WO2011081845A2 - Integrated optical receiver architecture for high speed optical i/o applications - Google Patents

Integrated optical receiver architecture for high speed optical i/o applications Download PDF

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Publication number
WO2011081845A2
WO2011081845A2 PCT/US2010/059852 US2010059852W WO2011081845A2 WO 2011081845 A2 WO2011081845 A2 WO 2011081845A2 US 2010059852 W US2010059852 W US 2010059852W WO 2011081845 A2 WO2011081845 A2 WO 2011081845A2
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WIPO (PCT)
Prior art keywords
recited
silicon
waveguide
layer
mirror structure
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Application number
PCT/US2010/059852
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French (fr)
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WO2011081845A3 (en
Inventor
Ansheng Liu
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Intel Corporation
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Application filed by Intel Corporation filed Critical Intel Corporation
Priority to BR112012016161-0A priority Critical patent/BR112012016161B1/en
Priority to EP10841481.4A priority patent/EP2519846B1/en
Priority to JP2012543306A priority patent/JP5677456B2/en
Priority to KR1020127016814A priority patent/KR101436704B1/en
Publication of WO2011081845A2 publication Critical patent/WO2011081845A2/en
Publication of WO2011081845A3 publication Critical patent/WO2011081845A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • H01L31/1808—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table including only Ge
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G02B6/02004—Optical fibres with cladding with or without a coating characterised by the core effective area or mode field radius
    • G02B6/02009—Large effective area or mode field radius, e.g. to reduce nonlinear effects in single mode fibres
    • G02B6/02023—Based on higher order modes, i.e. propagating modes other than the LP01 or HE11 fundamental mode
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Definitions

