 초과할 경우일 경우, 모듈러스 및 강도가 저하되고, 체적 저항이 높아지며, EMI 차폐 성능이 떨어진다. 반면, (A) 폴리아미드 수지의 함량이 10 중량% 미만일 경우, 성형성이 떨어질 수 있다.In the present invention, the polyamide resin may be used in about 10 to 34% by weight, preferably about 15 to 30% by weight of the component (A) + (B) + (C). If the (A) polyamide resin exceeds 34% by weight, the modulus and strength are lowered, the volume resistance is increased, and the EMI shielding performance is lowered. On the other hand, when the content of (A) polyamide resin is less than 10% by weight, moldability may be deteriorated.
(B) 카본섬유(B) carbon fiber
본 발명에서 사용되는 카본섬유는 이 분야의 통상적 지식을 가진 자에게는 이미 잘 알려져 있는 것으로, 상업적 구입이 용이하며, 통상의 방법으로 제조될 수 있다.Carbon fiber used in the present invention is already well known to those skilled in the art, it is easy to purchase commercially, it can be produced by conventional methods.
구체예에서는 상기 카본섬유는 PAN계나 피치계로부터 제조된 것이 사용될 수 있다. In specific embodiments, the carbon fiber may be one prepared from a PAN system or a pitch system.
상기 카본섬유의 평균직경은 약 1 내지 30 ㎛인 것이 사용될 수 있으며, 바람직하게는 약 3 내지 20 ㎛, 더욱 바람직하게는 약 5 내지 15 ㎛이다. 상기 범위에서 우수한 물성과 전도성을 얻을 수 있다. The average diameter of the carbon fiber may be used that is about 1 to 30 ㎛, preferably about 3 to 20 ㎛, more preferably about 5 to 15 ㎛. Excellent physical properties and conductivity can be obtained in the above range.
한 구체예에서 상기 카본섬유는 표면처리가 된 것을 사용할 수 있다. In one embodiment, the carbon fiber may be used that has been surface-treated.
또한 상기 카본 섬유는 번들 형태를 사용할 수 있다. 구체예에서는 상기 카본섬유는 약 400~3000TEX의 번들형태의 long 카본섬유가 사용될 수 있으며, 바람직하게는 약 800~2400TEX, 더욱 바람직하게는 약 800~1700TEX이다. 상기 범위에서 함침이 잘 될 수 있다. In addition, the carbon fiber may use a bundle form. In embodiments, the carbon fiber may be a long carbon fiber in the form of a bundle of about 400 to 3000 TEX, preferably about 800 to 2400 TEX, more preferably about 800 to 1700 TEX. Impregnation can be good in the above range.
이처럼 번들 형태를 갖는 카본 섬유는 폴리아미드 수지(A)의 용융물에 함침시켜 표면에 폴리아미드 수지(A)를 묻힌 후, 상기 폴리아미드 수지(A)가 묻어있는 카본 섬유를 펠렛타이징 과정에서 약 8 내지 20mm 길이로 절단되어 길이 약 8-20 mm의 펠렛으로 제조된다. 카본섬유 길이에 따라 절단되기 때문에 펠렛의 길이는 절단된 카본섬유의 길이와 동일하다. 즉, 길이 약 8-20 mm 의 펠렛은 약 8-20 mm 길이의 카본섬유를 그대로 함유하게 되는 것이다. The carbon fiber having a bundle form is impregnated in the melt of the polyamide resin (A) to bury the polyamide resin (A) on the surface, and then the carbon fiber having the polyamide resin (A) is squeezed in the pelletizing process. It is cut into 8-20 mm lengths and made into pellets about 8-20 mm long. Since the length is cut along the length of the carbon fiber, the length of the pellet is the same as the length of the cut carbon fiber. That is, a pellet of about 8-20 mm in length will contain carbon fibers of about 8-20 mm in length.
이와 같이 제조된 펠렛은 사출 등의 성형과정을 통해 성형물로 제조될 수 있으며, 최종 성형물에서는 카본 섬유가 서로 분산된 구조를 갖는다. The pellets prepared as described above may be manufactured into a molding through a molding process such as injection, and the final molding has a structure in which carbon fibers are dispersed from each other.
또한 통상 카본 섬유는 성형을 거친 후 대부분이 절단되는데, 본 발명과 같이 약 8 내지 20 mm 길이의 롱 카본섬유를 적용할 경우 성형품에서는 대부분 잔류 섬유의 길이가 약 0.5 내지 6mm으로 된다. 여기서 잔류섬유의 길이는 펠렛화한 다음 성형과정을 거친 후의 섬유 길이를 의미한다. 상기 성형과정은 통상의 일반적인 성형조건이다. 예를 들면, 온도 약 280~320 ℃, 압력 약 170Mpa ~ 190Mpa 의 사출조건이 일반적이다. 상기 성형조건의 예는 단순히 참고를 위한 예시이며, 반드시 이에 제한되는 것은 아니다. In addition, the carbon fiber is usually cut after the molding, most of the length of the residual fiber in the molded article is about 0.5 to 6mm when the long carbon fiber of about 8 to 20 mm length is applied as in the present invention. Here, the length of the residual fiber refers to the length of the fiber after pelletizing and then forming. The molding process is a common general molding condition. For example, injection conditions with a temperature of about 280 to 320 ° C. and a pressure of about 170 Mpa to 190 Mpa are common. Examples of the molding conditions are merely examples for reference, but are not necessarily limited thereto.
반면, 일반 chopped 섬유를 적용할 경우 성형품에서는 잔류 섬유길이가 약 0.5mm 이상이 나오기 어렵기 때문에 물성에 차이가 있는 것이다. 구체예에서는 본 발명의 조성물을 성형한 후 성형품 내에 잔류 섬유의 길이가 약 0.5 내지 6mm인 카본섬유가 전체 카본섬유중 약 80중량%이상, 구체예에서는 약 90 중량% 이상이다. 또한, 성형품에 대하여 550℃에서 1시간 후 잔류 섬유길이를 100개 추출하여 길이 방향으로 길이를 측정하여 평균값이 약 2mm 이상, 구체예에서는 약 3mm 이상일 수 있다. On the other hand, when the general chopped fiber is applied, there is a difference in physical properties because the length of the residual fiber is hardly about 0.5 mm or more in the molded article. In an embodiment, after molding the composition of the present invention, the carbon fiber having a length of about 0.5 to 6 mm of residual fiber in the molded article is about 80 wt% or more, and in the embodiment, about 90 wt% or more of the total carbon fibers. In addition, after 1 hour at 550 ℃ for the molded article 100 residual fiber length is extracted by measuring the length in the longitudinal direction, the average value may be about 2mm or more, in embodiments about 3mm or more.
