WO2011086546A1 - Machine for cutting both single and double dimple keys - Google Patents

Abstract

A dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising: a location probe, exposed in the first mode and arranged to mechanically determine dimple locations, and withdrawn in the second mode; and an inner dimple depth probe, arranged in the first mode to mechanically determine inner dimple depths by contacting depth limiting tabs held by a fastener in a housing of an inner dimple depth limiter, and arranged in the second mode to mechanically determine both locations and depths of single dimples in a sample key held by a bracket held by the fastener in the housing of the inner dimple depth limiter, the bracket replacing the depth limiting tabs, wherein the inner dimple depth probe is sharpened such as to fit into the single dimples of the sample key

Description

MACHINE FOR CUTTING BOTH SINGLE AND DOUBLE DIMPLE KEYS

BACKGROUND

1. TECHNICAL FIELD

[0001] The present invention relates to the field of key cutting machines, and more particularly, to dimple key cutting machines.

2. DISCUSSION OF RELATED ART

[0002] Prior to setting forth the background of the related art, it may be helpful to set forth definitions of certain terms that will be used hereinafter: The term "dimple" as used herein in this application, is defined as an indentation in a key. The term "single dimple key" as used herein in this application, is defined as a key having several adjacent single dimples while the term "double dimple key" as used herein in this application, is defined as a key having several adjacent double dimples, wherein each double dimple comprises two concentric dimple with radii that vary in two different ranges. The inner dimples in double dimple keys have a similar range of varying radii as the dimples in single dimple keys.

[0003] Dimple key cutting machines are constructed such as to cut dimple keys of certain predefined configurations, particularly single dimple keys are cut by single dimple cutting machines while double dimple keys are cut by double dimple cutting machines. BRIEF SUMMARY

[0004] Embodiments of the present invention provide a dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising: a location probe, exposed in the first mode and arranged to mechanically determine dimple locations, and withdrawn in the second mode; and an inner dimple depth probe, arranged in the first mode to mechanically determine inner dimple depths by contacting a plurality of depth limiting tabs held by a fastener in a housing of an inner dimple depth limiter, and arranged in the second mode to mechanically determine both locations and depths of single dimples in a sample key held by a bracket held by the fastener in the housing of the inner dimple depth limiter, the bracket replacing the plurality of depth limiting tabs, wherein the inner dimple depth probe is sharpened such as to fit into the single dimples of the sample key.

[0005] Embodiments of the present invention provide a dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising: a machine body, comprising: an outer dimple cutter arranged to cut outer dimples in a key blank; an inner dimple cutter arranged to cut inner dimples in the key blank; an outer dimple location ruler arranged to limit a cutting location of each outer dimple of double dimple keys by the outer dimple cutter; an inner dimple location ruler arranged to limit a cutting location of each inner dimple of double dimple keys by the inner dimple cutter; an outer dimple depth limiter, set according to readings of a first key reader and arranged to limit a cutting depth of each outer dimple by the outer dimple cutter; and an inner dimple depth limiter, comprising a housing and a fastener, and a plurality of depth limiting tabs interchangeable with a bracket, both held by the fastener within the housing, wherein in the first mode the inner dimple depth limiter is set according to readings of a second key reader by setting the plurality of depth limiting tabs, the inner dimple depth limiter arranged to limit a cutting depth of each inner dimple by the inner dimple cutter, and wherein in the second mode, the bracket is arranged to hold a sample key having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by the inner dimple cutter according to the single dimples in the sample key, and a feeder pivotly hinged on the machine body, the feeder comprising: an inner dimple depth probe, sharpened such as to fit into the single dimples of the sample key; an outer dimple depth probe; a holder holding a key blank; and a location probe having two operational positions: a double dimple position in which a location of each outer dimple is determined mechanically by inserting the location probe into a corresponding position in the outer dimple location ruler, and a location of each inner dimple is determined mechanically by inserting the location probe into a corresponding position in the inner dimple location ruler; and a single dimple position in which the location probe is disengaged from contacting the location rulers, the feeder arranged to allow pushing the key blank sequentially against the inner dimple cutter and the outer dimple cutter in the first mode, and against the inner dimple cutter in the second mode, wherein in the first mode, locations of the inner dimples and of the outer dimples are mechanically determined by pushing the location probe sequentially against the inner dimple location ruler and the outer dimple location ruler respectively, and depths of the inner dimples and of the outer dimples are mechanically determined by sequentially pushing the inner dimple depth probe against the inner dimple depth limiter and pushing the outer dimple depth probe against the outer dimple depth limiter, and wherein in the second mode, locations and depths of the single dimples are mechanically determined by pushing the inner dimple depth probe against the sample key held by the bracket in the inner dimple depth limiter.

