WO2012013605A2 - Cooling device and led lighting device comprising the same - Google Patents

Cooling device and led lighting device comprising the same Download PDF

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Publication number
WO2012013605A2
WO2012013605A2 PCT/EP2011/062676 EP2011062676W WO2012013605A2 WO 2012013605 A2 WO2012013605 A2 WO 2012013605A2 EP 2011062676 W EP2011062676 W EP 2011062676W WO 2012013605 A2 WO2012013605 A2 WO 2012013605A2
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WO
WIPO (PCT)
Prior art keywords
cooling
cooling device
cooling body
shape
led lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/062676
Other languages
French (fr)
Other versions
WO2012013605A3 (en
Inventor
Chenglong Dai
Haiping Yuan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2012013605A2 publication Critical patent/WO2012013605A2/en
Publication of WO2012013605A3 publication Critical patent/WO2012013605A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • F28F9/013—Auxiliary supports for elements for tubes or tube-assemblies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a cooling device used for cooling an LED lighting apparatus.
  • the present invention also relates to an LED lighting apparatus comprising the cooling device.
  • the heat sinks should have a high heat capacity so as to overcome thermal shock (generally an instantaneous heat flux density is more than 100000W/m 2 ).
  • thermal shock generally an instantaneous heat flux density is more than 100000W/m 2 .
  • traditional designs cannot satisfactorily overcome the thermal shock, because the metal plate used in the traditional designs does not have a fine specific heat capacity.
  • a heat sink according to a heat-pipe principle is known, and the heat-pipe is composed of a pipe wall, a capillary die and a cooling medium.
  • the cooling medium in the heat-pipe is absorbed into the capillary die so that when the heat-pipe absorbs heat, the cooling medium in the capillary die is quickly vaporized and is condensed at the other end of the heat-pipe, thereby dissipating the heat to realize the object of cooling.
  • the heat-pipe has fine cooling effect, it cannot provide a high heat capacity, because although the cooling medium may have a high specific heat capacity, the amount of the cooling medium in the heat-pipe is small, as long as it meets the object of vaporizing, and thus it is relatively weak in anti-thermal shock.
  • due to the structure of the heat-pipe it is relatively complex in construction and is high in cost. Summary of the Invention
  • a first aspect of the present invention aims to put forward a cooling device, especially for use in cooling LED lighting apparatuses.
  • the cooling device according to the present invention can provide a high heat capacity, satisfactorily overcome thermal shock, and also has fine thermal conductivity and then can effectively cool devices such as an LED lighting apparatus.
  • the first aspect of the present invention is realized by a cooling device, and the device comprises: at least one cooling body (1 ) each of which is provided with a vacuum sealing chamber therein; and a cooling medium filled in the vacuum sealing chamber, wherein the cooling medium has a high heat capacity.
  • the cooling body according to the present invention just needs to meet the requirement of obtaining a vacuum sealing chamber therein, and does not need other complex structures such as a capillary structure in the heat-pipe, and the cooling body is very simple in structure.
  • the cooling medium has a high heat capacity, that is, in the case of the same volume, the heat capacity from using pure water is 2 to 10 times of a genera metal, it can satisfactorily resist thermal shock.
  • the cooling medium fills 20% to 80% of the volume of the vacuum sealing chamber.
  • the heat capacity can be improved.
  • the above volume of the cooling medium constitutes a substantive difference with respect to the cooling medium in the heat-pipe.
  • the volume of the cooling medium in the vacuum sealing chamber can be selected for the above value range according to the powers of the LED lighting apparatuses.
  • a pure liquid having a high specific heat capacity is selected as the cooling medium, and the pure liquid is, for example, pure water or ether, and preferably a pure liquid having a minimum specific heat capacity of 2000 J/kgK is selected, more preferably more than 4000 J/kgK. This pure liquid having the high specific heat capacity notably enhances the heat capacity of the cooling medium.
  • the cooling body is designed to be in a tubular shape.
  • the cooling body in this shape can be processed or obtained more easily.
  • it can be seamless steel pipe and can be easily obtained in the market.
  • the cooling body in this shape will obtain contact in maximum extent with ambient environment, thereby further improving the heat dissipation effect. Also, it is more suitable to be bent into different shapes.
  • the cooling body is made of a metal having a fine heat conducting property, and the metal can be copper, aluminum, and etc.
  • the at least one cooling body is bendable.
  • the at least one cooling body is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape.
  • the cooling device according to the present invention matches the heat dissipation requirement of the LED lighting apparatuses.