  • Embodiments of the present invention are directed to optical receivers and, more particularly, to integrated optical receivers with embedded tapers for improved fiber alignment tolerances.
  • Efficient light coupling between an optical fiber and a silicon waveguide is highly desired for silicon based photonic device and circuit applications. Due to the high refractive index contrast of silicon waveguide systems, obtaining good fiber-silicon waveguide coupling may be challenging.
  • optical communication information is transmitted by way of an optical carrier whose frequency typically is in the visible or near-infrared region of the electromagnetic spectrum.
  • a carrier with such a high frequency is sometimes referred to as an optical signal, an optical carrier, or a lightwave signal.
  • a typical optical communication network includes several optical fibers, each of which may include several channels.
  • a channel is a specified frequency band of an electromagnetic signal, and is sometimes referred to as a wavelength.
  • Technological advances today include optical communication at the integrated circuit (or chip) level. This is because integrated circuits have size advantages that are attractive in computer systems. Sometimes designers couple an optical signal (light) between two chips, between a chip and a die in the system, or between two dies. This is traditionally accomplished using an optical fiber to couple light between waveguides on dies or chips.
  • optical fiber to couple light between waveguides on dies or chips
  • this method of coupling tends to be inefficient.
  • One reason is because of the physical size difference between the optical fiber and a typical waveguide on a chip or die.
  • the optical fiber tends to much larger than the waveguide. Because of the size difference the optical signal coupling efficiency is poor. That is, the light from the larger diameter optical fiber does not fit well into the small waveguide. The result can be that received light levels are so low that individual bits in the data stream in the optical signal become indistinguishable. When this happens, the receiving component may not be able to recover the information from the data stream.
  • Coupling efficiency may be improved by attaching lenses to the optical fiber or by placing a lens between the optical fiber and the waveguide to focus the optical signal into the waveguide.
  • coupling efficiency is only fair using lenses.
  • Other coupling methods result in efficiencies that are also fair at best.
  • the mode is the optical cross-sectional distribution of energy (Gaussian distribution) and is defined by the size of your waveguide (optical fiber, planar waveguide) and the wavelength of the light.
  • MMF multi-mode fiber
  • PD photo-detector
  • the active area of the detector is usually required to be small.
  • a large waveguide size is used for big misalignment tolerance needed for low cost passive alignment.
  • Figure 1 is a cut-away side view of an integrated optical receiver according to one embodiment of the invention.
  • Figure 2 is a view of the silicon on insulator (SOI) substrate for forming the optical receiver shown in Figure 1 ;
  • Figure 3 is a side view of the SOI wafer illustrating etching of the taper
  • Figure 4 is a side view of SOI wafer illustrating etching of the V-groove for the mirror
  • Figure 5 is a side view of the SOI wafer illustrating deposition of an odile layer for the total internal reflection mirror
  • Figure 6 is a side view of the SOI wafer having a silicon wafer bonded on top;
  • Figure 7 is a side view of the SOI shown in Figure 6 flipped over for further silicon photonic processing of the photo-detector (PD) and optional grating as shown in Figure 1 ;
  • PD photo-detector
  • Figure 8 is a graph illustrating modeling optical loss for the V-groove mirror structure of the integrated optical receiver under single mode conditions.
  • Figure 9 is a graph illustrating modeling optical loss for the V-groove mirror structure of the integrated optical receiver under multi-mode conditions.
