WO2012009174A3 - Air jet active heat sink apparatus - Google Patents

Air jet active heat sink apparatus Download PDF

Info

Publication number
WO2012009174A3
WO2012009174A3 PCT/US2011/042915 US2011042915W WO2012009174A3 WO 2012009174 A3 WO2012009174 A3 WO 2012009174A3 US 2011042915 W US2011042915 W US 2011042915W WO 2012009174 A3 WO2012009174 A3 WO 2012009174A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
air jet
active heat
sink apparatus
plenum
Prior art date
Application number
PCT/US2011/042915
Other languages
French (fr)
Other versions
WO2012009174A2 (en
Inventor
Todd Richard Salamon
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Publication of WO2012009174A2 publication Critical patent/WO2012009174A2/en
Publication of WO2012009174A3 publication Critical patent/WO2012009174A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An apparatus comprising a heat sink and a plenum. The heat sink includes a base and a plurality of heat exchange elements, connected to and raised above, a surface of the base. The plenum is located above the heat exchange elements. The plenum includes a housing configured to hold a positive air-pressure therein, and openings in a surface of the housing. The opening are positioned such that air exiting the plenum through the openings is directed to the heat sink.
PCT/US2011/042915 2010-07-13 2011-07-05 Air jet active heat sink apparatus WO2012009174A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/835,375 US20120012286A1 (en) 2010-07-13 2010-07-13 Air jet active heat sink apparatus
US12/835,375 2010-07-13

Publications (2)

Publication Number Publication Date
WO2012009174A2 WO2012009174A2 (en) 2012-01-19
WO2012009174A3 true WO2012009174A3 (en) 2012-03-29

Family

ID=45465981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/042915 WO2012009174A2 (en) 2010-07-13 2011-07-05 Air jet active heat sink apparatus

Country Status (3)

Country Link
US (1) US20120012286A1 (en)
TW (1) TW201212807A (en)
WO (1) WO2012009174A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014084891A2 (en) * 2012-11-30 2014-06-05 Anna Dyson Methods and systems of modifying air flow at building structures
US10085363B2 (en) * 2014-05-22 2018-09-25 General Electric Company Integrated compact impingement on extended heat surface
DE102016210198A1 (en) * 2016-06-09 2017-12-14 Zf Friedrichshafen Ag Cooling of components with a pressure surge generator to form a turbulent coolant flow
CN109862761B (en) * 2019-03-28 2024-03-15 西门子（上海）电气传动设备有限公司 High-voltage frequency converter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583316A (en) * 1992-08-06 1996-12-10 Pfu Limited Heat-generating element cooling device
JP2004006769A (en) * 2002-04-26 2004-01-08 Denso Corp Cooler for electronic apparatuses
US20100147501A1 (en) * 2008-12-15 2010-06-17 Delphi Technologies, Inc. Curled manifold for evaporator

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5063476A (en) * 1989-12-05 1991-11-05 Digital Equipment Corporation Apparatus for controlled air-impingement module cooling
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
US6781834B2 (en) * 2003-01-24 2004-08-24 Hewlett-Packard Development Company, L.P. Cooling device with air shower
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
JP2005079175A (en) * 2003-08-28 2005-03-24 Toshiba Corp Heat dissipating device
DE602004003316T2 (en) * 2003-09-12 2007-03-15 Samsung Electronics Co., Ltd., Suwon Diaphragm pump for cooling air
US20060196638A1 (en) * 2004-07-07 2006-09-07 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
US8051905B2 (en) * 2006-08-15 2011-11-08 General Electric Company Cooling systems employing fluidic jets, methods for their use and methods for cooling

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583316A (en) * 1992-08-06 1996-12-10 Pfu Limited Heat-generating element cooling device
JP2004006769A (en) * 2002-04-26 2004-01-08 Denso Corp Cooler for electronic apparatuses
US20100147501A1 (en) * 2008-12-15 2010-06-17 Delphi Technologies, Inc. Curled manifold for evaporator

Also Published As

Publication number Publication date
TW201212807A (en) 2012-03-16
US20120012286A1 (en) 2012-01-19
WO2012009174A2 (en) 2012-01-19

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