  • the cooling device comprises a heat conducting plate which transmits the heat of an object to be cooled to the at least one cooling body.
  • the heat conducting plate is connected to a converging end of at least one cooling body.
  • At least one cooling body is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate.
  • This type of panel-shape cooling device can be used to relatively large-sized LED lighting apparatuses and provide fine heat dissipation and cooling effects.
  • a second aspect of the present invention is realized by an LED lighting apparatus.
  • the LED lighting apparatus comprises the above type of cooling device, and by using this cooling device the heat dissipation of the LED lighting apparatus is notably improved, and as this cooling device has a large heat capacity, the anti-thermal shock ability of the overall LED lighting apparatus is enhanced. Also, due to the hollow structure of the cooling structure, the weights of the overall system together with the LED lighting apparatus and the cooling device are reduced.
  • a third aspect of the present invention is to put forward a cooling device, especially for use in cooling LED lighting apparatuses.
  • the cooling device according to the present invention can provide better thermal conductivity and heat dissipation ability, and is lighter in weight and can be used more flexibly to LED lighting apparatuses.
  • the third aspect of the present invention is realized by a cooling device, and the device comprises: at least one cooling body comprising an elongated bendable member.
  • Elongated means that the member has a shape where in one direction the linear dimension (the members length) is substantially larger than in a plane perpendicular to this direction, preferably at least by a factor of 5, more preferably by a factor of more than 10 or even 20.
  • Such members may be completely solid, partially hollow or along the whole length hollow.
  • the cooling body is a wire, a rod, a metal pipe, or a heat pipe.
  • the metal pipe especially the heat pipe, has very good heat dissipation property, this further improves the thermal conductivity and the heat dissipation ability of the cooling device.
  • the present invention better suits different types of LED lighting apparatuses.
  • Wire or rod can be bent more easily than a pipe and is easier to produce and to handle.
  • the sectional area perpendicular to the elongated members length may be of circular or square shape for the ease of manufacturing but may also have any other suitable shape.
  • the cooling body can be built with little effort.
  • the cooling device further comprises a heating conducting plate which transmits the heat of an object to be cooled to at least one cooling body.
  • the at least one cooling body is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape, so that the cooling device of the present invention matches the heat dissipation requirements of the LED lighting apparatuses to the maximum extent.
  • the at least one cooling body is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate.
  • This type of panel-shape cooling device can be used to relatively large-sized LED lighting apparatuses and provide fine heat dissipation and cooling effects.
  • the last aspect of the present invention is realized by an LED lighting apparatus which comprises the above types of cooling devices, and use of such cooling devices obviously improves the heat dissipation of the LED lighting apparatus.
  • the cooling body of the cooling device comprises an elongated bendable member, in the case of occupying a relatively small space, as large a contact area as possible with ambient environment can be obtained, thereby effectively improving the thermal conductivity and the heat dissipation ability, and this satisfactorily improves the heat dissipation effect of the overall LED lighting apparatus. Also, the weight of the overall system together with the LED lighting apparatus and the cooling device is reduced.
  • Figure 1 is a schematic perspective view of the cooling body with the end portion thereof opened;
  • Figure 2 is a schematic perspective view of the cooling body with the end portion thereof closed;
  • Figure 3a is a schematic view of the first embodiment of the cooling device according to the present invention.
  • Figure 3b is a schematic view of the second embodiment of the cooling device according to the present invention
  • Figure 3c is a schematic view of the third embodiment of the cooling device according to the present invention.
  • FIG. 4 is a sectional view of the cooling device formed in a panel-shape. Detailed Description of the Embodiments
  • Figure 1 illustrates the perspective view of the cooling body 1 of the cooling device according to the present invention.
  • the cooling body 1 is designed to be in a tubular shape, and made of copper, aluminum or other metals having a fine heating conducting property.
  • the cooling body according to the present invention is not just limited to the tubular shape, and can also be designed to be in other shapes suitable for bending and obtaining a larger heat dissipation area. It may also be made of a solid wire or rod.
  • the cooling body 1 with its end portion cut open can be seen from Figure 1 , wherein, the cooling body 1 defines a vacuum sealing chamber 3 by way of the pipe wall, wherein, the pipe wall does not need to be provided with therein such capillary structures as the heat-pipe.
  • the cooling medium is directly filled in the vacuum sealing chamber 3.
  • pure water, ether or other pure liquids having a high specific heat capacity can be selected as the cooling medium.
