WO2011064934A1

WO2011064934A1 - Sound damping component for ultrasonic probe, ultrasonic probe, and ultrasonic probe manufacturing method

Info

Publication number: WO2011064934A1
Application number: PCT/JP2010/006066
Authority: WO
Inventors: 雅己浅野
Original assignee: コニカミノルタエムジー株式会社
Priority date: 2009-11-30
Filing date: 2010-10-13
Publication date: 2011-06-03
Also published as: JPWO2011064934A1; JP5348250B2

Abstract

Disclosed are a sound damping component for ultrasonic probe, an ultrasonic probe, and an ultrasonic probe manufacturing method. Multiple through-holes (14A) penetrating a sound dampening body (13a) are formed with a drill, and conductive bodies (14) are formed in each of the through-holes (14A). Then, a first electrode unit (141) for connection to a piezoelectric element drive electrode is formed in each of the conductive bodies (14) on the entry side of the aforementioned drill. By this means, a sound dampening component, an ultrasonic probe and a manufacturing method thereof can be provided such that the piezoelectric element drive electrode can be connected to the signal line, which is on the drill entry side.

Description

Acoustic braking component for ultrasonic probe, ultrasonic probe, and method of manufacturing ultrasonic probe

The present invention relates to an acoustic braking component for an ultrasonic probe used in an ultrasonic probe including a plurality of piezoelectric elements. The present invention relates to an ultrasonic probe using the acoustic braking component for an ultrasonic probe. The present invention also relates to an ultrasonic probe manufacturing method for manufacturing such an ultrasonic probe.

Ultrasound generally refers to sound waves of 16000 Hz or higher, and can be examined non-destructively, harmlessly, and in real time, so that it is applied to various fields such as defect inspection and disease diagnosis. . One of them is an ultrasound that scans the inside of the subject with ultrasound and images the internal state of the subject based on a received signal generated from the reflected wave (echo) of the ultrasound coming from inside the subject. There is an ultrasound diagnostic device. This ultrasonic diagnostic apparatus is smaller and less expensive for medical use than other medical imaging apparatuses, has no radiation exposure such as X-rays, is highly safe, and has a blood effect using the Doppler effect. It has various features such as the ability to display flow. For this reason, the ultrasonic diagnostic apparatus includes a circulatory system (eg, coronary artery of the heart), a digestive system (eg, gastrointestinal), an internal system (eg, liver, pancreas, and spleen), and a urinary system (eg, kidney and bladder). Widely used in obstetrics and gynecology.

In this ultrasonic diagnostic apparatus, an ultrasonic probe that transmits and receives an ultrasonic wave (ultrasonic signal) to a subject is used. This ultrasonic probe uses a piezoelectric phenomenon to generate an ultrasonic wave by mechanical vibration based on an electric signal transmitted, and to generate a reflected wave of the ultrasonic wave caused by an acoustic impedance mismatch inside the subject. A plurality of piezoelectric elements that receive and generate received electrical signals are provided, and the plurality of piezoelectric elements are arranged in a two-dimensional array, for example. A member (component) called an acoustic braking member (acoustic load member, backing layer, damper layer, acoustic absorbing member) that absorbs ultrasonic waves is provided on one surface (back surface) of the plurality of piezoelectric elements. In addition, a signal line for transmitting and receiving an electrical signal is connected to each of the plurality of piezoelectric elements.

In this connection of signal lines, since a plurality of piezoelectric elements are arranged at a fine pitch, the work of drawing the signal lines from the signal electrodes (drive electrodes) of the piezoelectric elements tends to be complicated, so it is simpler. There is a demand for reliable signal line connection technology. Therefore, for example, in Patent Document 1 to Patent Document 3, signal lines are connected to each of a plurality of two-dimensionally arranged piezoelectric vibrator pieces on the backing material side, and the signal lines are connected to the backing material. An internal structure has been proposed.

By the way, when the through hole for passing the signal line through the acoustic braking member is mechanically formed by a drill, the drill has a blurring or eccentricity on the rotating shaft while the through hole is formed in the acoustic braking member. Therefore, at the outlet side of the drill, the position of the outlet is deviated from the position directly opposite to the position of the inlet, and the hole diameter of the outlet becomes larger than the hole diameter of the inlet. . As a result, the signal lines inserted through the through holes are irregularly arranged on the exit side of the drill. In particular, since a relatively hard rubber material is generally used for the acoustic braking member, its machinability is relatively poor and such a phenomenon is likely to occur.

Therefore, when connecting the signal lines penetrating the acoustic braking member to the drive electrodes of the plurality of piezoelectric elements arranged in a two-dimensional array at a fine pitch, the front and back of the acoustic braking member at the time of drilling ( If the connection is performed without managing the drill inlet side and the outlet side, the connection may be made on the drill outlet side. As a result, two piezoelectric element drive electrodes are provided on one signal line. May happen to be connected.