상기 카본섬유는 (A)+(B)+(C) 성분 중 약 65 내지 85 중량%, 바람직하게는 약 65 내지 80 중량%로 사용될 수 있다. 만일 (B) 카본섬유가 65 중량% 미만일 경우, 모듈러스 및 굴곡 모듈러스가 저하되고, 체적 저항과 흡습율이 높아지며, EMI 차폐 성능이 떨어진다. 반면, (B) 카본섬유의 함량이 85 중량%를 초과할 경우, 유동성이 저하되고 충격강도 및 굴곡 모듈러스가 떨어질 수 있다.The carbon fiber may be used in about 65 to 85% by weight, preferably about 65 to 80% by weight of the component (A) + (B) + (C). If (B) the carbon fiber is less than 65% by weight, the modulus and flexural modulus are lowered, the volume resistance and the moisture absorption rate are increased, and the EMI shielding performance is lowered. On the other hand, if the content of (B) the carbon fiber exceeds 85% by weight, the fluidity may be lowered and the impact strength and flexural modulus may fall.
(C) 금속 필러(C) metal filler
본 발명에서 사용되는 금속 필러(C)는 전도성을 갖는 필러라면 제한없이 사용될 수 있다. 구체예에서는 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트, 이들의 2종 이상 합금 등이 사용될 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. 한 구체예에서는 철-크롬-니켈의 합금일 수 있다. The metal filler (C) used in the present invention may be used without limitation as long as the filler has conductivity. In specific embodiments, aluminum, stainless, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt, two or more alloys thereof, and the like may be used. These can be used individually or in mixture of 2 or more types. In one embodiment it may be an alloy of iron-chromium-nickel.
다른 구체예에서는 산화주석, 산화인듐, 실리콘카바이드, 지르코늄카바이드, 티타늄카바이드 등과 같은 금속 산화물이나 금속 탄화물도 사용될 수 있다.In other embodiments, metal oxides or metal carbides such as tin oxide, indium oxide, silicon carbide, zirconium carbide, titanium carbide, and the like may also be used.
또 다른 구체예에서는 주석, 납 및 이들의 조합으로 이루어진 군에서 선택되는 주성분과, 구리, 알루미늄, 니켈, 은, 게르마늄, 인듐, 아연 및 이들의 조합으로 이루어진 군에서 선택되는 부성분을 포함하는 저융점 금속이 사용될 수 있다. 상기 저융점 금속은 융점 약 300 ℃ 이하, 바람직하게는 융점 약 275 ℃ 이하, 더욱 바람직하게는 융점 약 250 ℃이하 인 것이 사용될 수 있다. In another embodiment, a low melting point comprising a main component selected from the group consisting of tin, lead and combinations thereof and a subcomponent selected from the group consisting of copper, aluminum, nickel, silver, germanium, indium, zinc and combinations thereof Metals can be used. The low melting point metal may be used having a melting point of about 300 ° C. or less, preferably about 275 ° C. or less, and more preferably about 250 ° C. or less.
이와 같이 저융점 금속을 사용할 경우, 필러간 네트워크 형성을 용이하게 하여 전자파 차폐 효율을 더욱 향상시킬 수 있다. 이와 같은 저융점 금속은 폴리아미드 수지(A) 의 복합재 프로세스 공정 온도보다 낮은 고상선 온도(Solidus temp.:응고가 종료되는 온도)를 갖는 것이 바람직하다. 바람직하게는 폴리아미드 수지(A) 의 프로세스 공정 온도보다 저융점 금속의 고상선 온도가 20℃ 이상 낮은 것이 복합재 제조 공정 및 필러간의 네트워크 형성면에서 좋고, 복합재 사용 환경보다 약 100℃ 이상 높은 것이 안정성 면에서 좋다. 바람직하게는 융점 약 300 ℃ 이하로서 주석/구리(90~99 /1~10 중량비), 주석/구리/은(90~96 /3~8 /1~3중량비)이 사용될 수 있다.When the low melting point metal is used as described above, the filler-to-pillar network can be easily formed to further improve the electromagnetic shielding efficiency. Such a low melting point metal preferably has a solidus temperature (Solidus temp .: temperature at which solidification ends) lower than the composite process process temperature of the polyamide resin (A). Preferably, the solidus temperature of the low melting point metal is 20 ° C or more lower than the process process temperature of the polyamide resin (A) in terms of the composite manufacturing process and the network formation between the fillers, and the stability is about 100 ° C or more higher than the composite use environment. Good in terms of Preferably, tin / copper (90 to 99/1 to 10 weight ratio) and tin / copper / silver (90 to 96/3 to 8/1 to 3 weight ratio) may be used as the melting point of about 300 ° C. or less.
상기 금속 필러의 형태는 금속분, 금속비드, 금속 섬유, 금속 플레이크, 금속 코팅된 입자 및 금속 코팅된 섬유 등이 사용될 수 있으며, 반드시 이에 제한되는 것은 아니다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. The metal filler may be formed of metal powder, metal beads, metal fibers, metal flakes, metal coated particles, metal coated fibers, and the like, but are not limited thereto. These can be used individually or in mixture of 2 or more types.
금속 필러의 형태를 금속분 혹은 금속 비드 형태로 사용할 경우, 평균입경이 30 내지 300 ㎛일 수 있다. 상기 범위에서 압출시 feeding이 잘 되는 장점이 있다.When using the form of the metal filler in the form of metal powder or metal beads, the average particle diameter may be 30 to 300 ㎛. There is an advantage that feeding is good when extrusion in the above range.
금속 필러의 형태를 금속 섬유 형태로 사용할 경우, 약 50 내지 500 mm의 길이 및 약 10 내지 100 ㎛의 직경 범위를 가질 수 있다. 또한, 상기 금속 섬유는 밀도를 약 0.7 ∼ 6.0 g/ml 인 것을 사용할 수 한다. 상기 범위에서 압출가공 중 적정한 feeding을 유지할 수 있다.When the form of the metal filler is used in the form of a metal fiber, it may have a length of about 50 to 500 mm and a diameter range of about 10 to 100 μm. In addition, the metal fiber may be used having a density of about 0.7 to 6.0 g / ml. It is possible to maintain proper feeding during the extrusion process in the above range.
금속 필러의 형태를 금속 플레이크 형태로 사용할 경우, 평균 크기가 약 50 내지 500 ㎛일 수 있다. 상기 범위에서 압출가공 중 적정한 feeding을 유지할 수 있는 장점이 있다. When the form of the metal filler is used in the form of metal flakes, the average size may be about 50 to 500 μm. There is an advantage in maintaining the proper feeding during the extrusion processing in the above range.
상기 금속분, 금속비드, 금속 섬유 등은 단일금속 혹은 2종 이상의 합금일 수도 있으며, 다층 구조를 가질 수 있다. The metal powder, metal beads, metal fibers, etc. may be a single metal or an alloy of two or more kinds, and may have a multilayer structure.
