WO2011119891A3 - High performance low cost open air cavity ceramic power packages for high temperature die attach processes - Google Patents

High performance low cost open air cavity ceramic power packages for high temperature die attach processes Download PDF

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Publication number
WO2011119891A3
WO2011119891A3 PCT/US2011/029876 US2011029876W WO2011119891A3 WO 2011119891 A3 WO2011119891 A3 WO 2011119891A3 US 2011029876 W US2011029876 W US 2011029876W WO 2011119891 A3 WO2011119891 A3 WO 2011119891A3
Authority
WO
WIPO (PCT)
Prior art keywords
low cost
high temperature
air cavity
open air
die attach
Prior art date
Application number
PCT/US2011/029876
Other languages
French (fr)
Other versions
WO2011119891A2 (en
Inventor
Anwar Abdul Mohammed
Original Assignee
Anwar Abdul Mohammed
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anwar Abdul Mohammed filed Critical Anwar Abdul Mohammed
Publication of WO2011119891A2 publication Critical patent/WO2011119891A2/en
Publication of WO2011119891A3 publication Critical patent/WO2011119891A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Methods for forming a power package for use in removing heat from an electronic device are provided. In embodiments, a heat sink is attached to a window frame with the aid of a high temperature adhesive material. The adhesive material is cured at a predetermined time and temperature. One or more dies are attached to the heat sink.
PCT/US2011/029876 2010-03-25 2011-03-24 High performance low cost open air cavity ceramic power packages for high temperature die attach processes WO2011119891A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31767910P 2010-03-25 2010-03-25
US61/317,679 2010-03-25

Publications (2)

Publication Number Publication Date
WO2011119891A2 WO2011119891A2 (en) 2011-09-29
WO2011119891A3 true WO2011119891A3 (en) 2012-01-05

Family

ID=44673871

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/029876 WO2011119891A2 (en) 2010-03-25 2011-03-24 High performance low cost open air cavity ceramic power packages for high temperature die attach processes

Country Status (1)

Country Link
WO (1) WO2011119891A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package
US20040246682A1 (en) * 2003-06-09 2004-12-09 Sumitomo Metal (Smi) Eectronics Devices Inc. Apparatus and package for high frequency usages and their manufacturing method
US20070090514A1 (en) * 2005-10-24 2007-04-26 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture
US7582964B2 (en) * 2003-01-10 2009-09-01 Kyocera America, Inc. Semiconductor package having non-ceramic based window frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package
US7582964B2 (en) * 2003-01-10 2009-09-01 Kyocera America, Inc. Semiconductor package having non-ceramic based window frame
US20040246682A1 (en) * 2003-06-09 2004-12-09 Sumitomo Metal (Smi) Eectronics Devices Inc. Apparatus and package for high frequency usages and their manufacturing method
US20070090514A1 (en) * 2005-10-24 2007-04-26 Freescale Semiconductor, Inc. Semiconductor structure and method of manufacture

Also Published As

Publication number Publication date
WO2011119891A2 (en) 2011-09-29

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