WO2011145878A2 - Capteur tactile du type composite à couche de verre trempé et de pet destiné à un écran tactile et procédé de fabrication associé - Google Patents

Capteur tactile du type composite à couche de verre trempé et de pet destiné à un écran tactile et procédé de fabrication associé Download PDF

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Publication number
WO2011145878A2
WO2011145878A2 PCT/KR2011/003664 KR2011003664W WO2011145878A2 WO 2011145878 A2 WO2011145878 A2 WO 2011145878A2 KR 2011003664 W KR2011003664 W KR 2011003664W WO 2011145878 A2 WO2011145878 A2 WO 2011145878A2
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WO
WIPO (PCT)
Prior art keywords
coordinate
bonding pad
tempered glass
glass layer
pet
Prior art date
Application number
PCT/KR2011/003664
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English (en)
Korean (ko)
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WO2011145878A3 (fr
Inventor
우관제
Original Assignee
Woo Gwan-Je
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Woo Gwan-Je filed Critical Woo Gwan-Je
Publication of WO2011145878A2 publication Critical patent/WO2011145878A2/fr
Publication of WO2011145878A3 publication Critical patent/WO2011145878A3/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a composite touch sensor required for manufacturing a touch screen sensor and a method for manufacturing the same, and in particular, an FPC bonding pad formed on any one of a PET layer or a tempered glass layer, and an FPC connected by performing only one ACF bonding. It can greatly improve the work efficiency, significantly reduce the defect rate by reducing the alignment error generated in the ACF bonding process, and also minimize the ACF bonding area, improving design ease and greatly improving the performance of the touch sensor.
  • the present invention relates to a touch screen PET and a tempered glass layer composite touch sensor and a method of manufacturing the same.
  • a touch screen is an input device that does not use an input device such as a keyboard or a mouse, and detects the position of a person's hand or an object on a character or a specific location on the screen to process a specific function. It can be operated by touching the screen directly, there is an advantage such as high operation efficiency, convenience.
  • the touch sensor is configured to include a touch panel and a protective layer on which a circuit pattern of an ITO electrode patterned in a specific shape is formed on a substrate such as PET film or glass.
  • the protective layer is attached on top of the touch sensor to prevent contamination from external factors on the touch panel.
  • ACF is connected to an electrode pad to supply power to signal lines of FPC (Flexible Print Circuit) provided on one axis of the touch panel before attaching the touch panel to the top of various displays. After bonding, selectively select the various positions on the upper side of the touch panel and analyze the equipotential and equipotential values for each position to determine whether the touch panel is suitable for detecting touch motion. Will be evaluated.
  • FPC Flexible Print Circuit
  • the upper surface of the tempered glass layer 10 is connected to the x coordinate pattern and the x coordinate traces to form the x coordinate bonding pad 50, and the y coordinate pattern 30 and y coordinate on the upper surface of the PET layer 20.
  • the y-coordinate bonding pad 40 is connected to the trace.
  • ACF bonding is primarily performed for the connection between the x-coordinate bonding pad 50 and the FPC 60, In order to connect the y-coordinate bond pad 40 and the FPC 60, ACF bonding is performed secondarily.
  • the AC coordinate with the FPC 60 due to the x coordinate bonding pad 50 configured on the upper surface of the tempered glass layer 10 and the y coordinate bonding pad 40 configured on the upper surface of the PET layer 20. Due to the problem of bonding twice, there are problems in working time and production efficiency.
  • the present invention has been proposed to solve the above problems, the object is to change the existing composite sensor design so that there is no FPC bonding pad connected to the FPC on the PET layer upper surface, only FPC bonding pad configured on the upper surface of the tempered glass layer ACF bonding is performed only once by connecting only FPC and FPC to maximize the work efficiency through shortening of work process, and drastically reduce the alignment error between tempered glass layer and PET layer.
  • the present invention provides a touch screen PET, a tempered glass layer composite touch sensor, and a method of manufacturing the same.
  • ITO Indium Tin Oxide
  • ATO Antimony Thin Oxide
  • a y coordinate bonding pad formed by patterning a bonding pad region with silver ink on an upper surface of the PET layer and connected to a y coordinate pattern
  • the x coordinate bonding pad is connected to the FPC bonding pad on the upper surface of the tempered glass layer, the x coordinate bonding pad and the y coordinate bonding pad are formed at the same position on the upper surface of the PET layer and the upper surface of the tempered glass layer, and the x coordinate bonding While the pad and the y-coordinate bonding pad are connected to the ACF, the FPC bonding pad on the upper surface of the tempered glass layer is connected to the FPC.
