WO2011062580A1 - Dispositif et procédé améliorés de refroidissement pour centre de données - Google Patents

Dispositif et procédé améliorés de refroidissement pour centre de données Download PDF

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Publication number
WO2011062580A1
WO2011062580A1 PCT/US2009/064831 US2009064831W WO2011062580A1 WO 2011062580 A1 WO2011062580 A1 WO 2011062580A1 US 2009064831 W US2009064831 W US 2009064831W WO 2011062580 A1 WO2011062580 A1 WO 2011062580A1
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
cooling system
coils
compressor
evaporator
Prior art date
Application number
PCT/US2009/064831
Other languages
English (en)
Inventor
Richard Cockrell
Original Assignee
Core4 Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Core4 Systems, Inc. filed Critical Core4 Systems, Inc.
Priority to PCT/US2009/064831 priority Critical patent/WO2011062580A1/fr
Publication of WO2011062580A1 publication Critical patent/WO2011062580A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Definitions

  • the present invention involves a cooling system and method for its opeiation used for cooling devices in a data center
  • Data centeis are rooms that contain electronic systems generally ananged on racks, the standar d rack being defined by the EIA as an enclosure approximately 78" high, 24" wide and 40" deep
  • These racks are employed to house printed circuit board-based devices which, under normal opeiation, can geneiate significant amounts of heat.
  • piopei temperature and humidity must be maintained.
  • CRAC computet room air conditioning
  • CRAC1 There have been three fundamental CRAC system designs referred to, for the sake of simplicity, as CRAC1, CRAC2 and CRAC3.
  • CRAC1 is a split refrigeration system with outdoor aii cooled condensing.
  • This system is characterized by having two main components, namely, the CRAC unit itself located inside of the data centei and a condense! located external thereto .
  • the indoor unit houses the systems' compressors, evaporators, controls and cooling fans
  • the outdoor unit houses the condenser and condenser fans which inter -connect to the indoor 1 unit with piping through which the refrigerant travels.
  • the CRAC2 system also employs two main components, namely, the CRAC units located within the data center and heat exchanger components located external thereto
  • the indoor 1 unit houses the compressor, condenser, evaporator, system controls and cooling fans.
  • the outdoor unit is composed of a heat exchanger from which heat from the system is rejected as well as pumps used to move heat transfer 1 fluid from the indooi to outdoor units
  • This design can also have an optional heat exchanger 1 located in series with the indoor heat exchangers
  • a valve opens allowing the heat transfer fluid to pass through the lead heat exchanger , The fluid removes heat from the return air stream.
  • CRAC3 systems employ CRAC units located in the data center and fluid chillers located external thereto .
  • the indoor unit houses the indoor heat exchanger, indoor fan systems and contr ols
  • the outside unit is composed of either a self-contained
  • refrigeration system which chills the heat transfer fluid which is usually air cooled or a split chiller system which is composed of a compressor, evaporator, fluid cooled condenser and fluid cooled heat exchanger
  • CRAC systems in a data center is quite consistent from installation to installation.
  • typical installation involves adding a sufficient number of units to meet the anticipated heat load of the facility and one additional unit for redundancy.
  • each CRAC unit operates independently of other units.
  • the control valves of each unit are turned on and off independently of other units to meet and maintain building loads
  • Indoor fans never 1 shut off to maintain the load imposed upon the facility
  • Centrifugal fans are commonly employed for supply side air Small fans are employed even though smaller 1 fans are generally more inefficient than those which are larger .
  • current CRAC installations are based upon a "one load, one system" methodology.
  • Fig. 1 representing a schematic drawing of such a system commercially available from Trane Co .
  • the present invention involves a cooling system for cooling devices housed in a data center, the device compiising a cabinet, a set of evaporator coils, an inlet and outlet and at least one fan for drawing air from within the data centei thi ough said cabinet and for movement of the air over said evapoi atoi coils to the data centei heat loads
  • the improvement comprises angling the ah flow emanating from the cabinet proximate 45° to 70° to the plane of the flooring.
  • the invention is directed to a cooling system for cooling a data center to a predetei mined tempeiatuie and humidity, the cooling system compiising a set of evaporator coils and a fan for moving aii within the data centei passed the set of evaporator coils At least two sets of compressors, two sets of condenseis and two independent control systems aie located external to the data center and positioned in parallel to provide coolant to the set of evaporator coils.
  • the third embodiment involves a cooling system comprising a compressor, a condenser, coolant, pump and primary evapoiatoi' coil foi cooling.
  • the improvement comprises a secondary evapoiatoi' coil in seiies with the primary evaporator coil, the secondary evapoiatoi coil being a flooded coil piped to the condenser.
