WO2011045474A1 - Arrangement d'interface utilisateur et procédé de fabrication correspondant - Google Patents

Arrangement d'interface utilisateur et procédé de fabrication correspondant Download PDF

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Publication number
WO2011045474A1
WO2011045474A1 PCT/FI2010/050799 FI2010050799W WO2011045474A1 WO 2011045474 A1 WO2011045474 A1 WO 2011045474A1 FI 2010050799 W FI2010050799 W FI 2010050799W WO 2011045474 A1 WO2011045474 A1 WO 2011045474A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
electronics
substrate
mechanical structure
capacitive
Prior art date
Application number
PCT/FI2010/050799
Other languages
English (en)
Inventor
Antti KERÄNEN
Antti Kemppainen
Original Assignee
Valtion Teknillinen Tutkimuskeskus
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valtion Teknillinen Tutkimuskeskus filed Critical Valtion Teknillinen Tutkimuskeskus
Publication of WO2011045474A1 publication Critical patent/WO2011045474A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K17/962—Capacitive touch switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B29C2045/14254—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity deforming or preforming endless articles outside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches

Definitions

  • the invention relates to electronics. Specifically the invention concerns printed electronics and capacitive sensors in connection with UI (user interface) applications.
  • Capacitive sensors such as switches, e.g. so-called “touch-sensitive” switches, wherein a change in the monitored quantity also causes a change in the measured capacitance, may be used to detect location, distance, speed etc. of a certain object or substance in relation to the sensor in different use scenarios including computers, consumer electronics, mobile phones, PDA devices (Personal Digital Assistant) and media players.
  • a capacitive sensor may in such scenarios implement a key, a slide switch, a touchpad, a touch screen, or other corresponding UI element functionality to receive user input.
  • the element may produce activation (on/off switch such as a key) and/or location data (e.g. touchpad, touch screen) to the remaining system.
  • the objective of the present invention is to at least alleviate prior art defects relating to the cost efficiency, durability, integrability and/or processibility of capacitive sensors such as capacitive switches in the UI context.
  • the objective is met by an arrangement and a method in accordance with the present invention.
  • a substrate such as a plastic film, having electronics, preferably printed electronics, thereon, including at least one electrode of a capacitive sensor such as a capacitive switch,
  • a mechanical structure such as a housing structure, or a part thereof, of a device including the UI arrangement, overmoulded relative to the substrate such that said substrate and said at least one electrode at least partially remain within the mechanical structure
  • -read electronics being at least functionally connected to said at least one electrode to implement a capacitive, user input receiving sensor.
  • Overmoulding may be executed by injection moulding, wherein second material such as housing material, e.g. plastic, or other material of the mechanical structure is moulded over the first one (substrate such as plastic film).
  • second material such as housing material, e.g. plastic
  • first one substrate such as plastic film
  • the substrate and at least one electrode printed thereon, optionally with further elements, may be at least partially embedded in the material of the mechanical structure, for instance, by laminating or extruding.
  • the read electronics may be designed by a skilled person according to each embodiment and/or commonly available capacitance reading circuits and e.g. microcontrollers may be utilized therewith.
  • said at least one electrode may include an electrode pattern provided to the substrate by means of printed electronics.
  • the substrate is substantially flexible such as a film manufactured from plastic or other applicable ma- terial.
  • a substrate used in roll-to-roll methods shall preferably be flexible enough to bend to the used roll.
  • the film may be thin; the thickness thereof may be e.g. only about 10 ⁇ .
  • the substrate may thus have about 10 - 100 ⁇ such as 50 ⁇ thickness.
  • at least part of both the electrode and the read electronics thereof are preferably moulded within the mechanical structure such as the housing.
  • a cover of a terminal device or other electronic device may be provided with UI element, such as a key, keyboard, touch screen or touchpad without mechanically moving parts or lead-throughs.
  • the UI arrangement may be disposed at or at least functionally connected to a target device or other product, wherein the device or product is preferably selected from the group consisting of: consumer electronics product, terminal device, computer, portable computer, mobile phone, smartphone, PDA device, dictaphone, media player (e.g. multimedia or sound), musical instrument, wristop, calculator, construction element, vehicle and furniture.
