WO2012002032A1 - Led package, illuminating device, led backlight device, and liquid crystal display device - Google Patents

Led package, illuminating device, led backlight device, and liquid crystal display device Download PDF

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Publication number
WO2012002032A1
WO2012002032A1 PCT/JP2011/059915 JP2011059915W WO2012002032A1 WO 2012002032 A1 WO2012002032 A1 WO 2012002032A1 JP 2011059915 W JP2011059915 W JP 2011059915W WO 2012002032 A1 WO2012002032 A1 WO 2012002032A1
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WO
WIPO (PCT)
Prior art keywords
led
terminal
electrode terminal
substrate
backlight device
Prior art date
Application number
PCT/JP2011/059915
Other languages
French (fr)
Japanese (ja)
Inventor
真之助 野澤
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012002032A1 publication Critical patent/WO2012002032A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Definitions

  • the present invention relates to an LED package including an LED light source, an illumination device and an LED backlight device including the LED package, and a liquid crystal display device including the backlight device.
  • LEDs Light Emitting Diodes
  • the blue LED chip was developed, a white LED light source that emits white light by combining the blue LED chip and a phosphor that is excited by light from the LED chip and emits excitation light of a predetermined wavelength, A white LED light source that synthesizes white light using three primary color LED chips of a blue LED chip, a green LED chip, and a red LED chip has been developed.
  • an LED illumination device provided with this white LED light source is used as a backlight of an illumination device, a liquid crystal display device or the like.
  • a direct type backlight device in which a light source is disposed on the rear surface of the display screen, and a light guide plate is disposed on the rear surface of the display screen by arranging a light source on the side of the display screen.
  • An edge light type backlight device is known in which light is incident on a light guide plate from a side portion of a display screen and light is emitted in a planar shape from a light emitting surface of the light guide plate while reflecting the light guide plate.
  • the edge-light type backlight device is equipped with a light source on the side of the display screen and a plate-shaped light guide plate behind the display screen, making it easy to reduce the thickness of liquid crystal display devices, etc. Preferred for.
  • the direct type backlight device is preferable because a light source is installed on the rear surface of the display screen to directly illuminate, so that high-intensity illumination is easy and control of light emission luminance for each area is easy.
  • Each LED light source includes an LED package that is packaged by mounting an LED chip on a submount substrate and sealing it with a transparent resin or a transparent resin containing a predetermined phosphor.
  • a plurality of packages are integrally installed on the LED mounting substrate to form a light emitting member having a predetermined shape.
  • a large number of LED mounting boards on which a plurality of LED packages are mounted are arranged in parallel to constitute a lighting device having a large light emitting area such as a direct type backlight device. Therefore, when the LED package is mounted or replaced, the LED mounting substrate on which the plurality of LED packages are mounted is performed as a unit.
  • the main board on which the LED mounting boards are arranged side by side has been devised to facilitate the attachment / detachment of the respective LED mounting boards.
  • the LEDs and the electrical components necessary to drive the LEDs There has already been disclosed a backlight device in which a sub-printed board on which is integrally mounted is easily attached to and detached from a parent board (see, for example, Patent Document 1).
  • the LED mounting board on which the LED package is mounted can be easily attached to and detached from the main board, the mounting efficiency is improved and the replacement work is also easy.
  • the LED mounting board on which the LED package is mounted can be easily attached to and detached from the main board, the mounting efficiency is improved and the replacement work is also easy.
  • each LED package has a configuration that can be easily replaced individually so that it can be performed.
  • the LED light source is composed of an LED package in which a submount substrate, an LED chip, a sealing resin, and an electrode terminal are assembled and integrated, and the LED package can be individually attached to and detached from the LED mounting substrate.
  • a configuration is preferable.
  • the present invention is configured to be individually detachable from an LED mounting board in an illumination device using LEDs, a direct type LED backlight device, and a liquid crystal display device including the backlight device.
  • An LED package is provided, and an LED mounting board on which the LED package is mounted is provided side by side to provide an illumination device and an LED backlight device that are excellent in mounting efficiency and economy, and the manufacturing cost can be reduced by using the backlight device.
  • An object is to provide a liquid crystal display device that can be reduced.
  • the present invention provides an LED chip, a submount substrate on which the LED chip is mounted, an electrode terminal for driving the LED chip, and a sealing resin for sealing the LED chip.
  • the electrode terminal includes an LED side cathode terminal and an LED side anode terminal, and both of these terminals are provided on the back surface side of the submount substrate opposite to the LED chip mounting surface.
  • the cathode terminal is a conical screw-like terminal provided on the side surface of the male electrode terminal, and the anode terminal is provided at the top of the truncated cone It is characterized by being a planar terminal.
  • the female electrode terminal connected to the male electrode terminal included in the LED package is provided on the substrate side to which the LED package is attached, and the male LED side electrode terminal is screwed into the female substrate side electrode terminal.
  • the respective cathode terminals and anode terminals can be electrically connected. Therefore, a detachable LED package can be obtained through a truncated cone electrode terminal.
  • the LED package further includes an engaged portion to which an attachment connected to a detachable tool is engaged. According to this configuration, since the attachment / detachment operation of the LED package can be performed by engaging the attachment included in the attachment / detachment tool with the engaged portion of the LED package, the attachment / detachment operation of the LED package can be automated.
  • the engaged portion is an outer shape outer frame of the submount substrate, and the outer frame has an outer shape that fits into an engagement recess included in the attachment. It is characterized by that. According to this configuration, the attachment / detachment operation of the LED package can be performed by fitting the attachment to the outer frame of the submount substrate.
  • the engaged portion is a solidified outer shape of the sealing resin, and the solidified outer shape has an outer shape that fits into an engagement concave portion of the attachment. It is characterized by. According to this configuration, the attachment / detachment operation of the LED package can be performed by fitting the attachment into the outer shape of the sealing resin.
  • the present invention is characterized in that in the LED package having the above-described configuration, a diffusion lens is mounted on the top of the sealing resin, and the diffusion lens has an outer shape that fits into an engagement recess included in the attachment. According to this configuration, the attachment / detachment operation of the LED package can be performed individually by fitting the attachment to the outer shape of the diffusing lens.
  • a light emitting surface is formed by arranging a plurality of LED mounting boards on which a plurality of LED packages according to any one of claims 1 to 5 are mounted, and the LED mounting board is a male type provided in the LED package.
  • a female electrode terminal that is screwed to the electrode terminal is provided, and the female electrode terminal has an inner peripheral side surface portion screwed to an LED-side cathode terminal provided on a frustoconical side surface of the male electrode terminal.
  • the illumination device is a substrate-side cathode terminal and the bottom surface of the female electrode terminal is a substrate-side anode terminal.
  • an LED backlight device for irradiating light emitted from an LED from behind a liquid crystal panel, wherein an LED mounting substrate on which a plurality of LED packages according to any one of claims 1 to 5 are mounted is provided in parallel.
  • a light emitting surface is formed, and the LED mounting substrate includes a female electrode terminal screwed into a male electrode terminal included in the LED package, and the female electrode terminal includes an inner peripheral side surface of the male electrode terminal.
  • a substrate-side cathode terminal screwed into an LED-side cathode terminal provided on a frustoconical side surface of the die electrode terminal is used, and a bottom surface portion of the female electrode terminal is a substrate-side anode terminal.
  • the male electrode terminal included in the LED package and the female electrode terminal provided on the LED mounting board can be screwed together to mount each LED package on the LED mounting board.
  • an LED backlight device having excellent mounting efficiency and economy can be obtained by arranging LED mounting substrates on which individually detachable LED packages are mounted to form a light emitting surface.
  • an anode backlight terminal can be automatically connected to each other by an operation of screwing and mounting a conical screw-like cathode terminal, and an LED backlight device that can be easily mounted can be obtained.
  • the engagement portion of the attachment connected to the attaching / detaching tool is engaged with the engaged portion included in the LED package, so that the plurality of LED mounting boards are provided.
  • the LED packages can be individually attached to and detached from the LED mounting substrate by using the attachment / detachment tool in a state of being arranged in parallel. According to this configuration, since the LED package can be automatically attached / detached using the attaching / detaching tool having a predetermined attachment, an LED backlight device that can be mounted more easily can be obtained.
  • the engaged portion may be an outer frame of a submount substrate included in the LED package, a solidified outer shape of a sealing resin, or an outer shape of a diffusion lens.
  • These outer shapes are outer shapes that fit into engaging recesses of the attachment.
  • the attachment / detachment tool can be mounted by engaging the attachment with the outer frame of the submount substrate or by engaging the attachment with the solidified outer shape of the sealing resin. ⁇ ⁇ Attaching / detaching operation using a tool for removal can be performed.
  • the present invention is characterized in that a liquid crystal display device including a liquid crystal panel and the LED backlight device according to any one of claims 7 to 10 is provided. According to this configuration, it is possible to obtain a liquid crystal display device that can reduce the manufacturing cost by using a backlight device that is easy to attach and detach individual LED packages and is excellent in mounting efficiency and economy.
  • each LED package is individually connected via the truncated cone-shaped terminal. It becomes a detachable configuration. Therefore, it is possible to obtain an illumination device and an LED backlight device that are excellent in mounting efficiency and economy by arranging the LED mounting substrate on which the LED package is mounted, and the manufacturing cost is reduced by using the backlight device. A possible liquid crystal display device can be obtained.
  • the LED package 1 shown in FIG. 1 includes a submount substrate 11, an LED chip 12 mounted on the submount substrate 11, and a sealing resin 13 for sealing the LED chip 12.
  • an electrode terminal TA for driving the LED chip 12 is provided on the back surface side of the submount substrate 11 opposite to the LED chip mounting surface.
  • the electrode terminal TA is a male electrode terminal, and is connected to a female electrode terminal TB provided on the LED mounting substrate side.
  • the LED package 1 can be easily attached to and detached from the LED mounting substrate via these male and female electrode terminals.
  • Each electrode terminal includes a cathode terminal and an anode terminal.
  • the electrode terminal TA of the LED package 1 is a male electrode terminal projecting in a truncated cone shape
  • the LED side cathode terminal 14A Is a conical screw terminal provided on the side surface of the truncated cone
  • the LED side anode terminal 15A is a planar terminal provided on the top of the truncated cone.
  • the electrode terminal TB provided on the LED mounting substrate side is a female (female screw type) electrode terminal that fits into a male (male screw type) electrode terminal TA, and the inner peripheral side surface portion is formed on the substrate.
