WO2011152180A1 - Laser module and method for producing same - Google Patents

Laser module and method for producing same Download PDF

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Publication number
WO2011152180A1
WO2011152180A1 PCT/JP2011/060910 JP2011060910W WO2011152180A1 WO 2011152180 A1 WO2011152180 A1 WO 2011152180A1 JP 2011060910 W JP2011060910 W JP 2011060910W WO 2011152180 A1 WO2011152180 A1 WO 2011152180A1
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Prior art keywords
lens
laser
base
conversion element
laser diode
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PCT/JP2011/060910
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French (fr)
Japanese (ja)
Inventor
神戸聡
鈴木誠
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株式会社Ｑｄレーザ
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Publication of WO2011152180A1 publication Critical patent/WO2011152180A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0092—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for nonlinear frequency conversion, e.g. second harmonic generation [SHG] or sum- or difference-frequency generation outside the laser cavity

Definitions

  • the present invention relates to a laser module and a manufacturing method thereof, for example, a laser module that converts laser light into harmonic light and a manufacturing method thereof.
  • Laser modules that convert laser light into harmonic light are known.
  • a technique for driving a lens is known in order to optically couple a laser diode and a harmonic conversion element with high accuracy (for example, Patent Documents 1 and 2).
  • JP 2007-109978 A Japanese Patent Laid-Open No. 7-128546
  • Such a laser module is required to achieve both optical coupling of a laser diode and a harmonic conversion element with high accuracy using a lens and a reduction in manufacturing cost.
  • the present invention has been made in view of the above problems, and an object thereof is to perform optical coupling between a laser diode and a harmonic conversion element with high accuracy and to reduce manufacturing costs.
  • the present invention includes a step of disposing a base including a first upper surface, a second upper surface, and an enclosure formed so as to cover an upper portion and a side portion of one lens that is a finite system and not cover a lower portion. Fixing a laser diode for emitting laser light on the first upper surface, fixing a harmonic conversion element for converting the laser light into a harmonic of the laser light on the second upper surface, and the laser diode And adjusting the position of the lens so that the laser diode and the harmonic conversion element are optically coupled after holding the lens from the lower part of the lens after fixing the harmonic conversion element And a step of fixing the lens to the enclosure after the step of adjusting the position of the lens. According to the present invention, optical coupling between a laser diode and a harmonic conversion element can be performed with high accuracy, and the manufacturing cost can be reduced.
  • the base may be formed integrally using the same material. According to this configuration, it is possible to suppress a shift in optical coupling between the laser diode and the harmonic conversion element.
  • the step of adjusting the position of the lens includes a step of adjusting the position of the lens by moving the lens in two directions orthogonal to the optical axis direction of the laser beam and the optical axis. It can be configured. According to this configuration, optical coupling between the laser diode and the harmonic conversion element can be performed more precisely.
  • the step of adjusting the position of the lens includes moving the lens in the optical axis direction and tilting the lens with respect to two directions orthogonal to the optical axis direction. It can be set as the structure including the process of adjusting a position. According to this configuration, optical coupling between the laser diode and the harmonic conversion element can be performed more precisely.
  • the step of fixing the lens may include a step of fixing an upper portion and a side portion of the lens to the enclosure portion. According to this configuration, the lens can be more firmly fixed to the base.
  • the present invention includes a base, a laser diode that is fixed on the upper surface of the base and emits laser light, and a harmonic conversion element that is fixed on the upper surface of the base and converts the laser light into a harmonic of the laser light.
  • a lens that is fixed to the base and optically couples the laser diode and the harmonic conversion element, and the base covers the upper and side portions of the lens and covers the lower portion. It is a laser module characterized by including the enclosure part which is not covered.
  • the base may be formed integrally using the same material.
  • the lens may be fixed to the enclosure at the upper and side portions of the lens.
  • optical coupling between the laser diode and the harmonic conversion element can be performed with high accuracy and the manufacturing cost can be reduced.
  • FIG. 1A to FIG. 1C are views (part 1) illustrating a method for manufacturing a laser module according to the first embodiment.
  • 2A and 2B are diagrams (part 2) illustrating the method for manufacturing the laser module according to the first embodiment.
  • FIGS. 3A and 3B are views (No. 3) illustrating the method for manufacturing the laser module according to the first embodiment.
  • FIG. 4A and FIG. 4B are diagrams (part 4) illustrating the method for manufacturing the laser module according to the first embodiment.
  • FIGS. 5A to 5D are views (No. 5) illustrating the method for manufacturing the laser module according to the first embodiment.
  • 6A and 6B are diagrams illustrating a method of adjusting the position of the lens in the second embodiment.
  • FIG. 7 is a cross-sectional view of the laser module according to the third embodiment.
  • FIG. 1A to FIG. 5D are diagrams showing a method for manufacturing a laser module according to the first embodiment.
  • 1A is a top view of the base 10
  • FIG. 1B is an AA cross-sectional view
  • FIG. 1C is a BB cross-sectional view.
  • the base 10 includes a first upper surface 12 to which the laser diode is to be fixed and a second upper surface 14 to which the harmonic conversion element is to be fixed.
  • a space 18 in which the lens is to be stored is provided, and an enclosure portion 16 that is to surround the upper portion and the side portion of the lens is provided. It is open.
  • the base 10 is formed so as to cover the upper and side portions of the lens and not the lower portion.
  • the base 10 is made of, for example, a metal material such as aluminum, magnesium, or zinc, or a highly rigid resin material such as a liquid crystal polymer.
  • the base 10 is integrally formed using, for example, a die casting method.
  • the lower surface of the base 10 is flat. However, by providing irregularities on the lower surface of the base 10, heat dissipation can be improved.
  • the base 10 can be subjected to surface treatment such as anodizing or plating. The plating process can be performed with good solder wettability, for example.
  • FIG. 2 (a) is a top view of the base
  • FIG. 2 (b) is an AA cross-sectional view of the base.
  • the laser diode 20 is fixed on the first upper surface 12 of the base 10.