  • the proposed architecture can be used for both parallel and wavelength division multiplexing (WDM) based optical links with a data rate of 25 Gb/s and beyond.
  • WDM wavelength division multiplexing
  • the optical receiver 100 comprises a silicon wafer portion 102 on which a total internal reflection (TIR) mirror structure 104 is situated.
  • a waveguide portion 106 comprises a wide end into which light from a fiber, such as a multi-mode optical fiber 108 may be input.
  • the light may be focused through a lens 1 10.
  • the waveguide 106 comprises a taper 1 12 where the waveguide narrows from the bottom.
  • the TIR structure comprises a wedge 1 14 having a reflective surface to direct the light, traveling parallel to the substrate 102, is reflected upward to a high speed photo-detector 1 16 as indicated by the arrows.
  • a silicon de-multiplexer 1 18 may also be optionally fabricated into the waveguide 106 as shown.
  • the de-multiplexer may comprise a diffraction grating, such as the etched Echelle grating illustrated.
  • the etched Echelle grating may be capable of de-multiplexing both single-mode and multi- mode beams.
  • This integrated silicon chip shown in Figure 1 may be fabricated on a silicon-on-insulator (SOI) substrate.
  • SOI silicon-on-insulator
  • the demultiplexer may not be included.
  • the silicon taper 1 12 input has a height of 20-30 urn at the wide end for efficient coupling between the MMF 108 and the chip with a plastic lens 1 10.
  • the final waveguide 106 height after the taper is ⁇ 10 urn.
  • the taper may be fabricated, for example by using a grayscale technology as described in Optics Express vol. 1 1 , no. 26, 3555-3561 (2003), herein
  • the TIR reflection mirror portion 104 is used to couple light from the waveguide vertically to a high-speed germanium (Ge) detector 1 16 grown on top of silicon.
  • Ge germanium
  • the fabrication technique of such a Ge PD 1 16 is well established. Because the light from the tapered waveguide incident into the Ge PD can be reflected from the metal contact on top of the Ge layer in the detector, double optical path is achieved in the Ge active region. This leads to higher quantum efficiency with a thinner Ge film for higher speed.
  • the estimated speed of the detector with a Ge thickness of ⁇ 1 .5 urn is >20 GHz, good for 25 Gb/s applications.
  • a silicon on insulator (SOI) wafer comprises a silicon substrate a buried oxide (BOX) layer 202 and a silicon handle layer 204 on the BOX layer 202.
  • the Si layer 204 may be approximately 20-30um thick. This thickness of course may differ for differing applications.
  • a sacrificial oxide hard mask (HM) layer 206 may be on top of the Si layer 204.
  • the taper portion of the waveguide from Figure 1 is etched through the HM layer 206 and partway through the Si layer 204 to an etch depth of approximately 10um.
  • the etched portion may be generally rectangular at one end and tapered at the other.
  • a V-groove 400 may be further etched from the Si layer 204 for later forming of the wedge mirror 1 14 shown in Figure 1 .
  • the V-groove 400 may be etched, for example, with a Potassium Hydroxide (KOH) wet etch technique.
  • KOH Potassium Hydroxide
  • the V-groove 400 etch may in some embodiments reach the buried oxide (BOX) 202 or leaves a thin silicon layer (0.5-1 urn) for Ge growth later.
  • the etched trenches are filled with oxide 500 followed by chemical mechanical planarization (CMP).
  • the oxide comprises the total internal reflection (TIR) mirror shown in Figure 1 .
  • the planarized wafer will be wafer-bonded with a separate silicon wafer 102.
  • the original handle wafer 200 of the SOI wafer will be removed.
  • the entire apparatus may be flipped over. Removal of the handle wafer 200 creates a new wafer with BOX 202 as a hard mask.
  • the hard mask (HM) BOX layer 202 may be used for further process of Echelle grating 1 18 and Ge photo-detector (PD) as shown in Figure 1 , the processing techniques of which are well known in the art.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Communication System (AREA)
  • Light Receiving Elements (AREA)

