WO2012021154A1 - Dispositif en feuille souple de stockage et de distribution d'énergie - Google Patents

Dispositif en feuille souple de stockage et de distribution d'énergie Download PDF

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Publication number
WO2012021154A1
WO2012021154A1 PCT/US2011/001208 US2011001208W WO2012021154A1 WO 2012021154 A1 WO2012021154 A1 WO 2012021154A1 US 2011001208 W US2011001208 W US 2011001208W WO 2012021154 A1 WO2012021154 A1 WO 2012021154A1
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WO
WIPO (PCT)
Prior art keywords
electrode
separator
energy storage
layer
print
Prior art date
Application number
PCT/US2011/001208
Other languages
English (en)
Inventor
Robert J. Miller
George Allen
Marsha Grade
Amber Brooks
Trevor Simmons
Frank Kovacs
Kenneth Lenseth
Luis Sanchez
Original Assignee
The Paper Battery Company, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/844,787 external-priority patent/US8514548B2/en
Application filed by The Paper Battery Company, Inc. filed Critical The Paper Battery Company, Inc.
Publication of WO2012021154A1 publication Critical patent/WO2012021154A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M6/00—Primary cells; Manufacture thereof
    • H01M6/40—Printed batteries, e.g. thin film batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/431—Inorganic material
    • H01M50/434—Ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0407—Methods of deposition of the material by coating on an electrolyte layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H01M4/0419—Methods of deposition of the material involving spraying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/043—Processes of manufacture in general involving compressing or compaction
    • H01M4/0435—Rolling or calendering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/62—Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
    • H01M4/624—Electric conductive fillers
    • H01M4/626—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/665—Composites
    • H01M4/666—Composites in the form of mixed materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/411—Organic material
    • H01M50/414—Synthetic resins, e.g. thermoplastics or thermosetting resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2300/00—Electrolytes
    • H01M2300/0017—Non-aqueous electrolytes
    • H01M2300/002—Inorganic electrolyte
    • H01M2300/0022—Room temperature molten salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2300/00—Electrolytes
    • H01M2300/0017—Non-aqueous electrolytes
    • H01M2300/0025—Organic electrolyte
    • H01M2300/0045—Room temperature molten salts comprising at least one organic ion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/36—Selection of substances as active materials, active masses, active liquids
    • H01M4/58—Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy; of polyanionic structures, e.g. phosphates, silicates or borates
    • H01M4/583—Carbonaceous material, e.g. graphite-intercalation compounds or CFx
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/62—Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
    • H01M4/624—Electric conductive fillers
    • H01M4/625—Carbon or graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/663—Selection of materials containing carbon or carbonaceous materials as conductive part, e.g. graphite, carbon fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/44—Fibrous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/40—Separators; Membranes; Diaphragms; Spacing elements inside cells
    • H01M50/409—Separators, membranes or diaphragms characterised by the material
    • H01M50/446—Composite material consisting of a mixture of organic and inorganic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Definitions

  • Provisional Patent Applications namely: 1) Provisional Serial Number 61/228,831 to Miller et al., entitled “Compliant Sheet Capacitor” and filed on July 27, 2009; 2) Provisional Serial Number 61/363,104 to Miller et al., entitled “Complaint Sheet Capacitor” and filed July 9, 2010; and 3) Provisional Serial Number 61/364,667 to Miller et al., entitled “Compliant Sheet Capacitor” and filed July 15, 2010; all of which are fully incorporated herein by reference for all purposes to the extent not inconsistent with the present patent application.
  • the disclosed method and apparatus relates to the storage of electrical energy, and more particularly, some embodiments relate to use of a flexible pad or strip of energy storing material from which energy can be recovered.
  • One embodiment of the presently disclosed method and apparatus provides a versatile energy storing "tape” that is dispersed as discrete segments from a roll containing the tape.
  • the tape enables rapid prototyping of devices having a wide variety of power supply requirements.
  • the tape can be used for virtually any application requiring power.
  • the tape is flexible with a bending radius of 1 cm or less.
  • the tape has robust mechanical properties that allow the tape to be flexed multiple times.
  • the disclosed tape can supply physically "formable power".
  • the tape includes a standard pin-out interface to which external components can be soldered.
  • an electronic tape (EtapeTM) is described herein.
  • EtapeTM is a flexible energy storing tape roll with or without an adhesive backing that can be formatted like any other tape product of similar nature. It can in fact be substituted for masking tape, duct tape or ribbon-like material. The difference is that it can be charged and discharged when properly interfaced to a power supply or load respectively. High voltages can be formatted by z-folding back onto a common surface to form a brick-like or prismatic device or by shingling multi-layered strips into an alternate pattern such that the underside to topside are interconnected to form large areas of power at high voltage in a fashion similar to roofing materials. In addition, the Etape can be cut to form or folded or adhered to many surface types. To make electrical contact, the tape can be inductively or direct connected to loads or power.
  • the Etape allows for a dynamic patterning for receiving one or more components. This may be performed at a print shop thereby offering customizable fit to form.
  • the patterns may include holes, slots and filled vias.
  • the energy source comprises a battery, supercapacitor, solar cells or any other source of power. Also, the energy source comprises a power plane and a ground plane.
  • E-TapeTM design characteristics A versatile energy storing tape or ribbon that is dispersed as discrete segments from a roll containing the same.
  • the design of the tape or ribbon is in a manner that enables the rapid prototyping of power supply requirements for virtually any application requiring power.
  • the novel properties include its flexible format with a bending radius of 1 -cm or less, robust mechanical properties that enable multiple flex or formable power, stackable in series for increased voltage or parallel for increased capacitance.
  • the design includes a means of interfacing electronic components by means of standard pin-out and soldering.
  • Flexible PCB at least one segment is dispensed from a roll and the pin-outs of the design are used to attach various electronic components to the flexible "printed circuit board.”
  • At least one segment is dispensed from a roll and the pin-outs of the design are used to attach various electronic components to the flexible "printed circuit board.”
  • a group of items linked with the conjunction "and” should not be read as requiring that each and every one of those items be present in the grouping, but rather should be read as “and/or” unless expressly stated otherwise.
  • a group of items linked with the conjunction "or” should not be read as requiring mutual exclusivity among that group, but rather should also be read as “and/or” unless expressly stated otherwise.
  • items, elements or components of the disclosed method and apparatus may be described or claimed in the singular, the plural is contemplated to be within the scope thereof unless limitation to the singular is explicitly stated.
  • module does not imply that the components or functionality described or claimed as part of the module are all configured in a common package. Indeed, any or all of the various components of a module, whether control logic or other components, can be combined in a single package or separately maintained and can further be distributed in multiple groupings or packages or across multiple locations.
  • Print forming is defined as any direct contact or non-contact marking technology that is recognizable to one experienced in the field of printing and electronic printing.
  • Indirect print is defined as any non-contact print forming technology where individual droplets of marking material (ink) are used as markers on a substrate or material or inflight. At least one of the technologies known as spray (ultra-sonic or aerosol), ink-jet, airbrush are typically used alone or in combination with other print forming technologies.
  • Direct print is defined as any direct contact print forming technology where the physiochemical nature of the substrate (receiving surface) and a marking device such as a nano imprinting, drum, roll, bar, slide (transfer surface) jointly participate in establishing the amount of marking material (ink) transferred and the resulting properties of the final printed film.
  • a marking device such as a nano imprinting, drum, roll, bar, slide (transfer surface) jointly participate in establishing the amount of marking material (ink) transferred and the resulting properties of the final printed film.
  • At least one of the marking technologies commonly known as screen print, gravure, flexographic, nano imprinting or draw bar are typically used alone or in combination with other print forming technologies.
  • Nanoscale interlock is defined as the pinning of near surface print formed thick-film materials through physical interlacing and subsequent interactions between high aspect ratio particles or polymeric materials on a nanoscale. Said pinning may or may not include electron transfer common to chemical bond formation. Typical film based geometric aspect ratios (z verses the x-y plane of films) of the interlocked materials pinned are at least 1 : 1 where higher aspect ratios are desired and at least 3 : 1 may be preferable. The intent is to build physical legs of high aspect ratio with subsequently high surface areas into the receiving or transferred surfaces or both.
  • Typical length scales of the interlacing frequency within the x-y plane of the film also termed the interval lengths are typically 10-nm to 300-nm but may be as much as 1 -micron. Smaller scales are common to chemical bonding which may or may not be solicited in our devices.
  • Large scale interlock is defined as the near surface pinning of print formed thick-film materials at interval lengths exceeding 1-um. When such large scale interlocks include high aspect ratio legs a desirable interlock may still be formed provided that the total surface area gain is suitable. Devices when built as layered structures without high aspect ratio interlacing are commonly referred to as laminated structures with or without an adhesive present. A high aspect ratio large dimensioned leg with suitably high surface area is feasible and included within this invention.
  • Ring-seal is defined as a special case of interlocking between at least two materials utilizing nanoscale or large-scale or both interlocking mechanisms. The intent is to form a concentration gradient between the two materials using print forming manufacturing technologies. The result is the formation of a volume element comprised of a known concentration of the respective starting materials. In addition to controlling x-y concentration profiles, z-axis profiles may also be controlled by print forming. A representation of the ring-seal is depicted within FIGS. 6 A and 6B and will be described herein below.
  • Nanocomposite is defined as a physical interlacing between dissimilar materials on a nanoscale typically sub-micron in dimension. For printed films, maximizing weak physical interactions within multi-layered print formed materials by increasing the effective contact area with high aspect ratio legs and by reducing the length scale of the interlocking frequency in the x-y plane to nanoscale is a desirable aspect of the embodiments described herein. By so doing, homogenous composite like properties are possible between films of highly heterogeneous print formed thick-film materials. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 A depicts a perspective cutaway view of a structural sheet for storing energy and providing fault tolerance in accordance with one embodiment
  • FIG. IB depicts a layered view from the top of the structural sheet with the device layers shown cutaway in accordance with one embodiment
  • FIG. 1 C depicts an intersection of a foundation and current bus walls in accordance with one embodiment
  • FIG. ID depicts an end pin out for a multi-layered stack of individual devices in accordance with one embodiment
  • FIG. IE depicts a close-up view of the pin out in accordance with one embodiment
  • FIG. IF depicts a perspective view of the structural sheet with the pin out connector layer in accordance with one embodiment
  • FIG. 2 depicts a step of applying a separator layer to make the sheet of FIGS. 1-2, in accordance with one embodiment
  • FIG. 3A depicts a representation of the first of two stages of creating electrode in accordance with one embodiment
  • FIG. 3B depicts a representation of the second of two stages of creating electrode in accordance with one embodiment
  • FIG. 3C depicts a close-up microscopic image of the surface of an electrode particle in accordance with one embodiment
  • FIG. 4A depicts a nano-scale representation in the first step of forming the interlock between the separator layer of FIG. 2 and the electrode layer of FIG. 1 and a cap layer of a current collector in accordance with one embodiment
  • FIG. 4B depicts a nano-scale representation of the interlock between the separator layer of FIG. 3 and the electrode layer of FIGS. 4A-4C and the cap layer of the current collector in accordance with one embodiment
  • FIG. 4C depicts a nanoscale representation of the detailed interlock between the electrode and the cap layer of the current collector layer in accordance with one embodiment
  • FIG. 5A depicts a representation of the first step of formation of a ring seal of the structural sheet in accordance with one embodiment
  • FIG. 5B depicts a representation of the second step of formation of a ring seal of the structural sheet in accordance with on embodiment
  • FIG. 6A depicts an equivalent circuit for a single layer of the structural sheet device with energy storage
  • FIG. 6B depicts an equivalent circuit for a multi-layered structural sheet device with energy storage
  • FIG. 6C depicts a cross sectional view of a single layer of the structural sheet device with energy storage that comprises the energy storing unit shown in FIG. 1 ;
  • FIG. 6D depicts a multi-layered structural sheet device with energy storage that comprises a plurality of the energy storing units shown in FIG. 1 , stacked together;
  • FIG. 7 depicts a process diagram for creating the structural sheet and an integrated stack in accordance with one embodiment.
  • the sheet 10 may be made or manufactured using print forming processes. Each of the components of the sheet 10 may be manufactured with a print formed process. Both direct printing and indirect printing processes are contemplated.
  • the sheet 10 may have an energy storage density that is greater than 10-mWh/ft2 and is capable of withstanding greater than 5-KPa stress under at least 5% strain.
  • the sheet 10 may be made from one or more sub assemblies 18, 20 that are print formed onto a substrate or substrate 22.
  • the substrate 22 may be mismatched to the thermal properties of the sub assemblies for easy dismounting the sub assemblies from the substrate at the end of a process line.
  • the substrate 22 may be a tempered glass, or a SS web, or a consumable carbon based veil for example.
  • the batch processed sheet 10 depicted in FIGS. 1A-1F is fabricated by first print forming two sub-assemblies, then dismounting the two sub-assemblies from the substrate 22 or substrates, then loading with electrolyte that is compatible from the foundation side then adding a seaming plasticizing agent to the foundation side then aligning the two sub-assemblies with their foundations facing one another and sealing by calendaring the two sub-assemblies into a single sheet device 10.
  • the sub assemblies may be identical sub assemblies. The sub assemblies may be dismounted from the substrate 22 and aligned foundation-to-foundation and seamed into the energy storing structural sheet 10.
  • the sheet 10 may include a print formed separator layer 12 that is located between two print formed electrodes 14 and current buses 44 and two electrode cap layers 46 and two print formed current collectors 16.
  • An electrical pinout 17 or connection plane may be print formed onto the current collector 16 to output energy for external distribution that is stored in the sheet 10 or input energy to charge the sheet 10.
  • a planar interconnection enables higher cycling frequency when connected to a planar thermal heat sink (not illustrated).
  • the separator layer 12 is shown as the middle layer of the sheet 10. For symmetrical builds, the print formed current collector 16, electrode 14 and current bus 44 ensemble above and below the separator layer 12 are the same. Variations to a symmetrical build are feasible for incorporating hybrid, battery, or supercapacitor technologies into the sheet.
  • the sheet 10 may be created by printing the above sub assembly and the below sub assembly on the substrate 22 as shown in the cutaway perspective view of FIG. 2.
  • the above sub assembly and the below sub assembly may then be folded along a print formed perforated crease 56 that serves as an alignment feature together to form the completed sheet 10.
  • the separator film 12 may be an electrically insulating material made from a Cellulose Triacetate (CTA) solution.
  • CTA Cellulose Triacetate
  • the solution may be a 1.67 wt % CTA solution, for example. However, it should be understood that other CTA concentrations are contemplated.
  • the solution may include other compounds such as Chloroform, Acetone and Methanol.
  • the separator film 12 compound may be derived from an ink solution that is printable by indirect printing onto the substrate 22.
  • the substrate 22 may be glass or any other appropriate flat surface that would be apparent to one skilled in the art.
  • the separator film 12 may be formed using an indirect print by being uniformly sprayed onto the flat substrate 22 by known means. One or more spray layers may be applied and interlaced along the surface such that the separator film 12 is uniformly formed.
  • a heat lamp 26 may be utilized between the glass and the nozzle 24 in order to cure the sprayed solution as it is being transferred between the nozzle 24 and the substrate 20. This curing may help define the porosity and elasticity of the final separator film 12.
  • the separator film 12 may incorporate encapsulated particles such as ceramics or conductive materials to reduce the propensity for dielectric breakdown.