  • the heat capacity can be improved by enlarging the volume of the cooling medium.
  • the cooling medium fills 20% to 80% of the volume of the vacuum sealing chamber 3.
  • the filing extent of the cooling medium in the vacuum sealing chamber 3 can be selected freely for the above range according to the powers of the LED lighting apparatuses.
  • Figure 2 illustrates the cooling body 1 with its end portion 4 closed, and the cooling medium in the cooling body 1 is at least in a low pressure (close to vacuum) or vacuum state, the boiling point of the cooling medium in this state is relatively lowered and is easily vaporized, so that the cooling device obtains a fine heating conducting property.
  • Figures 3a-3c illustrate three embodiments of the cooling device, wherein, at least one cooling body 1 in Figure 3c is wound into the double spiral taper shape, at least one tubular cooling body 1 in Figure 3b is formed in the multi-layer disk shape, and at least one cooling body 1 in Figure 3c is bent to the lantern shape.
  • the cooling device also comprises a heat conducting plate 2 which is connected to the converging portion of the at least one cooling body, and the heat conducting plate 2 contacts an LED lighting apparatus that is not shown, so that the heat from the LED lighting apparatus is transmitted to the cooling body 1 and is dissipated into the ambient environment via the cooling body 1 .
  • Figure 4 illustrates the sectional view of the cooling device formed in the panel-shape.
  • at least one cooing body 1 is bent to be a winding shape in the plane of the heat conducting plate 2, thus forming a cooling body array, and the cooling body array is paved flat on the heat conducting plate 2 and is in close contact with the same, thereby forming a panel-shape cooling device which can also cool a large-sized apparatus according to needs.
  • the heat pipe can be bent and form a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape.
  • a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape in view of the structure features of the heat pipe, an overlarge angle in bending the heat pipe should be avoided so as not to damage the internal structure of the heat pipe.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a cooling device, comprising: at least one cooling body (1) each of which is provided with a vacuum sealing chamber (3) therein; and a cooling medium filled in the vacuum sealing chamber (3), wherein the cooling medium has a high heat capacity. The cooling device according to the present invention can provide a high heat capacity, satisfactorily overcome thermal shock, and also has fine thermal conductivity and then can effectively cool devices such as an LED lighting apparatus. Another aspect of the present invention also relates to a cooling device, comprising: at least one cooling body (1), wherein the at least one cooling body comprises an elongated bendable member. The cooling device has fine thermal conductivity and heat dissipation property, and is lighter in weight and more flexible in design. In addition, the present invention also relates to an LED lighting apparatus comprising the above types of cooling devices.

Description

Description
Cooling Device and LED Lighting Device Comprising the Same
Technical Field
The present invention relates to a cooling device used for cooling an LED lighting apparatus. In addition, the present invention also relates to an LED lighting apparatus comprising the cooling device. Background Art
Current LED lighting technologies become more and more mature, and heat dissipation technologies for cooling LED lighting apparatuses have also undergone much improvement, especially cooling the LED lighting apparatuses in a manner of natural convection. However, as a large power pump is introduced into the LED lighting apparatuses (generally a heat flux density is more than 50000W/m2), this puts forward new challenges to designs of passive cooling. In traditional passive cooling designs, metal plate heat sinks such as a finned heat sink are widely used. This type of solutions sometimes cannot provide fine heat dissipation properties and results in big weight. In addition, when the LED lighting apparatuses are used in unstable power consumption, the heat sinks should have a high heat capacity so as to overcome thermal shock (generally an instantaneous heat flux density is more than 100000W/m2). However, traditional designs cannot satisfactorily overcome the thermal shock, because the metal plate used in the traditional designs does not have a fine specific heat capacity. In the prior art, a heat sink according to a heat-pipe principle is known, and the heat-pipe is composed of a pipe wall, a capillary die and a cooling medium. The cooling medium in the heat-pipe is absorbed into the capillary die so that when the heat-pipe absorbs heat, the cooling medium in the capillary die is quickly vaporized and is condensed at the other end of the heat-pipe, thereby dissipating the heat to realize the object of cooling. However, as known to all, although the heat-pipe has fine cooling effect, it cannot provide a high heat capacity, because although the cooling medium may have a high specific heat capacity, the amount of the cooling medium in the heat-pipe is small, as long as it meets the object of vaporizing, and thus it is relatively weak in anti-thermal shock. In addition, due to the structure of the heat-pipe, it is relatively complex in construction and is high in cost. Summary of the Invention
Therefore, a first aspect of the present invention aims to put forward a cooling device, especially for use in cooling LED lighting apparatuses. The cooling device according to the present invention can provide a high heat capacity, satisfactorily overcome thermal shock, and also has fine thermal conductivity and then can effectively cool devices such as an LED lighting apparatus.