Abstract

An integrated optical receiver architecture may be used to couple light between a multi-mode fiber (MMF) and silicon chip which includes integration of a silicon de-multiplexer and a high-speed Ge photo-detector. The proposed architecture may be used for both parallel and wavelength division multiplexing (WDM) based optical links with a data rate of 25 Gb/s and beyond.

Description

INTEGRATED OPTICAL RECEIVER ARCHITECTURE FOR HIGH SPEED
OPTICAL I/O APPLICATIONS
FIELD OF THE INVENTION
Embodiments of the present invention are directed to optical receivers and, more particularly, to integrated optical receivers with embedded tapers for improved fiber alignment tolerances.
BACKGROUND INFORMATION
Efficient light coupling between an optical fiber and a silicon waveguide is highly desired for silicon based photonic device and circuit applications. Due to the high refractive index contrast of silicon waveguide systems, obtaining good fiber-silicon waveguide coupling may be challenging.
In optical communication, information is transmitted by way of an optical carrier whose frequency typically is in the visible or near-infrared region of the electromagnetic spectrum. A carrier with such a high frequency is sometimes referred to as an optical signal, an optical carrier, or a lightwave signal. A typical optical communication network includes several optical fibers, each of which may include several channels. A channel is a specified frequency band of an electromagnetic signal, and is sometimes referred to as a wavelength.
Technological advances today include optical communication at the integrated circuit (or chip) level. This is because integrated circuits have size advantages that are attractive in computer systems. Sometimes designers couple an optical signal (light) between two chips, between a chip and a die in the system, or between two dies. This is traditionally accomplished using an optical fiber to couple light between waveguides on dies or chips.
One limitation of using the optical fiber to couple light between waveguides on dies or chips is that this method of coupling tends to be inefficient. One reason is because of the physical size difference between the optical fiber and a typical waveguide on a chip or die. The optical fiber tends to much larger than the waveguide. Because of the size difference the optical signal coupling efficiency is poor. That is, the light from the larger diameter optical fiber does not fit well into the small waveguide. The result can be that received light levels are so low that individual bits in the data stream in the optical signal become indistinguishable. When this happens, the receiving component may not be able to recover the information from the data stream.
Coupling efficiency may be improved by attaching lenses to the optical fiber or by placing a lens between the optical fiber and the waveguide to focus the optical signal into the waveguide. However, coupling efficiency is only fair using lenses. Other coupling methods result in efficiencies that are also fair at best.
This limitation also comes with another challenge such as efficient coupling from the optical mode supported by the larger optical fiber to the smaller optical mode supported by the waveguide. The mode is the optical cross-sectional distribution of energy (Gaussian distribution) and is defined by the size of your waveguide (optical fiber, planar waveguide) and the wavelength of the light. There is a large optical mode in the larger optical fiber and a smaller optical mode in the smaller waveguide.
Also coupling from an optical fiber to small on-die waveguides requires very precise alignment. This is typically accomplished with specialized precise manual alignment procedures. Such specialized alignment procedures typically are very expensive and limit practical volumes.
Today, there is a fundamental problem existing for a low-cost multi-mode fiber (MMF) based optical receiver for high speed applications. To achieve high speed, for example 25 Gb/s and beyond, operation for a photo-detector (PD), the active area of the detector is usually required to be small. However, to efficiently couple light from MMF into a semiconductor waveguide based chip that contains photo-detectors and potentially an optical de-multiplexer, a large waveguide size is used for big misalignment tolerance needed for low cost passive alignment.
BRIEF DESCRIPTION OF THE DRAWINGS
The foregoing and a better understanding of the present invention may become apparent from the following detailed description of arrangements and example embodiments and the claims when read in connection with the
accompanying drawings, all forming a part of the disclosure of this invention.
While the foregoing and following written and illustrated disclosure focuses on disclosing arrangements and example embodiments of the invention, it should be clearly understood that the same is by way of illustration and example only and the invention is not limited thereto. Figure 1 is a cut-away side view of an integrated optical receiver according to one embodiment of the invention;
Figure 2 is a view of the silicon on insulator (SOI) substrate for forming the optical receiver shown in Figure 1 ;
Figure 3 is a side view of the SOI wafer illustrating etching of the taper;
Figure 4 is a side view of SOI wafer illustrating etching of the V-groove for the mirror;
Figure 5 is a side view of the SOI wafer illustrating deposition of an odile layer for the total internal reflection mirror;
Figure 6 is a side view of the SOI wafer having a silicon wafer bonded on top;
Figure 7 is a side view of the SOI shown in Figure 6 flipped over for further silicon photonic processing of the photo-detector (PD) and optional grating as shown in Figure 1 ;
Figure 8 is a graph illustrating modeling optical loss for the V-groove mirror structure of the integrated optical receiver under single mode conditions; and