  • the laser diode 20 is fixed on the submount 22 using solder.
  • the submount 22 is fixed on the first upper surface 12 using an adhesive 28.
  • the adhesive 28 for example, an epoxy adhesive can be used. In addition to the adhesive, solder or welding can also be used.
  • the submount 22 preferably has high thermal conductivity and excellent heat dissipation.
  • the submount 22 for example, aluminum nitride, alumina ceramic, or the like can be used.
  • the laser diode 20 is a laser diode that emits laser light having a wavelength of 1064 nm, for example.
  • the laser diode 20 may be a DFB (distributed feedback) laser or a Fabry-Perot laser. Further, a QW (quantum well) type laser or a QD (quantum dot) type laser may be used.
  • a pad (not shown) formed on the upper surface of the laser diode 20 is connected to an external power source. The laser diode 20 emits laser light by passing a current through the pad.
  • FIG. 3A is a top view of the base
  • FIG. 3B is an AA cross-sectional view of the base (a side view of the harmonic conversion element).
  • the harmonic conversion element 30 is fixed on the second upper surface 14 of the base 10 using an adhesive 38.
  • the adhesive 38 for example, an epoxy adhesive can be used. In addition to the adhesive, solder or welding can also be used.
  • the harmonic conversion element 30 converts the laser light into harmonic light of the laser light.
  • the harmonic conversion element 30 is, for example, a second harmonic conversion element using pseudo phase matching, and is, for example, PPLN (PeriodicallyioPoled Lithium Niobate). Laser light propagates in the vicinity of the waveguide 31 of the PPLN.
  • PPLN PeriodicallyioPoled Lithium Niobate
  • PPLN converts, for example, laser light having a wavelength of 1064 nm into green light having a wavelength of 532 nm.
  • the laser diode 20 emits laser light from the light emitting point 24.
  • the harmonic conversion element 30 converts light incident on the incident side coupling point 34 into harmonic light, and emits harmonic light 52 from the light emitting point 36. The reason why the harmonic conversion element 30 is fixed obliquely with respect to the optical axis is to suppress reflection of the laser light.
  • FIG. 4 (a) is a bottom view of the base
  • FIG. 4 (b) is an AA cross-sectional view of the base (lens and harmonic conversion element are side views).
  • the lens 40 is disposed in the space 18 in the enclosure 16 (that is, between the laser diode 20 and the harmonic conversion element 30).
  • the lens 40 is one lens that is a finite system.
  • the lens 40 is, for example, a glass lens or a resin lens.
  • the lens 40 is held by a clamp part 42, and the clamp part 42 is driven by a drive part.
  • the laser beam 50 along the optical axis 51 emitted from the laser diode 20 is coupled to the incident side coupling point 34 of the harmonic conversion element 30 by the lens 40.
  • At least a part of the harmonic light emitted along the optical axis 54 from the light emitting point 36 of the harmonic conversion element 30 is converted into an electric signal by the light receiving element 46.
  • the drive unit 44 adjusts the position of the lens 40 so that the output of the light receiving element 46 is maximized.
  • the direction of the optical axis 51 of the laser diode is defined as the Z direction 74
  • the vertical direction is defined as the X direction 70
  • the direction perpendicular to the X direction 70 and the Z direction 74 is defined as the Y direction 72.
  • the drive unit 44 adjusts the position of the lens 40 so that the intensity of the harmonic light detected by the light receiving element 46 is maximized by moving the lens 40 in the X direction 70 and the Y direction 72.
  • the drive unit 44 adjusts the position of the lens so that the intensity of the harmonic light detected by the light receiving element 46 is maximized by moving the lens 40 in the Z direction 74.
  • the position of the lens 40 in the X direction and the Y direction can be determined first, and then the focus of the lens 40 can be adjusted. Therefore, the position of the lens 40 can be determined with higher accuracy. Further, the adjustment in the X direction and the Y direction and the adjustment in the Z direction may be repeated. In this way, the drive unit 44 adjusts the position of the lens 40 so that the laser diode 20 and the harmonic conversion element 30 are optically coupled.
  • the lens 40 is fixed to the enclosure 16 of the base 10 using an adhesive 48 on the side of the lens 40.
  • the adhesive 48 for example, an ultraviolet curable resin or a thermosetting resin can be used.
  • FIG. 5A is a top view of the completed laser module (see through the cover)
  • FIG. 5B is a cross-sectional view taken along the line AA of the laser module (a lens and a harmonic conversion element are side views)
  • FIG. (C) is a cross-sectional view of the laser module taken along the line BB (the base 10 on the back side is not shown).
  • FIG. 5D is a bottom view of the laser module.
  • the lens 40 is fixed to the enclosure 16 at the side using an adhesive 48.
  • a cover 60 is provided so as to cover the base 10, the laser diode 20, and the harmonic conversion element 30. Thereby, the laser module 100 is completed.
  • the laser diode 20 and the harmonic conversion element 30 are optically coupled using one lens 40 of a finite system.
  • the number of parts is reduced, and the size and the manufacturing cost are reduced as compared with the case where the laser diode 20 and the harmonic conversion element 30 are optically coupled using an infinite system lens. be able to.
  • the laser diode 20 and the harmonic conversion element 30 are fixed to the base 10 from the upper side, and the lens 40 is adjusted from the lower side.
  • the tool for fixing the laser diode 20 and the harmonic conversion element 30 and the drive unit 44 for adjusting the lens 40 can be arranged separately in the vertical direction. Therefore, the laser module manufacturing apparatus can be simplified and the manufacturing cost of the laser module can be reduced.
  • the enclosure part 16 covers the upper part and side part of the lens 40, it can suppress that the lens 40 is damaged in a subsequent process. Furthermore, the enclosure 10 can suppress the base 10 from warping. Thereby, it can suppress that the optical coupling of the laser diode 20 and the harmonic conversion element 30 shift
  • the base 10 is integrally formed using the same material. Therefore, the laser diode 20, the harmonic conversion element 30, and the lens 40 are fixed to the base 10 formed integrally. Therefore, the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be prevented from shifting during the manufacturing process or in use.