[0006] Accordingly, according to an aspect of the present invention, there is provided a dimple key cutting machine, wherein the location probe is retracted within a location probe holder in the single dimple position.

[0007] Embodiments of the present invention provide a device for adapting a double dimple key cutting machine to additionally cut single dimple keys, the device comprising: an adapter connected to a location probe of the machine and arranged to disengage, in a single dimple mode, the location probe from contacting an inner dimple location ruler and an outer dimple location ruler of the machine; and a bracket arranged to replace a plurality of depth limiting tabs of an inner dimple depth limiter of the machine, and likewise be held by a fastener within a housing of the inner dimple depth limiter, the bracket arranged, in the single dimple mode, to hold a sample key having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by an inner dimple cutter of the machine, according to the single dimples in the sample key, wherein an inner dimple depth probe of the machine is sharpened such as to fit into the single dimples of the sample key, and wherein the machine cuts double dimple keys in a double dimple mode, and is arranged to cut single dimple keys in the single dimple mode.

[0008] Embodiments of the present invention provide a method of enabling duplication of single dimple keys with a machine for cutting double dimple keys, comprising: remounting a location probe of the machine such as to enable two alternative positions therefor: an original position thereof in the machine; and a second position selected such as to disengage the location probe from contacting the location rulers; and replacing a plurality of depth limiting tabs in an inner dimple depth limiter of the machine with a bracket arranged to hold a single dimple sample key in a specified position selected such as to allow to limit an inner dimple cutter of the machine by a inner dimple depth probe of the machine, according to the locations and the depths of single dimples in the sample key.

[0009] Accordingly, according to an aspect of the present invention, there is provided a method, further comprising applying the inner dimple cutter to cut single dimples in a key blank according to the limits set by the inner dimple depth probe during probing of the locations and the depths of the single dimples in the sample key held by the bracket.

[0010] These, additional, and/or other aspects and/or advantages of the present invention are: set forth in the detailed description which follows; possibly inferable from the detailed description; and/or learnable by practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will be more readily understood from the detailed description of embodiments thereof made in conjunction with the accompanying drawings of which:

Fig. 1 is a schematic perspective illustration of a machine for duplicating double dimple keys in a standby state of a first, double dimple state, according to some embodiments of the invention; Fig. 2 is a schematic perspective side view illustration of the machine in a standby state of the first state, according to some embodiments of the invention;

Fig. 3 is a schematic illustration of the operation region of the machine in an operational state, in the first, double dimple state, according to some embodiments of the invention; Fig. 4 is a schematic cross section illustration of the operation region of the machine in an operational state, in the first, double dimple state, during the stage of cutting the outer dimples, according to some embodiments of the invention;

Fig 5 is a schematic top view illustration of the operation region of the machine in an operational state, in the first, double dimple state, during the stage of cutting the outer dimples, according to some embodiments of the invention;

Fig. 6 is a schematic top view illustration of the operation region of the machine in an operational state, in the first, double dimple state, during the stage of cutting the inner dimples, according to some embodiments of the invention;

Fig. 7 is a schematic perspective illustration of the machine in a standby state in the second state, according to some embodiments of the invention;

Fig. 8 is a schematic perspective illustration of the machine in a standby state in the second state, according to some embodiments of the invention;

Fig. 9 is a schematic perspective illustration of the operation region of the machine in the operational state, in the second state (single dimples), during the stage of cutting dimples according to the sample key, according to some embodiments of the invention;