상기 금속 코팅된 입자 및 금속 코팅된 섬유는 수지, 세라믹, 금속, 탄소 등의 성분이 코어를 이루고 상기 코어를 금속이 코팅한 형태이다. 예컨대, 수지 기재의 미립자나 섬유에 니켈, 니켈-구리 등의 금속이 코팅된 형태일 수 있으며, 금속 코팅은 단층이거나 다층일 수 있다. The metal-coated particles and the metal-coated fibers form a core of a resin, ceramic, metal, carbon, and the like, and the core is coated with metal. For example, the resin-based fine particles or fibers may be coated with a metal such as nickel or nickel-copper, and the metal coating may be a single layer or a multilayer.
구체예에서 상기 금속 코팅된 입자는 평균입경이 약 30 내지 300 ㎛일 수 있다. 상기 범위에서 압출시 feeding이 잘 되는 장점이 있다. 또한 상기 금속 코팅된 섬유는 평균직경이 약 10 내지 100 ㎛이며, 약 50 내지 500 mm의 길이를 가질 수 있다. 상기 범위에서 압출가공 중 적정한 feeding을 유지할 수 있는 장점이 있다. In embodiments, the metal coated particles may have an average particle diameter of about 30 to 300 ㎛. There is an advantage that feeding is good when extrusion in the above range. In addition, the metal-coated fibers may have an average diameter of about 10 to 100 μm and a length of about 50 to 500 mm. There is an advantage in maintaining the proper feeding during the extrusion processing in the above range.
본 발명에서 상기 금속 필러(C)는 (A)+(B)+(C) 성분 중 약 1 내지 20 중량%, 바람직하게는 약 3 내지 15 중량%로 사용될 수 있다. 만일 금속 필러(C)가 1 중량% 미만일 경우, 전도성이 저하되고, 금속 필러(C)의 함량이 20 중량%를 초과할 경우,유동성이 저하되고 충격강도 및 굴곡 모듈러스가 떨어질 수 있다.In the present invention, the metal filler (C) may be used in about 1 to 20% by weight, preferably about 3 to 15% by weight of the component (A) + (B) + (C). If the metal filler (C) is less than 1% by weight, the conductivity is lowered, and when the content of the metal filler (C) is more than 20% by weight, the fluidity may be lowered and the impact strength and the bending modulus may fall.
한 구체예에서는 상기 (B)성분과 (C)성분 간 중량 비율은 (B):(C) = 6 : 1 ~20: 1로 사용될 수 있다. 상기 범위에서 우수한 물성 발란스를 얻을 수 있다. In one embodiment, the weight ratio between the component (B) and the component (C) may be used as (B) :( C) = 6: 1∼20: 1. Excellent physical property balance can be obtained in the above range.
상기 조성물은 탄소나노튜브를 더 포함할 수 있다. 상기 탄소나노튜브는 단일벽, 이중벽, 다중벽 어느 것이든 사용할 수 있으며, 이들의 조합도 적용될 수 있다. 바람직하게는 다중벽 탄소나노튜브이다. 상기 탄소나노튜브를 함유할 경우 표면저항이 현저히 저하되며, 보다 우수한 전자파 차폐성능과 강성을 가질 수 있다. 상기 탄소나노튜브는 (A)+(B)+(C) 100 중량부에 대하여 약 0 초과 20 중량부 이하의 범위로 포함될 수 있다. 상기 범위에서 우수한 유동성 및 강성과 전자파 차폐 성능을 가질 수 있다. 바람직하게는 약 1 내지 15 중량부, 더욱 바람직하게는 약 1 내지 10 중량부이다. The composition may further include carbon nanotubes. The carbon nanotubes may be used for any of single walls, double walls, and multiple walls, and a combination thereof may be applied. Preferably it is a multi-walled carbon nanotube. When the carbon nanotubes are contained, the surface resistance is significantly lowered, and thus the electromagnetic wave shielding performance and rigidity may be more excellent. The carbon nanotubes may be included in the range of about 0 to 20 parts by weight or less based on 100 parts by weight of (A) + (B) + (C). It can have excellent fluidity and rigidity and electromagnetic shielding performance in the above range. It is preferably about 1 to 15 parts by weight, more preferably about 1 to 10 parts by weight.
상기 조성물은 금속코팅된 흑연을 더 포함할 수 있다.상기 금속코팅된 흑연은 입자, 섬유, 플레이크, 무정형 또는 이들의 조합된 형상을 가질 수 있다. 상기 금속코팅된 흑연이 섬유형상을 가질 경우 카본섬유와 함께 네트워크 구조를 형성할 수 있다. 이와 같이 금속코팅된 흑연을 함유할 경우 표면저항이 현저히 저하되며, 보다 우수한 전자파 차폐성능과 강성을 가질 수 있다. The composition may further include metal coated graphite. The metal coated graphite may have particles, fibers, flakes, amorphous or a combination thereof. When the metal-coated graphite has a fiber shape, it may form a network structure with carbon fibers. When the metal-coated graphite is thus contained, the surface resistance is remarkably reduced, and it may have more excellent electromagnetic shielding performance and rigidity.
상기 금속코팅된 흑연은 평균 입경이 약 10 내지 200 ㎛일 수 있다. 또한 상기 금속코팅된 흑연이 섬유형상을 가질 경우, 평균 직경은 약 10 내지 200 ㎛이고, 평균 길이는 약 15 내지 100 ㎛인 것이 바람직하다. 상기 범위에서 전기전도성이 우수하면서도 첨가에 의한 기계적 물성의 저하가 적은 장점이 있다. The metal-coated graphite may have an average particle diameter of about 10 to 200 ㎛. In addition, when the metal-coated graphite has a fibrous shape, the average diameter is preferably about 10 to 200 μm, and the average length is about 15 to 100 μm. While excellent in electrical conductivity in the above range, there is an advantage that the decrease in mechanical properties by addition.
구체예에서 상기 금속은 전도성을 갖는 금속이라면 어느 것이든 사용될 수 있다. 바람직하게는 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트 등이 사용될 수 있으며, 이들의 2종 이상 합금도 적용될 수 있다. In embodiments, the metal may be used as long as the metal is conductive. Preferably, aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt and the like may be used, and two or more kinds thereof may also be applied.
또한 상기 금속 코팅은 단일층 뿐만 아니라, 2 이상의 복수층으로도 형성될 수 있다. In addition, the metal coating may be formed of not only a single layer but also two or more layers.
구체예에서 상기 금속코팅된 흑연은 (A)+(B)+(C) 100 중량부에 대하여 약 10 중량부 이하의 범위로 포함될 수 있다. 바람직하게는 약 0.1 내지 7중량부이다. In embodiments, the metal-coated graphite may be included in the range of about 10 parts by weight or less based on 100 parts by weight of (A) + (B) + (C). Preferably it is about 0.1-7 weight part.
또 다른 구체예에서는 상기 금속코팅된 흑연은 탄소나노튜브와 함께 적용할 수 있으며, 이때 금속코팅된 흑연의 함량은 (A)+(B)+(C) 100 중량부에 대하여 약 0.1 내지 3 중량부로 적용될 수 있다. 상기 범위에서 우수한 유동성 및 강성과 전자파 차폐 성능을 가질 수 있다. In another embodiment, the metal-coated graphite may be applied together with carbon nanotubes, wherein the metal-coated graphite content is about 0.1 to 3 parts by weight based on 100 parts by weight of (A) + (B) + (C). Can be applied to wealth. It can have excellent fluidity and rigidity and electromagnetic shielding performance in the above range.