Japanese Patent Laid-Open No. 05-123317 Japanese Patent Application Laid-Open No. 07-131895 JP 2001-309493 A

The present invention has been made in view of the above circumstances, and an object thereof is to provide an acoustic brake component for an ultrasonic probe capable of connecting a drive electrode of a piezoelectric element to a signal line on the entrance side of a drill. Is to provide. Another object of the present invention is to provide an ultrasonic probe using the acoustic braking component for an ultrasonic probe. Moreover, this invention is providing the manufacturing method of such an ultrasonic probe.

In the acoustic brake component for an ultrasonic probe, the ultrasonic probe, and the manufacturing method of the ultrasonic probe according to the present invention, a plurality of through-holes are formed by a drill so as to penetrate the acoustic brake body. Each of the through holes is provided with a plurality of conductors, and each of the conductors is provided with a first electrode portion for connecting a piezoelectric element driving electrode on the entrance side of the drill. Therefore, according to the present invention, it is possible to provide an acoustic braking component, an ultrasonic probe, and a method for manufacturing the same, which can connect the drive electrode of the piezoelectric element to the signal line on the entrance side of the drill.

The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

It is sectional drawing which shows the structure of the ultrasonic probe which concerns on embodiment. FIG. 2 is a cross-sectional view showing a first manufacturing process of the ultrasonic probe shown in FIG. 1, and FIGS. 2A to 2D are diagrams showing each process. FIG. 3 is a cross-sectional view showing a second manufacturing process of the ultrasonic probe shown in FIG. 1, and FIGS. 3A to 3E are diagrams showing each process. FIG. 4 is a cross-sectional view showing a third manufacturing process of the ultrasonic probe shown in FIG. 1, and FIGS. 4A to 4D are diagrams showing each process. FIG. 2 is a detailed cross-sectional view illustrating a configuration of the ultrasonic probe illustrated in FIG. 1.

Hereinafter, an embodiment according to the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted suitably. Further, in this specification, when referring generically, it is indicated by a reference symbol without a suffix, and when referring to an individual configuration, it is indicated by a reference symbol with a suffix.

FIG. 1 is a cross-sectional view showing a configuration of an ultrasonic probe according to the embodiment. As shown in FIG. 1, the ultrasonic probe 100 according to the present embodiment is roughly a substrate 15, a member 13 provided on the substrate 15, which is an acoustic braking component for an ultrasonic probe, and a member 13 includes a plurality of piezoelectric elements 1a provided on 13 and an acoustic matching layer 50 provided on the plurality of piezoelectric elements 1a, and transmits / receives ultrasonic waves to / from the subject. The member 13 mechanically supports the piezoelectric element 1a, and acoustically brakes the piezoelectric element 1a so as to keep the acoustic characteristics of the piezoelectric element 1a favorable. From the material that absorbs ultrasonic waves (ultrasonic absorber) The ultrasonic wave emitted from the piezoelectric element 1a toward the member 13 is mainly absorbed. More specifically, the member 13 penetrates through the acoustic braking body into each of an acoustic braking body made of resin and a plurality of through holes formed by a drill so as to penetrate the acoustic braking body. And a plurality of conductors provided as described above.

The ultrasonic probe 100 is a plurality of two-dimensional arrays arranged in two directions linearly independent in a plan view with a predetermined interval therebetween, for example, m rows × n columns in two directions orthogonal to each other. The piezoelectric element 1a is provided. Each of the plurality of piezoelectric elements 1a includes a predetermined piezoelectric material, and converts a signal between an electric signal and an ultrasonic signal by using a piezoelectric phenomenon. The ultrasonic probe 100 may be a one-dimensional array of ultrasonic probes having a configuration in which a plurality of piezoelectric elements 1a are arranged in a line. The acoustic matching layer 50 is a member for matching the acoustic impedance of each piezoelectric element 1a and the acoustic impedance of the subject. The acoustic matching layer 50 may include an acoustic lens that converges an ultrasonic wave that is transmitted toward the subject, and has an arcuate shape.

A method for manufacturing the ultrasonic probe 100 according to this embodiment will be described with reference to the drawings. FIG. 2 is a cross-sectional view showing a first manufacturing process of the ultrasonic probe according to this embodiment, and FIGS. 2A to 2D are views showing each process. FIG. 3 is a cross-sectional view showing a second manufacturing process of the ultrasonic probe according to the present embodiment, and FIGS. 3A to 3E are views showing each process. FIG. 4 is a cross-sectional view showing a third manufacturing process of the ultrasonic probe according to this embodiment, and FIGS. 4A to 4D are views showing each process. FIG. 5 is a detailed cross-sectional view showing the configuration of the ultrasonic probe according to the present embodiment.