  • the porous separator 12 may further incorporate carbon nanotubes or nano-fibrous materials at a concentration density that is below the percolation threshold that may also entangle with the electrode layer 14 on either side of the separator film 12 such that the mechanical strength between the two materials is improved significantly. Dissimilar nanoparticles may be used to build torturous pores.
  • spraying using the nozzle 24 is shown in FIG. 3, other embodiments are contemplated for printing the uniform separator film 12 onto the substrate 14. While one of the embodiments contemplated includes the separator film 12 being used with the sheet 10, the separator film 12 may also be manufactured and sold as a sub-assembly unit for other sheets (not shown) or purposes. Thus, energy may be storable in the separator 12 for electrical double layered capacitors.
  • the sheet 10 may further include a patterned non-porous foundation 28 that is printed o ⁇ 'er the seDarator layer 12 on the substrate 14 in a manner that enables the closing or blocking of the immediately underlying porous separator film.
  • the foundation 28 may be directly printed onto the porous film of the separator film 12 in such a matter to enable to conversion of the porous film into the patterned non-porous foundation 28 grid without impacting the uniformity of thickness throughout the separator surface.
  • the foundation 28 grid may be made such that massively parallel porous separator cells 32 are formed that are separated by the non- porous foundation 28.
  • the foundation 28, in conjunction with the separator film 12 may facilitate stress management within the sheet 10, helping to allow the sheet to be mechanically flexible and also aid in handling or mounting without damaging the electrical properties of the device. Further, the cells may provide puncture tolerance to the sheet 10.
  • the foundation 28 may be another CTA solution. However, the solution for the foundation 28 may have a much greater CTA wt % as it is applied by a direct print method. For example, the solution may be 9% CTA.
  • the foundation 28 may be an ink solution that is indirectly printable on the substrate 22.
  • the ink formulation may include a dilute CTA solution like previous discussed for the separator film. This precise indirect printing is accomplished by moving the nozzle or substrate in order to achieve the patterned desired.
  • the pattern in which the foundation 28 is applied is a number of boxes with X's through them to create four triangular cells 32 per box. Thus, the triangular cells 32 of FIG. 2 are actually the portion of the separator film 12 that the foundation 28 was not applied.
  • the triangular cells 32 therefore still have the porous surface of the separator film 12 after the foundation 28 has been applied, while the outline of the cells 32 and the outline of both of the- sub assemblies 18, 20 may comprise the nonporous foundation 28.
  • the cells 32 may be fault tolerant, self healing structural cells 32 in that a puncture of one cell may not affect the rest of the cells 32 of the sheet 10.
  • the grid created by the cells 32 and the foundation 28 and current bus 44 may enable a puncture tolerance and mechanical toughness to the plurality of cells 32.
  • the absolute dimensions of the cell 32, foundation 28 and current bus 44 and ratios of a grid defined by the foundation 28 or current bus 44 to the cell 32 can be varied throughout the dynamic range of the type of printing technology used and more practically, greater than 5 microns widths for the grid components and greater than 25 micron widths for the cell.
  • triangular cells 32 are shown in the Figures, it should be understood that other shaped cells are also envisioned. For example, circular, rhombus, rectangular cells, square cells, or any other appropriately shaped cells may be utilized.
  • the purpose of the cells 32 is to isolate damaged cells during processing, handling or otherwise and to provide additional strength to the sheet 10. Thus,- if a single of the cells 32 becomes punctured, the undamaged portion of the sheet 10 may function normally.
  • the size of the sheet 10, and the cells 32 may vary according to the requirements of the specific application.
  • the two dimensional area of each cell may be about 31 mm.sup.2
  • the length of each "box" of four triangular cells 32 may be about 12.5 mm in one embodiment.
  • the actual dimensions of each cell can vary and that typically the minimum dimension is 0.01 mm to 0.1 mm and typically the maximum dimension is 0.1 mm to 20 mm
  • the repeat unit of the sheet 10 is at the dimensions of a single cell 32. As such, unique designs within the sheet 10 can be envisioned during the fabrication process such as presence and absence of cells 32 to match a application or the cutting out of patterns such as an article of clothing or perhaps a donut shape for rail gun or coil gun application.
  • the electrode layer 14 may be made by a separate electrode preparation process, partially shown in FIGS. 3A-3C.
  • a nano mix may consist of any nanoscale materials or blends.
  • a polymers, metals, oxides of metals, ceramic or other type material may be used with the nano mix.
  • the nano mix may be a blend of nano materials such as carbon nanotubes (CNT) and fat, long aligned CNT bundles that resemble yarn when viewed with a SEM microscope. If carbon is used as the nano material, the carbon density may be greater than 0.5-g/cc.
  • the carbon density may be between 0.5 and 2 g/cc.
  • the nano material should preferably have high strength, low density, a high aspect ratio (length vs. diameter), and may be fusible with pulse radiation or other means.
  • the gelable liquid that may be comprised of precursory materials for aerogel formation together with the nano mix may then be gelled and then dried into an aerogel in a similar manner to the way in which pure sol-gel is turned into an aerogel from a liquid solution. Once in sol-gel form, the gelled system may be further dried in the similar manners to which sol-gel is dried into aerogel. The drying may be an air dry process or a super critical fluid CO.sub.2 process that is known to those skilled in the art.
  • a hardened porous material may result from the aerogel and nano mix blend.
  • the porous properties of the hardened materials can be adjusted by varying the ratio of the constituents within the nano blend and the properties of the starting sol-gel. Pores ranging from macropores (greater than 50 nm) to micropores (under 2 nm) are thus feasible within the hardened materials.
  • the hardened material at this stage may not be carbonized or fully conductive. While the nano-materials may be conductive, the hardened material may still include particles other than carbon most notably the aerogel component.
  • the hardened porous material may then be pyrolyzed, for example, in order to produce a substance that is richer in carbon after the resulting volatile moieties of the aerogel are oxidized off during the pyrolysis process.
  • the pyrolysis may result in a material that is shrunk from its original size and may involve a conditioning environment during or post-pyrolysis to induce unique properties to the nanomix or aerogel components.
  • a representation of a pyrolyzed material 34 is shown.
  • the pyrolyzed material 34 is shown having the nano mix 36 interspersed throughout.
  • the pyrolyzed material 34 may further be a highly porous material.
  • the pyrolyzed material 34 may then be ground into a powder, depicted by electrode particles 38.
  • the grinding process may include a cryogenic ball milling process. However, other processes are contemplated such as room temperature milling.
  • Each particle is designed to contain a mixture of macropores, mesopores and micropores in order to tune the mass transport properties and charge carrying capacity of the particles.
  • the electrode particles 38 may have a high porosity electrode core and a matrix of conductive nano materials that protrude from the high porosity electrode core.
  • the electrode particles 38 may be a "hairy particle," where this matrix of long nano mix components sticks out like hairs around the carbon blend of materials that predominantly makes up the particle.
  • the "hairy" electrode particle 38 may be an energy storing electrode that is capable of interlocking with neighboring particles and provides suitable nano-scale tethering to the layers above and below the electrode 38 when applied to the sheet 10.
  • the electrode particle 38 may thus be capable of interlocking with another layer in any direction to allow high density and constant power with increasing thickness of an electrode layer that comprises a plurality of the electrode particles 38.
  • the electrode particle 38 may have optimal mass transport of electrolyte between the particles while also containing high surface area microstructures, for example of the aerogel, within.
  • this powder may be turned into an ink by mixing the powder with a suitable rheological modifier such as hexane or another liquid organic material such as alcohol.
  • the powder may be combined with the coupling agents, rheological agents with ultrasonic dispersion.
  • the ink may be combined with or without a dispersing agent included, such as a surfactant.
  • the resulting electrode ink may provide a linear relationship between the printed electrode's 14 thickness and energy and power density, and also contain the nano mix "hairs" which facilitate in the bonding and anchoring of the electrode to the porous separator.
  • the energy storing electrode may be preloaded with electrolyte prior to printing, and either before or after becoming an ink.
  • the electrode ink may be applied to create the electrode layer 14.
  • the electrode layer 14 may be applied to the substrate 22 over only the porous separator film cells 32.
  • the ink may thus be sprayed using an indirect print.
  • the electrode layer 14 may be applied over the separator film 12 in more than one layer.
  • the hairy nano material of the electrode layer 14 is configured to nanoscale interlock between adjacent particles and with the particles of the separator film 12 in such a way to assure a high percentage of the protruding nano materials being intercalated within the previous separator film 12 pores.
  • Temperature and pressure treatment may be utilized in order to form a highly entangled interfacial zone between the separator film 12 and the electrode layer 14.
  • the electrode layer 14 may be flash cured with a pulsed radiation light source. While the process for applying the electrode layer 14 may be a wet process as described hereinabove, dry processes are also contemplated. For example, the electrode layer 14 may be electrostatically deposited onto a transfer drum then directly printed onto the separator film 12.
  • FIGS. 4A-4C a molecular view is shown of how the electrode layer 14 is interlocked with the separator film 12 and the current collector particles 16 (described hereinbelow). More particularly, the electrode particles 38 are shown mixed within a printed film and then fused with collector and separator particles 42.
  • One embodiment assumes a plasticized separator particle (gel like surface) entrapping the nanomix hairs of the electrode particles.
  • FIG. 5C A schematic representation of nanoscale interlocking using 100-nm beads 33 overlaid on an invented hairy particle 38 are illustrated to scale in FIG. 5C In the illustration, 200-nm beads 35 are shown not to be able to interlock with the particles 38.
  • the current bus 44 may then be applied to the substrate 22 between the individual electrodes 14 and directly over the previously applied foundation 28 once the electrodes 14 have been applied.
  • the current bus 44 may be print formed onto a non porous foundation layer that isolates porous separator and active cells 32 electrically and mechanically and prevents electrolyte transport, such as the non-porous foundation layer 28.
  • the current bus 44 may be dimensioned for optimal thermal, mechanical and current carrying needs of an application.
  • the ratio of the current bus to the cell 32 size and thus the porous separator 12 may be configured for optimal mechanical, thermal, and electrical properties.
  • the current bus 44 may be part of a current collection ensemble 50 that comprises the current bus 44, the current collectors 16. Thus, the current bus 44 may be applied over the foundation 28 in the patterned area.
  • the current bus 44 may be deposited in such a way that the nanomix materials of the electrode particles may become intercalated together with the current bus 44.
  • the current bus 44 may be sintered and cured, depending on the temperature and pressure requirements of the application process. The degree of densification of the current bus 44 may be a carefully controlled process parameter. Upon final densification, the current bus 44 may serve as part of a pressure tight seal provided by the current collection ensemble 50. This seal may serve to prevent cross contamination between adjacent cells.
  • the current bus 44 may be created with an ink, such as a Dupont silver, copper, nickel, aluminum or carbon ink.
  • the current bus 44 may be conductive, and serve to transport currents to and from the input and output pins 18.
  • the patterned current bus 44 may be interlocked with the non-porous foundation 28 with a ring seal.
  • a gradient is dynamically formulated within two dissimilar inks labeled "M” and "P” respectively.
  • a printed gradient is first formed within a detached vessel and is known to those familiar with continuous flow wet processing.
  • "M” is added to the vessel that contains a high percentage of "P” while the vessel containing "P” is being extracted and printed onto the device by the printing apparatus.
  • Spray applicators can be designed to have a wide range of concentration gradients within the deposition cone of the nozzle.
  • a gradient of M and P can be accomplished as a function of the deposition thickness and time.
  • curing frequency is adjusted to assure complete cure of the films formed due to a complex transmissivity function as a function of thickness.
  • the aspect ratio and thereby the properties of the legs, 45 developed are correlated to the cone geometries, relative concentration of M and P, film forming properties of M and P, and the deposition rates of the two nozzles.
  • the current collection ensemble 50 may further include a cap layer 46.
  • the cap layer 46 may be printed over the entirety of the substrate 14 with a wet or dry process. Shown in FIGS. 4A-4C is the cap layer 46 being applied over the electrode layer 14.
  • the cap layer 46 may be formed by placing nano-material over the electrode such that once fused with pulse radiation or other suitable means, the mechanical properties of the outer 0.3 to 3 microns of the electrode material become a cap that is infused with conductive nano mix of the electrode.
  • the cap layer 46 may work in conjunction with the current bus 44 and current collector 16 to form the pressure tight seal preventing cross contaminating between adjacent cells.
  • the cap layer 46 may be overlaid in such a manner to assure good intercalation, particularly with the previous current bus 44 and electrode layer 14 with which the cap layer 46 may contact.
  • the cap layer 46 may be composed of a dispersed solid consisting of micron sized pure metal particles or alloys with nano materials such as copper, gold, carbon, or silver. The purpose of the cap may be to enable thick-film build up while offering low processing temperature and to meet desired electrical and mechanical specifications after densification.
  • the electrode particle 38 may further form a green state build after application of the electrode particles 38 and the cap layer 46 that, upon sintering and shrinkage of a containment chamber for the electrode particle 38, allows the release of entrapped gasses through the open porous structure of the chamber.
  • a third portion of the current collector ensemble 50 may be the plurality of current collector layers 16.
  • the combination of the cap layer 46 and the electrically conducting continuous current collector layers may be configured to collect current, balance current between adjacent cells and transport it in a z-axis to an adjacent device.
  • FIGS. 4A-4C depict a cross sectional view of a current collector and cap interlock to the electrode in accordance with one embodiment.
  • the goal of the current collector layers 50 may be to build up metallic current collecting capacity and mechanically support the arrayed and sealed capacitive cells beneath.
  • the current collector layers 50 may provide that the sheet is able to withstand over 0.5 psi, and preferably between four and ten psi, of internal pressure without breaking down or harming the energy storage capabilities.
  • the current collector ensemble 50 may collectively prevent the electrolyte from escaping out of the sheet 10 during activation.
  • the current collector ensemble 50 may also be a moisture and environmental barrier. As such, the current collector ensemble 50 may be the final layers applied to the sheet 10 prior to assembling the fully printed device.
  • a third portion of the current collector module 50 may be one or more current collector layers 16.
  • the current collector module 50 may be an electrically conducting current carrying layer 16 that is print formed over a sub assembly that comprises the separator 12, the foundation, 28, the electrode 14 and the bus 44.
  • the material of the electrically conducting current collector may assure an interlocking between the electrically conducting current collector 16 and the electrode 14.
  • the combination of the cap layer 46 and the electrically conducting continuous current collector layers may be configured to collect current and transport it in a z-axis to an adjacent device.
  • the goal of the current collector layers 16 may be to build up metallic current collecting capacity and mechanically support the arrayed and sealed capacitive cells beneath.
  • the current collector layers 16 may provide that the sheet is able to withstand over three psi, and preferrably between four and ten psi, of internal pressure without breaking down or harming the energy storage capabilities.
  • the current collector layer 16 may be fused by pulse radiation over the cap 46.
  • the current collector layers 16 may collectively prevent the electrolyte from being pumped out of the sheet 10 during activation.
  • the current collector layers 16 may also be a moisture and environmental barrier.
  • the current collector layers 16 may be the final layers applied to the sheet 10 prior to assembling the fully printed device.
  • the current collector layers 16 and the cap 46 may be predominantly z-axis conductors. This z-axis conduction may be further provided by a high strength conductive carbon veil that is configured to enhance the mechanical properties and increase strength.
  • an external current bus (not shown) that is coupled to the outside of the two identical sub assemblies 18, 20.