  • the lens 40 is moved in the direction of the optical axis 51 (for example, the Z direction 74) of the laser light 50 and in two directions orthogonal to the optical axis 51 (for example, the X direction 70 and the Y direction 72).
  • the position of the lens 40 is adjusted.
  • the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be performed more precisely.
  • the two directions orthogonal to the optical axis need only intersect, but are preferably orthogonal to each other. This facilitates adjustment of the optical axis.
  • FIG. 6 (a) and 6 (b) are diagrams showing a method for adjusting the position of the lens 40 in the second embodiment.
  • 6A is a bottom view of the base
  • FIG. 6B is a cross-sectional view of the base.
  • the angle 80 of the lens 40 is adjusted so that the lens 40 is inclined with respect to the X direction.
  • the angle 82 of the lens 40 is adjusted so that the lens is inclined with respect to the Y direction.
  • the lens is moved in the Z direction 74 to adjust the position of the lens 40.
  • the position of the lens 40 can be determined with higher accuracy.
  • the position of the lens 40 can be adjusted by moving the lens 40 in the direction of the optical axis 51 and tilting the lens 40 with respect to two directions orthogonal to the optical axis direction. .
  • the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be performed more precisely.
  • the two directions orthogonal to the optical axis need only intersect, but are preferably orthogonal to each other. This facilitates adjustment of the optical axis.
  • FIG. 7 is a cross-sectional view of the laser module in Example 3 (the base 10 on the back side is not shown).
  • the lens 40 can be fixed to the enclosure 16 of the base 10 on the upper part and both side surfaces of the lens 40. Thereby, the lens 40 can be more firmly fixed to the base 10.

Abstract

Disclosed is a method for producing a laser module comprising a process for disposing a base (10) provided with a first upper surface (12), a second upper surface (14), and a surrounding portion (16) formed so as not to cover the bottom portion of a lens (49) which is a finite system but to cover the upper and side portions of the lens; a process for securing a laser diode (20) which emits laser light onto the first upper surface of the laser diode (20), and securing a harmonic conversion element (30) which converts the laser light into the harmonic of the laser light, onto the second upper surface; a process for retaining the lens from the bottom of the lens, and adjusting the position of the lens so that the laser diode is optically coupled to the harmonic conversion element after the process for securing the laser diode and the harmonic conversion element; and a process for securing the lens to the surrounding portion after the process for adjusting the position of the lens.

Description

レーザモジュールおよびその製造方法Laser module and manufacturing method thereof
　本発明は、レーザモジュールおよびその製造方法に関し、例えば、レーザ光を高調波光に変換するレーザモジュールおよびその製造方法に関する。 The present invention relates to a laser module and a manufacturing method thereof, for example, a laser module that converts laser light into harmonic light and a manufacturing method thereof.
　レーザ光を高調波光に変換するレーザモジュールが知られている。このようなレーザモジュールにおいて、レーザダイオードと高調波変換素子とを精度よく光結合させるため、レンズを駆動させる技術が知られている（例えば、特許文献１および２）。 Laser modules that convert laser light into harmonic light are known. In such a laser module, a technique for driving a lens is known in order to optically couple a laser diode and a harmonic conversion element with high accuracy (for example, Patent Documents 1 and 2).
特開２００７－１０９９７８号公報JP 2007-109978 A 特開平７－１２８５４６号公報Japanese Patent Laid-Open No. 7-128546
　このようなレーザモジュールにおいては、レンズを用いてレーザダイオードと高調波変換素子との光結合を高精度に行なうことと製造コストの削減を両立することが求められている。 Such a laser module is required to achieve both optical coupling of a laser diode and a harmonic conversion element with high accuracy using a lens and a reduction in manufacturing cost.
　本発明は、上記課題に鑑みなされたものであり、レーザダイオードと高調波変換素子との光結合を高精度に行い、かつ製造コストを削減することを目的とする。 The present invention has been made in view of the above problems, and an object thereof is to perform optical coupling between a laser diode and a harmonic conversion element with high accuracy and to reduce manufacturing costs.
　本発明は、第１上面と、第２上面と、有限系である１つのレンズの上部および側部を覆い下部を覆わないように形成された囲い部と、を備えたベースを配置する工程と、レーザ光を出射するレーザダイオードを前記第１上面上に固定し、前記レーザ光を前記レーザ光の高調波に変換する高調波変換素子を前記第２上面上に固定する工程と、前記レーザダイオードと前記高調波変換素子とを固定する工程の後、前記レンズの下部から前記レンズを保持し前記レーザダイオードと前記高調波変換素子とが光結合するように、前記レンズの位置を調整する工程と、前記レンズの位置を調整する工程の後、前記レンズを前記囲い部に固定する工程と、を含むことを特徴とするレーザモジュールの製造方法である。本発明によれば、レーザダイオードと高調波変換素子との光結合を高精度に行い、かつ製造コストを削減することができる。 The present invention includes a step of disposing a base including a first upper surface, a second upper surface, and an enclosure formed so as to cover an upper portion and a side portion of one lens that is a finite system and not cover a lower portion. Fixing a laser diode for emitting laser light on the first upper surface, fixing a harmonic conversion element for converting the laser light into a harmonic of the laser light on the second upper surface, and the laser diode And adjusting the position of the lens so that the laser diode and the harmonic conversion element are optically coupled after holding the lens from the lower part of the lens after fixing the harmonic conversion element And a step of fixing the lens to the enclosure after the step of adjusting the position of the lens. According to the present invention, optical coupling between a laser diode and a harmonic conversion element can be performed with high accuracy, and the manufacturing cost can be reduced.
　上記構成において、前記ベースは同じ材料を用い一体に形成されている構成とすることができる。この構成によれば、レーザダイオードと高調波変換素子との光結合のずれを抑制することができる。 In the above configuration, the base may be formed integrally using the same material. According to this configuration, it is possible to suppress a shift in optical coupling between the laser diode and the harmonic conversion element.
