WO2011094706A3 - Feedback control of polishing using optical detection of clearance - Google Patents

Feedback control of polishing using optical detection of clearance Download PDF

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Publication number
WO2011094706A3
WO2011094706A3 PCT/US2011/023215 US2011023215W WO2011094706A3 WO 2011094706 A3 WO2011094706 A3 WO 2011094706A3 US 2011023215 W US2011023215 W US 2011023215W WO 2011094706 A3 WO2011094706 A3 WO 2011094706A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
zone
substrate
measurements
time
Prior art date
Application number
PCT/US2011/023215
Other languages
French (fr)
Other versions
WO2011094706A2 (en
Inventor
Kun Xu
Ingemar Carlsson
Feng Liu
David Maxwell Gage
You Wang
Dominic J. Benvegnu
Boguslaw A. Swedek
Yuchun Wang
Pierre Fontarensky
Wen-Chiang Tu
Lakshmanan Karuppiah
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/697,177 external-priority patent/US8989890B2/en
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2011094706A2 publication Critical patent/WO2011094706A2/en
Publication of WO2011094706A3 publication Critical patent/WO2011094706A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Abstract

A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
PCT/US2011/023215 2010-01-29 2011-01-31 Feedback control of polishing using optical detection of clearance WO2011094706A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/697,177 US8989890B2 (en) 2008-11-07 2010-01-29 GST film thickness monitoring
US12/697,177 2010-01-29
US37927310P 2010-09-01 2010-09-01
US61/379,273 2010-09-01

Publications (2)

Publication Number Publication Date
WO2011094706A2 WO2011094706A2 (en) 2011-08-04
WO2011094706A3 true WO2011094706A3 (en) 2011-11-17

Family

ID=44320204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/023215 WO2011094706A2 (en) 2010-01-29 2011-01-31 Feedback control of polishing using optical detection of clearance

Country Status (1)

Country Link
WO (1) WO2011094706A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9095952B2 (en) 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
US10565701B2 (en) 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US11557048B2 (en) 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
TWI784719B (en) 2016-08-26 2022-11-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
US11100628B2 (en) 2019-02-07 2021-08-24 Applied Materials, Inc. Thickness measurement of substrate using color metrology

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020098777A1 (en) * 2000-10-17 2002-07-25 Thomas Laursen Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US20020197871A1 (en) * 2000-10-18 2002-12-26 Takenori Hirose Method of polishing a film
US20060009127A1 (en) * 2004-07-09 2006-01-12 Kunihiko Sakurai Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7115017B1 (en) * 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020098777A1 (en) * 2000-10-17 2002-07-25 Thomas Laursen Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US20020197871A1 (en) * 2000-10-18 2002-12-26 Takenori Hirose Method of polishing a film
US20060009127A1 (en) * 2004-07-09 2006-01-12 Kunihiko Sakurai Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
US7115017B1 (en) * 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization

Also Published As

Publication number Publication date
WO2011094706A2 (en) 2011-08-04

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