Figure 9 is a graph illustrating modeling optical loss for the V-groove mirror structure of the integrated optical receiver under multi-mode conditions.
DETAILED DESCRIPTION
Described is an integrated receiver optical receiver architecture to address light coupling between a multi-mode fiber (MMF) and silicon chip as well as integration of silicon de-multiplexer and a high-speed photo-detector. The proposed architecture can be used for both parallel and wavelength division multiplexing (WDM) based optical links with a data rate of 25 Gb/s and beyond.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Referring now to Figure 1 , there is shown the optical receiver according to one embodiment of the invention. The optical receiver 100 comprises a silicon wafer portion 102 on which a total internal reflection (TIR) mirror structure 104 is situated. A waveguide portion 106 comprises a wide end into which light from a fiber, such as a multi-mode optical fiber 108 may be input. The light may be focused through a lens 1 10. The waveguide 106 comprises a taper 1 12 where the waveguide narrows from the bottom. The TIR structure comprises a wedge 1 14 having a reflective surface to direct the light, traveling parallel to the substrate 102, is reflected upward to a high speed photo-detector 1 16 as indicated by the arrows. A silicon de-multiplexer 1 18 may also be optionally fabricated into the waveguide 106 as shown. For example the de-multiplexer may comprise a diffraction grating, such as the etched Echelle grating illustrated. The etched Echelle grating may be capable of de-multiplexing both single-mode and multi- mode beams.
This integrated silicon chip shown in Figure 1 , may be fabricated on a silicon-on-insulator (SOI) substrate. For parallel link applications, the demultiplexer may not be included. The silicon taper 1 12 input has a height of 20-30 urn at the wide end for efficient coupling between the MMF 108 and the chip with a plastic lens 1 10. The final waveguide 106 height after the taper is ~10 urn. The taper may be fabricated, for example by using a grayscale technology as described in Optics Express vol. 1 1 , no. 26, 3555-3561 (2003), herein
incorporated by reference.
Note that the final waveguide size should probably not be small because of the possible modal filtering effect (optical loss) for a multi mode beam launched from the MMF 108. The TIR reflection mirror portion 104 is used to couple light from the waveguide vertically to a high-speed germanium (Ge) detector 1 16 grown on top of silicon. The fabrication technique of such a Ge PD 1 16 is well established. Because the light from the tapered waveguide incident into the Ge PD can be reflected from the metal contact on top of the Ge layer in the detector, double optical path is achieved in the Ge active region. This leads to higher quantum efficiency with a thinner Ge film for higher speed. The estimated speed of the detector with a Ge thickness of ~1 .5 urn is >20 GHz, good for 25 Gb/s applications. Figures 2-7 illustrate the fabrication steps of the proposed integrated silicon receiver chip according to one embodiment. Referring now to Figure 2, a silicon on insulator (SOI) wafer comprises a silicon substrate a buried oxide (BOX) layer 202 and a silicon handle layer 204 on the BOX layer 202. In one embodiment, the Si layer 204 may be approximately 20-30um thick. This thickness of course may differ for differing applications. A sacrificial oxide hard mask (HM) layer 206 may be on top of the Si layer 204.
In Figure 3, the taper portion of the waveguide from Figure 1 is etched through the HM layer 206 and partway through the Si layer 204 to an etch depth of approximately 10um. The etched portion may be generally rectangular at one end and tapered at the other. In Figure 4, a V-groove 400 may be further etched from the Si layer 204 for later forming of the wedge mirror 1 14 shown in Figure 1 . The V-groove 400 may be etched, for example, with a Potassium Hydroxide (KOH) wet etch technique. The V-groove 400 etch may in some embodiments reach the buried oxide (BOX) 202 or leaves a thin silicon layer (0.5-1 urn) for Ge growth later.
In Figure 5, the etched trenches are filled with oxide 500 followed by chemical mechanical planarization (CMP). The oxide comprises the total internal reflection (TIR) mirror shown in Figure 1 .
In Figure 6 the planarized wafer will be wafer-bonded with a separate silicon wafer 102. After the wafer bonding, the original handle wafer 200 of the SOI wafer will be removed. As shown in Figure 7, the entire apparatus may be flipped over. Removal of the handle wafer 200 creates a new wafer with BOX 202 as a hard mask. The hard mask (HM) BOX layer 202 may be used for further process of Echelle grating 1 18 and Ge photo-detector (PD) as shown in Figure 1 , the processing techniques of which are well known in the art.
Referring now to Figures 8 and 9, the optical loss of the V groove mirror structure is modeled under single mode and multi mode launching conditions, respectively. With a V-groove angle of 54.7°, the single mode case of Figure 8 shows that there is almost no optical loss. As shown in Figure 9, for the multi- mode case with 0-5 modes launching there is low at only -0.36dB. It is also noted that even with a silicon layer of 1 urn un-etched for the V groove mirror, optical loss is still small. Namely, most of the light is reflected at the mirror facet and directed to the PD 1 16.
The above description of illustrated embodiments of the invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize.
These modifications can be made to the invention in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification and the claims. Rather, the scope of the invention is to be
determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation.

