WO2011070495A1 - Composant électronique comportant une enveloppe de protection et procédé de production correspondant - Google Patents

Composant électronique comportant une enveloppe de protection et procédé de production correspondant Download PDF

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Publication number
WO2011070495A1
WO2011070495A1 PCT/IB2010/055576 IB2010055576W WO2011070495A1 WO 2011070495 A1 WO2011070495 A1 WO 2011070495A1 IB 2010055576 W IB2010055576 W IB 2010055576W WO 2011070495 A1 WO2011070495 A1 WO 2011070495A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
casing
volume
mass
protection casing
Prior art date
Application number
PCT/IB2010/055576
Other languages
English (en)
Inventor
Rudi Boz
Marco Pagan
Original Assignee
Osram Gesellschaft mit beschränkter Haftung
Osram S.P.A. - Societa' Riunite Osram Edison Clerici
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gesellschaft mit beschränkter Haftung, Osram S.P.A. - Societa' Riunite Osram Edison Clerici filed Critical Osram Gesellschaft mit beschränkter Haftung
Publication of WO2011070495A1 publication Critical patent/WO2011070495A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This disclosure relates to techniques for producing electronic components provided with protection casings.
  • these components are provided with a protection casing, which is filled with a resinous mass currently known as "potting" mass.
  • potting a resinous mass currently known as "potting" mass.
  • the object of the invention is to overcome the previously described disadvantage, therefore allowing the production of electronic components which, albeit provided with a protection casing, are not subjected to drawbacks as concerns their spark gap behaviour.
  • volume VI is filled with air and is surrounded by a volume V2, which is filled with a potting mass
  • V which is filled with a potting mass
  • the presently disclosed solution makes use of this very feature, by surrounding component 10, as regards the internal volume of casing 12, with an air buffer (and not with a potting mass, which would be likely to worsen the spark gap characteristics of component 10) .

Abstract

L'invention concerne un composant électrique (10) qui comprend un corps de composant contenu dans une enveloppe de protection (12) et destiné à être monté sur une carte à circuit imprimé par une technique d'insertion en force de connexions (PIH), ou par la technologie de montage en surface (CMS). L'enveloppe (12) définit autour du corps du composant (10) un volume qui est laissé vide au lieu d'être rempli d'une masse d'enrobage, c.-à-d. rempli d'un volume de gaz, pour éviter d'aggraver les caractéristiques d'éclateur en cas de déclenchement d'arcs électriques.
PCT/IB2010/055576 2009-12-07 2010-12-03 Composant électronique comportant une enveloppe de protection et procédé de production correspondant WO2011070495A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTO2009A000962 2009-12-07
ITTO20090962 2009-12-07

Publications (1)

Publication Number Publication Date
WO2011070495A1 true WO2011070495A1 (fr) 2011-06-16

Family

ID=42357622

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/055576 WO2011070495A1 (fr) 2009-12-07 2010-12-03 Composant électronique comportant une enveloppe de protection et procédé de production correspondant

Country Status (1)

Country Link
WO (1) WO2011070495A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0122687A2 (fr) * 1983-03-18 1984-10-24 Mitsubishi Denki Kabushiki Kaisha Un dispositif semi-conducteur comprenant un empaquetage pour protéger des parties du dispositif
WO1994022168A1 (fr) * 1993-03-19 1994-09-29 Olin Corporation Boitier a systeme de reseau de billes pour dispositif electronique
US6111199A (en) * 1998-04-07 2000-08-29 Integrated Device Technology, Inc. Integrated circuit package using a gas to insulate electrical conductors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0122687A2 (fr) * 1983-03-18 1984-10-24 Mitsubishi Denki Kabushiki Kaisha Un dispositif semi-conducteur comprenant un empaquetage pour protéger des parties du dispositif
WO1994022168A1 (fr) * 1993-03-19 1994-09-29 Olin Corporation Boitier a systeme de reseau de billes pour dispositif electronique
US6111199A (en) * 1998-04-07 2000-08-29 Integrated Device Technology, Inc. Integrated circuit package using a gas to insulate electrical conductors

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