The first aspect of the present invention is realized by a cooling device, and the device comprises: at least one cooling body (1 ) each of which is provided with a vacuum sealing chamber therein; and a cooling medium filled in the vacuum sealing chamber, wherein the cooling medium has a high heat capacity. The cooling body according to the present invention just needs to meet the requirement of obtaining a vacuum sealing chamber therein, and does not need other complex structures such as a capillary structure in the heat-pipe, and the cooling body is very simple in structure. Also, as the cooling medium has a high heat capacity, that is, in the case of the same volume, the heat capacity from using pure water is 2 to 10 times of a genera metal, it can satisfactorily resist thermal shock.
According to a preferable design of the present invention, the cooling medium fills 20% to 80% of the volume of the vacuum sealing chamber. By enhancing the volume of the cooling medium, the heat capacity can be improved. The above volume of the cooling medium constitutes a substantive difference with respect to the cooling medium in the heat-pipe. In addition, the volume of the cooling medium in the vacuum sealing chamber can be selected for the above value range according to the powers of the LED lighting apparatuses. According to a preferable design of the present invention, a pure liquid having a high specific heat capacity is selected as the cooling medium, and the pure liquid is, for example, pure water or ether, and preferably a pure liquid having a minimum specific heat capacity of 2000 J/kgK is selected, more preferably more than 4000 J/kgK. This pure liquid having the high specific heat capacity notably enhances the heat capacity of the cooling medium.
According to a preferable design of the present invention, the cooling body is designed to be in a tubular shape. The cooling body in this shape can be processed or obtained more easily. For example, it can be seamless steel pipe and can be easily obtained in the market. In addition, the cooling body in this shape will obtain contact in maximum extent with ambient environment, thereby further improving the heat dissipation effect. Also, it is more suitable to be bent into different shapes.
According to a preferable design of the present invention, the cooling body is made of a metal having a fine heat conducting property, and the metal can be copper, aluminum, and etc.
Advantageously, the at least one cooling body is bendable. In the design of the present invention, according to the differences in powers, volumes, and etc. of the LED lighting apparatuses, the at least one cooling body is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape. Thus, to the maximum extent the cooling device according to the present invention matches the heat dissipation requirement of the LED lighting apparatuses.
Advantageously, the cooling device comprises a heat conducting plate which transmits the heat of an object to be cooled to the at least one cooling body. In the situation of the double spiral taper shape, the multi-layer disk shape and the lantern shape, the heat conducting plate is connected to a converging end of at least one cooling body.
According to a design of the present invention, at least one cooling body is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate. This type of panel-shape cooling device can be used to relatively large-sized LED lighting apparatuses and provide fine heat dissipation and cooling effects.
A second aspect of the present invention is realized by an LED lighting apparatus. The LED lighting apparatus comprises the above type of cooling device, and by using this cooling device the heat dissipation of the LED lighting apparatus is notably improved, and as this cooling device has a large heat capacity, the anti-thermal shock ability of the overall LED lighting apparatus is enhanced. Also, due to the hollow structure of the cooling structure, the weights of the overall system together with the LED lighting apparatus and the cooling device are reduced. A third aspect of the present invention is to put forward a cooling device, especially for use in cooling LED lighting apparatuses. The cooling device according to the present invention can provide better thermal conductivity and heat dissipation ability, and is lighter in weight and can be used more flexibly to LED lighting apparatuses.
The third aspect of the present invention is realized by a cooling device, and the device comprises: at least one cooling body comprising an elongated bendable member. Elongated means that the member has a shape where in one direction the linear dimension (the members length) is substantially larger than in a plane perpendicular to this direction, preferably at least by a factor of 5, more preferably by a factor of more than 10 or even 20. Such members may be completely solid, partially hollow or along the whole length hollow. By bending the cooling body, in the case of occupying a relatively small space, as large a contact area as possible with ambient environment can be obtained, thereby effectively improving the thermal conductivity and the heat dissipation ability.