또한, 본 발명의 조성물은 난연제, 가소제, 커플링제, 열안정제, 광안정제, 무기필러, 이형제, 분산제, 적하방지제, 탄소필러, 내후안정제 등의 첨가제를 통상의 범위로 첨가할 수 있다. 이들은 단독 또는 2종 이상 혼합하여 사용될 수 있다. 상기 탄소 필러로는 상기 카본섬유(B)를 제외한 다양한 탄소필러들이 적용될 수 있다. 구체예로는, 흑연, 탄소나노튜브, 카본 블랙 등이 포함될 수 있으며, 이들의 금속 코팅물도 포함될 수 있다. 예를 들면 앞서 설명한 금속코팅된 흑연도 포함될 수 있다.In the composition of the present invention, additives such as a flame retardant, a plasticizer, a coupling agent, a thermal stabilizer, a light stabilizer, an inorganic filler, a mold release agent, a dispersant, an antidropping agent, a carbon filler, and a weathering stabilizer may be added in a conventional range. These can be used individually or in mixture of 2 or more types. As the carbon filler, various carbon fillers except for the carbon fiber (B) may be applied. Specific examples may include graphite, carbon nanotubes, carbon black, and the like, and metal coatings thereof may also be included. For example, the metal-coated graphite described above may also be included.
하나의 구체예에서는 상기 조성물은 ASTM D638에 의한 3.2 mm 두께에서 인장강도가 약 40 GPa 이상이며, ASTM D790에 의한 6.4 mm 두께에서 굴곡 모듈러스가 약 40 GPa 이상이며, 1 GHz, 1 mm 두께에서 EMI D790 규격에 의한 차폐효과가 약 50 dB 이상이고, 1 mm 두께의 시편에 대해 4점 프로브 방법에 의한 체적저항이 약 0.2 Ω·cm 이하이며, 성형품에 대하여 550℃/1hr 후 100개를 추출하여 측정한 잔류섬유길이의 평균값이 약 2 내지 6 mm 일 수 있다. In one embodiment the composition has a tensile strength of at least about 40 GPa at 3.2 mm thickness according to ASTM D638, a flexural modulus of at least about 40 GPa at 6.4 mm thickness according to ASTM D790, EMI at 1 GHz, 1 mm thickness The shielding effect according to D790 standard is about 50 dB or more, the volume resistivity by the 4-point probe method is about 0.2 Ω · cm or less for specimens of 1 mm thickness, and 100 pieces are extracted after 550 ℃ / 1hr. The average value of the measured residual fiber length may be about 2 to 6 mm.
다른 구체예에서는 상기 조성물은 ASTM D638에 의한 3.2 mm 두께에서 인장강도가 약 315~420 MPa 이며, ASTM D790에 의한 6.4 mm 두께에서 굴곡 모듈러스가 약 40~55 GPa 이며, 1 GHz, 1 mm 두께에서 EMI D790 규격에 의한 차폐효과가 약 53~85 dB 이고, 1 mm 두께의 시편에 대해 4점 프로브 방법에 의한 체적저항이 약 0.05~0.18 Ω·cm 이며, 성형품에 대하여 550℃/1hr 후 100개를 추출하여 측정한 잔류섬유길이의 평균값이 약 3.0 내지 6 mm 일 수 있다. In another embodiment the composition has a tensile strength of about 315-420 MPa at a thickness of 3.2 mm by ASTM D638, a flexural modulus of about 40-55 GPa at a thickness of 6.4 mm by ASTM D790, and a thickness of 1 GHz, 1 mm. The shielding effect according to the EMI D790 standard is about 53 ~ 85 dB, the volume resistance by the 4-point probe method is about 0.05 ~ 0.18 Ω · cm for 1 mm thick specimens, and 100 pieces after 550 ℃ / 1hr for the molded product. The average value of the residual fiber length measured by extracting may be about 3.0 to 6 mm.
본 발명의 다른 관점은 상기 조성물로부터 제조된 성형품에 관한 것이다. 구체예에서 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지에 (B) 카본섬유와 (C) 금속 필러가 분산된 구조를 가질 수 있다. Another aspect of the invention relates to a molded article made from the composition. In an embodiment, the molded article may have a structure in which (B) carbon fibers and (C) metal filler are dispersed in a polyamide resin (A) containing an aromatic group in a main chain.
구체예에서 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지와 (C) 금속 필러를 용융시키고; 상기 용융물에 (B) 카본섬유를 통과시켜 함침한 후 커팅하여 펠렛화하고; 그리고 상기 펠렛을 성형하는 단계를 포함하여 제조될 수 있다. 구체예에서는 상기 펠렛화는 상기 함침된 카본섬유를 커팅하여 펠렛화할 수 있다. 상기 용융은 폴리아미드 수지를 용융할 수 있는 정도의 온도이며, 따라서, 상기 용융물에는 폴리아미드에 금속 필러가 분산되어 있을 수 있다. In an embodiment, the molded article comprises (A) melting a polyamide resin containing an aromatic group in a main chain and (C) a metal filler; (B) impregnated by passing the carbon fiber through the melt and then cut and pelletized; And it may be prepared including the step of molding the pellets. In embodiments, the pelletization may be pelletized by cutting the impregnated carbon fibers. The melting is a temperature at which the polyamide resin can be melted. Therefore, the metal filler may be dispersed in the polyamide in the melt.
상기 카본 섬유는 번들 형태를 가질 수 있다. The carbon fiber may have a bundle form.
구체예에서는 주쇄에 방향족기를 함유하는 폴리아미드 수지(A)와 금속 필러(C)를 먼저 압출기에 투입하여 용융시킨 후, 카본섬유(B)를 투입하여 함침시킬 수도 있다. In the specific example, the polyamide resin (A) and the metal filler (C) containing an aromatic group in the main chain may be first introduced into the extruder and melted, and then carbon fiber (B) may be added and impregnated.
바람직한 구체예에서, 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지와 (C) 금속 필러를 압출기에 투입하고 1차 펠렛화하여 복합수지 펠렛을 제조하고; 상기 복합수지 펠렛을 용융시키고; 상기 복합수지 펠렛에 (B) 카본섬유를 통과시켜 함침한 후 2차 펠렛화하고; 그리고 상기 카본 섬유가 함침된 2차 펠렛을 성형하는 단계를 포함하여 제조 될 수 있다.In a preferred embodiment, the molded article is (A) polyamide resin containing an aromatic group in the main chain and (C) a metal filler in an extruder and the first pelletized to produce a composite resin pellet; Melting the composite resin pellets; (B) impregnating the composite resin pellets by passing carbon fibers and then pelletizing them; And it may be prepared including the step of molding the carbon pellet impregnated secondary pellets.
