WO2011094706A3 - Feedback control of polishing using optical detection of clearance - Google Patents
Feedback control of polishing using optical detection of clearance Download PDFInfo
- Publication number
- WO2011094706A3 WO2011094706A3 PCT/US2011/023215 US2011023215W WO2011094706A3 WO 2011094706 A3 WO2011094706 A3 WO 2011094706A3 US 2011023215 W US2011023215 W US 2011023215W WO 2011094706 A3 WO2011094706 A3 WO 2011094706A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- zone
- substrate
- measurements
- time
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 7
- 238000001514 detection method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 5
- 238000005259 measurement Methods 0.000 abstract 3
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000012544 monitoring process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
- B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/697,177 US8989890B2 (en) | 2008-11-07 | 2010-01-29 | GST film thickness monitoring |
US12/697,177 | 2010-01-29 | ||
US37927310P | 2010-09-01 | 2010-09-01 | |
US61/379,273 | 2010-09-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011094706A2 WO2011094706A2 (en) | 2011-08-04 |
WO2011094706A3 true WO2011094706A3 (en) | 2011-11-17 |
Family
ID=44320204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/023215 WO2011094706A2 (en) | 2010-01-29 | 2011-01-31 | Feedback control of polishing using optical detection of clearance |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2011094706A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9095952B2 (en) * | 2013-01-23 | 2015-08-04 | Applied Materials, Inc. | Reflectivity measurements during polishing using a camera |
US11557048B2 (en) | 2015-11-16 | 2023-01-17 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
US10565701B2 (en) | 2015-11-16 | 2020-02-18 | Applied Materials, Inc. | Color imaging for CMP monitoring |
TWI784719B (en) | 2016-08-26 | 2022-11-21 | 美商應用材料股份有限公司 | Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product |
US11100628B2 (en) | 2019-02-07 | 2021-08-24 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020098777A1 (en) * | 2000-10-17 | 2002-07-25 | Thomas Laursen | Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
US20020197871A1 (en) * | 2000-10-18 | 2002-12-26 | Takenori Hirose | Method of polishing a film |
US20060009127A1 (en) * | 2004-07-09 | 2006-01-12 | Kunihiko Sakurai | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
US7115017B1 (en) * | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
-
2011
- 2011-01-31 WO PCT/US2011/023215 patent/WO2011094706A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020098777A1 (en) * | 2000-10-17 | 2002-07-25 | Thomas Laursen | Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
US20020197871A1 (en) * | 2000-10-18 | 2002-12-26 | Takenori Hirose | Method of polishing a film |
US20060009127A1 (en) * | 2004-07-09 | 2006-01-12 | Kunihiko Sakurai | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
US7115017B1 (en) * | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
Also Published As
Publication number | Publication date |
---|---|
WO2011094706A2 (en) | 2011-08-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2011094706A3 (en) | Feedback control of polishing using optical detection of clearance | |
WO2012019044A3 (en) | Techniques for matching measured spectra to reference spectra for in-situ optical monitoring | |
WO2012148859A3 (en) | Selection of polishing parameters to generate removal profile | |
WO2012051121A3 (en) | Building a library of spectra for optical monitoring | |
WO2013079542A3 (en) | Optically variable element | |
WO2010062910A3 (en) | Using optical metrology for feed back and feed forward process control | |
WO2013084068A3 (en) | System and method for identifying related events in a resource network monitoring system | |
WO2012148826A3 (en) | High sensitivity eddy current monitoring system | |
WO2012145336A3 (en) | Adaptively tracking spectrum features for endpoint detection | |
MX336885B (en) | Wound protection. | |
WO2012153294A3 (en) | Device, system and method of noise control | |
WO2011094590A3 (en) | High sensitivity real time profile control eddy current monitoring system | |
ATE553422T1 (en) | CONTROL AND MONITORING SYSTEM FOR COMPANIES | |
WO2011146208A3 (en) | Feedback for polishing rate correction in chemical mechanical polishing | |
WO2012054635A3 (en) | Monitoring using distributed acoustic sensing (das) technology | |
WO2010036580A3 (en) | Multi-touch surface providing detection and tracking of multiple touch points | |
WO2009131892A3 (en) | Methods and apparatus for measuring substrate edge thickness during polishing | |
WO2011146213A3 (en) | Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing | |
WO2009137764A3 (en) | Cmp pad thickness and profile monitoring system | |
WO2013034920A3 (en) | Surface polymer coatings | |
WO2016033247A3 (en) | Population-based learning with deep belief networks | |
WO2012019040A3 (en) | Spectrographic monitoring using index tracking after detection of layer clearing | |
SE0800490L (en) | Method for electrostatic production of particles | |
WO2012154244A3 (en) | Barrier materials for mirror assemblies | |
EP3859784A4 (en) | Array substrate and method for detecting same, and display panel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11737833 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11737833 Country of ref document: EP Kind code of ref document: A2 |