  • the device or product is preferably selected from the group consisting of: consumer electronics product, terminal device, computer, portable computer, mobile phone, smartphone, PDA device, dictaphone, media player (e.g. multimedia or sound), musical instrument, wristop, calculator, construction element, vehicle and furniture.
  • media player e.g. multimedia or sound
  • musical instrument e.g. multimedia or sound
  • wristop e.g. keys or keyboard
  • the substrate may be over- moulded during an injection moulding process to remain within the mechanical structure so as to preferably still enable arranging the external connections to the electronics within the housing.
  • electrical conductors connecting to the electronics, or a connector connected thereto may be at least partially left outside the moulded part so that the galvanic connection of the electrode can be later ar- ranged to external elements, e.g. to other electronics of the Ul-containing device or different product.
  • At least part of the read electronics of the capacitive sensor is disposed outside the molded part, e.g. to the circuit board within the device housing.
  • the functional connection between the read electronics and the electrode may be accomplished by electrical conductors, for example.
  • connection to elec- tronics within the mechanical structure is implemented wirelessly.
  • inductive power and data transfer may be used, whereupon neither power supply nor galvanic coupling are necessary to be included in the mechanical structure such as the aforementioned cover.
  • a so-called concept of single electrode capacitive measuring wherein the capacitive coupling of single electrodes is measured relative to the environment and a target object therein (e.g. a finger of a user).
  • Single electrode measurement concept may be used to attain, among other things, longer sensing distance in contrast to the use of two electrodes.
  • the measuring concept of two electrodes is applied, wherein the capacitance between two floating electrodes is measured.
  • a capacitive switch or other sensor may include an oscillator circuit, i.e. an oscillating circuit, the capacitance and oscillation of which is affected by the substance or object, such as a finger of a UP s user, in front of the electrode surface or between two electrodes.
  • the capacitance or associated quantity depends on, among other things, the dielectric constant of the sensed object. Substances with greater dielectric constant such as water (about 80 at room temperature) or the aforesaid human finger, may be sensed through substance with lower constant such as air (about 1), many plastics and other potential materials of the mechanical structure. Dielectric constants of solids are often within range 2-14.
  • the electrode(s) and/or at least part of the wirings and/or other electronics are carried out using roll-to-roll printing technique, for example.
  • the implementation technique of the printed electronics is preferably selected from the group consisting of: screen printing, flexo- graphy, gravure printing, offset printing and inkjet printing.
  • the applied, conductive ink may be e.g. silver and/or graphite ink, or more generally e.g. metal or metal oxide ink (e.g. silver, aluminium, copper, or the oxides thereof).
  • the printing process is executed such that a first element such as the electrode ⁇ ) are printed using graphite ink and a second element such as the conductors using silver ink to spare costs and reduce the conductor resistances.
  • a reticular, matrix or comb-like electrode structure is utilized to reduce ink costs.
  • the substrate will thus contain free areas that are either completely free of elements or include elements other than electrode's conductor surfaces.
  • a method for constructing a UI structure comprises: -obtaining a substrate, such as a plastic film, for printed electronics,
  • a mechanical structure such as a housing structure, or a part thereof, of a device containing the UI arrangement, at least partially over the aforesaid substrate and at least one electrode disposed thereon.
  • the read electronics is at least partially disposed to the substrate, optionally by means of printed electronics, and it is overmoulded as the electrode(s).
  • the electrode(s) and optionally further elements may be embedded in the mechanical structure by, for example, lamination or extrusion as disclosed hereinbefore.
  • the utility of the present invention arises from a plurality of factors depending on each particular embodiment.
  • the invention enables efficient integration of UI elements and other structures, whereupon many problems associated with manufactur- ing, placement and break-down of conventional UI elements such as mechanical keys are avoided.