  • the ITO or ATO film is characterized in that formed in substantially the same area on the PET layer and the tempered glass layer.
  • a transparent conductive electrode is formed by performing a patterning process using a transparent conductive material including ITO.
  • a material having excellent conductivity, including a transition metal, is selected and a patterning process is performed to form a pattern.
  • the PET layer is characterized in that the number and arrangement of the y-coordinate bonding pads connected to the y-coordinate pattern is selectively designed as needed.
  • the tempered glass layer is characterized in that the number and arrangement of the x-coordinate pattern, x-coordinate trace, x-coordinate bonding pad and FPC bonding pad on the upper surface is selectively designed as needed.
  • the PET layer is characterized by selectively designing a plurality of x-coordinate traces, x-coordinate bonding pads and FPC bonding pads on the upper surface.
  • the tempered glass layer is characterized by consisting of a y-coordinate pattern and a y-coordinate bonding pad on the upper surface.
  • the position of the x-coordinate bonding pad and the y-coordinate bonding pad may be designed at different positions as necessary.
  • the x-coordinate bonding pad and the y-coordinate bonding pad are ACF bonded in a process for adhesion including an ACA layer.
  • the FPC bonding pad may be located on an upper surface of the PET layer and is designed to be configured of a plurality of pads.
  • ITO Indium Tin Oxide
  • ATO Antimony Thin Oxide
  • An x coordinate trace, an x coordinate bonding pad, and an FPC bonding pad are formed on the upper surface of the tempered glass layer, and the x coordinate pattern and the x coordinate trace are connected to an FPC bonding pad, and the x coordinate bonding pad is an FPC. Connecting with a bonding pad;
  • an ITO pattern that is, an x coordinate pattern, an x coordinate bonding pad and an FPC bonding pad, on the upper surface of the tempered glass layer, and an ITO pattern on the PET layer.
  • the tempered glass layer and the PET layer is characterized in that it is manufactured to perform a laminating process therebetween.
  • the PET layer is produced by performing a laminating process using a laminator equipment for adhering the OCA film on its upper surface.
  • the tempered glass layer has an ACA layer on the PET layer upper surface to perform the connection between the x coordinate bonding pad located on the bottom surface and the y coordinate bonding pad located on the upper surface of the PET layer. Characterized in that produced by performing the AC coordinate bonding process with the x-coordinate bonding pad is located.
  • the tempered glass layer is characterized by being produced by performing the ACF bonding process with the FPC by placing the ACF on the FPC bonding pad located on the upper surface.
  • the y coordinate pattern and the y coordinate bonding pad are formed on the upper surface of the PET layer, and the x coordinate pattern and the x coordinate trace on the upper surface of the tempered glass layer. Is connected to the FPC bonding pad, the x coordinate bonding pad is connected to the FPC bonding pad, and the y coordinate bonding pad on the upper surface of the PET layer is designed to be connected to the x coordinate bonding pad on the upper surface of the tempered glass layer.
  • the present invention there is no FPC bonding pad connected to the FPC on the upper surface of the PET layer, and only one time of ACF bonding that connects the FPC bonding pad and the FPC formed on the upper surface of the tempered glass layer is performed only once. And due to the reduction of the defective rate it is possible to greatly improve the productivity of the touch screen.
  • the work efficiency can be maximized by shortening the ACF bonding process connecting the pad with the FPC by one time, and the effective micro pattern can be formed on the upper surface of the tempered glass layer, thereby making the pad area smaller.
  • the ACF bonding process can be carried out even in a space where the customer's product design is narrow, and the tempered glass material is advantageous in the process for enhancing the adhesive strength, and the peel strength can be greatly increased.
  • the FPC bonding pad is formed only on the upper surface of the tempered glass layer, by reducing the ACF bonding process for the connection with the FPC, it is possible to drastically reduce the alignment error that may occur, thereby generating a defective rate due to electrical short. It is easy to manufacture a high quality touch panel by removing.
  • the present invention can be applied to a composite touch sensor using any substrate as a method for manufacturing a touch sensor.
  • FIG. 1 is a rear view of a design drawing of a conventional hybrid touch sensor.
  • FIG. 2 is a rear view of a PET for a touch screen and a tempered glass layer composite touch sensor according to the present invention.