First, as shown in FIG. 2 (A), a plate-like acoustic braking body 13a made of a sound absorbing material is prepared. The sound absorbing material is made of, for example, a material obtained by mixing ferrite with chloroprene rubber or a material obtained by mixing tungsten powder with a resin such as an epoxy resin. Note that the thickness of the acoustic braking body 13a may be 1.5 to 2.0 mm, for example. The sound absorbing material is not limited to the above.

Next, as shown in FIG. 2 (B), the acoustic braking body 13a is drilled into the acoustic braking body 13a with a φ150 μm machining drill from one surface (hereinafter referred to as the surface 131) of the acoustic braking body 13a to the other surface (hereinafter referred to as the following). A plurality of holes 14A (through holes) penetrating to the back surface 132) are formed. Due to the bending and eccentricity of the drill being processed, the variation in the diameter and position of the hole 14A is larger on the back surface 132 than on the front surface 131. Note that a drill for machining Φ105 μm may be used instead of the drill.

Then, as shown in FIG. 2C, the acoustic braking body 13a is adhered to the dicing tape 2 at the back surface 132, and the conductive paste 14 is squeezed from the front surface 131 to the hole 14A in a vacuum. Filled. Then, the acoustic braking body 13a in which the conductive paste 14 is filled in the hole 14A is maintained at a predetermined temperature (135 ° C.) for a predetermined time (2 hours), and the conductive paste 14 is cured. The conductive paste 14 may be any conductive paste that contains no solvent and has a relatively small dispersed metal, and may be a conductive paste in which a conductor such as a metal is dispersed in a resin. The conductive paste 14 is, for example, Dotite XA-874 manufactured by Fujikura Kasei Co., Ltd. As the dicing tape 2, for example, Riva Alpha 3196 (trade name) manufactured by Nitto Denko Corporation is used.

Subsequently, as shown in FIG. 2D, the dicing tape 2 is peeled from the back surface 132, and both surfaces of the acoustic braking body 13a formed through these steps are polished, so that the acoustic braking body 13a A through electrode 14 corresponding to an example of the conductor is formed. The through electrode 14 has a front electrode surface 141 on the surface 131 of the acoustic braking body 13a and a back electrode surface 142 on the back surface 132 of the acoustic braking body 13a. Thereby, the member (acoustic braking component) 13 provided with the through electrode 14 in the acoustic braking body 13a is created. As described above, the variation in the diameter and position of the hole 14 </ b> A is larger on the back surface 132 than on the front surface 131. Therefore, the variation in the diameter and position of the front electrode surface 141 is smaller than that of the back electrode surface 142. The back-side electrode surface 142 having a large diameter and a large variation in electrode position is used as an electrode for connecting to an electric substrate on which the electrodes are arranged with high accuracy, and has a smaller diameter and a smaller variation in electrode position. The electrode surface 141 is used as an electrode for connection with the piezoelectric element 1a in which an error in position accuracy is likely to occur.

The formation of the through electrode 14 is not limited to the above. For example, as one specific example, after both surfaces of the member 13 are protected with a resist, the through electrode 14 can be formed of a metal such as plating. More specifically, after the metal is deposited on the inner surface of each hole 14A by electroless plating or the like, the through electrode 14 can be formed by filling the resin.

The following manufacturing method may be used instead of the manufacturing method of the through electrode 14 described above. That is, in the manufacturing method, before processing (FIG. 2 (A)) to form the holes 14A in the acoustic braking body 13a, the surface 131 of the acoustic braking body 13a and the back surface 132 thereof are made of aluminum having a thickness of 10 to 40 μm. A step of attaching the metal foil with an adhesive is further included. As the adhesive, for example, temporary fixing adhesive Ecosepara manufactured by Kaken Tech Co., Ltd. is used. After affixing the metal foil, a hole 14A is formed with a drill (FIG. 2B). Subsequently, the conductive paste 14 is filled from the surface 131 into the holes 14A by squeegeeing in a vacuum, and is maintained at a predetermined temperature (135 ° C.) for a predetermined time (2 hours), thereby curing the conductive paste 14 (FIG. 2 (C)). Here, while the conductive paste 14 is maintained at a predetermined temperature, the metal foils on the front surface 131 and the back surface 132 are peeled off. Subsequently, the remaining adhesive is removed to complete the member 13 in which the through electrode 14 is formed (FIG. 2D). According to such a manufacturing method, when the hole 14A is formed with a drill, the presence of the metal foil on the front surface 131 and the back surface 132 makes it easier to apply the drill during the forming process of the hole 14A, and the positional accuracy of the hole 14A is improved. More improved.