  • the side cathode terminal 14B is used, and the bottom part is the substrate side anode terminal 15B.
  • the LED side cathode terminal 14A and the LED side anode terminal 15A are each electrically connected to electrodes formed on the submount substrate, and a predetermined LED is connected via the electrode terminal TB on the LED mounting substrate side. A drive path is formed.
  • the male conical screw-like electrode terminal TA is mounted so as to be screwed into the female electrode terminal TB, and the LED-side cathode terminal 14A and the substrate-side cathode terminal 14B provided on the side screw portion. And electrically connect. Further, when screwed to the end, the LED side anode terminal 14B and the substrate side anode terminal 15B come into contact with each other and are electrically connected.
  • either one or both of the LED side anode terminal 14B and the substrate side anode terminal 15B may be configured to have elasticity in the abutting direction.
  • the connection configuration includes the male conical screw electrode terminal TA and the female electrode terminal TB, the LED package is detachable via the truncated cone electrode terminal.
  • each LED package 1 is detachably attached to the electrode terminal on the LED mounting substrate side, each LED package 1 can be individually detached and attached. Therefore, as shown in FIG. 2, even after a plurality of LED packages 1 (1 ⁇ / b> A, 1 ⁇ / b> B, 1 ⁇ / b> C...) Are incorporated in the mounting substrate 2 to form an integrated lighting device or light emitting device, each LED package 1. Can be removed individually and replaced with another new LED package.
  • the LED package 1 is configured to include an engaged portion to which the attachment AT connected to the attachment / detachment tool TL such as an electric screwdriver is engaged, the attachment AT included in the attachment / detachment tool TL is the LED package 1. Since the attachment / detachment operation can be performed by being engaged with the engaged portion, the attachment / detachment operation can be automated, which is preferable.
  • the engaged portion with which the attachment AT is engaged is preferably disposed on the upper surface side when the LED package 1 is mounted on the mounting substrate 2, in this embodiment, the submount substrate 11 shown in FIG.
  • the example using an outer frame and the example using the solidified outer shape of the sealing resin 13 shown in FIG. 3B are employed.
  • a submount substrate 11A having a polygonal outer frame with a predetermined shape is used, and an attachment AT1 having an engagement recess ATa that engages with the outer frame is used.
  • the outer outer frame may be, for example, a quadrangle or a hexagon, and is not particularly limited.
  • the sealing resin 13A having a polygonal solidified outer shape of a predetermined shape is used, and an attachment AT2 having an engagement recess ATb that engages with the solidified external shape is used.
  • the shape of the solidified outer shape may be, for example, a quadrangle or a hexagon, and is not particularly limited.
  • the diffusing lens may have an outer shape that fits into an engaging recess of the attachment AT.
  • the attachment AT can be fitted into the outer shape of the diffusing lens and the LED package 1 can be attached and detached individually.
  • the engaged portion provided in the LED package 1 may be other than the outer frame of the submount substrate, the solidified outer shape of the sealing resin, or the outer shape of the diffusing lens, for example, on the upper surface of the submount substrate.
  • Engaging projections that engage with these fitting recesses (or projections) by providing fitting recesses (or projections) or fitting recesses (or projections) on the outer surface of the sealing resin. It is good also as a structure using the attachment provided with the part (or recessed part).
  • the lighting device using the LED package 1 described above can detachably mount the LED packages 1 individually on the LED mounting substrate. Therefore, it is possible to form a light emitting surface having a predetermined area by arranging LED mounting substrates each having an individually detachable LED package mounted thereon, which is preferable as a lighting device having excellent mounting efficiency and economy.
  • the LED backlight device using the LED package 1 according to the present embodiment has, as shown in FIG. 4, for example, a connector 2 that is mounted on a mounting board 2 on which a predetermined number, for example, five LED packages 1 (1A to 1E) are mounted.
  • the LED backlight device 4 having a predetermined area is formed by connecting through 16 and extending in a row and arranging a plurality of stages.
  • the LED backlight device 4 in which the plurality of LED packages 1 are arranged at predetermined pitches in the vertical and horizontal directions is configured in units of a mounting substrate 2 on which a predetermined number, for example, five LED packages 1 are mounted. . Therefore, it can be attached and detached for each mounting substrate 2, mounting efficiency for mounting the LED package 1 on the LED backlight device 4 is improved, and replacement work is also facilitated.
  • the LED package 1 according to the present embodiment is configured to be individually detachable from the mounting substrate 2, the LED package 1 can be mounted without removing the mounting substrate 2 installed on the LED backlight device 4. It can be detached and attached independently.
  • the LED backlight device 4 excellent in mounting efficiency and economy can be obtained by arranging the LED mounting substrates 2 on which the individually detachable LED packages 1 are mounted in parallel. it can.
  • a liquid crystal display device 6 using the above backlight device 4 as a direct backlight is configured as shown in FIG. Moreover, this liquid crystal display device 6 can be used as a display part of the liquid crystal television 7 shown in FIG. Such a liquid crystal television 7 can be said to be a television receiver since it receives a television broadcast signal and projects an image.
  • the liquid crystal display device 6 includes a liquid crystal panel 5, an LED backlight device 4 for supplying light to the liquid crystal panel 5, and a housing HG (front housing HG1 and rear housing HG2) sandwiching them. And including.
  • an active matrix substrate 51 including a switching element such as a TFT (Thin Film Transistor) and an opposing substrate 52 facing the active matrix substrate 51 are bonded together with a sealant (not shown). Then, liquid crystal (not shown) is injected into the gap between the substrates 51 and 52.
  • a switching element such as a TFT (Thin Film Transistor)
  • an opposing substrate 52 facing the active matrix substrate 51 are bonded together with a sealant (not shown). Then, liquid crystal (not shown) is injected into the gap between the substrates 51 and 52.
  • a polarizing film 53 is attached to the light receiving surface side of the active matrix substrate 51 and the emission side of the counter substrate 52. And the above liquid crystal display panel 5 displays an image using the change of the transmittance
  • the LED backlight device 4 positioned immediately below the liquid crystal display panel 5 includes an LED module MJ, a backlight chassis 41, a reflection sheet 42, a diffusion plate 43, a prism sheet 44, and a lens sheet 45.
  • the LED module MJ is configured by mounting a plurality of LED packages 1 on the mounting surface 21U of the LED mounting substrate 21.
  • the LED mounting substrate 21 is a plate-like and rectangular substrate like the LED mounting substrate 2 described above, and a plurality of electrodes (not shown) are arranged on the mounting surface 21U. Then, the packaged LED package 1 is mounted on these electrodes. Each LED package 1 is mounted with an LED chip via a submount substrate. The electrode and the LED chip are electrically connected via the submount substrate.
  • a resist film (not shown) serving as a protective film is formed on the mounting surface 21U of the LED mounting substrate 21.
  • This resist film is, for example, white having reflectivity. This is because even if light is incident on the resist film, the light is reflected by the resist film and tends to go outside, thereby eliminating the cause of unevenness in the amount of light due to light absorption by the mounting substrate 21.
  • a relatively long mounting substrate 21 on which the LED packages 1 are mounted in a row is mounted.
  • the rows of the five LED packages 1 and the row of the eight LED packages 1 are arranged so as to form a row of 13 LED packages 1, and further, with respect to the direction in which the 13 LED packages 1 are arranged.
  • the two types of mounting boards 21 are also arranged in the intersecting (orthogonal) direction (note that the arrangement intervals of the LED packages 1 are equal).
  • the arrangement pattern and the number of LED light sources arranged are appropriately changed according to the size of the screen and the required luminance.
  • the LED package 1 is arranged in a lattice shape (in other words, the LED module MJ is planar), and light from these LED packages 1 is mixed to generate planar light (for convenience, different types of light are used).
  • the direction in which the mounting boards 21 are arranged is the X direction
  • the direction in which the same kind of mounting boards 21 are arranged is the Y direction
  • the direction intersecting the X direction and the Y direction is the Z direction).
  • the backlight chassis 41 is a box-shaped member, for example, and accommodates the plurality of LED modules MJ by spreading the LED modules MJ on the bottom surface 41B.
  • the bottom surface 41B of the backlight chassis 41 and the LED mounting board 21 of the LED module MJ are connected via a rivet (not shown).
  • a reflection sheet 42, a diffusion plate 43, a prism sheet 44, and a lens sheet 45 are stacked in this order.
  • the reflection sheet 42 is an optical sheet having a reflection surface 42U, and covers the plurality of LED modules MJ with the back surface of the reflection surface 42U facing. However, the reflection sheet 42 includes a through hole 42H that matches the position of the LED package 1, and exposes the light emitting surface of the LED package 1 from the reflection surface 42U.
  • the presence of the reflection sheet 42 causes the light of the LED package 1 to travel toward the diffusion plate 43 facing the reflection surface 42U without loss.
  • the diffusion plate 43 is an optical sheet that overlaps the reflection sheet 42 and diffuses the light emitted from the LED module MJ and the reflection light from the reflection sheet 42U. That is, the diffusion plate 43 diffuses the planar light formed by the plurality of LED modules MJ (in other words, the plurality of LED packages 1 arranged in a matrix) and spreads the light over the entire liquid crystal display panel 5. .
  • the prism sheet 44 is an optical sheet that overlaps the diffusion plate 43.
  • the prism sheet 44 arranges, for example, triangular prisms extending in one direction (linear) in a direction intersecting with one direction in the sheet surface. Thereby, the prism sheet 44 deflects the radiation characteristic of the light from the diffusion plate 43.
  • the prisms extend along the Y direction in which the LED packages 1 are arranged in a small number, and are arranged in the X direction in which the LED packages 1 are arranged in a large number.
  • the lens sheet 45 is an optical sheet that overlaps the prism sheet 44.
  • the lens sheet 45 disperses the fine particles that refract and scatter light inside. Thereby, the lens sheet 45 suppresses the light / dark difference (light quantity unevenness) without locally condensing the light from the prism sheet 44.
  • the LED backlight device 4 as described above supplies the planar light formed by the plurality of LED modules MJ to the liquid crystal panel 5 through the plurality of optical sheets 43 to 45.
  • the non-light-emitting liquid crystal panel 5 receives the light (backlight light) from the LED backlight device 4 and improves the display function.
  • a plurality of LED packages 1 are arranged in, for example, a lattice shape or a zigzag shape to form a planar light emitter. Therefore, if defective products are mixed in the LED package 1 which is a point light source or a failure occurs, a predetermined light emission intensity cannot be obtained, which causes a reduction in display quality.