  • FIG 3 is a sensor design diagram configured on the upper surface of the tempered glass layer provided in the touch screen PET and the tempered glass layer composite touch sensor according to the present invention.
  • Figure 4 is a sensor design diagram configured on the upper surface of the PET layer provided in the PET for touch screen and the tempered glass layer composite touch sensor according to the present invention.
  • FIG. 5 is a cross-sectional view of a PET for a touch screen and a tempered glass layer composite touch sensor according to the present invention.
  • FIG. 2 illustrates a touch screen PET and tempered glass layer composite touch sensor 100 according to the present invention.
  • the touch screen PET and tempered glass layer composite touch sensor 100 may include a tempered glass layer 110 in which indium tin oxide (ITO) or antimony thin oxide (ATO) is formed.
  • ITO indium tin oxide
  • ATO antimony thin oxide
  • the x-coordinate pattern 120, the x-coordinate bonding pad 140, the x-coordinate trace 130, and the FPC bonding pad 150 are designed on the upper surface of the ().
  • a y coordinate pattern 220 and a y coordinate bonding pad 230 are formed on an upper surface of the PET layer 210 having the indium tin oxide (ITO) or the antimony thin oxide (ATO) formed thereon, such a y coordinate bonding pad.
  • ITO indium tin oxide
  • ATO antimony thin oxide
  • 230 is adhesively connected to the x-coordinate bonding pad 140 located on the upper surface of the tempered glass layer 110.
  • the x coordinate pattern 120 and the x coordinate trace 130 are connected to the upper surface of the tempered glass layer 110 and connected to the FPC bonding pad 150, and the y coordinate bonding pad 230 and the upper surface of the PET layer 210.
  • the x-coordinate bonding pad 140 is bonded to each other. More details will be described with reference to the drawings below.
  • FIG 3 illustrates a touch sensor design diagram configured on the upper surface of the tempered glass layer 110 provided in the touch screen PET and the tempered glass layer composite touch sensor 100 according to the present invention.
  • the x coordinate pattern 120 is formed by a lithography process using a mask.
  • the x-coordinate trace 130, the x-coordinate bond pad 140, and the FPC bond pad 150 deposit Cr to form a Cr film, and then use a mask lithography process to perform the x-coordinate trace 130 and x.
  • the coordinate bonding pad 140 and the FPC bonding pad 150 are formed.
  • the x coordinate pattern 120 is connected to the x coordinate trace 130
  • the x coordinate trace 130 is connected to the FPC bonding pad 150
  • the x-coordinate bonding pad 140 is connected to the FPC bonding pad 150.
  • Figure 4 shows the design of the touch sensor formed on the PET layer 210 upper surface of the touch screen PET and the tempered glass layer composite touch sensor 100 according to the present invention.
  • a y coordinate pattern 220 is formed by a silk printing process.
  • the y coordinate bonding pad 230 forms a bonding pad pattern using silver ink, and the y coordinate pattern 220 and the y coordinate bonding pad 230 are connected to each other.
  • FIG 5 is a cross-sectional view after laminating the tempered glass layer 110 and PET layer 210 in the touch screen PET and tempered glass layer composite touch sensor 100 according to the present invention using a laminating device.
  • an ITO pattern that is, an x coordinate pattern 120
  • an x coordinate pattern 120 is formed on a lower surface of the tempered glass layer 110 and includes an x coordinate bonding pad 140 and an FPC bonding pad 150.
  • An upper surface of the layer 210 is composed of an ITO pattern, that is, a y coordinate pattern 220 and a y coordinate bonding pad 230.
  • laminating is performed using a laminator equipment for adhering the OCA film 310 on the PET layer 210.
  • the ACA layer 320 may be PET. ACF bonding is performed to connect to the x-coordinate bonding pad 140 positioned on the bottom surface of the layer 210 and positioned on the bottom surface of the tempered glass layer 110.
  • the manufacturing method of the PET and tempered glass layer composite touch sensor 100 according to the present invention configured as described above is as follows.
  • the PET layer 210 and the tempered glass layer 110 in which indium tin oxide (ITO) or antimony thin oxide (ATO) are formed are prepared.
  • the ITO or ATO film (not shown) is formed in substantially the same area on the PET layer 210 and the tempered glass layer (110).
  • the present invention forms an x coordinate trace 130, an x coordinate bonding pad 140, and an FPC bonding pad 150 made of Cr on the upper surface of the tempered glass layer 110.
  • the x coordinate pattern 120 is formed by a lithography process using a mask.