　上記構成において、前記レンズの位置を調整する工程は、前記レンズを前記レーザ光の光軸方向および前記光軸に直交する２つの方向に移動させることにより、前記レンズの位置を調整する工程を含む構成とすることができる。この構成によれば、レーザダイオードと高調波変換素子との光結合をより精密に行なうことができる。 In the above configuration, the step of adjusting the position of the lens includes a step of adjusting the position of the lens by moving the lens in two directions orthogonal to the optical axis direction of the laser beam and the optical axis. It can be configured. According to this configuration, optical coupling between the laser diode and the harmonic conversion element can be performed more precisely.
　上記構成において、前記レンズの位置を調整する工程は、前記レンズを前記光軸方向に移動させ、かつ前記レンズを前記光軸方向に直交する２つの方向に対しそれぞれ傾斜させることにより、前記レンズの位置を調整する工程を含む構成とすることができる。この構成によれば、レーザダイオードと高調波変換素子との光結合をより精密に行なうことができる。 In the above configuration, the step of adjusting the position of the lens includes moving the lens in the optical axis direction and tilting the lens with respect to two directions orthogonal to the optical axis direction. It can be set as the structure including the process of adjusting a position. According to this configuration, optical coupling between the laser diode and the harmonic conversion element can be performed more precisely.
　上記構成において、前記レンズを固定する工程は、前記レンズの上部および側部を前記囲い部に固定する工程を含む構成とすることができる。この構成によれば、レンズをより強固にベースに固定することができる。 In the above configuration, the step of fixing the lens may include a step of fixing an upper portion and a side portion of the lens to the enclosure portion. According to this configuration, the lens can be more firmly fixed to the base.
　本発明は、ベースと、前記ベース上面上に固定され、レーザ光を出射するレーザダイオードと、前記ベース上面上に固定され、前記レーザ光を前記レーザ光の高調波に変換する高調波変換素子と、前記ベースに固定され、前記レーザダイオードと前記高調波変換素子とを光結合させる有限系である１つのレンズと、を具備し、前記ベースは、前記レンズの上部および側部を覆い、下部を覆っていない囲い部を備えることを特徴とするレーザモジュールである。 The present invention includes a base, a laser diode that is fixed on the upper surface of the base and emits laser light, and a harmonic conversion element that is fixed on the upper surface of the base and converts the laser light into a harmonic of the laser light. A lens that is fixed to the base and optically couples the laser diode and the harmonic conversion element, and the base covers the upper and side portions of the lens and covers the lower portion. It is a laser module characterized by including the enclosure part which is not covered.
　上記構成において、前記ベースは同じ材料を用い一体に形成されている構成とすることができる。 In the above configuration, the base may be formed integrally using the same material.
　上記構成において、前記レンズは、前記レンズの上部および側部において前記囲い部に固定されている構成とすることができる。 In the above configuration, the lens may be fixed to the enclosure at the upper and side portions of the lens.
　本発明によれば、レーザダイオードと高調波変換素子との光結合を高精度に行い、かつ製造コストを削減することができる。 According to the present invention, optical coupling between the laser diode and the harmonic conversion element can be performed with high accuracy and the manufacturing cost can be reduced.
図１（ａ）から図１（ｃ）は、実施例１に係るレーザモジュールの製造方法を示す図（その１）である。FIG. 1A to FIG. 1C are views (part 1) illustrating a method for manufacturing a laser module according to the first embodiment. 図２（ａ）および図２（ｂ）は、実施例１に係るレーザモジュールの製造方法を示す図（その２）である。2A and 2B are diagrams (part 2) illustrating the method for manufacturing the laser module according to the first embodiment. 図３（ａ）および図３（ｂ）は、実施例１に係るレーザモジュールの製造方法を示す図（その３）である。FIGS. 3A and 3B are views (No. 3) illustrating the method for manufacturing the laser module according to the first embodiment. 図４（ａ）および図４（ｂ）は、実施例１に係るレーザモジュールの製造方法を示す図（その４）である。FIG. 4A and FIG. 4B are diagrams (part 4) illustrating the method for manufacturing the laser module according to the first embodiment. 図５（ａ）から図５（ｄ）は、実施例１に係るレーザモジュールの製造方法を示す図（その５）である。FIGS. 5A to 5D are views (No. 5) illustrating the method for manufacturing the laser module according to the first embodiment. 図６（ａ）および図６（ｂ）は、実施例２におけるレンズの位置を調整する方法を示す図である。6A and 6B are diagrams illustrating a method of adjusting the position of the lens in the second embodiment. 図７は、実施例３におけるレーザモジュールの断面図である。FIG. 7 is a cross-sectional view of the laser module according to the third embodiment.
　以下、図面を参照し実施例について説明する。 Hereinafter, embodiments will be described with reference to the drawings.