According to a preferable design of the present invention, the cooling body is a wire, a rod, a metal pipe, or a heat pipe. As the metal pipe, especially the heat pipe, has very good heat dissipation property, this further improves the thermal conductivity and the heat dissipation ability of the cooling device. Also, due to the use of the metal pipe or the heat pipe which is lighter and more flexible with respect to the heat dissipating fins in the prior art, the present invention better suits different types of LED lighting apparatuses. Wire or rod can be bent more easily than a pipe and is easier to produce and to handle. The sectional area perpendicular to the elongated members length may be of circular or square shape for the ease of manufacturing but may also have any other suitable shape.
If the cooling device comprises no more than 5, preferably no more than 2 elongated members the cooling body can be built with little effort.
Advantageously, the cooling device further comprises a heating conducting plate which transmits the heat of an object to be cooled to at least one cooling body. In the design of the present invention, according to the powers, volumes and etc. of the LED lighting apparatuses, the at least one cooling body is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape, so that the cooling device of the present invention matches the heat dissipation requirements of the LED lighting apparatuses to the maximum extent.
According to a design of the present invention, the at least one cooling body is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate. This type of panel-shape cooling device can be used to relatively large-sized LED lighting apparatuses and provide fine heat dissipation and cooling effects.
The last aspect of the present invention is realized by an LED lighting apparatus which comprises the above types of cooling devices, and use of such cooling devices obviously improves the heat dissipation of the LED lighting apparatus. As the cooling body of the cooling device comprises an elongated bendable member, in the case of occupying a relatively small space, as large a contact area as possible with ambient environment can be obtained, thereby effectively improving the thermal conductivity and the heat dissipation ability, and this satisfactorily improves the heat dissipation effect of the overall LED lighting apparatus. Also, the weight of the overall system together with the LED lighting apparatus and the cooling device is reduced.
It should be understood that the above general description and the following detailed description are for listing and explanation, and aim to provide further explanation of the claimed invention.
Brief Description of the Drawings
The accompanying drawings constitute a part of the Description and are used to provide further understanding of the present invention. Such accompanying drawings illustrate the embodiments of the present invention and are used to describe the principles of the present invention together with the Description. In the accompanying drawings the same components are represented using the same reference. As shown in the drawings:
Figure 1 is a schematic perspective view of the cooling body with the end portion thereof opened; Figure 2 is a schematic perspective view of the cooling body with the end portion thereof closed; Figure 3a is a schematic view of the first embodiment of the cooling device according to the present invention;
Figure 3b is a schematic view of the second embodiment of the cooling device according to the present invention; Figure 3c is a schematic view of the third embodiment of the cooling device according to the present invention; and
Figure 4 is a sectional view of the cooling device formed in a panel-shape. Detailed Description of the Embodiments
Figure 1 illustrates the perspective view of the cooling body 1 of the cooling device according to the present invention. In a preferable design of the present invention, the cooling body 1 is designed to be in a tubular shape, and made of copper, aluminum or other metals having a fine heating conducting property. Of course, the cooling body according to the present invention is not just limited to the tubular shape, and can also be designed to be in other shapes suitable for bending and obtaining a larger heat dissipation area. It may also be made of a solid wire or rod.
The cooling body 1 with its end portion cut open can be seen from Figure 1 , wherein, the cooling body 1 defines a vacuum sealing chamber 3 by way of the pipe wall, wherein, the pipe wall does not need to be provided with therein such capillary structures as the heat-pipe. The cooling medium is directly filled in the vacuum sealing chamber 3. In the design of the present invention, pure water, ether or other pure liquids having a high specific heat capacity can be selected as the cooling medium. Further, the heat capacity can be improved by enlarging the volume of the cooling medium. In the embodiments, the cooling medium fills 20% to 80% of the volume of the vacuum sealing chamber 3. Of course, the filing extent of the cooling medium in the vacuum sealing chamber 3 can be selected freely for the above range according to the powers of the LED lighting apparatuses.
Figure 2 illustrates the cooling body 1 with its end portion 4 closed, and the cooling medium in the cooling body 1 is at least in a low pressure (close to vacuum) or vacuum state, the boiling point of the cooling medium in this state is relatively lowered and is easily vaporized, so that the cooling device obtains a fine heating conducting property. Figures 3a-3c illustrate three embodiments of the cooling device, wherein, at least one cooling body 1 in Figure 3c is wound into the double spiral taper shape, at least one tubular cooling body 1 in Figure 3b is formed in the multi-layer disk shape, and at least one cooling body 1 in Figure 3c is bent to the lantern shape. The cooling device also comprises a heat conducting plate 2 which is connected to the converging portion of the at least one cooling body, and the heat conducting plate 2 contacts an LED lighting apparatus that is not shown, so that the heat from the LED lighting apparatus is transmitted to the cooling body 1 and is dissipated into the ambient environment via the cooling body 1 . Figure 4 illustrates the sectional view of the cooling device formed in the panel-shape. In this design, at least one cooing body 1 is bent to be a winding shape in the plane of the heat conducting plate 2, thus forming a cooling body array, and the cooling body array is paved flat on the heat conducting plate 2 and is in close contact with the same, thereby forming a panel-shape cooling device which can also cool a large-sized apparatus according to needs.