  • the overmoulded UI elements may be used in various use environments including consumer electronics, terminals such as mobile phones, personal computers, PDA's, wristops and mediaplayers, pulse counters, construction elements, textiles, and furnitures.
  • Printed capacitive key or more versatile UI are simp- ler and more affordable as to its implementation than e.g. a corresponding optical alternative.
  • a capacitive switch may be implemented together with, among other options, an optical touch panel using the same film to be overmoulded.
  • Figure 1 represents an example of an embodiment of a UI arrangement in accordance with the present invention as to its manufacturing and structure.
  • Figure 2 represents a test arrangement of a capacitive UI.
  • Figure 3 illustrates signal levels of test arrangement electrodes when a hand of a tester has been placed in front of an electrode.
  • Figure 4 represents a distance response of a signal provided by an electrode of the test arrangement relative to the hand.
  • Figure 5 depicts an example of a flexoprinted capacitive electrode structure.
  • Figure 6a is a flow diagram of an embodiment of a method in accordance with the present invention.
  • Figure 6b is a block diagram of a device or other product including an embodiment of a UI arrangement in accordance with the present invention.
  • Figure 1 illustrates one procedure for realizing a UI arrangement in accordance with the present invention.
  • electrodes and preferably conductors and/or other electronic elements such as read electronics are printed to the substrate material 104 using, for example, roll- to-roll method 106.
  • Roll-to-roll manufacturing enables rapid and affordable mass production in many applications.
  • Each sensor element 1 10 includes at least one electrode or electrode pattern.
  • a sensor element 1 10 is represented as embedded into a mechanical struc- ture 1 14 such as the cover or housing structure of a target product.
  • the sensor element 1 10 has been inserted in a mould and the mechanical structure has been over- moulded thereon.
  • a single key is shown, but it is clear to a skilled person that the solution of the present invention may be used to produce a whole keyboard, keypad or other desired UI solution, or a part thereof, by moulding it to the surface or other structure of the target product.
  • visual guide 1 13 is shown as disposed on the surface of the mechanical structure 1 14 in a location matching the element 1 10 to form, in this example, a circumferential form.
  • the guide 1 13 thus advantageously indicates the position of the electrode of a capacitive UI element, such as key or other element, in the structure 114 and/or the nature/character of the electrode (e.g. function associated with the electrode and activation thereof by the user).
  • the guide 1 13 may be disposed elsewhere, such as next to the element 1 10.
  • the visual guide 113 may in- elude at least one component selected from the group consisting of : letter, number, pattern, shape, image, symbol and geometric element such as an ellipse, circle, triangle, polygon and a line.
  • the inner surface of the mechanical structure 114 of the mechanical structure such as the housing/cover structure of hand-held device is represented.
  • Part of the molded sensor element 110 has been excluded from molding, which is illustrated by the darkened portion in the visualization of the element 1 10 as shown by the arrow 1 18.
  • the mentioned part may include e.g. conductor or connector to con- nect the electrode structure and/or other electronics connected thereto and remaining in the molded part to the rest of the device/product.
  • the substrate 104 includes material selected from the group consisting of : PET (polyethylene terephthalate), PC (polycarbonate), PEN (polyethy- lene naphthalate), PI (polyimide), LCP (liquid-crystal polymer), PE (polyethylene) ja PP (polypropylene).
  • the substrate material may be, depending on the embodiment, optically transparent, translucent or opaque.
  • the overmoulded mechanical structure 1 14 includes material se- lected from the group consisting of: PC, PMMA (polymethyl methacrylate), PA (polyamide, nylon), COC (cyclo-olefin copolymer) ja COP (cyclo-olefin polymer).
  • the material may be, depending on the embodiment, optically transparent, translucent or opaque.
  • Figure 2 discloses an image of a test arrangement for simulating and illustrating the operation of an embodiment of a UI arrangement according to the invention.
  • the arrangement includes 12 electrodes some of which have been directly cut from a metallic film and the rest have been flexo printed using graphite ink. In the top portion of the figure read electronics is shown, the electronics being connected thereto via common copper conductors.