  • the invention involves a cooling system comprising a compressor, condensei, condensable coolant, pump and evapoiatoi coils.
  • improvement comprises a measurement device and actuatoi wherein when the
  • the measurement device measuies the wet-bulb tempeiatui'e and when it is no greater ' than a preselected value, the compressible coolant is circulated by the pump between the condenser and evapoiatoi coils while bypassing the compressor
  • Fig 1 is a schematic depiction of a commercially available chiller of the prior art
  • Fig 2 is a side view of a portion of the piesent invention showing evaporator coils and fans to be housed in a cabinet used for cooling an appiopiiate data center according to the piesent invention.
  • Fig 3 is a schematic view of a system accoiding to the piesent invention including two ciicuits provided for redundancy and foi increased efficiency.
  • Fig 4 is a schematic view of a pait time economizing system using a scavenger coil in seiies with main evapoi atoi coils to increase efficiency of the piesent invention.
  • Fig, 5 is yet another schematic view of an economizing circuit similar to that depicted in Fig. 3
  • housing 20 is depicted with its side walls removed foi illustrative purposes.
  • Frame members 21 support sets of evaporator coils 22 receiving coolant from compressors and related hardware located external to the data center being cooled.
  • ambient air within the data center is drawn through open top 25 passed sets of evaporator coils 22 through the use of prop or axial fans 23. Ideally, multiple fans are employed sufficient to maintain a positive static pressure within a space beneath the flooring.
  • cool air created by housing 20 is discharged proximate racks of circuit boards and similar solid state devices through openings strategically located proximate thereto
  • a feature of the present invention is the orientation of fans 23 in directing cooled air in the dhection of arrows 24
  • CRAC units of the prior art generally employ centrifugal fans that blow air directly at the floor.. This increases the static pressuie load on the fans as the air is forced to change direction by 90 degiees upon impacting the floor
  • the present invention employs prop or axial fans 23 directing air discharge as shown by arrows 24 by mounting the fans at a 20 to 45 degree angle from vertical or 45 to 70 degree angle proximate to the plane of the floor This provides a much improved approach angle of the cold air discharge relative to the floor and reduces the pressuie drop characterized by prior systems All such expedients are considered to be embraced within the present invention.
  • Sufficient fans are employed for maintaining static pressuie and air flow within the space noting that output can be varied to maintain the required static pressure via static pressure sensors
  • system 30 is composed of two simple circuits, operating in parallel.
  • parallel condensers 31A and 3 IB as well as parallel compressors 34A and 34B operate externally to the data center each set operating in conjunction with pumps 35A and 35B, respectively, to supply coolant to expansion valves 36 and onto evaporators 32A/32B and 33A/33B, located within the data center Redundant condensers and evaporators are operated together at part load while increasing the heat exchange surface area resulting in a decrease in the temperature differences within the system; that is, the temperature difference between the coolant temperature and the ail temperature flowing over the coil, By decreasing this temperature difference, pressures ate generally higher on the evaporator side and lower on the condenser side of the system thereby decreasing the compression ratio of the coolant and reducing the ener gy the compressors consume to compress the coolant gas,
  • a main function of the present system is that it allows for reduced compression operation.
  • Compression ratio is a reference to the difference between the suction and the discharge pressures measured in absolute pressure, Ihere are several main reasons why the present invention can accomplish reduced compression where others cannot
  • typical systems compression ratios are derived by the use and control of the condensing pressure f ypical systems control the condensing pressure buy either staging the condenser fans off and on to meet a set point of condensing pressure or speed control fans to meet that specific point
  • the present system utilizes a unique form of control to allow for reduced compression Instead of turning fans on and off or slowing them down to meet a specific point, the present system utilizes a variable set point. Ideally, this set point establishes a condensing temperature that is 8 degree ' s F higher than the wet bulb temperature Condensers are controlled to match loads in ton and to match a true constant set point.
  • a machine's capability of pumping refrigerant increases as an example, at a 2 to 1 compression ratio, a machine may be capable of pumping 50 tons of coolant while at a 1 .5 to 1 compression ratio a machine may be capable of pumping 75 tons of coolant and at 1 05 to I, that same machine may be capable of pumping 100 tons of coolant , As the mass flow rates increase thru the compressor restriction, friction increases as well, as much as double in some cases This causes a higher amount of wear and tear on machine parts as gas flows thru the compressor ports, pipe and valves .