Fig 10 is a longitudinal cross section schematically illustrating the machine in the operational state, in the second state (single dimple), during the stage of cutting dimples according to the sample key, according to some embodiments of the invention; Fig 11 is a top view schematically illustrating the machine in the operational state, in the second state (single dimple), during the stage of cutting dimples according to the sample key, according to some embodiments of the invention;

Fig 12 is a horizontal cross section schematically illustrating the machine in the operational state, in the second state (single dimple), during the stage of cutting dimples according to the sample key, according to some embodiments of the invention;

Figs. 13 A, 13B and 13C are illustrations of a device for adapting a double dimple key cutting machine to additionally cut single dimple keys, according to some embodiments of the invention. Figs. 13A and 13B are exploded views, Fig 13C is a perspective view; and

Fig. 14 is a high level schematic flowchart of a method of enabling duplication of single dimple keys with a machine for cutting double dimple, according to some embodiments of the invention.

DETAILED DESCRIPTION

[0012] Before explaining at least one embodiment of the invention in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawings. The invention is applicable to other embodiments or of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting. [0013] The disclosed dimple key cutting machine has a first mode for cutting double dimple keys illustrated in Figs. 1-6, and a second mode for cutting single dimple keys, illustrated in Figs. 7-12. A device for adapting a double dimple key cutting machine to additionally cut single dimple keys is illustrated in Fig. 13 and a method of enabling duplication of single dimple keys with a machine for cutting double dimple keys is illustrated in Fig. 14.

[0014] The dimple key cutting machine comprises a machine body 100, comprising: outer dimple cutter 132 arranged to cut outer dimples in a key blank 90; an inner dimple cutter 131 arranged to cut inner dimples in key blank 90; an outer dimple location ruler 180 arranged to limit a cutting location of each outer dimple of double dimple keys by outer dimple cutter 132; an inner dimple location ruler 170 arranged to limit a cutting location of each inner dimple of double dimple keys by inner dimple cutter 131; an outer dimple depth limiter 120, set according to readings of a first key reader 102 and arranged to limit a cutting depth of each outer dimple by outer dimple cutter 132; and an inner dimple depth limiter 110 comprises a housing 212, a fastener 209, and depth limiting tabs 111 that are interchangeable with a bracket 200, both held by fastener 209 within housing 212. In the first mode, inner dimple depth limiter 110 is set according to readings of a second key reader 101 by setting depth limiting tabs 111. Inner dimple depth limiter 110 is arranged to limit a cutting depth of each inner dimple by inner dimple cutter 131. In the second mode, bracket 200 is arranged to hold a sample key 95 having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by inner dimple cutter 131 according to the single dimples in sample key 95. [0015] The dimple key cutting machine further comprises a feeder 140 pivotly hinged on machine body 100 (by axis 141). Feeder 140 comprises an inner dimple depth probe 155 that is sharpened such as to fit into the single dimples of a sample key 95 (for operating in the second mode), an outer dimple depth probe 156; a holder holding a key blank 90; and a location probe 310 that has two operational positions: A double dimple position 311 in which a location of each outer dimple is determined mechanically by inserting location probe 310 into a corresponding position in outer dimple location ruler 180, and a location of each inner dimple is determined mechanically by inserting location probe 310 into a corresponding position in inner dimple location ruler 170. A single dimple position in which location probe 310 is disengaged from contacting location rulers 170 and 180. Feeder 140 is arranged to allow pushing key blank 90 sequentially against inner dimple cutter 131 and outer dimple cutter 132 in the first mode, and against inner dimple cutter 131 in the second mode.

[0016] In the first mode, locations of the inner dimples and of the outer dimples are mechanically determined by pushing location probe 310 sequentially against inner dimple location ruler 170 and outer dimple location ruler 180 respectively, and depths of the inner dimples and of the outer dimples are mechanically determined by sequentially pushing inner dimple depth probe 155 against inner dimple depth limiter 110 and pushing outer dimple depth probe 60 against outer dimple depth limiter 120.