  • an LED package It is preferable that each can be attached and detached individually. Therefore, by using the LED package 1 that is provided with a conical screw-like electrode terminal and can be individually attached to and detached from the LED mounting substrate, an LED backlight device 4 that is excellent in mounting efficiency and economy can be obtained.
  • the liquid crystal display device 6 capable of reducing the manufacturing cost can be obtained using this backlight.
  • the LED package 1 is provided with the conical screw-shaped cathode terminal and the planar anode terminal provided on the top of the truncated cone.
  • the LED packages can be individually detached.
  • the LED mounting substrate on which the LED package 1 is mounted it is possible to obtain an illumination device and an LED backlight device that are excellent in mounting efficiency and economy, and the manufacturing cost is reduced by using the backlight device.
  • a possible liquid crystal display device can be obtained.
  • the LED package and the LED backlight device according to the present invention use a large number of LED packages, reduce the manufacturing cost, stabilize the display quality, and improve the reliability.
  • the LED backlight device can be suitably used.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

Disclosed are an illuminating device using an LED, a direct LED backlight device, and a liquid crystal display device provided with the backlight device. An LED package configured to be individually attached to and removed from an LED mounting substrate is provided, and the illuminating device and the LED backlight device having excellent mounting efficiency and cost performance are provided by having the LED mounting substrates disposed in parallel, each of said LED mounting substrates having the LED package mounted thereon, and the liquid crystal display device having reduced manufacture cost using the backlight device is provided. The LED package (1) has a male electrode terminal (TA), which is provided with a conical screw-like cathode terminal, and a planar anode terminal, which is provided on the top of the circular truncated cone. In the illuminating device and the LED backlight device (4), the LED mounting substrate is provided with a female electrode terminal (TB) to be screwed with the male electrode terminal, and each LED package (1) can be individually attached to and removed from the LED mounting substrate by having the conical screw-like connecting terminal between the LED package and the LED mounting substrate.

Description

ＬＥＤパッケージ、照明装置、ＬＥＤバックライト装置および液晶表示装置LED package, illumination device, LED backlight device, and liquid crystal display device
　本発明は、ＬＥＤ光源を備えたＬＥＤパッケージ、このＬＥＤパッケージを備えた照明装置やＬＥＤバックライト装置、およびこのバックライト装置を備えた液晶表示装置に関する。 The present invention relates to an LED package including an LED light source, an illumination device and an LED backlight device including the LED package, and a liquid crystal display device including the backlight device.
　近年、発光効率の向上や発光量の増加と共に、寿命が長く消費電力が小さくて、環境にやさしいとされるＬＥＤ（Light　Emitting　Diode：発光ダイオード）を用いた照明装置が実用化されつつある。また、青色ＬＥＤチップが開発されて以来、この青色ＬＥＤチップと、このＬＥＤチップからの光に励起されて所定波長の励起光を発光する蛍光体と、を組み合わせて白色発光する白色ＬＥＤ光源や、青色ＬＥＤチップと緑色ＬＥＤチップと赤色ＬＥＤチップとの三原色のＬＥＤチップを用いて白色光を合成する白色ＬＥＤ光源が開発されている。 In recent years, along with improvement in luminous efficiency and increase in the amount of emitted light, lighting devices using LEDs (Light Emitting Diodes), which are considered to be environmentally friendly with long life and low power consumption, are being put into practical use. Since the blue LED chip was developed, a white LED light source that emits white light by combining the blue LED chip and a phosphor that is excited by light from the LED chip and emits excitation light of a predetermined wavelength, A white LED light source that synthesizes white light using three primary color LED chips of a blue LED chip, a green LED chip, and a red LED chip has been developed.
　そのために、照明装置や液晶表示装置などのバックライトとして、この白色ＬＥＤ光源を配設したＬＥＤ照明装置が用いられている。また、液晶表示装置などのバックライトとしては、表示画面の後面に光源を配置する直下型のバックライト装置と、表示画面の側部に光源を配置し表示画面の後面に導光板を設置して、表示画面の側部から導光板に光を入射して、導光板内を反射させながら導光板の発光面から面状に発光させるエッジライト型のバックライト装置が知られている。 For this reason, an LED illumination device provided with this white LED light source is used as a backlight of an illumination device, a liquid crystal display device or the like. In addition, as backlights for liquid crystal display devices, etc., a direct type backlight device in which a light source is disposed on the rear surface of the display screen, and a light guide plate is disposed on the rear surface of the display screen by arranging a light source on the side of the display screen. An edge light type backlight device is known in which light is incident on a light guide plate from a side portion of a display screen and light is emitted in a planar shape from a light emitting surface of the light guide plate while reflecting the light guide plate.
　エッジライト型のバックライト装置は、表示画面の側部に光源部を設け、表示画面の後方に板状の導光板を設置する構成なので、薄型化が容易であり、液晶表示装置などの薄型化にとって好ましい。また、直下型のバックライト装置は、表示画面の後面に光源を設置して直に照明しているので、高輝度照明が容易であり、発光輝度のエリア毎の制御も容易となって好ましい。 The edge-light type backlight device is equipped with a light source on the side of the display screen and a plate-shaped light guide plate behind the display screen, making it easy to reduce the thickness of liquid crystal display devices, etc. Preferred for. In addition, the direct type backlight device is preferable because a light source is installed on the rear surface of the display screen to directly illuminate, so that high-intensity illumination is easy and control of light emission luminance for each area is easy.
　また、それぞれのＬＥＤ光源は、サブマウント基板にＬＥＤチップを搭載してその上を透明樹脂、あるいは所定の蛍光体を配合した透明樹脂で封止してパッケージ化されたＬＥＤパッケージからなり、このＬＥＤパッケージを、ＬＥＤ実装基板に複数一体に設置して所定形状の発光部材を形成している。 Each LED light source includes an LED package that is packaged by mounting an LED chip on a submount substrate and sealing it with a transparent resin or a transparent resin containing a predetermined phosphor. A plurality of packages are integrally installed on the LED mounting substrate to form a light emitting member having a predetermined shape.
　また、複数のＬＥＤパッケージを搭載したＬＥＤ実装基板を多数並設して、直下型バックライト装置等の大きな発光面積の照明装置を構成する。そのために、ＬＥＤパッケージを装着したり交換したりする際には、複数のＬＥＤパッケージが搭載されたＬＥＤ実装基板を単位として行う。 Also, a large number of LED mounting boards on which a plurality of LED packages are mounted are arranged in parallel to constitute a lighting device having a large light emitting area such as a direct type backlight device. Therefore, when the LED package is mounted or replaced, the LED mounting substrate on which the plurality of LED packages are mounted is performed as a unit.
　そのために、ＬＥＤ実装基板を並設するメイン基板に対して、それぞれのＬＥＤ実装基板の着脱を容易とするための工夫がなされており、例えば、ＬＥＤとこのＬＥＤを駆動するのに必要な電気部品を一体に装着したサブプリント基板を親基板に対して着脱容易としたバックライト装置が既に公開されている（例えば、特許文献１参照）。 For this reason, the main board on which the LED mounting boards are arranged side by side has been devised to facilitate the attachment / detachment of the respective LED mounting boards. For example, the LEDs and the electrical components necessary to drive the LEDs There has already been disclosed a backlight device in which a sub-printed board on which is integrally mounted is easily attached to and detached from a parent board (see, for example, Patent Document 1).
特開昭６３－４９７８７号公報JP 63-49787 A
　ＬＥＤパッケージを搭載したＬＥＤ実装基板がメイン基板に着脱容易であれば、実装効率がよくなり、交換作業も容易となる。しかし、１枚のＬＥＤ実装基板に複数のＬＥＤパッケージを搭載している場合は、１個のＬＥＤパッケージに不良が生じるとＬＥＤ実装基板単位で交換する必要が生じるので、問題のないＬＥＤパッケージまで交換することになってしまい不経済となる。 If the LED mounting board on which the LED package is mounted can be easily attached to and detached from the main board, the mounting efficiency is improved and the replacement work is also easy. However, when multiple LED packages are mounted on a single LED mounting board, it is necessary to replace each LED mounting board if a defect occurs in one LED package. Will be uneconomical.
　また、ＬＥＤ照明装置やＬＥＤバックライト装置の生産性を上げるためには、複数のＬＥＤパッケージを搭載したＬＥＤ実装基板を一体的に装着可能であるだけではなく、不良なＬＥＤパッケージは直ちに良品と交換できるように、それぞれのＬＥＤパッケージを個別に交換容易な構成であることが好ましい。 In addition, in order to increase the productivity of LED lighting devices and LED backlight devices, not only can an LED mounting board with a plurality of LED packages mounted thereon be integrated, but defective LED packages can be immediately replaced with good products. It is preferable that each LED package has a configuration that can be easily replaced individually so that it can be performed.
　そのために、ＬＥＤ光源を、サブマウント基板とＬＥＤチップと封止樹脂と電極端子とを組み付けて一体化したＬＥＤパッケージから構成し、さらに、このＬＥＤパッケージをＬＥＤ実装基板に対して個別に着脱自在な構成とすることが好ましい。 For this purpose, the LED light source is composed of an LED package in which a submount substrate, an LED chip, a sealing resin, and an electrode terminal are assembled and integrated, and the LED package can be individually attached to and detached from the LED mounting substrate. A configuration is preferable.
　そこで本発明は、上記問題点に鑑み、ＬＥＤを用いた照明装置や直下型のＬＥＤバックライト装置およびこのバックライト装置を備える液晶表示装置において、ＬＥＤ実装基板に個別に着脱自在な構成とされるＬＥＤパッケージを提供し、このＬＥＤパッケージを搭載したＬＥＤ実装基板を並設することで実装効率と経済性に優れた照明装置やＬＥＤバックライト装置を提供し、このバックライト装置を用いて製造コストを低減可能な液晶表示装置を提供することを目的とする。 Therefore, in view of the above problems, the present invention is configured to be individually detachable from an LED mounting board in an illumination device using LEDs, a direct type LED backlight device, and a liquid crystal display device including the backlight device. An LED package is provided, and an LED mounting board on which the LED package is mounted is provided side by side to provide an illumination device and an LED backlight device that are excellent in mounting efficiency and economy, and the manufacturing cost can be reduced by using the backlight device. An object is to provide a liquid crystal display device that can be reduced.