  • the external current bus may have a geometry that is parallel to the internal current bus 44, and the foundation layer 28.
  • the external current bus may further be in operable communication with the pinout 17.
  • Assembling the batched processed sheet 10 from the printed substrate 22 may comprise several steps. First, a printed sub assembly may be dismounted from the substrate 22. This dismounting may be accomplished by a cold finger, roller or refrigeration. For example, cooling may shear the physical bonds between the separator and foundation film 12, 28 and the substrate 22 so that the sub-assembly or the pre-assembled sheet 10 may be carefully removed from the substrate 22. The second sub assembly may be dismounted from the same substrate 22 or a different substrate (not shown) in a similar manner. The sub assemblies may be dismounted and stored in suitable packaging material for further processing.
  • the sheet 10 or sub assembly may be flipped 180.degree. such that the collector layers 50 are facing the substrate 22 while the separator layer 12 is faced upwards.
  • the reversed pre-assembly for sheet 10 or sub assembly may then be inserted into a vacuum oven or other environmentally controlled chamber for a predetermined amount of time. This temperature and time may help to drive off residual solvents from the carbon electrode materials and activate the electrode within the sheet 10.
  • a room temperature ionic liquid (RTIL) electrolyte may be applied to the sheet 10.
  • the RTIL may be applied directly to the triangular cell area 32.
  • the RTIL may be allowed to soak for a predetermined time period, for example for thirty minutes to fill in any of the unfilled pores of the separator film 12 and electrode layer 14. Once the soaking or wetting has been completed, excess RTIL may be removed with, for example, an absorbent roller.
  • Common RTIL electrolytes may be utilized assuming compatibility with the various materials used in the sheet 10. As such, phosphorous hexafluoride, PF.sub.6 anion's are preferred over boron tetrafluoride, BF.sub.4 anions for CTA based devices.
  • the cation selection is critical for similar reasons. For CTA, a proprietary cation is preferred in combination with the PF.sub.6 anion. In the case of CTA, aqueous systems are not compatible.
  • the electrolyte may be a solid electrolyte with different application processes that may be known to those skilled in the art.
  • the sheet 10 may treated with a seaming agent by print forming and then folded along a line of perforation or crease to enable alignment between the two sub-assemblies.
  • a seam 58 may be formed between the two sub assemblies by applying a plasticizing agent along the seam to attack the CTA of the separator layer 12 that is exposed due to the 180. degree, rotation described hereinabove.
  • the cells 32 and current bus grid may be properly aligned or matched up. It should be understood that while the embodiment described herein requires the folding step, other embodiments are contemplated.
  • the sheet 10 may be printed on both sides of the separator film 12, rather than requiring a folding step.
  • each of the steps of creating the sheet 10, described hereinabove may be done in a computerized printing process whereby lengths of the sheet 10 may be created. It is contemplated that precise roll-to-roll, (R2R) printing processes may be utilized to print lengths of the device at 1 m/s or more.
  • R2R roll-to-roll
  • a sealing device (not shown) may be used to seal the grid portion and the surrounding portion of the sheet 10.
  • the sealing device may include protrusions in the shape of the current bus grid and the surrounding portion that is around the current bus grid. This is because the triangular cells 32 of the sheet may actually protrude from the current bus grid shape channels prior to folding.
  • the sealing device may be used to seal the current bus grid of the above sub assembly with the current bus grid of the below sub assembly, along with sealing the area around the outside of the grid of the sheet 10.
  • Said sealing device may be an embossed roll in an R2R line that may also be heated.
  • the sheet 10 may be stackable in several layers, as shown in FIGS. 6C and 6D.
  • a single sheet 10 device as shown in FIGS. 6A and 6B, may be extremely thin, therefore allowing several of the devices to be stacked together, as shown in FIGS. 6C and 6D, and connected in either series or parallel, thus providing more energy storage per unit length of the sheet 10.
  • an odd numbered plurality of the sheets 10 may be integrated together in series with a seaming agent.
  • an even numbered plurality of sheets 10 may be integrated together in parallel with a seaming agent.
  • a filled vias may be print formed into the patterned current bus to integrate the plurality of high strengths, high energy density structural sheets and enable parallel arrangements between devices.
  • the sheet 10 may be made to accommodate any shape or size. While the embodiment depicted in the Figures is roughly square or rectangular in shape, other embodiments are contemplated such as circular shapes, rectangular, triangular, ovular, or any other shape that would be useful in an application of the sheet 10.
  • the method 100 may include a step 1 10 of applying a separator module, such as the separator layer 12 and the foundation 28 to a substrate such as the substrate
  • the method 100 may include a step 1 12 of applying an electrode, such as the electrode 14.
  • the method 100 may further include a step 1 14 of applying a current bus, such as the current bus 44.
  • the method 100 may still further include a step 1 16 of applying a cap layer, such as the cap 46.
  • the method 100 may include a step 1 18 of loading electrolytes into the opposite surface behind the separator module.
  • the method 100 may comprise a step 120 of assembling a sheet such as the sheet 10.
  • the method 100 may include a step 122 layering several sheets together. It should be understood that the steps outlined hereinabove to the method 100 may be done in other orders or including other steps there between that will be apparent to those skilled in the art and further described herein. It should be understood that the method 100 is presented in this order by way of exemplification.
  • the sheet 10 may be useful in a variety of different applications.
  • the thin nature of the device along, with its pliability and flexibility, are advantages that may allow the sheet 10 to provide energy in many scenarios.
  • the sheet 10 may be used as an energy storage elongated "tape," that is segmented for easy disassembly or assembly in series or parallel configurations based on user choice.
  • the sheet 10 may be used to store energy for solar photovoltaic devices, in both grid-integrated and off grid applications. It is further contemplated that the sheet 10 be embeddable in automobile frames or within advanced soldier uniforms. Still further, the sheet 10 may be used for digital camera flashes, or for cordless surgical or dental tools.
  • the sheet 10 as structurally conformable or integrated into structures of weapons such as guided missiles s, aeroplanes such as unmanned aerial vehicles (UAVs) or underwater vehicles, as, decoupling capacitors underlaid on printed circuit boards, industrial or production power tools, model airplanes, cars or helicopters, high stakes packaging, military battery or supercapacitor packs and generators, night vision goggles, portable defibrillators, embedded in building materials such as roads, concrete walls floors, insulation, barrier sheet materials or the like, hand held power tools, transmission lines wrapped in the device to integrate storage directly into the grid, fabric integrated batteries, embedding battery or supercapacitor in electric fencing, flexible displays (newspapers or the like), medical diagnostic watches or monitors worn by patients, eco-sensors, regenerative braking for hybrid vehicles, regenerative energy capture in elevators, forklifts, motors in other devices, within laptops, as batteries embedded under the skin with medical devices, cordless phones, toys, thin film battery or supercapacitor hybridization (RF
  • the sheet 10 may be implemented as a high power density supplement within a casing, for example, to supplement the standard battery or supercapacitor for these high power density applications. This may allow for the standard battery or supercapacitor of the device to be decreased in size significantly.
  • various aspects or features described herein may be implemented as a method, apparatus, or article of manufacture using standard programming and/or engineering techniques.
  • article of manufacture as used herein is intended to encompass a computer program accessible from any computer-readable device, carrier, or media.
  • computer-readable media can include but are not limited to magnetic storage devices (e.g., hard disk, floppy disk, magnetic strips, etc.), optical disks (e.g., compact disk (CD), digital versatile disk (DVD), etc.), smart cards, and flash memory devices (e.g., EPROM, card, stick, key ' drive, etc.).
  • various storage media described herein can represent one or more devices and/or other machine- readable media for storing information.
  • machine-readable medium can include, without being limited to, wireless channels and various other media capable of storing, containing, and/or carrying instruction(s) and/or data.
  • a computer program product may include a computer readable medium having one or more instructions or codes operable to cause a computer to perform the functions described herein.
  • a software module may reside in RAM memory, flash memory, ROM memory, EPROM memory,
  • An exemplary storage medium may be coupled to the processor, such that the processor can read information from, and write information to, the storage medium.
  • the storage medium may be integral to the processor.
  • the processor and the storage medium may reside in an ASIC.
  • the ASIC may reside in a user terminal.
  • the processor and the storage medium may reside as discrete components in a user terminal.
  • the steps and/or actions of a method or algorithm may reside as one or any combination or set of codes and/or instructions on a machine readable medium and/or computer readable medium, which may be incorporated into a computer program product.
  • FIG. 1 is a flow diagram describing an embodiment of the method to manufacture the current collector side of a flexible printed circuit board.
  • FIG. 2 is a flow diagram describing an embodiment of the method to manufacture the separator side of a flexible printed circuit board.
  • FIG. 3 is a flow diagram describing an embodiment of the method to align and join the current collector side and separator side of a half-build of a flexible printed circuit board.
  • FIG. 4 is a flow diagram describing an embodiment of the method to join two single- layer half-builds of a flexible printed circuit board.
  • FIG. 5 is a graphical representation and flow diagram of a simplified processing line utilizing an embodiment of the method to manufacture a flexible printed circuit board with energy storing capabilities.
  • FIG. 6 is a detailed exploded view of a subset of the method of manufacture represented FIG. 7A is a graphical representation of a processing line utilizing an embodiment of the method to manufacture a flexible printed circuit board with energy storing capabilities.
  • FIG. 7B is a graphical representation of a processing line utilizing an another embodiment of the method to manufacture a flexible printed circuit board with energy storing capabilities.
  • FIG. 8 is a cut-away view of an embodiment of a forward sequence build collector design.
  • FIG. 9A is a cut-away view of an embodiment of Roll A of a forward sequence half- build collector design.
  • FIG. 9B is a cut-away view of an embodiment of a reverse sequence half-build collector design.
  • FIG. 1 A is a side view of one embodiment of the invention.
  • FIG. IB is a side view of a partially assembled portion of one embodiment of the invention.
  • FIG. 2 is a side view of the detail of one embodiment of the invention.
  • FIG. 3A is a cut-away view of one embodiment of the invention.
  • FIG. 3B is a side view of one embodiment of the invention.
  • FIG. 4A is a perspective view of a finished assembly of one embodiment of the invention.
  • FIG. 4B is a perspective view of a finished assembly of one embodiment of the invention.
  • FIG. 5A is a cut-away view of an example of an application of one embodiment of the invention.
  • FIG. 5B is a cut-away view of one embodiment of the invention including electronic components.
  • EtapeTM is a flexible energy storing tape roll with or without an adhesive backing that can be formatted like any other tape product of similar nature. It can in fact be substituted for masking tape, duct tape or ribbon-like material. The difference is that it can be charged and discharged when properly interfaced to a power supply or load respectively.
  • High voltages can be formatted by z- folding back onto a. common surface to form a brick-like or prismatic device or by shingling multi-layered strips into an alternate pattern such that the underside to topside are interconnected to form large areas of power at high voltage in a fashion similar to roofing materials.
  • the Etape can be cut to form or folded or adhered to many surface types. To make electrical contact, the tape can be inductively or direct connected to loads or power.
  • an apparatus ETape role 100 for supplying power comprises massively arrayed flexible electronic cells (##) print formed into flexible electronic devices or energy segments (104) comprising an electrode 202 and a current collector 204, a separator 208, partitions that isolate each cell 206, , and an interface (i.e. pin- outs) for attaching to at least one external electronic component.
  • the current collector 204, partitions 206 and electrode 202 are preformed onto the first substrate and the separator 208 and foundation components 20# are preformed onto the second substrate.
  • Figure 1 shows the Etape comprises a protective seal or tape packaging 122 surrounding a portion of the flexible device, a conductive strip, a perforated cut 106 between each of the energy storing segment 104, an interconnected strip 108, a vinyl embedded device and an internal support rib or current bus.
  • the energy storing segment 104 comprises the power tape technology, a containment chamber 126, and a current bus 120.
  • the energy storing segments 104 may be connected in serial or in parallel and separated by a perforated cut 106.
  • the Etape may or may not have adhesive backing.
  • the Etape allows for a dynamic patterning for receiving one or more components. This may be performed at a print shop thereby offering customizable fit to form. The patterns may include holes, slots and filled vias.
  • the energy source comprises a battery, supercapacitor, solar cells or any other source of power. Also, the energy source comprises a power plane and a ground plane.
  • E-TapeTM design characteristics A versatile energy storing tape or ribbon that is dispersed as discrete segments from a roll containing the same.
  • the design of the tape or ribbon is in a manner that enables the rapid prototyping of power supply requirements for virtually any application requiring power.
  • the novel properties include its flexible format with a bending radius of 1 -cm or less, robust mechanical properties that enable multiple flex or formable power, stackable in series for increased voltage or parallel for increased capacitance.
  • the design includes a means of interfacing electronic components by means of standard pin-out and soldering.
  • Flexible PCB at least one segment is dispensed from a roll and the pin-outs of the design are used to attach various electronic components to the flexible "printed circuit board.”
  • At least one segment is dispensed from a roll and the pin-outs of the design are used to attach various electronic components to the flexible "printed circuit board.”
  • a highly compact electrode structure is desired.
  • the printed particle's design, the quality of the ink dispersion, and the print and cure or set processes will determine the overall compaction and performance of the electrode film or sub-assembly.
  • the print processes and the inks for said processes are in the field of high density electrode design and fabrication. Thus a ink formulation is used to make the electrode.
  • the electrode is formed by printing a film using indirect or direct printing methods.
  • indirect printing the inks are typically of low viscosity and rely on solvent evaporation to drive the setting and compaction of the final film.
  • direct printing the inks are typically highly viscose materials and slow drying.
  • An alternative approach using what is termed 100% solid inks is comprised of active monomers that cure to remove reactive components while preserving the functional needs of the electrode is conceivable.
  • a preferred means of forming an electrode element is to pre- form the film on an intermediate drum or plate for processing and densification before transferring the film to the substrate or receiving layer or separator or current collector of a device.
  • the electrode formation further comprises a means to transfer the free-form film to the build or substrate of device such as to cause transfer by pulsed irradiation through a translucent or transparent drum or plate serving as a transfer agent.
  • a means to transfer the free-form film to the build or substrate of device such as to cause transfer by pulsed irradiation through a translucent or transparent drum or plate serving as a transfer agent.
  • Described herein is an aspect of a method of forming a highly flexible low density low cost current collector (LD3C) is by the printing of a doped film forming ink.
  • the inks are comprised of conductive fibrous and conductive platelets dispersed within a polymer forming matrix.
  • said inks are matched to the print forming process in order to avoid or minimize the film forming nature of the polymer forming materials.
  • said film forming materials within the inks must be at a level that avoids a continuous non-conductive film formation over the conductive particles that must overlap or fuse to adjacent particles of similar nature.
  • the ink formulation and matching of such formulations to a deposition processes in order to avoid filming over of the conductive constituents in order to preserve the conductive properties within cured or set films is
  • Described herein is a method of print forming isolated zones within an energy storage apparatus.
  • the method comprises of using plasticized separator material and compatible current collector.
  • a key requirement for achieving the desired mechanical properties and isolation of cells is the proper formation of a suitable non-porous foundation within the separator film component or sub-assembly and an equally non-porous bus that is intimately associated with the said foundation forming materials of the separator.
  • the formulation of inks is used for initializing plasticization within the printed films in order to form a continuous seal between adjacent energy cells.
  • a current collector is fabricated using the following method.