[0017] In the second mode, locations and depths of the single dimples are mechanically determined by pushing inner dimple depth probe 155 against sample key 95 held by bracket 200 in inner dimple depth limiter 110. [0018] In the second mode, location probe 310 may be retracted within a location probe holder 315 in the single dimple position. Location probe 310 may be pulled back to retracted position 312 by a pin 320 and fastened in retracted position 312 by a fastener 300 (which may also fixate location probe 310 in its original position 311 in the first mode).

[0019] Figs. 1 and 2 are schematic illustrations of a machine for duplicating double dimple keys in the first state, in a standby state, according to some embodiments of the invention. In the standby state, feeder 140 holding key blank 90 and adjustable holders 150, 160, is inclined from main body 100 of the machine. Fig. 3 is a schematic illustration, and Fig. 4 is a schematic cross section illustration, of the operation region of the machine in an operational first state of duplicating double dimple keys, according to some embodiments of the invention. In the operational state, feeder 140 is fastened against main body 100 of the machine such that adjustable holders 150, 160, key blank 90 and cutters 131, 132 are in operational positions. In the operational state, feeder 140 is allowed to move horizontally, such that key blank 90 is fed to cutters 131, 132 sequentially. The depth of cutting is regulated by depth limiters 110, 120 respectively, as described below.

[0020] The machine for duplicating double dimple keys comprises inner dimple depth limiter 110, which is set manually according to readings of second key reader 101, and an outer dimple depth limiter 120, which is set manually according to readings of first key reader 102. (Inner dimple depth settings 115 are set by depth limiting tabs 111 and marked with numbers in Fig. 1, outer dimple depth settings 125 are set by tabs 122 and marked with letters in Fig. 1.) The machine further comprises inner dimple cutter 131 for cutting inner dimples in key blank 90 to a depth determined by inner dimple depth limiter 110, and outer dimple cutter 132 for cutting outer dimples in key blank 90 to a depth determined by outer dimple depth limiter 120. The depths are determined mechanically by cutting into key blank 90 to the depth allowed by the corresponding depth limiter. Inner dimples are cut by inner dimple cutter 131 to the depth allowed by inner dimple depth limiter 110 for inner dimple depth probe 155, while outer dimples are cut by outer dimple cutter 132 to the depth allowed by outer dimple depth limiter 120 for outer dimple depth probe 156. Cutting is performed after fixating feeder 140 (see Figs. 3 and 4) such that key blank 90 is sequentially fixed against inner dimple cutter 131 and outer dimple cutter 132. Inner dimple depth probe 155 is held against inner dimple limiter settings 115 by an adjustable holder 150, and outer dimple depth probe 156 is held against outer dimple limiter settings 125 by an adjustable holder 160. Feeder 140 may be slightly move pivotly (hinged on axis 141) such as to enable touching inner dimple limiter settings 115 by inner dimple depth probe 155 and outer dimple limiter settings 125 by outer dimple depth probe 156 during the cutting of the inner dimples and the outer dimples respectively. These movements allow the corresponding cutter 131, 132 to cut exactly the set depths. The locations of each dimple along the key are determined by inserting location probe 310 (positioned in original position 311) sequentially into slits in location rulers 170, 180. Location ruler 170 is used for the inner dimples, while location ruler 180 is used for the outer dimples. The positions of location rulers 170, 180 are set in such a way, that when location probe 310 is positioned in a slit, the corresponding depth probe 155, 156 is limited by settings 115, 116 of depth limiters 110, 120 that corresponds to the slit position (respectively). As a result, dimples in key blank 90 are cut in the appropriate locations and depths as specified by key readers 101, 102 and set in limiters 110, 120.

[0021] Fig 5 is a schematic top view illustration of the operation region of the machine in an operational first state, during the stage of cutting the outer dimples, according to some embodiments of the invention; and Fig. 6 is a schematic top view illustration of the operation region of the machine in an operational state, during the stage of cutting the inner dimples, according to some embodiments of the invention. As illustrated in Fig. 5, location probe 310 in original position 311 mechanically determines the locations of the outer dimples cut by outer dimple cutter 132 (not visible in Fig. 5, see Fig. 6) in key blank 90 according to outer dimple location ruler 180, while outer dimple depth probe 156 mechanically determines the depth of each outer dimple against settings 125. As illustrated in Fig. 6, location probe 310 in original position 311 mechanically determines the locations of the inner dimples cut by inner dimple cutter 131 (not visible in Fig. 6, see Fig. 5) in key blank 90 according to inner dimple location ruler 170, while inner dimple depth probe 155 mechanically determines the depth of each inner dimple against settings 115.