　上記目的を達成するために本発明は、ＬＥＤチップと、該ＬＥＤチップを実装するサブマウント基板と、前記ＬＥＤチップを駆動するための電極端子と、前記ＬＥＤチップを封止する封止樹脂とを備えてパッケージ化されたＬＥＤパッケージにおいて、前記電極端子がＬＥＤ側カソード端子とＬＥＤ側アノード端子とを備え、これらの両端子を前記サブマウント基板の前記ＬＥＤチップ実装面とは反対側の裏面側に円錐台状に突設した雄型電極端子として設けると共に、前記カソード端子は、前記雄型電極端子の側面に設けられた円錐螺子状端子であり、前記アノード端子は、前記円錐台の頂部に設けられた平面状端子とされていることを特徴としている。 To achieve the above object, the present invention provides an LED chip, a submount substrate on which the LED chip is mounted, an electrode terminal for driving the LED chip, and a sealing resin for sealing the LED chip. In the packaged LED package, the electrode terminal includes an LED side cathode terminal and an LED side anode terminal, and both of these terminals are provided on the back surface side of the submount substrate opposite to the LED chip mounting surface. Provided as a male electrode terminal protruding in the shape of a truncated cone, the cathode terminal is a conical screw-like terminal provided on the side surface of the male electrode terminal, and the anode terminal is provided at the top of the truncated cone It is characterized by being a planar terminal.
　この構成によると、ＬＥＤパッケージを取り付ける基板側に、ＬＥＤパッケージが備える雄型電極端子と接続する雌型の電極端子を設け、雄型のＬＥＤ側電極端子を雌型の基板側電極端子にねじ込むようにして装着して、それぞれのカソード端子とアノード端子とを電気的に接続することができる。そのために、円錐台状の電極端子を介して着脱自在なＬＥＤパッケージを得ることができる。 According to this configuration, the female electrode terminal connected to the male electrode terminal included in the LED package is provided on the substrate side to which the LED package is attached, and the male LED side electrode terminal is screwed into the female substrate side electrode terminal. Thus, the respective cathode terminals and anode terminals can be electrically connected. Therefore, a detachable LED package can be obtained through a truncated cone electrode terminal.
　また本発明は上記構成のＬＥＤパッケージにおいて、前記ＬＥＤパッケージは、さらに、着脱用工具に接続されるアタッチメントが係合する被係合部を備えていることを特徴としている。この構成によると、着脱用工具が備えるアタッチメントをＬＥＤパッケージの被係合部に係合させて着脱操作を行うことができるので、ＬＥＤパッケージの着脱操作の自動化を図ることができる。 Further, according to the present invention, in the LED package configured as described above, the LED package further includes an engaged portion to which an attachment connected to a detachable tool is engaged. According to this configuration, since the attachment / detachment operation of the LED package can be performed by engaging the attachment included in the attachment / detachment tool with the engaged portion of the LED package, the attachment / detachment operation of the LED package can be automated.
　また本発明は上記構成のＬＥＤパッケージにおいて、前記被係合部は、前記サブマウント基板の外形外枠であって、該外枠が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴としている。この構成によると、サブマウント基板の外形外枠にアタッチメントを嵌め込んでＬＥＤパッケージの着脱操作を行うことができる。 According to the present invention, in the LED package configured as described above, the engaged portion is an outer shape outer frame of the submount substrate, and the outer frame has an outer shape that fits into an engagement recess included in the attachment. It is characterized by that. According to this configuration, the attachment / detachment operation of the LED package can be performed by fitting the attachment to the outer frame of the submount substrate.
　また本発明は上記構成のＬＥＤパッケージにおいて、前記被係合部は、前記封止樹脂の固化外形であって、該固化外形が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴としている。この構成によると、封止樹脂の外形にアタッチメントを嵌め込んでＬＥＤパッケージの着脱操作を行うことができる。 According to the present invention, in the LED package having the above-described configuration, the engaged portion is a solidified outer shape of the sealing resin, and the solidified outer shape has an outer shape that fits into an engagement concave portion of the attachment. It is characterized by. According to this configuration, the attachment / detachment operation of the LED package can be performed by fitting the attachment into the outer shape of the sealing resin.
　また本発明は上記構成のＬＥＤパッケージにおいて、前記封止樹脂の上部に拡散レンズを搭載し、該拡散レンズが前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴としている。この構成によると、拡散レンズの外形にアタッチメントを嵌め込んでＬＥＤパッケージの着脱操作を個別に行うことができる。 Further, the present invention is characterized in that in the LED package having the above-described configuration, a diffusion lens is mounted on the top of the sealing resin, and the diffusion lens has an outer shape that fits into an engagement recess included in the attachment. According to this configuration, the attachment / detachment operation of the LED package can be performed individually by fitting the attachment to the outer shape of the diffusing lens.
　また本発明は、請求項１から５のいずれかに記載されたＬＥＤパケージを複数搭載したＬＥＤ実装基板を並設して発光面を形成し、前記ＬＥＤ実装基板は、前記ＬＥＤパッケージが備える雄型電極端子に螺合する雌型電極端子を備え、前記雌型電極端子は、その内周側面部を、前記雄型電極端子の円錐台状の側面に設けられたＬＥＤ側カソード端子と螺合する基板側カソード端子とし、前記雌型電極端子の底面部を、基板側アノード端子とした照明装置であることを特徴としている。 According to the present invention, a light emitting surface is formed by arranging a plurality of LED mounting boards on which a plurality of LED packages according to any one of claims 1 to 5 are mounted, and the LED mounting board is a male type provided in the LED package. A female electrode terminal that is screwed to the electrode terminal is provided, and the female electrode terminal has an inner peripheral side surface portion screwed to an LED-side cathode terminal provided on a frustoconical side surface of the male electrode terminal. The illumination device is a substrate-side cathode terminal and the bottom surface of the female electrode terminal is a substrate-side anode terminal.
　この構成によると、個別に着脱可能なＬＥＤパッケージを搭載したＬＥＤ実装基板を並設して発光面を形成して、実装効率と経済性に優れた照明装置を得ることができる。 According to this configuration, it is possible to obtain an illumination device that is excellent in mounting efficiency and economy by forming a light emitting surface by arranging LED mounting substrates each having an individually detachable LED package mounted thereon.
　また本発明は、液晶パネルの後方からＬＥＤが発光する光を照射するＬＥＤバックライト装置であって、請求項１から５のいずれかに記載されたＬＥＤパケージを複数搭載したＬＥＤ実装基板を並設して発光面を形成し、前記ＬＥＤ実装基板は、前記ＬＥＤパッケージが備える雄型電極端子に螺合する雌型電極端子を備え、前記雌型電極端子は、その内周側面部を、前記雄型電極端子の円錐台状の側面に設けられたＬＥＤ側カソード端子と螺合する基板側カソード端子とし、前記雌型電極端子の底面部を、基板側アノード端子としたことを特徴としている。 According to another aspect of the present invention, there is provided an LED backlight device for irradiating light emitted from an LED from behind a liquid crystal panel, wherein an LED mounting substrate on which a plurality of LED packages according to any one of claims 1 to 5 are mounted is provided in parallel. A light emitting surface is formed, and the LED mounting substrate includes a female electrode terminal screwed into a male electrode terminal included in the LED package, and the female electrode terminal includes an inner peripheral side surface of the male electrode terminal. A substrate-side cathode terminal screwed into an LED-side cathode terminal provided on a frustoconical side surface of the die electrode terminal is used, and a bottom surface portion of the female electrode terminal is a substrate-side anode terminal.
　この構成によると、ＬＥＤパッケージが備える雄型電極端子とＬＥＤ実装基板に設ける雌型電極端子とを螺合して、それぞれのＬＥＤパッケージをＬＥＤ実装基板に実装することができる。また、個別に着脱可能なＬＥＤパッケージを搭載したＬＥＤ実装基板を並設して発光面を形成して、実装効率と経済性に優れたＬＥＤバックライト装置を得ることができる。 According to this configuration, the male electrode terminal included in the LED package and the female electrode terminal provided on the LED mounting board can be screwed together to mount each LED package on the LED mounting board. In addition, an LED backlight device having excellent mounting efficiency and economy can be obtained by arranging LED mounting substrates on which individually detachable LED packages are mounted to form a light emitting surface.
　また本発明は上記構成のＬＥＤバックライト装置において、前記雄型電極端子を前記雌型電極端子に螺合したときに、円錐台状の前記カソード端子が前記基板側カソード端子に密着した状態で、前記アノード端子が前記基板側アノード端子に当接することを特徴としている。この構成によると、円錐螺子状のカソード端子をねじ込んで装着する操作で、自動的にアノード端子同士も接続可能となって、実装操作が容易となるＬＥＤバックライト装置を得ることができる。 Further, in the LED backlight device having the above-described configuration, when the male electrode terminal is screwed to the female electrode terminal, the truncated conical cathode terminal is in close contact with the substrate-side cathode terminal. The anode terminal is in contact with the substrate-side anode terminal. According to this configuration, an anode backlight terminal can be automatically connected to each other by an operation of screwing and mounting a conical screw-like cathode terminal, and an LED backlight device that can be easily mounted can be obtained.
　また本発明は上記構成のＬＥＤバックライト装置において、前記ＬＥＤパッケージが備える被係合部に、着脱用工具に接続されるアタッチメントが有する係合部が係合して、複数の前記ＬＥＤ実装基板が並設された状態で前記着脱用工具を用いて、前記ＬＥＤパッケージが前記ＬＥＤ実装基板に対してそれぞれ個別に着脱自在とされることを特徴としている。この構成によると、所定のアタッチメントを有する着脱用工具を用いて、ＬＥＤパッケージを自動的に着脱できるので、さらに実装操作が容易なＬＥＤバックライト装置を得ることができる。 In the LED backlight device having the above-described configuration, the engagement portion of the attachment connected to the attaching / detaching tool is engaged with the engaged portion included in the LED package, so that the plurality of LED mounting boards are provided. The LED packages can be individually attached to and detached from the LED mounting substrate by using the attachment / detachment tool in a state of being arranged in parallel. According to this configuration, since the LED package can be automatically attached / detached using the attaching / detaching tool having a predetermined attachment, an LED backlight device that can be mounted more easily can be obtained.
