WO2011053110A3 - An integrated packaged environmental sensor and roic and a method of fabricating the same - Google Patents

An integrated packaged environmental sensor and roic and a method of fabricating the same Download PDF

Info

Publication number
WO2011053110A3
WO2011053110A3 PCT/MY2010/000182 MY2010000182W WO2011053110A3 WO 2011053110 A3 WO2011053110 A3 WO 2011053110A3 MY 2010000182 W MY2010000182 W MY 2010000182W WO 2011053110 A3 WO2011053110 A3 WO 2011053110A3
Authority
WO
WIPO (PCT)
Prior art keywords
environmental sensor
roic
fabricating
same
integrated packaged
Prior art date
Application number
PCT/MY2010/000182
Other languages
French (fr)
Other versions
WO2011053110A2 (en
Inventor
Mohd Ismahadi Syono
Daniel Chia Sheng Bien
Hing Wah Lee
Original Assignee
Mimos Berhad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimos Berhad filed Critical Mimos Berhad
Publication of WO2011053110A2 publication Critical patent/WO2011053110A2/en
Publication of WO2011053110A3 publication Critical patent/WO2011053110A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure

Abstract

An integrated packaged microchip (100) including at least one environmental sensor (104) and at least one Read-Out Integrated Chip (ROIC) (102) is provided, characterized in that, the integrated packaged microchip (100) further includes an etched opening (108) of the environmental sensor (104) exposed to a sensable environment, using at least one layer of glass wafer (101,106) and at least one layer of silicon wafer (107).
PCT/MY2010/000182 2009-10-27 2010-09-30 An integrated packaged environmental sensor and roic and a method of fabricating the same WO2011053110A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20097023 2009-10-27
MYPI20097023A MY147335A (en) 2009-10-27 2009-10-27 An integrated packaged environmental sensor and roic and a method of fabricating the same

Publications (2)

Publication Number Publication Date
WO2011053110A2 WO2011053110A2 (en) 2011-05-05
WO2011053110A3 true WO2011053110A3 (en) 2011-08-18

Family

ID=43922292

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/MY2009/000196 WO2011053108A1 (en) 2009-10-27 2009-11-19 An integrated packaged environmental sensor and roic and a method of fabricating the same
PCT/MY2010/000182 WO2011053110A2 (en) 2009-10-27 2010-09-30 An integrated packaged environmental sensor and roic and a method of fabricating the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/MY2009/000196 WO2011053108A1 (en) 2009-10-27 2009-11-19 An integrated packaged environmental sensor and roic and a method of fabricating the same

Country Status (2)

Country Link
MY (1) MY147335A (en)
WO (2) WO2011053108A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501657A (en) * 2018-06-04 2018-09-07 泰铂（上海）环保科技股份有限公司 A kind of novel and multifunctional engineering car air-conditioner and control method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822473A (en) * 1996-02-29 1998-10-13 Texas Instruments Incorporated Integrated microchip chemical sensor
WO1998054554A1 (en) * 1997-05-28 1998-12-03 The Secretary Of State For Defence A thermal detector array
US20030049865A1 (en) * 2000-03-02 2003-03-13 Santini John T. Microfabricated devices for the storage and selective exposure of chemicals and devices
US20070262256A1 (en) * 2003-10-09 2007-11-15 Ocas Corp. Bolometric Infrared Sensor Having Two-Layer Structure and Method for Manufacturing the Same
US20080113495A1 (en) * 2006-11-13 2008-05-15 Raytheon Company Method of construction of CTE matching structure with wafer processing and resulting structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822473A (en) * 1996-02-29 1998-10-13 Texas Instruments Incorporated Integrated microchip chemical sensor
WO1998054554A1 (en) * 1997-05-28 1998-12-03 The Secretary Of State For Defence A thermal detector array
US20030049865A1 (en) * 2000-03-02 2003-03-13 Santini John T. Microfabricated devices for the storage and selective exposure of chemicals and devices
US20070262256A1 (en) * 2003-10-09 2007-11-15 Ocas Corp. Bolometric Infrared Sensor Having Two-Layer Structure and Method for Manufacturing the Same
US20080113495A1 (en) * 2006-11-13 2008-05-15 Raytheon Company Method of construction of CTE matching structure with wafer processing and resulting structure

Also Published As

Publication number Publication date
MY147335A (en) 2012-11-30
WO2011053110A2 (en) 2011-05-05
WO2011053108A1 (en) 2011-05-05

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