  • the method comprises of using an ink comprising conductive fibrous and conductive platelets, using a pulsed irradiation source, using a pulse transfer scheme, print forming the ink, and curing the ink using pulsed ultraviolet curing.
  • a method 100 of manufacturing a flexible printed circuit board with energy storing capabilities comprises the steps of printing a highly conductive, adhesion diffusion barrier on a smooth surface with a high expansion coefficient 102 using print formed generating inks.
  • the highly conductive, adhesion diffusion barrier may, in one embodiment be made by dispersing nanoparticles of a high dielectric material within an RTIL and suitable binder materials.
  • the layer is made by print forming a porous separator material that is porous to the RTIL electrolyte to a degree not more than 30% and preferably between 15-25%.
  • the nanoparticles may be a titinate of Ti02 or BaTi203.
  • a thermoplastic binder with a processing temperature between lOOC and 400C may be used.
  • the substrate and deposition may then be cured or dried 104, as appropriate, depending on the materials used.
  • the electrode is then print formed 106 and the assembly is dried at high temperature to drive the water off 108.
  • the foundation layer including the ring seal pattern is then print formed 1 10.
  • the assembly may then be partially cured with air drying, UV or chemical curing methods 1 12.
  • the separator and electrode may be interlocked through the establishment of one or more concentration gradients by a print forming technique. This interlocking creates a structurally tough electrode layer by utilizing the characteristics of spliced or fused super aggregates.
  • a method of manufacturing a second, subsequent or complementary layer 200 of a flexible printed circuit board with energy storage capabilities may be completed in a similar manner to the method 100 outlined above. Different desired characteristics can be attained through using different base and additive chemicals or materials.
  • a reusable solid substrate 202 may act as a base.
  • a release layer such as PTFE, may be optionally incorporated.
  • a porous separator coating 204 may be print formed over the substrate.
  • a non-porous foundation 206 for ring seal patterning may be print formed to convert regions of porous substrate.
  • the substrate may be then be dried or cured 208, as necessary.
  • An adhesive bonding foundation may then be print formed 210 for the patterned ring seal.
  • the assembly may then be partially cured with air drying, UV or chemical curing methods 212.
  • the partially cured plates 100, 200 may then be aligned and joined according to the foundation pattern 302.
  • the assembly may then be cured with air drying, UV or chemical curing methods 304 and the ring seals formed 306.
  • the substrate may then be removed 308 from the plate 200 resulting in a half-build device 310.
  • This same process may be repeated to manufacture additional half-build devices 312 for combining with the original device 310 or assembly (not shown).
  • a half-build device 310 and complementary half-build device 312 can be joined together and loaded with electrolytes 402. The assembly can then be sealed through seam formation at the rim and Ring Seal locations 404 resulting in a sealed, single-layer device 406.
  • FIG. 5 depicts a simplified representation of the flexible circuit board processing line 500.
  • the processing line 500 commences with a material source roll 502 of a web or support substrate 504.
  • the web is a 5 micron PE web 504.
  • a conductive photo sensitive release material 506 is applied to the web 502.
  • a metal composite 508 is deposited over the conductive release material 506 as the material progresses down the line 500.
  • a barrier material 510 is infused over the circuit assembly and the circuit assembly is then air dried or cured, as necessary.
  • the curing is accomplished by a pulsed irradiation fusing drum. The result of this process line manufacture is designated Roll A, 514.
  • a subsequent pass through the line 500 can create a complementary Roll B, 516.
  • Roll A 514 and Roll B 156 may be joined 518 and processed further through the process of electrode deposition and fusing 520 and then- separator deposition and curing or setting 522, as necessary.
  • the combination of Roll A and Roll B 518 is processed further by infusing the ring seal pattern 524 and a final round of curing or air drying 526, as necessary.
  • the resulting device is a half-build roll 528.
  • the step of Ring Seal Infusion 524 is shown in the gas polymerization phase.
  • the Ring Seal 602 pattern allows the gas 604 to infuse through the substrate 606 to the electrode layer 608.
  • the polymerized gas material 610 is mechanically and electrically connected to the electrode layer 608.
  • the process line 700 for the manufacturing includes the build 702 which passes under a patterned drum 708.
  • the patterned drum 708 print forms the correct electrode or separator pattern on the build 702.
  • a cleaning station 704 clears the excess print material from the patterned drum 708 after printing on the build 702.
  • a charging roller 706 keeps the electrical charge of the patterned drum 708 at the appropriate level.
  • the patterned drum 708 may, in one embodiment, include a pulsed irradiation source 710.
  • a transfer drum 712 transfers the print material from the development station 714.
  • a pulsed curing station 716 follows the print step.
  • the build 702 may be shuttled in a single direction or, for the development of thicker films and builds, may be bi-directional.
  • the movement of the build 702 may be controlled with rollers, tracks, trays or some other means and is represented by element 718, generally.
  • the build 732 may be uni-directional; however, the print module 734 and the curing module 736 may be repeated serially on the process line 730. This multi-station approach will also allow for development of thick films or builds.
  • the electrode and half-separator 802 supports the cap layer 804.
  • the cap layer 804 provides interlocking means for adjacent layers or electronic components (not pictured) and can increase the z-axis profile of the build for different applications.
  • the conductor layer 806 is built up on the z-axis, as well and provides further interlocking means for either adjacent layers or electronic components (not pictured).
  • the final seal layer 808 is also interlocked and serves to increase the self-sealing properties of the flexible printed circuit board.
  • Roll A 900 is comprised of multiple layers.
  • the support web or temporary sealing layer 902 may be in the 3 - 10 micron thickness range.
  • the conductive release layer 904 which may be 0.1 to 3 microns thick, is print formed next and serves to release the build from the web 902 further in the process.
  • the conductive release layer 904 separates the aluminum planar layer 906, which may be 0.1 to 3 microns thick, from the electrode fusion layer 908, also 0.1 to 3 microns thick.
  • the aluminum planar layer 906 serves as an interlock between adjacent layers and provides some lateral toughness to the build.
  • the electrode fusion layer 908 serves both as an interlock for the aluminum planar layer 906 and as a seal for the build.
  • the 50 micron half-build 922 serves as the support.
  • the electrode fusion layer 924 which may be 0.1 to 3 microns thick, is print formed on top of the half-build 922.
  • the electrode fusion layer 924 serves as a build seal and as an interlock between the half-build 922 and the aluminum planar layer 926.
  • the aluminum planar layer 926 may be 0.1 to 3 microns thick and serves to strengthen the lateral toughness of the build and interlocks the adjacent layers.
  • the last layer to be print formed on the build is the conductive photo sensitive fusing and sealing layer 928.
  • the conductive photo sensitive fusing and sealing layer 928 which may be 0.1 to 3 microns thick, interlocks with the aluminum planar layer 926 and seals the build.
  • a multi-layer substrate 100 consisting of, for example, of a conductive interfacial layer 102, deposited in a desired pattern and a non-conductive layer 104, separating the conductive interfacial layers 102.
  • the conductive interfacial layer 102 provides for growth or build of the z-axis of the multi-layer substrate 100 as well as allowing for the interlocking of the layers of the multi-layer substrate 100.
  • a release layer 106 may be utilized to release the multi-layer substrate 100 from a manufacturing substrate (not shown).
  • An attachment layer 108 also strengthens the interlocking of the layers and may increase the adhesion between the electrode (not shown) and multi-layer substrate 100.
  • the edges of the multi-layer substrate 100 may also be sealed with a sealant 1 10 which strengthens and electrically seals the multi-layer substrate 100.
  • FIG. IB a side view of one embodiment of the invention is shown.
  • the cap layer 1 14 is disposed upon the electrode and separation or half-separation layer 1 12.
  • the conductor layer 1 16 is sandwiched between the cap layer 1 14 and the final seal layer 1 18.
  • Each of these layers, the cap layer 1 14, the conductor layer 1 16 and the final seal layer 1 18 all may be print formed during manufacturing in one embodiment of the invention.
  • the current collector plate 200 is assembled from the base substrate 202.
  • a pre-formed metal foil 204 may be used as a collector.
  • a conductive adhesive diffusion layer 206 is printed upon the metal foil 204. The assembly may be dried or heated to cure.
  • the electrode pattern is printed and then dried at a high temperature to dry or evaporate off the water.
  • the foundation with the ring seal pattern 208 is then printed on the assembly.
  • the electrodes 210 will be separated by and/or surround the foundation ring seal pattern 208.
  • the entire assembly may then be partially or totally cured, depending on the particular embodiment of the invention.
  • the separator plate 220 is initiated with a solid substrate 222.
  • the solid substrate 222 may be coated with a release layer 224, for example PTFE.
  • a porous separator layer 226 is then print formed on top of the release layer 224.
  • the imprinted areas will become non-porous separators 228.
  • the assembly may then be cured or dried, as necessary.
  • the two plates, current collector plate 200 and separator plate 220 may then be aligned and joined according to their foundation patterns.
  • the new joined assembly (not pictured) can then be cured to form the ring seal.
  • the solid substrate 222 may then be removed resulting in a half-build device.
  • FIG. 3 a cut-away view of a multi-layer flexible substrate 300 capable of storing energy is depicted.
  • the current collector 302 surrounds the super aggregator electrodes 304 which, in turn sandwiches the porous separator layer 306 and the non- porous foundation 308.
  • FIG. 4A shows a multi-layer flexible substrate 400 with substrate 402 and array 404.
  • array 404 may include electrically isolated zones.
  • Electronic components or control devices 406 may be embedded or electrically connected to the array 404.
  • the electrically isolated zones of array 404 may include zones with differing electrical properties. These zones 410 may have different RC characteristics than the rest of the array 404.
  • the zones 408 may also include a particular voltage within the zone.
  • device assembly 500 is an example of one embodiment of the invention being utilized in a consumer electronic device.
  • the device encasement 502 may be made of any rigid or semi-rigid material including, but not limited to plastics, woods or metals.
  • the one or more embedded flexible power circuits 504 can conform itself to the interior of the device encasement 502.
  • a traditional printed circuit board 506 may be within the device assembly 500.
  • One or more components 508 may be inserted into or connected to the printed circuit board 506.
  • One side of the printed circuit board 506 may be designed as a power plane 510 and the other side may be designed as a ground plane 512.
  • An internal battery 514 or supercapacitor may be connected, or integral, to the printed circuit board 506.
  • the one or more flexible power circuits 504 may be tapped into singly for the circuit voltage, or in tandem for twice, or the sum of, the circuit voltage.
  • the stacked assembly 540 of the one or more flexible printed circuit boards 504 further illustrates the availability of increased power through multiple "stacked" boards.
  • two of the flexible printed circuit boards 504 are on opposite sides of substrate or support board 542.
  • the substrate 542 may be a series of supporting ribs or may be a traditional circuit board material.
  • Electronic components 544 are depicted as mounted on or through the support board 542 and passing through the flexible printed circuit board 504.
  • the total power 546 available in this configuration is the sum of the voltages of each of the single flexible printed circuit boards 504.
  • a versatile energy storing tape that is dispersed as discrete segments from a roll containing the same.
  • the design of the tape is in a manner that enables the rapid prototyping of power supply requirements for virtually any application requiring power.
  • properties include its flexible format with a bending radius of J -cm of less, robust mechanical properties that enable multiple flex or formable power, and series stackable for higher voltages.
  • the design includes a means of interfacing electronic components by means of standard pin-out and soldering.
  • energy storage sheet 10 may be composed of two halves or parts with at least a separator layer 12 in between.
  • Each of the two halves or parts may include an electrode layer 14 and a current collector layer 16.
  • Each electrode layer 14 may be in intimate contact with, and/or entangled with, separator layer 12.
  • the material of each electrode layer 14 may be pinned between the grain boundary of current collector 16 and separator 12.
  • Electrode layer 14 may be made by a separate electrode preparation process, partially shown in Figures 3A-3C and depicted in Figure AA.
  • a nano-mix may be added to a gelable solution that would become a sol-gel.
  • a nano-mix may consist of any nanoscale materials or blends.
  • polymers, metals, oxides of metals, ceramic or other type material may be used with the nano-mix.
  • the nano-mix may be a blend of nano-materials such as nanowires, carbon nanotubes (CNT), including multi-walled nanotubes (MWNT), and fat, long-aligned CNT bundles that can resemble yarn when viewed with a scanning electron microscope (SEM). If carbon (e.g.
  • the carbon density may be greater than 0.5-g/cc.
  • the carbon density may be between 0.5 and 2 g/cc.
  • the nano material should preferably have high strength, low density, a high aspect ratio (length vs. diameter), and may be fusible with pulse radiation or other means.
  • the gelable liquid that may be comprised of precursory materials for aerogel formation together with the nano mix may then be gelled and then dried into an aerogel in a similar manner to the way in which pure sol-gel is turned into an aerogel from a liquid solution.
  • the gelled system may be further dried in the similar manners to which sol-gel is dried into aerogel.
  • the drying may be an air dry process or a super critical fluid C0 2 process that is known to those skilled in the art.
  • a hardened porous material may result from the aerogel and nano mix blend.
  • the porous properties of the hardened materials can be adjusted by varying the ratio of the constituents within the nano-blend and the properties of the starting sol-gel.
  • Various pores are feasible within the hardened materials, such as pores ranging from macropores (greater than 50 nm), to mesopores (50 nm down to 2 nm), to micropores (under 2 nm).
  • the hardened material at this stage may not be carbonized or fully conductive. While the nano-materials may be conductive, the hardened material may still include particles other than carbon most notably the aerogel component.
  • the hardened porous material may then be pyrolyzed, for example, in order to produce a substance that is richer in carbon after the resulting volatile moieties of the aerogel are oxidized off during the pyrolysis process.
  • the pyrolysis may result in a material that is shrunk from its original size and may involve a conditioning environment during or post-pyrolysis to induce unique properties to the nano-mix or aerogel components.
  • FIGs 3A-3C a representation of a pyrolyzed material 34 is shown.
  • the pyrolyzed material 34 is shown having the nano mix 36 interspersed throughout.
  • the pyrolyzed material 34 may further be a highly porous material.
  • the pyrolyzed material 34 may then be turned into a powder, depicted by electrode particles 38, for example by grinding or milling the material.
  • the grinding process may include a cryogenic ball milling process. However, other processes are contemplated such as room temperature milling.
  • Each particle is designed to contain a mixture of macropores, mesopores and/or micropores in order to tune the mass transport properties and charge carrying capacity of the particles.
  • the electrode particles 38 may have a high porosity electrode core and a matrix of conductive nano materials that protrude from the high porosity electrode core.
  • the electrode particles 38 may be called “hairy particle,” where this matrix of long nano mix components sticks out like hairs around the carbon blend of materials that predominantly makes up the particle.
  • the "hairy” electrode particle 38 may be an energy storing electrode that is capable of interlocking with neighboring particles and provides suitable nano-scale tethering to the layers above and below the electrode 38 when applied to the sheet 10.
  • the electrode particle 38 may thus be capable of interlocking with another layer in any direction to allow high density and constant power with increasing thickness of an electrode layer that comprises a plurality of the electrode particles 38.
  • the electrode particle 38 may have optimal mass transport of electrolyte between the particles while also containing high surface area microstructures, for example of the aerogel, within.
  • this powder may be turned into an ink by mixing the powder with a suitable rheological modifier such as hexane, DMSO, mineral spirits, alcohols or another liquid organic material or blend of materials.
  • a suitable rheological modifier such as hexane, DMSO, mineral spirits, alcohols or another liquid organic material or blend of materials.