　また本発明は上記構成のＬＥＤバックライト装置において、前記被係合部は、前記ＬＥＤパッケージが備えるサブマウント基板の外形外枠、封止樹脂の固化外形、もしくは、拡散レンズの外形形状であって、これらの外形が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴としている。この構成によると、サブマウント基板の外形外枠にアタッチメントを係合させたり、封止樹脂の固化外形にアタッチメントを係合させたりして、着脱用工具を装着できるので、ＬＥＤ実装面の上部から勅脱用工具を用いた着脱操作を行うことができる。 In the LED backlight device having the above-described configuration, the engaged portion may be an outer frame of a submount substrate included in the LED package, a solidified outer shape of a sealing resin, or an outer shape of a diffusion lens. These outer shapes are outer shapes that fit into engaging recesses of the attachment. According to this configuration, the attachment / detachment tool can be mounted by engaging the attachment with the outer frame of the submount substrate or by engaging the attachment with the solidified outer shape of the sealing resin.着 脱 Attaching / detaching operation using a tool for removal can be performed.
　また本発明は、液晶パネルと請求項７から１０のいずれかに記載されたＬＥＤバックライト装置を備えた液晶表示装置としたことを特徴としている。この構成によると、個々のＬＥＤパッケージの着脱操作が容易で実装効率と経済性に優れたバックライト装置を用いて製造コストを低減可能な液晶表示装置を得ることができる。 Further, the present invention is characterized in that a liquid crystal display device including a liquid crystal panel and the LED backlight device according to any one of claims 7 to 10 is provided. According to this configuration, it is possible to obtain a liquid crystal display device that can reduce the manufacturing cost by using a backlight device that is easy to attach and detach individual LED packages and is excellent in mounting efficiency and economy.
　本発明によれば、円錐螺子状のカソード端子とこの円錐台の頂部に設ける平面状のアノード端子とを備えるＬＥＤパッケージとしたので、円錐台状の端子を介して、それぞれのＬＥＤパッケージが個別に着脱自在な構成となる。そのために、このＬＥＤパッケージを搭載したＬＥＤ実装基板を並設することで実装効率と経済性に優れた照明装置やＬＥＤバックライト装置を得ることができ、このバックライト装置を用いて製造コストを低減可能な液晶表示装置を得ることができる。 According to the present invention, since the LED package is provided with the conical screw-shaped cathode terminal and the planar anode terminal provided on the top of the truncated cone, each LED package is individually connected via the truncated cone-shaped terminal. It becomes a detachable configuration. Therefore, it is possible to obtain an illumination device and an LED backlight device that are excellent in mounting efficiency and economy by arranging the LED mounting substrate on which the LED package is mounted, and the manufacturing cost is reduced by using the backlight device. A possible liquid crystal display device can be obtained.
本発明に係るＬＥＤパッケージを示す概略説明図である。It is a schematic explanatory drawing which shows the LED package which concerns on this invention. 本発明に係るＬＥＤパッケージの着脱操作を示す概略説明図である。It is a schematic explanatory drawing which shows attachment / detachment operation of the LED package which concerns on this invention. サブマウント基板の外形外枠を係合部とする例を示す概略説明図である。It is a schematic explanatory drawing which shows the example which uses the outer frame of a submount board | substrate as an engaging part. 封止樹脂の固化外形を係合部とする例を示す概略説明図である。It is a schematic explanatory drawing which shows the example which uses the solidification external shape of sealing resin as an engaging part. 本発明に係るＬＥＤバックライト装置の要部拡大説明図である。It is principal part expansion explanatory drawing of the LED backlight apparatus which concerns on this invention. 液晶表示装置の分解斜視図である。It is a disassembled perspective view of a liquid crystal display device. 液晶表示装置を搭載したテレビ受信装置の分解斜視図である。It is a disassembled perspective view of the television receiver which mounts a liquid crystal display device.
　以下に本発明の実施形態を図面を参照して説明する。また、同一構成部材については同一の符号を用い、詳細な説明は適宜省略する。 Embodiments of the present invention will be described below with reference to the drawings. Moreover, the same code | symbol is used about the same structural member, and detailed description is abbreviate | omitted suitably.
　まず、図１を用いて本発明に係るＬＥＤパッケージの一例について説明する。 First, an example of an LED package according to the present invention will be described with reference to FIG.
　図１に示すＬＥＤパッケージ１は、サブマウント基板１１と、該サブマウント基板１１に実装されたＬＥＤチップ１２と、ＬＥＤチップ１２を封止する封止樹脂１３とを備えてパッケージ化されている。また、ＬＥＤチップ１２を駆動するための電極端子ＴＡを、サブマウント基板１１のＬＥＤチップ実装面とは反対側の裏面側に設けている。 The LED package 1 shown in FIG. 1 includes a submount substrate 11, an LED chip 12 mounted on the submount substrate 11, and a sealing resin 13 for sealing the LED chip 12. In addition, an electrode terminal TA for driving the LED chip 12 is provided on the back surface side of the submount substrate 11 opposite to the LED chip mounting surface.
　また、本実施形態では、電極端子ＴＡを雄型の電極端子とし、ＬＥＤ実装基板側に設ける雌型の電極端子ＴＢに接続する構成としている。このように、これらの雄雌型電極端子を介して、ＬＥＤパッケージ１をＬＥＤ実装基板に着脱容易としている。 In this embodiment, the electrode terminal TA is a male electrode terminal, and is connected to a female electrode terminal TB provided on the LED mounting substrate side. Thus, the LED package 1 can be easily attached to and detached from the LED mounting substrate via these male and female electrode terminals.
　また、それぞれの電極端子はカソード端子とアノード端子を備えているが、本実施形態では、ＬＥＤパッケージ１の電極端子ＴＡを円錐台状に突設された雄型電極端子とし、ＬＥＤ側カソード端子１４Ａをこの円錐台状の側面に設けられた円錐螺子状端子とし、ＬＥＤ側アノード端子１５Ａを、円錐台の頂部に設けられた平面状端子としている。 Each electrode terminal includes a cathode terminal and an anode terminal. In this embodiment, the electrode terminal TA of the LED package 1 is a male electrode terminal projecting in a truncated cone shape, and the LED side cathode terminal 14A. Is a conical screw terminal provided on the side surface of the truncated cone, and the LED side anode terminal 15A is a planar terminal provided on the top of the truncated cone.
　そのために、ＬＥＤ実装基板側に設ける電極端子ＴＢは、雄型（雄螺子型）の電極端子ＴＡに嵌合する雌型（雌螺子型）の電極端子であって、その内周側面部を基板側カソード端子１４Ｂとし、底面部を基板側アノード端子１５Ｂとしている。 For this purpose, the electrode terminal TB provided on the LED mounting substrate side is a female (female screw type) electrode terminal that fits into a male (male screw type) electrode terminal TA, and the inner peripheral side surface portion is formed on the substrate. The side cathode terminal 14B is used, and the bottom part is the substrate side anode terminal 15B.
　また、ＬＥＤ側カソード端子１４ＡとＬＥＤ側アノード端子１５Ａは、それぞれサブマウント基板に形成された電極と電気的に接続された構成であり、ＬＥＤ実装基板側の電極端子ＴＢを介して、所定のＬＥＤ駆動経路が形成される。 The LED side cathode terminal 14A and the LED side anode terminal 15A are each electrically connected to electrodes formed on the submount substrate, and a predetermined LED is connected via the electrode terminal TB on the LED mounting substrate side. A drive path is formed.
　上記の構成であれば、雄型の円錐螺子状電極端子ＴＡを雌型の電極端子ＴＢにねじ込むようにして装着して、側面の螺子部に設けたＬＥＤ側カソード端子１４Ａと基板側カソード端子１４Ｂとを電気的に接続する。また、最後までねじ込むと、ＬＥＤ側アノード端子１４Ｂと基板側アノード端子１５Ｂとが当接して電気的に接続される構成としている。 With the above configuration, the male conical screw-like electrode terminal TA is mounted so as to be screwed into the female electrode terminal TB, and the LED-side cathode terminal 14A and the substrate-side cathode terminal 14B provided on the side screw portion. And electrically connect. Further, when screwed to the end, the LED side anode terminal 14B and the substrate side anode terminal 15B come into contact with each other and are electrically connected.
　このときに、ＬＥＤ側アノード端子１４Ｂと基板側アノード端子１５Ｂとのいずれか一方もしくは両方が、当接する方向に弾性を有する構成であってもよい。このように、雄型の円錐螺子状電極端子ＴＡと雌型の電極端子ＴＢを備えた接続構成であれば、円錐台状の電極端子を介して着脱自在なＬＥＤパッケージとなる。 At this time, either one or both of the LED side anode terminal 14B and the substrate side anode terminal 15B may be configured to have elasticity in the abutting direction. As described above, if the connection configuration includes the male conical screw electrode terminal TA and the female electrode terminal TB, the LED package is detachable via the truncated cone electrode terminal.
　また、それぞれのＬＥＤパッケージ１がＬＥＤ実装基板側の電極端子に着脱自在であるので、それぞれのＬＥＤパッケージ１をそれぞれ個別に、取り外し、取付け自在な構成となる。そのために、図２に示すように、複数のＬＥＤパッケージ１（１Ａ、１Ｂ、１Ｃ・・・）を実装基板２に組み込んで一体の照明装置や発光装置を形成した後でも、それぞれのＬＥＤパッケージ１を個別に取り外して、新しい別のＬＥＤパッケージに交換可能な構成となる。 In addition, since each LED package 1 is detachably attached to the electrode terminal on the LED mounting substrate side, each LED package 1 can be individually detached and attached. Therefore, as shown in FIG. 2, even after a plurality of LED packages 1 (1 </ b> A, 1 </ b> B, 1 </ b> C...) Are incorporated in the mounting substrate 2 to form an integrated lighting device or light emitting device, each LED package 1. Can be removed individually and replaced with another new LED package.
　また、ＬＥＤパッケージ１が、電動ドライバなどの着脱用工具ＴＬに接続されるアタッチメントＡＴが係合する被係合部を備えている構成であれば、着脱用工具ＴＬが備えるアタッチメントＡＴをＬＥＤパッケージ１の被係合部に係合させて着脱操作を行うことができるので、着脱操作の自動化を図ることができて好ましい。 In addition, if the LED package 1 is configured to include an engaged portion to which the attachment AT connected to the attachment / detachment tool TL such as an electric screwdriver is engaged, the attachment AT included in the attachment / detachment tool TL is the LED package 1. Since the attachment / detachment operation can be performed by being engaged with the engaged portion, the attachment / detachment operation can be automated, which is preferable.