  • a data cable connects the read electronics to the remaining system. Response among the electrodes of different materials was not found to substantially differ. The use of electrodes as a keypad, for instance, was tried. The functioning was also tested through a wooden tabletop; the tabletop was used to simulate, among other things, a mechanical structure into which the elec- trodes could be embedded. Detection of a key press was implemented, among other things, by comparing capacitance signals in a simplest form such that if a signal of an electrode was greater than the signals of other electrodes by a predetermined threshold value, a "key" was considered as depressed. The signal intensity depends on, among other things, the distance between the target object, such as the tester's hand, and the electrode.
  • Figure 3 shows the measured signal levels of test electrodes when a hand has been positioned substantially in front of a single electrode (right side of the figure) at the distance of about 10 cm.
  • the elevated capacitance level is clearly visible in the figure based on the signals of the associated electrode and neighbouring electrodes.
  • Figure 4 discloses a graph of the distance response of the electrode signal to the human hand.
  • the signal value is inversely proportional to the distance.
  • Figure 5 illustrates the flexibility of a capacitive electrode structure flexo printed onto an optically substantially transparent plastic film in accordance with the present invention.
  • Figure 6a is a flow diagram of an embodiment of a method in accordance with the present invention.
  • the necessary equipment such as printing and moulding gear are obtained and configured.
  • the substrate material is obtained e.g. in roll format to enable subsequent printing and/or other type of placement and optionally fixing, by e.g. adhesive, of electrode(s) and optionally part of read electronics, further electronics and/or elements.
  • said electronics, the used inks and components/circuits, for example, are obtained.
  • phase 618 at least one electrode or a portion thereof is printed, by means of printed electronics, to the substrate material and optionally also (read)electronics, conductors and/or other elements are printed and/or disposed on the substrate to realize a desired sensor element structure 624.
  • a mechanical structure such as the cover/housing/surface structure of the target product is overmoulded at least partially over the substrate such that at least portion of the electrode(s) and optionally further elements contained with the substrate are left under the molded part. Alternatively or additionally other methods for forming a mechanical structure may be exploited - as disclosed hereinbefore.
  • phase 622 the moulded product is removed from the mould and placed e.g.
  • Figure 6b represents a substantially functional, exemplary block diagram of a product 601 such as an electronic device containing an embodiment of a UI arrangement 602 in accordance with the present invention.
  • the moulded mechanical structure such as cover part or other structural part of a product/device includes at least one capacitive, user input -receiving, sensor element electrode 604 or a part thereof and optionally other elements such as electrode read electronics 606, conductors and/or other electronics.
  • at least part of the read electronics 606 may be implemented external to the molded structure.
  • the read electronics 606 is advanta- geously configured to send a predetermined indication, e.g.
  • control electronics 608 that may include e.g. microprosessor, microcontroller, programmable logic circuit and/or digital signal processor (DSP) and optionally memory for storing program instructions and/or other data.
  • the control electronics 608 has been advantageously configured to execute, based on (indication) user input received from the UI arrangement in accordance with the present invention, an associated predetermined function or a group of functions that may relate, among other things, data processing, storage, transfer and/or visualization, for instance, through the elements 610 included in the product or controlled therewith.
  • the other elements 610 may include, for instance, one or more output devices such as a display, speaker, tactile feedback device (e.g.
  • Data transfer means may be optionally also used for wireless or wired data transfer with the read electronics 606.
  • the control electronics 608 includes such a data transfer means.
  • the scope of the invention is defined by the following claims and their equivalence.
  • a skilled person can modify, combine and supplement the exemplary embodiments disclosed herein to best match with each application scenario to occur in the real world.
  • the electrode could be implemented, instead of printing technology, using a suitable metal deposition method subsequently followed by a patterning method such as laser ablation or so-called lift-off method.
  • the suggested printing technique and/or overmoulding solution are feasible also in connection with other embedded functional elements, not merely capacitive sensors.