　図１（ａ）から図５（ｄ）は、実施例１に係るレーザモジュールの製造方法を示す図である。図１（ａ）はベース１０の上面図、図１（ｂ）はＡ－Ａ断面図、図１（ｃ）はＢ－Ｂ断面図である。図１（ａ）から図１（ｃ）のように、ベース１０はレーザダイオードを固定すべき第１上面１２と高調波変換素子を固定すべき第２上面１４とを備えている。第１上面１２と第２上面１４との間には、レンズを収納すべき空間１８が設けられ、レンズの上部および側部を囲むべき囲い部１６が設けられている、囲い部１６の下方は開放されている。すなわち、ベース１０は、レンズの上部および側部を覆い下部を覆わないように形成されている。ベース１０は、例えば、アルミニウム、マグネシウムまたは亜鉛等の金属材料、液晶ポリマー等の剛性の高い樹脂材料で形成される。ベース１０は、例えばダイキャスト法等を用い、一体として成形されている。実施例１においてはベース１０の下面は平坦であるが、ベース１０の下面に凹凸を設けることにより、放熱性を高めることもできる。また、ベース１０にアルマイト処理またはメッキ処理等の表面処理加工を施すこともできる。メッキ処理は、例えば半田の濡れ性のよい処理を行うことができる。 FIG. 1A to FIG. 5D are diagrams showing a method for manufacturing a laser module according to the first embodiment. 1A is a top view of the base 10, FIG. 1B is an AA cross-sectional view, and FIG. 1C is a BB cross-sectional view. As shown in FIGS. 1A to 1C, the base 10 includes a first upper surface 12 to which the laser diode is to be fixed and a second upper surface 14 to which the harmonic conversion element is to be fixed. Between the first upper surface 12 and the second upper surface 14, a space 18 in which the lens is to be stored is provided, and an enclosure portion 16 that is to surround the upper portion and the side portion of the lens is provided. It is open. That is, the base 10 is formed so as to cover the upper and side portions of the lens and not the lower portion. The base 10 is made of, for example, a metal material such as aluminum, magnesium, or zinc, or a highly rigid resin material such as a liquid crystal polymer. The base 10 is integrally formed using, for example, a die casting method. In the first embodiment, the lower surface of the base 10 is flat. However, by providing irregularities on the lower surface of the base 10, heat dissipation can be improved. Further, the base 10 can be subjected to surface treatment such as anodizing or plating. The plating process can be performed with good solder wettability, for example.
　図２（ａ）はベースの上面図、図２（ｂ）はベースのＡ－Ａ断面図である。図２（ａ）および図２（ｂ）のように、ベース１０の第１上面１２上にレーザダイオード２０を固定する。例えば、レーザダイオード２０はサブマウント２２上に半田を用い固定されている。サブマウント２２を第１上面１２上に接着剤２８を用い固定する。接着剤２８としては例えばエポキシ系接着剤を用いることができる。接着剤以外にも半田または溶接を用いることもできる。サブマウント２２は、熱伝導性が高く、放熱性に優れていることが好ましい。サブマウント２２として、例えば窒化アルミニウム、アルミナセラミック等を用いることができる。レーザダイオード２０は、例えば１０６４ｎｍの波長のレーザ光を出射するレーザダイオードである。レーザダイオード２０は、ＤＦＢ（分布帰還）型レーザでもよいし、ファブリペロ型レーザでもよい。また、ＱＷ（量子井戸）型レーザでもよいし、ＱＤ（量子ドット）型レーザでもよい。レーザダイオード２０の上面等に形成されたパッド（不図示）が外部電源に接続されている。パッドに電流を流すことにより、レーザダイオード２０は、レーザ光を出射する。 2 (a) is a top view of the base, and FIG. 2 (b) is an AA cross-sectional view of the base. As shown in FIGS. 2A and 2B, the laser diode 20 is fixed on the first upper surface 12 of the base 10. For example, the laser diode 20 is fixed on the submount 22 using solder. The submount 22 is fixed on the first upper surface 12 using an adhesive 28. As the adhesive 28, for example, an epoxy adhesive can be used. In addition to the adhesive, solder or welding can also be used. The submount 22 preferably has high thermal conductivity and excellent heat dissipation. As the submount 22, for example, aluminum nitride, alumina ceramic, or the like can be used. The laser diode 20 is a laser diode that emits laser light having a wavelength of 1064 nm, for example. The laser diode 20 may be a DFB (distributed feedback) laser or a Fabry-Perot laser. Further, a QW (quantum well) type laser or a QD (quantum dot) type laser may be used. A pad (not shown) formed on the upper surface of the laser diode 20 is connected to an external power source. The laser diode 20 emits laser light by passing a current through the pad.
　図３（ａ）はベースの上面図、図３（ｂ）はベースのＡ－Ａ断面図（高調波変換素子については側面図）である。図３（ａ）および図３（ｂ）のように、ベース１０の第２上面１４上に高調波変換素子３０を接着剤３８を用い固定する。接着剤３８としては例えばエポキシ系接着剤を用いることができる。接着剤以外にも半田または溶接を用いることもできる。高調波変換素子３０は、レーザ光をレーザ光の高調波光に変換する。高調波変換素子３０は、例えば擬似位相整合を用いた第２高調波変換素子であり、例えばＰＰＬＮ（Periodically Poled Lithium Niobate）である。ＰＰＬＮの導波路３１付近をレーザ光が伝搬する。ＰＰＬＮは、例えば１０６４ｎｍの波長のレーザ光を５３２ｎｍのグリーン光に変換する。レーザダイオード２０は発光点２４からレーザ光を出射する。一方、高調波変換素子３０は、入射側結合点３４に入射した光を高調波光に変換し、発光点３６から高調波光５２を出射する。高調波変換素子３０を光軸に対し斜めに固定しているのは、レーザ光の反射を抑制するためである。 3A is a top view of the base, and FIG. 3B is an AA cross-sectional view of the base (a side view of the harmonic conversion element). As shown in FIGS. 3A and 3B, the harmonic conversion element 30 is fixed on the second upper surface 14 of the base 10 using an adhesive 38. As the adhesive 38, for example, an epoxy adhesive can be used. In addition to the adhesive, solder or welding can also be used. The harmonic conversion element 30 converts the laser light into harmonic light of the laser light. The harmonic conversion element 30 is, for example, a second harmonic conversion element using pseudo phase matching, and is, for example, PPLN (PeriodicallyioPoled Lithium Niobate). Laser light propagates in the vicinity of the waveguide 31 of the PPLN. PPLN converts, for example, laser light having a wavelength of 1064 nm into green light having a wavelength of 532 nm. The laser diode 20 emits laser light from the light emitting point 24. On the other hand, the harmonic conversion element 30 converts light incident on the incident side coupling point 34 into harmonic light, and emits harmonic light 52 from the light emitting point 36. The reason why the harmonic conversion element 30 is fixed obliquely with respect to the optical axis is to suppress reflection of the laser light.