Claims

CLAIMS What is claimed is:
1 . An apparatus, comprising:
a silicon substrate;
a total internal reflection (TIR) mirror structure over the silicon substrate, the TIR mirror structure comprising a first portion and a second portion thicker than the first portion;
a taper portion transitioning between the first portion and the second portion of the TIR mirror structure;
a V-groove wedge integral to the second portion of the TIR mirror structure; a waveguide on top of the TIR mirror structure; and
a photo-detector (PD) fabricated over the waveguide proximate to the V- groove wedge.
2. The apparatus as recited in claim 1 further comprising:
a de-multiplexer formed in the waveguide in front of the V-groove wedge.
3. The apparatus as recited in claim 1 wherein the photo-detector comprises a high speed Germanium photo-detector.
4. The apparatus as recited in claim 2 wherein the de-multiplexer comprises a diffraction grating.
5. The apparatus as recited in claim 4 wherein the diffraction grating comprises an etched Echelle grating capable of de-multiplexing both single-mode and multi- mode beams.
6. The apparatus as recited in claim 1 wherein the waveguide comprises an input end approximately 20-30um in thickness.
7. The apparatus as recited in claim 6 wherein the thickness after the taper is approximately 10um in thickness.
8. A method for fabricating an integrated optical receiver comprising:
providing a silicon on insulator (SOI) wafer comprising a silicon handle layer, a buried oxide (BOX) layer, a silicon waveguide layer and a hard mask (HM) oxide layer;
etching a taper in the HM layer and the silicon waveguide layer;
etching a V-groove in a portion of the silicon layer; filling taper and the V-groove with oxide to form a total internal reflection (TIR) mirror structure;
planarizing the TIR mirror structure;
bonding a silicon wafer to the TIR mirror structure;
flipping the SOI wafer over;
removing the silicon handle layer; and
fabricating a high-speed photo-detector (PD) over the V-groove.
9. The method as recited in claim 8, further comprising:
fabricating a de-multiplexer in the silicon waveguide layer.
10. The method as recited in claim 8 wherein the photo-detector comprises a germanium (Ge) photodetector.
1 1 . The method as recited in claim 9 wherein the de-multiplexer comprises a diffraction grating.
12. The method as recited in claim 1 1 wherein the diffraction grating comprises an etched Echelle grating capable of de-multiplexing both single-mode and multi- mode beams.
13. The method as recited in claim 8 wherein the taper comprises a wide end approximately 20-30um in thickness and a narrower end approximately 10um in thickness.
14. The method as recited in claim 8 wherein the V-groove is etched to the BOX layer.
15. The method as recited in claim 8 wherein the V-groove is etched short of the BOX layer.
16. An integrated optical receiver system, comprising:
a silicon substrate;
a total internal reflection (TIR) mirror structure over the silicon substrate; a silicon waveguide over the TIR mirror structure, the silicon waveguide having an wide input end that tapers to a narrower end, the input end to receive light from a multi-mode fiber;
a photodetector fabricated over a portion of the narrower end of the waveguide; and
a wedge portion on the TIR mirror structure beneath the photodetector to reflect light up to the photodetector.
17. The system as recited in claim 16 further comprising:
a lens between the multi-mode fiber and the silicon waveguide input end.
18. The system as recited in claim 16, further comprising;
a demultiplexer formed in the waveguide prior to the wedge.
19. The system as recited in claim 16 wherein the photodetector is a germanium photodetector.
20. The system as recited in claim 18 wherein the demultiplexer is an Echelle grating.
PCT/US2010/059852 2009-12-31 2010-12-10 Integrated optical receiver architecture for high speed optical i/o applications WO2011081845A2 (en)

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BR112012016161-0A BR112012016161B1 (en) 2009-12-31 2010-12-10 Equipment and method for manufacturing an integrated optical receiver
EP10841481.4A EP2519846B1 (en) 2009-12-31 2010-12-10 Integrated optical receiver architecture for high speed optical i/o applications
JP2012543306A JP5677456B2 (en) 2009-12-31 2010-12-10 Integrated receiver architecture, method and system for high speed optical I / O applications
KR1020127016814A KR101436704B1 (en) 2009-12-31 2010-12-10 Integrated optical receiver architecture for high speed optical i/o applications

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US12/651,314 US8319237B2 (en) 2009-12-31 2009-12-31 Integrated optical receiver architecture for high speed optical I/O applications
US12/651,314 2009-12-31

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
US8319237B2 (en) 2009-12-31 2012-11-27 Intel Corporation Integrated optical receiver architecture for high speed optical I/O applications