  • the x-coordinate trace 130, the x-coordinate bond pad 140, and the FPC bond pad 150 deposit Cr to form a Cr film, and then use a mask lithography process to perform the x-coordinate trace 130 and x.
  • the coordinate bonding pad 140 and the FPC bonding pad 150 are formed.
  • the x coordinate pattern 120 is connected to the x coordinate trace 130
  • the x coordinate trace 130 is connected to the FPC bonding pad 150
  • the x-coordinate bonding pad 140 is connected to the FPC bonding pad 150.
  • a material having excellent conductivity including a transition metal is selected, and a patterning process is performed to form a patterning process. desirable.
  • the tempered glass layer 110 has an x coordinate pattern 120, an x coordinate trace 130, an x coordinate bonding pad 140, and an arrangement and number of FPC bonding pads 150 on the upper surface thereof. It may be designed a number.
  • the tempered glass layer 110 has an x-coordinate pattern 120 and an x-coordinate trace 130, an x-coordinate bonding pad 140, and an y-coordinate pattern 220 instead of the FPC bonding pad 150 on its upper surface. It can be designed and composed of the y coordinate bonding pad 230, in this case the x coordinate pattern 120 and the x coordinate trace 130, the x coordinate bonding pad 140, and the FPC bonding pad on the PET layer 210 150 is formed.
  • the bonding pad region is patterned with silver ink on the upper surface of the PET layer 210 to form the y-coordinate bonding pad 230.
  • a y-coordinate pattern 220 is formed by a silk printing process.
  • the y coordinate bonding pad 230 forms a bonding pad pattern using silver ink, and the y coordinate pattern 220 and the y coordinate bonding pad 230 are connected to each other.
  • a transparent conductive electrode is formed by performing a patterning process using a transparent conductive material including ITO.
  • the PET layer 210 may be selectively designed as many as the number and arrangement of the y-coordinate bonding pad 230 connected to the y-coordinate pattern 220 as needed.
  • the PET layer 210 has a y-coordinate pattern 220 and an x-coordinate pattern 120, an x-coordinate trace 130, and an x-coordinate bonding pad 140 on its upper surface instead of the y-coordinate pattern 220.
  • a plurality of FPC bonding pads 150 may be selectively designed.
  • the y-coordinate pattern 220 and the y-coordinate bonding pad 230 may be formed on the tempered glass layer 110.
  • connection between the x coordinate bonding pad 140 located on the lower surface of the tempered glass layer 110 and the y coordinate bonding pad 230 on the upper surface of the PET layer 210 is performed.
  • the ACA layer 320 is positioned on the upper surface of the PET layer 210 to perform ACF bonding with the x-coordinate bonding pad 140 located on the lower surface of the tempered glass layer 110.
  • the positions of the x-coordinate bonding pad 140 and the y-coordinate bonding pad 230 may be designed in different positions as necessary, and at this time, the x-coordinate bonding pad 140 and the y-coordinate bonding Pad 230 is ACF bonded in a process for adhesion including ACA layer 320.
  • ACF bonding with the FPC 300 is performed by forming an ACF layer 330 on the FPC bonding pad 150 located on the tempered glass layer 110 for ACF bonding with the FPC 300.
  • the FPC bonding pad 150 may be located on the PET layer 210 upper surface instead of the tempered glass layer 110, may be composed of a plurality of pads.
  • the ITO pattern that is, the x coordinate pattern 120 and the x coordinate bonding
  • the ITO pattern is formed on the upper surface of the tempered glass layer 110.
  • a pad 140 and an FPC bonding pad 150 are formed, and an ITO pattern, that is, a y coordinate pattern 220 and a y coordinate bonding pad 230, is formed on the PET layer 210, and one FPC bonding pad is formed.
  • the 150 is manufactured by performing an ACF bonding process with the FPC 300.
  • the present invention there is no FPC bonding pad 150 connected to the FPC 300 on the PET layer 210, and only the FPC bonding pad 150 and the FPC 300 configured on the upper surface of the tempered glass layer 110 are provided.
  • the productivity of the touch screen can be greatly improved due to the efficient work time and the reduction of the defective rate by shortening the process.
  • the ACF bonding process connecting the FPC 300 and the FPC bonding pad 150 may be shortened to one time to maximize work efficiency, and form an effective fine pattern on the upper surface of the tempered glass layer 110.
  • the area of the pad can be miniaturized, the ACF bonding process can be performed even in a narrow space of the customer's product design, and the tempered glass material is advantageous to the process for enhancing the adhesive strength, thereby improving the peel strength. Can be significantly higher.