　アタッチメントＡＴが係合する被係合部は、ＬＥＤパッケージ１を実装基板２に実装する際の上面側に配設することが好ましいので、本実施形態では、図３Ａに示す、サブマウント基板１１の外形外枠を利用する例と、図３Ｂに示す、封止樹脂１３の固化外形を利用する例とを採用している。 Since the engaged portion with which the attachment AT is engaged is preferably disposed on the upper surface side when the LED package 1 is mounted on the mounting substrate 2, in this embodiment, the submount substrate 11 shown in FIG. The example using an outer frame and the example using the solidified outer shape of the sealing resin 13 shown in FIG. 3B are employed.
　例えば、図３Ａに示す場合では、所定形状の多角形の外形外枠を備えたサブマウント基板１１Ａとし、この外形外枠に係合する係合凹部ＡＴａを有するアタッチメントＡＴ１を用いる。この外形外枠は例えば四角形でも六角形でもよく、特に限定されない。 For example, in the case shown in FIG. 3A, a submount substrate 11A having a polygonal outer frame with a predetermined shape is used, and an attachment AT1 having an engagement recess ATa that engages with the outer frame is used. The outer outer frame may be, for example, a quadrangle or a hexagon, and is not particularly limited.
　また、図３Ｂに示す場合では、所定形状の多角形の固化外形を備えた封止樹脂１３Ａとし、この固化外形に係合する係合凹部ＡＴｂを有するアタッチメントＡＴ２を用いる。この固化外形の形状も例えば四角形でも六角形でもよく、特に限定されない。 Further, in the case shown in FIG. 3B, the sealing resin 13A having a polygonal solidified outer shape of a predetermined shape is used, and an attachment AT2 having an engagement recess ATb that engages with the solidified external shape is used. The shape of the solidified outer shape may be, for example, a quadrangle or a hexagon, and is not particularly limited.
　また、封止樹脂の上部に拡散レンズを搭載する構成のＬＥＤパッケージ１であれば、この拡散レンズがアタッチメントＡＴが有する係合凹部に嵌合する外形形状とされていてもよい。このような構成であれば、拡散レンズの外形にアタッチメントＡＴを嵌め込んでＬＥＤパッケージ１の着脱操作を個別に行うことができる。 Further, if the LED package 1 has a configuration in which a diffusing lens is mounted on the upper part of the sealing resin, the diffusing lens may have an outer shape that fits into an engaging recess of the attachment AT. With such a configuration, the attachment AT can be fitted into the outer shape of the diffusing lens and the LED package 1 can be attached and detached individually.
　また、ＬＥＤパッケージ１に設ける被係合部は、上記したサブマウント基板の外形外枠や封止樹脂の固化外形や拡散レンズの外形形状以外であってもよく、例えば、サブマウント基板の上面に嵌合凹部（あるいは凸部）を設けたり、封止樹脂の外表面に嵌合凹部（あるいは凸部）を設けたりして、これらの嵌合凹部（あるいは凸部）に係合する係合凸部（あるいは凹部）を備えたアタッチメントを用いる構成としてもよい。 Further, the engaged portion provided in the LED package 1 may be other than the outer frame of the submount substrate, the solidified outer shape of the sealing resin, or the outer shape of the diffusing lens, for example, on the upper surface of the submount substrate. Engaging projections that engage with these fitting recesses (or projections) by providing fitting recesses (or projections) or fitting recesses (or projections) on the outer surface of the sealing resin. It is good also as a structure using the attachment provided with the part (or recessed part).
　上記したＬＥＤパッケージ１を用いた照明装置は、ＬＥＤパッケージ１を、それぞれ個別にＬＥＤ実装基板に対して着脱自在に実装することができる。そのために、個別に着脱可能なＬＥＤパッケージを搭載したＬＥＤ実装基板を並設して所定面積の発光面を形成可能となり、実装効率と経済性に優れた照明装置となって好ましい。 The lighting device using the LED package 1 described above can detachably mount the LED packages 1 individually on the LED mounting substrate. Therefore, it is possible to form a light emitting surface having a predetermined area by arranging LED mounting substrates each having an individually detachable LED package mounted thereon, which is preferable as a lighting device having excellent mounting efficiency and economy.
　また、本実施形態に係るＬＥＤパッケージ１を用いたＬＥＤバックライト装置は、例えば図４に示すように、所定数、例えば５個のＬＥＤパッケージ１（１Ａ～１Ｅ）を搭載した実装基板２をコネクタ１６を介して接続して列状に延設し、これを複数段配設して所定面積のＬＥＤバックライト装置４とされる。 In addition, the LED backlight device using the LED package 1 according to the present embodiment has, as shown in FIG. 4, for example, a connector 2 that is mounted on a mounting board 2 on which a predetermined number, for example, five LED packages 1 (1A to 1E) are mounted. The LED backlight device 4 having a predetermined area is formed by connecting through 16 and extending in a row and arranging a plurality of stages.
　このように、複数のＬＥＤパッケージ１が縦横に所定ピッチで配設されたＬＥＤバックライト装置４は、所定数、例えば５個のＬＥＤパッケージ１が搭載された実装基板２を単位として構成されている。そのために、この実装基板２毎に着脱可能であり、ＬＥＤバックライト装置４に対するＬＥＤパッケージ１を実装する実装効率がよくなり、交換作業も容易となる。 As described above, the LED backlight device 4 in which the plurality of LED packages 1 are arranged at predetermined pitches in the vertical and horizontal directions is configured in units of a mounting substrate 2 on which a predetermined number, for example, five LED packages 1 are mounted. . Therefore, it can be attached and detached for each mounting substrate 2, mounting efficiency for mounting the LED package 1 on the LED backlight device 4 is improved, and replacement work is also facilitated.
　また、本実施形態に係るＬＥＤパッケージ１は、それぞれ実装基板２に対して個別に着脱自在な構成としているので、ＬＥＤバックライト装置４に設置された実装基板２を取り外すことなく、ＬＥＤパッケージ１を単独に取り外したり装着したりすることができる。 Moreover, since the LED package 1 according to the present embodiment is configured to be individually detachable from the mounting substrate 2, the LED package 1 can be mounted without removing the mounting substrate 2 installed on the LED backlight device 4. It can be detached and attached independently.
　このように、本実施形態によれば、個別に着脱可能なＬＥＤパッケージ１を搭載したＬＥＤ実装基板２を並設することで、実装効率と経済性に優れたＬＥＤバックライト装置４を得ることができる。 Thus, according to this embodiment, the LED backlight device 4 excellent in mounting efficiency and economy can be obtained by arranging the LED mounting substrates 2 on which the individually detachable LED packages 1 are mounted in parallel. it can.
　上記したバックライト装置４を直下型のバックライトとして用いた液晶表示装置６は、例えば図５に示すような構成とされる。また、この液晶表示装置６は、図６に示す液晶テレビ７の表示部として用いることができる。なお、このような液晶テレビ７は、テレビ放送信号を受信して画像を映すことから、テレビ受信装置といえる。 A liquid crystal display device 6 using the above backlight device 4 as a direct backlight is configured as shown in FIG. Moreover, this liquid crystal display device 6 can be used as a display part of the liquid crystal television 7 shown in FIG. Such a liquid crystal television 7 can be said to be a television receiver since it receives a television broadcast signal and projects an image.
　図５に示すように、液晶表示装置６は、液晶パネル５と、この液晶パネル５に対して光を供給するＬＥＤバックライト装置４と、これらを挟み込むハウジングＨＧ（表ハウジングＨＧ１・裏ハウジングＨＧ２）と、を含む。 As shown in FIG. 5, the liquid crystal display device 6 includes a liquid crystal panel 5, an LED backlight device 4 for supplying light to the liquid crystal panel 5, and a housing HG (front housing HG1 and rear housing HG2) sandwiching them. And including.
　液晶パネル５は、ＴＦＴ（Thin　Film　Transistor）等のスイッチング素子を含むアクティブマトリックス基板５１と、このアクティブマトリックス基板５１に対向する対向基板５２とをシール材（不図示）で貼り合わせる。そして、両基板５１・５２の隙間に液晶（不図示）が注入される。 In the liquid crystal panel 5, an active matrix substrate 51 including a switching element such as a TFT (Thin Film Transistor) and an opposing substrate 52 facing the active matrix substrate 51 are bonded together with a sealant (not shown). Then, liquid crystal (not shown) is injected into the gap between the substrates 51 and 52.
　なお、アクティブマトリックス基板５１の受光面側、対向基板５２の出射側には、偏光フィルム５３が取り付けられる。そして、以上のような液晶表示パネル５は、液晶分子の傾きに起因する透過率の変化を利用して、画像を表示する。 A polarizing film 53 is attached to the light receiving surface side of the active matrix substrate 51 and the emission side of the counter substrate 52. And the above liquid crystal display panel 5 displays an image using the change of the transmittance | permeability resulting from the inclination of a liquid crystal molecule.
　液晶表示パネル５の直下に位置するＬＥＤバックライト装置４は、ＬＥＤモジュールＭＪ、バックライトシャーシ４１、反射シート４２、拡散板４３、プリズムシート４４、および、レンズシート４５を含む。ＬＥＤモジュールＭＪは、ＬＥＤ実装基板２１の実装面２１ＵにＬＥＤパッケージ１を複数搭載して構成される。 The LED backlight device 4 positioned immediately below the liquid crystal display panel 5 includes an LED module MJ, a backlight chassis 41, a reflection sheet 42, a diffusion plate 43, a prism sheet 44, and a lens sheet 45. The LED module MJ is configured by mounting a plurality of LED packages 1 on the mounting surface 21U of the LED mounting substrate 21.
　ＬＥＤ実装基板２１は、前述したＬＥＤ実装基板２と同様に、板状かつ矩形状の基板であり、実装面２１Ｕ上に、複数の電極（不図示）を並べる。そして、これらの電極上に、パッケージ化されたＬＥＤパッケージ１が実装される。ＬＥＤパッケージ１は、それぞれが、サブマウント基板を介してＬＥＤチップが搭載されている。そして、電極とＬＥＤチップとは、サブマウント基板を介して導通する。 The LED mounting substrate 21 is a plate-like and rectangular substrate like the LED mounting substrate 2 described above, and a plurality of electrodes (not shown) are arranged on the mounting surface 21U. Then, the packaged LED package 1 is mounted on these electrodes. Each LED package 1 is mounted with an LED chip via a submount substrate. The electrode and the LED chip are electrically connected via the submount substrate.