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Publication number Priority date Publication date Assignee Title
US8437585B2 (en) * 2010-12-07 2013-05-07 Intel Corporation Low-cost passive optical waveguide using Si substrate
CN103543503B (en) * 2011-08-16 2016-03-09 硅光电科技股份有限公司 A kind of optical devices with monolithic optical module based on total internal reflection surface
CN103998961A (en) * 2011-09-29 2014-08-20 英特尔公司 Vertical optical coupler for planar photonic circuits
WO2014142795A1 (en) * 2013-03-11 2014-09-18 Intel Corporation Low voltage avalanche photodiode with re-entrant mirror for silicon based photonic integrated circuits
DE112013007697B4 (en) 2013-12-20 2021-12-09 Intel Corporation Photodetector with a tapered waveguide structure and method and system
US9231131B2 (en) 2014-01-07 2016-01-05 International Business Machines Corporation Integrated photodetector waveguide structure with alignment tolerance
JP6427992B2 (en) 2014-06-30 2018-11-28 富士通株式会社 Optical transmission system, transmitter, receiver, and optical transmission method
US9250388B1 (en) * 2014-07-17 2016-02-02 Intel Corporation Optical device using echelle grating that provides total internal reflection of light
US9348099B2 (en) * 2014-07-18 2016-05-24 Intel Corporation Optical coupler
US9772463B2 (en) 2014-09-04 2017-09-26 International Business Machines Corporation Intra chip optical interconnect structure
KR102284657B1 (en) 2015-01-05 2021-08-02 삼성전자 주식회사 Photodiode and optical communication system including the same
US9864138B2 (en) 2015-01-05 2018-01-09 The Research Foundation For The State University Of New York Integrated photonics including germanium
US9704916B2 (en) 2015-07-24 2017-07-11 Artilux Inc. Multi-wafer based light absorption apparatus and applications thereof
US10644187B2 (en) 2015-07-24 2020-05-05 Artilux, Inc. Multi-wafer based light absorption apparatus and applications thereof
US9910232B2 (en) * 2015-10-21 2018-03-06 Luxtera, Inc. Method and system for a chip-on-wafer-on-substrate assembly
KR102604742B1 (en) 2015-12-23 2023-11-22 삼성전자주식회사 Optical device and method for manufacturing the same
US10976491B2 (en) 2016-11-23 2021-04-13 The Research Foundation For The State University Of New York Photonics interposer optoelectronics
US10698156B2 (en) 2017-04-27 2020-06-30 The Research Foundation For The State University Of New York Wafer scale bonded active photonics interposer
US10197737B2 (en) 2017-06-19 2019-02-05 Intel Corporation Low back reflection echelle grating
US10775559B2 (en) * 2018-01-26 2020-09-15 Analog Photonics LLC Photonics fabrication process performance improvement
GB2572426B (en) 2018-03-29 2021-05-12 Rockley Photonics Ltd Waveguide mirror and method of fabricating a waveguide mirror
GB2594152B (en) * 2018-03-29 2022-03-02 Rockley Photonics Ltd Waveguide mirror and method of fabricating a waveguide mirror
US10877300B2 (en) 2018-04-04 2020-12-29 The Research Foundation For The State University Of New York Heterogeneous structure on an integrated photonics platform
US10816724B2 (en) 2018-04-05 2020-10-27 The Research Foundation For The State University Of New York Fabricating photonics structure light signal transmission regions
US10914892B2 (en) * 2018-10-18 2021-02-09 Cisco Technology, Inc. Germanium photodetector coupled to a waveguide
US11029466B2 (en) 2018-11-21 2021-06-08 The Research Foundation For The State University Of New York Photonics structure with integrated laser
US11550099B2 (en) 2018-11-21 2023-01-10 The Research Foundation For The State University Of New York Photonics optoelectrical system
GB2580092B (en) * 2018-12-21 2022-11-16 Univ Southampton Photonic chip and method of manufacture
GB2583348A (en) * 2019-04-24 2020-10-28 Univ Southampton Photonic chip and method of manufacture
US10996408B2 (en) * 2019-07-19 2021-05-04 Intel Corporation Optical device including buried optical waveguides and output couplers
US11428870B2 (en) * 2020-06-15 2022-08-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and method of fabricating the same
CN111947640B (en) * 2020-07-10 2023-03-14 中国航空工业集团公司西安飞行自动控制研究所 Silicon optical coupling component, silicon optical integrated module and integrated resonant fiber optic gyroscope

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696536A (en) 1985-07-01 1987-09-29 The United States Of America As Represented By The Secretary Of The Navy Integrated optical wavelength demultiplexer
US5394490A (en) 1992-08-11 1995-02-28 Hitachi, Ltd. Semiconductor device having an optical waveguide interposed in the space between electrode members
US6801550B1 (en) 2003-05-30 2004-10-05 Bae Systems Information And Electronic Systems Integration Inc. Multiple emitter side pumping method and apparatus for fiber lasers
US6808957B1 (en) 2003-07-31 2004-10-26 Chunghwa Telecom Co., Ltd. Method for improving a high-speed edge-coupled photodetector