Abstract

L'invention porte sur un arrangement d'interface utilisateur (112, 116, 602) comprenant un élément capteur, qui comprend un substrat, tel qu'un film plastique, portant des composants électroniques, de préférence imprimés, comprenant au moins une électrode (604) d'un capteur capacitif, une structure mécanique (114), telle qu'une structure de boîtier ou une partie d'une telle structure, surmoulée par rapport au substrat de telle sorte que ledit substrat et ladite au moins une électrode restent au moins partiellement à l'intérieur de la structure mécanique, et des composants électroniques de lecture (606), qui sont connectés au moins fonctionnellement à ladite au moins une électrode pour constituer un capteur capacitif recevant une entrée utilisateur, au moins une partie desdits composants électroniques de lecture étant disposée sur ledit substrat et résidant au moins partiellement dans ladite structure mécanique moulée. L'invention porte aussi sur un procédé de fabrication correspondant.
PCT/FI2010/050799 2009-10-15 2010-10-15 Arrangement d'interface utilisateur et procédé de fabrication correspondant WO2011045474A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20096062A FI20096062A (fi) 2009-10-15 2009-10-15 Käyttöliittymäjärjestely ja menetelmä sen valmistamiseksi
FI20096062 2009-10-15

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Publication Number Publication Date
WO2011045474A1 true WO2011045474A1 (fr) 2011-04-21

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Cited By (3)

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WO2015044523A1 (fr) 2013-09-27 2015-04-02 Tactotek Oy Procédé pour fabriquer une structure électromécanique et agencement pour conduire le procédé
FR3069476A1 (fr) * 2017-07-31 2019-02-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique
DE102017218243B3 (de) * 2017-10-12 2019-02-21 Audi Ag Verfahren zum Herstellen zumindest eines Teils einer berührungssensitiven Bedieneinrichtung, berührungssensitive Bedieneinrichtung und Kraftfahrzeug

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US20030121767A1 (en) * 2001-11-20 2003-07-03 Caldwell David W. Molded/integrated touch switch/control panel assembly and method for making same
US20080257706A1 (en) * 2007-04-20 2008-10-23 Haag Ronald H In-molded capacitive switch
US20090040191A1 (en) * 2007-08-08 2009-02-12 Synaptics Incorporated Capacitive touch sensor with conductive trace lines in bonding region
US20090101489A1 (en) * 2007-10-23 2009-04-23 Min-Yi Lee In-mould molding touch module and method for manufacturing the same

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US20030121767A1 (en) * 2001-11-20 2003-07-03 Caldwell David W. Molded/integrated touch switch/control panel assembly and method for making same
US20080257706A1 (en) * 2007-04-20 2008-10-23 Haag Ronald H In-molded capacitive switch
US20090040191A1 (en) * 2007-08-08 2009-02-12 Synaptics Incorporated Capacitive touch sensor with conductive trace lines in bonding region
US20090101489A1 (en) * 2007-10-23 2009-04-23 Min-Yi Lee In-mould molding touch module and method for manufacturing the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10986733B2 (en) 2013-09-27 2021-04-20 Tactotek Oy Method for manufacturing an electromechanical structure
US10986734B2 (en) 2013-09-27 2021-04-20 Tactotek Oy Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
US11516920B2 (en) 2013-09-27 2022-11-29 Tactotek Oy Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
US11406021B2 (en) 2013-09-27 2022-08-02 Tactotek Oy System for manufacturing an electromechanical structure
US11363720B2 (en) 2013-09-27 2022-06-14 Tactotek Oy System for manufacturing an electromechanical structure
US10575407B2 (en) 2013-09-27 2020-02-25 Tactotek Oy System for carrying out a manufacturing method on an electro chemical structure
TWI610881B (zh) * 2013-09-27 2018-01-11 塔克圖科技有限公司 用以製造機電結構的方法和用以實行該方法的配置
US10660211B2 (en) 2013-09-27 2020-05-19 Tactotek Oy Method for manufacturing an electromechanical structure
US10986735B2 (en) 2013-09-27 2021-04-20 Tactotek Oy Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
WO2015044523A1 (fr) 2013-09-27 2015-04-02 Tactotek Oy Procédé pour fabriquer une structure électromécanique et agencement pour conduire le procédé
US10813222B2 (en) 2013-09-27 2020-10-20 Tactotek Oy System for manufacturing an electromechanical structure
WO2019025329A1 (fr) * 2017-07-31 2019-02-07 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une piece moulee par injection dotee d'au moins un dispositif electromecanique comprenant un element mobile
FR3069476A1 (fr) * 2017-07-31 2019-02-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique
DE102017218243B3 (de) * 2017-10-12 2019-02-21 Audi Ag Verfahren zum Herstellen zumindest eines Teils einer berührungssensitiven Bedieneinrichtung, berührungssensitive Bedieneinrichtung und Kraftfahrzeug

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