　図４（ａ）はベースの下面図、図４（ｂ）はベースのＡ－Ａ断面図（レンズおよび高調波変換素子は側面図）である。図４（ａ）および図４（ｂ）のように、囲い部１６内の空間１８（すなわちレーザダイオード２０と高調波変換素子３０との間）にレンズ４０を配置する。レンズ４０は、有限系である１つのレンズである。レンズ４０は、例えば硝子レンズまたは樹脂レンズ等である。レンズ４０はクランプ部４２により保持されており、クランプ部４２は駆動部により駆動される。レーザダイオード２０が出射した光軸５１に沿ったレーザ光５０はレンズ４０により高調波変換素子３０の入射側結合点３４に結合する。高調波変換素子３０の発光点３６から光軸５４に沿って出射された高調波光の少なくとも一部は、受光素子４６により電気信号に変換される。駆動部４４は受光素子４６の出力が最大となるように、レンズ４０の位置を調整する。 4 (a) is a bottom view of the base, and FIG. 4 (b) is an AA cross-sectional view of the base (lens and harmonic conversion element are side views). As shown in FIGS. 4A and 4B, the lens 40 is disposed in the space 18 in the enclosure 16 (that is, between the laser diode 20 and the harmonic conversion element 30). The lens 40 is one lens that is a finite system. The lens 40 is, for example, a glass lens or a resin lens. The lens 40 is held by a clamp part 42, and the clamp part 42 is driven by a drive part. The laser beam 50 along the optical axis 51 emitted from the laser diode 20 is coupled to the incident side coupling point 34 of the harmonic conversion element 30 by the lens 40. At least a part of the harmonic light emitted along the optical axis 54 from the light emitting point 36 of the harmonic conversion element 30 is converted into an electric signal by the light receiving element 46. The drive unit 44 adjusts the position of the lens 40 so that the output of the light receiving element 46 is maximized.
　例えば、レーザダイオードの光軸５１の方向をＺ方向７４、Ｚ方向７４に直交し上下方向をＸ方向７０、Ｘ方向７０およびＺ方向７４にそれぞれ直交する方向をＹ方向７２とする。駆動部４４は、レンズ４０をＸ方向７０およびＹ方向７２に移動することにより、受光素子４６が検出する高調波光の強度が最大になるようにレンズ４０の位置を調整する。次に、駆動部４４は、レンズ４０をＺ方向７４に移動することにより、受光素子４６が検出する高調波光の強度が最大になるようにレンズの位置を調整する。これにより、最初にＸ方向、Ｙ方向のレンズ４０の位置を決め、その後レンズ４０の焦点を合わせることができる。よって、より高精度にレンズ４０の位置を決めることができる。さらに、Ｘ方向およびＹ方向の調整と、Ｚ方向の調整と、を繰り返してもよい。このようにして、駆動部４４は、レーザダイオード２０と高調波変換素子３０とが光結合するように、レンズ４０の位置を調整する。レンズ４０をレンズ４０の側部において接着剤４８を用いベース１０の囲い部１６に固定する。接着剤４８としては、例えば紫外線硬化型樹脂または熱硬化型樹脂を用いることができる。 For example, the direction of the optical axis 51 of the laser diode is defined as the Z direction 74, the vertical direction is defined as the X direction 70, and the direction perpendicular to the X direction 70 and the Z direction 74 is defined as the Y direction 72. The drive unit 44 adjusts the position of the lens 40 so that the intensity of the harmonic light detected by the light receiving element 46 is maximized by moving the lens 40 in the X direction 70 and the Y direction 72. Next, the drive unit 44 adjusts the position of the lens so that the intensity of the harmonic light detected by the light receiving element 46 is maximized by moving the lens 40 in the Z direction 74. Thereby, the position of the lens 40 in the X direction and the Y direction can be determined first, and then the focus of the lens 40 can be adjusted. Therefore, the position of the lens 40 can be determined with higher accuracy. Further, the adjustment in the X direction and the Y direction and the adjustment in the Z direction may be repeated. In this way, the drive unit 44 adjusts the position of the lens 40 so that the laser diode 20 and the harmonic conversion element 30 are optically coupled. The lens 40 is fixed to the enclosure 16 of the base 10 using an adhesive 48 on the side of the lens 40. As the adhesive 48, for example, an ultraviolet curable resin or a thermosetting resin can be used.
　図５（ａ）は完成したレーザモジュールの上面図（カバーを透視している）、図５（ｂ）はレーザモジュールのＡ－Ａ断面図（レンズおよび高調波変換素子は側面図）、図５（ｃ）はレーザモジュールのＢ－Ｂ断面図である（奥側のベース１０は不図示）。図５（ｄ）はレーザモジュールの下面図である。図５（ａ）から図５（ｄ）のように、レンズ４０は、側部において囲い部１６に接着剤４８を用い固定されている。ベース１０、レーザダイオード２０および高調波変換素子３０を覆うようにカバー６０を設ける。これにより、レーザモジュール１００が完成する。 5A is a top view of the completed laser module (see through the cover), FIG. 5B is a cross-sectional view taken along the line AA of the laser module (a lens and a harmonic conversion element are side views), and FIG. (C) is a cross-sectional view of the laser module taken along the line BB (the base 10 on the back side is not shown). FIG. 5D is a bottom view of the laser module. As shown in FIGS. 5A to 5D, the lens 40 is fixed to the enclosure 16 at the side using an adhesive 48. A cover 60 is provided so as to cover the base 10, the laser diode 20, and the harmonic conversion element 30. Thereby, the laser module 100 is completed.
