WO2011111945A3 - A preparation method of silicone composition having high refractive index for light emitting diode device - Google Patents

A preparation method of silicone composition having high refractive index for light emitting diode device Download PDF

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Publication number
WO2011111945A3
WO2011111945A3 PCT/KR2011/001434 KR2011001434W WO2011111945A3 WO 2011111945 A3 WO2011111945 A3 WO 2011111945A3 KR 2011001434 W KR2011001434 W KR 2011001434W WO 2011111945 A3 WO2011111945 A3 WO 2011111945A3
Authority
WO
WIPO (PCT)
Prior art keywords
high refractive
light emitting
emitting diode
silicone composition
preparation
Prior art date
Application number
PCT/KR2011/001434
Other languages
French (fr)
Other versions
WO2011111945A2 (en
Inventor
Seung Kwang Seo
Seung Hyun Kang
Su Jin Lee
Original Assignee
Kcc Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kcc Corporation filed Critical Kcc Corporation
Publication of WO2011111945A2 publication Critical patent/WO2011111945A2/en
Publication of WO2011111945A3 publication Critical patent/WO2011111945A3/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a method for preparing a high refractive organopolysiloxane through condensation reactions. More specifically, the present invention relates to a method for preparing a high refractive organopolysiloxane through condensation reactions using a slight amount of catalyst, by which the reduction of ion content, easy removal of silanol groups and saving of production time can be achieved simultaneously; and a silicone composition for light emitting diode (LED) devices comprising the high refractive organopolysiloxane prepared by the method.
PCT/KR2011/001434 2010-03-09 2011-03-02 A preparation method of silicone composition having high refractive index for light emitting diode device WO2011111945A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100021040A KR20110101791A (en) 2010-03-09 2010-03-09 A preparation method of silicon composition having high refractive index for light emitting diode device
KR10-2010-0021040 2010-03-09

Publications (2)

Publication Number Publication Date
WO2011111945A2 WO2011111945A2 (en) 2011-09-15
WO2011111945A3 true WO2011111945A3 (en) 2012-01-19

Family

ID=44573329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001434 WO2011111945A2 (en) 2010-03-09 2011-03-02 A preparation method of silicone composition having high refractive index for light emitting diode device

Country Status (2)

Country Link
KR (1) KR20110101791A (en)
WO (1) WO2011111945A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102757458B (en) * 2012-07-30 2015-04-29 嘉兴联合化学有限公司 Method and device for preparing tetramethyldihydrodisiloxane
CN103232600B (en) * 2013-05-23 2015-01-28 汕头市骏码凯撒有限公司 Method for preparing phenyl silicone resin with high-refractive index

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148252B1 (en) * 1989-02-09 1998-08-17 . Process for preparing organosilicon compounds
KR20080110761A (en) * 2006-04-25 2008-12-19 에니콜로포브 인스티튜트 오브 신테틱 폴리머릭 머터리얼즈 (아이에스피엠) 오브 더 러시안 아카데미 오브 사이언스 Curable resin composition
JP2009203475A (en) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp Sealing resin and method of producing the same
KR20090103785A (en) * 2008-03-27 2009-10-01 신에쓰 가가꾸 고교 가부시끼가이샤 Curable silicone rubber composition and optical semiconductor device using the same as sealing material
KR20100013368A (en) * 2008-07-31 2010-02-10 한국과학기술원 Siloxane resin for led encapsulation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0148252B1 (en) * 1989-02-09 1998-08-17 . Process for preparing organosilicon compounds
KR20080110761A (en) * 2006-04-25 2008-12-19 에니콜로포브 인스티튜트 오브 신테틱 폴리머릭 머터리얼즈 (아이에스피엠) 오브 더 러시안 아카데미 오브 사이언스 Curable resin composition
JP2009203475A (en) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp Sealing resin and method of producing the same
KR20090103785A (en) * 2008-03-27 2009-10-01 신에쓰 가가꾸 고교 가부시끼가이샤 Curable silicone rubber composition and optical semiconductor device using the same as sealing material
KR20100013368A (en) * 2008-07-31 2010-02-10 한국과학기술원 Siloxane resin for led encapsulation

Also Published As

Publication number Publication date
KR20110101791A (en) 2011-09-16
WO2011111945A2 (en) 2011-09-15

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