WO2011078507A3 - 절곡형 방열부재 - Google Patents

절곡형 방열부재 Download PDF

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Publication number
WO2011078507A3
WO2011078507A3 PCT/KR2010/008878 KR2010008878W WO2011078507A3 WO 2011078507 A3 WO2011078507 A3 WO 2011078507A3 KR 2010008878 W KR2010008878 W KR 2010008878W WO 2011078507 A3 WO2011078507 A3 WO 2011078507A3
Authority
WO
WIPO (PCT)
Prior art keywords
bent
heat
type heat
heat dissipater
dissipater
Prior art date
Application number
PCT/KR2010/008878
Other languages
English (en)
French (fr)
Other versions
WO2011078507A2 (ko
Inventor
조장형
Original Assignee
쎄딕(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쎄딕(주) filed Critical 쎄딕(주)
Priority to US13/518,689 priority Critical patent/US20120298346A1/en
Publication of WO2011078507A2 publication Critical patent/WO2011078507A2/ko
Publication of WO2011078507A3 publication Critical patent/WO2011078507A3/ko

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Building Environments (AREA)

Abstract

본 발명에 따른 절곡형 방열부재는, 일 방향에서 전달되는 열을 외기와 함께 반대 방향으로 배출하기 위해, 중앙에 유로를 형성하는 하나 또는 다수의 냉각홀을 갖는 방열판 및, 상기 방열판에 일체로 절곡 형성되는 하나 또는 다수의 방열핀을 포함한다.
PCT/KR2010/008878 2009-12-24 2010-12-13 절곡형 방열부재 WO2011078507A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/518,689 US20120298346A1 (en) 2009-12-24 2010-12-13 Bent-type heat dissipater

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090130385A KR100970747B1 (ko) 2009-12-24 2009-12-24 절곡형 방열부재
KR10-2009-0130385 2009-12-24

Publications (2)

Publication Number Publication Date
WO2011078507A2 WO2011078507A2 (ko) 2011-06-30
WO2011078507A3 true WO2011078507A3 (ko) 2011-10-20

Family

ID=42645700

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008878 WO2011078507A2 (ko) 2009-12-24 2010-12-13 절곡형 방열부재

Country Status (3)

Country Link
US (1) US20120298346A1 (ko)
KR (1) KR100970747B1 (ko)
WO (1) WO2011078507A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2479423A (en) * 2010-04-09 2011-10-12 Lemnis Lighting Patent Holding B V LED lamp with heat removal body
KR101308694B1 (ko) 2011-04-29 2013-09-13 주식회사 태종 엘이디조명등기구
KR101281340B1 (ko) * 2011-12-26 2013-07-02 주식회사 포스코 방열구조를 가지는 인쇄회로기판 및 이를 포함하는 ｌｅｄ 조명장치
CN104520640B (zh) * 2012-08-07 2018-03-23 飞利浦照明控股有限公司 包括散热器结构的照明设备
WO2014037844A1 (en) * 2012-09-05 2014-03-13 Koninklijke Philips N.V A heat dissipation structure, a lighting device provided with the same and a method of manufacturing the same
JP2016066694A (ja) * 2014-09-24 2016-04-28 株式会社東芝 ヒートシンク及び照明装置
CN106918027B (zh) * 2017-05-09 2023-08-01 红壹佰照明有限公司 一种散热器及灯

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030000818A (ko) * 2001-06-27 2003-01-06 원진전자(주) 집적 회로용 냉각 장치 어셈블리 및 그 제조 방법
JP2008103195A (ja) * 2006-10-19 2008-05-01 Matsushita Electric Works Ltd Ｌｅｄ照明装置
KR20090033432A (ko) * 2009-03-16 2009-04-03 최재민 파워 엘이디를 사용한 가로등

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US8240871B2 (en) * 2007-09-27 2012-08-14 Enertron, Inc. Method and apparatus for thermally effective removable trim for light fixture
TW200940881A (en) * 2008-03-18 2009-10-01 Pan Jit Internat Inc LED lamp with thermal convection and thermal conduction heat dissipating effect, and heat dissipation module thereof
JP4957927B2 (ja) * 2009-05-29 2012-06-20 東芝ライテック株式会社 電球形ランプおよび照明器具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030000818A (ko) * 2001-06-27 2003-01-06 원진전자(주) 집적 회로용 냉각 장치 어셈블리 및 그 제조 방법
JP2008103195A (ja) * 2006-10-19 2008-05-01 Matsushita Electric Works Ltd Ｌｅｄ照明装置
KR20090033432A (ko) * 2009-03-16 2009-04-03 최재민 파워 엘이디를 사용한 가로등

Also Published As

Publication number Publication date
KR100970747B1 (ko) 2010-07-16
WO2011078507A2 (ko) 2011-06-30
US20120298346A1 (en) 2012-11-29

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