Next, as shown in FIG. 3A, a PZT (PbZr _1-x Ti _x O ₃ : lead zirconate titanate) plate 1 that is a piezoelectric element having electrodes (films) formed on both upper and lower surfaces, For example, it is bonded to a dicing tape 2 which is a thermal foaming release tape. The thickness of the PZT plate 1 may be 0.3 mm, for example. In the PZT plate 1, electrodes are formed on the surface bonded to the dicing tape 2 and the surface facing the surface. As the piezoelectric element, other than PZT, for example, BaTiO ₃ , PbTiO _3, or the like may be used.

Next, as shown in FIG. 3B, the PZT plate 1 bonded to the dicing tape 2 is cut by a dicing saw 3. In this way, the PZT plate 1 is cut, whereby each piezoelectric element 1a is divided from the PZT plate 1 and formed. At this time, the PZT plate 1 is cut so that the piezoelectric elements 1a are two-dimensionally arranged. Since the PZT plate 1 is bonded to the dicing tape 2, the PZT plate 1 is fixed to the dicing tape 2 even after being divided into the piezoelectric elements 1a. The excision width by the dicing saw 3 may be 0.04 mm, for example.

Thus, as shown in FIG. 3 (C), a plurality of piezoelectric elements 1a arranged in a two-dimensional array are arranged on the dicing tape 2. For example, the pitch between the piezoelectric elements 1 a is 0.3 mm, and 100 × 100 piezoelectric elements 1 a are formed on the dicing tape 2. Next, as shown in FIG. 3D, a substrate 4 on which a common electrode 6 is formed is prepared, and an adhesive 5 is applied to the surface of the piezoelectric element 1a facing the surface bonded to the dicing tape 2. Is done. The adhesive 5 is, for example, an epoxy resin that is a thermosetting resin, and the coating thickness is, for example, 10 μm. Application of the adhesive 5 may be performed using, for example, a flexographic printing machine. Flexographic printing is a printing method in which ink is applied to the surface of a relief printing plate with a roller called an anilox roll, and then the printing plate is pressed against a printing object such as paper. Furthermore, the ink that has adhered to the anilox surface is scraped off by the doctor blade, and a stable amount of ink is always supplied to the surface of the plate. By using such a flexographic printing machine and regarding the piezoelectric element 1a as a relief, a stable amount of the adhesive 5 can be applied to the electrode surface of the piezoelectric element 1a. A common electrode 6 is formed on the main surface of the substrate 4. In this way, the substrate 4 on which the common electrode 6 is formed is produced by forming an aluminum film (common electrode 6) on the substrate 4 that is an acoustic matching layer, for example, by vapor deposition or plating. Then, the piezoelectric element 1a bonded to the dicing tape 2 is pressed against the substrate 4 so that the electrode surface contacts the common electrode 6, and the epoxy adhesive 5 is cured, for example, at 60 degrees. Heat for 15 hours. As the adhesive 5, for example, Epo-Tek353ND manufactured by Epoxy Technology is used.

As shown in FIG. 3E, the adhesive 5 is hardened in a fillet shape while being pushed out from the gap between the piezoelectric element 1a and the common electrode 6. Thereby, the piezoelectric element 1 a is firmly fixed to the substrate 4. Next, the dicing tape 2 is removed from the piezoelectric element 1a. Then, the first incomplete ultrasonic probe 10 in which one electrode of the piezoelectric element 1a is simply connected to the common electrode 6 is produced.

Next, as shown in FIG. 4A, the filler 7 is dropped on the piezoelectric element 1a side of the first incomplete ultrasonic probe 10. The filler 7 is a liquid that can be dropped at the time of dropping, has a curing property such as thermosetting, and is a material having ultrasonic absorption, impact resistance, insulation, and the like after curing. It is preferable. Therefore, as the filler 7, for example, a rubber paste of a silicone rubber agent having a viscosity of tens of thousands of cp, an epoxy resin, or the like is used. The first incomplete ultrasonic probe 10 onto which the filler 7 has been dropped is preferably placed in a vacuum state or a reduced pressure state, such as being housed in a vacuum chamber. Thereby, there exists an effect that the bubble in filler 7 comes out. In particular, in the case of the filler 7 produced by mixing a plurality of materials, it is preferable to perform the above-described treatment because it contains bubbles due to stirring during mixing.

Next, as shown in FIG. 4B, the pressing member 8 composed of the soft layer 8a and the support layer 8b is installed on the first incomplete ultrasonic probe 10 so as to cover the upper surfaces of all the piezoelectric elements 1a. Is done. The soft layer 8a is disposed so as to be on the piezoelectric element 1a side. A flat plate member 9 is further installed above the pressing member 8, and the flat member 9 presses the filler 7 dropped onto the pressing member 8 and the first incomplete ultrasonic probe 10. More specifically, the pressing member 8 and the filler 7 are sandwiched between the flat plate member 9 and the first incomplete ultrasonic probe 10. The flat plate member 9 has a flat surface and is pressed in a state where this surface is on the pressing member 8 side.