상기 함침된 혼합물은 긴 섬유의 형태로 압출한 후 일정한 크기로 커팅하여 펠렛화할 수 있다. 구체예에서는 약 8 내지 20 mm, 바람직하게는 약 10 내지 15 mm의 길이로 커팅하여 펠렛화할 수 있다. 상기 범위에서 장섬유의 카본섬유의 형태가 유지되어 우수한 차폐성과 강도를 얻을 수 있다. The impregnated mixture may be extruded in the form of long fibers and then cut into pellets to pelletize. In embodiments it may be pelletized by cutting to a length of about 8 to 20 mm, preferably about 10 to 15 mm. The shape of the carbon fiber of the long fiber is maintained in the above range can be obtained excellent shielding properties and strength.
상기 제조된 펠렛은 사출성형, 압축성형, 캐스팅성형 등을 통해 다양한 형태로 제조될 수 있다. The prepared pellets may be manufactured in various forms through injection molding, compression molding, casting molding, and the like.
이러한 성형과정을 통해 번들 형태를 갖는 카본 섬유는 서로 분산되어 최종 성형품 내에서 섬유들이 네트워크 형상으로 분산되어 있을 수 있다. 여기에서 네트워크 형상은 섬유들이 다수의 접촉점을 형성하여 섬유와 섬유간 서로 연결된 형태를 의미한다. Through such a molding process, the carbon fibers having a bundle shape may be dispersed with each other so that the fibers may be dispersed in a network shape in the final molded product. Here, the network shape refers to a form in which the fibers form a plurality of contact points and are connected to each other.
상기 카본 섬유는 성형을 거친후 일부가 컷팅될 수 있다. 구체예에서 상기 성형품 내에는 약 0.5 내지 6mm 의 길이를 갖는 카본 섬유가 네트워크 형상으로 분산되어 있을 수 있다. 상기 약 0.5 내지 6mm 의 길이를 갖는 카본 섬유는 전체 카본섬유중 약 80중량%이상, 구체예에서는 약 90 중량% 이상이다. 또한, 성형품에 대하여 550℃에서 1시간 후 잔류 섬유길이를 100개 추출하여 길이 방향으로 길이를 측정하여 평균값이 약 2mm 이상일 수 있다. The carbon fiber may be partially cut after the molding. In an embodiment, the carbon fiber having a length of about 0.5 to 6 mm may be dispersed in a network shape in the molded article. The carbon fiber having a length of about 0.5 to 6 mm is at least about 80% by weight, in embodiments at least about 90% by weight of the total carbon fiber. In addition, after 1 hour at 550 ℃ for the molded article 100 residual fiber length is extracted to measure the length in the longitudinal direction may have an average value of about 2mm or more.
구체예에서는 상기 성형품은 우수한 전자파 차폐성과 전도성, 기계적 물성, 성형성을 가지므로 휴대용 디스플레이 제품의 LCD 보호용 브라켓에 바람직하게 적용될 수 있다. In the exemplary embodiment, the molded article has excellent electromagnetic shielding properties, conductivity, mechanical properties, and moldability, and thus may be preferably applied to the LCD protective bracket of a portable display product.
이하, 본 발명의 바람직한 실시예를 통해 본 발명의 구성 및 작용을 더욱 상세히 설명하기로 한다. 다만, 이는 본 발명의 바람직한 예시로 제시된 것이며 어떠한 의미로도 이에 의해 본 발명이 제한되는 것으로 해석될 수는 없다. Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. However, this is presented as a preferred example of the present invention and in no sense can be construed as limiting the present invention.
여기에 기재되지 않은 내용은 이 기술 분야에서 숙련된 자이면 충분히 기술적으로 유추할 수 있는 것이므로 그 설명을 생략하기로 한다.Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.
실시예 Example
하기 실시예 및 비교실시예에서 사용된 각 성분의 사양은 다음과 같다: The specifications of each component used in the following Examples and Comparative Examples are as follows:
(A) 폴리아미드 수지 : 토요보에서 제조된 Nylon-MXD6인 Toyobo T-600를 사용하였다. (A) Polyamide resin: Toyobo T-600, a nylon-MXD6 manufactured by Toyobo, was used.
(A') 폴리아미드 수지 : ARKEMA에서 제조된 PA 11을 사용하였다. (A ′) polyamide resin: PA 11 made from ARKEMA was used.
(B) 카본섬유: Toray에서 제조된 Toray TORAYCA T700S 50C, 1650TEX 을 사용하였다. (B) Carbon fiber: Toray TORAYCA T700S 50C, 1650TEX manufactured by Toray was used.
(B') 카본섬유: 평균직경이 7 ㎛ 이고 길이가 6mm의 Zoltek에서 제조된 chopped 카본섬유를 사용하였다. (B ′) Carbon fiber: A chopped carbon fiber manufactured by Zoltek having an average diameter of 7 μm and a length of 6 mm was used.
(C) 금속 필러 (C) metal filler
(C1)micro stainless steel fiber : (주)미래소재에서 제조된 MSF150 (Fe-Cr-Ni가 65-15-10인 금속 단섬유)를 사용하였다. (C1) micro stainless steel fiber: MSF150 (short metal fiber with 65-15-10 Fe-Cr-Ni) manufactured by Mirae Materials Co., Ltd. was used.
(C2)저융점 300 ℃ 이하인 금속분 : 워튼 메탈사(Warton metals Limited)에서 제조된 97C(97% Sn, 2.5% Cu로서 Powder type 주석-구리 합금류)를 사용하였다. (C2) Low melting point 300 ℃ or less metal powder: 97C (97% Sn, 2.5% Cu as powder type tin-copper alloys) manufactured by Warton Metals Limited was used.
(D) 금속코팅흑연: Ni-coated graphite 로서 Sulzer사의 2805(Ni : 75 wt%, graphite : 25 wt%)를 사용하였다.(D) Metal-coated graphite: Sulzer 2805 (Ni: 75 wt%, graphite: 25 wt%) was used as Ni-coated graphite.
(E) Carbon Nano Tube : Nanocyl사의 NC7000(다중벽 CNT)를 사용하였다.(E) Carbon Nano Tube: NC7000 (multi-wall CNT) manufactured by Nanocyl was used.