  • the powder may be combined with the coupling agents, rheological agents and dispersed with ultrasonic dispersion technique.
  • the ink may be combined with or without a dispersing agent included, such as a surfactant or matching solubility parameters.
  • the resulting electrode ink may provide a linear relationship between the printed electrode thickness, and energy and power density, and also contain the nano mix "hair particles" to help with, or facilitate, the bonding and anchoring of the electrode to the porous separator and current collector matreials.
  • the energy storing electrode may be preloaded with electrolyte prior to printing, and either before or after becoming an ink.
  • the electrode ink may be applied to create the electrode layer 14.
  • the electrode layer 14 may be applied to the substrate 22 over only the porous separator film cells 32.
  • the ink may thus be sprayed using an indirect print but a direct printing process such as gravure, flexographic, screen, or a transfer drum are easily accomplished too.
  • the electrode layer 14 may be applied over the separator film 12 in more than one layer.
  • the hairy nano material of the electrode layer 14 is configured to nanoscale interlock between adjacent particles and with the particles of the separator film 12 in such a way to assure a high percentage of the protruding nano materials being intercalated within the previous separator film 12 pores.
  • Temperature and pressure treatment may be utilized in order to form a highly entangled interfacial zone between the separator film 12 and the electrode layer 14.
  • the electrode layer 14 may be flash cured with a pulsed radiation light source.
  • the electrode materials could become incorporated within the gain boundaries of a printed current collector.
  • the process for applying the electrode layer 14 may be a wet process as described hereinabove, dry processes are also contemplated.
  • the electrode layer 14 may be electrostatically deposited onto a transfer drum then directly printed onto the separator film 12.
  • the electrode layer 14 may be formed from hairy particles that are combined together to form super-aggregate groups.
  • the primary aerogel particles (6 illustrated), each with "hairy" MWNT, CNT or nanowire protrusions, or hairs, are bound together to form the super-aggregate material.
  • the process of forming the super-aggregate groups can be by phase segregation techniques within the sol-gel, as discussed above, to obtain a suspension of the sol-gel materials. Alternatively, they can form directly from hairy primary particles that are aggregated or fused as per the teachings in this section.
  • an electrode of the energy storage sheet is formed from a cluster of the super-aggregates.
  • the conductivity by clustering of the super-aggregates can be accomplished, for example, by contact, splicing or fusing of the hairs protruding among different super-aggregates. If performed by splicing, then a splicing agent may be used.
  • the electrode after clustering of the super-aggregates is illustrated in Figure DD.
  • a process for making tough, low contact resistance high surface area electrode particles is disclosed.
  • This process, and the materials made from it, can produce micron-dimensioned, high surface area thick-films with low internal resistance for high power, and mechanically tough electrodes.
  • the internal toughness of the electrode material may be increased, while also reducing the interconnect CNT resistance, by photonic welding and/or spark plasma sintering of the protrusions of the electrode particles.
  • Electrolyte loading may be used to help in the formation of micron- sized electrode hairy particles.
  • the loaded particles may be formed by a blend of SCF liquid, electrolyte and CNTs in proportions such that the SCF volume fraction approximately equals the volume fraction lost during sintering and shrinkage of the particles.
  • the loaded particles may be formed by blending low boiling point liquids or sublimable solids with the electrolyte and CNTs in proportions such that the low boiling point liquids or sublimable solid volume fractions approximately equals the volume fraction during a controlled sintering and shrinkage of the close-packed particles.
  • the process may include loading the electrode particles with electrolyte and assembling the particles into a chamber or cell in order to provide low contact resistance electrodes.
  • the electrode may be formed with the loaded particles by print forming the electrode to form a green state build, which upon densification by sintering and shrinkage of the containment chamber or cell for the electrode, will release entrapped gasses through the open porous structure of the chamber or cell while filling voids within the shrinking chamber or cell with the electrolyte.
  • a process for building a nano-composite, high- permittivity separator is disclosed.
  • the separator for EDLC (electric double layer capacitor) devices can contribute to energy storage and promotes mechanically tough structural elements that store energy.
  • the separator can form a tough continuous interface with embedded energy storing particles such as ceramics or conductive materials and the porous matrix surrounding said particles such as to reduce the propensity for dielectric breakdown.
  • the separator can incorporate thermoplastic coated ceramic, crystalline polymers or conductive materials particles that can be sintered during processing to enable tunable pore formation within the said separator.
  • a tunable porous separator can have pores that are torturous and have an effective length that is 3 to 5 times greater than the true thickness of the separator material.
  • the porous separator may incorporate CNT or nano-fibrous materials that entangle with electrode forming materials on either side of the separator in such a manner that the mechanical strength between the two materials is improved significantly.
  • a process for building a layer-by-layer nano particle structure which is porous, mechanically tough and demonstrates a suitable permittivity.
  • the process may include a method of formulating a high solid content layer capable of demonstrating high dielectric properties.
  • the high solid content layer may include nanoparticles of high dielectric materials are dispersed within an RTIL electrolyte and suitable binder materials in an amount sufficient to form a tight network of particles that is porous to the RTIL electrolyte to a degree not greater than 60% and more specifically 15-40%.
  • the high dielectric materials might include Ti0 2 , BaTi 2 0 3 , and other similar materials.
  • the suitable binders might include thermoplastic and thermoplastic treated crystalline materials with a processing temperature greater than 100-C but below 400-C.
  • printing of the micron or nano-sized particulate matter may be performed by known means to form a continuous thick layer of high permittivity and known pore structures.
  • two-sided printing may be performed by known means of thermoplastic encapsulated nano-crystalline materials where said thermoplastic materials forms a layer that enables entanglement of adjacent particles once the processing temperature is obtained.
  • the two-sided printed process may be controlled in such a way where the thickness and type of thermoplastic coupled with the temperature and time for processing predetermines the resulting interstitial voids or pores between the particles once sintered. It may be possible to add CNT or fibrous materials to the separator particles, thereby enabling the formation of extended hair like structures on a micron to nanoscale during processing.
  • Further processing may include embedding electrode particular materials ' between the separator particles by known printing means in order to form a tough mechanical bond between the separator particles and the electrode materials.
  • the printing of the particles with electrolyte may be accomplished in place by known printing techniques.
  • sintering the particles to form a density gradient of separator and electrode materials without a well-defined interface is performed.
  • the pore structures that naturally form within all printed separator materials disclosed may be formed and further regulated by common methods such as the use of porogens from the common class of chemicals known as blowing agents or from multi- phased systems such as, emulsions or thermodynamically stable microemulsions or microsuspensions.
  • porogens from the common class of chemicals known as blowing agents or from multi- phased systems such as, emulsions or thermodynamically stable microemulsions or microsuspensions.
  • porogen materials are added to the polymer producing or polymer containing inks in amounts typically ranging from 0. 1 % to 5% by weight but more specifically 0.1 to 2%.
  • Figures XX illustrates a cross-sectional view of a printed (e.g., print- formed) pressure tight energy storage cell (or isolation capsule) that is massively repeatable throughout the plane of an energy storage sheet according to certain embodiments.
  • the cell can include a thin-film porous separator layer together with a patterned, non-porous foundation boundary.
  • the porous separator material may be between about 5um and about lOOum thick, with other thicknesses contemplated for various applications, and may have a mixed pore size distribution.
  • the pattern of the foundation can be such that it defines a cell shape.
  • the cell shape can be, for example, triangular.
  • the substantially planar cell shape can be defined by the edges of the cell shape. In this way, the edges of the cell shape mostly coincide with the pattern of the foundation boundary, leaving the cell shape center mostly coinciding with the separator.
  • a thin-film, patterned electrode is printed on each side of the separator.
  • the pattern of the electrode is substantially a reverse image of the foundation pattern; that is, where there is foundation material, there mostly is not electrode material, and vice versa.
  • the electrode material directly over both sides of the separator, without covering the foundation material.
  • Each electrode may be printed or deposited using electrode material that includes hairy particles, which are capable of forming, and do form, interlocks among themselves.
  • the hairy particles in the electrode material may be interconnected using a welding or fusing process. This type of electrode processing can provide added strength to the electrode layers, while preserving energy transport properties.
  • the collector layers may include one or more sub-layers, which together make up the collector layers.
  • the collector layers are printed to be in intimate contact with each electrode layer. Additionally, the collector layers are printed to be in intimate contact with exposed foundation boundary, if any.
  • the collector layers may provide low resistance collection of current from the electrode layer, and be interlocked to the electrode layer for added strength and stability of the cell.
  • a current bus or rib may be printed to correspond to the foundation in order to carry current in xy plane over large areas or to offset height differences between the electrode and the foundation if needed.
  • the collector layers and the bus or rib if present facilitate the formation of a pressure- tight seal for the cell.
  • the pressure-tight seal between cells may provide isolation between about lpsi and lOpsi, with higher pressures possible if needed or desired in future applications.
  • each interface may have a grainy boundary between the layers, with the electrode material being pinned between the two grainy boundary layer interfaces.
  • the hairy particles in the electrode material may be interconnected using a welding or fusing process.
  • Cell production may include synchronized, low-temperature processing and pulsed irradiation to obtain conductivity within the layers and to form the pressure-tight seal around the layered cell.
  • the cells can be combined or formed at their edges to form an energy storage sheet.
  • the various layers of each cell are approximately in the same plane with each other (e.g., the separator layers of each cell are approximately in one plane, and so on). It may be possible to produce the sheet with multiple cells, such that the patterned foundation that defines each cell boundary is a shared cell edge between adjacent cells. When produced in a sheet, each cell is capable of energy storage in isolation of one or more of the other cells. Sheets formed in this manner are termed a massively paralleled cell design and may be stacked on their planar surfaces to form a stacked sheet, which may result in synergistic functional characteristics.
  • the cells may be individually addressed electrically by printing patterned collector layers on at least one side of the sheet containing a plurality of electrodes in a single plane.
  • printed non-conductive ribs electrically isolate and form a pressure tight seal with the patterned collector layers.
  • the alpha, option A build refers to a print formed energy storage sheet at the conclusion of a product development cycle.
  • all three versions of the alpha build are 100% print forming process for obtaining an energy storing sheet that is flexible and embodies energy storage technologies while maintaining and meeting structural sheeting requirements.
  • the alpha build, option A is a segmented print formed process that overcomes the limitations of sealing found within the V-6 version.
  • the separator plus foundation component is preformed onto substrate or plate 1 while the current collector is preformed along with its current bus and electrode onto substrate or plate 2.
  • the mating of the two plates is accomplished after the device is loaded with electrolyte and made ready with a means for forming a permanent seal between the two components.
  • the completed electrode component with its separator is then heat treated to affect sealing.
  • the adhesion to plate 2 by the current collector is reduced in order to allow plate removal without impacting the integrity of the electrode ensemble.
  • Plate 1 with the porous separator and foundation is prepared as previously disclosed in v-6 reports and associated data. Plate 1 is set aside until the mating step. Plate 2, begins by the design and deposition of a temporary release layer (if needed) followed by the placement of a carbon veil under tension directly over the plate completely covering the work area of the build. Next, a direct print step is initiated to print form the current collector onto and predominately through the veil material.
  • a suitable material is cellulose triacetate but other materials are suitable. This step is repeated two additional times to assure a pin-hole free build. For enhanced conductivity and lower ESR, the last coating step should be laced with a suitable film forming conductive polymer solution or metallic ink.
  • a patterned indirect print process is executed to prepare the veil for a current bus.
  • the current bus is then applied with at least one direct print step that overlays the indirect print pattern in order to draw the conductive veil near the plate surface while providing an insulating surface for subsequent processing.
  • a plasticizing material is applied by a patterned print within the electrode pocket formed between the current bus.
  • an electrode adjoining layer is print formed by direct print in order to make contact and transfer with the collector. The purpose and intent here is to enable an interlocking of the electrode with the current collector.
  • a heat treatment to effect bonding is initiated together with the print step or as a separate step.
  • the electrode is built by dry or wet print step(s) and calendared to make ready for mating.
  • a plasticizer materials is applied uniformly over the current bus and foundation patterned by a direct print process.
  • a sparse indirect print process is delivered to the active zone of the electrode and separator.
  • the two plates are mated and cured with heat.
  • the current collector is separated from plate 2 by known means and the complete and sealed electrode ensemble is made ready for adjoining into a fully functional device by previously disclosed means.
  • a continuous carbon fiber veil encapsulated within a sealing material such as cellulose triacetate is also a considered and demonstrated z-axis conductor.
  • a continuous coating of a conductive polymer or alternatively a conductive metal ink is applied to the inside (facing electrode) surface of the z-axis conductive layer.
  • Suitable materials include PEDOT-PSS with sorbitol and a surfactant as rheology modifiers.
  • the electrode can be fused to the veil and conductive polymer film within the skeleton using pulsed radiation that is commercially available. Such fusing of the carboneous components has been demonstrated in this effort and reported in the literature. The resulting lowering of resistance and associated increase in strength are of particular interest to this work.
  • a integrated energy storing sheet by print formed processing 1.
  • a current collecting element formed into a self-sealing component comprised of collector, sealer, and electrode elements.
  • a means and process for enhancing the internal strength of the electrode and current collector ensemble 5.
  • the alpha, option B build refers to a commercial ready print formed energy storage sheet at the conclusion of a development cycle. As an alpha version, it incorporates the teachings of the previous versions in order to meet technological or manufacturability requirements. In addition, all three versions of the alpha build are 100% print forming process for obtaining an energy storing sheet that is " flexible and embodies energy storage technologies while maintaining and meeting structural sheeting requirements.
  • the alpha build, option B is a single sided, print formed process that overcomes the mentioned V-6 limitations and the alignment issues of the two plates associated with option A.
  • an indirect printed surface preparation step is inserted into the processing.
  • the purpose of this layer is to prepare the electrode surface for receiving solvent loaded separator materials. This is accomplished by printing onto the top of the veil / electrode first with a dry separator material and then with a wet semi-porous separator material.
  • the completed absorbent layer over the electrode component is then dried and printed onto with a suitable separator material that will form a suitably sized porous structure.
  • a foundation layer is print formed by previously discussed means and the structure is completed by known means.
  • a receiver plate begins by the design and deposition of a temporary release layer (if needed) followed by the placement of a carbon veil under tension directly over the plate completely covering the work area of the build.
  • a direct print step is initiated to print form the current collector onto and predominately through the veil material.
  • a suitable material is cellulose triacetate but other materials are suitable. This step is repeated two additional times to assure a pin-hole free build.
  • the last coating step should be laced with a suitable film forming conductive polymer solution or metallic ink.
  • a suitable film forming conductive polymer solution or metallic ink is a mixture of PEDOT-PSS plus sorbitol plus a surfactant or other wetting agent.
  • a patterned indirect print process is executed to prepare the veil for a current bus.
  • the current bus is then applied with at least one direct print step that overlays the indirect print pattern in order to draw the conductive veil near the plate surface while providing an insulating surface for subsequent processing.
  • an electrode adjoining layer is print formed by indirect printing assuring adequate packing and contact and with all components to the collector. The intent being to improve conductivity at the interface to the electrode and to enhance the strength between the two materials.
  • the electrode mixture may include a binding agent or fusing agent where the purpose and intent here is to enable an interlocking of the electrode with the current collector.
  • a heat treatment to effect bonding is initiated together with the print step or as a separate step. This step may include or substitute a pulsed radiation treatment of the build.