[0022] Figs. 7 and 8 are schematic illustrations of the machine in a standby position in the second state, according to some embodiments of the invention; and Fig. 9 is a illustration of the operation region of the machine in the operational state, in the second state (single dimple), during the stage of cutting dimples according to sample key 95, according to some embodiments of the invention. Figs. 7-9 are perspective views.

[0023] Figs.10- 12 are schematic illustrations of the machine in the operational state, in the second state (single dimple), during the stage of cutting dimples according to sample key 95, according to some embodiments of the invention. Fig .10 is a longitudinal cross section, Fig. 11 is a top view and Fig. 12 is a horizontal cross section. Location probe 310 is exposed in the first mode and arranged to mechanically determine dimple locations, and withdrawn in the second mode. Inner dimple depth probe 155 is arranged in the second mode to mechanically determine both locations and depths of single dimples in sample key 95 (inner dimple depth probe 155 is sharpened such as to fit into the single dimples of sample key 95). Sample key 95 is held by bracket 200 (held by fastener 209 in housing 212 of inner dimple depth limiter 110). Bracket 200 replaces depth limiting tabs 111. An adapter 301 comprising fastener 300 and pin 320 is arranged to allow displacing and fixating location probe 310 in each of the positions 311, 312.

[0024] Figs. 13 A, 13B and 13C are illustrations of a device 400 for adapting a double dimple key cutting machine to additionally cut single dimple keys, according to some embodiments of the invention. Figs. 13A and 13B are exploded views, Fig 13C is a perspective view. Device 400 comprises bracket 200 and adapter 301. Adapter 301 (Fig. 13 A) is connected to location probe 310 of the machine and arranged to disengage, in a single dimple mode, location probe 310 from contacting inner dimple location ruler 170 and outer dimple location ruler 180 of the machine, e.g., by retracting location probe 310 within location probe holder 315 with pin 320.

[0025] Bracket 200 (Figs. 13B and 13C) is arranged to replace depth limiting tabs 111 of inner dimple depth limiter 110 of the machine, and is likewise held by fastener 209 within housing 212 (e.g., fastener 209 passing through an opening 224) of inner dimple depth limiter 110. Bracket 200 is arranged, in the single dimple mode, to hold sample key 95 having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by inner dimple cutter 131 of the machine, according to the single dimples in sample key 95. For example, Bracket 200 may comprise a jaw 221 loaded on a spring 222 against a fastener 211 and fixable by a pin 223.

[0026] Fig. 14 is a high level schematic flowchart of a method of enabling duplication of single dimple keys with a machine for cutting double dimple, according to some embodiments of the invention. The method comprises the following stages: re-mounting a location probe of the machine such as to enable two alternative positions therefor: an original position thereof in the machine; and a second position selected such as to disengage the location probe from contacting the location rulers (stage 410); and replacing a plurality of depth limiting tabs in an inner dimple depth limiter of the machine with a bracket arranged to hold a single dimple sample key in a specified position selected such as to allow to limit an inner dimple cutter of the machine by a inner dimple depth probe of the machine, according to the locations and the depths of single dimples in the sample key (stage 420). The second position of the location probe may be a retracted position.

[0027] The method may further comprise the following stages: applying the inner dimple cutter to cut single dimples in a key blank according to the limits set by the inner dimple depth probe during probing of the locations and the depths of the single dimples in the sample key held by the bracket (stage 430).

[0028] In the above description, an embodiment is an example or implementation of the inventions. The various appearances of "one embodiment," "an embodiment" or "some embodiments" do not necessarily all refer to the same embodiments. [0029] Although various features of the invention may be described in the context of a single embodiment, the features may also be provided separately or in any suitable combination. Conversely, although the invention may be described herein in the context of separate embodiments for clarity, the invention may also be implemented in a single embodiment.