실시예 1~8Examples 1-8
폴리아미드 수지, 금속 필러, 기타 하기 표 1에 나타난 첨가제를 통상의 혼합기에서 혼합하고 L/D=35, Φ=45mm인 이축 압출기를 이용하여 압출한 후, 압출물을 펠렛 형태로 제조하였다. 상기 펠렛을 장축 압출기를 이용하여 용융시킨 후 이를 pultrusion방식으로 카본섬유(B)를 함침시켜 길이 12mm의 롱펠렛으로 커팅하여 카본 섬유의 길이를 12mm으로 제조하였다. 사출온도 270℃에서 물성 측정 및 EMI·저항성 등 응용 평가를 위한 시편을 장섬유 전용 사출기를 이용하여 제조하였다. 이들 시편은 23℃, 상대습도 50%에서 48시간 방치한 후 하기의 방법으로 물성을 평가하였으며, 그 결과는 표 1에 나타내었다. Polyamide resin, metal filler, and other additives shown in Table 1 were mixed in a conventional mixer and extruded using a twin screw extruder having L / D = 35 and Φ = 45 mm, and then the extrudate was prepared in pellet form. The pellets were melted using a long-screw extruder, and impregnated with carbon fibers (B) by a pultrusion method, and cut into long pellets having a length of 12 mm to prepare a carbon fiber having a length of 12 mm. Specimens for measuring physical properties and evaluating applications such as EMI and resistance at the injection temperature of 270 ° C were prepared using a long fiber injection machine. After the specimens were allowed to stand for 48 hours at 23 ° C. and 50% relative humidity, the physical properties were evaluated by the following method, and the results are shown in Table 1.
평가방법: Evaluation method :
(1) 인장강도: ASTM D638 에 의해 5 mm/min 조건으로 평가하였으며, 단위는 MPa이다.(1) Tensile strength: evaluated by ASTM D638 at 5 mm / min conditions, the unit is MPa.
(2) 굴곡모듈러스 : ASTM D790 에 의해 1.27 mm/min 조건으로 평가하였으며, 단위는 GPa이다.(2) Flexural modulus: evaluated at 1.27 mm / min by ASTM D790, and the unit is GPa.
(3) EMI 차폐성(dB): 샘플을 23℃, 상대 습도 50% 하에 48 시간 동안 방치한 후, EMI D790 에 준하여 1GHz에서 1 mm 두께의 샘플(6X6)에 대한 전자파 차폐 성능을 측정하였다. (3) EMI shielding (dB): After leaving the sample for 48 hours at 23 ° C., 50% relative humidity, the electromagnetic shielding performance of the 1 mm thick sample (6 × 6) at 1 GHz was measured according to EMI D790.
(4) 체적저항: 4point probe 방법으로 평가하였다(Ω·cm). (4) Volume resistance: It was evaluated by the 4-point probe method (Ωcm).
(5) 강열감량후 잔류 섬유 길이(mm): 550℃/1hr 후 잔류 섬유길이를 100개 추출하여 길이 방향으로 길이를 측정하여 길이에 대한 산술 평균값으로 하였다. (5) Residual fiber length (mm) after ignition loss: 100 residual fiber lengths were extracted after 550 ° C./1hr, and the length was measured in the longitudinal direction to be an arithmetic mean value for the length.
비교예 1~5Comparative Examples 1 to 5
비교예 1~3은 각 성분의 조성을 하기 표 2와 같이 변경한 것을 제외하고는 상기 실시예 1과 동일하게 수행하였다. Comparative Examples 1 to 3 were carried out in the same manner as in Example 1 except for changing the composition of each component as shown in Table 2 below.
비교예 4는 pultrusion방식으로 카본섬유를 함침시킨후 펠렛길이를 6mm로 커팅하여 카본 섬유의 길이를 6mm로 한 것을 제외하고는 실시예 1과 동일하게 수행한 것이다. Comparative Example 4 was carried out in the same manner as in Example 1 except that the length of the carbon fiber to 6mm by cutting the pellet length to 6mm after impregnating the carbon fiber by the pultrusion method.
비교예 5는 폴리아미드 수지, chopped 카본섬유(B') 및 금속 필러를 하기 표 1에 나타난 함량으로 통상의 혼합기에서 혼합하고 L/D=35, Φ=45mm인 이축 압출기를 이용하여 압출하여 펠렛 형태로 제조한 다음, 사출온도 270℃에서 물성 측정 및 EMI·저항성 등 응용 평가를 위한 시편을 제조한 것을 제외하고는 실시예 1과 동일한 방법으로 물성을 평가하였다. In Comparative Example 5, polyamide resin, chopped carbon fiber (B ') and metal filler were mixed in a conventional mixer with the contents shown in Table 1 below, and extruded using a twin screw extruder having L / D = 35 and Φ = 45 mm to pellet After the preparation in the form, the physical properties were evaluated in the same manner as in Example 1 except that a specimen for measuring the physical properties and the evaluation of the application, such as EMI and resistance at the injection temperature of 270 ℃.
표 1
실시예
1 2 3 4 5 6 7 8
(A)PA 30 25 30 20 15 20 20 20
(A')PA - - - - - - - -
(B)카본섬유 65 65 65 75 80 75 75 75
(B')카본섬유(chopped) - - - - - - - -
(C)금속 필러 C1 5 10 - 5 5 5 5 5
C2 - - 5 - - - - -
(D) 금속코팅흑연 - - - - - 3 - 3
(E) CNT - - - - - - 1 1
펠렛 길이(mm) 12 12 12 12 12 12 12 12
인장강도 318 320 319 343 381 352 345 352
굴곡모듈러스 45 42 41 43 41 44 43 44
EMI 차폐성(dB) 53 59 54 65 71 67 66 68
저항(Ω·cm) 0.15 0.12 0.17 0.16 0.14 0.12 0.12 0.10
비중 1.48 1.48 1.48 1.49 1.49 1.50 1.49 1.50
강열감량후 잔류섬유길이(mm) 3.4 3.3 3.1 3.6 3.5 3.5 3.6 3.4
Table 1
Example
One 2 3 4 5 6 7 8
(A) PA 30 25 30 20 15 20 20 20
(A ') PA - - - - - - - -
(B) carbon fiber 65 65 65 75 80 75 75 75
(B ') chopped carbon fiber - - - - - - - -
(C) metal filler C1 5 10 - 5 5 5 5 5
C2 - - 5 - - - - -
(D) metal coated graphite - - - - - 3 - 3
(E) CNT - - - - - - One One
Pellet length (mm) 12 12 12 12 12 12 12 12
The tensile strength 318 320 319 343 381 352 345 352
Flexural Modulus 45 42 41 43 41 44 43 44
EMI shielding (dB) 53 59 54 65 71 67 66 68
Resistance (Ωcm) 0.15 0.12 0.17 0.16 0.14 0.12 0.12 0.10
importance 1.48 1.48 1.48 1.49 1.49 1.50 1.49 1.50
Length of residual fiber after ignition loss (mm) 3.4 3.3 3.1 3.6 3.5 3.5 3.6 3.4
표 2
비교예
1 2 3 4 5
(A)PA 35 - 55 30 30
(A')PA - 30 - - -
(B)카본섬유 65 65 40 65 -
(B')카본섬유(chopped) - - - - 65
(C)금속 필러 C1 - 5 5 5 5
C2 - - - - -
(D) 금속코팅흑연 - - - - -
(E) CNT - - - - -
펠렛 길이(mm) 12 12 12 6 6
인장강도 319 290 270 291 280
굴곡모듈러스 47 35 31 35 33
EMI 차폐성(dB) 54 51 38 41 35
저항(Ω·cm) 0.31 0.14 0.20 0.25 0.23
비중 1.48 1.43 1.47 1.48 1.47
강열감량후 잔류섬유길이(mm) 3.3 3.3 3.2 1.4 0.8
TABLE 2
Comparative example
One 2 3 4 5
(A) PA 35 - 55 30 30
(A ') PA - 30 - - -
(B) carbon fiber 65 65 40 65 -
(B ') chopped carbon fiber - - - - 65
(C) metal filler C1 - 5 5 5 5
C2 - - - - -
(D) metal coated graphite - - - - -
(E) CNT - - - - -
Pellet length (mm) 12 12 12 6 6
The tensile strength 319 290 270 291 280
Flexural Modulus 47 35 31 35 33
EMI shielding (dB) 54 51 38 41 35
Resistance (Ωcm) 0.31 0.14 0.20 0.25 0.23
importance 1.48 1.43 1.47 1.48 1.47
Length of residual fiber after ignition loss (mm) 3.3 3.3 3.2 1.4 0.8
상기 표 1에 나타난 바와 같이 실시예 1, 4 및 5를 비교하면 고함량의 카본섬유를 사용하여 40GPa 이상의 굴곡모듈러스 및 50dB 이상의 EMI 차폐 효과 갖고 카본섬유의 함량이 많아질수록 더 증가함을 알 수 있다. 이는 카본섬유의 함량이 적은 비교예 3 보다 훨씬 높은 값임을 알 수 있다. 또한 비교예 2와 같이 방향족 폴리아미드가 아닐 경우 인장강도와 모듈러스가 현저히 떨어지는 것을 확인할 수 있다.Comparing Examples 1, 4 and 5 as shown in Table 1, it can be seen that the use of a high content of carbon fiber has a flexural modulus of 40 GPa or more and an EMI shielding effect of 50 dB or more and increases as the content of the carbon fiber increases. have. This can be seen that the content of the carbon fiber is much higher than the comparative example 3. In addition, when the aromatic polyamide is not as in Comparative Example 2, it can be seen that the tensile strength and modulus are significantly reduced.