　実施例１によれば、図５（ａ）および図５（ｂ）のように、有限系の１つのレンズ４０を用い、レーザダイオード２０と高調波変換素子３０とを光結合させている。このため、特許文献１および特許文献２のように、無限系レンズを用いレーザダイオード２０と高調波変換素子３０とを光結合させる場合に比べ、部品点数を減らし、小型化および製造コストを削減することができる。しかしながら、有限系の１つのレンズ４０を用いた場合、レーザダイオード２０と高調波変換素子３０とを光結合の調整が難しい。そこで、レンズ４０の位置の複雑な調整が行なわれる。この際、レーザダイオード２０および高調波変換素子３０は上側からベース１０に固定し、レンズ４０は下側から調整する。これにより、レーザダイオード２０および高調波変換素子３０を固定するツールと、レンズ４０を調整する駆動部４４を上下に分けて配置することができる。よって、レーザモジュールの製造装置を簡素化できレーザモジュールの製造コストを削減することができる。 According to the first embodiment, as shown in FIGS. 5A and 5B, the laser diode 20 and the harmonic conversion element 30 are optically coupled using one lens 40 of a finite system. For this reason, as in Patent Document 1 and Patent Document 2, the number of parts is reduced, and the size and the manufacturing cost are reduced as compared with the case where the laser diode 20 and the harmonic conversion element 30 are optically coupled using an infinite system lens. be able to. However, when one lens 40 of a finite system is used, it is difficult to adjust the optical coupling between the laser diode 20 and the harmonic conversion element 30. Therefore, complicated adjustment of the position of the lens 40 is performed. At this time, the laser diode 20 and the harmonic conversion element 30 are fixed to the base 10 from the upper side, and the lens 40 is adjusted from the lower side. Thereby, the tool for fixing the laser diode 20 and the harmonic conversion element 30 and the drive unit 44 for adjusting the lens 40 can be arranged separately in the vertical direction. Therefore, the laser module manufacturing apparatus can be simplified and the manufacturing cost of the laser module can be reduced.
　また、囲い部１６がレンズ４０の上部および側部をカバーしているため、その後の工程において、レンズ４０が損傷を受けることを抑制できる。さらに、囲い部１６により、ベース１０が反ることを抑制できる。これにより、レーザダイオード２０と高調波変換素子３０との光結合が製造工程や使用中にずれることを抑制できる。 Moreover, since the enclosure part 16 covers the upper part and side part of the lens 40, it can suppress that the lens 40 is damaged in a subsequent process. Furthermore, the enclosure 10 can suppress the base 10 from warping. Thereby, it can suppress that the optical coupling of the laser diode 20 and the harmonic conversion element 30 shift | deviates during a manufacturing process or use.
　また、実施例１によれば、ベース１０は同じ材料を用い一体に形成されている。これにより、レーザダイオード２０、高調波変換素子３０およびレンズ４０が一体に形成されたベース１０に固定される。よって、レーザダイオード２０と高調波変換素子３０との光結合が製造工程や使用中にずれることを抑制できる。 Further, according to the first embodiment, the base 10 is integrally formed using the same material. Thereby, the laser diode 20, the harmonic conversion element 30, and the lens 40 are fixed to the base 10 formed integrally. Therefore, the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be prevented from shifting during the manufacturing process or in use.
　さらに、実施例１によれば、レンズ４０をレーザ光５０の光軸５１方向（例えばＺ方向７４）および光軸５１に直交する２つの方向（例えばＸ方向７０およびＹ方向７２）に移動させることにより、レンズ４０の位置を調整する。これにより、レーザダイオード２０と高調波変換素子３０との光結合をより精密に行なうことができる。なお、光軸に直交する２つの方向は、交差していればよいが、互いに直交していることが好ましい。これにより、光軸の調整が容易になる。 Further, according to the first embodiment, the lens 40 is moved in the direction of the optical axis 51 (for example, the Z direction 74) of the laser light 50 and in two directions orthogonal to the optical axis 51 (for example, the X direction 70 and the Y direction 72). Thus, the position of the lens 40 is adjusted. Thereby, the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be performed more precisely. Note that the two directions orthogonal to the optical axis need only intersect, but are preferably orthogonal to each other. This facilitates adjustment of the optical axis.
　図６（ａ）および図６（ｂ）は、実施例２におけるレンズ４０の位置を調整する方法を示す図である。図６（ａ）はベースの下面図、図６（ｂ）はベースの断面図である。図６（ａ）のように、Ｘ方向に対しレンズ４０を傾けるようにレンズ４０の角度８０を調整する。また図６（ｂ）のように、Ｙ方向に対しレンズを傾けるようにレンズ４０の角度８２を調整する。その後、レンズをＺ方向７４に移動させ、レンズ４０の位置を調整する。これにより、より高精度にレンズ４０の位置を決めることができる。 6 (a) and 6 (b) are diagrams showing a method for adjusting the position of the lens 40 in the second embodiment. 6A is a bottom view of the base, and FIG. 6B is a cross-sectional view of the base. As shown in FIG. 6A, the angle 80 of the lens 40 is adjusted so that the lens 40 is inclined with respect to the X direction. Further, as shown in FIG. 6B, the angle 82 of the lens 40 is adjusted so that the lens is inclined with respect to the Y direction. Thereafter, the lens is moved in the Z direction 74 to adjust the position of the lens 40. Thereby, the position of the lens 40 can be determined with higher accuracy.
　実施例２のように、レンズ４０を光軸５１の方向に移動させ、かつレンズ４０を光軸方向に直交する２つの方向に対しそれぞれ傾斜させることにより、レンズ４０の位置を調整することができる。これにより、レーザダイオード２０と高調波変換素子３０との光結合をより精密に行なうことができる。なお、光軸に直交する２つの方向は、交差していればよいが、互いに直交していることが好ましい。これにより、光軸の調整が容易になる。 As in the second embodiment, the position of the lens 40 can be adjusted by moving the lens 40 in the direction of the optical axis 51 and tilting the lens 40 with respect to two directions orthogonal to the optical axis direction. . Thereby, the optical coupling between the laser diode 20 and the harmonic conversion element 30 can be performed more precisely. Note that the two directions orthogonal to the optical axis need only intersect, but are preferably orthogonal to each other. This facilitates adjustment of the optical axis.