[0030] Reference in the specification to "some embodiments", "an embodiment", "one embodiment" or "other embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiments is included in at least some embodiments, but not necessarily all embodiments, of the inventions.

[0031] It is to be understood that the phraseology and terminology employed herein is not to be construed as limiting and are for descriptive purpose only.

[0032] The principles and uses of the teachings of the present invention may be better understood with reference to the accompanying description, figures and examples.

[0033] It is to be understood that the details set forth herein do not construe a limitation to an application of the invention.

[0034] Furthermore, it is to be understood that the invention can be carried out or practiced in various ways and that the invention can be implemented in embodiments other than the ones outlined in the description above.

[0035] It is to be understood that the terms "including", "comprising", "consisting" and grammatical variants thereof do not preclude the addition of one or more components, features, steps, or integers or groups thereof and that the terms are to be construed as specifying components, features, steps or integers. [0036] If the specification or claims refer to "an additional" element, that does not preclude there being more than one of the additional element.

[0037] It is to be understood that where the claims or specification refer to "a" or "an" element, such reference is not to be construed that there is only one of that element.

[0038] It is to be understood that where the specification states that a component, feature, structure, or characteristic "may", "might", "can" or "could" be included, that particular component, feature, structure, or characteristic is not required to be included.

[0039] Where applicable, although state diagrams, flow diagrams or both may be used to describe embodiments, the invention is not limited to those diagrams or to the corresponding descriptions. For example, flow need not move through each illustrated box or state, or in exactly the same order as illustrated and described.

[0040] Methods of the present invention may be implemented by performing or completing manually, automatically, or a combination thereof, selected steps or tasks.

[0041] The term "method" may refer to maimers, means, techniques and procedures for accomplishing a given task including, but not limited to, those manners, means, techniques and procedures either known to, or readily developed from known manners, means, techniques and procedures by practitioners of the art to which the invention belongs.

[0042] The descriptions, examples, methods and materials presented in the claims and the specification are not to be construed as limiting but rather as illustrative only.

[0043] Meanings of technical and scientific terms used herein are to be commonly understood as by one of ordinary skill in the art to which the invention belongs, unless otherwise defined. [0044] The present invention may be implemented in the testing or practice with methods and materials equivalent or similar to those described herein.

[0045] Any publications, including patents, patent applications and articles, referenced or mentioned in this specification are herein incorporated in their entirety into the specification, to the same extent as if each individual publication was specifically and individually indicated to be incorporated herein. In addition, citation or identification of any reference in the description of some embodiments of the invention shall not be construed as an admission that such reference is available as prior art to the present invention.

[0046] While the invention has been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the invention, but rather as exemplifications of some of the preferred embodiments. Other possible variations, modifications, and applications are also within the scope of the invention. Accordingly, the scope of the invention should not be limited by what has thus far been described, but by the appended claims and their legal equivalents.

Claims

CLAIMS What is claimed is:

1. A dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising:

a location probe, exposed in the first mode and arranged to mechanically determine dimple locations, and withdrawn in the second mode; and

an inner dimple depth probe, arranged in the first mode to mechanically determine inner dimple depths by contacting a plurality of depth limiting tabs held by a fastener in a housing of an inner dimple depth limiter, and arranged in the second mode to mechanically determine both locations and depths of single dimples in a sample key held by a bracket held by the fastener in the housing of the inner dimple depth limiter, the bracket replacing the plurality of depth limiting tabs, wherein the inner dimple depth probe is sharpened such as to fit into the single dimples of the sample key.