Here, the soft layer 8a is made of a material having flexibility and adhesiveness. More specifically, the soft layer 8a is softer than the piezoelectric element 1a, and has a degree of flexibility that can be brought into close contact with the piezoelectric element 1a and deformed into its shape when pressed against the piezoelectric element 1a. The soft layer 8 a is deformed when pressed against the first incomplete ultrasonic probe 10 by the flat plate member 9. The support layer 8b is a member that supports the soft layer 8a. As the pressing member 8, in the present embodiment, for example, a dicing tape that is a thermal foaming release tape is used. In this dicing tape, the glue portion is the soft layer 8a, and the tape portion other than the glue portion is the support layer 8b. Thus, since the pressing member 8 has the support layer 8b, the pressing member 8 is easy to handle. Moreover, the flat plate member 9 should just have the intensity | strength which does not deform | transform, when the press member 8 grade | etc., Is pressed, and the surface by the side of the piezoelectric element 1a should just be flat.

Thus, when the pressing member 8 is pressed by the flat plate member 9, the piezoelectric element 1 a is not deformed, but the filler 7 filled between the piezoelectric elements 1 a has fluidity and the pressing member 8. Is pressed and flows, and is uniformly filled between the piezoelectric elements 1a. Further, the soft layer 8a is pressed to be in close contact with the upper surface of the piezoelectric element 1a, and the filler 7 is pushed out between the upper surface of the piezoelectric element 1a and the soft layer 8a, and the upper surface of the piezoelectric element 1a is filled. The material 7 does not exist. That is, the filler 7 does not remain on the upper surface of the piezoelectric element 1a where the electrodes are formed. Further, as shown in FIG. 4B, the soft layer 8a is deformed so that the piezoelectric element 1a enters the soft layer 8a, and the portion in close contact with the piezoelectric element 1a has a concave shape. It becomes convex. That is, the filler 7 is pushed in by the soft layer 8. Thereby, the upper surface of the filler 7 becomes lower than the upper surface of the piezoelectric element 1a. That is, the upper surface of the filler 7 and the upper surface of the piezoelectric element 1 a are not on the same plane, and the upper surface of the piezoelectric element 1 a is located at a position further away from the substrate 4. The pressure applied to the filler 7 and the like can be adjusted by adjusting the force pressing the flat plate member 9, and the position of the upper surface of the filler 7 can be adjusted.

Here, the soft layer 8a preferably has an elastic modulus of 0.1 GPa or less, and the elastic modulus of the support layer is preferably about 1 to 3 GPa. The soft layer 8a may have an adhesive strength of 2 to 10 N / 20 mm. Thereby, when pressed by the piezoelectric element 1a, the soft layer 8a is deformed according to the shape of the piezoelectric element 1a, and can be easily peeled off when the soft layer 8a described later is peeled from the piezoelectric element 1a. . If the soft layer 8a is too soft, that is, if the adhesive force of the soft layer 8a is too large, the piezoelectric element 1a enters the soft layer 8a too much, and it becomes difficult to peel the soft layer 8a from the piezoelectric element 1a. If the soft layer 8a is too hard, that is, if the adhesive force of the soft layer 8a is too low, the piezoelectric element 1a does not sufficiently enter the soft layer 8a, and the filler 7 tends to remain on the piezoelectric element 1a.

The thickness of the soft layer 8a is preferably about 10 to 100 μm, and the thickness of the support layer 8b is preferably about 10 to 200 μm. Accordingly, the soft layer 8a is sufficiently deformed, and the piezoelectric element 1a appropriately enters the soft layer 8a. In addition, when the thickness of the soft layer 8a is too thick, the piezoelectric element 1a enters the soft layer 8a too much, and it becomes difficult to peel the soft layer 8a from the piezoelectric element 1a. If the thickness of the soft layer 8a is too thin, the piezoelectric element 1a does not sufficiently enter the soft layer 8a, and the filler 7 tends to remain on the piezoelectric element 1a. Note that the pressing member 8 is not limited to the thermal foaming release tape. The pressing member 8 should just have the soft layer 8a which has the above properties.

Then, in order to cure the filler 7 in this state, the flat plate member 9, the pressing member 8, the filler 7, and the first incomplete ultrasonic probe 10 are heated. For example, when the filler 7 is a rubber paste of a silicone rubber agent, it may be heated at 60 degrees for 15 hours. Thereby, the filler 7 is cured.

After the filler 7 is cured, the flat plate member 9 and the pressing member 8 are removed as shown in FIG. The pressing member 8 is bonded to the first incomplete ultrasonic probe 10 when pressed, but since it is a heat-foaming release tape, the adhesive force is reduced by the heating, and the pressing member 8 is easily 1 It can be removed from the incomplete ultrasound probe 10.

In FIG. 4 (C), by removing the flat plate member 9 and the pressing member 8, as shown in FIG. 4 (D), the second unfinished material in which the filler 7 is installed in the first incomplete ultrasonic probe 10 is used. A completed ultrasonic probe 11 is produced.