  • the electrode is built by dry or wet print step(s) and calendared to make ready for application of the separator.
  • a plasticizer materials is applied uniformly over the current bus and foundation patterned by a direct print process.
  • a sparse indirect print process is delivered to the active zone of the electrode and separator.
  • the two plates are mated and cured with heat.
  • the current collector is separated from plate 2 by known means and the complete and sealed electrode ensemble is made ready for adjoining into a fully functional device by previously disclosed means.
  • the current collection obtained by a means for self-assembling z-axis conduction within the sealing materials before cure or immobilization of the sealing component.
  • a continuous carbon fiber veil encapsulated within a sealing material such as cellulose triacetate is also a considered and demonstrated z-axis conductor.
  • a continuous coating of a conductive polymer or alternatively a conductive metal ink is applied to the inside (facing electrode) surface of the z-axis conductive layer.
  • Suitable materials include PEDOT-PSS with sorbitol and a surfactant as rheology modifiers.
  • the electrode can be fused to the veil and conductive polymer film within the skeleton using pulsed radiation that is commercially available. Such fusing of the carboneous components has been demonstrated in this effort and reported in the literature. The resulting lowering of resistance and associated increase in strength are of particular interest to this work.
  • Dioxane 40 ml Combine mineral spirits, hexane and dioxane in 16 oz bottle. Shake bottle vigorously to mix solvents.
  • Part A (Binder stock):
  • Part B (Electrode stock):
  • Air deflector pressure approx. 4.5 psi
  • a light coating of PTFE should be sprayed onto the full Al flashing plate at a distance of approx. 12".
  • Approximate thickness of final separator can range from 10-40 ⁇ depending on the number of runs chosen .
  • Electrode mix of choice at desired loading level (total area sprayed is estimated to be about 100 cm2); current formulation is Aerogel/MWCNT/PEDOT/sorb in 90/10 hexane/IPA
  • Spray 3 passes then lower assembly one set of dowel pins and repeat.
  • An apparatus for supplying power comprising:
  • a flexible electronic comprising an electrode and a current collector
  • the apparatus of claim Al further comprising a means to enable dynamic patterning for receiving one or more components.
  • the energy source comprises a power plane, a ground plane and a battery.
  • A5. The apparatus of claim Al, wherein the interface comprises one or more pin-outs.
  • A7. The apparatus of claim Al , wherein the segments comprising printed cutouts.
  • A9 The apparatus of claim Al , wherein the flexible ribbon further comprises a first ribbon and a second ribbon.
  • a 10 The apparatus of claims Al, wherein the current collector and electrode are performed onto the first conductive substrate and the seperator and foundation components are preformed onto the second conductive substrate.
  • a 10.1 The apparatus of claim Al, wherein the electrode and current collector are interlocked using a first scheme.
  • a 10.2 The apparatus of claim Al , wherein the current collector comprises highly flexible self-sealing components, conductive fibrous and conductive platelets.
  • An apparatus for storing energy comprising:
  • a flexible device comprising plurality of energy storing segments dispersed across the flexible device
  • A12 The apparatus of claim Al l , further comprising a vinyl embedded device and an internal support rib.
  • the apparatus of claim Al l the energy storing segments are connected in parallel.
  • A15. The apparatus of claim Al l, wherein the energy storing segments are connected in a series, each segment folded back onto itself in a z-fold or z-shape.
  • A16. The apparatus of claim Al l , wherein the energy storing segments comprises a power tape technology.
  • a 17. The apparatus of claim Al l, wherein the energy storing segments further comprises a containment chamber and a current bus.
  • a flexible apparatus for storing energy comprising:
  • inks which comprise conductive fibrous and conductive platlets are used to form the current collector.
  • a method of making a printed electronic tape comprising:
  • the printed components comprising a current collector, electrode, separator and partitions
  • the method of claim Bl, assembling comprises of using pulsed irradiation to transfer the electrode materials to at least one of the components.
  • a method of making a current collector comprising:
  • the ink comprises a conductive fibrous and conductive platelets which are dispersed within a polymer forming matrix
  • a method of free-form fabrication of a current collector comprising: printing using conductive ink; and pulsed ultra-violet curing the ink.
  • a method of making a current collector, the me.thod comprising:
  • an ink comprising conductive fibrous and conductive platelets
  • a method of making a current collector comprising:
  • an ink comprising conductive fibrous and conductive platelets
  • a method of print forming partitions to form isolated zones within an energy storage apparatus comprising:
  • plasticizing agent plasticized separator material, and compatible current collector; forming a non-porous foundation within the separator film component;
  • a flexible printed circuit board with energy storing capabilities comprising: a one or more flexible multi-layer substrates composed of a parallel array of a one or more isolated energy storage element arrays separated by a common current bus.
  • the one or more flexible multi-layer substrates composed of a parallel array of a one or more isolated energy storage element arrays separated by a common current bus is conformed as an energy storage structural sheet.
  • the one or more flexible multi-layer substrates composed of a parallel array of a one or more isolated energy storage element arrays separated by a common current bus further comprises a means of producing high voltages within the energy storing structural sheet.
  • the one or more flexible multi-layer substrate has a toughness modulus greater than 10 kPa at 10% strain.
  • the one or more flexible multi-layer substrate has a toughness modulus of at least 70 kPa at 10% strain.
  • the parallel array of isolated energy storage element array further comprises a parallel array of hybrid- supercapacitors.
  • the one or more flexible multi-layer, substrate further comprises two or more multi-layer substrates.
  • the flexible printed circuit board of claim 1 wherein, the parallel array of isolated energy storage element arrays provides a circuit with enhanced reliability.
  • the parallel array of isolated energy storage element arrays may be partially removed.
  • the flexible printed circuit board of claim 1- further comprising an electrically isolated zone in the parallel array of a one or more isolated energy storage element arrays.
  • step of providing the one or more parallel array of a one or more isolated energy storage element arrays further comprises the step of providing a one or more isolated energy storage element arrays which has an energy storage density greater than 5Wh/kg.
  • step of providing the one or more flexible multi-layer substrates further comprises providing a one or more flexible multi-layer substrate which has a toughness modulus greater than 10 kPa at 10% strain.
  • step of providing the one or more flexible multi-layer substrates further comprises providing a one or more flexible multi-layer substrate which has a toughness modulus of at least 70 kPa at 10% strain.
  • step of providing the one or more parallel array of a one or more isolated energy storage element arrays further comprises the step of providing a parallel array of hybrid- supercapacitors.
  • step of providing the one or more flexible multi-layer substrates further comprises providing two multi-layer substrates.
  • step of providing the one or more parallel array of a one or more isolated energy storage element arrays further comprises providing an electrically isolated zone in the parallel array of a one or more isolated energy storage element arrays.
  • step of providing an electrically isolated zone in the parallel array of the one or more isolated energy arrays further comprises providing an active electronic component in the parallel array of the one or more isolated energy arrays.
  • step of providing an electrically isolated zone in the parallel array of the one or more isolated energy arrays further comprises providing an electronic control element in the parallel array of the one or more isolated energy arrays.
  • a power storage device comprising:
  • a one or more flexible multi-layer substrates composed of a parallel array of a one or more isolated energy storage element arrays separated by a common current bus.
  • the power storage device is a power amplification element.
  • the power storage device of claim 31 further comprising:
  • the power storage device can be mounted on a rigid or semi-rigid printed circuit board.
  • the power storage device of claim 31 further comprising:
  • a planar surface mount connection means wherein the power storage device can be mounted on a rigid or semi-rigid printed circuit board.
  • the power storage device of claim 31 further comprising:
  • the power storage device can be mounted between two rigid or semi-rigid printed circuit boards.
  • the power storage device of claim 43 wherein the power storage device is a backup storage element. 46. The power storage device of claim 43 wherein the power storage device is a power supply element.
  • the power storage device of claim 31 further comprising:
  • a planar surface mount connection means wherein the power storage device can be mounted on a flexible circuit board.
  • a method of manufacturing a flexible printed circuit board with energy storing capabilities comprising:
  • the method of manufacturing the flexible printed circuit board of claim 1, wherein the step of print forming a porous separator material with a suitable permittivity, pore structure and thickness further comprises the step of print forming with a means for pulsed patterned transfer. 2. The method of manufacturing the flexible printed circuit board of claim 1, wherein the step of print forming a porous separator material with a suitable permittivity, pore structure and thickness further comprises the step of dispersing nanoparticles of a high dielectric material within an RTIL and suitable binder materials.
  • step of print forming a porous separator material with a suitable permittivity, pore structure and thickness further comprises the step of print forming a porous separator material that is porous to the RTIL electrolyte to a degree not more than 30%.
  • step of print forming a porous separator material with a suitable permittivity, pore structure and thickness further comprises the step of print forming a porous separator material that is porous to the RTIL electrolyte to a degree between 15- 25%.
  • step of depositing nano-material of a high dielectric material within an RTIL and suitable binder materials further comprises the step of depositing nano- material of a titinate of Ti02 or BaTi203 within an RTIL and suitable binder.
  • step of depositing nano-material of a high dielectric material within an RTIL and suitable binder materials further comprises the step of depositing nano- material of a high dielectric material within an RTIL and a thermoplastic binder with a processing temperature between lOOC and 400C.
  • step of print forming a porous separator material with a suitable permittivity, pore structure and thickness further comprises the step of making porous media for energy storage applications using print formed generating inks.
  • the step of depositing conductive nano-material such that the nano-material permeates the electrode layer further comprises the step of utilizing a means to interlock the nano-material and the electrode layer through the establishment of one or more concentration gradients by print forming technique.
  • the step of utilizing a means to interlock the nano-material and the electrode layer through the establishment of one or more concentration gradients by print forming technique further comprises the step of interlocking functional components to the flexible printed circuit board by one or more print formed concentration gradients.
  • step of applying a fusible, conductive nano-material within the pores formed by the cross-linkable material and the conductive nano-material to form a continuous conductive thread further comprises providing the means to form a continuous conductive thread.
  • step of applying a fusible, conductive nano-material within the pores formed by the cross-linkable material and the conductive nano-material to form a continuous conductive thread further comprises applying super aggregates within the pores formed by the cross-linkable material to form a continuous conductive thread.
  • step of print forming an electrode layer mechanically directly to the separator material further comprises providing a means for print forming a structurally tough electrode layer.
  • step of print forming a structurally tough electrode layer further comprises providing the step of forming a structurally tough electrode layer by splicing super aggregates.
  • step of print forming a structurally tough electrode layer further comprises providing the step of forming a structurally tough electrode layer by fusing super aggregates.
  • step of curing the flexible printed circuit board further comprises the step of using a means for pulsed curing of the flexible printed circuit board.
  • step of providing the means to build up the desired characteristics of the flexible printed circuit board further comprises the step of using a means for pulsed curing of the flexible printed circuit board.
  • step of reversing build process direction to build up the desired characteristics of the flexible printed circuit board further comprises:
  • the step of print forming an electrode fusion layer on a half-build substrate the step of providing an aluminum planar conductor disposed upon the electrode fusion layer;
  • a method of manufacturing a flexible printed circuit board with a current collector side and a separator side comprising:
  • seaming the two half-devices at one or more ring seals and the external rim of the device 22.
  • the step of seaming the two half-devices at one or more ring seals further comprises the step of forming the one or more ring seals to isolate ion transport within each energy storing element from its nearest neighbors.
  • step of seaming the two half-devices at one or more ring seals further comprises the step of forming the one or more ring seals to isolate ion transport within each energy storing cell from its nearest neighbors.
  • a flexible printed circuit board with energy storing capabilities manufactured according to the method of claim 1 , comprising:
  • a print formed electrode layer mechanically directly to the separator material; a conductive nano-material deposited such that the nano-material permeates the electrode layer;
  • a cross-linkable material applied to the conductive nano-material; and a fusible, conductive nano-material applied within the pores formed by the cross-linkable material and the conductive nano-material to form a continuous conductive thread.
  • a method of manufacture for an electrode ink used to make an electrode layer of an energy storage sheet comprising:
  • preparing the nano-mix comprises:
  • nano-materials including polymers, metals, oxides of metals, silicon, ceramic and carboneous materials,
  • preparing the nano-mix comprises:
  • the materials including polymers, metals, oxides of metals, silicon, ceramic and nano-materials,
  • nano-materials incudes carbon nanotubes (CNT), multi-walled nanotubes
  • the preparing the sol-gel mixture comprises combining precursory materials for aerogel formation and the nano-mix.
  • turning the pyrolyzed material into a powder comprises grinding the pyrolyzed material using a cryogenic ball milling process.
  • preparing the electrode ink comprises mixing the powder with one or more coupling agents and one or more rheological agents.
  • preparing the electrode ink further comprises combining in one or more dispersing agents.
  • An electrode ink used to make an electrode layer of an energy storage sheet comprising:
  • the materials including polymers, metals, silcon, oxides of metals, ceramic and nano-materials,
  • nano-materials incudes carbon nanotubes (CNT), multi-walled nanotubes
  • electrode ink of claim 9 wherein the electrodes have a carbon density of between about 0.5 g/cc and about 1.5 g/cc.
  • the electrode ink of claim 8 wherein the conductive powder is dispersed with one or more coupling agents and one or more rheological agents. 12. The electrode ink of claim 1 1 , wherein the means for preparing the electrode ink further comprises means for combining in one or more dispersing agents.
  • a seamlessly integrated energy storing sheet by print formed processing is provided.
  • a current collecting element formed into a self-sealing component comprised of collector, sealer, and electrode elements.
  • a means and process of lowering ESR by interlocking electrode and current collector components
  • a means and process for enhancing the internal strength of the electrode and current collector ensemble is provided.
  • An apparatus for energy storage comprising:
  • gy storage cell the cell including:
  • a printed, thin-film, porous separator having a thickness and a substantially planar shape, the shape being defined by shape edges;
  • a plurality of printed, thin-film, patterned electrodes at least one electrode in intimate contact with a first planar surface of the separator and at least one other electrode in intimate contact with a second planar surface of the separator;
  • a plurality of printed, thin-film collector layers at least one collector layer in intimate contact with an outer planar surface of the at least one electrode and a first planar surface of the foundation boundary, both on the same side of the cell, and at least one other collector layer in intimate contact with an outer planar surface of the at least one other electrode and a second planar surface of the foundation boundary, both on the other side of the cell,
  • each cell is capable of energy storage in isolation of at least one of the remaining plurality of cells.
  • a method of producing an energy storage device comprising:
  • An apparatus for energy storage comprising:
  • a method of making an electrode comprising:
  • printing a film comprising direct or indirect printing
  • a method of making an electrode comprising:
  • printing a film comprising direct and indirect printing; pre-forming the film on an device for processing and densification; and transferring the film to a receiver;
  • printing comprises of forming a film that is highly conductive by using solid ink.
  • printing comprises of micro-emulsions comprising salt for fabrication of porous separators with tunable pore size control.
  • printing the film comprises of using ink comprising phase separation pore forming agent for free forming fabrication.
  • printing the film comprises of using ink comprising sub-limable pore forming agent for free forming fabrication.
  • a method for producing an energy storage device comprising:
  • printing each of the first and second current collector plates comprises:
  • the collector sub-assembly includes:
  • printing each of the first and second separator plates comprises print-forming a separator sub-assembly on a second substrate.
  • printing the separator sub-assembly comprises:
  • a flexible integrated power tape adapted for use in- electronics devices, comprising: at least one energy segment element operatively coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current.