실시예 1~8의 경우 금속 필러를 사용하여 높은 모듈러스 및 높은 EMI차폐효과 뿐만 아니라, 0.2Ω·cm이하의 낮은 체적저항을 갖는 반면, 금속 필러를 넣지 않은 비교예 1은 모듈러스와 EMI차폐효과는 비슷하나 저항값이 높음을 알 수 있다. In Examples 1 to 8, the metal filler was used to have a high modulus and a high EMI shielding effect, as well as a low volume resistivity of 0.2 Ω · cm or less, whereas Comparative Example 1 without the metal filler had a modulus and EMI shielding effect. It is similar but the resistance is high.
pultrusion방식으로 압출된 pellet길이 12mm의 장섬유보강 열가소성 수지인 실시예 1~5의 경우, 동일방식으로 압출된 6mm 카본섬유를 적용한 비교예 4에 비해 모듈러스 및 EMI차폐 효과·저항성 등 전반적으로 성능이 현저히 우수함을 알 수 있으며, 특히, 비교예 4는 강열감량 후 잔류한 섬유(ash)의 길이 또한 짧아져서 사출물에서의 네트워킹이 중요한 EMI 차폐성 및 전기 저항성에 큰 차이가 남을 알 수 있다. 또한 6mm의 일반 chopped CF를 사용한 비교예 5도 모듈러스 및 EMI차폐 효과·저항성이 현저히 저하된 것을 알 수 있다. In Examples 1 to 5, a long fiber reinforced thermoplastic resin having a pellet length of 12 mm extruded by pultrusion method, overall performance such as modulus, EMI shielding effect, and resistance was higher than that of Comparative Example 4 using 6 mm carbon fiber extruded in the same method. In particular, it can be seen that the comparative example 4, in particular, the length of the fibers (ash) remaining after the loss of ignition is also shortened so that there is a significant difference in EMI shielding and electrical resistance, which is important for networking in the injection molding. In addition, Comparative Example 5 using a 6mm general chopped CF also showed a significant decrease in modulus, EMI shielding effect and resistance.
이상 본 발명의 실시예들을 설명하였으나, 본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야 한다.Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be manufactured in various forms, and a person of ordinary skill in the art to which the present invention pertains has the technical idea of the present invention. However, it will be understood that other specific forms may be practiced without changing the essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (19)

  1. (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지 약 10 내지 34 중량%;(A) about 10 to 34% by weight of a polyamide resin containing an aromatic group in the main chain;
    (B) 카본섬유 약 65 내지 85 중량%; 및 (B) about 65 to 85 weight percent of carbon fibers; And
    (C) 금속 필러 약 1 내지 20 중량%;(C) about 1 to 20 weight percent of a metal filler;
    를 포함하여 이루어지는 것을 특징으로 하는 고강성 전자파 차폐 조성물.High-rigidity electromagnetic shielding composition comprising a.
  2. 제1항에 있어서, 상기 (A) 폴리아미드 수지는 전방향족 폴리아미드, 반방향족 폴리아미드 또는 이들의 혼합물인 것을 특징으로 하는 고강성 전자파 차폐 조성물.The highly rigid electromagnetic shielding composition according to claim 1, wherein the polyamide resin (A) is a wholly aromatic polyamide, a semi-aromatic polyamide or a mixture thereof.
  3. 제2항에 있어서, 상기 반방향족 폴리아미드는 방향족 디아민과 지방족 디카르복실산의 중합체인 것을 특징으로 하는 고강성 전자파 차폐 조성물.3. The highly rigid electromagnetic shielding composition of claim 2, wherein the semiaromatic polyamide is a polymer of aromatic diamine and aliphatic dicarboxylic acid.
  4. 제3항에 있어서, 상기 반방향족 폴리아미드는 하기 화학식 1로 표시되는 것을 특징으로 하는 고강성 전자파 차폐 조성물:According to claim 3, The semi-aromatic polyamide is a highly rigid electromagnetic shielding composition, characterized in that represented by the formula
    <화학식 1><Formula 1>
    Figure PCTKR2010009244-appb-I000004
    Figure PCTKR2010009244-appb-I000004
    상기에서 Ar은 방향족기이며, R은 C4~20의 알킬렌기이고, n은 50 내지 500의 정수임.Ar is an aromatic group, R is a C 4-20 alkylene group, n is an integer of 50 to 500.
  5. 제1항에 있어서, 상기 (B) 카본섬유는 번들 형태를 포함하는 것을 특징으로 하는 고강성 전자파 차폐 조성물. The high stiffness electromagnetic shielding composition according to claim 1, wherein the carbon fiber (B) comprises a bundle form.
  6. 제1항에 있어서, 상기 (C) 금속 필러는 금속분, 금속비드, 금속 섬유, 금속 플레이크, 금속 코팅된 입자 및 금속 코팅된 섬유로 이루어진 군에서 1종 이상 포함하는 것을 특징으로 하는 고강성 전자파 차폐 조성물.The highly rigid electromagnetic shielding of claim 1, wherein the metal filler (C) comprises at least one selected from the group consisting of metal powder, metal beads, metal fibers, metal flakes, metal coated particles, and metal coated fibers. Composition.