  • the present system commonly operates at compression ratios of 1 .05 to 1 - 1 ,51 to 1 and in most cases it operates well under a manufacture's published allowable compression ratio for long periods of time . This is done by not exceeding the machine's designed mass flow rate rather 1 than compression ratio. This is achieved by reducing the speed of the compressor to only allow the machine to pump coolant to match its maximum mass flow rate..
  • Every meteiing device is rated based on pressure differential acioss its valve For example, a common meteiing device may be rated at 15 tons under common conditions, but as a system's compression ratio or pressure differential drops, that same valve may be only rated for 5 to 10 tons
  • metering valves used herein are rated and designed at a 1 .3 to 1 compression ratio These metering valves are provided with a constant piessuie differential by amplifying liquid pressure entering the valve with the use of a liquid coolant pump and speed control. Pump speed is varied to maintain a constant pressure drop acioss the meteiing devices.
  • system 40 is depicted whereby coolant from pump 42 located externally to the data center urges coolant through a separate evaporator coil 44 which is called a "scavenger coil " Ihe scavenger coil is located in seiies with main evaporator coils 43 thiough which air flows in the direction of arrows 45 for cooling the data center.
  • Vapoi condenser 41 is also located externally to the data center to complete the circuit, Again referring to Fig 4, scavenger coil 44 is a flooded coil that is piped directly back to condenser 41 When the coolant temperature is lowei than the return ah temperature, bypass valve 47 opens allowing coolant into the scavenger coil where it removes heat fr om the data centei The coolant then returns directly back to condenser 41, via flash vessel 3.3 without moving thiough a compiessoi, thus enhancing system efficiency, As condenser 41 still uses eneigy to remove heat and pumps use energy to pump coolant, some energy is still employed to operate system 40. However, energy usage is far more efficient than in a typical vapor compressor cycle
  • SC scavengei coil
  • the condensing liquid temperature is lower than the return air temperature a valve opens allowing refrigerant into the scavenger coil where it removes heat and goes directly back to the condenser to extract the heat from the room If, for example, the return air temperature is 68°F and the condensing liquid temperature is 65°F, heat from the return air is absorbed into the refrigerant (hot goes to cold) The larger the differential is between the return air temperature and the refrigerant temperature, the more energy is removed with this coil Since a BTU is a BTU the condensers still use energy to remove the heat and the pumps use energy to pump the refrigerant there still is energy used This energy usage is far more efficient than a typical vapor compressor cycle
  • coolant pump 42 pumps liquid refrigerant to feed devices 49 and into the scavenger coils 44 Inside the scavengei coils, the liquid refrigerant removes heat while still in a semi liquid form Liquid refrigerant leaves the scavenger coils and flows to flash vessel 46 Vapor leaves flash vessel 46 and enters the condenser 41 to be condensed, Flash vessels 46 level is approximately 2 feet below condensei 41 outlet for purposes of maintaining a proper liquid trap, Flash vessel 46 maintains a liquid level based on the weight of the refrigerant and acts as an expansion tank.
  • the present system is also designed, under certain conditions, to allow for "free cooling, " This means that the system operates under the physics of a thermo-siphon or through migration cooling as was suggested when discussing Fig 1 However, in this instance, when the wet bulb temperature is less than approximately 41 - 45 degrees F, the "free cooling" cycle operates Instead of operating with gravity controlling the flow rate as in the prior art, the present system employs a pump to ensure there is enough of a pressure difference to allow the coolant to flow through the metering valve and the evaporator ' where it is boiled off and routed through a motorized valve to the condenser wheie it condenses without moving thiough a compression cycle.
  • the compressor is activated by a sensor enabling the system to operate noimally.
  • system 50 is, in effect, one system having two circuits
  • Multiple evaporator coils 51 and 52 are located within the data center to be cooled.
  • a first circuit comprised of compressor 53, condenser 54, expansion receiver 55, pump 56 and metering valves 57 is employed in conjunction with parallel elements comprised of compressor 58, condenser 59, expansion receiver 60, pump 61 and metering valves 62. Both circuits work together but are capable of working independently in case of system failures or emergencies.
  • Each air handling unit has both circuits operating in parallel comprised of the same components as in any typical refrigeration system.
  • the systems can be expanded to meet growing loads Indoor and outdoor units can be added as demand or as planned expansion r equir es . Further , thr ough the use of pumps 56 and 61 together 1 with metering valves 57 and 62, economizing can be carried out as explained above, by circulating coolant without use of compressors 53 and 58 if outdoor wet bulb temperatures so dictate