  • An energy storing tape comprising: an energy segment element electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current.
  • An energy storage tape aggregate comprising: a plurality of energy segment elements electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current, wherein the plurality of energy segment elements is tunably overlapped such that higher overall voltages are scaled proportional to such overlap.
  • a folded energy storage tape aggregate adapted for capacitive tuning, comprising: a plurality of successive layers comprising: a plurality of energy segment elements electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current; wherein the plurality of successive layers are folded
  • An energy storing sheet adapted for print form processing, comprising: a current collecting element formed into a self-sealing element comprising: a current collector member operatively coupled to a sealer element, and; an electrode element.
  • a method for manufacturing an energy storing sheet comprising: a means for interlocking and electrode element with a current collector component; means for providing a high internal strength factor of the electrode element; means for providing a high internal strength factor of the current collector component.
  • An energy storing power patch comprising: a flexible material member having a scalable patch area; a tunable dimensional element wherein the tunable dimensional element is adapted to scale capacitance proportional to the scalable patch area.
  • the coupling of the so design, the PCB and the option C inclusive of the simplified processing is a close hit for the integrated control / power vision of the market we are headed into. It is also a direct hit for the Etape like lining to the encasement of the server. The idea is to make a flexible power tape or strip that can have components mounted directly into the tape or strip tapping then power within. As such, the component of an integrated PCB with power and components is realized.
  • a flexible printed circuit board comprising: a interface element, having a receptacle disposed therein, adapted to accept a connector element, wherein the interface element is malleable.
  • the energy density (volumetric and gravimetric) is improved when the technology can be embedded.
  • the packaging efficiency gain is expected to be in excess of 30% and possibly closer to 50%.
  • the final sealing toward external gases and moisture are shared between the OEM and PBC.
  • packaging materials are 30% of the total weight content of the device, approximately 25% improvement in total energy density is possible by combining multiple device layers in one package.
  • An energy storing powerpatch or chip having a flexible format and tunable dimensional characteristics (in one embodiment option A build)
  • the separator plus foundation component is preformed onto substrate or plate 1 while the current collector is preformed (in one embodiment, a preformed foil is employed) along with its current bus and electrode onto substrate or plate 2.
  • the mating of the two plates is accomplished after the device is loaded with electrolyte and made ready with a means for forming a permanent seal between the two components.
  • the completed electrode component with its separator is then heat treated to affect sealing.”
  • EtapeTM is a flexible energy storing tape roll with or without an adhesive backing that can be formatted like any other tape product of similar nature. It can in fact be substituted for masking tape, duct tape or scotch tape. The difference is that it can be charged and discharged when properly interfaced to a power supply or load respectively. High voltages can be formatted by z-folding back onto a common surface to form a brick or prismatic device or by shingling multi- layered strips into an alternate pattern such that the underside to topside are interconnected to form large areas of power in a fashion similar to roofing materials. In addition, the Etape can be cut to form or folded or adhered to many surface types. To make electrical contact, the tape can be inductively or direct connected to loads or power.
  • design for enabling stretchable 2) a tape that has energy
  • a flexible integrated power tape adapted for use in electronics devices, comprising: at least one energy segment, element operatively coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current.
  • An energy storing tape comprising: an energy segment element electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to cany electrical current.
  • CAD based dynamic patterning at the print shop offering customizable fit to form inclusive of holes, slots and filled vias.
  • collector materials using pulsed irradiation.
  • a structural energy storing sheet suitable for incorporation into carbon composites, aircraft wings and fuselage, automotive paneling, tents etc.
  • the sheeting will be attached by an adhesive over which siding or roofing materials with be attached by standard practice (e.g., nails). Once installed, the sheeting
  • openness wm be available within the film to enable electrolyte expansion into the open structures during high temperature or voltage operation. electrolyte technology for >3.2V at 60C for 30,000 cycles
  • a fault tolerant design uses massively parallel, but isolated, storage cells that enable uninterrupted power even if a loss of some cells occurs or when the product is punctured.
  • the stiff but flexible PowerPatch enables a conformable power source
  • a fault tolerance energy storage cell apparatus adapted to continue functioning to provide electrical power when punctured, comprising: a plurality of isolated energy storage cell members, mechanically connected, having an aggregate voltage, wherein each of the plurality of isolated energy storage cell members is adapted to contain an electrolyte therein, wherein when one of the plurality of isolated energy storage cell members is punctured, only electrolyte contained therein will cause a fault; a fault detection algorithm, rendered as a software program, adapted for storage in a memory storage medium, wherein the fault detection algorithm is further adapted to detect an aggregate voltage change in the plurality of isolated energy storage cell members due to puncturing of at least one of the plurality of isolated energy storage cell members, wherein the fault detection algorithm changes the aggregate voltage to provide a continuous power source.
  • a fault tolerant supercapacitor comprising: a plurality of isolated energy storage cell members, mechanically connected, having an aggregate voltage, wherein each of the plurality of isolated energy storage cell members is adapted to contain an electrolyte therein, wherein when one of the plurality of isolated energy storage cell members is punctured, only electrolyte contained therein will cause a fault; a fault detection algorithm, rendered as a software program, adapted for storage in a memory storage medium, wherein the fault detection algorithm is further adapted to detect an aggregate voltage change in the plurality of isolated energy storage cell members due to puncturing of at least one of the plurality of isolated energy storage cell members, wherein the fault detection algorithm changes the aggregate voltage to provide a continuous power source.
  • BCJR algorithm decoding of error correcting codes defined on trellises (principally convolutional codes)
  • Hamming(7,4) a Hamming code that encodes 4 bits of data into 7 bits by adding 3 parity bits
  • LRC Longitudinal redundancy check
  • Luhn algorithm a method of validating identification numbers Luhn mod N algorithm: extension of Luhn to non-numeric characters Parity: simple/fast error detection technique Verhoeff algorithm
  • a puncture tolerant supercapaticor comprising: a plurality of isolated energy storage cell members, mechanically connected, having an aggregate voltage, wherein each of the plurality of isolated energy storage cell members is adapted to contain an electrolyte therein, wherein when one of the plurality of isolated energy storage cell members is punctured, only electrolyte contained therein will cause a fault; a fault detection algorithm, rendered as a software program, adapted for storage in a memory storage medium, wherein the fault detection algorithm is further adapted to detect an aggregate voltage change in the plurality of isolated energy storage cell members due to puncturing of at least one of the plurality of isolated energy storage cell members, wherein the fault detection algorithm changes the aggregate voltage to provide a continuous power source.
  • a puncture tolerant electrolytic double layer capacitor comprising: a plurality of isolated energy storage cell members, mechanically connected, having an aggregate voltage, wherein each of the plurality of isolated energy storage cell members is adapted to contain an electrolyte therein, wherein when one of the plurality of isolated energy storage cell members is punctured, only electrolyte contained therein will cause a fault; a fault detection algorithm, rendered as a software program, adapted for storage in a memory storage medium, wherein the fault detection algorithm is further adapted to detect an aggregate voltage change in the plurality of isolated energy storage cell members due to puncturing of at least one of the plurality of isolated energy storage cell members, wherein the fault detection algorithm changes the aggregate voltage to provide a continuous power source.
  • Integrating structural energy storing sheets within replaceable ceilings of high rise office buildings or the underlayment to roofs for more traditional residential buildings provides the potential for GWatt levels or more of storage capacity for every 10 million buildings so outfitted.
  • a building materials cost model enables transformational change in how energy storage is envisioned and scaled within the grid.
  • a long-life capacitance sheet that is robust, fault tolerant and easily incorporated into everyday building materials such as roofing underlayment, moisture barrier house wrap, or interior wall paper is envisioned.
  • Control and interface electronics are expected to be imbedded into the sheet, for charge discharge and power conditioning across the massively parallel array of cells.
  • a structural energy storing sheet adapted for use in a building structure, comprising: A structural energy storing sheet, adapted for roofing:
  • a structural energy storing sheet adapted to be disposed in a ceiling cavity, comprising: a separator, an electrode, a collector.
  • a flexible energy storage sheeting apparatus comprising: a separator, an electrode, a collector.
  • An integrated structural energy storing sheet apparatus adapted for providing electrical power comprising: a separator, an electrode, a collector.
  • a puncture tolerant sheet apparatus A puncture tolerant sheet apparatus
  • a highly distributed energy storage apparatus adapted for secured grid level applications, compring:
  • an integrated structural energy storing sheet apparatus adapted for providing electrical power comprising: a separator, an electrode, a collector.
  • a network of homes and buildings within a reasonably sized community will be modeled to fully assess the grid level implications of have a terminus based energy storage
  • the structural sheet energy storing sheet's mechanical properties are dominated by materials and their composites, and the processes to make the sheets, These properties are also dependent on the design, density and dimensions of the ring seal / bus that serve to form the independent isolated cells within the sheet.
  • a particularly useful innovation is the use of asymmetric free-forming fabrication to communicate out of plane current conduction or "z-axis" conductivity.
  • filaments of various aspect ratios and various cross sectional area interconnect the open electrode to the application interface through a self-sealing composite that contains these filaments.
  • the conductive filaments and non-conductive self-sealing filler form a sealed current collector to the sheets.
  • these conductive fingerlings can manage any power requirements of the sheet while also keeping the chemical reactivity and overall gravimetric density of the device low.
  • a tunable energy storing sheeting apparatus comprising:
  • a plurality of current collectors comprising:
  • a typical build includes print forming an alternating open layer of non-conductive and conductive inks that are fusible and self-seal within a multilayered fabrication process. Initially these inks provide a swollen layer that upon curing or setting form a continuous sealed film within a few layers composed of alternating print plus set cycles.
  • a design goal of such a fabrication is to interlock the porous electrode particles into the collector such that low ohmic contact and optimal mechanical strength obtained within the interfacial region of the two materials or films,
  • a integrated electrode to collector apparatus comprising:
  • Suitable materials include PEDOT-PSS with sorbitol and a surfactant as rheology modifiers.
  • the electrode can be fused to the veil and conductive polymer film within the skeleton using pulsed radiation that is commercially available. Such fusing of the carboneous components has been demonstrated in this effort and reported in the literature. The resulting lowering of resistance and associated increase in strength are of particular interest to this work.” 3. "A means and process for enhancing the internal strength of the electrode and current collector ensemble.”
  • a method for printing film employs drawdown.
  • Yet another means for forming a highly flexible low density low cost current collector is by the printing of a doped film fprming ink.
  • said inks are comprised of conductive fibrous and conductive platelets dispersed within a polymer forming matrix.
  • said inks are matched to the print forming process in order to avoid or minimize the film forming nature of the polymer forming materials.
  • said film forming materials within the inks must be a a level that avoids a continuous non-conductive film formation over the conductive particles that must overlap or fuse to adjacent particles of similar nature.
  • the ink formulation and matching of such formulations to a deposition processes in order to avoid filming over of the hairs in order to preserve the conductive properties within cured or set films is employed.
  • One preferred means of forming an electrode element is to pre-form the film on an intermediate drum or plate for processing and densification before transferring the film by a known means to the substrate or receiving layer or separator or current collector of a device.
  • An innovation that broadens the scope of these means to transfer the free-form film to the build, substrate of device is to cause transfer by pulsed irradiation through a translucent or transparent drum or plate serving as a transfer agent. Such processing, is rapid, solvent free and easy adapted to controlled environments.
  • ... heat treatment to effect bonding is initiated together with the print step or as a separate step.
  • This step may include or substitute a pulsed radiation treatment of the build.”
  • Option C build sequence and results showing embedded particles within UV curable 100% solid inks
  • PowerChip multi-layered stacked device packaged as rigid, modular with interconnects and attaches with flex connector to memory module card.
  • a soft shut-down apparatus adapted for use in a digital memory module member, comprising:
  • a multi-layer stacked module element having a plurality of interconnection interface members
  • SSDs SolidStateDrives
  • Electrode and separator design could be implemented in this device as technology becomes commercially viable.
  • Packaging could be shared with frame of server but likely to be a stand alone device in its current design.
  • First version is standalone component as a supercapacitor that attaches to circuitry or battery or supercapacitor to enhance performance.
  • Other application is as part of the packaging of a medical patch for physiological monitoring - our device could be the adhesive part of the strip and needs to be flexible and stretchable to some extent. Device will be patterned during print or end packaging process.
  • circuit board Embedded in circuit board as patterned device between power and ground planes. This will likely be licensed to the PCB manufacturer who will put it into their manufacturing process and deliver an end product with our technology embedded. Patterning with vias, packaging between ground and power planes of PCB card etc innovations are part of the functionality important for this device.
  • supercapacitor devices can be smaller and weight less with enhanced performance.
  • the Power WrapperTM technology can be used in virtually any consumer electronics application.
  • it can be used in one or more of the following ways, alone or in combination in a particular consumer electronics application.
  • It can be used as a "chip" on a PCB board, and used with backup storage and/or extra UMP.
  • It can be used as a surface mounted power plane on a PCB board or flexible PCB, and used with backup memory and/or array drivers.
  • It can be used as an embedded power plane on a PCB board or flexible PCB, and used for decoupling and with backup memory and/or array drivers.
  • Certain embodiments may include a process of manufacture using an Aluminum foil for a preformed conductor, high power chip that may be surface or overlay mounted.
  • elements illustrated may be used in flexible PCB application with electronic components.
  • the internal device could have ribbing or be replaced with a classical board material.
  • technologies disclosed herein may be used as integrated large area power planes, including but not limited to e-tape and flexible PCB application. Certain processes and application where power is integrated into the plastic encasement of the consumer electronics may be used. Certain elements illustrated may be used in flexible PCB application with electronic components. In certain embodiments, the internal device could have ribbing or be replaced with a classical board material
  • Figure 15 illustrates an exemplary Power WrapperTM processing line according to certain embodiments.
  • Figure 16 illustrates an exemplary Power WrapperTM reverse processing line according to certain embodiments.
  • FIG 17 illustrates exemplary collector and separator build-ups according to certain embodiments. Old slide 16, New Figure 18
  • Figure 18 illustrates an exemplary current collector free-form fabrication process according to certain embodiments.
  • Figure 19 illustrates an exemplary current collector free-form fabrication process according to certain embodiments.
  • Figure 20 illustrates an exemplary electrode free-form fabrication process according to certain embodiments.
  • Figure 21 illustrates an exemplary energy storage tape according to certain embodiments.
  • the tape can include one or more current collector with electrode layers and one or more separator layers.
  • the light colorations are the electrode materials.
  • An energy storage tape aggregate comprising: a plurality of energy segment elements electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current, wherein the plurality of energy segment elements is tunably overlapped such that higher overall voltages are scaled proportional to such overlap.
  • a folded energy storage tape aggregate adapted for capacitive tuning, comprising: a plurality of successive layers comprising: a plurality of energy segment elements electrically coupled to an interconnect strip member, wherein the interconnect strip member is adapted to carry electrical current; wherein the plurality of successive layers are folded such that ???????
  • Chip / powerpatch device figures (Uses option A preferred build) below 5.) Option A variation ... use of Al foil as a "preformed collector"
  • An energy storing sheet apparatus comprising:
  • a pressure tight print formed energy storing capsule comprising: self sealing carboneous current collector interlocked hairy particle based electrode porous separator with non-porous "foundation" la.) massively repeated within print plane lb.) massively repeated throughout the plane of the sheet.