　なお、ＬＥＤ実装基板２１における実装面２１Ｕには、保護膜となるレジスト膜（不図示）が成膜される。このレジスト膜は、例えば、反射性を有する白色とされる。なぜなら、レジスト膜に光が入射したとしても、その光はレジスト膜で反射して外部に向かおうとするので、実装基板２１による光の吸収という光量ムラの原因が解消するためである。 A resist film (not shown) serving as a protective film is formed on the mounting surface 21U of the LED mounting substrate 21. This resist film is, for example, white having reflectivity. This is because even if light is incident on the resist film, the light is reflected by the resist film and tends to go outside, thereby eliminating the cause of unevenness in the amount of light due to light absorption by the mounting substrate 21.
　また、図示するＬＥＤバックライト装置４では、例えば、１枚の実装基板２１に５個のＬＥＤパッケージ１を列状に実装した比較的短い実装基板２１と、１枚の実装基板２１に８個のＬＥＤパッケージ１を列状に実装した比較的長い実装基板２１と、が搭載される。 Further, in the illustrated LED backlight device 4, for example, a relatively short mounting board 21 in which five LED packages 1 are mounted in a row on one mounting board 21, and eight on one mounting board 21. A relatively long mounting substrate 21 on which the LED packages 1 are mounted in a row is mounted.
　このように、５個のＬＥＤパッケージ１の列と８個のＬＥＤパッケージ１の列とを１３個のＬＥＤパッケージ１の列にするように並び、さらに、１３個のＬＥＤパッケージ１の並ぶ方向に対して、交差（直交等）する方向にも、２種類の実装基板２１は並ぶ（なお、ＬＥＤパッケージ１の配置間隔は、等間隔である）。また、これらの配置パターンやＬＥＤ光源の配設数量は、画面の大きさや要求される輝度などに応じて適宜変更される。 In this way, the rows of the five LED packages 1 and the row of the eight LED packages 1 are arranged so as to form a row of 13 LED packages 1, and further, with respect to the direction in which the 13 LED packages 1 are arranged. Thus, the two types of mounting boards 21 are also arranged in the intersecting (orthogonal) direction (note that the arrangement intervals of the LED packages 1 are equal). In addition, the arrangement pattern and the number of LED light sources arranged are appropriately changed according to the size of the screen and the required luminance.
　これにより、ＬＥＤパッケージ１は格子状（別表現すると、ＬＥＤモジュールＭＪが面状）に配置され、これらＬＥＤパッケージ１からの光が混ざり合って、面状光が生成される（なお、便宜上、異種の実装基板２１の並ぶ方向をＸ方向、同種の実装基板２１の並ぶ方向をＹ方向とし、このＸ方向とＹ方向とに交差する方向をＺ方向とする）。 Thereby, the LED package 1 is arranged in a lattice shape (in other words, the LED module MJ is planar), and light from these LED packages 1 is mixed to generate planar light (for convenience, different types of light are used). The direction in which the mounting boards 21 are arranged is the X direction, the direction in which the same kind of mounting boards 21 are arranged is the Y direction, and the direction intersecting the X direction and the Y direction is the Z direction).
　バックライトシャーシ４１は、例えば箱状の部材で、底面４１ＢにＬＥＤモジュールＭＪを敷き詰めることで、それら複数のＬＥＤモジュールＭＪを収容する。なお、バックライトシャーシ４１の底面４１ＢとＬＥＤモジュールＭＪのＬＥＤ実装基板２１とは、不図示のリベット等を介して接続される。また、バックライトシャーシ４１の上に、反射シート４２、拡散板４３、プリズムシート４４、レンズシート４５をこの順で積み重ねている。 The backlight chassis 41 is a box-shaped member, for example, and accommodates the plurality of LED modules MJ by spreading the LED modules MJ on the bottom surface 41B. The bottom surface 41B of the backlight chassis 41 and the LED mounting board 21 of the LED module MJ are connected via a rivet (not shown). Further, on the backlight chassis 41, a reflection sheet 42, a diffusion plate 43, a prism sheet 44, and a lens sheet 45 are stacked in this order.
　反射シート４２は、反射面４２Ｕを有する光学シートで、複数のＬＥＤモジュールＭＪに、反射面４２Ｕの裏面を向けて覆い被さる。ただし、反射シート４２は、ＬＥＤパッケージ１の位置に合わせた通過開孔４２Ｈを含み、反射面４２ＵからＬＥＤパッケージ１の発光面を露出させる。 The reflection sheet 42 is an optical sheet having a reflection surface 42U, and covers the plurality of LED modules MJ with the back surface of the reflection surface 42U facing. However, the reflection sheet 42 includes a through hole 42H that matches the position of the LED package 1, and exposes the light emitting surface of the LED package 1 from the reflection surface 42U.
　すると、ＬＥＤパッケージ１から出射する光の一部が、バックライトシャーシ４１の底面４１Ｂ側に向かって進行したとしても、反射シート４２の反射面４２Ｕによって反射し、その底面４１Ｂから乖離するように進行する。したがって、反射シート４２が存在することで、ＬＥＤパッケージ１の光は損失することなく、反射面４２Ｕに対向した拡散板４３に向かう。 Then, even if a part of the light emitted from the LED package 1 travels toward the bottom surface 41B side of the backlight chassis 41, it is reflected by the reflective surface 42U of the reflective sheet 42 and travels away from the bottom surface 41B. To do. Therefore, the presence of the reflection sheet 42 causes the light of the LED package 1 to travel toward the diffusion plate 43 facing the reflection surface 42U without loss.
　拡散板４３は、反射シート４２に重なる光学シートであり、ＬＥＤモジュールＭＪから発せられる光および反射シート４２Ｕからの反射光を拡散させる。すなわち、拡散板４３は、複数のＬＥＤモジュールＭＪ（別表現すると、マトリックス配置された複数のＬＥＤパッケージ１）によって形成される面状光を拡散させて、液晶表示パネル５全域に光をいきわたらせる。 The diffusion plate 43 is an optical sheet that overlaps the reflection sheet 42 and diffuses the light emitted from the LED module MJ and the reflection light from the reflection sheet 42U. That is, the diffusion plate 43 diffuses the planar light formed by the plurality of LED modules MJ (in other words, the plurality of LED packages 1 arranged in a matrix) and spreads the light over the entire liquid crystal display panel 5. .
　プリズムシート４４は、拡散板４３に重なる光学シートである。そして、このプリズムシート４４は、一方向（線状）に延びる例えば三角プリズムを、シート面内にて、一方向に交差する方向に並べる。これにより、プリズムシート４４は、拡散板４３からの光の放射特性を偏向させる。なお、プリズムは、ＬＥＤパッケージ１の配置個数の少ないＹ方向に沿って延び、ＬＥＤパッケージ１の配置個数の多いＸ方向に沿って並ぶ。 The prism sheet 44 is an optical sheet that overlaps the diffusion plate 43. The prism sheet 44 arranges, for example, triangular prisms extending in one direction (linear) in a direction intersecting with one direction in the sheet surface. Thereby, the prism sheet 44 deflects the radiation characteristic of the light from the diffusion plate 43. The prisms extend along the Y direction in which the LED packages 1 are arranged in a small number, and are arranged in the X direction in which the LED packages 1 are arranged in a large number.
　レンズシート４５は、プリズムシート４４に重なる光学シートである。そして、このレンズシート４５は、光を屈折散乱させる微粒子を内部に分散させる。これにより、レンズシート４５は、プリズムシート４４からの光を、局所的に集光させることなく、明暗差（光量ムラ）を抑える。 The lens sheet 45 is an optical sheet that overlaps the prism sheet 44. The lens sheet 45 disperses the fine particles that refract and scatter light inside. Thereby, the lens sheet 45 suppresses the light / dark difference (light quantity unevenness) without locally condensing the light from the prism sheet 44.
　そして、以上のようなＬＥＤバックライト装置４は、複数のＬＥＤモジュールＭＪによって形成される面状光を、複数枚の光学シート４３～４５を通過させ、液晶パネル５に供給する。これにより、非発光型の液晶パネル５は、ＬＥＤバックライト装置４からの光（バックライト光）を受光して表示機能を向上させる。 Then, the LED backlight device 4 as described above supplies the planar light formed by the plurality of LED modules MJ to the liquid crystal panel 5 through the plurality of optical sheets 43 to 45. Thereby, the non-light-emitting liquid crystal panel 5 receives the light (backlight light) from the LED backlight device 4 and improves the display function.
　上記した構成のＬＥＤバックライト装置４においては、複数のＬＥＤパッケージ１を、例えば格子状や千鳥状に配設して、面状の発光体を形成している。そのために、点状光源であるＬＥＤパッケージ１に不良品が混在していたり故障が発生していたりすると、所定の発光強度が得られず、表示品位が低下する要因となる。 In the LED backlight device 4 having the above-described configuration, a plurality of LED packages 1 are arranged in, for example, a lattice shape or a zigzag shape to form a planar light emitter. Therefore, if defective products are mixed in the LED package 1 which is a point light source or a failure occurs, a predetermined light emission intensity cannot be obtained, which causes a reduction in display quality.
　そのために、直下型のＬＥＤバックライト装置およびこのバックライト装置を備える液晶表示装置において、大画面の表示装置を製造する製造コストを低減するため、また、メインテナンスを容易とするためには、ＬＥＤパッケージをそれぞれ個別に着脱自在であることが好ましい。そこで、円錐螺子状の電極端子を備えてＬＥＤ実装基板に個別に着脱自在な構成とされるＬＥＤパッケージ１を用いることで、実装効率と経済性に優れたＬＥＤバックライト装置４を得ることができ、このバックライトを用いて製造コストを低減可能な液晶表示装置６を得ることができる。 Therefore, in order to reduce the manufacturing cost of manufacturing a large-screen display device in a direct type LED backlight device and a liquid crystal display device including the backlight device, and to facilitate maintenance, an LED package It is preferable that each can be attached and detached individually. Therefore, by using the LED package 1 that is provided with a conical screw-like electrode terminal and can be individually attached to and detached from the LED mounting substrate, an LED backlight device 4 that is excellent in mounting efficiency and economy can be obtained. The liquid crystal display device 6 capable of reducing the manufacturing cost can be obtained using this backlight.