As shown in FIG. 4D, the second incomplete ultrasonic probe 11 includes a substrate 4 on which the common electrode 6 is formed, and a plurality of substrates 4 fixed to the substrate 4 with the adhesive 5 via the common electrode 6. Piezoelectric element 1a and a filler 7 filled between the piezoelectric elements 1a. The common electrode 6 and each piezoelectric element 1a are electrically connected. Further, the upper surface of each piezoelectric element 1 a is positioned higher than the upper surface of the filler 7. Therefore, the upper surface of the second incomplete ultrasonic probe 11 has an uneven shape with the filler 7 as a recess and the piezoelectric element 1a as a protrusion. In other words, the filler 7 is located between the substrate 4 and the surface of the piezoelectric element 1a facing the surface of the piezoelectric element 1a in contact with the substrate 4. Note that the surface of the piezoelectric element 1a facing the surface of the piezoelectric element 1a in contact with the substrate 4 is the upper surface of the piezoelectric element 1a.

In the member 13, a mark having a predetermined shape is given to the front surface 131 having the front electrode surface 141 or the back surface 132 having the back electrode surface 142. Then, by referring to the distinction between the front surface 131 and the back surface 132, each piezoelectric element electrode 1A of the plurality of piezoelectric elements 1a is connected to the front electrode surface 141 for connecting the piezoelectric element electrode 1A, and the substrate electrode 15A is connected. Each substrate electrode 15A of the electronic substrate 15 is connected to each of the back electrode surfaces 142 for connection.

And as shown in FIG. 5, the ultrasonic probe 100 is completed by installing the member 13 on the upper surface of the second incomplete ultrasonic probe 11 and further installing the substrate 15. More specifically, the surface 131 of the member 13 formed by penetrating the plurality of through-electrodes 14 corresponding to each piezoelectric element 1a corresponds to each front-side electrode surface 141 of each of the plurality of through-electrodes 14 and each corresponding piezoelectric element electrode 1A. Are installed on the upper surface of the second incomplete ultrasonic probe 11 so as to be electrically connected to each other. And the electrode mounting surface in the board | substrate (electronic board | substrate) 15 which mounted several board | substrate electrode 15A corresponding to each penetration electrode 14 electrically connected these several board | substrate electrodes 15A and each corresponding back side electrode surface 142. As described above, it is installed on the surface 132 of the member 13. In other words, each back side electrode 142 of each through electrode 14 is such that the surface 132 of the member 13 electrically connects each back side electrode surface 142 of each of the plurality of through electrodes 14 and each corresponding substrate electrode 15A. Are mounted on the surface of a substrate (electronic substrate) 15 on which a plurality of substrate electrodes 15A corresponding to the above are mounted. Thus, the ultrasonic probe 100 is completed.

The piezoelectric element 1a is used when the PZT plate 1 is cut by the dicing saw 3 (FIG. 3B) or when the filler 7 is dropped between the adjacent piezoelectric elements 1a (FIG. 4A). 1a is inclined, and the position of each piezoelectric element 1a may deviate from the design value. FIG. 5 shows a case where variations occur in the positions of the piezoelectric elements 1a. However, the back electrode surface 142 having a large diameter and large electrode position variation is used as an electrode for connection with the substrate electrode 15A of the electronic substrate 15 on which the electrodes are arranged with high precision, while the diameter is smaller, and The front-side electrode surface 141 having a smaller electrode position variation is used as an electrode for connection with the piezoelectric element electrode 1A of the piezoelectric element 1a in which an error in position accuracy is likely to occur. By setting the electrode surfaces 142 and 141 in this way, even if the positions of the piezoelectric elements 1a vary, a problem occurs in which the two piezoelectric element electrodes 1A are joined to one electrode of the member 13. Can be reduced.

The member 13 and the second incomplete ultrasonic probe 11 are bonded and fixed to each other by, for example, an epoxy adhesive 12. An anisotropic conductive adhesive may be used as the adhesive 12. In addition, anisotropic conductive adhesive has a property which has electroconductivity or insulation according to a direction. For example, in FIG. 5, the adhesive 12 of the anisotropic conductive adhesive has conductivity in the vertical direction, and has insulation in the other directions. When the anisotropic conductive adhesive is used as the adhesive 12, the electrodes formed on the piezoelectric elements 1a and the corresponding through electrodes 14 are not in direct contact with each other, and the anisotropic conductive adhesive is interposed between them. Even if an adhesive 12 is present, each piezoelectric element 1a and each through electrode 14 can be electrically connected. At the same time, the piezoelectric elements 1a or the through electrodes 14 can be insulated even if the adhesive 12 which is an anisotropic conductive adhesive is interposed therebetween.