  • a symmetrical half-build apparatus comprising: print formed separator module
  • electrode member having an upper and a lower .... deposition of hairy particles capable of forming interlocks forming of interlock between nearest neighbors preserve transport properties of electrolyte
  • Ultra low profile for surface mounted applications in consumer electronics or for embedding within active components uses massively parallel, but isolated, storage cells that enable uninterrupted power even if a loss of some cells occurs or when the product is punctured.
  • the stiff but flexible PowerPatch enables a conformable power source to meet the needs of special applications. Use of freeform fabrication makes the PowerPatchTM designed for manufacturing in USA.
  • An energy storing sheet adapted for print form processing, comprising: a current collecting element formed into a self-sealing element comprising: a current collector member operatively coupled to a sealer element, and; an electrode element.
  • a method for manufacturing an energy storing sheet comprising: a means for interlocking and electrode element with a current collector component; means for providing a high internal strength factor of the electrode element; means for providing a high internal strength factor of the current collector component.
  • Isolation element [1/2 total i.e., a mirror image is not shown] ring seal (interfacial area) Mirror image of details above
  • Flexible PCB with energy storage capability comprising: cut-to-form capabilities with a desired Patch area (cm2) and Capacitance (F)
  • An energy storing power patch comprising: a flexible material member having a scalable patch area; a tunable dimensional element wherein the tunable dimensional element is adapted to scale capacitance proportional to the scalable patch area.
  • Flexible PCB with energy storage capability comprising: mechanically, electrically and chemically isolated cells (massively parallel) for enhanced tolerance
  • a Flexible PCB with energy storage capability and method of manufacture comprising "option A” (powerpatch) further comprising build cross sections (preferred) further comprising build cross sections (alternative) further comprising process diagram
  • a Flexible PCB with energy storage capability and method of manufacture comprising ; PLATE Al - current collector; Web; Aluminum Foil; Conductive adhesive diffusion layer; Foundation - ring seal; Electrode (calendered); PLATE A2 - separator; Reusable substrate (metal, glass); (optional) release layer; Porous separator; NonPorous separator
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Option A build - and collector design (alternative); Step 1 - Form collector subassembly; Release layer for release from substrate; XYZ conductor + filler and sealer for xyz, strength, sealing; Conductive interfacial layer for z-axis, interlocking; Step 2- deposit foundation and electrode (patterned); Collector sub-assembly (step 1);
  • Attachment layer for z-axis, interlocking a) foundation; b) electrode; Step 3- mate parts and seam; T and P; Step 2 component; Attachment layer for interlocking, adhesion; Separator sub-assembly; half-separator
  • a Flexible PCB with energy storage capability and method of manufacture comprising the Design objective of A)Generate sealed collector and separator subassemblies, B) deposit electrode, C) mate parts.
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Preformed current collector side (Plate Al); Current Collector (CC) - preformed, etched pin-hole free Aluminum foil (7-15 um); Print highly conductive, adhesive diffusion barrier in preparation for electrode deposition (patterned) on CC; Dry (cure) at appropriate temperature if needed (dependent on final materials); Print electrode (patterned); dry at high temperature to drive off water; Print foundation layer for ring seal (patterned); Partial cure ring seal foundation layer (dry in air, or UV cure); Plate Al prepared; Separator Side (Plate A2); Coat reusable solid substrate with release layer (e.g.
  • PTFE FreeForm print porous separator coating over entire plate with multiple passes of print head; Convert regions to non porous foundation for ring seal pattern by printing forming pattern; Cure or dry as needed; Print adhesive bonding foundation layer for ring seal (patterned); Partial cure ring seal foundation layer (dry in air, or UV cure); Plate A2 prepared
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Half device Plate A formation; Plate Al ; Plate A2; Align Plate Al and A2 foundation pattern; cure; Form Ring Seal; Remove substrate of Plate A2 (separator); Plate A (Half device); Plate B - same process as Plate A; (Half device)
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Full device - 1 layer; Plate A; Mirrored; Half devices; Plate B; Electrolyte loading; Seam formation at Ring Seal and at outside rim; Sealed, Single layer 'Patch' Option A device
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Option B - concepts; 1- use of carbon veil in collectors or electrodes or separator; 2- use of carbon veil in all component thick-films (very tough but thick composite) ...; ap space is fuselage, solder armor plating etc.; 3- blended composites for enhanced conductivity etc.
  • a Flexible PCB with energy storage capability and method of manufacture comprising: Option B build - and collector design (alternative); Step 1- Form collector subassembly; Release layer for release from substrate; XYZ conductor + filler and sealer; for xyz, strength, sealing e.g., carbon veil with CTA filler; Conductive interfacial layer for z-axis, interlocking; Step 2- deposit foundation and electrode (patterned); Collector sub-assembly (step 1); Attachment layer for z-axis, interlocking; a) foundation; b) electrode; Step 3- print form separator onto electrode ensemble of step 2; half-separator; T and P; Step 2 component; Absorbent -porous layer for solvent barrier, interlocking, insulation; Print formed Separator w/ foundation for electrical isolation, electrolyte reservoir
  • a Flexible PCB with energy storage capability and method of manufacture comprising the Design objective: A) Generate sealed collector and separator subassemblies, B) deposit electrode, C) mate parts;
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Active sensor embodiment wherein at least one collector is "transparent) to ions, photons, electrons etc.
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet wherein the sheet is print form with a pressure tight energy storing capsule (cell) that is then massively repeated throughout the plane of the sheet.
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising an Isolation capsule or cell
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising an Diffuse current collector (biased diffusion of ions, photons etc.)
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising e.g., glassy carbon, some conductive polymers, doped carboneous
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising an interlocked hairy particle based electrode
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising a Poroiis separator with non-porous "foundation"
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising a Self sealing current collector
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising a massively repeated within print plane
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising a Massively parallel celled sheet
  • a Flexible PCB with energy storage capability and method of manufacture comprising an Energy Storing Sheet further comprising an embodiment where there is a "welding" or "fusing" of interconnected hairy electrode materials
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator design wherein the separator is standalone w/ and w/o isolation features
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator design wherein the separator further comprises isolation and strength building features of foundation
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator design wherein the separator has a chemical reaction isolation for reactive or high temp
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator design wherein the separator has an enhanced fault tolerance
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator Module.
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator Module wherein the inks and processes for print forming a range of mechanical properties (rubber like elasticity to brittle films)
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator Module wherein the inks and processes to transform porous zones to non- porous zones.
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator Module wherein the reduction of the number of print steps 10-fold with extensibility to further reduce (5-passes is the design goal)
  • a Flexible PCB with energy storage capability and method of manufacture comprising a Separator Module wherein there is extensibility to non-CTA based materials (e.g., Elvax resin and polyurethane)
  • non-CTA based materials e.g., Elvax resin and polyurethane
  • a Flexible PCB with energy storage capability and method of manufacture wherein there is a means to form isolated patterned partitions to isolate electrolyte within cells
  • a Flexible PCB with energy storage capability and method of manufacture further comprising 5mm to 50mm thick films with greater than 3KV/cm breakdown voltages
  • a Flexible PCB with energy storage capability and method of manufacture further comprising a porous, pCTA - (separator)
  • a Flexible PCB with energy storage capability and method of manufacture further comprising a pCTA (separator)
  • a Flexible PCB with energy storage capability and method of manufacture further comprising a nCTA (fpCTA) (separator)
  • a Flexible PCB with energy storage capability and method of manufacture further comprising an Electrode Module.
  • a Flexible PCB with energy storage capability and method of manufacture further comprising an Electrode Module further comprising super aggregate of hairy particles
  • a Flexible PCB with energy storage capability and method of manufacture further comprising an Electrode Module further comprising Binder (2 -types) for super aggregates or hairy particles
  • a Flexible PCB with energy storage capability and method of manufacture further comprising an Electrode Module further comprising conductor (cloth like properties)
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture is provided.
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising one or more super-aggregate (hairy particle also).
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising phase segregation within sol-gel.
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising MWNT or CNT bundles
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising nanowires
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising aerogel primary particles
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture wherein one or more electrodes is a cluster of fused super-aggregates
  • Electrode Material for a Flexible PCB with energy storage capability and method of manufacture further comprising a fusion mode for aggregates Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module (LDL3C)
  • LDL3C current Collector Module
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module wherein the print process determines the sealing and mechanical properties of the build
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module further comprising cloth like properties (z-axis collection ... "fingerlings”)
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module further comprising tuned stiffness (planer collection ... "B” and “Fletcher”)
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module further comprising 100% Print formed onto porous surfaces for interlocking
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module further comprising low density at Low cost current collector (LDL3C technology), ⁇ 3g/cc
  • Flexible PCB with energy storage capability and method of manufacture further comprising a current Collector Module further comprising under 30mOhms resistance per film
  • Flexible PCB with energy storage capability and method of manufacture further comprising a freeformed fingerlings as z-axis conductors
  • Flexible PCB with energy storage capability and method of manufacture further comprising conductive (M) only
  • Flexible PCB with energy storage capability and method of manufacture further comprising conductive and non-conductive (M + P) mixed
  • Flexible PCB with energy storage capability and method of manufacture further comprising non-conductive (P) only Flexible PCB with energy storage capability and method of manufacture f further comprising after print
  • Flexible PCB with energy storage capability and method of manufacture further comprising one or more filament (fingerling)
  • Flexible PCB with energy storage capability and method of manufacture further comprising a non-conductive matrix
  • Flexible PCB with energy storage capability and method of manufacture further comprising a freeform fabricated low density conductive film
  • a method of providing power to a non-planar encasement lining comprising the steps of: Providing a flexible PCB with energy storage capability; Conforming the flexible PCB to fit the encasement
  • Flexible PCB with energy storage capability comprising: the use of Al foil as a "preformed collector"
  • Flexible PCB with energy storage capability comprising: Ultra low profile for surface mounted applications in consumer electronics or for embedding within active components.
  • Flexible PCB with energy storage capability comprising: A fault tolerant design further comprising massively parallel, but isolated, storage cells that enable uninterrupted power even if a loss of some cells occurs or when the product is punctured.
  • Flexible PCB with energy storage capability comprising: The stiff but flexible
  • PowerPatch enables a conformable power source to meet the needs of special applications.
  • Flexible PCB with energy storage capability comprising: freeform fabrication to enable the following electrical/power characteristics: 6V 3 HJ, 4.5W alpha build Product Configurations - 1 (saddle bagged module)*
  • An energy storage device comprising two linked units such that the units may be supported by the device using the energy provided.
  • ETape application An energy storage sheet comprising one or more parallel isolated energy storage devices.
  • Flexible PCB with energy storage capability comprising: Electrode and half-separator 59.) Flexible PCB with energy storage capability comprising:
  • Plate Al - current collector Web; Aluminum foil; Conductive adhesive diffusion layer; Foundation - ring seal; Electrode (calendered); Plate A2 - separator; Reusable substrate (metal, glass); (optional) release layer; Porous separator; Non-Porous separator

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

La présente invention concerne un dispositif en feuille de stockage et de distribution d'énergie formé par impression comportant des cellules de stockage d'énergie adressables. L'invention concerne également : un procédé de formation libre de feuilles de stockage d'énergie; une interface d'interconnexion, destinée à coupler fonctionnellement le dispositif en feuille de stockage d'énergie à un élément externe; une carte de circuit imprimé souple, comportant des couches de stockage d'énergie à motifs; un dispositif en feuille de stockage d'énergie souple et adhésif; une feuille de stockage d'énergie qui peut être mécaniquement accordée et à motifs servant de matériau de construction structural; un mode de réalisation de stockage de grille en réseau d'un dispositif en feuille de stockage d'énergie structurel; un dispositif en feuille de stockage d'énergie alimentant une mémoire d'ordinateur et des circuits intégrés; un dispositif de stockage d'énergie tolérant à la perforation; un ultracondensateur comportant un séparateur, des électrodes symétriques ou asymétriques, un électrolyte et un collecteur de courant; une batterie, un supercondensateur, et un dispositif hybride; et, enfin, des constantes de temps RC et des tensions dans un dispositif en feuille de stockage d'énergie.
PCT/US2011/001208 2010-07-09 2011-07-11 Dispositif en feuille souple de stockage et de distribution d'énergie WO2012021154A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US36310410P 2010-07-09 2010-07-09
US61/363,104 2010-07-09
US36466710P 2010-07-15 2010-07-15
US61/364,667 2010-07-15
US12/844,787 US8514548B2 (en) 2009-07-27 2010-07-27 Compliant energy storing structural sheet
US12/844,787 2010-07-27

Publications (1)

Publication Number Publication Date
WO2012021154A1 true WO2012021154A1 (fr) 2012-02-16

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9564275B2 (en) 2012-03-09 2017-02-07 The Paper Battery Co. Supercapacitor structures
US9583277B2 (en) 2013-09-30 2017-02-28 The Paper Battery Company, Inc. Ultra-capacitor structures and electronic systems with ultra-capacitor structures
US9831533B2 (en) 2013-03-15 2017-11-28 The Paper Battery Co. Energy storage structures and fabrication methods thereof
CN112312756A (zh) * 2018-05-15 2021-02-02 张海根 滑台褶皱pcb电子器件制备机构的制作方法

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Publication number Priority date Publication date Assignee Title
US5019468A (en) * 1988-10-27 1991-05-28 Brother Kogyo Kabushiki Kaisha Sheet type storage battery and printed wiring board containing the same
US5540742A (en) * 1989-05-01 1996-07-30 Brother Kogyo Kabushiki Kaisha Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process
WO1997014157A1 (fr) * 1995-10-07 1997-04-17 Img Group Limited Composant de circuit electrique forme par impression directe d'un liquide conducteur sur un substrat
WO2006105966A1 (fr) * 2005-04-08 2006-10-12 Varta Microbattery Gmbh Element galvanique
WO2011017130A1 (fr) * 2009-07-27 2011-02-10 The Paper Battery Co. Feuille structurelle adaptative de stockage d’énergie

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019468A (en) * 1988-10-27 1991-05-28 Brother Kogyo Kabushiki Kaisha Sheet type storage battery and printed wiring board containing the same
US5540742A (en) * 1989-05-01 1996-07-30 Brother Kogyo Kabushiki Kaisha Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process
WO1997014157A1 (fr) * 1995-10-07 1997-04-17 Img Group Limited Composant de circuit electrique forme par impression directe d'un liquide conducteur sur un substrat
WO2006105966A1 (fr) * 2005-04-08 2006-10-12 Varta Microbattery Gmbh Element galvanique
WO2011017130A1 (fr) * 2009-07-27 2011-02-10 The Paper Battery Co. Feuille structurelle adaptative de stockage d’énergie

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9564275B2 (en) 2012-03-09 2017-02-07 The Paper Battery Co. Supercapacitor structures
US10153094B2 (en) 2012-03-09 2018-12-11 The Paper Battery Co. Supercapacitor structures
US9831533B2 (en) 2013-03-15 2017-11-28 The Paper Battery Co. Energy storage structures and fabrication methods thereof
US9583277B2 (en) 2013-09-30 2017-02-28 The Paper Battery Company, Inc. Ultra-capacitor structures and electronic systems with ultra-capacitor structures
CN112312756A (zh) * 2018-05-15 2021-02-02 张海根 滑台褶皱pcb电子器件制备机构的制作方法
CN112312756B (zh) * 2018-05-15 2022-01-28 无锡旭电科技有限公司 滑台褶皱pcb电子器件的制作方法

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