　図７は、実施例３におけるレーザモジュールの断面図である（奥側のベース１０は不図示）。図７のように、レンズ４０の上部および両側面において、レンズ４０をベース１０の囲い部１６に固定することができる。これにより、レンズ４０をより強固にベース１０に固定することができる。 FIG. 7 is a cross-sectional view of the laser module in Example 3 (the base 10 on the back side is not shown). As shown in FIG. 7, the lens 40 can be fixed to the enclosure 16 of the base 10 on the upper part and both side surfaces of the lens 40. Thereby, the lens 40 can be more firmly fixed to the base 10.
　以上、発明の好ましい実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

Claims (8)

  1. 　第１上面と、第２上面と、有限系である１つのレンズの上部および側部を覆い下部を覆わないように形成された囲い部と、を備えたベースを配置する工程と、
    　レーザ光を出射するレーザダイオードを前記第１上面上に固定し、前記レーザ光を前記レーザ光の高調波に変換する高調波変換素子を前記第２上面上に固定する工程と、
    　前記レーザダイオードと前記高調波変換素子とを固定する工程の後、前記レンズの下部から前記レンズを保持し前記レーザダイオードと前記高調波変換素子とが光結合するように、前記レンズの位置を調整する工程と、
    　前記レンズの位置を調整する工程の後、前記レンズを前記囲い部に固定する工程と、
    を含むことを特徴とするレーザモジュールの製造方法。     Disposing a base including a first upper surface, a second upper surface, and an enclosure formed so as to cover an upper portion and a side portion of one lens that is a finite system and not cover a lower portion;
    Fixing a laser diode that emits laser light on the first upper surface, and fixing a harmonic conversion element that converts the laser light into harmonics of the laser light on the second upper surface;
    After the step of fixing the laser diode and the harmonic conversion element, the position of the lens is adjusted so that the lens is held from below the lens and the laser diode and the harmonic conversion element are optically coupled. And the process of
    After the step of adjusting the position of the lens, fixing the lens to the enclosure;
    A method for manufacturing a laser module, comprising:
  2. 　前記ベースは同じ材料を用い一体に形成されていることを特徴とする請求項１記載のレーザモジュールの製造方法。 The method for manufacturing a laser module according to claim 1, wherein the base is integrally formed using the same material.
  3. 　前記レンズの位置を調整する工程は、前記レンズを前記レーザ光の光軸方向および前記光軸方向に直交する２つの方向に移動させることにより、前記レンズの位置を調整する工程を含むことを特徴とする請求項１または２記載のレーザモジュールの製造方法。 The step of adjusting the position of the lens includes the step of adjusting the position of the lens by moving the lens in two directions orthogonal to the optical axis direction of the laser beam and the optical axis direction. A method for manufacturing a laser module according to claim 1 or 2.
  4. 　前記レンズの位置を調整する工程は、前記レンズを前記光軸方向に移動させ、かつ前記レンズを前記光軸方向に直交する２つの方向に対しそれぞれ傾斜させることにより、前記レンズの位置を調整する工程を含むことを特徴とする請求項１または２記載のレーザモジュールの製造方法。 The step of adjusting the position of the lens adjusts the position of the lens by moving the lens in the optical axis direction and tilting the lens with respect to two directions orthogonal to the optical axis direction. 3. The method of manufacturing a laser module according to claim 1, further comprising a step.
  5. 　前記レンズを固定する工程は、前記レンズの上部および側部を前記囲い部に固定する工程を含むことを特徴とする請求項１から４のいずれか一項記載のレーザモジュールの製造方法。 The method for manufacturing a laser module according to any one of claims 1 to 4, wherein the step of fixing the lens includes a step of fixing an upper portion and a side portion of the lens to the enclosure portion.
  6. 　ベースと、
    　前記ベース上面上に固定され、レーザ光を出射するレーザダイオードと、
    　前記ベース上面上に固定され、前記レーザ光を前記レーザ光の高調波に変換する高調波変換素子と、
    　前記ベースに固定され、前記レーザダイオードと前記高調波変換素子とを光結合させる有限系である１つのレンズと、
    　を具備し、
    　前記ベースは、前記レンズの上部および側部を覆い、下部を覆っていない囲い部を備えることを特徴とするレーザモジュール。     Base and
    A laser diode that is fixed on the upper surface of the base and emits laser light;
    A harmonic conversion element fixed on the upper surface of the base and converting the laser beam into a harmonic of the laser beam;
    One lens that is fixed to the base and is a finite system that optically couples the laser diode and the harmonic conversion element;
    Comprising
    The laser module according to claim 1, wherein the base includes an enclosure that covers an upper portion and a side portion of the lens and does not cover a lower portion.
  7. 　前記ベースは同じ材料を用い一体に形成されていることを特徴とする請求項６記載のレーザモジュール。 The laser module according to claim 6, wherein the base is integrally formed using the same material.
  8. 　前記レンズは、前記レンズの上部および側部において前記囲い部に固定されていることを特徴とする請求項６または７記載のレーザモジュール。 The laser module according to claim 6 or 7, wherein the lens is fixed to the enclosure at an upper part and a side part of the lens.
PCT/JP2011/060910 2010-06-01 2011-05-12 Laser module and method for producing same WO2011152180A1 (en)

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JP2013195437A (en) * 2012-03-15 2013-09-30 Mitsubishi Electric Corp Light emitting device

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JPH07168065A (en) * 1993-12-13 1995-07-04 Matsushita Electric Ind Co Ltd Optical semiconductor module
JPH10213722A (en) * 1997-01-30 1998-08-11 Nec Corp Semiconductor laser module
JP2005049416A (en) * 2003-07-30 2005-02-24 Noritsu Koki Co Ltd Laser system and wavelength transducer

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Publication number Priority date Publication date Assignee Title
JPH07168065A (en) * 1993-12-13 1995-07-04 Matsushita Electric Ind Co Ltd Optical semiconductor module
JPH10213722A (en) * 1997-01-30 1998-08-11 Nec Corp Semiconductor laser module
JP2005049416A (en) * 2003-07-30 2005-02-24 Noritsu Koki Co Ltd Laser system and wavelength transducer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013195437A (en) * 2012-03-15 2013-09-30 Mitsubishi Electric Corp Light emitting device

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