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

L'invention concerne un système et un procédé de refroidissement pour des dispositifs logés dans un centre de données. Une armoire renfermant un ensemble de serpentins de condenseur est située à l'intérieur du centre de données, positionnée sur le plancher de celui-ci, et comprend des ventilateurs destinés à aspirer de l'air le long des serpentins de condenseur de telle sorte qu'il quitte le dispositif sous un certain angle par rapport au plancher du centre de données. La présente invention concerne également l'utilisation de compresseurs et de condenseurs redondants, un système comprenant un serpentin secondaire d'évaporateur et une configuration permettant au dispositif, dans certaines conditions, de contourner son compresseur.
PCT/US2009/064831 2009-11-17 2009-11-17 Dispositif et procédé améliorés de refroidissement pour centre de données WO2011062580A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2009/064831 WO2011062580A1 (fr) 2009-11-17 2009-11-17 Dispositif et procédé améliorés de refroidissement pour centre de données

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Application Number Priority Date Filing Date Title
PCT/US2009/064831 WO2011062580A1 (fr) 2009-11-17 2009-11-17 Dispositif et procédé améliorés de refroidissement pour centre de données

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8903556B2 (en) 2011-12-05 2014-12-02 International Business Machines Corporation Managing waste water discharge of a computing system
US9320177B2 (en) 2011-11-22 2016-04-19 Le Groupe S.M. Inc. Data center cooling system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6374627B1 (en) * 2001-01-09 2002-04-23 Donald J. Schumacher Data center cooling system
US20050023363A1 (en) * 2003-05-29 2005-02-03 Sharma Ratnesh K. CRAC unit control based on re-circulation index
US6980433B2 (en) * 2003-03-19 2005-12-27 American Power Conversion Corporation Data center cooling system
US20080105412A1 (en) * 2006-11-03 2008-05-08 American Power Conversion Corporation Continuous cooling capacity regulation using supplemental heating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6374627B1 (en) * 2001-01-09 2002-04-23 Donald J. Schumacher Data center cooling system
US6980433B2 (en) * 2003-03-19 2005-12-27 American Power Conversion Corporation Data center cooling system
US20050023363A1 (en) * 2003-05-29 2005-02-03 Sharma Ratnesh K. CRAC unit control based on re-circulation index
US20080105412A1 (en) * 2006-11-03 2008-05-08 American Power Conversion Corporation Continuous cooling capacity regulation using supplemental heating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9320177B2 (en) 2011-11-22 2016-04-19 Le Groupe S.M. Inc. Data center cooling system
US9706689B2 (en) 2011-11-22 2017-07-11 Le Group S.M. Inc. Data center cooling system
US8903556B2 (en) 2011-12-05 2014-12-02 International Business Machines Corporation Managing waste water discharge of a computing system
US8903557B2 (en) 2011-12-05 2014-12-02 International Business Machines Corporation Managing waste water discharge of a computing system

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