As described above, the upper surface of the second unfinished ultrasonic probe 11 has a concave-convex shape in which the filler 7 is a concave portion and the piezoelectric element 1a is a convex portion. When the wiring is connected to the piezoelectric element 1a that is the convex portion, the incomplete ultrasonic probe 11 can reliably connect the wiring without interfering with the filler 7 that is the concave portion.

Also, anisotropic conductive adhesive has the property of having conductivity in the direction in which pressure is applied. Therefore, when an anisotropic conductive adhesive is used as the adhesive 12, the adhesive 12 is applied between the surface 131 of the member 13 and the second unfinished ultrasonic probe 11, and the corresponding piezoelectric element is applied. When the pressure is applied so that the adhesive 1 is sandwiched between the 1a and the front electrode surface 141, the opposed piezoelectric element 1a and the through electrode 14 are electrically connected. At this time, since the pressure is more likely to be applied to the adhesive 12 between the piezoelectric element 1a and the through electrode 14 when the piezoelectric element 1a protrudes, the adhesive 12 between them is easily made conductive. This is preferable. Therefore, in this embodiment, since the piezoelectric element 1a is a convex part, it is preferable.

Further, according to the method of manufacturing the ultrasonic probe 100 according to the present embodiment, the filler 7 is uniformly filled between the piezoelectric elements 1a, and the filler 7 need not be polished. Damages are reduced, and the manufacturing process can be reduced. Moreover, according to this manufacturing method, since it is not necessary to grind the filler 7, the surface of the filler 7 is not formed irregularly. Further, according to this manufacturing method, since the piezoelectric element 1a protrudes from the filler 7, the filler 7 and the like interfere when connecting the wiring to the electrode formed on the piezoelectric element 1a. Therefore, there is a low possibility that the wiring is loaded and the connection with the electrode is lost.

In addition, as described above, the ultrasonic probe 100 according to the present embodiment has the filler 7 uniformly filled between the piezoelectric elements 1a, and thus has an effect of suppressing crosstalk between the piezoelectric elements 1a. high. In addition, since the piezoelectric element electrode 1A and the front electrode surface 141 corresponding to the piezoelectric element electrode 1A are connected with high accuracy, the performance variation of each piezoelectric element 1a is small, and the quality of the ultrasonic probe 100 is reduced. Is expensive. Further, as described above, the ultrasonic probe 100 is less damaged by wiring. Furthermore, since it is not necessary to polish the filler 7 in the manufacturing process, a soft rubber which is difficult to polish but has a high crosstalk suppressing effect can be used as the filler 7.

Further, an ultrasonic diagnostic apparatus may be manufactured using the ultrasonic probe 100 according to the present embodiment. Such an ultrasonic diagnostic apparatus transmits an ultrasonic wave (ultrasound signal) to a subject such as a living body (not shown) and comes from a subject such as a reflected wave of an ultrasonic wave reflected by the subject. An ultrasonic probe 100 that receives ultrasonic waves, and an ultrasonic probe 100 that is connected to the ultrasonic probe 100 and transmits a transmission signal of an electrical signal to the ultrasonic probe 100 to the subject to the ultrasonic probe 100. The ultrasonic wave is transmitted to the inside of the subject based on the received signal of the electrical signal generated by the ultrasonic probe 100 according to the ultrasonic wave received from the inside of the subject received by the ultrasonic probe 100. An ultrasonic diagnostic apparatus main body that images the internal state of the image as an ultrasonic image. As described above, even if the position of the piezoelectric element electrode 1 </ b> A varies, the ultrasonic probe 100 in which the occurrence of a problem that the two piezoelectric element electrodes 1 </ b> A are joined to one electrode of the member 13 is reduced. The yield of the ultrasonic diagnostic apparatus is improved.

This specification discloses various modes of technology as described above, and the main technologies are summarized below.

The acoustic brake component for an ultrasonic probe according to one aspect is an acoustic brake component for an ultrasonic probe that is used in an ultrasonic probe that includes a plurality of piezoelectric elements and transmits / receives ultrasonic waves to / from a subject. An insulating acoustic braking body; and a plurality of conductors provided to penetrate the acoustic braking body in each of a plurality of through holes formed by a drill so as to penetrate the acoustic braking body; A first electrode portion for connecting to a drive electrode of the piezoelectric element, provided on each of the plurality of conductors and provided on the entrance side of the drill, and a plurality of conductors And a second electrode portion provided on the outlet side of the drill.

In another aspect, in the above-described acoustic braking component for an ultrasonic probe, preferably, the acoustic braking body is formed of a resin. According to another aspect, in the above-described acoustic braking component for an ultrasonic probe, preferably, the plurality of conductors are made of a conductive material filled in the plurality of through holes.

According to this configuration, since the first electrode portion is used for connecting the piezoelectric element drive electrode, the drive electrode of the piezoelectric element can be connected to the signal line on the entrance side of the drill. As a result, the occurrence of defective products is reduced and the yield is improved.