Of course, in the above embodiments of the present invention, the heat pipe can be bent and form a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape. However, in view of the structure features of the heat pipe, an overlarge angle in bending the heat pipe should be avoided so as not to damage the internal structure of the heat pipe.
The descriptions above are only preferable embodiments of the present invention and are not used to restrict the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements etc. within the spirit and principle of the present invention shall all be included in the scope of protection of the present invention. List of reference signs
1 cooling body
2 heat conducting plate 3 vacuum sealing chamber 4 end portion

Claims

Claims:
1 . A cooling device, characterized by, comprising: at least one cooling body (1 ) each of which is provided with a vacuum sealing chamber (3) therein; and a cooling medium filled in the vacuum sealing chamber (3), wherein the cooling medium has a high heat capacity.
2. The cooling device according to claim 1 , characterized in that the cooling medium is filled into 20% to 80% of the volume of the vacuum sealing chamber (3).
3. The cooling device according to claim 1 or 2, characterized in that a pure liquid having a high specific heat capacity is selected as the cooling medium.
4. The cooling device according to claim 3, characterized in that the cooling medium is pure water or ether.
5. The cooling device according to claim 1 or 2, characterized in that the at least one cooling body (1 ) is designed to be in a tubular shape.
6. The cooling device according to claim 1 or 2, characterized in that the at least one cooling body (1 ) is made of metal.
7. The cooling device according to claim 1 or 2, characterized in that the at least one cooling body (1 ) is bendable.
8. The cooling device according to claim 7, characterized in that the cooling device comprises a heat conducting plate (2) which transmits the heat of an object to be cooled to the at least one cooling body (1 ).
9. The cooling device according to claim 8, characterized in that the at least one cooling body (1 ) is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape.
10. The cooling device according to claim 8, characterized in that the at least one cooling body (1 ) is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate (2).
11 . An LED lighting apparatus, characterized in that the LED lighting apparatus comprises the cooling device according to any of claims 1 to 10.
12. A cooling device, characterized by, comprising: at least one cooling body (1 ), wherein the at least one cooling body comprises an elongated bendable member.
13. The cooling device according to claim 12, characterized in that the at least one cooling body is a wire, a rod, a metal pipe or a heat pipe.
14. The cooling device according to claim 13, characterized in that the cooling device comprises no more than 5, preferably no more than 2 elongated members.
15. The cooling device according to claim 13, characterized in that the cooling device comprises no more than 2 elongated members.
16. The cooling device according to claim 14 or 15, characterized in that the cooling device comprises a heat conducting plate (2) which transmits the heat of an object to be cooled to the at least one cooling body (1 ).
17. The cooling device according to claim 16, characterized in that the at least one cooling body (1 ) is bent and forms a shape selected from a group consisting of a double spiral taper shape, a multi-layer disk shape and a lantern shape.
18. The cooling device according to claim 16, characterized in that the at least one cooling body (1 ) is bent and forms a panel-shape cooling body array, and the cooling body array sticks to the surface of the heat conducting plate (2).
19. An LED lighting apparatus, characterized in that the LED lighting apparatus comprises the cooling device according to any of claims 12 to 18.
PCT/EP2011/062676 2010-07-30 2011-07-22 Cooling device and led lighting device comprising the same Ceased WO2012013605A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201010246549 2010-07-30
CN201010246549.0 2010-07-30
CN2010102578041A CN102345843A (en) 2010-07-30 2010-08-13 Cooling device and LED (light emitting diode) illumination device with same
CN201010257804.1 2010-08-13

Publications (2)

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WO2012013605A2 true WO2012013605A2 (en) 2012-02-02
WO2012013605A3 WO2012013605A3 (en) 2012-03-29

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CN (1) CN102345843A (en)
WO (1) WO2012013605A2 (en)

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CN104565889A (en) * 2013-10-22 2015-04-29 上海德士电器有限公司 Spiral LED assembly and LED bulb lamp using same
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