  • the FPC bonding pad 150 is formed only on the upper surface of the tempered glass layer 110, by reducing the ACF bonding process for the connection with the FPC 300, the alignment error that can be generated is significantly reduced. By removing the defective rate caused by the electrical short, it is easy to manufacture high-quality touch panel.
  • the present invention is applicable to the composite touch sensor 100 using all the substrates as a method for manufacturing the touch sensor 100.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

La présente invention se rapporte à une conception d'un capteur du type composite qui présente une couche de PET et une couche de verre trempé afin de fabriquer un capteur d'écran tactile et plus particulièrement à une structure et à une conception dans lesquelles : lors de la conception d'un capteur d'écran tactile, la surface supérieure d'une couche de PET est configurée avec un motif de coordonnées y et une plage de jonction de coordonnées y ; et la surface supérieure d'une couche de verre trempé est configurée avec un motif de coordonnées x, une plage de jonction de coordonnées x, une piste de coordonnées x et une plage de jonction de FPC. La présente invention est conçue de telle sorte que : le motif de coordonnées y situé sur la surface supérieure de la couche de PET et la plage de jonction de coordonnées x située sur la couche de verre trempé soient fixés et connectés l'un à l'autre par la place de jonction de coordonnées y ; sur la surface supérieure de la couche de verre trempé, le motif de coordonnées x et la piste de coordonnées x sont connectés l'un à l'autre de façon à former une plage ; et la couche de PET est disposée sur la surface supérieure de celle-ci, la plage de jonction de coordonnées x étant fixée et connectée à la plage de jonction de coordonnées y. Selon la présente invention, il n'y a aucune plage de jonction de FPC, connectée au FPC, sur la surface supérieure de la couche de PET et une liaison d'ACF est exécutée seulement une fois de façon à connecter le FPC à la plage de jonction de FPC disposée seulement sur la surface supérieure de la couche de verre trempé. Par conséquent, selon la présente invention, la simplification du procédé permet d'atteindre une vitesse de fabrication efficace et de réduire le taux de défaillance, en améliorant de ce fait la productivité des écrans tactiles.
PCT/KR2011/003664 2010-05-20 2011-05-18 Capteur tactile du type composite à couche de verre trempé et de pet destiné à un écran tactile et procédé de fabrication associé WO2011145878A2 (fr)

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KR10-2010-0047429 2010-05-20
KR20100047429 2010-05-20

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WO2011145878A2 true WO2011145878A2 (fr) 2011-11-24
WO2011145878A3 WO2011145878A3 (fr) 2012-03-01

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KR101901253B1 (ko) * 2012-03-06 2018-09-21 엘지디스플레이 주식회사 터치 스크린 일체형 표시 장치 및 이의 제조 방법
CN105260073B (zh) * 2015-11-03 2018-10-19 江西省天翌光电有限公司 一种电容式触摸屏防水处理工艺
CN106980419B (zh) * 2016-01-22 2019-01-11 张顺珍 一种投射式电容触控屏的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158008A (ja) * 2003-11-06 2005-06-16 Matsushita Electric Ind Co Ltd タッチパネルおよびこれを用いたタッチパネル付き液晶表示装置
KR20060055873A (ko) * 2004-11-19 2006-05-24 엘지.필립스 엘시디 주식회사 터치패널 일체형 평판 디스플레이 장치
KR20090080221A (ko) * 2008-01-21 2009-07-24 엘지전자 주식회사 터치 스크린을 구비한 플라즈마 디스플레이 패널 및 그제조 방법
KR20100031380A (ko) * 2008-09-12 2010-03-22 (주) 태양기전 윈도우 터치 패널 및 그 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158008A (ja) * 2003-11-06 2005-06-16 Matsushita Electric Ind Co Ltd タッチパネルおよびこれを用いたタッチパネル付き液晶表示装置
KR20060055873A (ko) * 2004-11-19 2006-05-24 엘지.필립스 엘시디 주식회사 터치패널 일체형 평판 디스플레이 장치
KR20090080221A (ko) * 2008-01-21 2009-07-24 엘지전자 주식회사 터치 스크린을 구비한 플라즈마 디스플레이 패널 및 그제조 방법
KR20100031380A (ko) * 2008-09-12 2010-03-22 (주) 태양기전 윈도우 터치 패널 및 그 제조 방법

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KR20110128133A (ko) 2011-11-28

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