2. The dimple key cutting machine of claim 1, as hereinbefore described with reference to the accompanying drawings.

3. A dimple key cutting machine having a first mode for cutting double dimple keys and a second mode for cutting single dimple keys, comprising:

a machine body, comprising:

an outer dimple cutter arranged to cut outer dimples in a key blank; an inner dimple cutter arranged to cut inner dimples in the key blank;

an outer dimple location ruler arranged to limit a cutting location of each outer dimple of double dimple keys by the outer dimple cutter; an inner dimple location ruler arranged to limit a cutting location of each inner dimple of double dimple keys by the inner dimple cutter;

an outer dimple depth limiter, set according to readings of a first key reader and arranged to limit a cutting depth of each outer dimple by the outer dimple cutter; and

an inner dimple depth limiter, comprising a housing and a fastener, and a plurality of depth limiting tabs interchangeable with a bracket, both held by the fastener within the housing, wherein in the first mode the inner dimple depth limiter is set according to readings of a second key reader by setting the plurality of depth limiting tabs, the inner dimple depth limiter arranged to limit a cutting depth of each inner dimple by the inner dimple cutter, and wherein in the second mode, the bracket is arranged to hold a sample key having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by the inner dimple cutter according to the single dimples in the sample key, and

a feeder pivotly hinged on the machine body, the feeder comprising:

an inner dimple depth probe, sharpened such as to fit into the single dimples of the sample key;

an outer dimple depth probe;

a holder holding a key blank; and

a location probe having two operational positions:

a double dimple position in which a location of each outer dimple is determined mechanically by inserting the location probe into a corresponding position in the outer dimple location ruler, and a location of each inner dimple is determined mechanically by inserting the location probe into a corresponding position in the inner dimple location ruler; and a single dimple position in which the location probe is disengaged from contacting the location rulers,

the feeder arranged to allow pushing the key blank sequentially against the inner dimple cutter and the outer dimple cutter in the first mode, and against the inner dimple cutter in the second mode,

wherein in the first mode, locations of the inner dimples and of the outer dimples are mechanically determined by pushing the location probe sequentially against the inner dimple location ruler and the outer dimple location ruler respectively, and depths of the inner dimples and of the outer dimples are mechanically determined by sequentially pushing the inner dimple depth probe against the inner dimple depth limiter and pushing the outer dimple depth probe against the outer dimple depth limiter, and

wherein in the second mode, locations and depths of the single dimples are mechanically determined by pushing the inner dimple depth probe against the sample key held by the bracket in the inner dimple depth limiter.

4. The dimple key cutting machine of claim 3, wherein the location probe is retracted within a location probe holder in the single dimple position.

5. The dimple key cutting machine of claim 3, as hereinbefore described with reference to the accompanying drawings.

6. A device for adapting a double dimple key cutting machine to additionally cut single dimple keys, the device comprising: an adapter connected to a location probe of the machine and arranged to disengage, in a single dimple mode, the location probe from contacting an inner dimple location ruler and an outer dimple location ruler of the machine; and

a bracket arranged to replace a plurality of depth limiting tabs of an inner dimple depth limiter of the machine, and likewise be held by a fastener within a housing of the inner dimple depth limiter, the bracket arranged, in the single dimple mode, to hold a sample key having single dimples, such as to limit a cutting depth and a cutting location of each single dimple by an inner dimple cutter of the machine, according to the single dimples in the sample key,

wherein an inner dimple depth probe of the machine is sharpened such as to fit into the single dimples of the sample key, and

wherein the machine cuts double dimple keys in a double dimple mode, and is arranged to cut single dimple keys in the single dimple mode.

7. The device of claim 6, wherein the adapter is arranged to retract the location probe in the single dimple position.

8. The device of claim 6, as hereinbefore described with reference to the accompanying drawings.

9. A method of enabling duplication of single dimple keys with a machine for cutting double dimple keys, comprising:

re-mounting a location probe of the machine such as to enable two alternative positions therefor: an original position thereof in the machine; and a second position selected such as to disengage the location probe from contacting the location rulers; and replacing a plurality of depth limiting tabs in an inner dimple depth limiter of the machine with a bracket arranged to hold a single dimple sample key in a specified position selected such as to allow to limit an inner dimple cutter of the machine by a inner dimple depth probe of the machine, according to the locations and the depths of single dimples in the sample key.

10. The method of claim 9, further comprising applying the inner dimple cutter to cut single dimples in a key blank according to the limits set by the inner dimple depth probe during probing of the locations and the depths of the single dimples in the sample key held by the bracket.

11. The method of claim 9, wherein the second position of the location probe is a retracted position.

12. The method of claim 9, as hereinbefore described with reference to the accompanying drawings.