  7. 제1항에 있어서, 상기 (C) 금속 필러는 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트 및 이들의 2종 이상 합금으로 이루어진 군으로부터 1종 이상 선택되는 것을 특징으로 하는 고강성 전자파 차폐 조성물.The metal filler of claim 1, wherein the metal filler (C) is selected from the group consisting of aluminum, stainless steel, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt and two or more alloys thereof. Highly rigid electromagnetic shielding composition, characterized in that at least one selected.
  8. 제1항에 있어서, 상기 조성물은 (A)+(B)+(C) 100 중량부에 대하여 탄소나노튜브를 약 0 초과 20 중량부 이하의 범위로 더 포함하는 것을 특징으로 하는 고강성 전자파 차폐 조성물.According to claim 1, wherein the composition (A) + (B) + high rigidity electromagnetic shielding further comprises a carbon nanotube in the range of about 0 to 20 parts by weight or less based on 100 parts by weight Composition.
  9. 제8항에 있어서, 상기 조성물은 금속코팅된 흑연을 더 포함하는 것을 특징으로 하는 고강성 전자파 차폐 조성물.The high stiffness electromagnetic shielding composition of claim 8, wherein the composition further comprises metal-coated graphite.
  10. 제9항에 있어서, 상기 금속코팅된 흑연은 입자, 섬유, 플레이크, 무정형 또는 이들의 조합된 형상을 갖는 것을 특징으로 하는 고강성 전자파 차폐 조성물.10. The highly rigid electromagnetic shielding composition of claim 9, wherein the metal-coated graphite has particles, fibers, flakes, amorphous, or a combination thereof.
  11. 제10항에 있어서, 상기 금속코팅된 흑연은 평균 입경이 약 10 내지 200 ㎛인 고강성 전자파 차폐 조성물.The highly rigid electromagnetic shielding composition of claim 10, wherein the metal-coated graphite has an average particle diameter of about 10 to 200 μm.
  12. 제9항에 있어서, 상기 금속은 알루미늄, 스테인레스, 철, 크롬, 니켈, 블랙니켈, 구리, 은, 금, 백금, 팔라듐, 주석, 코발트 및 이들의 2종 이상 합금으로 이루어진 군으로부터 1종 이상 선택되는 것을 특징으로 하는 고강성 전자파 차폐 조성물.The method of claim 9, wherein the metal is at least one selected from the group consisting of aluminum, stainless, iron, chromium, nickel, black nickel, copper, silver, gold, platinum, palladium, tin, cobalt and two or more alloys thereof. Highly rigid electromagnetic shielding composition, characterized in that.
  13. 제1항에 있어서, 상기 조성물은 난연제, 가소제, 커플링제, 열안정제, 광안정제, 무기필러, 이형제, 분산제, 적하방지제, 탄소필러 및 내후안정제로 이루어진 군으로부터 선택된 하나 이상의 첨가제를 더 포함하는 것을 특징으로 하는 고강성 전자파 차폐 조성물.The method of claim 1, wherein the composition further comprises at least one additive selected from the group consisting of flame retardants, plasticizers, coupling agents, thermal stabilizers, light stabilizers, inorganic fillers, mold release agents, dispersants, anti-drip agents, carbon fillers and weather stabilizers. High-strength electromagnetic shielding composition characterized in that.
  14. 제1항에 있어서, 상기 조성물은 ASTM D638에 의한 3.2 mm 두께에서 인장강도가 약 40 GPa 이상이며, ASTM D790에 의한 6.4 mm 두께에서 굴곡 모듈러스가 40 GPa 이상이며, 1 GHz, 1 mm 두께에서 EMI D790 규격에 의한 차폐효과가 약 50 dB 이상이고, 1 mm 두께의 시편에 대해 4점 프로브 방법에 의한 체적저항이 약 0.2 Ω·cm 이하이며, 성형품에 대하여 550℃/1hr 후 100개를 추출하여 측정한 잔류섬유길이가 약 2 내지 6 mm 인 것을 특징으로 하는 고강성 전자파 차폐 조성물.The composition of claim 1 wherein the composition has a tensile strength of at least about 40 GPa at a thickness of 3.2 mm by ASTM D638, a flexural modulus of at least 40 GPa at a thickness of 6.4 mm by ASTM D790, and EMI at 1 GHz, 1 mm thick. The shielding effect according to D790 standard is about 50 dB or more, the volume resistance by the 4-point probe method is about 0.2 0.2 · cm or less for specimens of 1 mm thickness, and 100 pieces are extracted after 550 ℃ / 1hr. The high rigidity electromagnetic shielding composition, characterized in that the measured residual fiber length is about 2 to 6 mm.
  15. 제1항 내지 제14항중 어느 한 항의 조성물로부터 제조되며, (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지에 (B) 카본섬유와 (C) 금속 필러가 분산된 구조를 가지는 성형품.A molded article prepared from the composition according to any one of claims 1 to 14, wherein the molded article has a structure in which (A) carbon fibers and (C) metal filler are dispersed in a polyamide resin containing (A) an aromatic group in its main chain.
  16. 제15항에 있어서, 상기 성형품은 휴대용 디스플레이 제품의 LCD 보호용 브라켓인 것을 특징으로 하는 성형품.The molded article of claim 15, wherein the molded article is an LCD protective bracket of a portable display product.
  17. 제15항에 있어서, 상기 성형품은 (A) 주쇄에 방향족기를 함유하는 폴리아미드 수지와 (C) 금속 필러를 용융시키고; 상기 용융물에 (B) 카본섬유를 통과시켜 함침한 후 커팅하여 펠렛화하고; 그리고 상기 펠렛을 성형하는 단계를 포함하여 제조된 것을 특징으로 하는 성형품. The molded article according to claim 15, wherein the molded article comprises: (A) melting a polyamide resin containing an aromatic group in a main chain and (C) a metal filler; (B) impregnated by passing the carbon fiber through the melt and then cut and pelletized; And molding the pellets.
  18. 제17항에 있어서, 상기 펠렛은 약 8 내지 20 mm의 길이를 갖는 것을 특징으로 하는 성형품. 18. The molded article of claim 17, wherein the pellets have a length of about 8 to 20 mm.
  19. 제15항에 있어서, 상기 성형품은 약 0.5 내지 6mm의 잔류 섬유 길이를 갖는 카본 섬유가 성형품내 전체 카본섬유중 약 80 중량% 이상인 것을 특징으로 하는 성형품. 16. The molded article of claim 15, wherein the molded article is at least about 80 wt% of the total carbon fibers in the molded article with carbon fibers having a residual fiber length of about 0.5 to 6 mm.
PCT/KR2010/009244 2010-08-26 2010-12-23 High-rigidity electromagnetic shielding composition and molded articles thereof WO2012026652A1 (en)

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