　上記したように、本発明によれば、円錐螺子状のカソード端子とこの円錐台の頂部に設ける平面状のアノード端子とを備えるＬＥＤパッケージ１としたので、円錐台状の端子を介して、それぞれのＬＥＤパッケージが個別に着脱自在な構成となる。 As described above, according to the present invention, the LED package 1 is provided with the conical screw-shaped cathode terminal and the planar anode terminal provided on the top of the truncated cone. The LED packages can be individually detached.
　また、このＬＥＤパッケージ１を搭載したＬＥＤ実装基板を並設することで実装効率と経済性に優れた照明装置やＬＥＤバックライト装置を得ることができ、このバックライト装置を用いて製造コストを低減可能な液晶表示装置を得ることができる。 Moreover, by arranging the LED mounting substrate on which the LED package 1 is mounted, it is possible to obtain an illumination device and an LED backlight device that are excellent in mounting efficiency and economy, and the manufacturing cost is reduced by using the backlight device. A possible liquid crystal display device can be obtained.
　そのために、本発明に係るＬＥＤパッケージおよびＬＥＤバックライト装置は、多数のＬＥＤパッケージを用いると共に、製造コストを低減し、さらに、表示品位を安定させて信頼性の向上を図ることを目指す液晶表示装置のＬＥＤバックライト装置に好適に利用可能となる。 Therefore, the LED package and the LED backlight device according to the present invention use a large number of LED packages, reduce the manufacturing cost, stabilize the display quality, and improve the reliability. The LED backlight device can be suitably used.
　　　１　　ＬＥＤパッケージ
　　　２　　ＬＥＤ実装基板
　　２１　　ＬＥＤ実装基板
　　　４　　ＬＥＤバックライト装置
　　　５　　液晶パネル
　　　６　　液晶表示装置
　　　７　　液晶テレビ
　　１１　　サブマウント基板
　　１２　　ＬＥＤチップ
　　１３　　封止樹脂
　　１４Ａ　ＬＥＤ側カソード端子
　　１４Ｂ　基板側カソード端
　　１５Ａ　ＬＥＤ側アノード端子
　　１５Ｂ　基板側アノード端子
　　ＡＴ　　アタッチメント
　　ＡＴａ　係合凹部
　　ＡＴｂ　係合凹部
　　ＴＡ　　電極端子（雄型）
　　ＴＢ　　電極端子（雌型）
　　ＴＬ　　着脱用工具 DESCRIPTION OF SYMBOLS 1 LED package 2 LED mounting board 21 LED mounting board 4 LED backlight apparatus 5 Liquid crystal panel 6 Liquid crystal display device 7 Liquid crystal television 11 Submount board 12 LED chip 13 Sealing resin 14A LED side cathode terminal 14B Substrate side cathode end 15A LED side Anode terminal 15B Substrate side anode terminal AT attachment ATa engagement recess ATb engagement recess TA electrode terminal (male)
TB electrode terminal (female)
TL Detachable tool

Claims (11)

  1. ＬＥＤチップと、該ＬＥＤチップを実装するサブマウント基板と、前記ＬＥＤチップを駆動するための電極端子と、前記ＬＥＤチップを封止する封止樹脂とを備えてパッケージ化されたＬＥＤパッケージにおいて、
    　前記電極端子がＬＥＤ側カソード端子とＬＥＤ側アノード端子とを備え、これらの両端子を前記サブマウント基板の前記ＬＥＤチップ実装面とは反対側の裏面側に円錐台状に突設した雄型電極端子として設けると共に、
    　前記カソード端子は、前記雄型電極端子の側面に設けられた円錐螺子状端子であり、前記アノード端子は、前記円錐台の頂部に設けられた平面状端子とされていることを特徴とするＬＥＤパッケージ。     In an LED package packaged with an LED chip, a submount substrate for mounting the LED chip, an electrode terminal for driving the LED chip, and a sealing resin for sealing the LED chip,
    The electrode terminal includes an LED-side cathode terminal and an LED-side anode terminal, and both of these terminals protrude in a truncated cone shape on the back side opposite to the LED chip mounting surface of the submount substrate. As a terminal,
    The LED is characterized in that the cathode terminal is a conical screw terminal provided on a side surface of the male electrode terminal, and the anode terminal is a planar terminal provided on the top of the truncated cone. package.
  2. 前記ＬＥＤパッケージは、さらに、着脱用工具に接続されるアタッチメントが係合する被係合部を備えていることを特徴とする請求項１に記載のＬＥＤパッケージ。 The LED package according to claim 1, further comprising an engaged portion with which an attachment connected to a detachable tool is engaged.
  3. 前記被係合部は、前記サブマウント基板の外形外枠であって、該外枠が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴とする請求項２に記載のＬＥＤパッケージ。 The said to-be-engaged part is the external shape outer frame of the said submount board | substrate, Comprising: This outer frame is made into the external shape fitted to the engagement recessed part which the said attachment has, The Claim 2 characterized by the above-mentioned. LED package.
  4. 前記被係合部は、前記封止樹脂の固化外形であって、該固化外形が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴とする請求項２に記載のＬＥＤパッケージ。 3. The LED according to claim 2, wherein the engaged portion is a solidified outer shape of the sealing resin, and the solidified outer shape has an outer shape that fits into an engagement concave portion of the attachment. package.
  5. 前記封止樹脂の上部に拡散レンズを搭載し、該拡散レンズが前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴とする請求項２に記載のＬＥＤパッケージ。 The LED package according to claim 2, wherein a diffusion lens is mounted on an upper portion of the sealing resin, and the diffusion lens has an outer shape that fits into an engagement concave portion of the attachment.
  6. 請求項１から５のいずれかに記載されたＬＥＤパケージを複数搭載したＬＥＤ実装基板を並設して発光面を形成し、
    　前記ＬＥＤ実装基板は、前記ＬＥＤパッケージが備える雄型電極端子に螺合する雌型電極端子を備え、
    　前記雌型電極端子は、その内周側面部を、前記雄型電極端子の円錐台状の側面に設けられたＬＥＤ側カソード端子と螺合する基板側カソード端子とし、前記雌型電極端子の底面部を、基板側アノード端子としたことを特徴とする照明装置。     A light emitting surface is formed by juxtaposing LED mounting substrates each having a plurality of LED packages according to any one of claims 1 to 5 mounted thereon,
    The LED mounting substrate includes a female electrode terminal screwed into a male electrode terminal included in the LED package,
    The female electrode terminal has a substrate-side cathode terminal screwed with an LED-side cathode terminal provided on a frustoconical side surface of the male electrode terminal, and a bottom surface of the female electrode terminal. A lighting device characterized in that the portion is a substrate-side anode terminal.
  7. 液晶パネルの後方からＬＥＤが発光する光を照射するＬＥＤバックライト装置であって、
    　請求項１から５のいずれかに記載されたＬＥＤパケージを複数搭載したＬＥＤ実装基板を並設して発光面を形成し、
    　前記ＬＥＤ実装基板は、前記ＬＥＤパッケージが備える雄型電極端子に螺合する雌型電極端子を備え、
    　前記雌型電極端子は、その内周側面部を、前記雄型電極端子の円錐台状の側面に設けられたＬＥＤ側カソード端子と螺合する基板側カソード端子とし、前記雌型電極端子の底面部を、基板側アノード端子としたことを特徴とするＬＥＤバックライト装置。     An LED backlight device that emits light emitted from the LED from the back of the liquid crystal panel,
    A light emitting surface is formed by juxtaposing LED mounting substrates each having a plurality of LED packages according to any one of claims 1 to 5 mounted thereon,
    The LED mounting substrate includes a female electrode terminal screwed into a male electrode terminal included in the LED package,
    The female electrode terminal has a substrate-side cathode terminal screwed with an LED-side cathode terminal provided on a frustoconical side surface of the male electrode terminal, and a bottom surface of the female electrode terminal. An LED backlight device characterized in that the portion is a substrate-side anode terminal.
  8. 前記雄型電極端子を前記雌型電極端子に螺合したときに、円錐台状のＬＥＤ側カソード端子が前記基板側カソード端子に密着した状態で、ＬＥＤ側アノード端子が前記基板側アノード端子に当接することを特徴とする請求項７に記載のＬＥＤバックライト装置。 When the male electrode terminal is screwed to the female electrode terminal, the LED-side anode terminal contacts the substrate-side anode terminal in a state where the truncated cone-shaped LED-side cathode terminal is in close contact with the substrate-side cathode terminal. The LED backlight device according to claim 7, wherein the LED backlight device is in contact with the LED backlight device.
  9. 前記ＬＥＤパッケージが備える被係合部に、着脱用工具に接続されるアタッチメントが有する係合部が係合して、複数の前記ＬＥＤ実装基板が並設された状態で前記着脱用工具を用いて、前記ＬＥＤパッケージが前記ＬＥＤ実装基板に対してそれぞれ個別に着脱自在とされることを特徴とする請求項７または８に記載のＬＥＤバックライト装置。 Using the attachment / detachment tool in a state where a plurality of the LED mounting boards are arranged in parallel, with the engagement portion of the attachment connected to the attachment / detachment tool engaged with the engaged portion of the LED package The LED backlight device according to claim 7 or 8, wherein the LED packages are individually attachable to and detachable from the LED mounting substrate.
  10. 前記被係合部は、前記ＬＥＤパッケージが備えるサブマウント基板の外形外枠、封止樹脂の固化外形、もしくは、拡散レンズの外形形状であって、これらの外形が前記アタッチメントが有する係合凹部に嵌合する外形形状とされることを特徴とする請求項９に記載のＬＥＤバックライト装置。 The engaged portion is an outer frame of a submount substrate included in the LED package, a solidified outer shape of a sealing resin, or an outer shape of a diffusing lens, and these outer shapes are engagement recesses of the attachment. The LED backlight device according to claim 9, wherein the LED backlight device has an outer shape to be fitted.
  11. 液晶パネルと請求項７から１０のいずれかに記載されたＬＥＤバックライト装置を備えたことを特徴とする液晶表示装置。 A liquid crystal display device comprising a liquid crystal panel and the LED backlight device according to claim 7.
PCT/JP2011/059915 2010-07-01 2011-04-22 Led package, illuminating device, led backlight device, and liquid crystal display device WO2012002032A1 (en)

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CN103240793A (en) * 2013-05-03 2013-08-14 安徽宁火新材料有限公司 Machining method of refractory forming die
CN103240793B (en) * 2013-05-03 2015-07-22 安徽宁火新材料有限公司 Machining method of refractory forming die

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