Further, an ultrasonic probe according to another aspect includes any one of the above-described acoustic braking components, a plurality of piezoelectric elements respectively connected to the first electrode portions of the plurality of conductors, and the plurality of the plurality of piezoelectric elements. And an electronic substrate having a plurality of substrate electrodes respectively connected to the second electrode portion of the conductor.

According to this configuration, an ultrasonic probe is provided in which the drive electrode of the piezoelectric element is connected to the signal line on the entrance side of the drill. As a result, the situation where the drive electrodes of the two piezoelectric elements are connected to one signal line is prevented or reduced, the yield of the ultrasonic probe is improved, and the production cost can be reduced.

An ultrasonic probe manufacturing method according to another aspect is an ultrasonic probe manufacturing method for manufacturing an ultrasonic probe that includes a plurality of piezoelectric elements and transmits / receives ultrasonic waves to / from a subject. There are, for example, a step of forming a plurality of through holes with a drill in an insulating acoustic braking body made of resin, and each of the end portions of the plurality of through holes located on the entrance side of the drill, Forming a plurality of conductors so as to penetrate through the acoustic braking body, and connecting the driving electrodes of the plurality of piezoelectric elements to each of the plurality of conductors.

In another aspect, in the above-described method for manufacturing an ultrasonic probe, preferably, the step of forming the plurality of conductors by filling each through hole with a conductive paste and then curing the paste. Further prepare.

According to this configuration, since the drive electrode of the piezoelectric element is appropriately connected to the signal line on the entrance side of the drill, the occurrence of defective products is reduced and the yield is improved.

In another aspect, in the above-described ultrasonic probe manufacturing method, preferably, before the step of forming a plurality of through holes by the drill, a metal foil is pasted on both surfaces of the acoustic braking body. The process of carrying out is further provided.

According to this configuration, drilling can be performed with higher accuracy.

This application is based on Japanese Patent Application No. 2009-272037 filed on Nov. 30, 2009, the contents of which are included in the present application.

In order to express the present invention, the present invention has been properly and fully described through the embodiments with reference to the drawings. However, those skilled in the art can easily change and / or improve the above-described embodiments. It should be recognized that this is possible. Therefore, unless the modifications or improvements implemented by those skilled in the art are at a level that departs from the scope of the claims recited in the claims, the modifications or improvements are not covered by the claims. To be construed as inclusive.

According to the present invention, there is provided an acoustic brake component for an ultrasonic probe used in an ultrasonic probe including a plurality of piezoelectric elements, an ultrasonic probe thereof, and a method of manufacturing the ultrasonic probe. Can do.

Claims

An acoustic braking component for an ultrasonic probe used in an ultrasonic probe that includes a plurality of piezoelectric elements and transmits / receives ultrasonic waves to / from a subject,
An insulating acoustic brake,
A plurality of conductors provided so as to penetrate through the acoustic braking body in each of a plurality of through holes formed by a drill so as to penetrate the acoustic braking body;
A first electrode portion provided on each of the plurality of conductors and provided on an entrance side of the drill, for connecting to a drive electrode of the piezoelectric element, for connecting to a drive electrode of the piezoelectric element;
An acoustic braking component for an ultrasonic probe, comprising: a second electrode portion provided on each of the plurality of conductors and provided on an outlet side of the drill.
The acoustic braking component for an ultrasonic probe according to claim 1, wherein the acoustic braking body is made of resin.
The acoustic brake component for an ultrasonic probe according to claim 1 or 2, wherein the plurality of conductors are formed of a conductive material filled in each of the plurality of through holes.
The acoustic braking component according to any one of claims 1 to 3,
A plurality of piezoelectric elements respectively connected to the first electrode portions of the plurality of conductors;
An ultrasonic probe comprising: an electronic substrate having a plurality of substrate electrodes respectively connected to the second electrode portions of the plurality of conductors.
An ultrasonic probe manufacturing method for manufacturing an ultrasonic probe including a plurality of piezoelectric elements and transmitting / receiving ultrasonic waves to / from a subject,
A step of forming a plurality of through-holes with a drill in an insulating acoustic braking body;
Forming a plurality of conductors in each of the plurality of through holes so as to penetrate through the acoustic braking body;
Connecting the drive electrodes of the plurality of piezoelectric elements to each of the end portions of the plurality of conductors positioned on the entrance side of the drill. The method of manufacturing an ultrasound probe, comprising:
The method of manufacturing an ultrasonic probe according to claim 5, further comprising forming the plurality of conductors by curing each of the through holes after filling with a conductive paste.
The ultrasonic probe according to claim 5, further comprising a step of attaching a metal foil to both surfaces of the acoustic braking body before the step of forming a plurality of through holes by the drill. Child manufacturing method.