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5054871A (en) * 1990-07-02 1991-10-08 Bell Communications Research, Inc. Semiconductor waveguide and impedance-matched detector
US5391869A (en) * 1993-03-29 1995-02-21 United Technologies Corporation Single-side growth reflection-based waveguide-integrated photodetector
US5835517A (en) * 1996-10-04 1998-11-10 W. L. Gore & Associates, Inc. WDM multiplexer-demultiplexer using Fabry-Perot filter array
KR100277695B1 (en) * 1998-09-12 2001-02-01 정선종 Method for manufacturing a substrate for hybrid optical integrated circuit using S-O optical waveguide
US20020110328A1 (en) * 2001-02-14 2002-08-15 Bischel William K. Multi-channel laser pump source for optical amplifiers
WO2002073256A1 (en) * 2001-02-28 2002-09-19 Nec Corporation Optical circuit element and production method therefor, array-form optical circuit element, optical circuit device using it
JP2003167175A (en) * 2001-12-04 2003-06-13 Matsushita Electric Ind Co Ltd Optical mounted substrate and optical device
US7203387B2 (en) * 2003-09-10 2007-04-10 Agency For Science, Technology And Research VLSI-photonic heterogeneous integration by wafer bonding
US7636522B2 (en) * 2004-04-15 2009-12-22 Infinera Corporation Coolerless photonic integrated circuits (PICs) for WDM transmission networks and PICs operable with a floating signal channel grid changing with temperature but with fixed channel spacing in the floating grid
JP2006053471A (en) * 2004-08-16 2006-02-23 Sony Corp Optical waveguide device, fabrication method thereof and optical information processing apparatus
US7391520B2 (en) * 2005-07-01 2008-06-24 Carl Zeiss Meditec, Inc. Fourier domain optical coherence tomography employing a swept multi-wavelength laser and a multi-channel receiver
CN102089689B (en) * 2008-05-09 2015-03-11 惠普开发有限公司 Optical splitter device
US8319237B2 (en) 2009-12-31 2012-11-27 Intel Corporation Integrated optical receiver architecture for high speed optical I/O applications

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4696536A (en) 1985-07-01 1987-09-29 The United States Of America As Represented By The Secretary Of The Navy Integrated optical wavelength demultiplexer
US5394490A (en) 1992-08-11 1995-02-28 Hitachi, Ltd. Semiconductor device having an optical waveguide interposed in the space between electrode members
US6801550B1 (en) 2003-05-30 2004-10-05 Bae Systems Information And Electronic Systems Integration Inc. Multiple emitter side pumping method and apparatus for fiber lasers
US6808957B1 (en) 2003-07-31 2004-10-26 Chunghwa Telecom Co., Ltd. Method for improving a high-speed edge-coupled photodetector

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ANITA SURE ET AL.: "Fabrication and characterization of three-dimensional silicon taperslntegrated Optical Modeshape Adapters in InGaAsP/InP for efficient Fiber-to-Waveguide Coupling", PHYS. OPT. LETT. (ACCEPTED ELECTRON. LETT. IEEE PHOTON. TECHNOL. LETT. IEEE PHOTON. TECHNOL. LETT. CONF. INTEGRATED OPTICS ELECTRON. LETT. IEEE J. SEL. TOP. QUANTUM ELECTRON. IEEE J. LIGHTWAVE TECHNOL. OPT. LETT.IEEE PHOTON. TECHNOL. LETT. OPTICS EXP, 29 December 2003 (2003-12-29), pages 582 - 584, XP055175430
See also references of EP2519846A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8319237B2 (en) 2009-12-31 2012-11-27 Intel Corporation Integrated optical receiver architecture for high speed optical I/O applications
US9076902B2 (en) 2009-12-31 2015-07-07 Intel Corporation Integrated optical receiver architecture for high speed optical I/O applications

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